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ADS5271IPFPTG4 [TI]

Eight-Channel, 12-Bit, 50-MSPS Analog-to-Digital Converter (ADC) 80-HTQFP -40 to 85;
ADS5271IPFPTG4
型号： ADS5271IPFPTG4
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

Eight-Channel, 12-Bit, 50-MSPS Analog-to-Digital Converter (ADC) 80-HTQFP -40 to 85

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ADS5271  
www.ti.com ...................................................................................................................................................... SBAS313C–JUNE 2004–REVISED JANUARY 2009  
8-Channel, 12-Bit, 50MSPS Analog-to-Digital Converter  
with Serial LVDS Interface  
An integrated phase lock loop (PLL) multiplies the  
incoming ADC sampling clock by a factor of 12. This  
1
FEATURES  
23  
•
Maximum Sample Rate: 50MSPS  
high-frequency LVDS clock is used in the data  
serialization and transmission process. The word  
output of each internal ADC is serialized and  
transmitted either MSB or LSB first. In addition to the  
eight data outputs, a bit clock and a word clock are  
also transmitted. The bit clock is at 6x the speed of  
the sampling clock, whereas the word clock is at the  
same speed of the sampling clock.  
•
12-Bit Resolution  
•
•
No Missing Codes  
Total Power Dissipation:  
Internal Reference: 927mW  
External Reference: 861mW  
•
•
•
•
•
•
•
•
•
•
CMOS Technology  
Simultaneous Sample-and-Hold  
70.5dB SNR at 10MHz IF  
The ADS5271 provides internal references, or can  
optionally be driven with external references. Best  
performance is achieved through the internal  
reference mode.  
3.3V Digital/Analog Supply  
Serialized LVDS Outputs  
The device is available in a TQFP-80 PowerPAD  
package and is specified over a –40°C to +85°C  
operating range.  
Integrated Frame and Bit Patterns  
Option to Double LVDS Clock Output Currents  
Four Current Modes for LVDS  
Pin- and Format-Compatible Family  
TQFP-80 PowerPAD™ Package  
LCLKP  
6x A DCLK  
LCLKN  
12x ADCLK  
PLL  
A DCLKP  
A DCLKN  
1x A DCLK  
AD CLK  
APPLICATIONS  
IN 1P  
IN1N  
OUT1P  
OUT1N  
12−Bit  
A DC  
Serialize r  
Serialize r  
Serialize r  
Serialize r  
Serialize r  
Serialize r  
Serialize r  
S/H  
S/H  
S/H  
S/H  
S/H  
S/H  
S/H  
S/H  
•
•
•
•
Portable Ultrasound Systems  
Tape Drives  
Test Equipment  
Optical Networking  
IN 2P  
IN2N  
OUT2P  
OUT2N  
12−Bit  
A DC  
IN 3P  
IN3N  
OUT3P  
OUT3N  
12−Bit  
A DC  
DESCRIPTION  
IN 4P  
IN4N  
OUT4P  
OUT4N  
12−Bit  
A DC  
The ADS5271 is  
a high-performance, 50MSPS,  
IN 5P  
IN5N  
OUT5P  
OUT5N  
8-channel analog-to-digital converter (ADC). Internal  
references are provided, simplifying system design  
requirements. Low power consumption allows for the  
highest of system integration densities. Serial LVDS  
(low-voltage differential signaling) outputs reduce the  
number of interface lines and package size.  
12−Bit  
A DC  
IN 6P  
IN6N  
OUT6P  
OUT6N  
12−Bit  
A DC  
IN 7P  
IN7N  
OUT7P  
OUT7N  
12−Bit  
A DC  
IN 8P  
IN8N  
OUT8P  
OUT8N  
12−Bit  
A DC  
Serialize r  
Control  
RELATED PRODUCTS  
RESOLUTION  
(BITS)  
SAMPLE  
RATE (MSPS) CHANNELS  
Reg isters  
Reference  
INT/E XT  
MODEL  
ADS5270  
ADS5272  
ADS5273  
ADS5277  
12  
12  
12  
10  
40  
65  
70  
65  
8
8
8
8
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
PowerPAD is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2009, Texas Instruments Incorporated  
 
 
 
 
 
 
ADS5271  
SBAS313C–JUNE 2004–REVISED JANUARY 2009...................................................................................................................................................... www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ORDERING INFORMATION(1)  
SPECIFIED  
PACKAGE  
DESIGNATOR  
TEMPERATURE  
RANGE  
PACKAGE  
MARKING  
ORDERING  
NUMBER  
TRANSPORT  
MEDIA, QUANTITY  
PRODUCT PACKAGE-LEAD(2)  
ADS5271 HTQFP-80  
ADS5271IPFP  
Tray, 96  
PFP  
–40°C to +85°C  
ADS5271IPFP  
ADS5271IPFPT Tape and Reel, 250  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Thermal pad size: 4.69mm × 4.69mm (min), 6.20mm × 6.20mm (max).  
ABSOLUTE MAXIMUM RATINGS(1)  
Supply Voltage Range, AVDD  
–0.3V to +3.8V  
–0.3V to +3.8V  
Supply Voltage Range, LVDD  
Voltage Between AVSS and LVSS  
Voltage Between AVDD and LVDD  
Voltage Applied to External REF Pins  
All LVDS Data and Clock Outputs  
Analog Input Pins(2)  
–0.3V to +0.3V  
–0.3V to +0.3V  
–0.3V to +2.4V  
–0.3V to +2.4V  
–0.3V to min. [3.3V, (AVDD + 0.3V)]  
–0.3V to min. [3.9V, (AVDD + 0.3V)](3)  
–0.3V to min. [3.9V, (LVDD + 0.3V)](3)  
–40°C to +85°C  
Digital Input Pins, Set 1 (pin 69, 76-78)  
Digital Input Pins, Set 2 (pins 16, 45)  
Operating Free-Air Temperature Range, TA  
Lead Temperature, 1.6mm (1/16" from case for 10s)  
Junction Temperature  
+260°C  
+105°C  
Storage Temperature Range  
–65°C to +150°C  
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those specified is not supported.  
(2) The dc voltage applied on the input pins should not go below –0.3V. Also, the dc voltage should be limited to the lower of either 3.3V or  
(AVDD + 0.3V). If the input can go higher than +3.3V, then a resistor greater than or equal to 25Ω should be added in series with each  
of the input pins. Also, the duty cycle of the overshoot beyond +3.3V should be limited. The overshoot duty cycle can be defined either  
as a percentage of the time of overshoot over a clock period, or over the entire device lifetime. For a peak voltage between +3.3V and  
+3.5V, a duty cycle up to 10% is acceptable. For a peak voltage between +3.5V and +3.7V, the overshoot duty cycle should not exceed  
1%. Any overshoot beyond +3.7V should be restricted to less than 0.1% duty cycle, and never exceed +3.9V.  
(3) It is recommended to use a series resistor of 1kΩ or greater if the digital input pins are tied to AVDD or LVDD.  
2
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Product Folder Link(s): ADS5271  
 
 
ADS5271  
www.ti.com ...................................................................................................................................................... SBAS313C–JUNE 2004–REVISED JANUARY 2009  
RECOMMENDED OPERATING CONDITIONS  
ADS5271  
MIN  
TYP  
MAX  
UNITS  
SUPPLIES AND REFERENCES  
Analog Supply Voltage, AVDD  
Output Driver Supply Voltage, LVDD  
REFT — External Reference Mode  
REFB — External Reference Mode  
REFCM = (REFT + REFB )/ 2 — External Reference Mode(1)  
Reference = (REFT – REFB ) — External Reference Mode  
Analog Input Common-Mode Range(1)  
CLOCK INPUT AND OUTPUTS  
ADCLK Input Sample Rate (low-voltage TTL)  
ADCLK Duty Cycle  
3.0  
3.0  
3.3  
3.3  
3.6  
3.6  
V
V
V
V
V
V
V
1.825  
0.9  
1.95  
2.0  
0.95  
1.075  
VCM ± 50mV  
1.0  
0.75  
1.1  
VCM ± 50mV  
20  
45  
50  
55  
MSPS  
%
Low-Level Voltage Clock Input  
High-Level Voltage Clock Input  
ADCLKP and ADCLKN Outputs (LVDS)  
LCLKP and LCLKN Outputs (LVDS)(2)  
Operating Free-Air Temperature, TA  
Thermal Characteristics:  
0.6  
V
2.2  
20  
V
50  
MHz  
MHz  
°C  
120  
–40  
300  
+85  
θJA  
19.4  
4.2  
°C/W  
°C/W  
θJC  
(1) These voltages need to be set to 1.45V ±50mV if they are derived independent of VCM  
.
