AFE5816 [TI]
噪声为 0.95nV/rtHz 并具有 CW 无源混频器的全集成式 16 通道超声波模拟前端;
| 型号： | AFE5816 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 噪声为 0.95nV/rtHz 并具有 CW 无源混频器的全集成式 16 通道超声波模拟前端 |
| 文件： | 总163页 (文件大小：2824K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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AFE5816
ZHCSDT7E –APRIL 2015–REVISED SEPTEMBER 2017
具有 90mW/通道功耗、1-nV/√Hz 噪声、14 位 65MSPS 或
12 位 80MSPS ADC 以及 CW 无源混频器的 AFE5816 16 通道超声波
AFE
1
1 特性
•
面向超声波应用的 16 通道 应用应用的 32 通道
AFE：
•
出色的器件间增益匹配：
±0.5dB（典型值）
–
–
输入衰减器、低噪声放大器 (LNA)、低通滤波器
(LPF)、模数转换器 (ADC) 和
连续波 (CW) 混频器
•
•
•
低谐波失真等级：–60dBc
快速且持续的过载恢复
连续波 (CW) 路径：
–
信号链针对时间增益补偿 (TGC) 和 CW 模式进
行了优化
–
–
无源混频器
低近端相位噪声：
1KHz 时为 -148dBc/Hz
–
–
–
数字时间增益补偿 (DTGC)
总增益范围：6dB 至 45dB
线性输入范围：1 VPP
–
–
–
相位分辨率：λ/16
支持 16X、8X、4X 和 1X CW 时钟
三阶和五阶谐波 12dB 抑制
•
•
具有 DTGC 功能的输入衰减器：
–
–
衰减范围为 0dB 至 8dB（步长为 0.125dB）
•
小型封装：15mm × 15mm NFBGA-289
支持匹配的阻抗：
–
50Ω 至 800Ω 的源阻抗
2 应用
具有 DTGC 功能的低噪声放大器 (LNA)：
•
•
•
•
医疗超声波成像
–
–
增益范围为 14dB 至 45dB（步长为 0.125dB）
低输入电流噪声：1.2pA/√Hz
无损检测设备
声纳成像设备
•
•
三阶线性相位低通滤波器 (LPF)：
10MHz、15MHz、20MHz 和 25MHz
具有可编程分辨率的模数转换器 (ADC)：
多通道高速数据采集
–
3 说明
–
14 位 ADC：65MSPS 时的空闲通道信噪比
(SNR)
为 75dBFS
AFE5816 是一套高度集成的模拟前端 (AFE) 解决方
案，专用于需要高性能、低功耗和小尺寸的超声波系
统。
–
12 位 ADC：80MSPS 时
的空闲通道 SNR 为 72dBFS
器件信息(1)
器件型号
AFE5816
封装
封装尺寸（标称值）
•
•
LVDS 接口，速率最高达
1GBPS
nFBGA (289)
15.00mm × 15.00mm
针对噪声和功耗进行了优化：
(1) 如需了解所有可用封装，请参阅产品说明书末尾的封装选项附
录。
–
–
–
90mW/通道，1nV/√Hz（65MSPS，TGC 模
式）
55mW/通道，1.45nV/√Hz（40MSPS，
TGC 模式）
59mW/通道（CW 模式）
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SBAS688
AFE5816
ZHCSDT7E –APRIL 2015–REVISED SEPTEMBER 2017
www.ti.com.cn
简化框图
SPI OUT
SPI IN
SPI Logic
ATTEN
INP
3rd-Order LPF with
10 MHz, 15 MHz,
20 MHz, and 25
MHz
Digital
Processing
(Optional)
LNA
14 dB to
45 dB
12-, 14-Bit
ADC
LVDS
INM
1 of 16 Channels
16 x 16 Cross-
Point Switch
CW Mixer
Reference
TGC Control
Signals
DTGC Engine
16-Phase
Generator
CW Clocks
CW Current Outputs
2
版权 © 2015–2017, Texas Instruments Incorporated
AFE5816
www.ti.com.cn
ZHCSDT7E –APRIL 2015–REVISED SEPTEMBER 2017
目录
9.3 Feature Description................................................. 31
9.4 Device Functional Modes........................................ 74
9.5 Programming........................................................... 79
10 Application and Implementation........................ 81
10.1 Application Information.......................................... 81
10.2 Typical Application ................................................ 81
10.3 Do's and Don'ts..................................................... 85
10.4 Initialization Set Up ............................................... 85
11 Power Supply Recommendations ..................... 86
11.1 Power Sequencing and Initialization..................... 86
12 Layout................................................................... 87
12.1 Layout Guidelines ................................................. 87
12.2 Layout Example .................................................... 88
13 Register Maps...................................................... 95
13.1 Serial Register Map .............................................. 95
14 器件和文档支持 ................................................... 159
14.1 文档支持 ............................................................. 159
14.2 社区资源.............................................................. 159
14.3 商标..................................................................... 159
14.4 静电放电警告....................................................... 159
14.5 Glossary.............................................................. 159
15 机械、封装和可订购信息..................................... 159
1
2
3
4
5
6
7
8
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 3
说明 （续）.............................................................. 4
Device Family Comparison Table ........................ 6
Pin Configuration and Functions......................... 7
Specifications....................................................... 11
8.1 Absolute Maximum Ratings .................................... 11
8.2 ESD Ratings............................................................ 11
8.3 Recommended Operating Conditions..................... 11
8.4 Thermal Information................................................ 13
8.5 Electrical Characteristics: TGC Mode..................... 13
8.6 Electrical Characteristics: CW Mode....................... 16
8.7 Digital Characteristics ............................................. 17
8.8 Output Interface Timing Requirements................... 18
8.9 Serial Interface Timing Requirements..................... 19
8.10 Typical Characteristics: TGC Mode ...................... 20
8.11 Typical Characteristics: CW Mode........................ 28
Detailed Description ............................................ 29
9.1 Overview ................................................................. 29
9.2 Functional Block Diagram ....................................... 30
9
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision D (November 2015) to Revision E
Page
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Deleted Output and Gain Code Step Response vs Time figure........................................................................................... 25
Deleted condition statement from Output and Gain Code Step Response vs Time figure.................................................. 25
Changed Device Power vs Gain Code figure....................................................................................................................... 26
Deleted Device Power vs Gain Code (TGC_CONS register bit = 1) figure ......................................................................... 26
Changed VCA Power vs Gain Code figure .......................................................................................................................... 26
Changed AVDD_1P9 Supply Current vs Gain Code figure.................................................................................................. 27
Deleted contour curves from Typical Characteristics: TGC Mode section........................................................................... 27
Changed Input Signal Support in TGC Mode section .......................................................................................................... 33
Added footnote 2 to Profile Description for Up, Down Ramp Mode table ........................................................................... 40
Changed TGC_SLOPE and TGC_UP_DN clock traces in External Non-Uniform Mode figure........................................... 41
Added footnote 2 to Profile Description for External Non-Uniform Mode table ................................................................... 42
Changed Figure 72 .............................................................................................................................................................. 46
Added footnote 2 to Internal Non-Uniform Mode Profile Definition table ............................................................................ 48
Added Latency Between a Transition in TGC_SLOPE and the Resulting Change in Gain table and associated
paragraph to Timing Specifications section.......................................................................................................................... 48
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•
•
•
•
•
Changed second sentence in sixth paragraph of Continuous-Wave (CW) Beamformer section ....................................... 52
Changed Figure 77 .............................................................................................................................................................. 53
Changed last paragraph of 16 × ƒcw Mode section ............................................................................................................. 54
Changed Clock Configurations figure .................................................................................................................................. 57
Changed Number of samples from "2045" to "2047" in Table 15 ........................................................................................ 68
Changed HPF_ROUND_ENABLE register bit (register 21, bit 5) to HPF_ROUND_EN_CH1-8 and
HPF_ROUND_EN_CH9-16 bits in last paragraph of Digital HPF section ........................................................................... 70
版权 © 2015–2017, Texas Instruments Incorporated
3
AFE5816
ZHCSDT7E –APRIL 2015–REVISED SEPTEMBER 2017
www.ti.com.cn
修订历史记录 (接下页)
•
•
•
•
•
•
已添加 last paragraph to Partial Power-Up and Power-Down Mode section ...................................................................... 77
已添加 PLL initialization method (step 4) to Initialization Set Up section............................................................................. 85
已添加 PLL Initialization section ........................................................................................................................................... 87
Changed PIN_PAT_LVDS to PAT_LVDS15[2:0] in register 59 of ADC Register Map table .............................................. 98
Added registers 65 and 66 to ADC Register Map table ....................................................................................................... 98
Changed 001 row description from half frame 0, half frame 1 to half frame 1, half frame 0 in Pattern Mode Bit
Description table ................................................................................................................................................................ 100
•
•
•
•
•
•
Changed HPF_ROUND_EN to HPF_ROUND_EN_CH1-8 in register 21 ......................................................................... 109
Changed bit 5 from 0 to HPF_ROUND_EN_CH9-16 in register 45 .................................................................................. 123
Changed bits 7-5 from PIN_PAT_LVDS to PAT_LVDS15[2:0] in register 59 ................................................................... 131
Added register descriptions for registers 65 and 66 .......................................................................................................... 133
Deleted register 202 from VCA Register Map table .......................................................................................................... 135
已删除 从相关文档 部分删除了 WEBENCH ....................................................................................................................... 159
Changes from Revision C (August 2015) to Revision D
Page
•
•
将完整文档发布至 Web：添加了器件比较表、引脚配置和功能 部分、规范 部分、详细 说明 部分、应用和实施 部
分、电源相关建议 部分、布局 部分以及寄存器映射 部分 ...................................................................................................... 1
已更改特性部分：已在第一个 特性 要点中添加第二个分项，已更改 ADC 和针对噪声和功率进行了优化 特性 要点，
并已添加第一个分项和最后一个分项至 CW 特性 要点部分） ................................................................................................ 1
•
•
•
已更改器件信息表和简化框图 ................................................................................................................................................. 1
已更改说明部分....................................................................................................................................................................... 5
添加了社区资源部分 ........................................................................................................................................................... 159
Changes from Revision B (June 2015) to Revision C
Page
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•
从文档中删除了 AFE58JD16 .................................................................................................................................................. 1
Changed Functional Block Diagram: removed references to AFE58JD16 ......................................................................... 30
Changes from Revision A (April 2015) to Revision B
Page
•
从“产品预览”改为“量产数据” ................................................................................................................................................... 1
5 说明 （续）
AFE5816 是一款集成模拟前端 (AFE)，针对医疗超声波应用进行了优化。AFE5816 是一款多芯片模块 (MCM) 器
件，包含两个芯片：VCA 和 ADC_CONV。每个芯片均有 16 条通道。
VCA 芯片中的每条通道均可配置为两种模式：时间增益补偿 (TGC) 模式和连续波 (CW) 模式。在 TGC 模式下，每
条通道包含一个输入衰减器 (ATTEN)、一个带有可变增益的低噪声放大器 (LNA) 以及一个三阶低通滤波器 (LPF)。
衰减器支持的衰减范围为 0dB 至 8dB，LNA 支持的增益范围为 14dB 至 45dB。LPF 的截止频率可配置为
10MHz、15MHz、20MHz 或 25 MHz，以便支持频率不同的超声波 应用 。在 CW 模式下，每条通道包含一个增
益固定为 18dB 的 LNA 以及一个具有 16 种可选相位延迟的低功耗无源混频器。通过对每个模拟输入信号施加不同
的相位延迟可执行片上波束赋形操作。CW 混频器中的谐波滤波器通过抑制三阶和五阶谐波来增强 CW 多普勒测量
的灵敏度。CW 模式支持三种时钟模式：16 倍频、8 倍频和 4 倍频。
4
Copyright © 2015–2017, Texas Instruments Incorporated
AFE5816
www.ti.com.cn
ZHCSDT7E –APRIL 2015–REVISED SEPTEMBER 2017
ADC_CONV 芯片的每条通道都具有一个高性能模数转换器 (ADC)，该转换器的分辨率可编程为 14 位或 12 位。
ADC 在 14 位 和 12 位模式下分别可实现 75dBFS 和 72dBFS 的信噪比 (SNR)。该 ADC 在低通道增益时仍具有出
色的 SNR。该器件的最高运行速度为 65MSPS 和 80MSPS，分别提供 14 位和 12 位输出。ADC 设计为根据采样
率调整其功耗。ADC 的输出接口为低压差分信令 (LVDS) 接口，可轻松与低成本现场可编程门阵列 (FPGA) 连接。
AFE5816 还允许选择多种功率和噪声组合，从而优化系统性能。因此，对于电池寿命要求严格的系统而言，这些
器件是一套非常适合的超声波 AFE 解决方案。AFE5816 采用 15mm × 15mm NFBGA-289 封装（ZAV 封装，S-
PBGA-N289），额定工作温度范围为 –40°C 至 +85°C。此器件还与 AFE5818 系列器件引脚兼容。的最后一段
Copyright © 2015–2017, Texas Instruments Incorporated
5
AFE5816
ZHCSDT7E –APRIL 2015–REVISED SEPTEMBER 2017
www.ti.com.cn
6 Device Family Comparison Table
DEVICE
DESCRIPTION
PACKAGE
BODY SIZE (NOM)
16-channel, ultrasound, analog front-end (AFE) with 124-mW/channel, 0.75-nV/√Hz
noise, 14-bit, 65-MSPS or 12-bit, 80-MSPS ADC and passive CW mixer
AFE5818
AFE5812
AFE5809
AFE5808A
AFE5807
NFBGA (289)
15.00 mm × 15.00 mm
Fully integrated, 8-channel ultrasound AFE with passive CW mixer, and digital I/Q
demodulator, 0.75 nV/√Hz, 14 and 12 bits, 65 MSPS, 180 mW/ch
NFBGA (135)
NFBGA (135)
NFBGA (135)
NFBGA (135)
15.00 mm × 9.00 mm
15.00 mm × 9.00 mm
15.00 mm × 9.00 mm
15.00 mm × 9.00 mm
8-channel ultrasound AFE with passive CW mixer, and digital I/Q demodulator,
0.75 nV/√Hz, 14 and 12 bits, 65 MSPS, 158 mW/ch
8-channel ultrasound AFE with passive CW mixer, 0.75 nV/√Hz, 14 and 12 bits,
65 MSPS, 158 mW/ch
8-channel ultrasound AFE with passive CW mixer, 1.05 nV/√Hz, 12 bits, 80 MSPS,
117 mW/ch
AFE5803
AFE5805
AFE5804
8-channel ultrasound AFE, 0.75 nV/√Hz, 14 and 12 bits, 65 MSPS, 158 mW/ch
8-channel ultrasound AFE, 0.85 nV/√Hz, 12 bits, 50 MSPS, 122 mW/ch
8-channel ultrasound AFE, 1.23 nV/√Hz, 12 bits, 50 MSPS, 101 mW/ch
NFBGA (135)
NFBGA (135)
NFBGA (135)
15.00 mm × 9.00 mm
15.00 mm × 9.00 mm
15.00 mm × 9.00 mm
8-channel variable-gain amplifier (VGA) with octal high-speed ADC, 5.5 nV/√Hz,
12 bits, 65 MSPS, 65 mW/ch
AFE5801
AFE5851
VCA5807
VQFN (64)
VQFN (64)
HTQFP (80)
9.00 mm × 9.00 mm
9.00 mm × 9.00 mm
14.00 mm × 14.00 mm
16-channel VGA with high-speed ADC, 5.5 nV/√Hz, 12 bits, 32.5 MSPS, 39 mW/ch
8-channel voltage-controlled amplifier for ultrasound with passive CW mixer,
0.75 nV/√Hz, 99 mW/ch
VCA8500
ADS5294
ADS5292
ADS5295
8-channel, ultralow-power VGA with low-noise pre-amp, 0.8 nV/√Hz, 65 mW/ch
Octal-channel, 14-bit, 80-MSPS ADC, 75-dBFS SNR, 77 mW/ch
Octal-channel, 12-bit, 80-MSPS ADC, 70-dBFS SNR, 66 mW/ch
Octal-channel, 12-bit, 100-MSPS ADC, 70.6-dBFS SNR, 80 mW/ch
VQFN (64)
HTQFP (80)
HTQFP (80)
HTQFP (80)
9.00 mm × 9.00 mm
14.00 mm × 14.00 mm
14.00 mm × 14.00 mm
14.00 mm × 14.00 mm
10-bit, 200-MSPS, 4-channel, 61-dBFS SNR, 150-mW/ch and 12-bit, 80-MSPS,
8-channel, 70-dBFS SNR, 65-mW/ch ADC
ADS5296A
VQFN (64)
9.00 mm × 9.00 mm
6
Copyright © 2015–2017, Texas Instruments Incorporated
AFE5816
www.ti.com.cn
ZHCSDT7E –APRIL 2015–REVISED SEPTEMBER 2017
7 Pin Configuration and Functions
ZAV Package
289-Bumps NFBGA
Top View
4
5
6
7
8
10
11
12
13
14
15
16
17
1
2
3
9
A
B
INP16
INP15
INP14
INP13
NC
INP8
INP7
INP6
INP12
INP11
INP10
INP9
INP5
INP4
INP3
INP2
INP1
NC
INM16
NC
NC
INM15
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
INM5
NC
NC
NC
NC
NC
INM14
INM13
INM8
INM7
INM6
C
D
E
F
INM12
INM11
INM10
INM9
INM4
INM3
AVSS
AVSS
AVSS
AVSS
INM2
AVSS
INM1
AVSS
CW_IP_
OUTM
CW_IP_
OUTP
AVDD_
3P15
AVDD_
3P15
AVDD_
3P15
AVDD_
3P15
BIAS_
2P5
AVDD_
3P15
AVDD_
3P15
AVDD_
3P15
SRC_
BIAS
AVDD_
1P9
AVDD_
1P9
AVDD_
1P9
AVDD_
1P9
AVDD_
1P9
AVDD_
1P9
CLKP_
16X
CLKM_
16X
NC
NC
NC
NC
NC
NC
AVSS
AVSS
AVSS
AVSS
AVSS
AVSS
AVSS
DVSS
DVSS
DVSS
NC
AVSS
AVSS
NC
AVSS
AVSS
AVSS
AVSS
AVSS
AVSS
AVSS
DVSS
DVSS
DVSS
FCLKM
DOUTP9
AVDD_
1P9
AVDD_
1P9
LNA_
INCM
AVDD_
1P9
AVDD_
1P9
AVDD_
1P9
AVDD_
1P9
NC
NC
AVSS
AVSS
CW_QP_
OUTM
CW_QP_
OUTP
AVDD_
1P9
AVDD_
1P9
BAND_
GAP
AVDD_
1P9
AVDD_
1P9
CLKM_
1X
CLKP_
1X
NC
NC
AVSS
NC
NC
NC
NC
NC
NC
NC
NC
NC
G
H
J
TGC_
SLOPE
AVDD_
1P9
AVDD_
1P9
TGC_
PROF<2>
AVDD_
1P9
AVDD_
1P9
TR_
EN<3>
AVSS
AVSS
AVSS
AVSS
AVSS
AVSS
SDOUT
NC
SCLK
SEN
ADC_
CLKP
ADC_
CLKM
TGC_
UP_DN
AVDD_
1P9
AVDD_
1P9
TGC_
PROF<1>
AVDD_
1P9
AVDD_
1P9
TR_
EN<4>
TR_
EN<2>
AVSS
AVDD_
1P9
AVDD_
1P9
AVDD_
1P9
AVDD_
1P9
TR_
EN<1>
AVSS
NC
AVSS
NC
NC
NC
AVSS
NC
NC
K
DVDD_
1P2
AVDD_
1P8
AVDD_
1P8
AVDD_
1P8
AVDD_
1P8
AVDD_
1P8
AVDD_
1P8
AVSS
NC
SDIN
RESET
L
M
N
P
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
PDN_
FAST
NC
NC
DVSS
DVSS
DVSS
DVSS
DVSS
DVSS
TX_TRIG
PDN_GBL
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
DVDD_
1P2
NC
DVSS
NC
NC
NC
NC
NC
DVDD_
1P2
DVDD_
1P2
DVDD_
1P8
DVDD_
1P8
DVDD_
1P8
DVDD_
1P8
DVDD_
1P8
DVDD_
1P8
DVDD_
1P8
DVDD_
1P8
DVDD_
1P2
DVDD_
1P2
NC
DVSS
NC
DOUTP16 DOUTP15 DOUTP14
DOUTM16 DOUTM15 DOUTM14
FCLKP
DOUTP8
DOUTM8
DOUTM6
DOUTP7
DOUTM7
DOUTP6
DOUTP5
DOUTM5
NC
DOUTM11 DOUTP11
NC
DOUTP3
DOUTM3
NC
DOUTP2
DOUTM2
NC
DOUTP1
DOUTM1
NC
R
T
NC
DCLKP
DCLKM
DOUTP13 DOUTP12 DOUTP10
DOUTP4
DOUTM4
NC
NC
NC
NC
DOUTM13 DOUTM12 DOUTM10 DOUTM9
U
Copyright © 2015–2017, Texas Instruments Incorporated
7
AFE5816
ZHCSDT7E –APRIL 2015–REVISED SEPTEMBER 2017
www.ti.com.cn
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
Differential clock input pin used for ADC conversion, negative. A single-ended clock is also
supported. Connect ADC_CLKM to dc ground when using a single-ended clock.
ADC_CLKM
J2
I
Differential clock input pin used for ADC conversion, positive. A single-ended clock is also
supported. Connect the ADC clock to the ADC_CLKP pin when using a single-ended clock.
ADC_CLKP
AVDD_1P8
J1
I
L5-L7, L11-L13
P
Analog supply pins, 1.8 V (ADC_CONV die)
Analog supply pins, 1.9 V (VCA die)(1)
Analog supply pins, 3.15 V (VCA die)
Analog ground pins
E6, E7, E11-E14, F6, F7,
F11-F14, G6, G7, G11, G12,
H6, H7, H11, H12, J6, J7,
J11, J12, K6, K7, K11, K12
AVDD_1P9
AVDD_3P15
AVSS
P
P
G
D6-D12
D15-D17, E8-E10, E15, F8-
F10, F15-F17, G8-G10, G15,
H1-H3, H8-H10, J3, J8-J10,
K1-K3, K8-K10, L8-L10
BAND_GAP
BIAS_2P5
G5
D5
O
O
Bypass to analog ground with a 1-µF capacitor.
Bypass to analog ground with a 1-µF capacitor.
Differential clock input for the 1X CW clock, negative. A single-ended clock is also supported.
In single-ended clock mode, the CLKM_1X pin is internally pulled to ground.
CLKM_1X
CLKP_1X
CLKM_16X
G16
G17
E17
I
I
I
In 1X clock mode, this pin is the negative quadrature-phase clock input for the CW mixer.(2)
Differential clock input for the 1X CW clock, positive. A single-ended clock is also supported.
Connect the 1X CW clock to the CLKP_1X pin when using a single-ended clock.
In 1X clock mode, this pin is the positive quadrature-phase clock input for the CW mixer.(2)
Differential clock input for the 16X, 8X, and 4X CW clocks, negative.
A single-ended clock is also supported.
In single-ended clock mode, the CLKM_16X pin is internally pulled to ground.(2)
Differential clock input for the 16X, 8X, and 4X CW clocks, positive.
A single-ended clock is also supported.
Connect the 16X CW clock to the CLKP_16X pin when using a single-ended clock.
In 1X CW clock mode, this pin is the positive in-phase clock input for the CW mixer.(2)
CLKP_16X
E16
I
CW_IP_OUTM
CW_IP_OUTP
CW_QP_OUTM
CW_QP_OUTP
DCLKM
D3
D4
O
O
O
O
In-phase CW differential summed current output, negative.(2)
In-phase CW differential summed current output, positive.(2)
Quadrature-phase CW differential summed current output, negative.(2)
Quadrature-phase CW differential summed current output, positive.(2)
G3
G4
U9
Low-voltage differential signaling (LVDS) serialized data clock outputs
(receiver bit alignment)
O
O
O
O
O
O
O
O
O
O
DCLKP
T9
DOUTM1
DOUTP1
T16
R16
T15
R15
T14
R14
U13
T13
U12
T12
R11
R12
U11
T11
U10
T10
U8
LVDS serialized differential data outputs for channel 1
LVDS serialized differential data outputs for channel 2
LVDS serialized differential data outputs for channel 3
LVDS serialized differential data outputs for channel 4
LVDS serialized differential data outputs for channel 5
LVDS serialized differential data outputs for channel 6
LVDS serialized differential data outputs for channel 7
LVDS serialized differential data outputs for channel 8
LVDS serialized differential data outputs for channel 9
DOUTM2
DOUTP2
DOUTM3
DOUTP3
DOUTM4
DOUTP4
DOUTM5
DOUTP5
DOUTM6
DOUTP6
DOUTM7
DOUTP7
DOUTM8
DOUTP8
DOUTM9
DOUTP9
T8
(1) In low-power mode, the typical power supply for AVDD_1P9 is 1.8 V.
(2) When CW mode is not used, this pin can be floated.
8
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Pin Functions (continued)
PIN
NAME
DOUTM10
DOUTP10
DOUTM11
DOUTP11
DOUTM12
DOUTP12
DOUTM13
DOUTP13
DOUTM14
DOUTP14
DOUTM15
DOUTP15
DOUTM16
DOUTP16
NO.
U7
T7
R6
R7
U6
T6
U5
T5
T4
R4
T3
R3
T2
R2
I/O
DESCRIPTION
O
LVDS serialized differential data outputs for channel 10
LVDS serialized differential data outputs for channel 11
LVDS serialized differential data outputs for channel 12
LVDS serialized differential data outputs for channel 13
LVDS serialized differential data outputs for channel 14
LVDS serialized differential data outputs for channel 15
O
O
O
O
O
O
LVDS serialized differential data outputs for channel 16
1.2-V digital supply pins for the ADC digital block
L3, M4-M6, M12-M14, N2-N6,
N12-N16, P2, P3, P15, P16
DVDD_1P2
DVDD_1P8
DVSS
P
P
G
1.8-V digital supply pins for the ADC digital, digital I/Os, phase-locked loop (PLL), and LVDS
interface blocks
P4-P7, P11-P14
M3, M7-M11, N7-N11, P8-
P10
Digital ground (ADC_CONV die).