(2) 6 × ADCLK.  
Copyright © 2004–2009, Texas Instruments Incorporated  
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ADS5271  
SBAS313C–JUNE 2004–REVISED JANUARY 2009...................................................................................................................................................... www.ti.com  
ELECTRICAL CHARACTERISTICS  
TMIN = –40°C and TMAX = +85°C. Typical values are at TA = +25°C, clock frequency = maximum specified, 50% clock duty  
cycle, AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, and LVDS buffer current at 3.5mA per  
channel, unless otherwise noted.  
ADS5271  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
DC ACCURACY  
No Missing Codes  
Tested  
±0.5  
DNL Differential Nonlinearity  
INL Integral Nonlinearity  
fIN = 5MHz  
fIN = 5MHz  
–0.9  
–2.0  
+0.9  
+2.0  
LSB  
LSB  
±0.6  
Offset Error(1)  
–0.75  
+0.75  
%FS  
ppm/°C  
%FS  
dB  
Offset Temperature Coefficient  
Fixed Attenuation in Channel(2)  
Fixed Attenuation Matching Across Channels  
Gain Error/Reference Error(3)  
Gain Error Temperature Coefficient  
POWER REQUIREMENTS(4)  
Internal Reference  
±6  
1.5  
0.01  
±1.0  
±20  
0.2  
VREFT – VREFB  
–2.5  
+2.5  
%FS  
ppm/°C  
Power Dissipation  
Analog Only (AVDD)  
Output Driver (LVDD)  
743  
184  
927  
792  
208  
mW  
mW  
mW  
Total Power Dissipation  
External Reference  
1000  
Power Dissipation  
Analog Only (AVDD)  
Output Driver (LVDD)  
677  
184  
861  
92  
mW  
mW  
mW  
mW  
Total Power Dissipation  
Power-Down  
Clock Running  
149  
REFERENCE VOLTAGES  
VREFT Reference Top (internal)  
VREFB Reference Bottom (internal)  
VCM Common-Mode Voltage  
VCM Output Current(5)  
1.9  
0.9  
1.4  
1.95  
0.95  
2.0  
1.0  
1.5  
V
V
1.45  
V
±50mV Change in Voltage  
±2.0  
mA  
V
VREFT Reference Top (external)  
VREFB Reference Bottom (external)  
External Reference Common-Mode  
External Reference Input Current(6)  
1.825  
0.9  
1.95  
2.0  
0.95  
1.075  
V
VCM ± 50mV  
1.0  
mV  
mA  
(1) Offset error is the deviation of the average code from mid-code with –1dBFS sinusoid from ideal mid-code (2048). Offset error is  
expressed in terms of % of full-scale.  
(2) Fixed attenuation in the channel arises due to a fixed attenuation in the sample-and-hold amplifier. When the differential voltage at the  
analog input pins are changed from –VREF to +VREF, the swing of the output code is expected to deviate from the full-scale code  
(4096LSB) by the extent of this fixed attenuation. NOTE: VREF is defined as (REFT – REFB).  
(3) The reference voltages are trimmed at production so that (VREFT – VREFB) is within ± 25mV of the ideal value of 1V. This specification  
does not include fixed attenuation.  
(4) Supply current can be calculated from dividing the power dissipation by the supply voltage of 3.3V.  
(5) VCM provides the common-mode current for the inputs of all eight channels when the inputs are ac-coupled. The VCM output current  
specified is the additional drive of the VCM buffer if loaded externally.  
(6) Average current drawn from the reference pins in the external reference mode.  
4
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Copyright © 2004–2009, Texas Instruments Incorporated  
Product Folder Link(s): ADS5271  
 
ADS5271  
www.ti.com ...................................................................................................................................................... SBAS313C–JUNE 2004–REVISED JANUARY 2009  
ELECTRICAL CHARACTERISTICS (continued)  
TMIN = –40°C and TMAX = +85°C. Typical values are at TA = +25°C, clock frequency = maximum specified, 50% clock duty  
cycle, AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, and LVDS buffer current at 3.5mA per  
channel, unless otherwise noted.  
ADS5271  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
ANALOG INPUT  
Differential Input Capacitance  
4.0  
VCM ± 50mV  
2.03  
pF  
mV  
Analog Input Common-Mode Range  
Differential Full-Scale Input Voltage Range  
Internal Reference  
External Reference  
VPP  
2.03 × (VREFT – VREFB)  
3.0  
VPP  
Voltage Overhead Recovery Time(7)  
Input Bandwidth  
CLK Cycles  
–3dBFS, 25Ω Series  
300  
MHz  
Resistances  
DIGITAL DATA INPUTS  
VIH High-Level Input Voltage  
VIL Low-Level Input Voltage  
CIN Input Capacitance  
DIGITAL DATA OUTPUTS  
Data Format  
2.2  
0.6  
3.0  
V
V
pF  
Straight Offset Binary  
Data Bit Rate  
240  
600  
Mbps  
MHz  
SERIAL INTERFACE  
SCLK Serial Clock Input Frequency  
20  
(7) A differential ON/OFF pulse is applied to the ADC input. The differential amplitude of the pulse in its ON (high) state is twice the  
full-scale range of the ADC, while the differential amplitude of the pulse in its OFF (low) state is zero. The overload recovery time of the  
ADC is measured as the time required by the ADC output code to settle within 1% of full-scale, as measured from its mid-code value  
when the pulse is switched from ON (high) to OFF (low).  
REFERENCE SELECTION  
MODE  
INT/EXT  
DESCRIPTION  
Internal Reference; FSR = 2.03VPP  
1
Default with internal pull-up.  
Internal reference is powered down. The common-mode voltage  
of the external reference should be within 50mV of VCM. VCM is  
derived from the internal bandgap voltage.  
External Reference; FSR = 2.03 x (REFT – REFB)  
0
Copyright © 2004–2009, Texas Instruments Incorporated  
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ADS5271  
SBAS313C–JUNE 2004–REVISED JANUARY 2009...................................................................................................................................................... www.ti.com  
AC CHARACTERISTICS  
TMIN = –40°C and TMAX = +85°C. Typical values are at TA = +25°C, clock frequency = maximum specified, 50% clock duty  
cycle, AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, and LVDS buffer current at 3.5mA per  
channel, unless otherwise noted.  
ADS5271  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
DYNAMIC CHARACTERISTICS  
fIN = 1MHz  
fIN = 5MHz  
fIN = 10MHz  
fIN = 20MHz  
fIN = 1MHz  
fIN = 5MHz  
fIN = 10MHz  
fIN = 20MHz  
fIN = 1MHz  
fIN = 5MHz  
fIN = 10MHz  
fIN = 20MHz  
fIN = 1MHz  
fIN = 5MHz  
fIN = 10MHz  
fIN = 20MHz  
fIN = 1MHz  
fIN = 5MHz  
fIN = 10MHz  
fIN = 20MHz  
fIN = 5MHz  
87  
85  
dBc  
dBc  
78  
SFDR Spurious-Free Dynamic Range  
HD2 2nd-Order Harmonic Distortion  
HD3 3rd-Order Harmonic Distortion  
SNR Signal-to-Noise Ratio  
84  
dBc  
82  
dBc  
90  
dBc  
85  
78  
90  
dBc  
87  
dBc  
85  
dBc  
87  
dBc  
85  
dBc  
84  
dBc  
82  
dBc  
70.5  
70.5  
70.5  
70.5  
70  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
Bits  
69.5  
69  
70  
SINAD Signal-to-Noise and Distortion  
70  
70  
ENOB Effective Number of Bits  
Crosstalk  
11.3  
–90  
5MHz Full-Scale Signal Applied to 7 Channels;  
Measurement Taken on the Channel with No Input Signal  
dBc  
Two-Tone, Third-Order  
IMD3  
f1 = 9.5MHz at –7dBFS  
f2 = 10.2MHz at –7dBFS  
–85  
dBFS  
Intermodulation Distortion  
6
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Product Folder Link(s): ADS5271  
 
 
 
 
 
ADS5271  
www.ti.com ...................................................................................................................................................... SBAS313C–JUNE 2004–REVISED JANUARY 2009  
LVDS DIGITAL DATA AND CLOCK OUTPUTS  
Test conditions at IO = 3.5mA, RLOAD = 100Ω, CLOAD = 6pF, and 50% duty cycle. IO refers to the current setting for the LVDS buffer. RLOAD is  
the differential load resistance between the differential LVDS pair. CLOAD is the effective single-ended load capacitance between each of the  
LVDS pins and ground. CLOAD includes the receiver input parasitics as well as the routing parasitics. Measurements are done with a 1-inch  
transmission line of 100Ω characteristic impedance between the device and the load. All LVDS specifications are characterized, but not  
parametrically tested at production. LCLKOUT refers to (LCLKP – LCLKN); ADCLKOUT refers to (ADCLKP – ADCLKN); DATA OUT refers to  
(OUTP – OUTN); and ADCLK refers to the input sampling clock.  