FCLKM
FCLKP
INM1
INM2
INM3
INM4
INM5
INM6
INM7
INM8
INM9
INM10
INM11
INM12
INM13
INM14
INM15
INM16
INP1
R8
R10
C17
C16
C15
C14
C13
C12
C11
C10
C8
O
LVDS serialized differential frame clock outputs (receiver word alignment).
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
Complementary analog input for channel 1.(3)
Complementary analog input for channel 2.(3)
Complementary analog input for channel 3.(3)
Complementary analog input for channel 4.(3)
Complementary analog input for channel 5.(3)
Complementary analog input for channel 6.(3)
Complementary analog input for channel 7.(3)
Complementary analog input for channel 8.(3)
Complementary analog input for channel 9.(3)
Complementary analog input for channel 10.(3)
Complementary analog input for channel 11.(3)
Complementary analog input for channel 12.(3)
Complementary analog input for channel 13.(3)
Complementary analog input for channel 14.(3)
Complementary analog input for channel 15.(3)
Complementary analog input for channel 16.(3)
C7
C6
C5
C4
C3
C2
C1
A17
A16
A15
A14
A13
A12
A11
A10
A8
Analog input for channel 1. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 2. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 3. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 4. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 5. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 6. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 7. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 8. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 9. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 10. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 11. AC-couple to device input with a 10-nF capacitor.
INP2
INP3
INP4
INP5
INP6
INP7
INP8
INP9
INP10
INP11
A7
A6
(3) The LNA high-pass filter (HPF) response of the channel depends on the capacitor connected at the INMx pin. By default, leave this pin
floating. For very low-frequency applications, connect a capacitor > 1 µF.
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Pin Functions (continued)
PIN
NAME
NO.
A5
A4
A3
A2
A1
F5
I/O
DESCRIPTION
INP12
INP13
INP14
INP15
INP16
I
I
Analog input for channel 12. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 13. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 14. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 15. AC-couple to device input with a 10-nF capacitor.
Analog input for channel 16. AC-couple to device input with a 10-nF capacitor.
Bypass to ground with a 1-μF capacitor.
I
I
I
LNA_INCM
O
A9, B1-B17, C9, D1, D2, D13,
E1-E5, F1-F4, G1, G2, G13,
G14, H13, H14, H17, J13,
J14, K4, K5, K13, K14, K16,
L1, L2, L4, L14, L15, M1, M2,
R5, R9, R13, N1, N17, P1,
R1, R17, P17, T1, T17, U1-
U4, U14-U17
NC
—
Unused pins; do not connect
Partial power-down control pin for the entire device with an internal 16-kΩ pulldown resistor;
PDN_FAST
PDN_GBL
M17
M16
I
I
active high.(4)
Global (complete) power-down control pin for the entire device with an internal 16-kΩ
pulldown resistor; active high.(4)
RESET
SCLK
L17
J17
L16
H16
K17
D14
I
I
Hardware reset pin with an internal 16-kΩ pull-down resistor; active high.(4)
Serial programming interface clock pin with an internal 16-kΩ pulldown resistor.(4)
Serial programming interface data pin with an internal 16-kΩ pulldown resistor.(4)
Serial programming interface readout pin. This pin is in tri-state by default.(4)
Serial programming interface enable pin, active low. This pin has a 16-kΩ pullup resistor.(4)
Bypass to ground with a 1-μF capacitor.
SDIN
I
SDOUT
SEN
O
I
SRC_BIAS
O
Digital TGC profile 1 select pin.
TGC_PROF<1>
TGC_PROF<2>
J5
I
I
This pin has an internal 150-kΩ pulldown resistor; active high.(4)
Digital TGC profile 2 select pin.
H5
This pin has an internal 150-kΩ pulldown resistor; active high.(4)
TGC_SLOPE
TGC_UP_DN
H4
J4
I
I
Digital TGC control pin. This pin has an internal 150-kΩ pulldown resistor.(4)
Digital TGC control pin. This pin has an internal 150-kΩ pulldown resistor.(4)
TR enable pin 1; disconnects the LNA HPF from the input pins of channels 1 to 4.(4)
This pin has an internal 150-kΩ pullup resistor.
TR enable pin 2; disconnects the LNA HPF from the input pins of channels 5 to 8.(4)
This pin has an internal 150-kΩ pullup resistor.
TR enable pin 3; disconnects the LNA HPF from the input pins of channels 9 to 12.(4)
This pin has an internal 150-kΩ pullup resistor.
TR enable pin 4; disconnects the LNA HPF from the input pins of channels 13 to 16.(4)
This pin has an internal 150-kΩ pullup resistor.
TR_EN<1>
TR_EN<2>
TR_EN<3>
TR_EN<4>
TX_TRIG
K15
J16
I
I
I
I
I
H15
J15
This pin synchronizes test patterns across devices.
This pin has a 20-kΩ pulldown resistor.(4)
M15
(4) A 1.8-V logic level is required.
Table 1. Pin Name to Signal Name Map
SIGNAL NUMBER
PIN NAME
ADC_CLKP – ADC_CLKM
CLKP_1X – CLKM_1X
SIGNAL NAME
ADC_CLK
CW_CLK1X
CW_CLK_NX
CW_IP_OUT
CW_QP_OUT
DOUT
1
2
3
4
5
6
7
8
9
CLKP_16X – CLKM_16X
CW_IP_OUTP – CW_IP_OUTM
CW_QP_OUTP – CW_QP_OUTM
DOUTPx – DOUTMx
FCLKP – FCLKM
FCLK
DCLKP – DCLKM
DCLK
CMLx_OUTP – CMLx_OUTM
CMLx_OUT
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8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range, unless otherwise noted(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
MAX
2.2
UNIT
AVDD_1P8
AVDD_1P9
2.2
Supply voltage range
AVDD_3P15
DVDD_1P2
DVDD_1P8
3.9
V
1.35
2.2
Minimum [2.2,
(AVDD_1P9 + 0.3)]
Voltage at analog inputs
Voltage at digital inputs
–0.3
–0.3
V
V
Minimum [2.2, (AVDD_1P9 +
0.3), (DVDD_1P8 + 0.3)]
Maximum junction temperature (TJ),
any condition
105
150
Temperature
°C
Storage, Tstg
–55
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
VALUE
±1000
±250
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
over operating free-air temperature range, unless otherwise noted
PARAMETER
MIN TYP MAX
UNIT
SUPPLIES
VA_1P8
AVDD_1P8 voltage
AVDD_1P9 voltage
1.7
1.8
1.8
1.9
1.9
2.0
2.0
3.3
V
V
Low-noise mode, medium-power mode
Low-power mode
VA_1P9
1.75
3
1.8
VA_3P15
VD_1P2
VD_1P8
AVDD_3P15 voltage
DVDD_1P2 voltage
DVDD_1P8 voltage
3.15
V
V
V
1.15
1.7
1.2 1.25
1.8
1.9
85
TEMPERATURE
TA
Ambient temperature
–40
°C
BIAS VOLTAGES
ADC_CLKP, ADC_CLKM in differential mode
0.7
1.5
0.9
1
CLKP_1X, CLKM_1X, CLKP_16X, CLKM_16X in differential mode
Common-mode voltage(1)
V
CW_IP_OUTP, CW_IP_OUTM, CW_QP_OUTP, CW_QP_OUTM
(INM1, INP1), (INM2, INP2)…(INM16, INP16)
BAND_GAP
BIAS_2P5
LNA_INCM
SRC_BIAS
1.2
2.5
1
Bias voltage(1)
V
0.5
(1) Internally set by the device.
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Recommended Operating Conditions (continued)
over operating free-air temperature range, unless otherwise noted
PARAMETER
MIN TYP MAX
UNIT
ADC CLOCK INPUT: ADC_CLK
14-bit ADC resolution
5
5
65
80
fCLKIN
ADC clock frequency
MHz
12-bit ADC resolution
Sine-wave, ac-coupled
0.7
VDEADC
Differential clock amplitude LVPECL, ac-coupled
LVDS, ac-coupled
1.6
0.7
VPP
Single-ended clock
amplitude
VSEADC
DADC
LVCMOS on ADC_CLKP with ADC_CLKM grounded
1.8
V
ADC_CLK duty cycle
40% 50% 60%
CW CLOCK INPUT: CW_CLK1X, CW_CLK_NX
CW_CLK1X across CW clock modes in relation to CW_CLK1X;
8
MHz
see the CW_CLK_MODE register bits in register 192
16X mode
16X
8X
CWCLK
CW clock frequency
CW_CLK_NX across CW clock modes;
CW_
CLK1X
see the CW_CLK_MODE register bits in 8X mode
register 192
4X mode
4X
VDECW
VSECW
DCW
Differential clock amplitude CW_CLK1X, CW_CLK_NX. LVDS, ac-coupled
0.7
VPP
V
Single-ended clock
amplitude
LVCMOS on CLKP_1X, CLKP_16X with CLKM_1X, CLKM_16X
grounded or floating
3.15
CLK duty cycle
CW_CLK1X, CW_CLK_NX
40% 50% 60%
DIGITAL OUTPUT (LVDS)
RL Differential load resistance
100
Ω
12
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8.4 Thermal Information
AFE5816
THERMAL METRIC(1)
ZAV (NFBGA)
289 PINS
26.1
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
5.6
11.7
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.2
ψJB
11.0
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
8.5 Electrical Characteristics: TGC Mode
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, and
DVDD_1P2 = 1.2 V, DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is
applied with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK.
Device settings: gain code = 319 (total gain = 45 dB), 14-bit ADC resolution, LVDS interface to capture ADC data, and
output amplitude VOUT = –1 dBFS. Minimum and maximum values are specified across the full temperature range.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
GENERAL
At INP_SOURCE node; see the Functional Block Diagram section
At INPx node; see the Functional Block Diagram section
1
0.4
35
VMAX
Maximum linear input voltage
VPP
pF
CINP
Input capacitance
Gain code(1)
GCODE
Programs the total gain
0
319
(6 + 0.125 ×
GCODE
Low-noise mode and medium-power mode
)
GTOT
Total gain
dB
(12 + 0.125 ×
GCODE
Low-power mode
)
GRANGE
GSLOPE
TTGC
Gain range
39
0.125
10
dB
dB/GCODE
µs
Gain slope
TGC response time
GCODE changed from 64 to 319
Low-noise mode
1
RS = 0 Ω, calculated in band of 4-MHz
to 6-MHz frequency
Low-power mode
Across low-noise, medium-power, and low-power mode
Low-noise mode
VN,IRN
Input voltage noise
Medium-power mode
1.3
1.45
1.2
3.6
4.5
5.0
1.2
1.5
1.6
nV/√Hz
pA/√Hz
dB
IN,IRN
Input-referred current noise
RS = 50 Ω
Medium-power mode
Low-power mode
Low-noise mode
NF
Noise figure(2)
RS = 400 Ω
Medium-power mode
Low-power mode
dB
(1) The gain code range from 0 to 63 controls the input attenuation and the gain code range from 64 to 319 controls the LNA gain.
(2) NF is measured as the SNR at the output of the device relative to the SNR at the input resulting from ths noise of source resistance RS.
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Electrical Characteristics: TGC Mode (continued)
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, and
DVDD_1P2 = 1.2 V, DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is
applied with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK.
Device settings: gain code = 319 (total gain = 45 dB), 14-bit ADC resolution, LVDS interface to capture ADC data, and
output amplitude VOUT = –1 dBFS. Minimum and maximum values are specified across the full temperature range.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
GENERAL (continued)
RS = 330 Ω
–20
–26
–17
–14
–13
Without a signal, calculated in a 1-MHz
to 10-MHz bandwidth
RS = 100 Ω
Total gain = 45 dB
Total gain = 26 dB
Total gain = 45 dB
With a signal, calculated in a 1-MHz to
10-MHz bandwidth
Channel-to-channel noise
correlation factor(3)
KCORR
dB
With a signal, calculated in a 1-MHz
bandwidth around a 5-MHz input signal
frequency
Total gain = 26 dB
–10
Total gain = 14 dB
Total gain = 45 dB
65
55
68
58
SNR calculated in 750 kHz to Nyquist
bandwidth
SNR
Signal-to-noise ratio
Narrow-band SNR
dBFS
dBFS
SNR calculated in 2-MHz bandwidth
around input signal frequency
SNRNB
Total gain = 30 dB
72.5
76
10
15
Low-noise and medium-
power mode
20
–3-dB cutoff frequency across
LPF_PROG register settings;
see register 199
25
LPF
3rd-order, low-pass filter
LPF bandwidth variation
MHz
5
7.5
10
Low-power mode
12.5
±5%
ΔLPF
ΔGr
Channel-to-channel group
delay matching
2-MHz to 15-MHz input signal frequency
15-MHz signal
2
ns
Channel-to-channel phase
matching
Δφ
11
Degrees
GCODE < 64
GCODE > 64
GCODE < 64
GCODE > 64
±0.5
±0.5
±0.5
±0.5
–65
–55
–60
–60
–58
–54
Device-to-device, average across
channels
–1
–1
1
1
GMATCH
Gain matching
dB
Channel-to-channel, same device
Output amplitude = –1 dBFS, gain = 45 dB
Output amplitude = –1 dBFS, gain = 6 dB
Output amplitude = –1 dBFS, gain = 45 dB
Output amplitude = –1 dBFS, gain = 6 dB
Output amplitude = –1 dBFS, gain = 45 dB
Output amplitude = –1 dBFS, gain = 6 dB
Second-order harmonic
distortion
HD2
HD3
THD
dBc
dBc
dBc
Third-order harmonic
distortion
Total harmonic distortion
Third-order intermodulation
distortion
Input frequency 1 = 5 MHz at –1 dBFS,
input frequency 2 = 5.01 MHz at –21 dBFS
IMD3
–75
–55
dBc
dBc
Signal applied to a single channel. Crosstalk measured on neighboring
channel.
XTALK
Fundamental crosstalk
PN1kHz
VORO
Phase noise
Output offset
Calculated at 1-kHz offset from 5-MHz input signal frequency
–129
±600
dBc/Hz
LSB
LNA gain range in TGC
mode
GLNA
14 to 45
dB
(3) The noise-correlation factor is defined as 10 × log10[Nc / (Nc + Nu)], where Nc is the correlated noise power in a single channel and Nu
is the uncorrelated noise power in a single channel. The noise-correlation factor measurement is described by the equation:
Nc
N_16Ch
1
=
-
(Nu +Nc) (N_1Chì240) 15
where N_16CH is the noise power of the summed 16 channels and N_1CH is the noise power of one channel.
14
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Electrical Characteristics: TGC Mode (continued)
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, and
DVDD_1P2 = 1.2 V, DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is
applied with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK.
Device settings: gain code = 319 (total gain = 45 dB), 14-bit ADC resolution, LVDS interface to capture ADC data, and
output amplitude VOUT = –1 dBFS. Minimum and maximum values are specified across the full temperature range.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
GENERAL (continued)
75
150
300
600
–1-dB cutoff frequency across LNA_HPF_PROG register settings;
see register 199
HPFTGC
LNA High-pass filter
kHz
ADC SPECIFICATIONS
14-bit resolution
12-bit resolution
Without a signal
5
5
65
80
fS
Sample rate
MSPS
75
72.5
72
14-bit resolution
With a –1-dBFS signal
amplitude
SNR
Signal-to-noise ratio
dBFS
VPP
Without a signal
12-bit resolution
With a –1-dBFS signal
69.5
2
amplitude
VMAX,ADC
ADC input full-scale range
POWER DISSIPATION
TGC low-noise mode, 500-mVPP input signal up to 1% duty cycle
applied to 16 channels
94
72
Power dissipation per
channel: 12-bit ADC
resolution and 80-MSPS
ADC clock
TGC medium-power mode, 500-mVPP input signal up to 1% duty cycle
applied to 16 channels
PTGC/Ch
mW/Ch
TGC low-power mode, 500-mVPP input signal up to 1% duty cycle
applied to 16 channels
62
TGC low-noise mode, 500-mVPP input signal up to 1% duty cycle
applied to 16 channels
430
240
160
20
TGC medium-power mode, 500-mVPP input signal up to 1% duty cycle
applied to 16 channels
IA_1P9
AVDD_1P9 current (1.9 V)(4)
AVDD_3P15 current(4)
mA
mA
TGC low-power mode, 500-mVPP input signal up to 1% duty cycle
applied to 16 channels
TGC low-noise, medium-power, and low-power modes, 500-mVPP
input signal up to 1% duty cycle applied to 16 channels
IA_3P15
IA_1P8
ID_1P2
IA_1P8
AVDD_1P8 current(4)
DVDD_1P2 current(4)
DVDD_1P8 current(4)
For a 12-bit ADC resolution and an 80-MSPS system clock
For a 12-bit ADC resolution and an 80-MSPS system clock
For a 12-bit ADC resolution and an 80-MSPS system clock
170
110
100
mA
mA
mA
AC PERFORMANCE (Power)
AVDD_1P9
–65
–90
AC power-supply rejection
AVDD_3P15
PSRR1 kHz
ratio: tone at output relative
to tone on supply
100 mVPP, 1-kHz tone on supply
dBc
dBc
AVDD_1P8, DVDD_1P8, and
DVDD_1P2
–70
AVDD_1P9
–45
–45
AC power-supply modulation
ratio: intermodulation tone at
output resulting from tones at
supply and input measured
relative to input tone
100 mVPP, 1-kHz tone on supply and
–1-dBFS, 5-MHz tone at input
AVDD_3P15
PSMR1 kHz
AVDD_1P8, DVDD_1P8, and
DVDD_1P2
–80
POWER DOWN
Partial power-down when PDN_FAST = high
Complete power-down when PDN_GBL = high
17
3
Power dissipation in
PDOWN
mW/Ch
power-down mode
Power-up time
Partial power-down when PDN_FAST = high and the device is in
partial power-down time for < 500 µs
3
1
µs
tUP
Complete power-down when PDN_GBL = high
ms
(4) Designing the power supply with 2X of the typical current capacity is recommended to take care of current variation across devices,
switching current, signal current, and so forth.
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8.6 Electrical Characteristics: CW Mode
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is applied
with source resistance RS = 50 Ω at frequency fIN = 2 MHz, CW_CLK1X = 2-MHz differential clock, and CW_CLK_NX = 32-
MHz differential clock. Device settings: CW clock mode = 16X, and 1X and 16X clock buffer in differential mode and ADC in
power-down mode. Minimum and maximum values are specified across the full temperature range.
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
GENERAL
VMAX, CW
Maximum input swing
300
500
mVPP
Voltage-to-current resistor
at LNA output
RV2I
IOPP
VN,IRCW
Ω
Peak-to-peak output
current per channel
4.8
mA/Ch
1 channel
1.55
0.45
19
Input voltage noise
Output current noise
nV/√Hz
16 channels
1 channel
IN,ORCW
pA/√Hz
16 channels
80
RS = 100 Ω, 1 channel
4
NFCW
Noise figure(1)
dB
dB
RS = 100 Ω, 16 channels
4.8
4
LCWM
CW mixer conversion loss
Phase noise
Signal to 1 channel
–151
–161
16X CW clock mode, calculated at
1-kHz frequency
PN1 kHz,CW
dBc/Hz
Signal to 16 channels
fIN1 = 5 MHz, fIN2 = 5.01 MHz, both tones at –6-dBFS
amplitude,
input to all the 16 channels.
–60
Two-tone, third-order
intermodulation distortion
IMD3
dBc
fIN1 = 5 MHz, fIN2 = 5.01 MHz, both tones at –6-dBFS
amplitude, input to single channel
–70
16X and 8X CW clock mode
4X CW clock mode
±0.06
±0.08
±0.05
±0.15
–49
ΔIQG
I/Q channel gain matching
dB
16X and 8X CW clock mode
4X CW clock mode
I/Q channel phase
matching
ΔIQP
Degrees
16X and 8X CW clock mode
4X CW clock mode
IMREJ
Image rejection ratio
LNA gain in CW mode
dBc
dB
–46
GLNACW
18
75
150
–1-dB cutoff frequency across LNA_HPF_PROG register
settings; see register 199
HPFCW
High-pass filter
kHz
300
600
POWER DISSIPATION
Power dissipation
No signal
60
68
CW mode, CW_CLK1X = 5 MHz,
PCW/Ch
mW/Ch
mA
300-mVPP input signal
CW_CLK_NX = 80 MHz
per channel (CW mode)
to all 16 channels
No signal
385
450
70
AVDD_1P9 current
(1.9 V)(2)
CW mode, CW_CLK1X = 5 MHz,
IA_1P9
300-mVPP input signal
CW_CLK_NX = 80 MHz
to all 16 channels
No signal
CW mode, CW_CLK1X = 5 MHz,
IA_3P15
AVDD_3P15 current(2)
mA
300-mVPP input signal
CW_CLK_NX = 80 MHz
70
to all 16 channels
(1) NF is measured as the SNR at the output of the device relative to the SNR at the input resulting from ths noise of source resistance RS.
(2) Designing the power supply with 2X of the typical current capacity is recommended to take care of current variation across devices,
switching current, signal current, and so forth.
16
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Electrical Characteristics: CW Mode (continued)
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is applied
with source resistance RS = 50 Ω at frequency fIN = 2 MHz, CW_CLK1X = 2-MHz differential clock, and CW_CLK_NX = 32-
MHz differential clock. Device settings: CW clock mode = 16X, and 1X and 16X clock buffer in differential mode and ADC in
power-down mode. Minimum and maximum values are specified across the full temperature range.
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
AC PERFORMANCE (Power)
AC power-supply rejection
ratio: tone at output
relative to tone on supply
AVDD_1P9
–60
–75
–50
PSRR1 kHz
100 mVPP, 1-kHz tone on supply
dBc
AVDD_3P15
AVDD_1P9
AC power-supply
modulation ratio:
intermodulation tone at
output resulting from tones
at supply and input
measured relative to input
tone
100 mVPP, 1-kHz tone on supply
and –1-dBFS, 5-MHz tone at input
PSMR1 kHz
dBc
AVDD_3P15
–50
8.7 Digital Characteristics
The dc specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic
level 0 or 1. Typical values are at TA = 25°C, minimum and maximum values are across the full temperature range of TMIN
=
–40°C to TMAX = 85°C, AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 = 1.2 V, DVDD_1P8 =
1.8 V, external differential load resistance between the LVDS output pair, and RLOAD = 100 Ω, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUTS
(PDN_FAST, PDN_GBL, RESET, SCLK, SDIN, SEN, TGC_PROF<1>, TGC_PROF<2>, TGC_SLOPE, TGC_UP_DN, TR_EN<1>,
TR_EN<2>, TR_EN<3>, TR_EN<4>, TX_TRIG)(1)
0.75 × max [AVDD_
1P9, DVDD_1P8]
VIH
VIL
High-level input voltage
Low-level input voltage
V
V
0.25 × min [AVDD_
1P9, DVDD_1P8]
IIH
IIL
Ci
High-level input current
Low-level input current
Input capacitance
150
150
8
µA
µA
pF
DIGITAL OUTPUTS (SDOUT)(1)
VOH
VOL
zo
High-level output voltage
Low-level output voltage
Output impedance
1.6
1.8(2)
V
V
Ω
0
0.2
50
LVDS DIGITAL OUTPUTS (DOUT)(1)
100-Ω external load connected differentially
across DOUT
|VOD
|
Output differential voltage
320
0.9
400
480
mV
V
Output offset voltage
(common-mode voltage of
DOUTPI and DOUTMI)
100-Ω external load connected differentially
across DOUT
VOS
1.03
1.15
(1) All digital specifications are characterized across operating temperature range but are not tested at production.
(2) When SDOUT operation is performed in VCA die, typical output voltage of SDOUT is 1.9 V.
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8.8 Output Interface Timing Requirements
Typical values are at TA = 25°C, AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 = 1.2 V,
DVDD_1P8 = 1.8 V, differential ADC clock, LVDS load CLOAD = 5 pF, RLOAD = 100 Ω, 14-bit ADC resolution, and sample rate
= 65 MSPS, unless otherwise noted. Minimum and maximum values are across the full temperature range of TMIN = –40°C to
TMAX = 85°C.
MIN
TYP
MAX
UNIT
GENERAL
tAP
Aperture delay(1)
1.6
±0.5
0.5
ns
ns
ps
Aperture delay variation from device to device
(at same temperature and supply)
δtAP
tAPJ
Aperture jitter with LVPECL clock as input clock
ADC TIMING
Default after reset(1)
ADC latency
8.5
4.5
Cd
ADC clocks
Low-latency mode
LVDS TIMING(2)
fF
Frame clock frequency(1)
fCLKIN
50%
MHz
Bits
DFRAME
NSER
Frame clock duty cycle
Number of bits serialization of each ADC word
1X output data rate
mode
Output rate of serialized data
2X output data rate
12
16
NSER × fCLKIN
1000
fD
Mbps
MHz
2 × NSER × fCLKIN
1000
500
mode
fB
Bit clock frequency
fD / 2
50%
DBIT
tD
Bit clock duty cycle
Data bit duration(1)
Clock propagation delay(1)
1
1000 / fD
6 × tD+ 5
ns
ns
tPDI
Clock propagation delay variation from device to device
(at same temperature and supply)
δtPROP
±2
ns
ns
DOUT, DCLK, FCLK rise and fall time, transition time
between –100 mV and +100 mV
tORF
0.2
tOSU
Minimum serial data, serial clock setup time(1)
Minimum serial data, serial clock hold time(1)
Minimum data valid window(3)(1)
tD / 2 – 0.4
tD / 2 – 0.4
tD – 0.65
ns
ns
ns
tOH
tDV
TX_TRIG TIMING
tTX_TRIG_DEL
Delay between TX_TRIG and TX_TRIGD(4)
0.5
0.4 × tS
ns
ns
(5)
Setup time related to latching TX_TRIG relative to the
rising edge of the system clock
tSU_TX_TRIGD
tH_TX_TRIGD
0.6
0.4
Hold time related to latching TX_TRIG relative to the
rising edge of the system clock
ns
(1) See Figure 1.
(2) All LVDS specifications are characterized but are not tested at production.