PARAMETER  
DC SPECIFICATIONS(1)  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
VOH Output Voltage High, OUTP or OUTN  
VOL Output Voltage Low, OUTP or OUTN  
RLOAD = 100Ω ± 1%; See LVDS Timing Diagram, Page 8  
RLOAD = 100Ω ± 1%  
1265  
940  
275  
1.1  
1365  
1040  
325  
1.2  
13  
1465  
1140  
375  
mV  
mV  
mV  
V
|VOD  
|
Output Differential Voltage  
RLOAD = 100Ω ± 1%  
VOS Output Offset Voltage(2)  
RO Output Impedance, Differential  
RO Output Impedance, Differential  
CO Output Capacitance(3)  
RLOAD = 100Ω ± 1%; See LVDS Timing Diagram, Page 8  
Normal Operation  
1.3  
kΩ  
kΩ  
pF  
Power-Down  
20  
4
|ΔVOD  
|
Change in |VOD| Between 0 and 1  
RLOAD = 100Ω ± 1%  
RLOAD = 100Ω ± 1%  
10  
25  
40  
12  
mV  
mV  
mA  
mA  
ΔVOS Change Between 0 and 1  
ISOUT Output Short-Circuit Current  
ISOUTNP Output Current  
Drivers Shorted to Ground  
Drivers Shorted Together  
DRIVER AC SPECIFICATIONS  
ADCLKOUT Clock Duty Cycle(4)  
LCLKOUT Duty Cycle(4)  
45  
45  
50  
50  
55  
55  
%
%
Data Setup Time(5)(6)  
Data Hold Time(6)(7)  
LVDS Outputs Rise/Fall Time(8)  
0.6  
0.42  
ns  
ns  
ps  
ps  
ps  
ps  
ns  
ns  
ns  
IO = 2.5mA  
IO = 3.5mA  
IO = 4.5mA  
IO = 6.0mA  
400  
300  
230  
180  
0.83  
0.83  
0
180  
500  
LCLKOUT Rising Edge to ADCLKOUT Rising Edge(9)  
ADCLKOUT Rising Edge to LCLKOUT Falling Edge(9)  
ADCLKOUT Rising Edge to DATA OUT Transition(9)  
0.60  
0.60  
1.05  
1.05  
–0.35  
+0.35  
(1) The dc specifications refer to the condition where the LVDS outputs are not switching, but are permanently at a valid logic level 0 or 1.  
(2) VOS refers to the common-mode of OUTP and OUTN.  
(3) Output capacitance inside the device, from either OUTP or OUTN to ground.  
(4) Measured between zero crossings.  
(5) DATA OUT (OUTP – OUTN) crossing zero to LCLKOUT (LCLKP – LCLKN) crossing zero.  
(6) Data setup and hold time accounts for data-dependent skews, channel-to-channel mismatches, as well as effects of clock jitter within  
the device.  
(7) LCLKOUT crossing zero to DATA OUT crossing zero.  
(8) Measured from –100mV to +100mV on the differential output for rise time, and +100mV to –100mV for fall time.  
(9) Measured between zero crossings.  
SWITCHING CHARACTERISTICS  
TMIN = –40°C and TMAX = +85°C. Typical values are at TA = +25°C, clock frequency = maximum specified, 50% clock duty  
cycle, AVDD = 3.3V, LVDD = 3.3V, –1dBFS, internal voltage reference, and LVDS buffer current at 3.5mA per channel,  
unless otherwise noted.  
PARAMETER  
SWITCHING SPECIFICATIONS  
tSAMPLE  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
20  
2
50  
ns  
ns  
tD(A) Aperture Delay  
4
6.5  
Aperture Jitter (uncertainty)  
tD(pipeline) Latency  
tPROP Propagation Delay  
1
ps rms  
Cycles  
ns  
6.5  
4.8  
3
6.5  
Copyright © 2004–2009, Texas Instruments Incorporated  
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ADS5271  
SBAS313C–JUNE 2004–REVISED JANUARY 2009...................................................................................................................................................... www.ti.com  
LVDS TIMING DIAGRAM (PER ADC CHANNEL)  
Sample n  
Sample n + 6  
Input  
1
tSAMPLE  
ADCLK  
tS  
2
LCLKP  
6X ADCLK  
LCLKN  
OUTP  
D10 D11  
D0 D1  
SERIAL DATA  
OUTN  
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9  
Sample n data  
ADCLKP  
1X ADCLK  
ADCLKN  
tD(A)  
tPROP  
6.5 Clock Cycles  
NOTE: Serial data bit format shown in LSB first mode.  
RECOMMENDED POWER-UP SEQUENCING AND RESET TIMING  
AVDD (3V to 3.6V)  
t1  
AVDD  
LVDD (3V to 3.6V)  
t2  
LVDD  
Device Ready  
For ADC Operation  
t3  
t4  
t7  
t5  
t6  
RESET  
CS  
Device Ready  
For Serial Register Write  
Device Ready  
Start of Clock  
For ADC Operation  
ADCLK  
t8  
NOTE: 10 s < t1 < 50ms; 10 s < t2 < 50ms; 10ms < t3 < 10ms; t4 > 10ms; t5 > 100ns; t6 > 100ns; t7 > 10ms; and t8 > 100 s.  
µ
µ
−
µ
8
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POWER-DOWN TIMING  
µ
1 s  
µ
500 s  
PD  
Device Fully  
Powers Down  
Device Fully  
Powers Up  
µ
NOTE: The shown power−up time is based on 1 F bypass capacitors on the reference pins.  
See the Theory of Operation section for details.  
SERIAL INTERFACE TIMING  
Outputs change on  
next rising clock edge  
after CS goes high.  
ADCLK  
CS  
Start Sequence  
t6  
t1  
t7  
Data latched on  
each rising edge of SCLK.  
t2  
SCLK  
t3  
D7  
(MSB)  
SDATA  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
t4  
t5  
NOTE: Data is shifted in MSB first.  