(3) The specification for the minimum data valid window is larger than the sum of the minimum setup and hold times because there can be
a skew between the ideal transitions of the serial output data with respect to the transition of the bit clock. This skew can vary across
channels and across devices. A mechanism to correct this skew can therefore improve the setup and hold timing margins. For example,
the LVDS_DCLK_DELAY_PROG control can be used to shift the relative timing of the bit clock with respect to the data.
(4) TX_TRIGD is the internally delayed version of TX_TRIG that gets latched on the rising edge of the ADC clock.
(5) tS is the ADC clock period in nanoseconds (ns).
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8.9 Serial Interface Timing Requirements(1)
Typical values are at TA = 25°C, AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 = 1.2 V, and
DVDD_1P8 = 1.8 V, unless otherwise noted. Minimum and maximum values are across the full temperature range of TMIN
–40°C to TMAX = 85°C.
=
MIN
50
20
20
5
TYP
MAX
UNIT
ns
(2)
tSCLK
tSCLK_H
tSCLK_L
SCLK period
(2)
(2)
SCLK high time
ns
SCLK low time
ns
(2)
tDSU
Data setup time
ns
(2)
tDH
Data hold time
5
ns
(2)
tSEN_SU
tSEN_HO
tOUT_DV
SEN falling edge to SCLK rising edge
Time between last SCLK rising edge to SEN rising edge
SDOUT delay
8
ns
(2)
(3)
8
ns
12
20
28
ns
(1) All serial interface timing specifications are characterized but are not tested at production.
(2) See 图 100 for more details.
(3) See 图 101 for more details.
Sample N
Input Signal
TAP
Cd Clock
Cycles Latency
Input Clock (ADC_CLK)
Frequency = fCLKIN
TF
tPDI
Frame Clock (FCLK)
Frequency = fCLKIN
Bit Clock (DCLK)
Frequency = 7 x fCLKIN
Output Data (DOUT)
Data Rate = 14 x fCLKIN
1
0
13
(0)
12
(1)
11
(2)
10
(3)
9
(4)
8
(5)
7
(6)
6
(7)
5
(8)
4
3
2
1
0
13
(0)
12
(1)
11
(2)
10
(3)
9
(4)
8
(5)
7
(6)
6
(7)
5
(8)
4
3
2
1
0
13
12
(1)
11
(2)
10
(3)
9
(4)
8
(5)
7
(6)
6
(7)
5
(8)
4
3
2
1
0
13
(0)
12
(1)
(12) (13)
(9) (10) (11) (12) (13)
(9) (10) (11) (12) (13) (0)
(9) (10) (11) (12) (13)
Sample N-1
Sample N
Data Bit in MSB-First Mode
Data Bit in LSB-First Mode
13
(0)
DOUT1
D0
D1
D2
D3
D4
Bit Clock (DCLK)
tD
tD
tOH
tOSU
tB
Bit Clock (DCLK)
tDV
tDV
Figure 1. LVDS Output Timing Specification
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8.10 Typical Characteristics: TGC Mode
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is applied
with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK. Device
settings: gain code = 319 (total gain = 45 dB), LPF filter cutoff frequency = 15 MHz, low-noise mode, 14-bit ADC resolution,
LVDS interface to capture ADC data, output amplitude VOUT = –1 dBFS, and SNR is measured from 750 kHz to Nyquist
bandwidth. Minimum and maximum values are specified across the full temperature range.
55
50
45
40
35
30
25
20
15
10
5
50
45
40
35
30
25
20
15
10
5
Low Noise
Medium Power
Low Power
-40 èC
25 èC
85 èC
0
0
0
40
80
120
160
200
240
280
319
0
40
80
120
160
200
240
280
319
Gain Code (LSB)
Gain Code (LSB)
Across power modes
Across temperature
Figure 2. Gain vs Gain Code
Figure 3. Gain vs Gain Code
2600
2400
2200
2000
1800
1600
1400
1200
1000
800
3200
2800
2400
2000
1600
1200
800
600
400
400
200
0
0
Gain Matching (dB)
Gain Matching (dB)
Gain = 14 dB (14288 channels)
Gain = 30 dB (14288 channels)
Figure 4. Gain Matching Histogram
Figure 5. Gain Matching Histogram
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
1800
1600
1400
1200
1000
800
600
400
200
0
Gain Matching (dB)
Gain Matching (dB)
Gain = 38 dB (14288 channels)
Gain = 45 dB (14288 channels)
Figure 6. Gain Matching Histogram
Figure 7. Gain Matching Histogram
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Typical Characteristics: TGC Mode (continued)
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is applied
with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK. Device
settings: gain code = 319 (total gain = 45 dB), LPF filter cutoff frequency = 15 MHz, low-noise mode, 14-bit ADC resolution,
LVDS interface to capture ADC data, output amplitude VOUT = –1 dBFS, and SNR is measured from 750 kHz to Nyquist
bandwidth. Minimum and maximum values are specified across the full temperature range.
2500
2250
2000
1750
1500
1250
1000
750
2200
2000
1800
1600
1400
1200
1000
800
600
500
400
250
200
0
0
ADC Output (LSB)
ADC Output (LSB)
Gain = 14 dB (14288 channels)
Gain = 45 dB (14288 channels)
Figure 8. Output Offset Histogram
Figure 9. Output Offset Histogram
8000
6000
4000
2000
0
-40
-50
-60
-70
-80
-90
0.5 0.7
1
2
3
4
5 6 78 10
20 30 4050 70 100
0.5 0.7
1
2
3
4
5 6 78 10
20 30 4050 70 100
Frequency (MHz)
Frequency (MHz)
Figure 10. Input Impedance Magnitude vs Frequency
Figure 11. Input Impedance Phase vs Frequency
5
3
0
0
-5
-3
-6
-10
-15
-20
-25
-9
-12
-15
-18
-21
10 MHz
15 MHz
20 MHz
25 MHz
75 kHz
-30
-35
-40
-24
-27
-30
150 kHz
300 kHz
600 kHz
0
5
10
15
20
25
30
35
40
45
50
20
30 40 50 70 100
200 300
500 700 1000
Frequency (MHz)
Frequency (kHz)
Across LPF corner settings
Across LNA HPF corner settings
Figure 12. Full-Channel, Amplitude Response vs
Frequency
Figure 13. Full-Channel, Low-Frequency Amplitude
Response vs Frequency
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Typical Characteristics: TGC Mode (continued)
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is applied
with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK. Device
settings: gain code = 319 (total gain = 45 dB), LPF filter cutoff frequency = 15 MHz, low-noise mode, 14-bit ADC resolution,
LVDS interface to capture ADC data, output amplitude VOUT = –1 dBFS, and SNR is measured from 750 kHz to Nyquist
bandwidth. Minimum and maximum values are specified across the full temperature range.
5
40
35
30
25
20
15
10
5
Low Noise
Medium Power
Low Power
0
-5
-10
-15
-20
-25
-30
-35
With INM Capacitor of 1mF
Without INM Capacitor
0
0
100 200 300 400 500 600 700 800 900 1000
Frequency (kHz)
0
40
80
120
160
200
240
280
319
Gain Code (LSB)
Across INM capacitor
Across power modes
Figure 15. Input-Referred Noise vs Gain Code
Figure 14. Full-Channel, Low-Frequency Amplitude
Response vs Frequency
3.5
600
Low Noise
Medium Power
Low Power
Low Noise
Medium Power
Low Power
550
500
450
400
350
300
250
200
150
100
50
2.5
1.5
0.5
0
260
270
280
290
300
310
319
0
40
80
120
160
200
240
280
319
Gain Code (LSB)
Gain Code (LSB)
Across power modes
Across power modes
Figure 16. Input-Referred Noise vs Gain Code (Zoomed)
Figure 17. Output-Referred Noise vs Gain Code
5500
5000
75 kHz
150 kHz
5000
300 kHz
600 kHz
4500
4000
3500
3000
2500
2000
1500
1000
500
4000
3000
2000
1000
0
0
1.5k
10k
100k
1M
3M
1.5k
10k
100k
1M
3.5M
Frequency (Hz)
Frequency (Hz)
Across LNA HPF corner settings
With INMx capacitor = 1 µF
Figure 18. Low-Frequency, Output-Referred Noise vs
Frequency
Figure 19. Low-Frequency, Output-Referred Noise vs
Frequency
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Typical Characteristics: TGC Mode (continued)
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is applied
with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK. Device
settings: gain code = 319 (total gain = 45 dB), LPF filter cutoff frequency = 15 MHz, low-noise mode, 14-bit ADC resolution,
LVDS interface to capture ADC data, output amplitude VOUT = –1 dBFS, and SNR is measured from 750 kHz to Nyquist
bandwidth. Minimum and maximum values are specified across the full temperature range.
260
240
220
200
180
160
140
120
100
1.6
1.4
1.2
1
0.8
0.6
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
Frequency (MHz)
Frequency (MHz)
Figure 20. Input-Referred Noise vs Frequency
Figure 21. Output-Referred Noise vs Frequency
70
68
66
64
62
60
58
56
6
Low Noise
Medium Power
Low Power
5
4
3
2
1
0
54
Low Noise
Medium Power
52
Low Power
50
6
9
12 15 18 21 24 27 30 33 36 39 42 45
Gain (dB)
50
100
150
200
250
300
350
400
Source Impedance (W)
Across power modes
Across power modes
Figure 22. Signal-to-Noise Ratio vs Gain
Figure 23. Noise Figure vs Source Impedance
-50
-55
-60
-65
-70
-75
-45
Low Noise
Medium Power
Low Power
-50
-55
-60
-65
-70
-75
-80
-85
-90
Low Noise
Medium Power
Low Power
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
Frequency (MHz)
Frequency (MHz)
Across power modes
Across power modes
Figure 25. Third-Order Harmonic Distortion vs Frequency
Figure 24. Second-Order Harmonic Distortion vs Frequency
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Typical Characteristics: TGC Mode (continued)
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is applied
with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK. Device
settings: gain code = 319 (total gain = 45 dB), LPF filter cutoff frequency = 15 MHz, low-noise mode, 14-bit ADC resolution,
LVDS interface to capture ADC data, output amplitude VOUT = –1 dBFS, and SNR is measured from 750 kHz to Nyquist
bandwidth. Minimum and maximum values are specified across the full temperature range.
-50
-55
-60
-65
-70
-75
-80
-55
-60
-65
-70
-75
-80
-85
Low Noise
Medium Power
Low Power
Low Noise
Medium Power
Low Power
6
9
12 15 18 21 24 27 30 33 36 39 42 45
Gain (dB)
6
9
12 15 18 21 24 27 30 33 36 39 42 45
Gain (dB)
Across power modes
Across power modes
Figure 26. Second-Order Harmonic Distortion vs Gain
Figure 27. Third-Order Harmonic Distortion vs Gain
-50
-50
fIN1 = 2 MHz, fIN2 = 2.01 MHz
fIN1 = 5 MHz, fIN2 = 5.01 MHz
fIN1 = 2 MHz, fIN2 = 2.01 MHz
fIN1 = 5 MHz, fIN2 = 5.01 MHz
-55
-55
-60
-65
-70
-75
-80
-85
-90
-95
-100
-60
-65
-70
-75
-80
-85
-90
-95
-100
6
9
12 15 18 21 24 27 30 33 36 39 42 45
Gain (dB)
6
9
12 15 18 21 24 27 30 33 36 39 42 45
Gain (dB)
fOUT1 = –1 dBFS, fOUT2 = –21 dBFS
fOUT1 = –7 dBFS, fOUT2 = –7 dBFS
Figure 28. IMD3 vs Gain
Figure 29. IMD3 vs Gain
-50
-55
-60
-65
-70
-75
-80
-65
-70
Gain Code = 0
Gain Code = 0
Gain Code = 153
Gain Code = 249
Gain Code = 319
Gain Code = 153
Gain Code = 249
Gain Code = 319
-75
-80
-85
-90
-95
-100
-105
-110
5 678 10
20 30 50 70 100 200 300 500 1000 2000
Supply Frequency (kHz)
5 678 10
20 30 50 70 100 200 300 500 1000 2000
Supply Frequency (kHz)
Across gain codes
Across gain codes
Figure 30. AVDD_1P9 Power-Supply Modulation Ratio vs
100-mVPP Supply Noise Frequencies
Figure 31. AVDD_3P15 Power-Supply Modulation Ratio vs
100-mVPP Supply Noise Frequencies
24
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AFE5816
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Typical Characteristics: TGC Mode (continued)
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is applied
with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK. Device
settings: gain code = 319 (total gain = 45 dB), LPF filter cutoff frequency = 15 MHz, low-noise mode, 14-bit ADC resolution,
LVDS interface to capture ADC data, output amplitude VOUT = –1 dBFS, and SNR is measured from 750 kHz to Nyquist
bandwidth. Minimum and maximum values are specified across the full temperature range.
-10
-20
-30
-40
-50
-60
-70
25
Gain Code = 0
Gain Code = 0
Gain Code = 153
Gain Code = 249
Gain Code = 319
Gain Code = 153
Gain Code = 249
Gain Code = 319
0
-25
-50
-75
-100
5 678 10
20 30 50 70 100 200 300 500 1000 2000
5 678 10
20 30 50 70 100 200 300 500 1000 2000
Supply Frequency (kHz)
Supply Frequency (kHz)
Across gain codes
Across gain codes
Figure 32. AVDD_1P9 Power-Supply Rejection Ratio vs
100-mVPP Supply Noise Frequencies
Figure 33. AVDD_3P15 Power-Supply Rejection Ratio vs
100-mVPP Supply Noise Frequencies
14000
12000
10000
8000
360
300
240
180
120
60
14000
12000
10000
8000
360
300
240
180
120
60
Output Code
Gain Code
Output Code
Gain Code
6000
6000
4000
4000
2000
0
2000
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Time(ms)
D034
Time(ms)
D035
Figure 34. Output and Gain Code Step Response vs Time
Figure 35. Output and Gain Code Step Response vs Time
1.2
10000
Positive Overload (P)
Negative Overload (N)
0.8
Positive Overload (P)
Negative Overload (N)
Average (P+N)
6000
1
8000
0.6
0.4
0.2
0
4000
2000
0
-0.2
-0.4
-0.6
-0.8
-1
-2000
-4000
-6000
-8000
-10000
-1.2
0
2
4
6
8
10
12
14
16
18
20
0
5
10
15
20
25
30
35
Time (ms)
Time (ms)
For the input in Figure 36, gain = 21 dB, across positive and
negative overload
Figure 37. Device Pulse Inversion Output vs Time
Figure 36. Pulse Inversion Asymmetrical Input vs Time
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Typical Characteristics: TGC Mode (continued)
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is applied
with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK. Device
settings: gain code = 319 (total gain = 45 dB), LPF filter cutoff frequency = 15 MHz, low-noise mode, 14-bit ADC resolution,
LVDS interface to capture ADC data, output amplitude VOUT = –1 dBFS, and SNR is measured from 750 kHz to Nyquist
bandwidth. Minimum and maximum values are specified across the full temperature range.
10000
8000
6000
4000
2000
0
800
600
400
200
0
Positive Overload (P)
Negative Overload (N)
Average (P+N)
-2000
-4000
-6000
-8000
-10000
-200
-400
-600
-800
0
5
10 15 20 25 30 35 40 45 50 55 60
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Time (ms)
Time (ms)
For the input in Figure 36, gain = 21 dB, across positive and
negative overload
VIN = large amplitude (50 mVPP
followed by small amplitude (500 µVPP
)
)
Figure 38. Device Pulse Inversion Output vs Time (Zoomed)
Figure 39. Output Code Overload Recovery vs Time
2000
1600
1200
800
10
0
-10
400
-20
HPF_CORNER_CHxy = 2
HPF_CORNER_CHxy = 3
0
-30
-40
-50
-60
HPF_CORNER_CHxy = 4
HPF_CORNER_CHxy = 5
HPF_CORNER_CHxy = 6
HPF_CORNER_CHxy = 7
HPF_CORNER_CHxy = 8
HPF_CORNER_CHxy = 9
HPF_CORNER_CHxy = 10
-400
-800
-1200
-1600
-2000
1
1.5
2
2.5
3
3.5
4
4.5
5
0.01
0.05
0.2 0.5
1
2 3 45 710 20 50 100 200
Time (ms)
Frequency (MHz)
VIN = large amplitude (50 mVPP
)
Across digital HPF corner settings
followed by small amplitude (500 µVPP
)
Figure 40. Output Code Overload Recovery vs Time
(Zoomed)
Figure 41. Digital High-Pass Filter Gain Response vs
Frequency
110
70
Low Noise
Medium Power
Low Power
Low Noise
Medium Power
Low Power
100
90
80
70
60
50
60
50
40
30
20
0
40
80
120
160
200
240
280
319
0
40
80
120
160
200
240
280
319
Gain Code (LSB)
Gain Code (LSB)
D045
D060
Across power modes
Figure 42. Device Power vs Gain Code
Across power modes
Figure 43. VCA Power vs Gain Code
26
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Typical Characteristics: TGC Mode (continued)
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal is ac-coupled to INP with a 10-nF capacitor and is applied
with source resistance RS = 50 Ω at frequency fIN = 5 MHz, and a 50-MHz differential clock is applied on ADC_CLK. Device
settings: gain code = 319 (total gain = 45 dB), LPF filter cutoff frequency = 15 MHz, low-noise mode, 14-bit ADC resolution,
LVDS interface to capture ADC data, output amplitude VOUT = –1 dBFS, and SNR is measured from 750 kHz to Nyquist
bandwidth. Minimum and maximum values are specified across the full temperature range.
38
36
34
32
30
28
26
24
22
550
500
450
400
350
300
250
200
150
ADC Resolution 12 bit
ADC Resolution 14 bit
Low Noise
Medium Power
Low Power
10
20
30
40
50
60
70
80
0
40
80
120
160
200
240
280
319
ADC Sample Rate (MHz)
Gain Code (LSB)
D063
Across ADC resolution
Across power modes
Figure 44. ADC Power vs ADC Sample Rate
Figure 45. AVDD_1P9 Supply Current vs Gain Code
170
18.2
AVDD_1P8
DVDD_1P8
DVDD_1P2
Low Noise
Medium Power
Low Power
160
150
18.15
18.1
18.05
18
140
130
120
110
100
90
80
70
17.95
17.9
60
50
40
0
40
80
120
160
200
240
280
319
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
ADC Sample Rate (MHz)
Gain Code (LSB)
Across power modes
12-bit resolution
Figure 46. AVDD_3P15 Supply Current vs Gain Code
Figure 47. AVDD_1P8, DVDD_1P8 and DVDD_1P2 Supply
Current vs ADC Sample Rate
160
100
AVDD_1P8
DVDD_1P8
Low Noise
Medium Power
150
95
140
130
120
110
100
90
DVDD_1P2
Low Power
90
85
80
75
70
65
60
55
50
45
80
70
60
50
40
10 15 20 25 30 35 40 45 50 55 60 65
ADC Sample Rate (MHz)
10 15 20 25 30 35 40 45 50 55 60 65
ADC Sample Rate (MHz)
D051
14-bit resolution
For all power modes
Figure 48. AVDD_1P8, DVDD_1P8 and DVDD_1P2 Supply
Current vs ADC Sample Rate
Figure 49. Total Power Dissipation vs ADC Sample Rate
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8.11 Typical Characteristics: CW Mode
At TA = 25°C, unless otherwise noted. Supply: AVDD_1P8 = 1.8 V, AVDD_1P9 = 1.9 V, AVDD_3P15 = 3.15 V, DVDD_1P2 =
1.2 V, and DVDD_1P8 = 1.8 V. Input to the device: input signal = 2 MHz, CW_CLK1X = 2-MHz differential, and
CW_CLK_NX = 32-MHz differential. Device settings: CW clock mode = 16X, and 1X and 16X clock buffer in differential
mode, and ADC in power-down mode. Minimum and maximum values are specified across the full temperature range.
3
0
-140
-142
-144
-146
-148
-150
-152
-154
-156
-158
-160
16X Clock Mode
8X Clock Mode
4X Clock Mode
-3
-6
-9
-12
-15
-18
-21
-24
-27
-30
75 kHz
150 kHz
300 kHz
600 kHz
20
30 40 50 70 100
200 300
500 700 1000
100 200300 500 1000 2000
5000 10000 20000 50000
Frequency (kHz)
Frequency (Hz)
Across LNA HPF corner settings
fIN = 2 MHz, one channel across CW clock modes
Figure 50. Full-Channel, Low-Frequency Amplitude
Response vs Frequency
Figure 51. CW Phase Noise vs Frequency
-142
-144
Phase Noise 1 Channel
Phase Noise 16 Channels
-146
16X Clock Mode
8X Clock Mode
4X Clock Mode
-144
-146
-148
-148
-150
-152
-154
-156
-158
-160
-162
-164
-166
-168
-150
-152
-154
-156
-158
-160
-162
-164
-166
-168
-170
100 200300 500 1000 2000
5000 10000 20000 50000
100 200300 500 1000 2000
5000 10000 20000 50000
Frequency (Hz)
Frequency (Hz)
fIN = 2 MHz, across one channel and 16 channels
fIN = 2 MHz, 16 channels across CW clock modes
Figure 52. CW Phase Noise vs Frequency
Figure 53. CW Phase Noise vs Frequency
450
425
400
375
350
72
68
64
60
56
61
AVDD_1P9 Current
AVDD_3P15 Current
60
59
58
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
CW_CLK1X (MHz)
CW_CLK1X (MHz)
Across all CW clock modes
Figure 54. AVDD_1P9 and AVDD_3P15 Supply Current vs
CW Clock Frequency
Figure 55. Power vs CW 1X Clock Frequency
28
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9 Detailed Description
9.1 Overview
The AFE5816 is a highly-integrated, analog front-end (AFE) solution specifically designed for ultrasound systems
where high performance and higher integration are required. The device integrates a complete time-gain
compensation (TGC) imaging path and a continuous-wave Doppler (CWD) path. The device also enables users
to select from a variety of power and noise combinations to optimize system performance. The device contains
16 dedicated channels, each comprising an attenuator, low-noise amplifier (LNA), low-pass filter (LPF), and
either a 14-bit or 12-bit analog-to-digital converter (ADC). At the output of the 16 ADCs is a low-voltage
differential signaling (LVDS) serializer to transfer digital data. In addition, the device also contains a continuous
wave (CW) mixer. Multiple features in the device are suitable for ultrasound applications (such as programmable
termination, individual channel control, fast power-up and power-down response, fast and consistent overload
recovery, and integrated digital processing). Therefore, this device brings premium image quality to ultra-
portable, handheld systems all the way up to high-end ultrasound systems. In addition, the signal chain of the
device can handle signal frequencies as low as 10 kHz and as high as 25 MHz. This broad analog frequency
range enables the device to be used in both sonar and medical applications; see the Functional Block Diagram
section for a simplified function block diagram.
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9.2 Functional Block Diagram
VCM
BIAS_2P5
Reference Voltage/
Current Generator
BAND_GAP
LNA_INCM
SRC_BIAS
TR_EN<1>
INP1
INP_SOURCE
!ÇÇ9bÜ!Çhw
LPF
10, 15,
LNA
with
10nF
+
ADC 1
œ
HPF
20, 25 MHz
INM1
TGC CONTROL
CW
Mixer
10nF
LVDS
CW_CH1
DOUTP1
CW_CLOCK
16X16 Cross
point SW
DOUTM1
DOUTP2
DOUTM2
INP2
TR_EN<1>
INP_SOURCE
!ÇÇ9bÜ!Çhw
LPF
10, 15,
LNA
with
10nF
+
ADC 2
œ
HPF
20, 25 MHz
INM2
TGC CONTROL
CW
Mixer
10nF
CW_CH2
DOUTP16
DOUTM16
CW_CLOCK
16X16 Cross
point SW
FCLKP
FCLKM
DCLKP
DCLKM
INP_SOURCE
TR_EN<4>
INP16
!ÇÇ9bÜ!Çhw
LPF
10, 15,
LNA
with
10nF
+
ADC 16
œ
HPF
20, 25 MHz
INM16
TGC CONTROL
CW
Mixer
10nF
CW_CH16
CW_CLOCK
16X16 Cross
point SW
TR_EN<1>
TR_EN<2>
TR_EN<3>
TR_EN<4>
TR_EN<1>
TR_EN<2>
TR_EN<3>
TR_EN<4>
TGC
CONTROL
CW_CLOCK
Clock
Generator
TGC Control
Engine
SERIAL
INTERFACE
CLKP_16x
SYNC GEN
SDOUT
CLKM_16x
16 Phase
Generator
CLKP_1x
CLKM_1x
CW_IP/QP_OUTP/M
30
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9.3 Feature Description
The device supports two signal chains: TGC mode and CW mode. Table 2 describes the functionality of various
blocks in CW and TGC mode.
Table 2. Various Block Functionality in TGC and CW Mode
TGC MODE
CW MODE
BLOCK
ENABLED,
DISABLED
ENABLED,
DISABLED
COMMENT
COMMENT
Attenuator supports attenuation
range of 8 dB to 0 dB
In CW mode, the attenuator is disabled
automatically
Attenuator
Enabled
Enabled
Disabled
Disabled
Attenuator high-pass
filter
—
—
Low-noise amplifier
(LNA)
LNA supports gain range of 14 dB
to 45 dB
Enabled
Enabled
Enabled
Enabled
Enabled
Disabled
LNA supports a fixed gain of 18 dB
—
LNA high-pass filter
—
In CW mode, the LPF is disabled
automatically
Low pass filter (LPF)
—
In CW mode, the DTGC is disabled
automatically
Digital TGC (DTGC)
Enabled
Enabled
—
—
Disabled
Enabled
In CW mode, the ADC remains active.
The ADC can be powered down in CW
mode using a power-down pin or power-
down register bit.
Analog-to-digital
converter (ADC)
9.3.1 Attenuator
The first stage of the signal chain is an attenuator followed by a low-noise amplifier (LNA). Fundamentally, an
attenuator functions as a time-varying passive termination. In ultrasound imaging systems, near-field reflected
signals are of very high amplitude. This high-amplitude signal can be attenuated using an attenuator in order to
bring the signal amplitude down to within the LNA input amplitude range. The attenuator supports time-gain
compensation [that is, the attenuation level is from –8 dB to 0 dB with time in steps of 0.125 dB (64 steps)]. The
attenuation level is controlled by the TGC control engine in the device.