PARAMETER  
DESCRIPTION  
Serial CLK Period  
Serial SLK High Time  
Serial CLK Low Time  
Data Setup Time  
MIN  
50  
20  
20  
5
TYP  
MAX  
UNIT  
ns  
t1  
t2  
t3  
t4  
t5  
t6  
t7  
ns  
ns  
ns  
Data Hold Time  
5
ns  
CS Fall to SCLK Rise  
8
ns  
SCLK Rise to CS Rise  
8
ns  
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SERIAL INTERFACE REGISTERS  
ADDRESS  
DATA  
DESCRIPTION  
REMARKS  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
0
0
LVDS BUFFERS (Register 0)  
Normal ADC Output  
All Data Outputs  
0
0
1
1
0
1
0
1
(default after reset)  
Deskew Pattern  
Sync Pattern  
See Test Patterns  
Custom Pattern  
0
0
1
1
0
1
0
1
Output Current in LVDS = 3.5mA  
Output Current in LVDS = 2.5mA  
Output Current in LVDS = 4.5mA  
Output Current in LVDS = 6.0mA  
CLOCK CURRENT (Register 1)  
Default LVDS Clock Output Current  
2x LVDS Clock Output Current(1)  
LSB/MSB MODE (Register 1)  
LSB First Mode  
(default after reset)  
0
0
0
0
0
0
0
0
1
1
1
0
0
0
X
X
X
X
0
1
IOUT = 3.5mA (default)  
IOUT = 7.0mA  
0
0
0
1
X
X
X
X
(default after reset)  
MSB First Mode  
POWER-DOWN ADC CHANNELS  
(Register 2)  
X
X
X
X
X
X
X
X
Example: 1010 Powers Down  
Channels 4 and 2 and  
Keeps Channels 1 and 3 Active  
Power-Down Channels 1 to 4; D3 is  
for Channel 4 and D0 for Channel 1  
0
0
1
1
POWER-DOWN ADC CHANNELS  
(Register 3)  
Power-Down Channels 5 to 8; D3 is  
for Channel 8 and D0 for Channel 5  
CUSTOM PATTERN (Registers 4–6)  
D3  
X
D2  
X
D1  
X
D0  
X
Bits for Custom Pattern  
See Test Patterns  
0
0
0
1
1
1
0
0
1
0
1
0
X
X
X
X
X
X
X
X
(1) Output current drive for the two clock LVDS buffers (LCLKP and LCLKN and ADCLKP and ADCLKN) is double the output current setting  
programmed in register 0. The current drive of the data buffers remains the same as the setting in register 0.  
TEST PATTERNS  
Serial Output(1)  
ADC Output(2)  
Deskew Pattern  
Sync Pattern  
LSB  
D0  
MSB  
D11  
0
D1  
0
D2  
1
D3  
0
D4  
1
D5  
0
D6  
1
D7  
0
D8  
1
D9  
0
D10  
1
1
0
0
0
0
0
0
1
1
1
1
1
1
Custom Pattern(3)  
D0(4)  
D1(4)  
D2(4)  
D3(4)  
D0(5)  
D1(5)  
D2(5)  
D3(5)  
D0(6)  
D1(6)  
D2(6)  
D3(6)  
(1) The serial output stream comes out LSB first by default.  
(2) D11...D0 represent the 12 output bits from the ADC.  
(3) D0(4) represents the content of bit D0 of register 4, D3(6) represents the content of bit D3 of register 6, etc.  
10  
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ADS5271  
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PIN CONFIGURATION  
Top View  
HTQFP  
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61  
60  
59  
1
2
AVDD  
IN8N  
AVDD  
IN1P  
IN1N  
58 IN8P  
57  
3
4
AVSS  
AVSS  
IN2P  
56 IN7N  
55 IN7P  
5
IN2N  
6
54  
7
AVDD  
AVDD  
AVSS  
IN3P  
53 AVSS  
8
52  
51  
50  
9
IN6N  
IN6P  
10  
11  
IN3N  
ADS5271  
AVSS  
AVSS  
49 IN5N  
48  
IN4P 12  
13  
IN5P  
IN4N  
47 AVDD  
46 LVSS  
AVDD 14  
LVSS 15  
45  
16  
RESET  
PD  
44 LVSS  
LVSS 17  
43  
42  
41  
18  
19  
20  
LVSS  
LVSS  
LCLKP  
LCLKN  
ADCLKN  
ADCLKP  
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40  
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PIN DESCRIPTIONS  
NAME  
ADCLK  
ADCLKN  
ADCLKP  
AVDD  
AVSS  
CS  
PIN #  
I/O  
I
DESCRIPTION  
71  
Data Converter Clock Input  
42  
O
O
I
Negative LVDS ADC Clock Output  
41  
Positive LVDS ADC Clock Output  
1, 7, 14, 47, 54, 60, 63, 70, 75  
Analog Power Supply  
4, 8, 11, 50, 53, 57, 61, 62, 68, 72–74, 79, 80  
I
Analog Ground  
76  
I
Chip Select; 0 = Select, 1 = No Select  
Channel 1 Differential Analog Input Low  
Channel 1 Differential Analog Input High  
Channel 2 Differential Analog Input Low  
Channel 2 Differential Analog Input High  
Channel 3 Differential Analog Input Low  
Channel 3 Differential Analog Input High  
Channel 4 Differential Analog Input Low  
Channel 4 Differential Analog Input High  
Channel 5 Differential Analog Input Low  
Channel 5 Differential Analog Input High  
Channel 6 Differential Analog Input Low  
Channel 6 Differential Analog Input High  
Channel 7 Differential Analog Input Low  
Channel 7 Differential Analog Input High  
Channel 8 Differential Analog Input Low  
Channel 8 Differential Analog Input High  
Internal/External Reference Select; 0 = External, 1 = Internal. Weak pull-up to supply.  
Bias Current Setting Resistor of 56.2kΩ to Ground  
Negative LVDS Clock  
IN1N  
3
I
IN1P  
2
I
IN2N  
6
I
IN2P  
5
I
IN3N  
10  
I
IN3P  
9
I
IN4N  
13  
I
IN4P  
12  
I
IN5N  
49  
I
IN5P  
48  
I
IN6N  
52  
I
IN6P  
51  
I
IN7N  
56  
I
IN7P  
55  
I
IN8N  
59  
I
IN8P  
58  
I
INT/EXT  
ISET  
69  
I
64  
I/O  
O
O
I
LCLKN  
LCLKP  
LVDD  
LVSS  
OUT1N  
OUT1P  
OUT2N  
OUT2P  
OUT3N  
OUT3P  
OUT4N  
OUT4P  
OUT5N  
OUT5P  
OUT6N  
OUT6P  
OUT7N  
OUT7P  
OUT8N  
OUT8P  
PD  
20  
19  
Positive LVDS Clock  
25, 35  
LVDS Power Supply  
15, 17, 18, 26, 36, 43, 44, 46  
I
LVDS Ground  
22  
21  
24  
23  
28  
27  
30  
29  
32  
31  
34  
33  
38  
37  
40  
39  
16  
66  
67  
45  
78  
77  
65  
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
I
Channel 1 Negative LVDS Data Output  
Channel 1 Positive LVDS Data Output  
Channel 2 Negative LVDS Data Output  
Channel 2 Positive LVDS Data Output  
Channel 3 Negative LVDS Data Output  
Channel 3 Positive LVDS Data Output  
Channel 4 Negative LVDS Data Output  
Channel 4 Positive LVDS Data Output  
Channel 5 Negative LVDS Data Output  
Channel 5 Positive LVDS Data Output  
Channel 6 Negative LVDS Data Output  
Channel 6 Positive LVDS Data Output  
Channel 7 Negative LVDS Data Output  
Channel 7 Positive LVDS Data Output  
Channel 8 Negative LVDS Data Output  
Channel 8 Positive LVDS Data Output  
Power-Down; 0 = Normal, 1 = Power-Down  
Reference Bottom Voltage (2Ω resistor in series with a 0.1F capacitor to ground)  
Reference Top Voltage (2Ω resistor in series with a 0.1F capacitor to ground)  
Reset to Default; 0 = Reset, 1 = Normal. Weak pull-down to ground.  
Serial Data Clock  
REFB  
REFT  
RESET  
SCLK  
SDATA  
VCM  
I/O  
I/O  
I
I
I
Serial Data Input  
O
Common-Mode Output Voltage  
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ADS5271  
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DEFINITION OF SPECIFICATIONS  
Analog Bandwidth  
Minimum Conversion Rate  
The analog input frequency at which the spectral  
power of the fundamental frequency (as determined  
by FFT analysis) is reduced by 3dB.  
This is the minimum sampling rate where the ADC  
still works.  
Signal-to-Noise and Distortion (SINAD)  
Aperture Delay  
SINAD is the ratio of the power of the fundamental  
(PS) to the power of all the other spectral components  
including noise (PN) and distortion (PD), but not  
including dc.  
The delay in time between the rising edge of the input  
sampling clock and the actual time at which the  
sampling occurs.  
PS  
SINAD + 10Log  
10 PN ) PD  
Aperture Uncertainty (Jitter)  
The sample-to-sample variation in aperture delay.  