9.3.1.1 Implementation
The attenuator is implemented as a resistor divider network that uses the principle of voltage division between a
source resistance (RS) and attenuator resistance (RATTEN); see Figure 56. At the signal frequency, attenuation
provided by this resistor network is given by Equation 1:
VINP
RATTEN
Attenuation =
=
VINP_SOURCE RS+RATTEN
(1)
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Device
TGC Control Engine
INP
INP_SOURCE
RS
CINP = 10 nF
LNA Input
INP-INM
LNA
RATTEN
CINM = 10 nF
INM
Transducer
CINM_EXT
Optional
Figure 56. Attenuator Block Diagram
In Equation 1, the value of the RATTEN resistor is controlled by the TGC control engine. Further details of the TGC
control engine are provided in the Digital TGC (DTGC) section. The correct RATTEN network must be selected for
a given RS using the INP_RES_SEL register because attenuation is a function of both source resistance (RS)
and attenuator resistance (RATTEN). The range of input resistance RS supported is listed in Table 122.
NOTE
The attenuator block remains active only in TGC mode. The attenuator block is disabled in
CW mode.
9.3.1.2 Maximum Signal Amplitude Support
In TGC mode, the maximum input signal amplitude of the low-noise amplifier is approximately 400 mVPP. In
Figure 56, the source is modeled as a voltage source at the INP_SOURCE node in series with its (source)
impedance RS. The attenuation is achieved by the voltage division between the series combination of the source
impedance RS and the attenuator resistance a RATTEN. Therefore, the maximum signal amplitude supported at
the INP_SOURCE node is given by 400 mVPP divided by the attenuation. For a given value of source resistance
RS, the attenuator provides the maximum attenuation of 8 dB. Thus, the maximum signal supported at the
INP_SOURCE node is 1 VPP
.
9.3.1.3 Attenuator High-Pass Filter (ATTEN HPF)
A high-pass filter can be realized through the attenuator. The frequency response of the high-pass filter is
governed by the CINM (internal to the device), CINM_EXT (optional and external to the device), and CINP (external
ac-coupling capacitor) capacitors, and the source resistance RS and attenuator resistance RATTEN
.
For the input circuit shown in Figure 56, the LNA input is given by Equation 2:
≈
’
CINPìCINM_ T
CINP+CINM_ T
sì R +R
ì
)
∆
∆
«
÷
÷
◊
(
)
S
ATTEN
VINP-VINM
VINP_SOURCE RS+RATTEN
RATTEN
=
ì
≈
’
CINPìCINM_ T
1+ sì R +R
ì
∆
∆
«
÷
÷
◊
(
S
ATTEN
CINP+CINM_ T
where
•
CINM_T represents the total capacitor (= CINM + CINM_EXT) at the INM node.
(2)
32
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Equation 2 describes a high-pass response with a corner frequency given by Equation 3:
[1 / (RS + RATTEN)] × [(CINP + CINM_T) / ( CINP × CINM_T)]
(3)
Therefore, when RATTEN changes with the TGC, the HPF cutoff frequency also changes.
Figure 57 shows typical values of RATTEN across attenuation and INP_RES_SEL settings. Figure 58 and
Figure 59 show the HPF corner frequency across attenuation and INP_RES_SEL settings for CINP = CINM_T
=
10 nF and CINP = CINM_T = 1 µF, respectively. For low-frequency application systems (for example, sonar systems
that require a very-low, high-pass filter corner), larger value capacitors of CINP and CINM_EXT can be used in order
to reduce the HPF corner frequency.
7000
6500
6000
5500
5000
4500
4000
3500
3000
2500
2000
1500
1000
500
400
375
350
325
300
275
250
225
200
175
150
125
100
75
50
50
100
200
400
800
100
200
400
800
50
25
0
0
-8
-7
-6
-5
-4
-3
-2
-1
-8
-7
-6
-5
-4
-3
-2
-1
0
Attenuation (dB)
Attenuation (dB)
Across INP_RES_SEL register settings
Across INP_RES_SEL register settings, CINP = CINM_T = 10 nF
Figure 57. Attenuation Resistance vs Attenuation
Figure 58. HPF Corner vs Attenuation
4
3.75
3.5
3.25
3
2.75
2.5
2.25
2
50
100
200
400
800
1.75
1.5
1.25
1
0.75
0.5
0.25
0
-8
-7
-6
-5
-4
-3
-2
-1
0
Attenuation (dB)
Across INP_RES_SEL register settings, CINP = CINM_T= 1 µF
Figure 59. HPF Corner vs Attenuation
9.3.2 Low-Noise Amplifier (LNA)
In many high-gain systems, a LNA is critical to achieve overall performance. The device uses a proprietary
architecture and a metal-oxide-semiconductor field-effect transistor (MOSFET) input transistor to achieve
exceptional low-noise performance when operating on a low-quiescent current. The LNA takes a single-ended
input signal and converts it to a differential output signal.
9.3.2.1 Input Signal Support in TGC Mode
In TGC mode, the LNA supports time-gain compensation [that is, the LNA gain can be changed from 14 dB to
45 dB in steps of 0.125 dB (256 steps total) with time]. Similar to the attenuator, the LNA gain is also controlled
by the TGC control engine.
In TGC mode, the maximum differential swing supported at the LNA output is 2 VPP. Therefore, the maximum
swing supported at the LNA input is given by 2 VPP divided by the LNA gain. For an LNA gain of 14 dB, the
maximum swing supported at the LNA input is 400 mVPP
.
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9.3.2.2 Input Signal Support in CW Mode
In CW mode, the LNA is automatically configured to a 18-dB, fixed-gain mode. In CW mode, the LNA supports a
maximum linear input range of 300 mVPP
.
9.3.2.3 Input Circuit
In both CW and TGC modes, the LNA input pin (INPx) is internally biased at approximately 1 V. AC-couple the
input signal to the INPx pin with an adequately-sized capacitor, CINP; a 10-nF capacitor is recommended. For
low-frequency applications, a 1-µF capacitor is recommended for both CINP and CINM_EXT. The electrical interface
of the input attenuator and the LNA to the external world is shown in Figure 60.
DEVICE
TGC Control Engine
INPx
+
TR_EN<x>
CINP
LNA
RATTEN
INMx
-
CINM = 10 nF
CINM_EXT
LPF
Figure 60. Device Input Circuit
9.3.2.4 LNA High-Pass Filter (LNA HPF)
The LPF circuit in Figure 60 is a low-pass transfer function between the positive and negative inputs of the LNA.
The LPF results in a high-pass transfer function between the LNA input and output and can be used to reject
unwanted low-frequency leakage signal from the transducer. The high-pass filter in the LNA is active for both CW
and TGC mode. The effective corner frequency of the HPF is determined by the capacitor connected at the INMx
pin of the device. Internal to the device, a 10-nF capacitor is connected at the INMx node. A large capacitor
(such as 1 μF) can be connected externally at the INMx pin for setting the low corner frequency (< 2 kHz) of the
LNA dc offset correction circuit. By default, a capacitor is not required to be connected at the INMx pin. To
disable this HPF, set the LNA_HPF_DIS register bit to 1. This bit powers down the unity feedback buffer
connected between positive and negative input of the LNA shown in Figure 60. For a given INMx capacitor, the
corner frequency of the HPF can be programmed using the LNA_HPF_PROG bit. Table 3 lists the HPF corner
frequency as a function of the CINM_EXT capacitor connected at the INMx pin across various LNA_HPF_PROG bit
settings.
Table 3. HPF Corner Programming Bits
HPF CORNER WITHOUT CONNECTING A
CAPACITOR AT THE INMx PIN
HPF CORNER WITH A CINM_EXT CAPACITOR
CONNECTED AT THE INMx PIN
LNA_HPF_PROG
00
01
10
11
75 kHz
150 kHz
300 kHz
600 kHz
75 kHz × 10 nF / (10 nF + CINM_EXT)
150 kHz × 10 nF / (10 nF + CINM_EXT
300 kHz × 10 nF / (10 nF + CINM_EXT
600 kHz × 10 nF / (10 nF + CINM_EXT
)
)
)
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9.3.2.4.1 Disconnecting the LNA HPF During Overload
In ultrasound systems, the device detects a large-amplitude, overloaded signal during transmit phase. The AFE
used for such systems is expected to quickly switch from a high overloaded state to a normal state.
To implement a very low LNA high-pass filter corner, the device uses a large capacitor at the INMx node. The
INMx node voltage changes as a result of the large overload signal, which ultimately leads to a low-frequency
settling at the device output. To avoid any significant disturbance on the INMx node voltage change resulting
from an overloaded input signal, the LNA HPF circuit can be disconnected from the INPx pin by using a series
switch; see Figure 60. This switch is controlled by the TR_EN<x>pins (TR_EN<1>, TR_EN<2>, TR_EN<3>, and
TR_EN<4> control channels 1 to 4, 5 to 8, 9 to 13, and 14 to 16, respectively). Figure 61 shows an example of
TR_EN<x> control signals. Figure 62, Figure 63, Figure 64, and Figure 65 illustrate a positive overload input
signal, negative overload input signal, and the corresponding device output for both without and with TR_EN<x>
pin functionality, respectively. The TR_EN<x> pin functionality refers to using a low-going pulse on TR_EN<x>
during an overload input signal to disconnect the LNA HPF. This functionality is useful when there is not a low-
frequency signal immediately after an overload signal.
Input Signal
Overload
Signal
1.8
TR_EN<x>
0
Figure 61. TR_EN Control Signal
1.2
1.05
0.9
1.2
1.05
0.9
0.75
0.6
0.75
0.6
0.45
0.3
0.45
0.3
0.15
0
0.15
0
-0.15
-0.3
-0.45
-0.6
-0.75
-0.9
-1.05
-1.2
-0.15
-0.3
-0.45
-0.6
-0.75
-0.9
-1.05
-1.2
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
Time (ms)
Time (ms)
Figure 62. Pulse Inversion Positive Input vs Time
Figure 63. Pulse Inversion Negative Input vs Time
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10000
10000
8000
6000
4000
2000
0
Positive Overload
Negative Overload
Positive Overload
Negative Overload
8000
6000
4000
2000
0
-2000
-4000
-6000
-8000
-10000
-2000
-4000
-6000
-8000
-10000
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
Time (ms)
Time (ms)
Figure 64. Overload Recovery Output vs Time Without
TR_EN Functionality
Figure 65. Overload Recovery Output vs Time with TR_EN
Functionality
9.3.2.5 LNA Noise Contribution
The noise specification is critical for the LNA and determines the dynamic range of the entire system. The device
LNA achieves low power, an exceptionally low-noise voltage of 0.95 nV/√Hz at 45-dB gain, and a low-current
noise of 1.2 pA/√Hz in low-noise mode.
Voltage noise is the dominant source of noise; however, the LNA current noise flowing through the source
impedance (RS) generates additional voltage noise. The total LNA noise can be computed with Equation 4.
LNA _Noisetotal
=
VL2NAnoise +RS2 ìIL2NAnoise
(4)
The device achieves a low noise figure (NF) over a wide range of source resistances; see Figure 23.
9.3.3 High-Pass Filter (HPF)
Two high-pass filters (HPFs) exist in the signal chain. The first high-pass filter is the HPF that is part of the input
attenuator and the other filter is the HPF in the low-noise amplifier (LNA). In the preceding sections (see the LNA
High-Pass Filter (LNA HPF) and Attenuator High-Pass Filter (ATTEN HPF) sections) the HPF corner expression
of the attenuator and LNA is explained, assuming only a single HPF is active at a time. If both HPFs are enabled
at the same time, the overall HPF corner is approximately given by the maximum of the two corner frequencies.
For instance, if the HPF corner of the attenuator is (fATTEN) Hz and the HPF corner of the LNA is (fLNA) Hz, the
overall HPF corner is given by the maximum of (fATTEN, fLNA) Hz. In CW mode, the attenuator HPF is disabled
and the LNA HPF remains active so the overall HPF corner is given by fLNA
.
9.3.4 Low-Pass Filter (LPF)
In TGC mode, the LNA output is fed to a low-pass filter (LPF). The LPF is designed as a differential, active, third-
order filter with Butterworth characteristics and a typical 18 dB per octave roll-off. Programmable through the
serial interface, the –3-dB corner frequency can be set to different combinations across power modes, as shown
in Table 4. The filter bandwidth is set for all channels simultaneously.
Note that in CW mode, the LPF is automatically disabled.
Table 4. LPF Corner Frequency Combinations
POWER MODE
Low noise
LPF CORNER FREQUENCY (MHz)
10, 15, 20, 25
Medium power
Low power
10, 15, 20, 25
5, 7.5, 10, 12.5
36
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9.3.5 Digital TGC (DTGC)
This section discusses the operation of the digital TGC control engine. The DTGC is relevant only in TGC mode;
see the DTGC Register Map for register settings and descriptions.
9.3.5.1 DTGC Overview
As described previously, the device consists of a programmable attenuator, a variable-gain LNA, and a TGC
control engine that controls the gain of the device, as shown in Figure 66. In combination, these blocks can be
used to implement a digital time gain control (DTGC) scheme. The attenuator block attenuation can be changed
from 8 dB to 0 dB in 0.125-dB steps (64 steps) and the LNA gain can be changed from 14 dB to 45 dB in
0.125-dB steps (256 steps). Thus, the total channel gain can be varied from 6 dB to 45 dB in 0.125-dB steps
(320 steps). These gain settings are controlled as a function of time based on the different profile settings of the
TGC control engine. The TGC control engine operates on the same clock as the ADC_CLK.
Input
Attenuator
LNA
Output
ADC_CLK
TGC Control Engine
Figure 66. Digital TGC
9.3.5.2 DTGC Programming
Various functions of the digital TGC operation can be programmed using the registers listed in the DTGC
Register Map. To program register settings in the DTGC register map, set the DTGC_WR_EN bit to 1.
9.3.5.2.1 DTGC Profile
The TGC engine supports four different modes (programmable fixed-gain, up, down ramp, external non-uniform,
and internal non-uniform mode) to change the device gain with time. The gain versus time curve for each mode
is set using a set of combined parameters referred to as a profile. Four such profiles can be programmed in
advance, which enables a given mode to switch between one of four profiles based on either a pin control or
based on a single register control. Table 5 shows the profile mapping with register bits.
Table 5. Profile Registers Address
PROFILE
REGISTER BITS IN THE DTGC REGISTER MAP
0
1
2
3
Registers 161 (bits 15-0), 162 (bits 15-0), 163 (bits 15-0), 164 (bits 15-0), 165 (bits 15-0), and 185 (bits 15-8)
Registers 166 (bits 15-0), 167 (bits 15-0), 168 (bits 15-0), 169 (bits 15-0), 170 (bits 15-0), and 185 (bits 7-0)
Registers 171 (bits 15-0), 172 (bits 15-0), 173 (bits 15-0), 174 (bits 15-0), 175 (bits 15-0), and 186 (bits 15-8)
Registers 176 (bits 15-0), 177 (bits 15-0), 178 (bits 15-0), 179 (bits 15-0), 180 (bits 15-0), and 186 (bits 7-0)
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9.3.5.2.1.1 Profile Selection
When programmed, there are two ways that any one of the four profiles can be selected and switched to
program the settings in the TGC mode: either with the device pin or by register settings.
1. Device pin. To select the profile using pin control, set the PROFILE_EXT_DIS bit to 0. Then, the different
combinations of logic level at the TGC_PROF<2> and TGC_PROF<1> pins listed in Table 6 dictate which
profile is selected.
2. Register settings. To select the profile with register settings, set the PROFILE_EXT_DIS bit to 1. Then, the
different combinations of the PROFILE_REG_SEL bits listed in Table 6 dictate which profile must be used to
program the corresponding TGC mode.
Table 6. Profile Selection Using the Device Pin or the PROFILE_REG_SEL Bits
PIN CONTROL (PROFILE_EXT_DIS = 0)
REGISTER CONTROL (PROFILE_EXT_DIS = 1)
SELECTED PROFILE
TGC_PROF<2>
TGC_PROF<1>
PROFILE_REG_SEL
0
0
1
1
0
1
0
1
00
01
10
11
Profile 0
Profile 1
Profile 2
Profile 3
9.3.5.3 DTGC Modes
The device supports four schemes to change the device gain. These schemes are referred to as the four DTGC
modes. The device can be programmed in any of these modes by using the MODE_SEL register bit, as shown in
Table 7.
Table 7. DTGC Modes
MODE_SEL REGISTER BITS SETTING
DTGC MODE
Programmable fixed-gain
Up, down ramp
10
01
00
11
External non-uniform
Internal non-uniform
9.3.5.3.1 Programmable Fixed-Gain Mode
In this mode, the device gain is set directly by writing a gain code in the MANUAL_GAIN_DTGC register. See
Figure 2 for a description of device gain versus gain code across power modes. Note that the allowed value of
the gain code is from 0 to 319. The gain codes from 0 to 63 control the attenuator and the codes from 64 to 319
control the LNA. If the gain code is programmed outside the 0 to 319 range, then the gain code value
automatically becomes 0.
For Low-Noise or Medium-Power mode: Gain = 6 + Gain code × 0.125
For Low-Power mode: Gain = 12 + Gain code × 0.125
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9.3.5.3.2 Up, Down Ramp Mode
Figure 67 shows the change in device gain with time in the up, down ramp mode. This mode generates an
ascending gain ramp followed by a descending gain ramp.
Down gain ramp
Stage
Up gain ramp
Stage
Start
Stage
Stop
Stage
Start
Stage
Positive Step
Frequency
Negative Step
Frequency
Stop Gain
Positive Step
Negative Step
Start Gain
Start Gain
Start TGC
Stop TGC
Time
TGC_SLOPE
TGC_UP_DN
TGC profile changes are not
reflected in this region.
Figure 67. Up, Down Ramp Mode
The different stages of the up, down ramp mode are:
1. Start: At device reset or a DTGC mode change (that is, when changing the DTGC mode to any other mode
and returning to up, down ramp mode), the device gain is equal to the start gain.
2. Up gain ramp. The up gain ramp stage starts when the TGC_SLOPE pin voltage level goes high. During the
up gain ramp stage, the device gain increases by a positive step at the rate of the positive step frequency.
3. Stop gain. Any device gain in the up gain ramp stage keeps increasing until a stop gain stage is reached.
Any pules given at the TGC_SLOPE or TGC_UP_DN pins during the up gain ramp stage are ignored.
4. Down gain ramp. The down gain ramp stage starts when the TGC_UP_DN pin voltage level goes high.
During the down gain ramp stage, the device gain decreases by a negative step at the rate of the negative
step frequency. Any device gain in the down gain ramp stage keeps decreasing until a gain reaches the
value specified by start gain. Thereafter, the TGC curve proceeds to the start stage.
5. Profile. Different parameters (such as start gain, positive step, positive step frequency, and so forth) of
different gain stages are programmed with profile registers. A single profile consists of five 16-bit registers
and one 8-bit register that can be programmed with the serial interface registers. The functions of these
registers in up, down ramp mode are listed in Table 8. Note that changing the profile number updates the
parameters only during the start gain stage.
6. Timing requirement. See the section for timing requirements on the TGC_SLOPE and TGC_UP_DN pins
with respect to the ADC clock.
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Table 8. Profile Description for Up, Down Ramp Mode
REGISTER CONTROL
NOTATION IN
REGISTER
MAP
DEFAULT ALLOWED
NAME
DESCRIPTION
VALUE
RANGE
PROFILE 0 PROFILE 1 PROFILE 2 PROFILE 3
These bits set the gain code for the
start gain. For an N value (in decimal),
these bits set the start gain stage to
(6 + N × 0.25) dB.(1)
161
(bits 15-8)
166
(bits 15-8)
171
(bits 15-8)
176
(bits 15-8)
START_GAIN_x
[15:8]
Start gain
0
0 to 159
These bits set the gain code for the
stop gain. For an N value, these bits
set the stop gain stage to
161
(bits 7-0)
166
(bits 7-0)
171
(bits 7-0)
176
(bits 7-0)
Stop gain
STOP_GAIN_x[7:0]
159
0 to 159
(6 + N × 0.25) dB.(1)
162
167
172
177
Positive
step
For an N value, these bits set the
positive step to (N + 1) × 0.125 dB.
POS_STEP_x[7:3]
POS_STEP_x[2:0]
NEG_STEP_x[7:3]
NEG_STEP_x[2:0]
0
0
0 to 31(2)
0 to 7
(bits 15-11) (bits 15-11) (bits 15-11) (bits 15-11)
For an N value, gain steps at a
periodicity of [fS / 2(7 – N)]. Where fS is
the ADC clock frequency.(1)
Positive
step
frequency
162
(bits 10-8)
167
(bits 10-8)
172
(bits 10-8)
177
(bits 10-8)
162
(bits 7-3)
167
(bits 7-3)
172
(bits 7-3)
177
(bits 7-3)
Negative
step
For an N value, these bits set the
31
7
0 to 31
0 to 7
negative step to (N + 1) × 0.125 dB.(1)
For an N value, gain steps at a
periodicity of [fS / 2(7 – N)]. Note that fS
is ≥ the ADC clock frequency.(1)
Negative
step
frequency
162
(bits 2-0)
167
(bits 2-0)
172
(bits 2-0)
177
(bits 2-0)
163 to 165 168 to 170 173 to 175 178 to 180
—
—
—
—
—
0
N/A
(bits 15-0)
(bits 15-0)
(bits 15-0)
(bits 15-0)
185
185
186
186
0 = Default
1 = Enable fixed attenuation mode
FIX_ATTEN_x
0 to 1
(bit 15)
(bit 7)
(bit 15)
(bit 7)
When the FIX_ATTEN_EN_x bit is set
to 1, the attenuation level of the
attenuator block is set by the
ATTENUATION_0 bits. A value of N
written in the ATTENUATION_x
register sets the attenuation level at
–8 + N × 0.125 dB.(1)
185
(bits 14-8)
185
(bits 6-0)
186
(bits 14-8)
186
(bits 6-0)
—
ATTENUATION_x
0
0 to 64
(1) N refers to the decimal equivalent of the multi-bit word.
(2) Best image quality is achieved with a value of N = 0 (positive step of 0.125 dB). Using a higher positive step can result in glitches at the
gain transitions, causing a reduction in image quality.
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9.3.5.3.3 External Non-Uniform Mode
Figure 68 shows the change in device gain with time in external non-uniform mode. This mode generates an
ascending gain ramp followed by a descending gain ramp. This mode can be made to generate a non-uniform
gain profile using appropriate controls on the TGC_SLOPE and TGC_UP_DN pins.
Start Stage
Increase or decrease gain stage
Start Stage
Stop Gain
Positive Step
Negative Step
Start Gain
Time
TGC_SLOPE
TGC_UP_DN
1.8 V
0 V
Figure 68. External Non-Uniform Mode
The different stages of the external non-uniform mode are:
1. Start: At device reset or a DTGC mode change (that is, when changing the DTGC mode to any other mode
and returning to external non-uniform mode), the device gain is equal to the start gain.
2. Increase or decrease gain. When a positive edge transition is received on the device TGC_SLOPE pin, the
device gain increases or decreases by either a positive step or negative step based on the TGC_UP_DN pin
voltage level. If the TGC_UP_DN pin is set to a level 0, device gain increases and if the TGC_UP_DN pin is
set to 1, device gain decreases. The signal frequency at the TGC_SLOPE pin must be less than or equal to
the ADC clock.
3. Profile. Different parameters (such as start gain, positive step, negative step, and so forth) of different gain
stages are programmed with profile registers. A single profile consists of five 16-bit registers and one 8-bit
register that can be programmed with the serial programming interface (SPI). The functions of these registers
in external non-uniform mode are listed in Table 9. Note that changing the profile number updates the
parameters at any stage of the gain curve.
4. Timing requirement. See the section for timing requirements on the TGC_SLOPE and TGC_UP_DN pins
with respect to the ADC clock.
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Table 9. Profile Description for External Non-Uniform Mode
REGISTER CONTROL
BIT IN
REGISTER
MAP
DEFAULT ALLOWED
NAME
DESCRIPTION
VALUE
RANGE
PROFILE 0 PROFILE 1 PROFILE 2 PROFILE 3
These bits set the gain code for the
start gain stage. For an N value (in
decimal), these bits set the start gain
stage to (6 + N × 0.25) dB.(1)
161
(bits 15-8)
166
(bits 15-8)
171
(bits 15-8)
176
(bits 15-8)
START_GAIN_x
[15:8]
Start gain
0
0 to 159
These bits set the gain code for the
stop gain stage. For an N value, these
bits set the stop gain stage to
(6 + N × 0.25) dB.(1)
161
(bits 7-0)
166
(bits 7-0)
171
(bits 7-0)
176
(bits 7-0)
Stop gain
STOP_GAIN_x
159
0 to 159
162
(bits 15-8)
167
(bits 15-8)
172
(bits 15-8)
177
(bits 15-8)
Positive
step
For an N value, these bits set the
POS_STEP_x
NEG_STEP_x
—
0
255
—
0
0 to 255(2)
0 to 255
—
positive step to (N + 1) × 0.125 dB.(1)
162
(bits 7-0)
167
(bits 7-0)
172
(bits 7-0)
177
(bits 7-0)
Negative
step
For an N value, these bits set the
negative step to (N + 1) × 0.125 dB.(1)
163 to 165 168 to 170 173 to 175 178 to 180
(bits 15-0)
—
—
—
(bits 15-0)
(bits 15-0)
(bits 15-0)
185
(bit 15)
185
(bit 7)
186
(bit 15)
186
(bit 7)
0 = Default
1 = Enable fixed attenuation mode
FIX_ATTEN_x
0 to 1
When the FIX_ATTEN_EN_x bit is set
to 1, the attenuation level of the
attenuator block is set by the
ATTENUATION_0 bits. A value of N
written in the ATTENUATION_x
register sets the attenuation level at
–8 + N × 0.125 dB.(1)
185
(bits 14-8)
185
(bits 6-0)
186
(bits 14-8)
186
(bits 6-0)
—
ATTENUATION_x
0
0 to 64
(1) N refers to the decimal equivalent of the multi-bit word.