SINAD is either given in units of dBc (dB to carrier)  
when the absolute power of the fundamental is used  
as the reference, or dBFS (dB to full-scale) when the  
power of the fundamental is extrapolated to the  
full-scale range of the converter.  
Clock Duty Cycle  
Pulse width high is the minimum amount of time that  
the ADCLK pulse should be left in logic ‘1’ state to  
achieve rated performance. Pulse width low is the  
minimum time that the ADCLK pulse should be left in  
a low state (logic ‘0’). At a given clock rate, these  
specifications define an acceptable clock duty cycle.  
Signal-to-Noise Ratio (SNR)  
SNR is the ratio of the power of the fundamental (PS)  
to the noise floor power (PN), excluding the power at  
dc and the first eight harmonics.  
PS  
SNR + 10Log  
10 PN  
Differential Nonlinearity (DNL)  
An ideal ADC exhibits code transitions that are  
exactly 1 LSB apart. DNL is the deviation of any  
single LSB transition at the digital output from an  
ideal 1 LSB step at the analog input. If a device  
claims to have no missing codes, it means that all  
possible codes (for a 12-bit converter, 4096 codes)  
are present over the full operating range.  
SNR is either given in units of dBc (dB to carrier)  
when the absolute power of the fundamental is used  
as the reference, or dBFS (dB to full-scale) when the  
power of the fundamental is extrapolated to the  
full-scale range of the converter.  
Effective Number of Bits (ENOB)  
Spurious-Free Dynamic Range  
The ENOB is a measure of converter performance as  
compared to the theoretical limit based on  
quantization noise.  
The ratio of the power of the fundamental to the  
highest other spectral component (either spur or  
harmonic). SFDR is typically given in units of dBc (dB  
to carrier).  
SINAD * 1.76  
ENOB +  
6.02  
Two-Tone, Third-Order Intermodulation  
Distortion  
Integral Nonlinearity (INL)  
INL is the deviation of the transfer function from a  
reference line measured in fractions of 1 LSB using a  
best straight line or best fit determined by a least  
square curve fit. INL is independent from effects of  
offset, gain or quantization errors.  
Two-tone IMD3 is the ratio of power of the  
fundamental (at frequencies f1 and f2) to the power of  
the worst spectral component of third-order  
intermodulation distortion at either frequency 2f1 – f2  
or 2f2 – f1. IMD3 is either given in units of dBc (dB to  
carrier) when the absolute power of the fundamental  
is used as the reference, or dBFS (dB to full-scale)  
when the power of the fundamental is extrapolated to  
the full-scale range of the converter.  
Maximum Conversion Rate  
The encode rate at which parametric testing is  
performed. This is the maximum sampling rate where  
certified operation is given.  
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TYPICAL CHARACTERISTICS  
Typical values are at TA = +25C, clock frequency = maximum specified, 50% clock duty cycle, AVDD = 3.3V, LVDD = 3.3V,  
–1dBFS, ISET = 56.2kΩ, internal voltage reference, and LVDS buffer current at 3.5mA per channel, unless otherwise noted.  
SPECTRAL PERFORMANCE  
SPECTRAL PERFORMANCE  
0
20  
40  
60  
80  
0
20  
40  
60  
80  
−
fIN = 1MHz ( 1dBFS)  
SNR = 71.1dBFS  
SINAD = 70.9dBFS  
SFDR = 87.7dBc  
−
fIN = 5MHz ( 1dBFS)  
SNR = 70.9dBFS  
SINAD = 70.8dBFS  
SFDR = 89dBc  
−
−
−
−
−
−
−
−
−
−
100  
120  
−
−
100  
120  
0
0
0
5
10  
15  
20  
25  
0
5
10  
15  
20  
25  
Input Frequency (MHz)  
Input Frequency (MHz)  
Figure 1.  
Figure 2.  
SPECTRAL PERFORMANCE  
SPECTRAL PERFORMANCE  
0
0
−
fIN = 10MHz ( 1dBFS)  
SNR = 70.9dBFS  
SINAD = 70.7dBFS  
SFDR = 85.4dBc  
−
fIN = 20MHz ( 1dBFS)  
SNR = 70.5dBFS  
SINAD = 70.4dBFS  
SFDR = 85.6dBc  
−
−
−
−
20  
40  
60  
80  
−
−
−
−
20  
40  
60  
80  
−
−
100  
120  
−
−
100  
120  
5
10  
15  
20  
25  
0
5
10  
15  
Input Frequency (MHz)  
Figure 4.  
20  
25  
Input Frequency (MHz)  
Figure 3.  
INTERMODULATION DISTORTION  
DIFFERENTIAL NONLINEARITY  
0
0.5  
0.4  
0.3  
0.2  
0.1  
0
fIN = 5MHz  
−
−
f1 = 9.5MHz ( 7dBFS)  
f2 = 10.2MHz ( 7dBFS)  
−
−
−
−
20  
40  
60  
80  
−
IMD = 85dBFS  
−
0.1  
0.2  
0.3  
0.4  
0.5  
−
−
−
−
−
−
100  
120  
0
512 1024 1536 2048 2560 3072 3584 4096  
5
10  
15  
20  
25  
Code  
Input Frequency (MHz)  
Figure 5.  
Figure 6.  
14  
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TYPICAL CHARACTERISTICS (continued)  
Typical values are at TA = +25C, clock frequency = maximum specified, 50% clock duty cycle, AVDD = 3.3V, LVDD = 3.3V,  
–1dBFS, ISET = 56.2kΩ, internal voltage reference, and LVDS buffer current at 3.5mA per channel, unless otherwise noted.  
INTEGRAL NONLINEARITY  
SWEPT INPUT POWER  
1.0  
0.8  
0.6  
0.4  
0.2  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
fIN = 5MHz  
fIN = 5MHz  
SNR (dBFS)  
SFDR (dBc)  
−
0.2  
0.4  
0.6  
0.8  
1.0  
SNR (dBc)  
−
−
−
−
−
−
−
−
−
−
−
10  
0
512 1024 1536 2048 2560 3072 3584 4096  
70  
60  
50  
40  
30  
20  
0
80  
60  
Code  
Input Amplitude (dBFS)  
Figure 7.  
Figure 8.  
SWEPT INPUT POWER  
DYNAMIC PERFORMANCE vs DUTY CYCLE  
fIN = 5MHz  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
95  
90  
85  
80  
75  
70  
65  
60  
fIN = 10MHz  
SNR (dBFS)  
SFDR  
SFDR (dBc)  
SNR  
SNR (dBc)  
SINAD  
−
−
−
−
−
−
−
10  
70  
60  
50  
40  
30  
20  
0
20  
30  
40  
50  
60  
70  
Input Amplitude (dBFS)  
Duty Cycle (%)  
Figure 9.  
Figure 10.  
DYNAMIC PERFORMANCE vs INPUT FREQUENCY  
DYNAMIC PERFORMANCE vs SAMPLE RATE  
fIN = 5MHz  
SFDR  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
95  
90  
85  
80  
75  
70  
65  
60  
SFDR  
SNR  
SINAD  
SNR  
15  
20  
25  
30  
35  
40  
45  
50  
55  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
Sample Rate (MSPS)  
Input Frequency (MHz)  
Figure 11.  
Figure 12.  
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TYPICAL CHARACTERISTICS (continued)  
Typical values are at TA = +25C, clock frequency = maximum specified, 50% clock duty cycle, AVDD = 3.3V, LVDD = 3.3V,  
–1dBFS, ISET = 56.2kΩ, internal voltage reference, and LVDS buffer current at 3.5mA per channel, unless otherwise noted.  
DYNAMIC PERFORMANCE vs SAMPLE RATE  
SUPPLY CURRENT vs SAMPLE RATE  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
300  
250  
200  
150  
100  
50  
fIN = 10MHz  
SFDR  
IAVDD  
SNR  
SINAD  
ILVDD  
0
15  
20  
25  
30  
35  
40  
45  
50  
55  
60  
10  
15  
20  
25  
30  
35  
40  
45  
50  
Sample Rate (MSPS)  
Sample Rate (MSPS)  
Figure 13.  
Figure 14.  
16  
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ADS5271  
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THEORY OF OPERATION  
data externally has multiple advantages, such as a  
reduced number of output pins (saving routing space  
on the board), reduced power consumption, and  
reduced effects of digital noise coupling to the analog  
circuit inside the ADS5271.  