(2) Best image quality is achieved with a value of N = 0 (positive step of 0.125 dB). Using a higher positive step can result in glitches at the
gain transitions, causing a reduction in image quality.
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9.3.5.3.4 Internal Non-Uniform Mode
Figure 69 shows the change in device gain with time in internal non-uniform mode. A gain profile is completely
user defined by programming a set of profile registers and a bank of memory consisting of 160 16-bit registers.
Programming the profile register is covered in the DTGC Profile section. Memory architecture and other
information are explained in detail in the Memory section.
Start
Stage
Wait to Start
Stage
Ramp
Stage
Wait to Stop
Stage
Ramp Down
Stage
Start
Stage
Stop Gain Time
Stop Gain
Positive Step
Negative Step
Start Gain
Time
Start Gain Time
Wait Time
TGC_SLOPE
Figure 69. Internal Non-Uniform Mode
9.3.5.3.4.1 Memory
In the device are a total of four memory banks (bank 0 to bank 3), with each bank containing 160 rows and each
row is 16 bits in length, as shown in Figure 70. Each memory bank contains the information of the non-uniform
gain curve for a particular profile.
Bank 2
160 x 16
Bits
Bank 0
160 x 16
Bits
Bank 1
160 x 16
Bits
Bank 3
160 x 16
Bits
16
16
16
16
0
3
1
2
Profile Select
MUX
2
16
Memory Word
Figure 70. Memory Bank
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9.3.5.3.4.1.1 Write Operation for the Memory
The device supports two write operation modes: normal write mode and burst write mode. The following steps
describe the memory write operation in normal write mode:
1. Select the memory bank whose contents must be programmed using the MEM_BANK_SEL register bit.
Table 10 shows the mapping of the MEM_BANK_SEL and memory bank.
Table 10. Memory Bank Selection
MEM_BANK_SEL
MEMORY BANK
00
01
10
11
0
1
2
3
2. After selecting the memory bank, any memory bank word can be programmed by writing the MEM_WORD_0
to MEM_WORD_159 registers. For example, to program word 1 to word 160 of memory bank 0, first write
MEM_BANK_SEL = 00 and write the memory content at the MEM_WORD_0 to MEM_WORD_159 registers.
The following steps describe the memory write operation in burst write mode:
1. Select the memory bank whose contents must be programmed using the MEM_BANK_SEL register bit.
Table 10 shows the mapping of the MEM_BANK_SEL and memory bank.
2. After selecting the memory bank, any memory bank word can be programmed in burst by giving the register
address only one time. After giving the register address, provide continuous data on the SDIN pin and keep
the SEN signal low. The device automatically internally increments the register address and writes the data
to the next memory word.
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Figure 71 shows the normal and burst write mode operations.
SEN
Data Latched on SCLK Rising Edge
SCLK
A7
A6
A5
A4
A3
A2
A1
A0 D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SDIN
Register MEM_WROD_x Address
Memory Word Data
Normal Write Operation
SEN
SCLK
A7
A6
A5
A4
A3
A2
A1
A0 D15 D14 D13
D1
D0 D15 D14 D13
D2
D1
D0
SDIN
Memory Data for Word x+1
Register MEM_WROD_x Address
Memory Data for Word x
Burst Write Operation
Figure 71. Memory Write Mode
9.3.5.3.4.1.2 Read Operation for the Memory
The memory bank content can be read back in the same manner by reading the registers of the DTGC register
map; see the Register Readout section. To read the content of memory banks 0, 1, 2, or 3, first set the
MEM_BANK_SEL to 00, 01, 10, or 11 respectively, then place the device in DTGC register read mode and read
the MEM_WORD_x register to read word x on the SDOUT pin.
NOTE
Simultaneous memory read and write operation is not supported.
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9.3.5.3.4.2 Gain Curve Description for the Internal Non-Uniform Mode
The internal non-uniform mode operation is described in Figure 72 via a flow chart.
Device Reset or TGC Mode Change
Device Gain = Start Gain
No
Is TGC_SLOPE
= 1?
Yes
Reduce Device Gain by
Negative Step on Each
ADC Clock Until Gain
Reaches Start Gain
Wait for START_GAIN_TIME_x Number of ADC Clock Cycles
Read 16-Bit Memory Word at Address START_INDEX_x
No
Yes
Is Word[7] = 0?
Decrease Device Gain by Negative Step after Waiting
Increase Device Gain by Positive Step after Waiting for
Word[6:0] x 2(SLOPE_FAC<3:0>) ADC Clock Cycles
for
Word[6:0] x 2(SLOPE_FAC<3:0>) ADC Clock Cycles
No
Yes
Is Word[15] = 0?
Decrease Device Gain by Negative Step after Waiting
Increase Device Gain by Positive Step after Waiting for
Word[14:8] x 2(SLOPE_FAC<3:0>) ADC Clock Cycles
for
Word[14:8] x 2(SLOPE_FAC<3:0>) ADC Clock Cycles
Increment Memory Address
No
Yes
Is Memory Address =
STOP_INDEX_x?
Wait for STOP_GAIN_TIME_x Number of
ADC Clock Cycles
Read 16 Bit Memory Word
Figure 72. Internal Non-Uniform Mode Operation
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The different stages of the internal non-uniform mode are:
1. Start: At device reset or a DTGC mode change (that is, when changing the DTGC mode to any other mode
and returning to internal non-uniform mode), the device gain is equal to the start gain.
2. Wait to start: When the TGC_SLOPE pin voltage level goes high, the device gain remains at the start gain
stage for the number of ADC clock cycles defined in the START_GAIN_TIME_x register (x is the profile
number).
3. Ramp:
a. After waiting for START_GAIN_TIME_x number of ADC clock cycles, the TGC engine reads a 16-bit
memory word (word[15:0]) at the START_INDEX_x address and performs the following operation:
i. If memory word[7] = 0, the device gain increases by a positive step gain after waiting for the
word[6:0] × 2SLOPE_FAC<3:0>number of ADC clock cycles. If memory word[7] = 1, the device gain
decreases by a negative step gain after waiting for the word[6:0] × 2 SLOPE_FAC<3:0>number of ADC
clock cycles.
ii. If memory word[15] = 0, the device gain increases by a positive step gain after waiting for the
word[14:8] × 2SLOPE_FAC<3:0>number of ADC clock cycles. If memory word[15] = 1, the device gain
decreases by a negative step gain after waiting for the word[14:8] × 2SLOPE_FAC<3:0>number of ADC
clock cycles.
b. The TGC engine increases the memory address by 1. If the new address is less than STOP_INDEX_x,
the TGC engine reads a 16-bit memory word at the new address and repeats steps i and ii.
4. Wait to stop: The TGC engine increases the memory address by 1. If the new memory address is equal to
STOP_INDEX_x, then the device waits for the STOP_GAIN_TIME_x number of ADC clock cycles.
5. Ramp down: After waiting for the STOP_GAIN_TIME_x number of ADC clock cycles, the device gain starts
reducing by a negative step gain on each ADC clock until the gain reaches the start gain stage.
6. Profile: Different parameters (such as start gain, positive step, positive step frequency, and so forth) of
different gain stages are programmed with profile registers. A single profile consists of five 16-bit registers
and one 8-bit register that can be programmed with the serial programming interface (SPI). The functions of
these registers in internal non-uniform mode are listed in Table 11. Note that changing the profile number
updates the parameters only during the start gain stage.
7. Timing requirement. See the Timing Specifications section for timing requirements on the TGC_SLOPE pin
with respect to the ADC clock.
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Table 11. Internal Non-Uniform Mode Profile Definition
REGISTER CONTROL
BIT IN
REGISTER
MAP
DEFAULT ALLOWED
NAME
DESCRIPTION
VALUE
RANGE
PROFILE 0 PROFILE 1 PROFILE 2 PROFILE 3
These bits set the gain code for the
start gain stage. For an N value (in
decimal), these bits set the start gain
stage to (6 + N × 0.25) dB.
161
(bits 15-8)
166
(bits 15-8)
171
(bits 15-8)
176
(bits 15-8)
START_GAIN_x
[15:8]
Start gain
—
0
0 to 159
161
(bits 7-0)
166
(bits 7-0)
171
(bits 7-0)
176
(bits 7-0)
STOP_GAIN_x[7:0] Always write 159
159
0
0 to 159
0 to 255(1)
0 to 255
0 to 159
0 to 159
162
(bits 15-8)
167
(bits 15-8)
172
(bits 15-8)
177
(bits 15-8)
Positive
step
For an N value, these bits set the
positive step to (N + 1) × 0.125 dB.
POS_STEP_x[7:0]
NEG_STEP_x[7:0]
START_INDEX_x
STOP_INDEX_x
162
(bits 7-0)
167
(bits 7-0)
172
(bits 7-0)
177
(bits 7-0)
Negative
step
For an N value, these bits set the
negative step to (N + 1) × 0.125 dB.
255
0
163
(bits 15-8)
168
(bits 15-8)
173
(bits 15-8)
178
(bits 15-8)
Memory
start index
Memory start index
Memory stop index
163
(bits 7-0)
168
(bits 7-0)
173
(bits 7-0)
178
(bits 7-0)
Memory
stop index
159
0
164
(bits 15-0)
169
(bits 15-0)
174
(bits 15-0)
179
(bits 15-0)
Start gain
time
START_GAIN_
TIME_x
For an N value, these bits set the start
gain time to N × ADC clock cycles.
0 to (216 – 1
0 to (216 – 1
0 to 1
)
165
(bits 15-0)
170
(bits 15-0)
175
(bits 15-0)
180
(bits 15-0)
Stop gain
time
STOP_GAIN_
TIME_x
For an N value, these bits set the stop
gain time to N × ADC clock cycles.
0
)
185
(bit 15)
185
(bit 7)
186
(bit 15)
186
(bit 7)
0 = Default
1 = Enable fixed attenuation mode
—
—
FIX_ATTEN_x
0
When the FIX_ATTEN_EN_x bit is set
to 1, the attenuation level of the
attenuator block is set by the
ATTENUATION_0 bits. A value of N
written in the ATTENUATION_x
register sets the attenuation level at
–8 + N × 0.125 dB.
185
(bits 14-8)
185
(bits 6-0)
186
(bits 14-8)
186
(bits 6-0)
ATTENUATION_x
0
0 to 64
(1) Best image quality is achieved with a value of N = 0 (positive step of 0.125 dB). Using a higher positive step can result in glitches at the
gain transitions, causing a reduction in image quality.
9.3.5.4 Timing Specifications
For all DTGC modes, a signal applied on the TGC_SLOPE and TGC_UP_DN pins must meet the timing
constraints with respect to the ADC clock signal, as shown in Figure 73.
NOTE
Failure to meet the timing constraints in the up, down ramp mode results in a locked state.
To come out of a locked start state, change MODE_SEL to another mode and return to
up, down ramp mode or reset the device.
>3 ns
>2 ns
ADC_CLKP
TGC_SLOPE,
TGC_UP_DN
Figure 73. TGC Timing Diagram
A transition on TGC_SLOPE triggers the associated gain change event with a latency. This latency varies
depending on the DTGC modes. Table 12 lists the latency for each mode in terms of number of ADC_CLK
cycles. To determine the total latency from a transition on TGC_SLOPE to a transition in the output code, the
latency of the ADC must be added to the number in Table 12.
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Table 12. Latency Between a Transition in TGC_SLOPE and the Resulting Change in Gain
LATENCY FROM TGC_SLOPE TRANSITION TO A CHANGE IN
DTGC MODE
GAIN
Up, down ramp
External non-uniform
Internal non-uniform
6 ADC_CLKs
2 ADC_CLKs
11 ADC_CLKs
No timing constraints are required on signals applied at the TGC_PROF<2> and TGC_PROF<1> pins.
9.3.6 Continuous-Wave (CW) Beamformer
The continuous-wave Doppler (CWD) is a key function in mid-end to high-end ultrasound systems. Compared to
the TGC mode, the CW path must handle high dynamic range along with strict phase noise performance. CW
beamforming is often implemented in the analog domain because of these strict requirements. Multiple
beamforming methods are implemented in ultrasound systems, including a passive delay line, active mixer, and
passive mixer. Among these approaches, the passive mixer achieves optimized power and noise. This mixer
satisfies the CW processing requirements (such as wide dynamic range, low phase noise, and accurate gain and
phase matching).
The output signal in the CW path is a current output unlike the TGC path that has a voltage output. The down-
converted and phase-shifted currents of all the channels are summed and given to a single node; see Figure 74.
Connect this node to the virtual ground of an external differential amplifier for correct operation; see Figure 75.
NOTE
The local oscillator inputs of the passive mixer are cos (ωt) for the I channel and sin (ωt)
(where ω is local oscillator frequency) for the Q channel, respectively. Depending on the
application-specific CWD complex FFT processing, swapping the I and Q channels in
either the field-programmable gate array (FPGA) or digital signal processor (DSP) can be
required in order to obtain correct blood flow direction.
All blocks include well-matched, in-phase, quadrature channels to achieve good image frequency rejection as
well as beamforming accuracy. As a result, the image rejection ratio from an I/Q channel is excellent, which is
desired in ultrasound systems.
NOTE
The TGC path in the device is automatically disabled when the CW path is enabled. The
device does not support both TGC and CW modes simultaneously. However though not
used, the ADC remains powered up by default in the CW mode. The ADC can be powered
down using register bit GLOBAL_PDN.
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I-CLK
I-Channel
Q-Channel
Voltage-to-Current
LNA1
Converter
Q-CLK
CW_IP_OUTP
CW_IP_OUTM
(1 × fcw
)
1 × fcw CLK
Clock Distribution
Circuits
N × fcw CLK
CW_QP_OUTP
CW_QP_OUTM
I-CLK
(1 × fcw
)
I-Channel
Q-Channel
Voltage-to-Current
LNA16
Converter
Q-CLK
Figure 74. Simplified Block Diagram of the CW Path
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Mixer Clock 1
500 ꢀ
INP1
INM1
External Amplifier
LNA1
Input 1
Cext
500 ꢀ
500 ꢀ
Mixer Clock 2
Rext
CW_AMP_OUTP
INP2
INM2
CW_OUTM
I2V Sum
Amp
3 - 5 Ω
3 - 5 Ω
LNA2
Input 2
CW_OUTP
CW_AMP_OUTM
500 ꢀ
Rext
Cext
Mixer Clock 16
500 ꢀ
500 ꢀ
INP16
INM16
Input 16
LNA16
CW I- or Q- Channel Structure
NOTE: The 3-Ω to 6-Ω resistors at CW_OUTP and CW_OUTM result from the internal device routing and can create
a slight attenuation in the signal.
Figure 75. A Circuit Representation of a In-Phase or Quadrature-Phase Channel
The CW mixing operation attempts to down-convert the signal band to approximately dc such that the Doppler
frequency is translated to a low-frequency signal. This process is done by a complex mixing of the signal with a
clock that is at the same frequency as the center frequency of the signal. The complex mixing of the signal
requires the I- and Q- version of the clock. Furthermore, different channels can have different phase delays in the
path of their analog inputs. Thus, the programmability of the phase of the I- and Q- clock is essential to have.
The CW mixer uses two clocks; a high speed clock (16X, 8X, or 4X of the mixing clock) that is used to generate
multiple phases of a 1X clock, which is at the frequency of the mixing clock.
The CW mixer in the device is passive and switch based; the passive mixer adds less noise than active mixers.
The CW mixer achieves good performance at low power. Figure 76, Table 13, and the calculations of Equation 5
describe the principles of the mixer operation. LO(t) is square-wave based and includes odd harmonic
components.
Vi(t)
Vo(t)
LO(t)
Figure 76. CW Mixer Operation Block Diagram
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Table 13. Symbol Definition for CW Mixing
SYMBOL
DEFINITION
Vi(t)
Vo(t)
LO(t)
ω0
Input signal to the mixer
Output of the mixer
Local oscillator signal (1X clock) with appropriate phase
Input signal center frequency in radians per second
Input signal center frequency in Hz
f0
ωd
Doppler shift frequency in radians per second
Time
t
φ
Input signal phase relative to the phase of LO(t)
Vi t = sin
( )
w0t +
wdt +
j
(
)
4
1
1
»
ÿ
LO t =
sin
w
t + sin 3w0t + sin 5w0t ... -Fourier series of square wave
( )
(
)
(
)
(
)
0
…
Ÿ
⁄
p
3
5
2
»
ÿ
+...
⁄
Vo t =
cos
wdt +
j
-cos 2
w0t +
wdt +
j
( )
(
)
(
)
p
(5)
All the symbol definitions for Equation 5 are given in Table 13.
The first term in Equation 5 represents the ideal down-connected Doppler frequency component desired from the
CW mixer. Though not shown in Equation 5, the third- and fifth-order harmonics from LO(t) can either mix with
the third- and fifth-order harmonic of the Vi(t) signal or the noise around the third- and fifth-order harmonics of
Vi(t). This higher-order mixing can result in additional undesired down-converted components that lead to
degraded mixer performance. In order to eliminate this side-effect resulting from the square-wave demodulation,
a proprietary harmonic-suppression circuit is implemented in the device. The third- and fifth-order harmonic
components from the LO can be suppressed by over 12 dB. Thus, the LNA output noise around the third- and
fifth-order harmonic bands are not down-converted to base band. Thus, a better noise figure is achieved. The
conversion loss of the mixer is approximately –4 dB, (20log10 2 / π).
The mixed current output of the 16 channels must be summed externally; see Figure 75. The external differential
amplifier converts the current signal to differential voltage and can also provide a filtering action for the higher
frequency components in Equation 5. The common-mode voltage at the CW_OUT nodes is 0.9 V. Setting the
output common-mode of the external amplifier to 0.9 V is recommended to avoid common-mode loading. The
amplifier must be able to support the maximum output current of the device, which is 80 mAPP. The amplifier
noise and matching have a direct impact on the I/Q channel performance and therefore must be selected
cautiously. Amplifiers with input-referred voltage noise lower than 2 nV/√Hz can be selected. The OPA1632 and
THS4130 for are recommended as external amplifiers, both of which satisfy the above criteria.
The CW I/Q channels are well-matched internally to suppress image frequency components in the Doppler
spectrum. Use low-tolerance (0.1%) components and precise operational amplifiers to achieve good matching in
the external circuits as well. The circuit illustrated in Figure 75 achieves a first-order filter with a corner frequency
of fC, as given by Equation 6:
1
fC =
2ìp ìRext ì Cext
(6)
The CW path gain (see Figure 75 ) for an in-band signal (frequency less than fC) at one of the channels is given
by the combination of LNA gain, mixer loss, and gain provided by the external amplifier. The LNA gain is 18 dB
and the mixer attenuation is 4 dB. The gain of the external amplifier is determined by the ratio of the external
resistor (Rext) and the internal resistor (500 Ω). The CW gain is given by Equation 7.
R
≈
’
ext
Gain dB =18 - 4 + 20ìlog10
(
)
∆
«
÷
◊
500
(7)
The 3-Ω to 5-Ω resistors shown in Figure 75 create a small loss. Multiple clock options are supported in the
device CW path. Two CW clock inputs are required: an N × ƒcw clock and a 1 × ƒcw clock, where ƒcw is the CW
transmitting frequency and N can be 16, 8, 4, or 1. The most convenient system clock solution can be selected
for the device. In the 16 × ƒcw and 8 × ƒcw modes, the third- and fifth-order harmonic suppression feature is
supported. Thus, the 16 × ƒcw and 8 × ƒcw modes achieve better performance than the 4 × ƒcw and 1 × ƒcw
modes.
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9.3.6.1 16 × ƒcw Mode
The 16 × ƒcw mode achieves the best phase accuracy compared to the other modes. This mode is the default
mode for CW operation. In this mode, 16 × ƒcw and 1 × ƒcw clocks are required. 16 × fcw generates the 16 × ƒcw
LO signals with 16 accurate phases. Multiple devices can be synchronized by the 1 × ƒcw (that is, LO signals in
multiple AFEs can have the same starting phase). The phase noise specification is critical only for the 16X clock.
The 1X clock is for synchronization only and does not require low phase noise.
The top-level clock distribution diagram is shown in Figure 77. Each mixer clock is distributed through a 16 × 16
cross-point switch. The inputs of the cross-point switch are 16 different phases of the 1X clock. Synchronizing the
1 × ƒcw and 16 × ƒcw clocks is recommended; see Figure 78.
INV
fIN 16X Clock
fIN 1X Clock
D
Q
16-Phase Generator
1X Clock
Phase 0º
1X Clock
Phase 22.5º
1X Clock
Phase 292.5º
1X Clock
Phase 315º
1X Clock
Phase 337.5º
SPI
16:16 Crosspoint Switch
Mixer 1
1X Clock
Mixer 2
1X Clock
Mixer 3
1X Clock
Mixer 14
1X Clock
Mixer 15
1X Clock
Mixer 16
1X Clock
Figure 77. CW Clock Distribution Scheme
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CW_CLK1X
CW_CLK_NX
1X Clock
Phase 0°
1X Clock
Phase 22.5°
1X Clock
Phase 67.5°
CW_CLK1X
thold
tset > 4 ns,
thold > 1 ns
CW_CLK_NX
tset
1X Clock
Phase 0
Figure 78. 1X and 16X CW Clock Timing Diagram
The cross-point switch distributes the clocks with an appropriate phase delay to each mixer. The mixer phase
delay is used to compensate for the delay in the input signal. For instance, if a received signal Vi(t) is delayed
with a time of 1 / (16 × fo) (where fo is the input signal frequency in Hz), apply a delayed LO(t) to the mixer in
order to compensate for the 1 / (16 × fo) delay. Thus, a 22.5⁰ delayed clock (that is, 2π / 16) is selected for this
channel. The mathematical calculation is expressed in Equation 8. Therefore, after the I/Q mixers, the phase
delay in the received signals is compensated. The mixer outputs from all channels are aligned and added linearly
to improve the signal-to-noise ratio.
1
Vi(t) = sin[w0 (t -
) +
wdt] = sin[w0t - 22.5è +
wdt]
16 f0
4
1
4
LO(t) = sin[
w0 (t -
)] = sin[w0t - 22.5è]
p
16 f0
p
2
Vo(t) = cos(
w
d t) + f ( nt)
w
p
(8)
Vo(t) represents the demodulated Doppler signal of each channel. When the Doppler signals from N channels
are summed, the signal-to-noise ratio improves. ωd is the Doppler frequency, ωo is the local oscillator frequency,
and ωn represents the high-frequency components that are filtered out.
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9.3.6.2 8 × ƒcw and 4 × ƒcw Modes
The 8 × ƒcw and 4 × ƒcw modes are alternative modes when a higher frequency clock solution (that is, a 16 × ƒcw
clock) is not available in the system. The block diagram of these two modes is shown in Figure 79.
INV
Device
External Amplifier
4X, 8X Clock
I/Q CLK
Generator
D
Q
1X Clock
LNA2 to 16
Summed
In-Phase
In-Phase
CLK
Quadrature
CLK
I/V
I/V
Weight
Weight
LNA1
Weight
Weight
Summed
Quadrature
Figure 79. 8 × ƒcw and 4 × ƒcw Block Diagram
Good phase accuracy and matching are also maintained in these modes. The quadrature clock generator is used
to create in-phase and quadrature clocks with exactly a 90° phase difference. The difference between the 8 × ƒcw
and 4 × ƒcw modes is the accessibility of the third- and fifth-order harmonic suppression filter. In the 8 × ƒcw
mode, the suppression filter can be supported. Although the phases of the 1X clock that can be directly ensured
in the 8 × ƒcw and 4 × ƒcw modes are fewer than in the 16 × ƒcw mode, the intermediate phases can be generated
by appropriate weighting and combination of I- and Q- signals. For example, if a delay of 1 / (16 × fo) or 22.5° is
targeted corresponding to LO(t), the weighting coefficients must follow Equation 9 (assuming Iin and Qin are sin
(ω0t) and cos (ω0t), respectively).
2
p
2
p
1
16 f0
1
I
delayed (t) = Iin cos(- ) + Qin sin(- ) = Iin (t -
16 16
)
2
p
2p
Qdelayed (t) = Qin cos(- ) - Iin sin(- ) = Qin (t -
16 16
)
16 f0
(9)
NOTE
The timing requirements for the 4 × ƒcw clock relative to the 1 × fcw clock are illustrated in
Figure 80. A similar timing requirement (tset and thold) is also applicable for the 8 × ƒcw
clock.
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CW_CLK1X
CW_CLK_NX
1X Clock
Phase 0
1X Clock
Phase 90°
1X Clock
Phase 270°
CW_CLK1X
tset > 4 ns,
thold > 1 ns
thold
CW_CLK_NX
tset
1X Clock
Phase 0
Figure 80. 8 × ƒcw and 4 × ƒcw Timing Diagram
9.3.6.3 1 × ƒcw Mode
The 1 × ƒcw mode requires in-phase and quadrature clocks with low-phase noise specifications. A block diagram
for this mode is shown in Figure 81. Here again, the intermediate phases can be obtained through appropriate
weighting and combining of the I- and Q- signals, as described in the 8 × ƒcw and 4 × ƒcw Modes section.
Device
External Amplifier
Synchronized
I/Q Clocks
LNA2 to 16
Summed
In-Phase
In-Phase
CLK
Quadrature
CLK
I/V
I/V
Weight
Weight
LNA1
Weight
Weight
Summed
Quadrature
Figure 81. 1 × ƒcw Mode Block Diagram
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9.3.6.4 CW Clock Selection
For the CW clocks, the device can accept differential LVDS, LVPECL, and other differential clock inputs as well
as a single-ended CMOS clock. An internally-generated VCM of 1.5 V is applied to CW clock inputs (that is,
CW_CLK_NX and CW_CLK1X). Because this 1.5-V VCM is different from the one used in standard LVDS or
LVPECL clocks, ac coupling is required between clock drivers and the device CW clock inputs. When the CMOS
clock is used, tie CLKM_1X and CLKM_16X either to ground or leave CLKM_1X floating. Common clock
configurations are shown in Figure 82. Appropriate termination is recommended to achieve good signal integrity.
NOTE
The configurations shown in Figure 82 can also be used as a reference for the ADC clock
input.