OVERVIEW  
The ADS5271 is an 8-channel, high-speed, CMOS  
ADC.  
It  
consists  
of  
a
high-performance  
sample-and-hold circuit at the input, followed by a  
12-bit ADC. The 12 bits given out by each channel  
are serialized and sent out on a single pair of pins in  
LVDS format. All eight channels of the ADS5271  
operate from a single clock referred to as ADCLK.  
The sampling clocks for each of the eight channels  
are generated from the input clock using a carefully  
matched clock buffer tree. The 12x clock required for  
the serializer is generated internally from ADCLK  
using a phase lock loop (PLL). A 6x and a 1x clock  
are also output in LVDS format along with the data to  
enable easy data capture. The ADS5271 operates  
from internally generated reference voltages that are  
trimmed to ensure matching across multiple devices  
on a board. This feature eliminates the need for  
external routing of reference lines and also improves  
matching of the gain across devices. The nominal  
values of REFT and REFB are 1.95V and 0.95V,  
respectively. These values imply that a differential  
input of –1V corresponds to the zero code of the  
ADC, and a differential input of +1V corresponds to  
the full-scale code (4095 LSB). VCM (common-mode  
voltage of REFT and REFB) is also made available  
externally through a pin, and is nominally 1.45V.  
The ADS5271 operates from two sets of supplies and  
grounds. The analog supply/ground set is denoted as  
AVDD/AVSS, while the digital set is denoted by  
LVDD/LVSS.  
DRIVING THE ANALOG INPUTS  
The analog input biasing is shown in Figure 15. The  
inputs are biased internally using two 600Ω resistors  
to enable ac-coupling. A resistor greater than 20Ω is  
recommended in series with each input pin.  
A 4pF sampling capacitor is used to sample the  
inputs. The choice of the external ac-coupling  
capacitor is dictated by the attenuation at the lowest  
desired input frequency of operation. The attenuation  
resulting from using a 10nF ac-coupling capacitor is  
0.04%.  
ADS5271  
IN+  
Ω
Ω
600  
Input  
Circuitry  
600  
The ADC employs a pipelined converter architecture  
consisting of a combination of multi-bit and single-bit  
internal stages. Each stage feeds its data into the  
digital error correction logic, ensuring excellent  
differential linearity and no missing codes at the  
12-bit level. The pipeline architecture results in a data  
latency of 6.5 clock cycles.  
−
IN  
Internal  
Voltage  
VCM  
Reference  
CM Buffer  
NOTE: Dashed area denotes one of eight channels.  
The output of the ADC goes to a serializer that  
operates from a 12x clock generated by the PLL. The  
12 data bits from each channel are serialized and  
sent LSB first. In addition to serializing the data, the  
serializer also generates a 1x clock and a 6x clock.  
These clocks are generated in the same way the  
serialized data is generated, so these clocks maintain  
perfect synchronization with the data. The data and  
clock outputs of the serializer are buffered externally  
using LVDS buffers. Using LVDS buffers to transmit  
Figure 15. Analog Input Bias Circuitry  
If the input is dc-coupled, then the output  
common-mode voltage of the circuit driving the  
ADS5271 should match the VCM (which is provided as  
an output pin) to within ±50mV. It is recommended  
that the output common-mode of the driving circuit be  
derived from VCM provided by the device.  
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Figure 16 shows a detailed RLC model of the  
sample-and-hold circuit. The circuit operates in two  
phases. In the sample phase, the input is sampled on  
two capacitors that are nominally 4pF. The sampling  
circuit consists of a low-pass RC filter at the input to  
filter out noise components that might be differentially  
coupled on the input pins. The next phase is the hold  
phase wherein the voltage sampled on the capacitors  
is transferred (using the amplifier) to a subsequent  
pipeline ADC stage.  
over-voltage pulse input of twice the amplitude of a  
full-scale pulse is expected to be within three clock  
cycles when the input switches from overload to zero  
signal. All of the amplifiers in the SHA and ADC are  
specially designed for excellent recovery from an  
overload signal.  
In most applications, the ADC inputs are driven with  
differential sinusoidal inputs. While the pulse-type  
signal remains at peak overload conditions  
throughout its HIGH state, the sinusoid signal only  
attains peak overload intermittently, at its minima and  
maxima. This condition is much less severe for the  
ADC input and the recovery of the ADC output (to 1%  
of full-scale around the expected code). This typically  
happens within the second clock when the input is  
driven with a sinusoid of amplitude equal to twice that  
of the ADC differential full-scale range.  
INPUT OVER-VOLTAGE RECOVERY  
The differential full-scale range supported by the  
ADS5271 is nominally 2.03V. The ADS5271 is  
specially designed to handle an over-voltage  
condition where the differential peak-to-peak voltage  
can exceed up to twice the ADC full-scale range. If  
the input common-mode is not considerably off from  
VCM during overload (less than 300mV around the  
nominal value of 1.45V), recovery from an  
IN  
OUT  
5nH  
to 9nH  
INP  
1.5pF to  
2.5pF  
3.2pF  
to 4.8pF  
Ω
Ω
Ω
60  
Ω
to 120  
15  
15  
Ω
to 25  
Ω
to 25  
Ω
1
IN  
OUT  
IN  
OUT  
Ω
500  
Ω
to 720  
OUT  
OUTP  
OUTN  
1.5pF  
to 1.9pF  
IN  
Ω
500  
Ω
Ω
to 720  
Ω
Ω
15 to 35  
3.2pF  
to 4.8pF  
Ω
15  
Ω
Ω
60  
Ω
to 120  
15  
Ω
to 25  
to 25  
IN  
OUT  
IN  
OUT  
5nH  
to 9nH  
INN  
1.5pF to  
2.5pF  
Switches that are ON  
in SAMPLE phase.  
Ω
1
Switches that are ON  
in HOLD phase.  
IN  
OUT  
Figure 16. Overall Structure of the Sample-and-Hold Circuit  
18  
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REFERENCE CIRCUIT DESIGN  
The device also supports the use of external  
reference voltages. This mode involves forcing REFT  
and REFB externally. In this mode, the internal  
reference buffer is tri-stated. Since the switching  
current for the eight ADCs come from the externally  
forced references, it is possible for the performance  
to be slightly less than when the internal references  
are used. It should be noted that in this mode, VCM  
and ISET continue to be generated from the internal  
bandgap voltage, as in the internal reference mode. It  
is therefore important to ensure that the  
common-mode voltage of the externally forced  
The digital beam-forming algorithm relies heavily on  
gain matching across all receiver channels. A typical  
system would have about 12 octal ADCs on the  
board. In such a case, it is critical to ensure that the  
gain is matched, essentially requiring the reference  
voltages seen by all the ADCs to be the same.  
Matching references within the eight channels of a  
chip is done by using a single internal reference  
voltage buffer. Trimming the reference voltages on  
each chip during production ensures the reference  
voltages are well matched across different chips.  
reference voltages matches to within 50mV of VCM  
.
The state of the reference voltages during various  
combinations of PD and INT/EXT is shown in  
Table 1.  
All bias currents required for the internal operation of  
the device are set using an external resistor to  
ground at pin ISET. Using a 56.2kΩ resistor on ISET  
generates an internal reference current of 20µA. This  
current is mirrored internally to generate the bias  
current for the internal blocks. Using a larger external  
resistor at ISET reduces the reference bias current and  
thereby scales down the device operating power.  
However, it is recommended that the external resistor  
be within 10% of the specified value of 56.2kΩ so  
that the internal bias margins for the various blocks  
are proper.  
Table 1. State of Reference Voltages for Various  
Combinations of PD and INT/EXT  
PD  
INT/EXT  
REFT  
REFB  
VCM  
0
0
1
1
0
1
0
1
Tri-State  
Tri-State  
1.45V  
1.95V  
0.95V  
1.45V  
Tri-State  
Tri-State  
Tri-State(1) Tri-State(1)  
Tri-State  
Tri-State  
Buffering the internal bandgap voltage also generates  
a voltage called VCM, which is set to the midlevel of  
REFT and REFB, and is accessible on a pin. It is  
meant as a reference voltage to derive the input  
common-mode in case the input is directly coupled. It  
can also be used to derive the reference  
common-mode voltage in the external reference  
mode.  