3.3 V
130 W
83 W
0.1 mF
0.1 mF
3.3 V
130 W
LMK048x,
CDCM7005,
CDCE7010
AFE
Clocks
LVPECL
83 W
(a) LVPECL Configuration
0.1 mF
100 W
AFE
Clocks
CDCE72010
0.1 mF
LVDS
(b) LVDS Configuration
C1
100 nF
0.1 mF
0.1 mF
0.1 mF
R1
50 W
AFE
Clock
Clocks
Source
(c) Transformer-Based Configuration
CMOS CLK
Driver
AFE
CMOS CLK
CMOS
(d) CMOS Configuration
Figure 82. Clock Configurations
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The combination of the clock noise and the CW path noise can degrade CW performance. The internal clocking
circuit is designed for achieving excellent phase noise required by CW operation. The phase noise of the mixer
clock inputs must be better than the phase noise of the CW path.
In the 16, 8, and 4 × ƒcw operation modes, a low-phase noise clock is required for the 16, 8, and 4 × ƒcw clocks
(that is, the CW_CLK_NX ) in order to maintain good CW phase noise performance. The 1 × ƒcw clock is only
used to synchronize multiple device chips and is not used for demodulation. Thus, the 1 × ƒcw clock phase noise
is not a concern. However, in the 1 × ƒcw operation mode, low-phase noise clocks are required for both the
CLKP_16X, CLKM_16X and CLKP_1X, CLKM_1X pins because both pins are used for mixer demodulation. In
general, a higher slew rate clock has lower phase noise. Thus, clocks with high amplitude and fast slew rate are
preferred in CW operation.
Internal to the device, there is a division of the Nx clock (for example, N = 16, 8, or 4) to generate LO(t). A clock
division results in improvement of the phase noise. The phase noise of a divided clock can be improved
approximately by a factor of 20logN dB, where N is the dividing factor of 16, 8, or 4. If the target phase noise of
the mixer LO clock 1 × fcw is 160 dBc/Hz at a 1-kHz off the carrier, the 16 × fcw clock phase noise must be
greater than (160 – 20log16 = 136 dBc/Hz). TI’s jitter cleaners (LMK048x, CDCM7005, and CDCE72010) exceed
this requirement and can be selected to work with the device. In the 4X and 1X modes, higher-quality input
clocks are expected to achieve the same performance because N is smaller. Thus, the 16X mode is a preferred
mode because this mode reduces the phase noise requirement for the system clock design.
Note that in the 16X operation mode, the CW operation range is limited to 8 MHz as a result of the 16X clock.
The maximum clock frequency for the 16X clock is 128 MHz. In the 8X, 4X, and 1X modes, higher CW signal
frequencies up to 15 MHz can be supported with a degradation in performance. For example, the phase noise is
degraded by 9 dB at 15 MHz, compared to 2 MHz.
As the channel number in a system increases, clock distribution becomes more complex. Using one clock driver
output is not preferred to drive multiple AFEs because the clock buffer load capacitance increases by a factor of
N (N is the number of AFEs in a system). See the System Clock Configuration for Multiple Devices section for
further details of the system clock configuration. When clock phase noise is not a concern (for example, the 1 ×
ƒcw clock in the 16, 8, and 4 × ƒcw operation modes), one clock driver output can excite more than one device.
Nevertheless, special considerations must be applied for such a clock distribution network design. Preferably, all
clocks are generated from the same clock source in typical ultrasound systems (such as 16 × ƒcw and 1 × ƒcw
clocks, audio ADC clocks, RF ADC clocks, pulse repetition frequency signals, frame clocks, and so on). By using
the same clock source, interference resulting from clock asynchronization can be minimized.
9.3.6.5 CW Supporting Circuits
As a general practice in the CW circuit design, in-phase and quadrature channels must be strictly symmetrical by
using well-matched layout and high-accuracy components. Additional high-pass wall filters (20 Hz to 500 Hz) and
low-pass audio filters (10 kHz to 100 kHz) with multiple poles are usually required in ultrasound systems. Noise
under this range is critical because the CW Doppler signal ranges from 20 Hz to 20 kHz. Consequently, low-
noise audio operational amplifiers are suitable to build these active filters for CW post-processing (that is, the
OPA1632, OPA2211, or THS4131). More filter design techniques can be found at www.ti.com. The TI active filter
design tool is the WEBENCH® Filter Designer. The filtered audio CW I/Q signals are sampled by audio ADCs
and processed by the DSP or PC. Although the CW signal frequency is from 20 Hz to 20 KHz, higher sampling-
rate ADCs are still preferred for further decimation and SNR enhancement. Because of the large dynamic range
of CW signals, high-resolution ADCs (≥ 16 bits) are required [such as the ADS8413 (2 MSPS, 16 bits, 92-dBFS
SNR) and the ADS8472 (1 MSPS, 16 bits, 95-dBFS SNR)]. ADCs for in-phase and quadrature-phase channels
must be strictly matched, not only for amplitude matching but also for phase matching in order to achieve the
best I/Q matching. In addition, the in-phase and quadrature ADC channels must be sampled simultaneously.
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9.3.7 Analog-to-Digital Converter (ADC)
The device supports a high-performance, 14-bit ADC that achieves 72-dBFS SNR. This ADC ensures excellent
SNR at low-chain gain. The ADC can operate at maximum speeds of 65 MSPS and 80 MSPS, providing a 14-bit
and a 12-bit output, respectively. The low-voltage differential signaling (LVDS) outputs of the ADC enable a
flexible system integration that is desirable for miniaturized systems. In the following sections, a full description of
all inputs and outputs of the ADC with different configurations are provided along with suitable examples.
NOTE
The ADC is part of the TGC signal chain. An ADC is not used in CW mode and can be
powered down in this mode using the appropriate register controls.
9.3.7.1 System Clock Input
The 16 channels on the device operate from a single clock input. To ensure that the aperture delay and jitter are
the same for all channels, the device uses a clock tree network to generate individual sampling clocks for each
channel. The clock lines for all channels are matched from the source point to the sampling circuit for each of the
16 internal ADCs. The delay variation is described by the aperture delay parameter of the Output Interface
Timing Characteristics table. Variation over time is described by the aperture jitter parameter of the Output
Interface Timing Characteristics table.
This system clock input can be driven differentially (sine wave, LVPECL, or LVDS) or single-ended (LVCMOS).
The device clock input has an internal buffer and clock amplifier (as shown in Figure 83) that are enabled or
disabled automatically, depending on the type of clock provided (auto-detect feature).
AVDD_1P8
0.7 V
VCM
100 pF
5 kQ
5 kQ
CLKP
6 pF
6 pF
CLKM
Figure 83. Internal Clock Buffer for Differential Clock Mode
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If the preferred clocking scheme for the device is single-ended, connect the single-ended clock to ADC_CLKP
and connect the ADC_CLKM pin to ground (in other words, short ADC_CLKM directly to AVSS, as shown in
Figure 84). In this case, the auto-detect feature shuts down the internal clock buffer and the device automatically
goes into a single-ended clock mode. Connect the single-ended clock source directly (without decoupling) to the
ADC_CLKP pin. Low-jitter, square signals (LVCMOS levels, 1.8-V amplitude) are recommended to drive the ADC
in single-ended clock mode (refer to technical brief SLYT075 for further details).
CMOS Clock Input
ADC_CLKP
ADC_CLKM
Figure 84. Single-Ended Clock Driving Circuit
For single-ended sinusoidal clocks, or for differential clocks (such as differential sine wave, LVPECL, LVDS, and
so forth), enable the clock amplifier with the connection scheme shown in Figure 85. The 10-nF capacitor used to
ac-couple the clock input is as shown in Figure 85.
If a transformer is used with the secondary coil floating (for instance, to convert from single-ended to differential),
the transformer can be connected directly to the clock inputs without requiring the 10-nF series capacitors,
provided that center tap of the transformer is either floating or ac-grounded.
10 nF
ADC_CLKP
Differential Sine Wave
or PECL or LVDS Clock Signal
10 nF
ADC_CLKM
Figure 85. Differential Clock Driving Circuit
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9.3.7.2 System Clock Configuration for Multiple Devices
To ensure that the aperture delay and jitter are the same for all channels, the device uses a clock tree network to
generate individual sampling clocks for each channel. For all channels, the clock is matched from the source
point to the sampling circuit of each of the eight internal devices. The variation on this delay is described in the
Aperture Delay parameter of the Output Interface Timing Characteristics table. Variation is described by the
aperture jitter parameter of the Output Interface Timing Characteristics table.
Figure 86 shows a clock distribution network.
FPGA Clock,
Noisy Clock
n × (5-MHz to 80-MHz)
TI Jitter Cleaner
LMK048X
CDCE72010
CDCM7005
5-MHz to 80-MHz
ADC CLK
CDCLVP1208
The CDCE72010 has 10
LMK0030X
outputs
LMK01000
8 Synchronized
DUT System CLKs
Figure 86. System Clock Distribution Network
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9.3.8 LVDS Interface
The device supports an LVDS output interface in order to transfer device digital data serially to an FPGA. The
device has a total of 18 LVDS output lines. One of these pairs is a serial data clock, another pair is a data
framing clock, and the remaining 16 pairs are dedicated for data transfer. A graphical representation of the LVDS
output is shown in Figure 87.
LVDS Buffer
DOUTP1
DOUTM1
DOUTP2
DOUTM2
Digital Output
DOUTP16
DOUTM16
DCLKP
Serial Clock
DCLKM
FCLKP
Frame Clock
FCLKM
Figure 87. LVDS Output
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9.3.8.1 LVDS Buffer
The equivalent circuit of each LVDS output buffer is shown in Figure 88. The buffer is designed for a normal
output impedance of 100 Ω (ROUT). Terminate the differential outputs at the receiver end by a 100-Ω termination.
The buffer output impedance functions like a source-side series termination. By absorbing reflections from the
receiver end, the buffer output impedance helps improve signal integrity. Note that this internal termination
cannot be disabled nor can its value be changed.
Device
OUTP
+0.4 V
External
100-ꢀ Load
OUTM
ROUT
1.03 V
-0.4 V
Switch impedance is
nominally 50 ꢀ (ê10%).
Figure 88. LVDS Output Circuit
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9.3.8.2 LVDS Data Rate Modes
The LVDS interface supports two data rate modes, as described in this section.
9.3.8.2.1 1X Data Rate Mode
In 1X data rate mode, each LVDS output carries data from a single ADC. Figure 89 and Figure 90 show the
output data, serial clock, and frame clock LVDS lines for the 14-bit and 12-bit 1X mode, respectively.
Input Signal
Sample N
TA
Cd Clock
Cycles Latency
Input Clock (ADC_CLK)
Frequency = fCLKIN
T
tPDI
Frame Clock (FCLK)
Frequency = fCLKIN
Bit Clock (DCLK)
Frequency = 7 x fCLKIN
Output Data (DOUT)
Data Rate = 14 x fCLKIN
1
0
13
(0)
12
(1)
11
(2)
10
(3)
9
(4)
8
(5)
7
(6)
6
(7)
5
(8)
4
3
2
1
0
13
(0)
12
(1)
11
(2)
10
(3)
9
(4)
8
(5)
7
(6)
6
(7)
5
(8)
4
3
2
1
0
13
12
(1)
11
(2)
10
(3)
9
(4)
8
(5)
7
(6)
6
(7)
5
(8)
4
3
2
1
0
13
(0)
1
(
(12) (13)
(9) (10) (11) (12) (13)
(9) (10) (11) (12) (13) (0)
(9) (10) (11) (12) (13)
Sample N-1
Sample N
Data Bit in MSB-First Mode
Data Bit in LSB-First Mode
13
(0)
(1) K = ADC resolution.
Figure 89. 14-Bit, 1X Data Rate Output Timing Specification
Sample N
Input Signal
TA
Cd Clock Cycles Latency
Input Clock (ADC_CLK)
Frequency = fCLKIN
tPDI
T
Frame Clock (FCLK)
Frequency = fCLKIN
Bit Clock (DCLK)
Frequency = 6 x fCLKIN
Output Data (DOUT)
Data Rate = 12 x fCLKIN
1
(10)
0
(11)
11
(0)
10
(1)
9
(2)
8
(3)
7
(4)
6
(5)
5
(6)
4
(7)
3
(8)
2
(9)
1
(10)
0
(11)
11
(0)
10
(1)
9
(2)
8
(3)
7
(4)
6
(5)
5
(6)
4
(7)
3
(8)
2
(9)
1
(10)
0
(11)
11
(0)
10
(1)
9
(2)
8
(3)
7
(4)
6
(5)
5
(6)
4
(7)
3
(8)
2
(9)
1
(10)
0
(11)
11
(0)
10
(1)
Sample N-1
Sample N
Sample N+1
Data Bit in MSB-First Mode
Data Bit in LSB-First Mode
1
(10)
Figure 90. 12-Bit, 1X Data Rate Output Timing Specification
9.3.8.2.2 2X Data Rate Mode
In 2X data rate mode, only half of the LVDS lines are used to transfer data. Thus, this mode is useful for saving
power when lower sampling frequency ranges permit. This mode is enabled with the LVDS_RATE_2X register bit
(register 1, bit 14). After enabling this mode, the digital data from two ADCs are transmitted with a single LVDS
lane. When compared to the 1X data rate mode, the 2X data rate mode serial clock frequency is doubled, but the
frame clock frequency remains the same (for the same serialization factor and ADC resolution).
When the frame clock is high, data on DOUT1 correspond to channel 1, data on DOUT2 correspond to channel
3, and so forth. When the frame clock is low, DOUT1 transmits channel 2 data, DOUT2 transmits channel 4 data,
and so forth.
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Figure 91 and Figure 92 show a timing diagram for the 14-bit and 12-bit 2X mode, respectively. Channel and
LVDS data line mapping for this mode are listed in Table 14. Note that idle LVDS lines are not powered down by
default. To save power, these lines can be powered down using the corresponding power-down bits
(PDN_LVDSx).
Input Signal
Sample N
TA
tPDI
Input Clock (ADC_CLK)
Frequency = fCLKIN
T
Frame Clock (FCLK)
Frequency = fCLKIN
Bit Clock (DCLK)
Frequency = 14 x fCLKIN
Output Data (DOUT)
Data Rate = 28 x fCLKIN
11
(2)
4
(8)
3
(9)
2
1
0
13
(0)
12
(1)
11
(2)
10
(3)
9
(4)
8
(5)
7
(6)
6
(7)
5
(8)
4
3
2
1
0
13
(0)
12
(1)
11
(2)
10
(3)
9
(4)
8
(5)
7
(6)
6
(7)
5
(8)
4
3
2
1
0
13
12
(1)
11
(2)
10
(3)
9
(4)
8
(5)
7
(6)
6
(7)
5
(8)
4
3
2
1
0
13
(0)
12
(1)
(10) (12) (13)
(9) (10) (11) (12) (13)
(9) (10) (11) (12) (13) (0)
(9) (10) (11) (12) (13)
ADC first channel, Sample N+1
ADC second channel, Sample N
ADC first channel, Sample N
Data Bit in MSB-First Mode
Data Bit in LSB-First Mode
13
(0)
Figure 91. 14-Bit, 2X Data Rate Output Timing Specification
Input Signal
Sample N
TA
tPDI
Input Clock (ADC_CLK)
Frequency = fCLKIN
T
Frame Clock (FCLK)
Frequency = fCLKIN
Bit Clock (DCLK)
Frequency = 12 x fCLKIN
Output Data (DOUT)
Data Rate = 24 x fCLKIN
4
(7)
3
(8)
8
(3)
8
(3)
7
(4)
1
0
11
(0)
10
(1)
9
(2)
8
(3)
7
(4)
6
(5)
5
(6)
4
(7)
3
(8)
2
1
0
11
10
(1)
9
(2)
7
(4)
6
(5)
5
(6)
4
(7)
3
(8)
2
1
0
11
10
(1)
9
(2)
7
(4)
6
(5)
5
(6)
4
(7)
3
(8)
2
1
0
11
10
(1)
2
(9)
(10) (11)
(9) (10) (11) (0)
(9) (10) (11) (0)
(9) (10) (11) (0)
ADC first channel, Sample N
Data Bit in MSB-First Mode
Data Bit in LSB-First Mode
ADC second channel, Sample N
ADC first channel, Sample N+1
1
(10)
Figure 92. 12-Bit, 2X Data Rate Output Timing Specification
Table 14 illustrates which LVDS output lines are active in 2X data rate mode. The idle channels can be powered
down using appropriate register controls.
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Table 14. Channel and ADC Data Line Mapping (2X Rate)
CHANNELS
DOUT1
MAPPING
ADC data for channels 1 and 2
DOUT2
ADC data for channels 3 and 4
DOUT3
ADC data for channels 5 and 6
DOUT4
ADC data for channels 7 and 8
DOUT5
Idle
DOUT6
Idle
DOUT7
Idle
DOUT8
Idle
DOUT9
ADC data for channels 9 and 10
DOUT10
DOUT11
DOUT12
DOUT13
DOUT14
DOUT15
DOUT16
ADC data for channels 11 and 12
ADC data for channels 13 and 14
ADC data for channels 15 and 16
Idle
Idle
Idle
Idle
9.3.9 ADC Register, Digital Processing Description
The ADC has extensive digital processing functionalities that can be used to enhance ADC output performance.
The digital processing blocks are arranged as shown in Figure 93.
ADC 2
Output
Digital Test Patterns
8b, 10b, 12b, 14b
Final
MUX
Digital
Output
ADC1
Output
Digital Average
Default = No
Digital Gain
Default = 0
Digital HPF
Default = No
8b, 10b, 12b, 14b
Digital Offset
Default = No
Figure 93. ADC Digital Block Diagram
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9.3.9.1 Digital Offset
Digital functionality provides for channel offset correction. Setting the DIG_OFFSET_EN bit to 1 enables the
subtraction of the offset value from the ADC output. There are two offset correction modes, as shown in
Figure 94.
DIG_OFFSET_EN
0
Data Output,
Bits 13-0
Bits 13-0
MUX
(0s appended as LSBs when in 12-bit resolutions.)
Analog
Inputs
ADCx
+
1
-
AUTO_OFFSET_REMOVAL_
ACC_CYCLES
OFFSET_REMOVAL_SELF
(Register 4, Bit 15)
(Register 4, Bits 12-9)
OFFSET_REMOVAL_START_SEL
(Register 4, Bit 14)
Bits
29-0
OFFSET_REMOVAL_
Truncation and
Rounding Data
Bits
Bits 13-0
1
START_MANUAL
(Register 4, Bit 13)
0
Accumulator
Start
MUX
MUX
1
TX_TRIG Pin
Bits 9-0
0
Extending Sign
Bit to 14 Bits
OFFSET_CHx
Bits 13-0
Figure 94. Digital Offset Correction Block Diagram
9.3.9.1.1 Manual Offset Correction
If the channel offset is known, the appropriate value can be written in the OFFSET_CHx register for channel x.
The offset value programmed in the OFFSET_CHx register subtracts out from the ADC output. The offset of
each of the 16 ADC output channels can be independently programmed. The same offset value must be
programmed into two adjacent offset registers. For instance, when programming the channel 1 offset value
0000011101, write the same offset value of 0000011101 in registers 13 (bits 9-0) and 14 (bits 9-0). The offset
values are to be written in twos complement format.
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9.3.9.1.2 Auto Offset Correction Mode (Offset Correction using a Built-In Offset Calculation Function)
The auto offset calculation module can be used to calculate the channel offset that is then subtracted from the
ADC output. To enable the auto offset correction mode, set the OFFSET_REMOVAL_SELF bit to 0.
In auto offset correction mode, the dc component of the ADC output (assumed to be the channel offset) is
estimated using a digital accumulator. The ADC output sample set used by the accumulator is determined by a
start time or by the first sample and number of samples to be used. Figure 94 illustrates the options available to
determine the accumulator sample set.
A
high pulse on the TX_TRIG pin or setting the
OFFSET_REMOVAL_START_MANUAL register can be used to determine the accumulator first sample. To set
the number of samples, the AUTO_OFFSET_REMOVAL_ACC_CYCLES register (bits 12-9) must be
programmed according to Table 15.
If a pulse on the TX_TRIG pin is used to set the first sample, additional flexibility in setting the first sample is
provided. A programmable delay between the TX_TRIG pulse and first sample can be set by writing to the
OFFSET_CORR_DELAY_FROM_TX_TRIG register.
The determined offset value can be read out channel-wise. Set the channel number in the
AUTO_OFFSET_REMOVAL_VAL_RD_CH_SEL register and read the offset value for the corresponding channel
in the AUTO_OFFSET_REMOVAL_VAL_RD register.
Table 15. Auto Offset Removal Accumulator Cycles
NUMBER OF SAMPLES USED FOR OFFSET VALUE
AUTO_OFFSET_REMOVAL_ACC_CYCLES (Bits 3-0)
EVALUATION
0
2047
127
1
2
255
3
511
4
1023
2047
4095
8191
16383
32767
65535
5
6
7
8
9
10 to 15
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9.3.9.2 Digital Average
The signal-to-noise ratio (SNR) of the signal chain can be improved by providing the same input signal to two
channels and averaging their output digitally. To enable averaging, set the AVG_EN register bit (register 2, bit
11). The way that data are transmitted on the digital output lines in this mode is described in Table 16.
Table 16. Channel and ADC Data Line Mapping (Averaging Enabled)
CHANNELS
DOUT1
MAPPING
Average of channels 1 and 2
DOUT2
Average of channels 3 and 4
DOUT3
Average of channels 5 and 6(1)
DOUT4
Average of channels 7 and 8(1)
DOUT5
Idle
DOUT6
Idle
DOUT7
Idle
DOUT8
Idle
DOUT9
Average of channels 9 and 10
DOUT10
DOUT11
DOUT12
DOUT13
DOUT14
DOUT15
DOUT16
Average of channels 11 and 12
Average of channels 13 and 14(1)
Average of channels 15 and 16(1)
Idle
Idle
Idle
Idle
(1) Idle when AVG_EN = 1 and when the LVDS data rate is set to 2X mode.
NOTE
Idle LVDS lines are not powered down by default. To save power, these lines can be
powered down using the corresponding power-down bits (PDN_LVDSx).
The serialization factor must be greater than the ADC resolution to obtain SNR
improvement after averaging in 12b resolution.
9.3.9.3 Digital Gain
To enable the digital gain block, set DIG_GAIN_EN (register 3, bit 12) to 1. When enabled, the gain value for
channel x (where x is from 1 to 16) can be set with the 4-bit register control for the corresponding channel
(GAIN_CHx). Gain is given as (0 dB + 0.2 dB × GAIN CHx). For instance, if GAIN_CH5 = 3 (decimal equivalent
of the 4-bit word), then channel 5 is increased by a 0.6-dB gain. GAIN_CHx = 31 produces the same effect as
GAIN_CHx = 30, which sets the gain of channel x to 6 dB.
9.3.9.4 Digital HPF
To enable the digital high-pass filter (HPF) of channels 1 to 4, 5 to 8, 9 to 12, and 13 to 16, set the
DIG_HPF_EN_CH1-4,
respectively.
DIG_HPF_EN_CH5-8,
DIG_HPF_EN_CH9-12,
and
DIG_HPF_EN_CH13-16,
The HPF_CORNER_CHxy register bits (where xy are 1-4, 5-8, 9-12, or 13-16) control the characteristics of a
digital high-pass transfer function applied to the output data, based on Equation 10. These bits correspond to bits
4-1 in registers 21, 33, 45, and 57, respectively (these register settings describe the value of K). The valid values
of K are 2 to 10. The digital HPF can be used to suppress low-frequency noise. Table 17 describes the cutoff
frequency versus K.
2k
Y(n) =
[x(n) - x(n - 1) + y(n - 1)]
2k + 1
(10)
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Table 17. Digital HPF, –1-dB Corner Frequency versus K and fS
CORNER FREQUENCY (kHz)
CORNER FREQUENCY (k)
(HPF_CORNER_CHxy Register)
fS = 40 MSPS
fS = 50 MSPS
fS = 65 MSPS
2
3
2780
1490
738
369
185
111
49
3480
1860
230
461
230
138
61
4520
2420
1200
600
300
180
80
4
5
6
7
8
9
25
30
40
10
12.
15
20
The HPF output is mapped to the ADC resolution bits either by truncation or a round-off operation. By default,
the HPF output is truncated to map to the ADC resolution. To enable the rounding operation to map the HPF
output to the ADC resolution, set the HPF_ROUND_EN_CH1-8 and HPF_ROUND_EN_CH9-16 bits to 1.
9.3.9.5 LVDS Synchronization Operation
Different test patterns can be synchronized on the LVDS serialized output lines to help set and program the
FPGA timing that receives the LVDS serial output. Of these test patterns, the ramp, toggle, and pseudo-random
sequence (PRBS) test patterns can be reset or synchronized by providing a synchronization pulse on the
TX_TRIG pin or by setting and resetting a specific register bit. The synchronization pulse on the TX_TRIG pin
must meet the setup and hold time constraints with respect to the system clock, as shown in Figure 95.
Parameter values are listed in the Output Interface Timing Requirements table.
tTX_TRIG_DEL
TX_TRIG
tSU_TX_TRIGD
tH_TX_TRIGD
tH_TX_TRIGD
TX_TRIGD
(Internal signal latched by
System clock rising edge)
System Clock
Figure 95. Setup and Hold Time Constraint for the TX_TRIG Signal
ADC data may be corrupted for four to six clocks immediately after applying TX_TRIG. The phase reset from
TX_TRIG can be disabled using MASK_TX_TRIG.
9.3.10 Power Management
Power management plays a critical role to extend battery life and to ensure a long operation time. The device
has a fast and flexible power-up and power-down control that can maximize battery life. The device can be either
powered down or up through external pins or internal registers.
This section describes the functionality of different power-down pins and register bits available in the device. The
device can be divided in two major blocks: the VCA and ADC; see Figure 96 and Figure 97.