(1) Weak pull-down (approximately 5kΩ) to ground.  
CLOCKING  
The eight channels on the chip operate from a single  
ADCLK input. To ensure that the aperture delay and  
jitter are same for all the channels, a clock tree  
network is used to generate individual sampling  
clocks to each channel. The clock paths for all the  
channels are matched from the source point all the  
way to the sample-and-hold amplifier. This ensures  
that the performance and timing for all the channels  
are identical. The use of the clock tree for matching  
introduces an aperture delay, which is defined as the  
delay between the rising edge of ADCLK and the  
actual instant of sampling. The aperture delays for all  
the channels are matched to the best possible extent.  
However, a mismatch of ±20ps (±3σ) could exist  
between the aperture instants of the eight ADCs  
within the same chip. However, the aperture delays of  
ADCs across two different chips can be several  
hundred picoseconds apart. Another critical  
specification is the aperture jitter that is defined as  
the uncertainty of the sampling instant. The gates in  
the clock path are designed to provide an rms jitter of  
approximately 1ps.  
When using the internal reference mode, a 2Ω  
resistor should be added between the reference pins  
(REFT and REFB) and the decoupling capacitor, as  
shown in Figure 17. If the device is used in the  
external reference mode, this 2Ω resistor is not  
required.  
ADS5271  
ISET  
REFT  
REFB  
Ω
56.2k  
Ω
2
Ω
2
µ
0.1  
µ
µ
µ
0.1 F  
F
2.2 F  
2.2 F  
Ideally, the input ADCLK should have a 50% duty  
cycle. However, while routing ADCLK to different  
components onboard, the duty cycle of the ADCLK  
reaching the ADS5271 could deviate from 50%. A  
smaller (or larger) duty cycle reduces the time  
available for sample or hold phases of each circuit,  
and is therefore not optimal. For this reason, the  
Figure 17. Internal Reference Mode  
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internal PLL is used to generate an internal clock that  
has 50% duty cycle. The input sampling instant,  
however, is determined by the rising edge of the  
external clock and is not affected by jitter in the PLL.  
In addition to generating a 50% duty cycle clock for  
the ADC, the PLL also generates a 12x clock that is  
used by the serializer to convert the parallel data from  
the ADC to a serial stream of bits.  
The LVDS buffer receives data from a serializer that  
takes the output data from each channel and  
serializes it into a single data stream. For a clock  
frequency of 50MHz, the data rate output of the  
serializer is 600MBPS. The data comes out LSB first,  
with a register programmability that allows it to revert  
to MSB first. The serializer also transmits a 1x clock  
and  
a
6x clock. The 6x clock (denoted as  
LCLKP/LCLKN) is meant to synchronize the capture of  
the LVDS data.  
The use of the PLL automatically dictates the  
minimum sample rate to be about 20MSPS. The PLL  
also requires the input clock to be free-running. If the  
input clock is momentarily stopped (for a duration of  
less than 300ns) then the PLL would require  
approximately 10µs to lock back to the input clock  
frequency.  
Deskew mode can be enabled as well, using a  
register setting. This mode gives out a data stream of  
alternate 0s and 1s and can be used determine the  
relative delay between the 6x clock and the output  
data for optimum capture. A 1x clock is also  
generated by the serializer and transmitted through  
the LVDS buffer. The 1x clock (referred to as  
ADCLKP/ADCLKN) is used to determine the start of  
the 12-bit data frame. Sync mode (enabled through a  
register setting) gives out a data of six 0s followed by  
six 1s. Using this mode, the 1x clock can be used to  
determine the start of the data frame. In addition to  
the deskew mode pattern and the sync mode pattern,  
a custom pattern can be defined by the user and  
output from the LVDS buffer. The LVDS buffers are  
tri-stated in the power-down mode. The LVDS outputs  
are weakly forced to 1.2V through 10kΩ resistors  
(from each output pin to 1.2V).  
LVDS BUFFERS  
The LVDS buffer has two current sources, as shown  
in Figure 18. OUTP and OUTN are loaded externally  
by a resistive load that is ideally about 100Ω.  
Depending on whether the data is 0 or 1, the currents  
are directed in one direction or the other through the  
resistor. The LVDS buffer has four current settings.  
The default current setting is 3.5mA, and provides a  
differential drop of about ±350mV across the 100Ω  
resistor.  
NOISE COUPLING ISSUES  
High-speed mixed signals are sensitive to various  
types of noise coupling. One of the main sources of  
noise is the switching noise from the serializer and  
the output buffers. Maximum care is taken to isolate  
these noise sources from the sensitive analog blocks.  
As a starting point, the analog and digital domains of  
the chip are clearly demarcated. AVDD and AVSS  
are used to denote the supplies for the analog  
sections, while LVDD and LVSS are used to denote  
the digital supplies. Care is taken to ensure that there  
is minimal interaction between the supply sets within  
the device. The extent of noise coupled and  
transmitted from the digital to the analog sections  
depends on the following:  
External  
Termination  
Resistor  
High  
Low  
OUTP  
OUTN  
Low  
High  
1. The effective inductances of each of the  
supply/ground sets.  
2. The isolation between the digital and analog  
supply/ground sets.  
Figure 18. LVDS Buffer  
Smaller effective inductance of the supply/ground  
pins leads to better suppression of the noise. For this  
reason, multiple pins are used to drive each  
supply/ground. It is also critical to ensure that the  
impedances of the supply and ground lines on board  
The single-ended output impedance of the LVDS  
drivers is very high because they are current-source  
driven. If there are excessive reflections from the  
receiver, it might be necessary to place a 100Ω  
termination resistor across the outputs of the LVDS  
drivers to minimize the effect of reflections. In such a  
situation, the output current of the LVDS drivers can  
be increased to regain the output swing.  
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are kept to the minimum possible values. Use of  
ground planes in the board as well as large  
decoupling capacitors between the supply and  
ground lines are necessary to get the best possible  
SNR from the device.  
RESET  
After the supplies have stabilized, it is necessary to  
give the device an active RESET pulse. This results  
in all internal registers resetting to their default value  
of 0 (inactive). Without a reset, it is possible that  
some registers may be in their non-default state on  
power-up. This may cause the device to malfunction.  
When a reset is active, the device outputs ‘0’ code on  
all channels. However, the LVDS output clocks are  
unaffected by reset.  
It is recommended that the isolation be maintained on  
board by using separate supplies to drive AVDD and  
LVDD, as well as separate ground planes for AVSS  
and LVSS.  
The use of LVDS buffers reduces the injected noise  
considerably, compared to CMOS buffers. The  
current in the LVDS buffer is independent of the  
direction of switching. Also, the low output swing as  
well as the differential nature of the LVDS buffer  
results in low-noise coupling.  
LAYOUT OF PCB WITH PowerPAD  
THERMALLY-ENHANCED PACKAGES  
The ADS5271 is housed in an 80-lead PowerPAD  
thermally-enhanced package. To make optimum use  
of the thermal efficiencies designed into the  
PowerPAD package, the printed circuit board (PCB)  
must be designed with this technology in mind.  
Please refer to SLMA004 PowerPAD brief PowerPAD  
Made Easy (refer to our web site at www.ti.com),  
which addresses the specific considerations required  
when integrating a PowerPAD package into a PCB  
design. For more detailed information, including  
thermal modeling and repair procedures, please see  
POWER-DOWN MODE  
The ADS5271 has a power-down pin, referred to as  
PD. Pulling PD high causes the device to enter the  
power-down mode. In this mode, the reference and  
clock circuitry, as well as all the channels, are  
powered down. Device power consumption drops to  
less than 100mW in this mode. In power-down mode,  
the internal buffers driving REFT and REFB are  
tri-stated and their outputs are forced to a voltage  
roughly equal to half of the voltage on AVDD. Speed  
of recovery from power-down mode depends on the  
value of the external capacitance on the REFT and  
REFB pins. For capacitances on REFT and REFB less  
than 1µF, the reference voltages settle to within 1%  
of their steady-state values in less than 500µs.  
Individual channels can also be selectively powered  
down by programming registers.  
the  
technical  
brief  
SLMA002,  
PowerPAD  
Thermally-Enhanced Package (www.ti.com).  
Interfacing High-Speed LVDS Outputs (SBOA104),  
an application report discussing the design of a  
simple deserializer that can deserialize LVDS outputs  
up to 840Mbps, can also be found on the TI web site  
(www.ti.com).  
CONNECTING HIGH-SPEED,  
MULTI-CHANNEL ADCs TO XILINX FPGAs  
The ADS5271 also has an internal circuit that  
monitors the state of stopped clocks. If ADCLK is  
stopped for longer than 300ns (or if it runs at a speed  
less than 3MHz), this monitoring circuit generates a  
A separate application note (XAPP774) describing  
how to connect TI's high-speed, multi-channel ADCs  
with serial LVDS outputs to Xilinx FPGAs can be  
downloaded directly from the Xilinx web site  
(http://www.xilinx.com).  
logic signal that puts the device in  
power-down state. As result, the power  
consumption of the device is reduced when ADCLK is  
stopped. The recovery from such partial  
a partial  
a
a
power-down takes ap- proximately 100µs; this is  
described in Table 2.  
Table 2. Time Constraints Associated with Device Recovery from Power-Down and Clock Stoppage  
DESCRIPTION  
TYP  
500µs  
10µs  
REMARKS  
Recovery from power-down mode (PD = 1 to PD = 0).  
Recovery from momentary clock stoppage ( < 300ns).  
Recovery from extended clock stoppage ( > 300ns).  
Capacitors on REFT and REFB less than 1µF.  
100µs  
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Revision History  
Changes from Revision B (September 2005) to Revision C .......................................................................................... Page  
•
Updated Absolute Maximum Ratings table: added entries for Digital Input Pins, Set 1 and Set 2 and added footnote 3.... 2  
Changes from Revision A (August 2005) to Revision B ................................................................................................ Page  
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Changed component image to having TI logo....................................................................................................................... 1  
Changed X to x (for instance, 12X, 6X, 1X, etc) globally. ..................................................................................................... 1  
Changed ISET to ISET globally. .............................................................................................................................................. 1  
Changed 56kΩ to 56.2kΩ globally......................................................................................................................................... 1  
Changed fourth bullet of Features section............................................................................................................................. 1  
Deleted eighth and 12th bullets of Features section. ............................................................................................................ 1  
Changed Synch to Bit in 11th bullet of Features section....................................................................................................... 1  
Added Four Current Modes for LVDS as 14th bullet in Features section. ........................................................................... 1  
Changed Description section and block diagram. ................................................................................................................. 1  
Changed Ordering Information table and footnotes............................................................................................................... 2  
Changed Absolute Maximum Ratings table and footnotes.................................................................................................... 2  
Changed Recommended Operating Conditions table and footnotes. ................................................................................... 3  
Changed Electrical Characteristics table, conditions, and footnotes..................................................................................... 4  
Changed Electrical Characteristics table, conditions, and footnotes..................................................................................... 5  
Changed Reference Selection table. ..................................................................................................................................... 5  
Changed AC Characteristics table conditions to include ISET = 56.2kΩ. ............................................................................... 6  
Changed 68 to 69.5 in second row of SNR section in AC Characteristics table................................................................... 6  
Changed 67.5 to 69 in second row of SINAD section in AC Characteristics table................................................................ 6  
Changed Crosstalk row of AC Characteristics table.............................................................................................................. 6  
Added IMD3 row of AC Characteristics table. ....................................................................................................................... 6  
Changed entire LVDS table, conditions, and footnotes......................................................................................................... 7  
Deleted condition value from CO row in LVDS table.............................................................................................................. 7  
Changed minimum unit values for Data Setup Time and Data Hold Time rows in LVDS table............................................ 7  
Changed Switching Characteristics table. ............................................................................................................................. 7  
Changed LVDS timing diagram. ............................................................................................................................................ 8  
Changed Reset timing diagram. ............................................................................................................................................ 8  
Changed Power-Down timing diagram. ................................................................................................................................. 9  
Changed Serial Interface Timing figure and table. ................................................................................................................ 9  
Changed Serial Interface Registers table............................................................................................................................ 10  
Changed Test Patterns table. .............................................................................................................................................. 10  
Changed Pin Configuration figure........................................................................................................................................ 11  
Changed Pin Descriptions table. ......................................................................................................................................... 12  
Added Definition of Specifications section........................................................................................................................... 13  
Changed Typical Characteristics conditions........................................................................................................................ 14  
Changed Figure 1. ............................................................................................................................................................... 14  
Changed Figure 2. ............................................................................................................................................................... 14  
Changed Figure 3. ............................................................................................................................................................... 14  
Changed Figure 4. ............................................................................................................................................................... 14  
Changed Figure 5. ............................................................................................................................................................... 14  
Changed Typical Characteristics conditions........................................................................................................................ 15  
Changed Figure 12. ............................................................................................................................................................. 15  
Changed Typical Characteristics conditions........................................................................................................................ 16  
Changed Figure 13. ............................................................................................................................................................. 16  
22  
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ADS5271  
www.ti.com ...................................................................................................................................................... SBAS313C–JUNE 2004–REVISED JANUARY 2009  
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Changed Figure 14. ............................................................................................................................................................. 16  
Deleted Figure 15 (Power Dissipation vs Temperature)...................................................................................................... 16  
Changed figure numbers in Theory of Operation to reflect addition of Typical Characteristics section.............................. 17  
Changed operates to operate in first paragraph of Overview section in Theory of Operation. ........................................... 17  
Changed 2V to 1.95V, 1V to 0.95V, and 1.5V to 1.45V in first paragraph of Overview section in Theory of Operation. ... 17  
Added second paragraph of Driving the Analog Inputs section in Theory of Operation. .................................................... 17  
Changed Figure 16. ............................................................................................................................................................. 17  
Deleted second paragraph of Driving the Analog Inputs section in Theory of Operation. .................................................. 17  
Added fourth paragraph of Driving the Analog Inputs section in Theory of Operation........................................................ 18  
Deleted fourth paragraph of Driving the Analog Inputs section in Theory of Operation and Figure 2 (Input Circuitry)....... 18  
Changed Input Over-Voltage Recovery section. ................................................................................................................. 18  
Added Figure 17. ................................................................................................................................................................. 18  
Changed third paragraph of Reference Circuit Design section in Theory of Operation. ..................................................... 19  
Changed fourth paragraph of Reference Circuit Design section in Theory of Operation.................................................... 19  
Changed Figure 18. ............................................................................................................................................................. 19  
Changed Clocking section in Theory of Operation.............................................................................................................. 19  
Changed 2.0ps to 20ps and added (±3σ) to seventh sentence of first paragraph of Clocking section in Theory of  
Operation. ............................................................................................................................................................................ 19  
•
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Changed LVDS Buffers section in Theory of operation....................................................................................................... 20  
Changed Power-Down Mode section in Theory of Operation. ............................................................................................ 21  
Added Table 2...................................................................................................................................................................... 21  
Deleted Supply Sequence section....................................................................................................................................... 21  
Added Reset section............................................................................................................................................................ 21  
Changed Layout of PCB with PowerPAD Thermally-Enhanced Packages section in Theory of Operation. ...................... 21  
Added Connecting High-Speed, Multi-Channel ADCs to XILINX FPGAs section in Theory of Operation.......................... 21  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
PACKAGING INFORMATION  
Orderable Device  
ADS5271IPFP  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
HTQFP  
HTQFP  
HTQFP  
HTQFP  
PFP  
80  
80  
80  
80  
96  
96  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
ADS5271IPFP  
ADS5271IPFP  
ADS5271IPFP  
ADS5271IPFP  
ADS5271IPFPG4  
ADS5271IPFPT  
ADS5271IPFPTG4  
ACTIVE  
ACTIVE  
ACTIVE  
PFP  
PFP  
PFP  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
250  
250  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Feb-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
ADS5271IPFPT  
HTQFP  
PFP  
80  
250  
330.0  
24.4  
15.0  
15.0  
1.5  
20.0  
24.0  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Feb-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
HTQFP PFP 80  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 45.0  
ADS5271IPFPT  
250  
Pack Materials-Page 2  
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