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VCM
BIAS_2P5
BAND_GAP
LNA_INCM
SRC_BIAS
Reference Voltage,
Current Generator
hne /ꢀannel .lock
TR_EN<1>
INP1
INP_SOURCE
!ttenuator
LPF
10, 15,
LNA
with
10 nF
+
œ
HPF
20, 25 MHz
INM1
TGC Control
CW
Mixer
10 nF
CW_CH1
CW_CLOCK
16X16 Cross
Point SW
INP2
TR_EN<1>
INP_SOURCE
!ttenuator
LPF
10, 15,
LNA
with
10 nF
+
œ
HPF
20, 25 MHz
INM2
TGC Control
CW
Mixer
10 nF
CW_CH2
CW_CLOCK
16X16 Cross
Point SW
INP_SOURCE
TR_EN<4>
INP16
!ttenuator
LPF
10, 15,
LNA
with
10 nF
+
œ
HPF
20, 25 MHz
INM16
TGC Control
CW
Mixer
10 nF
CW_CH16
CW_CLOCK
16X16 Cross
Point SW
TR_EN<1>
TR_EN<2>
TR_EN<3>
TR_EN<4>
TR_EN<1>
TR_EN<2>
TR_EN<3>
TR_EN<4>
TGC Control
CW_CLOCK
TGC Control
Engine
CLKP_16x
Serial Interface
SDOUT
CLKM_16x
16 Phase
Generator
CLKP_1x
CLKM_1x
CW_IP_OUTP,
CW_IP_OUTM,
CW_QP_OUTP,
CW_QP_OUTM
Figure 96. VCA Block Diagram
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Reference Voltage,
Current Generator
Band-Gap Circuit
VCM
ADC1
LVDS Data
Serializer and
Buffer
DOUTP1
DOUTM1
ADC Analog
ADC Digital
LVDS Data
Serializer and
Buffer
DOUTP2
DOUTM2
ADC Analog
ADC Digital
ADC2
VCA Output
ADC16
LVDS Outputs
LVDS Data
Serializer and
Buffer
DOUTP16
DOUTM16
ADC Analog
ADC Digital
FCLKP
FCLKM
LVDS Frame,
Clock
Serializer, and
Buffer
DCLKP
DCLKM
PLL
Serial
Interface
SDOUT
ADC Clock
Buffer
Figure 97. ADC Block Diagram
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9.3.10.1 Voltage-Controlled Attenuator (VCA) Power Management
The VCA consists of the following blocks:
•
•
•
•
Band-gap circuit,
Serial interface,
Reference voltage and current generator,
A total of 16 channel blocks (each channel block includes an attenuator, LNA, LPF, CW mixer, and a 16 × 16
cross-point switch),
•
•
TGC control engine, and
Phase generator for CW mode.
Of these VCA blocks, the band-gap, attenuator, and serial interface block cannot be powered down by using
power-down pins or bits. Table 18 lists all the VCA blocks that are powered down using various pin and bit
settings.
Table 18. VCA Power-Down Mode Descriptions
16 × 16
CROSS-
POINT
TYPE
(Pin or
Register)
TGC
CONTROL
ENGINE
CW
MIXER
PHASE
GENERATOR
NAME
LNA
LPF
REFERENCE
CHANNEL
SWITCH
PDN_GBL
GBL_PDWN
PDN_FAST
FAST_PDWN
PDCHxx
Pin
Yes(1)
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
No
Yes
Yes
No
Yes
Yes
Yes
Yes
No
All(2)
All
Register
Pin
All
Register
Register
Register
No
No
All
No
No
Individual
All
PDWN_LNA
No
No
No
PDWN_
FILTER
Register
No
Yes
No
No
No
No
No
All
(1) Yes = powered down; no = active.
(2) All = all channels are powered down; individual = only a single channel is powered down, depending upon the corresponding bit.
If more than one bit is simultaneously enabled, then all blocks listed as Yes for each bit setting are powered
down.
9.3.10.2 Analog-to-Digital Converter (ADC) Power Management
The ADC consists of the following blocks:
•
•
•
•
•
Band-gap circuit,
Serial interface,
Reference voltage and current generator,
ADC analog block that performs a sampling and conversion,
ADC digital block that includes all the digital post processing blocks (such as the offset, gain, digital HPF, and
so forth),
•
•
•
LVDS data serializer and buffer that converts the ADC parallel data to a serial stream,
LVDS frame and clock serializer and buffer, and
PLL (phase-locked loop) that generates a high-frequency clock for both the ADC and serializer.
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Of all these blocks, only the band-gap and serial interface block cannot be powered down using power-down pins
or bits. Table 19 lists which blocks in the ADC are powered down using different pins and bits.
Table 19. Power-Down Modes Description for the ADC
LVDS FRAME
LVDS DATA
SERIALIZER,
BUFFER
REFERENCE +
ADC CLOCK
BUFFER
TYPE (Pin or
Register)
ADC
ANALOG
ADC
DIGITAL
AND CLOCK
SERIALIZER,
BUFFER
NAME
PLL
CHANNEL
PDN_GBL
GLOBAL_PDN
PDN_FAST
Pin
Yes(1)
Yes
Yes
No
Yes
Yes
Yes
No
Yes
Yes
Yes
Yes
No
Yes
Yes
No
Yes
Yes
No
No
No
No
No
Yes
Yes
No
No
No
No
No
All(2)
All
Register
Pin
All
DIS_LVDS
Register
Register
Register
Register
Yes
No
All
PDN_ANA_CHx
PDN_DIG_CHx
PDN_LVDSx
Yes
No
No
Individual
Individual
Individual
Yes
No
No
No
No
Yes
No
(1) Yes = powered down; no = active.
(2) All = all channels are powered down; individual = only a single channel is powered down, depending upon the corresponding bit.
9.4 Device Functional Modes
9.4.1 ADC Test Pattern Mode
9.4.1.1 Test Patterns
9.4.1.1.1 LVDS Test Pattern Mode
The ADC data coming out of the LVDS outputs can be replaced by different kinds of test patterns. The different
test patterns are described in 表 20.
表 20. Description of LVDS Test Patterns
PROGRAMMING THE MODE
TEST
THE PATTERN IS SELECTIVELY
PATTERN
MODE
THE SAME PATTERN MUST BE COMMON
TO ALL DATA LINES (DOUT)
REQUIRED ON ONE OR MORE DATA
LINE (DOUT)
TEST PATTERNS
REPLACE(1)
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
Zeros in all bits
(00000000000000)
All 0s
Set the mode using PAT_MODES[2:0]
Set the mode using PAT_MODES[2:0]
Set the mode using PAT_MODES[2:0]
Set the mode using PAT_MODES[2:0]
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
Ones in all bits
(11111111111111)
All 1s
Deskew
Sync
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
The ADC data is replaced by
alternate 0s and 1s
(01010101010101)
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
ADC data are replaced by
half 1s and half 0s
(11111110000000)
The word written in the
CUSTOM_PATTERN control
(taken from the MSB side)
replaces ADC data.
Set the mode using PAT_MODES[2:0]. Set
the desired custom pattern using the
CUSTOM_PATTERN register control.
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
(For instance,
Custom
CUSTOM_PATTERN =
1100101101011100 and
ADC data =
11001011010111 when the
serialization factor is 14.)
(1) Shown for a serialization factor of 14.
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Device Functional Modes (接下页)
表 20. Description of LVDS Test Patterns (接下页)
PROGRAMMING THE MODE
TEST
PATTERN
MODE
THE PATTERN IS SELECTIVELY
THE SAME PATTERN MUST BE COMMON
TO ALL DATA LINES (DOUT)
REQUIRED ON ONE OR MORE DATA
LINE (DOUT)
TEST PATTERNS
REPLACE(1)
The ADC data are replaced
by a word that increments by
1 LSB every conversion clock
starting at negative full-scale,
increments until positive full-
scale, and wraps back to
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
Ramp
Set the mode using PAT_MODES[2:0]
negative full-scale. Step size
of RAMP pattern is function
of ADC resolution (N) and
serialization factor (S) and
given by 2(S-N)
.
The ADC data alternate
between two words that are
all 1s and all 0s. At each
setting of the toggle pattern,
the start word can either be
all 0s or all 1s. (Alternate
between 11111111111111
and 00000000000000.)
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
Toggle
PRBS
Set the mode using PAT_MODES[2:0]
Set PAT_SELECT_IND = 1. Select either
custom or ramp pattern with
PAT_LVDSx[2:0]. Enable PRBS mode on
Set SEL_PRBS_PAT_GBL = 1. Select either
custom or ramp pattern with
PAT_MODES[2:0]. Enable PRBS mode
using PRBS_EN. Select the desired PRBS
mode using PRBS_MODE. Reset the PRBS
generator with PRBS_SYNC.
A 16-bit pattern is generated
by a 23-bit (or 9-bit) PRBS
DOUTx with the PAT_PRBS_LVDSx control. pattern generator (taken from
Select the desired PRBS mode using
PRBS_MODE. Reset the PRBS generator
with PRBS_SYNC.
the MSB side) and replaces
the ADC data.
All patterns listed in 表 20 (except the PRBS pattern) can also be forced on the frame clock output line by using
PAT_MODES_FCLK[2:0]. To force a PRBS pattern on the frame clock, use the SEL_PRBS_PAT_FCLK,
PRBS_EN, and PAT_MODES_FCLK register controls.
The ramp, toggle, and pseudo-random sequence (PRBS) test patterns can be reset or synchronized by providing
a synchronization pulse on the TX_TRIG pin or by setting and resetting a specific register bit. A block diagram for
the test patterns is provided in 图 98.
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PAT_MODES[2:0]
PAT_MODES[2:0]
Global
Pattern
ADC1
0
1
PAT_SELECT_IND
0
DOUTP1,
DOUTM1
Serializer
1
0
1
Individual
Pattern for
LVDS1
PAT_LVDS1[2:0]
ADC16
0
1
PAT_SELECT_IND
0
DOUTP16,
DOUTM16
Serializer
1
0
1
Individual
Pattern for
LVDS16
PAT_LVDS16[2:0]
图 98. Test Pattern Block Diagram
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9.4.2 Partial Power-Up and Power-Down Mode
The partial power-up and power-down mode is also called fast power-up and power-down mode. The VCA can
be programmed in partial power-down mode either by setting the PDN_FAST pin high or setting the
FAST_PDWN register bit to 1. Similarly, the ADC can be programmed in this mode by setting the PDN_FAST pin
high. In this mode, many blocks in the signal path are powered down. However, the internal reference circuits,
LVDS frame, and data clock buffers remain active. The partial power-down function allows the device to quickly
wake-up from a low-power state. This configuration ensures that the external capacitors are discharged slowly;
thus, a minimum wake-up time is required as long as the charges on these capacitors are restored. The longest
wake-up time depends on the capacitors connected at INP and INM, because the wake-up time is the time
required to recharge the capacitors to the desired operating voltages. For larger capacitors, this time is longer.
The ADC wake-up time is approximately 1 μs. Thus, the device wake-up time is more dependent on the VCA
wake-up time with the assumption that the ADC clock is running for at least 50 μs before the normal operating
mode resumes. The power-down time is instantaneous, less than 2 μs. This fast wake-up response is desired for
portable ultrasound applications where power savings is critical. The pulse repetition frequency (PRF) of an
ultrasound system can vary from 50 kHz to 500 Hz, and the imaging depth (that is, the active period for a receive
path) varies from tens of µs to hundreds of μs. The power savings can be quite significant when a system PRF is
low. In some cases, only the VCA is powered down when the ADC runs normally to ensure minimal interference
to the FPGAs; see the Electrical Characteristics: TGC Mode table to determine device power dissipation in partial
power-down mode.
The AFE uses PLLs that generate the high speed clock for the interfaces. Switching activity on the PDN_FAST
pin can possibly result in disturbance to the PLL operation because of board-level coupling mechanisms. Such a
disturbance can result in a loss of synchronization at the FPGA and may require re-synchronization on
resumption of normal operation.
9.4.3 Global Power-Down Mode
To achieve the lowest power dissipation, the device can be placed into a complete power-down mode. This
mode is controlled through the GBL_PDWN (for the VCA) or GLOBAL_PDN (for the ADC) registers or the
PDN_GBL pin (for both the VCA and ADC). In complete power-down mode, all circuits (including reference
circuits within the device) are powered down and the capacitors connected to the device are discharged. The
wake-up time depends on the time that the device spends in shutdown mode. A 0.01-μF capacitor at INP without
a capacitor at INM provides a wake-up time of approximately 1 ms.
9.4.4 TGC Configuration
By default, the VCA is configured in TGC mode after reset. Depending upon the system requirements, the device
can be programmed in a suitable power mode using the MEDIUM_POW (register 206, bit 14) and LOW_POW
(register 200, bit 12) register bits.
9.4.5 Digital TGC Test Modes
The available test mode bits in the TGC engine are: ENABLE_INT_START, NEXT_CYCLE_WAIT_TIME,
MANUAL_START, FLIP_ATTEN, and DIS_ATTEN.
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9.4.5.1 ENABLE_INT_START and NEXT_CYCLE_WAIT_TIME
In internal non-uniform digital TGC mode, the device gain starts changing after the TGC_SLOPE pin level goes
high. Instead of applying a signal on the TGC_SLOPE pin, the device generates a signal to start the device gain.
To generate a signal internally, set the ENABLE_INT_START bit (register 181, bit 14) to 1. When a complete
cycle of the gain curve completes and the device gain returns to the start gain stage, the next start pulse is
generated after the NEXT_CYCLE_WAIT_TIME (register 183, bits 15-0) number of ADC clock cycles, as shown
in 图 99.
Stop_Gain_Time
Stop Gain
Positive Step
Negative Step
Start Gain
Time
Wait_Time
Pulse Generated
in Device
NEXT_CYCLE_WAIT_TIME
图 99. Internal Non-Uniform Test Mode
9.4.5.2 MANUAL_START
In up, down ramp mode and internal non-uniform mode, a single TGC start pulse provided on the TGC_SLOPE
pin can be generated by the device when the MANUAL_START bit is enabled. In up, down ramp mode, the
MANUAL_START bit also generates a pulse that performs the same functionality that applying a pulse on the
TGC_UP_DOWN pin does (that is, reduces the signal gain from stop gain to start gain).
9.4.5.3 FLIP_ATTEN
By default, the attenuation of an attenuator block is varied and followed by an LNA gain variation in all TGC
modes. When the FLIP_ATTEN bit (register 182, bit 6) is enabled, the LNA gain is varied first and then followed
by the attenuation of an attenuator block.
9.4.5.4 DIS_ATTEN
When the DIS_ATTEN bit is set to 1, the attenuation block is disabled.
9.4.5.5 Fixed Attenuation Mode
The attenuator block can be programmed in fixed attenuation mode (that is, the attenuation does not change with
time by enabling the FIX_ATTEN_x (x is the profile number) bit in the DTGC Register Map). When the
FIX_ATTEN_x bit is set to 1, the attenuation value is set using the ATTENUATION_x register bits. A value of N
written in the ATTENUATION_x register sets the attenuation level at –8 + N × 0.125 dB.
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9.4.6 CW Configuration
To configure the device in CW mode, set the CW_TGC_SEL register bit (register 192, bit 0) to 1. To save power,
the ADC can be powered down completely using the GLOBAL_PDN bit (register 1, bit 0). Usually only half the
number of channels in a system are active in the CW mode. Thus, the individual channel control can power-
down unused channels and save power; see Table 18 and Table 19. Enabling CW mode automatically
configures the LNA from TGC mode to CW mode and disables the LPF stage.
9.4.7 TGC + CW Mode
This device does not support TGC and CW mode simultaneously. Only one mode can remain active at a time.
9.5 Programming
9.5.1 Serial Peripheral Interface (SPI) Operation
This section discusses the read and write operations of the SPI interface.
9.5.1.1 Serial Register Write Description
Several different modes can be programmed with the serial peripheral interface (SPI). This interface is formed by
the SEN (serial interface enable), SCLK (serial interface clock), SDIN (serial interface data), and RESET pins.
The SCLK, SDIN, and RESET pins have a 16-kΩ pulldown resistor to ground. SEN has a 16-kΩ pullup resistor to
supply. Serially shifting bits into the device is enabled when SEN is low. SDIN serial data are latched at every
SCLK rising edge when SEN is active (low). SDIN serial data are loaded into the register at every 24th SCLK
rising edge when SEN is low. If the word length exceeds a multiple of 24 bits, the excess bits are ignored. Data
can be loaded in multiples of 24-bit words within a single active SEN pulse (an internal counter counts the
number of 24 clock groups after the SEN falling edge). Data are divided into two main portions: the register
address (8 bits) and data (16 bits). 图 100 shows the timing diagram for serial interface write operation.
SEN
tSEN_SU
Data Latched On
SCLK Rising Edge
tSCLK_H
tSEN_HO
tSCLK
SCLK
tSCLK_L
tDH
tDSU
A7
A6
A5
A4
A3
A2
A1
A0 D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SDIN
RESET
图 100. Serial Interface Timing
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Programming (接下页)
9.5.1.2 Register Readout
The device includes an option where the contents of the internal registers can be read back. This readback can
be useful as a diagnostic test to verify the serial interface communication between the external controller and
AFE. First, the REG_READ_EN bit must be set to 1. Then, initiate a serial interface cycle specifying the address
of the register (A[7:0]) whose content must be read. The data bits are don’t care. The device outputs the contents
(D[15:0]) of the selected register on the SDOUT pin. For lower-speed SCLKs, SDOUT can be latched on the
SCLK rising edge. For higher-speed SCLKs, latching SDOUT at the next SCLK falling edge is preferable. The
read operation timing diagram is shown in 图 101. In readout mode, the REG_READ_EN bit can be accessed
with SDIN, SCLK, and SEN. To enable serial register writes, set the REG_READ_EN bit back to 0.
SEN
SCLK
tOUT_DV
D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SDOUT
SDIN
A7
A6
A5
A4
A3
A2
A1
A0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
图 101. Serial Interface Register, Read Operation
The device SDOUT buffer is 3-stated and is only enabled when the REG_READ_EN bit is enabled. SDOUT pins
from multiple devices can therefore be tied together without any pullup resistors. The SN74AUP1T04 level shifter
can be used to convert 1.8-V logic to 2.5-V or 3.3-V logic, if necessary.
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10 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The device supports a wide-frequency bandwidth signal in the range of several kHz to several MHz. The device
is a highly-integrated solution that includes an attenuator, low-noise amplifier (LNA), an antialiasing filter, an
analog-to-digital converter (ADC), and a continuous-wave (CW) mixer. As a result of the device functionality, the
device can be used in various applications (such as in medical ultrasound imaging systems, sonar imaging
equipment, radar, and other systems that require a very large dynamic range).
10.2 Typical Application
Çransmitter
1
{ꢂL /ontrol
ꢀ Çó_ÇwLD
10 nC
/hannel 1
Lbꢂ1
Çꢀw {ꢁitch
/lamping
5iode
[ë5{
weceiver
[ë5{ lines
!C9 1
Çransmitter
16
10 nC
/hannel 16
Lbꢂ16
Çꢀw {ꢁitch
CꢂD!
5ata
ꢂrocessing
!nd
/lamping
5iode
64
/hannels
Çransducer
!rray
{torage
[ë5{ lines
[ë5{
weceiver
!C9 4
Çransmitter
64
10 nC
/hannel 64
Lbꢂ16
/lock
Denerator
Çꢀw {ꢁitch
/lamping
5iode
图 102. Simplified Schematic for a Medical Ultrasound Imaging System
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Typical Application (接下页)
1.9 VA
10 ꢀF
1.8 VA
10 ꢀF
3.15 VA
10 ꢀF
1.2 VD
10 ꢀF
1.8 VD
10 ꢀF
0.1 ꢀF
0.1 ꢀF
ADC_CLKP
N × 0.1 ꢀF
N × 0.1 ꢀF
N × 0.1 ꢀF
N × 0.1 ꢀF
N × 0.1 ꢀF
ADC_CLKM
AVSS
AVSS
AVSS
DVSS
DVSS
AFE5816
CLKP_16X
CLKM_16X
10 nF
10 nF
DOUTP1
DOUTM1
DOUTP2
INP1
INP2
Clock Inputs
IN CH1
IN CH2
0.1 ꢀF
0.1 ꢀF
CLKP_1X
CLKM_1X
DOUTM2
SDOUT
SDIN
DOUTP3, DOUTM3 to
DOUTP14, DOUTM14
INP3 to INP14
SCLK
TX_TRIG
DOUTP15
DOUTM15
DOUTP16
SEN
10 nF
10 nF
RESET
PDN_FAST
PDN_GBL
INP15
INP16
AFE5816
IN CH15
IN CH16
DOUTM16
Digital Inputs,
Outputs
DCLKP
DCLKM
FCLKP
AFE5816
Analog Inputs,
TGC_PROF<2:1>
TGC_SLOPE
Analog Outputs,
BIAS Decoupling,
LVDS Outputs
FCLKM
TGC_UP_DN
TR_EN <4:1>
≥ 1 ꢀF
≥ 1 ꢀF
≥ 1 ꢀF
BIAS_2P5
Summing
Amplifier
CW_IP_OUTM
CW_IP_OUTP
+
BAND_GAP
LNA_INCM
≥ 1 ꢀF
SRC_BIAS
Summing
Amplifier
CW_QP_OUTM
CW_QP_OUTP
+
NCs
AVSS
DVSS
图 103. Application Circuit
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Typical Application (接下页)
10.2.1 Design Requirements
Typical requirements for a medical ultrasound imaging system are listed in 表 21.
表 21. Design Parameters
DESIGN PARAMETER
Signal center frequency
Signal bandwidth
EXAMPLE VALUES
5 MHz
2 MHz
Maximum overloaded signal
Maximum input signal amplitude
Transducer noise level
Dynamic range
1 VPP
100 mVPP
1 nV/√Hz
151 dBc/Hz
40 dB
Time-gain compensation range
Total harmonic distortion
40 dBc
10.2.2 Detailed Design Procedure
Medical ultrasound imaging is a widely-used diagnostic technique that enables visualization of internal organs,
their size, structure, and blood flow estimation. An ultrasound system uses a focal imaging technique that
involves time shifting, scaling, and intelligently summing the echo energy using an array of transducers to
achieve high imaging performance. The concept of focal imaging provides the ability to focus on a single point in
the scan region. By subsequently focusing at different points, an image is assembled.
See 图 102 for a simplified schematic of a 64-channel ultrasound imaging system. When initiating an ultrasound
image, a pulse is generated and transmitted from each of the 64 transducer elements. The pulse, now in the
form of mechanical energy, propagates through the body as sound waves, typically in the frequency range of 1
MHz to 15 MHz.
The sound waves weaken rapidly as they travel through the objects being imaged, falling off as the square of the
distance traveled. As the signal travels, portions of the wave front energy are reflected. Signals that are reflected
immediately after transmission are very strong because they are from reflections close to the surface; reflections
that occur long after the transmit pulse are very weak because they are reflecting from deep in the body. As a
result of the limitations on the amount of energy that can be put into the imaging object, the industry developed
extremely sensitive receive electronics. Receive echoes from focal points close to the surface require little, if any,
amplification. This region is referred to as the near field. However, receive echoes from focal points deep in the
body are extremely weak and must be amplified by a factor of 100 or more. This region is referred to as the far
field. In the high-gain (far field) mode, the limit of performance is the sum of all noise sources in the receive
chain.
In high-gain (far field) mode, system performance is defined by its overall noise level, which is limited by the
noise level of the transducer assembly and the receive low-noise amplifier (LNA). However, in the low-gain (near
field) mode, system performance is defined by the maximum amplitude of the input signal that the system can
handle. The ratio between noise levels in high-gain mode and the signal amplitude level in low-gain mode is
defined as the dynamic range of the system.
The high integration and high dynamic range of the device make the AFE5816 ideally-suited for ultrasound
imaging applications. The device includes an integrated attenuator, an LNA (with variable gain that can be
changed with enough time to handle both near- and far-field systems), a low-pass antialiasing filter to limit the
noise bandwidth, an ADC with high SNR performance, and a CW mixer. 图 103 illustrates an application circuit of
the device.
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The following steps detail how to design medical ultrasound imaging systems:
1. Use the signal center frequency and signal bandwidth to select an appropriate ADC sampling frequency.
2. Use the time-gain compensation range to select the range of the LNA gain.
3. Use the transducer noise level and maximum input signal amplitude to select the appropriate LNA gain. The
device input-referred noise level reduces with higher LNA gain. However, higher LNA gain leads to lower
input signal swing support.
4. See 图 103 to select different passive components for different device pins.
5. See the CW Clock Selection section to select the clock configuration for the ADC and CW clocks.
10.2.3 Application Curves
图 104 and 图 105 show the FFT of a device output for gain code = 64 and gain code = 319, respectively, with
an input signal at 5 MHz captured at a sample rate of 50 MHz. 图 104 shows the spectrum for a far-field imaging
scenario with the full Nyquist band, default device settings, and gain code = 319. 图 105 shows the spectrum for
a near-field imaging scenario for the full Nyquist band with default device settings and gain code = 64.
10
-10
0
-20
-30
-40
-50
-60
-70
-80
-90
-100
-120
-110
-130
0
2.5
5
7.5 10 12.5 15 17.5 20 22.5 25
Frequency (MHz)
0
2.5
5
7.5 10 12.5 15 17.5 20 22.5 25
Frequency (MHz)
图 104. FFT for Gain Code = 14 dB
图 105. FFT for Gain Code = 45 dB
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10.3 Do's and Don'ts
Driving the inputs (analog or digital) beyond the power-supply rails. For device reliability, an input must not
go more than 300 mV below the ground pins or 300 mV above the supply pins, as suggested in the Absolute
Maximum Ratings table. Exceeding these limits, even on a transient basis, can cause faulty or erratic operation
and can impair device reliability.
Driving the device signal input with an excessively high-level signal. The device offers consistent and fast
overload recovery with a 6-dB overloaded signal. For very large overload signals (> 6 dB of the linear input signal
range), TI recommends back-to-back Schottky clamping diodes at the input to limit the amplitude of the input
signal.
Not meeting timing requirements on the TGC_SLOPE and TGC_UP_DN pins. If timing is not met between
the TGC_SLOPE and TGC_UP_DN signals and the ADC clock signal, then the TGC engine is placed into a
locked state. See the Timing Specifications section for more details.
Using a clock source with excessive jitter, an excessively long input clock signal trace, or having other
signals coupled to the ADC or CW clock signal trace. These situations cause the sampling interval to vary,
causing an excessive output noise and a reduction in SNR performance. For a system with multiple devices, the
clock tree scheme must be used to apply an ADC or CW clock. See the System Clock Configuration for Multiple
Devices section for clock mismatch between devices, which can lead to latency mismatch and reduction in SNR
performance.
LVDS routing length mismatch. The routing length of all LVDS lines routed to the FPGA must be matched to
avoid any timing-related issues. For systems with multiple devices, the LVDS serialized data clock (DCLKP,
DCLKM) and the frame clock (FCLKP, FCLKM) of each individual device must be used to deserialize the
corresponding LDVS serialized data (DOUTP, DOUTM).
Failure to provide adequate heat removal. Use the appropriate thermal parameter listed in the Thermal
Information table and an ambient, board, or case temperature in order to calculate device junction temperature. A
suitable heat removal technique must be used to keep the device junction temperature below the maximum limit
of 105°C.
Incorrect register programming. After resetting the device, write register 1, bit 2 = 1 and register 1, bit 4 = 1. If
these bits are not set as specified, the device does not function properly.
10.4 Initialization Set Up
After bringing up all the supplies, follow these steps to initialize the device:
1. Apply a hardware reset pulse on the RESET pin with a minimum pulse duration of 100 ns. Note that after
powering up the device, a hardware reset is required.
2. After applying a hardware reset pulse, wait for a minimum time of 100 ns.
3. Set register 1, bit 2 and bit 4 to 1 using SPI signals.
4. 100 µs or later after the start of clock, write the PLLRST1 and PLLRST2 bits to 1. Then, after waiting for at
least 10 µs, write both these bits to 0, which helps initialize the PLL in a proper manner. This method of PLL
initialization is also required whenever the device comes out of a global power-down mode or when
ADC_CLK is switched off and turned on again.
5. Write any other register settings as required.
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11 Power Supply Recommendations
The device requires a total of five supplies in order to operate properly. These supplies are: AVDD_3P15,
AVDD_1P9, AVDD_1P8, DVDD_1P8, and DVDD_1P2. See the Recommended Operating Conditions table for
detailed information regarding the minimum and maximum operating voltage specifications of different supplies.
11.1 Power Sequencing and Initialization
11.1.1 Power Sequencing
图 106 shows the suggested power-up sequencing and reset timing for the device. Note that the DVDD_1P2
supply must rise before the AVDD_1P8 supply. If the AVDD_1P8 supply rises before the DVDD_1P2 supply, the
AVDD_1P8 supply current is several times larger than the normal current until the DVDD_1P2 supply reaches a
1.2-V level.
t1
t2
DVDD_1P2
DVDD_1P8,
t3
t7
AVDD_1P8,
AVDD_1P9,
AVDD_3P15
t4
t5
RESET
t6
Device ready for
register write.
SEN
Write Initialization
register
SPI Register
write
Device ready for data
conversion.
Start of Clock
ADC_CLK
t8
NOTE: 10 µs < t1 < 50 ms, 10 µs < t2 < 50 ms, t3 > t1, t4 > 10 ms, t5 > 100 ns, t6 > 100 ns, t7 > 4 ADC clock cycles,
and t8 > 100 µs.
图 106. Recommended Power-Up Sequencing and Reset Timing Diagram
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Power Sequencing and Initialization (接下页)
11.1.2 PLL Initialization
100 µs or later after the start of clock, write the PLLRST1 and PLLRST2 bits to 1. Then, after waiting for at least
10 µs, write both these bits to 0, which helps initialize the PLL in a proper manner. This method of PLL
initialization is also required whenever the device comes out of a global power-down mode or when ADC_CLK is
switched off and turned on again.
12 Layout
12.1 Layout Guidelines
12.1.1 Power Supply, Grounding, and Bypassing
In a mixed-signal system design, the power-supply and grounding design play a significant role. The device
distinguishes between two different grounds: AVSS (analog ground) and DVSS (digital ground). In most cases,
designing the printed circuit board (PCB) to use a single ground plane is adequate, but in high-frequency or high-
performance systems care must be taken so that this ground plane is properly partitioned between various
sections within the system to minimize interactions between analog and digital circuitry. Alternatively, the digital
supply set consisting of the DVDD_1P8, DVDD_1P2, and DVSS pins can be placed on separate power and
ground planes. For this configuration, tie the AVSS and DVSS grounds together at the power connector in a star
layout. In addition, optical or digital isolators (such as the ISO7240) can completely separate the analog portion
from the digital portion. Consequently, such isolators prevent digital noise from contaminating the analog portion.
表 22 lists the related circuit blocks for each power supply.
表 22. Supply versus Circuit Blocks
POWER SUPPLY
GROUND
CIRCUIT BLOCKS(1)
Reference voltage and current generator, LNA, VCNTRL, CW mixer, CW clock buffer,
16 × 16 cross-point switch, and 16-phase generator blocks
AVDD_3P15
AVSS
Band-gap circuit, reference voltage and current generator, LNA, PGA, LPF, and VCA
SPI blocks
AVDD_1P9
AVDD_1P8
AVSS
AVSS
ADC analog, reference voltage and current generator, band-gap circuit, ADC clock
buffer
DVDD_1P8
DVDD_1P2
DVSS
DVSS
LVDS serializer and buffer, and PLL blocks
ADC digital and serial interface blocks
(1) See Figure 96 and Figure 97 for further details.
Reference all bypassing and power supplies for the device to their corresponding ground planes. Bypass all
supply pins with 0.1-μF ceramic chip capacitors (size 0603 or smaller). In order to minimize the lead and trace
inductance, the capacitors must be located as close to the supply pins as possible. Where double-sided
component mounting is allowed, these capacitors are best placed directly under the package. In addition, larger
bipolar decoupling capacitors (2.2 μF to 10 μF, effective at lower frequencies) can also be used on the main
supply pins. These components can be placed on the PCB in close proximity (< 0.5 inch or 12.7 mm) to the
device itself.
The device has a number of reference supplies that must be bypassed, such as BIAS_2P5, LNA_INCM,
BAND_GAP, and SRC_BIAS. Bypass these pins with at least a 1-μF capacitor; higher value capacitors can be
used for better low-frequency noise suppression. For best results, choose low-inductance ceramic chip
capacitors (size 0402, > 1 μF) placed as close as possible to the device pins.
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12.1.2 Board Layout
High-speed, mixed-signal devices are sensitive to various types of noise coupling. One primary source of noise is
the switching noise from the serializer and the output buffer and drivers. For the device, care must be taken to
ensure that the interaction between the analog and digital supplies within the device is kept to a minimal amount.
The extent of noise coupled and transmitted from the digital and analog sections depends on the effective
inductances of each supply and ground connection; smaller effective inductances of the supply and ground pins
result in better noise suppression. For this reason, multiple pins are used to connect each supply and ground set.
Low inductance properties must be maintained throughout the design of the PCB layout by the use of proper
planes and layer thickness.
To avoid noise coupling through supply pins, keep sensitive input pins (such as the INM and INP pins) away from
the AVDD_3P15 and AVDD_1P9 planes. For example, do not route the traces or vias connected to these pins
across the AVDD_3P15 and AVDD_1P9 planes. That is, avoid the power planes under the INM and INP pins.
In order to maintain proper LVDS timing, all LVDS traces must follow a controlled impedance design. In addition,
all LVDS trace lengths must be equal and symmetrical; keep trace length variations less than 150 mil (0.150 inch
or 3.81 mm).
In addition, appropriate delay matching must be considered for the CW clock path, especially in systems with a
high channel count. For example, if the clock delay is half of the 16X clock period, a phase error of 22.5°C can
exist. Thus, the timing delay difference among channels contributes to the beamformer accuracy.
Additional details on the NFBGA PCB layout techniques can be found in the Texas Instruments application report
SSYZ015 that can be downloaded from www.ti.com.
12.2 Layout Example
图 107 and 图 108 illustrate example layouts for the top and bottom layers, respectively.
图 107. Top Layer
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Layout Example (接下页)
图 108. Bottom Layer
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Layout Example (接下页)
图 109 shows the routing of input traces and differential CW outputs.
图 109. Input Routing
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Layout Example (接下页)
图 110 shows routing examples for different power planes.
图 110. Ground Plane
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Layout Example (接下页)
图 111, 图 112, and 图 113 illustrate routing examples for different power planes.
图 111. AVDD_1P9 and DVDD_1P8 Power Plane
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Layout Example (接下页)
图 112. AVDD_1P8 Power Plane
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Layout Example (接下页)
图 113. AVDD_3P15 and DVDD_1P2 Power Plane
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13 Register Maps
13.1 Serial Register Map
The device is a multichip module (MCM) with two dies: the VCA die and the ADC_CONV die, as shown in
Figure 114. Figure 114 also describes the channel mapping of the VCA die to the input pins. Both dies share the
same SPI control signals (SCLK, SDIN, and SEN).
ADC_CONV die
VCA Die
INP1
INP2
INP3
INP4
INP5
VCA_IN1
VCA_IN2
VCA_IN3
VCA_IN4
VCA_IN5
VCA_OUT1
VCA_OUT2
VCA_OUT3
VCA_OUT4
VCA_OUT5
ADC_IN1
ADC_IN2
ADC_IN3
ADC_IN4
ADC_IN5
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
INP6
INP7
VCA_IN6
VCA_IN7
VCA_OUT6
VCA_OUT7
ADC_IN6
ADC_IN7
DOUT6
DOUT7
INP8
INP9
VCA_IN8
VCA_IN9
VCA_OUT8
VCA_OUT9
ADC_IN8
ADC_IN9
ADC_IN10
ADC_IN11
ADC_IN12
ADC_IN13
DOUT8
DOUT9
INP10
INP11
INP12
INP13
VCA_IN10 VCA_OUT10
VCA_IN11 VCA_OUT11
VCA_IN12 VCA_OUT12
VCA_IN13 VCA_OUT13
DOUT10
DOUT11
DOUT12
DOUT13
INP14
INP15
VCA_IN14 VCA_OUT14
VCA_IN15 VCA_OUT15
ADC_IN14
ADC_IN15
DOUT14
DOUT15
INP16
VCA_IN16 VCA_OUT16
ADC_IN16
DOUT16
Device
Figure 114. Channel Mapping: VCA Dies
A reset process is required at the device initialization stage.
NOTE
Initialization can be accomplished with a hardware reset by applying a positive pulse to
the RESET pin. After reset, all ADC and VCA registers are set to default values. Note that
during register programming, all unnamed register bits must be set to 0 for the register
that is being programmed.
The device consists of the following register maps:
1. Global register map. This register map is common to both the ADC_CONV and VCA dies. The global register
map consists of register 0. To program the global register map, set the DTGC_WR_EN bit to 0.
2. ADC register map. This register map programs the ADC die. The ADC register map consists of register 1 to
register 67. To program the ADC register map, set the DTGC_WR_EN bit to 0.
3. VCA register map. This register map contains register 192 to register 230 and programs all VCA blocks
except the DTGC engine. To program the VCA register map, set the DTGC_WR_EN bit to 0.
4. DTGC register map. This register map contains register 1 to register 186 and programs the TGC control
engine of the VCA die. To program the DTGC register map, set the DTGC_WR_EN bit to 1.
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Serial Register Map (continued)
Because these register maps share the same address space, the DTGC_WR_EN bit is used to program the
different register maps, as listed in Table 23.
Table 23. Register Configuration
REGISTER MAP
Global register map
ADC register map
VCA register map
DTGC register map
ADDRESS
0
DTGC_WR_EN BIT
0
0
0
1
1 to 67
192 to 230
1 to 186
13.1.1 Global Register Map
This section discusses the global register. This register map is shown in Table 24.
DTGC_WR_EN must be set to 0 before programming other bits of the global register map.
Table 24. Global Register Map
REGISTER
ADDRESS
REGISTER DATA(1)
DECIMAL HEX
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
DTGC_
WR_EN
REG_READ_
EN
SOFTWARE_
RESET
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
(1) The default value of all registers is 0.
13.1.1.1 Description of Global Register
13.1.1.1.1 Register 0 (address = 0h)
Figure 115. Register 0
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
1
W-0h
7
0
6
0
5
0
4
3
0
2
0
0
REG_READ_
EN
SOFTWARE_
RESET
DTGC_WR_EN
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: W = Write only; -n = value
Table 25. Register 0 Field Descriptions
Bit
15-5
4
Field
Type
W
Reset
0h
Description
0
Must write 0
DTGC_WR_EN
W
0h
0 = Enables programming of the global, ADC, and VCA register maps
1 = Enables programming of the DTGC register map
3-2
1
0
W
W
0h
0h
Must write 0
REG_READ_EN
0 = Register readout mode disabled
1 = Register readout mode enabled
0
SOFTWARE_RESET
W
0h
0 = Disabled
1 = Enabled (this setting returns the device to a reset state). This bit is a
self-clearing register bit.
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13.1.2 ADC Register Map
This section discusses the ADC register map. A register map is available in Table 26.
DTGC_WR_EN must be set to 0 before programming the ADC register map.
Table 26. ADC Register Map
REGISTER
ADDRESS
REGISTER DATA(1)
DECIMAL HEX
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
LVDS_
RATE_2X
GLOBAL_
PDN
1
2
1
2
0
0
0
0
0
0
0
0
0
DIS_LVDS
1
0
1
0
LOW_
LATENCY_
EN
SEL_PRBS
_PAT_
FCLK
SEL_PRBS
_PAT_GBL
PAT_MODES_FCLK[2:0]
SER_DATA_RATE
AVG_EN
0
PAT_MODES[2:0]
OFFSET_CORR_DELAY_FROM_TX_TRIG[5:0]
DIG_
OFFSET_
EN
DIG_GAIN_
EN
OFFSET_CORR_DELAY_
FROM_TX_TRIG[7:6]
3
4
3
4
0
0
0
0
0
0
0
0
0
0
OFFSET_
REMOVAL_ REMOVAL_
START_
SEL
OFFEST_
OFFSET_
REMOVAL_
SELF
PAT_
SELECT_
IND
PRBS_
SYNC
PRBS_
MODE
MSB_
FIRST
AUTO_OFFSET_REMOVAL_ACC_CYCLES[3:0]
PRBS_EN
ADC_RES
START_
MANUAL
5
7
5
7
8
B
CUSTOM_PATTERN[15:0]
CHOPPER
_EN
AUTO_OFFSET_REMOVAL_VAL_RD_CH_SEL[4:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
8
0
0
AUTO_OFFSET_REMOVAL_VAL_RD[13:0]
EN_
11
0
0
0
0
0
0
0
0
DITHER
13
14
15
16
17
18
19
20
D
E
GAIN_CH1
0
0
0
0
0
0
0
0
OFFSET_CH1
0
OFFSET_CH1
OFFSET_CH2
OFFSET_CH2
OFFSET_CH3
OFFSET_CH3
OFFSET_CH4
OFFSET_CH4
F
GAIN_CH2
10
11
12
13
14
0
GAIN_CH3
0
GAIN_CH4
0
HPF_
ROUND_
EN_CH1-8
PAT_PRBS PAT_PRBS PAT_PRBS PAT_PRBS
DIG_HPF_
EN_CH1-4
21
15
PAT_LVDS1[2:0]
PAT_LVDS2[2:0]
HPF_CORNER_CH1-4[3:0]
PAT_LVDS4[2:0]
_LVDS1
_LVDS2
_LVDS3
_LVDS4
23
24
17
18
0
0
0
0
0
0
0
0
PAT_LVDS3[2:0]
PDN_ANA_ PDN_ANA_ PDN_ANA_ PDN_ANA_
0
0
PDN_DIG_ PDN_DIG_ PDN_DIG_ PDN_DIG_
PDN_
LVDS4
PDN_
LVDS3
PDN_
LVDS2
PDN_
LVDS1
INVERT_
CH4
INVERT_
CH3
INVERT_
CH2
INVERT_
CH1
CH4
CH3
CH2
GAIN_CH5
0
CH1
CH4 CH3 CH2 CH1
25
26
27
28
29
19
1A
1B
1C
1D
0
0
0
0
0
OFFSET_CH5
OFFSET_CH5
OFFSET_CH6
OFFSET_CH6
OFFSET_CH7
GAIN_CH6
0
GAIN_CH7
(1) Default value of all registers is 0.
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Table 26. ADC Register Map (continued)
REGISTER
ADDRESS
REGISTER DATA(1)
DECIMAL
HEX
1E
15
14
13
12
11
10
0
9
8
7
6
5
4
3
2
1
0
30
31
32
0
OFFSET_CH7
1F
GAIN_CH8
0
0
OFFSET_CH8
OFFSET_CH8
20
0
PAT_PRBS PAT_PRBS PAT_PRBS PAT_PRBS
DIG_HPF_
EN_CH5-8
33
35
36
21
23
24
PAT_LVDS5[2:0]
0
PAT_LVDS6[2:0]
0
HPF_CORNER_CH5-8[3:0]
PAT_LVDS8[2:0]
_LVDS5
_LVDS6
_LVDS7
_LVDS8
0
0
0
0
0
0
0
PAT_LVDS7[2:0]
PDN_ANA_ PDN_ANA_ PDN_ANA_ PDN_ANA_
0
0
PDN_DIG_ PDN_DIG_ PDN_DIG_ PDN_DIG_
PDN_
LVDS8
PDN_
LVDS7
PDN_
LVDS6
PDN_
LVDS5
INVERT_
CH8
INVERT_
CH7
INVERT_
CH6
INVERT_
CH5
CH8
CH7
CH6
CH5
CH8
CH7
CH6
CH5
37
38
39
40
41
42
43
44
25
26
27
28
29
2A
2B
2C
GAIN_CH9
0
0
0
0
0
0
0
0
OFFSET_CH9
0
OFFSET_CH9
OFFSET_CH10
OFFSET_CH10
OFFSET_CH11
OFFSET_CH11
OFFSET_CH12
OFFSET_CH12
GAIN_CH10
0
GAIN_CH11
0
GAIN_CH12
0
HPF_ROU
ND_EN_CH
1-8
DIG_HPF_
EN_
CH9-12
PAT_PRBS PAT_PRBS PAT_PRBS PAT_PRBS
45
2D
PAT_LVDS9[2:0]
0
PAT_LVDS10[2:0]
HPF_CORNER_CH9-12[3:0]
PAT_LVDS12[2:0]
_LVDS9
_LVDS10
_LVDS11
_LVDS12
47
48
2F
30
0
0
0
0
0
0
0
PAT_LVDS11[2:0]
0
0
PDN_DIG_ PDN_DIG_ PDN_DIG_ PDN_DIG_
PDN_
LVDS12
PDN_
LVDS11
PDN_
LVDS10
PDN_
LVDS9
PDN_ANA_ PDN_ANA_ PDN_ANA_ PDN_ANA_
INVERT_
CH12
INVERT_
CH11
INVERT_
CH10
INVERT_
CH9
CH12
CH11
CH10
CH9
CH12
CH11
CH10
CH9
49
50
51
52
53
54
55
56
31
32
33
34
35
36
37
38
GAIN_CH13
0
0
0
0
0
0
0
0
OFFSET_CH13
0
OFFSET_CH13
OFFSET_CH14
OFFSET_CH14
OFFSET_CH15
OFFSET_CH15
OFFSET_CH16
OFFSET_CH16
GAIN_CH14
0
GAIN_CH15
0
GAIN_CH16
0
DIG_HPF_
EN_
CH13-16
PAT_PRBS PAT_PRBS PAT_PRBS PAT_PRBS
57
39
PAT_LVDS13[2:0]
0
PAT_LVDS14[2:0]
0
HPF_CORNER_CH13-16[3:0]
PAT_LVDS16[2:0]
_LVDS13
_LVDS14
_LVDS15
_LVDS16
59
60
3B
3C
0
0
0
0
0
0
0
PAT_LVDS15[2:0]
PDN_ANA_ PDN_ANA_ PDN_ANA_ PDN_ANA_
0
0
PDN_DIG_ PDN_DIG_ PDN_DIG_ PDN_DIG_
PDN_
LVDS16
PDN_
LVDS15
PDN_
LVDS14
PDN_
LVDS13
INVERT_
CH16
INVERT_
CH15
INVERT_
CH14
INVERT_
CH13
CH16
PLLRST1
PLLRST2
0
CH15
CH14
CH13
CH16
CH15
CH14
CH13
65
66
67
41
42
43
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
LVDS_DCLK_DELAY_PROG[3:0]
98
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13.1.2.1 Description of ADC Registers
13.1.2.1.1 Register 1 (address = 1h)
Figure 116. Register 1
15
0
14
13
0
12
0
11
0
10
0
9
0
8
0
LVDS_RATE_
2X
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
4
1
3
0
2
1
1
0
0
DIS_LVDS
R/W-0h
GLOBAL_PDN
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 27. Register 1 Field Descriptions
Bit
15
14
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
LVDS_RATE_2X
0h
0 = 1X rate; normal operation (default)
1 = 2X rate. This setting combines the data of two LVDS pairs
into a single LVDS pair. This feature can be used when the ADC
clock rate is low; see the LVDS Interface section for further
details.
13-6
5
0
R/W
R/W
0h
0h
Must write 0
DIS_LVDS
0 = LVDS interface is enabled (default)
1 = LVDS interface is disabled
4
3
2
1
0
1
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
Must write 1
Must write 0
Must write 1
Must write 0
0
1
0
GLOBAL_PDN
0 = Device operates in normal mode (default)
1 = ADC enters complete power-down mode
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13.1.2.1.2 Register 2 (address = 2h)
Figure 117. Register 2
15
14
13
5
12
11
10
9
8
LOW_
LATENCY_EN
SEL_PRBS_
PAT_FCLK
PAT_MODES_FCLK[2:0]
R/W-0h
AVG_EN
PAT_MODES[2:0]
R/W-0h
R/W-0h
4
R/W-0h
3
R/W-0h
2
7
6
1
0
PAT_
MODES[2:0]
SEL_PRBS_
PAT_GBL
OFFSET_CORR_DELAY_FROM_TX_TRIG[5:0]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 28. Register 2 Field Descriptions
Bit
Field
Type
Reset
Description
15-13
PAT_MODES_FCLK[2:0]
R/W
0h
These bits enable different test patterns on the frame clock line;
see Table 29 for bit descriptions and the Test Patterns section
for further details.
12
11
LOW_LATENCY_EN
AVG_EN
R/W
R/W
0h
0h
0 = Default latency with digital features supported
1 = Low latency with digital features bypassed
0 = No averaging
1 = Enables averaging of two channels to improve signal-to-
noise ratio (SNR); see the LVDS Interface section for further
details.
10
9-7
6
SEL_PRBS_PAT_FCLK
PAT_MODES[2:0]
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0 = Normal operation
1 = Enables the PRBS pattern to be generated on fCLK; see the
Test Patterns section for further details
These bits enable different test patterns on the LVDS data lines;
see Table 29 for bit descriptions and the Test Patterns section
for further details.
SEL_PRBS_PAT_GBL
0 = Normal operation
1 = Enables the PRBS pattern to be generated; see the Test
Patterns section for further details
5-0
OFFSET_CORR_DELAY_
FROM_TX_TRIG[5:0]
This 8-bit register initiates an offset correction after the TX_TRIG
input pulse (each step is equivalent to one sample delay); the
remaining two MSB bits are the
OFFSET_CORR_DELAY_FROM_TX_TRIG[7:6] bits (bits 10-9)
in register 3.
Table 29. Pattern Mode Bit Description
PAT_MODES[2:0]
DESCRIPTION
000
001
010
011
100
101
110
111
Normal operation
Sync (half frame 1, half frame 0)
Alternate 0s and 1s
Custom pattern(1)
All 1s
Toggle mode
All 0s
Ramp pattern(1)
(1) Either the custom or the ramp pattern setting is required for PRBS pattern selection.
100
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13.1.2.1.3 Register 3 (address = 3h)
Figure 118. Register 3
15
14
13
12
11
0
10
9
8
OFFSET_CORR_DELAY_FROM
_TX_TRIG[7:6]
DIG_
OFFSET_EN
SER_DATA_RATE
R/W-0h
DIG_GAIN_EN
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 30. Register 3 Field Descriptions
Bit
Field
Type
Reset
Description
15-13
SER_DATA_RATE
R/W
0h
These bits control the LVDS serialization rate.
000 = 12X
001 = 14X
100 = 16X
101, 110, 111, 010, 011 = Unused
12
DIG_GAIN_EN
0
R/W
0h
0 = Digital gain disabled
1 = Digital gain enabled
11
R/W
R/W
0h
0h
Must write 0
10-9
OFFSET_CORR_DELAY_
FROM_TX_TRIG[7:6]
This 8-bit register initiates an offset correction after the TX_TRIG
input pulse (each step is equivalent to one sample delay); the
remaining six LSB bits are the
OFFSET_CORR_DELAY_FROM_TX_TRIG[5:0] bits (bits 5-0) in
register 2.
8
DIG_OFFSET_EN
0
R/W
R/W
0h
0h
0 = Digital offset subtraction disabled
1 = Digital offset subtraction enabled
7-0
Must write 0
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13.1.2.1.4 Register 4 (address = 4h)
Figure 119. Register 4
15
14
13
12
11
10
9
8
OFFSET_REM OFFSET_REM
OVAL_START_ OVAL_START_
OFFSET_REM
OVAL_SELF
PAT_
SELECT_IND
AUTO_OFFSET_REMOVAL_ACC_CYCLES
SEL
MANUAL
R/W-0h
7
R/W-0h
R/W-0h
R/W-0h
4
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
6
5
PRBS_
SYNC
PRBS_
MODE
PRBS_EN
R/W-0h
MSB_FIRST
R/W-0h
0
0
ADC_RES
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 31. Register 4 Field Descriptions
Bit
Field
Type
Reset
Description
15
OFFSET_REMOVAL_SELF
R/W
0h
0 = Auto offset correction mode is enabled
1 = Offset correction via register is enabled
14
OFFSET_REMOVAL_START_SEL R/W
0h
0 = Auto offset correction is initiated when the
OFFSET_REMOVAL_START_MANUAL bit is set to 1
1 = Auto offset correction is initiated with a pulse on the
TX_TRIG pin
13
12-9
8
OFFSET_REMOVAL_START_
MANUAL
R/W
R/W
R/W
0h
0h
0h
This bit initiates an offset correction manually instead of with a
TX_TRIG pulse
AUTO_OFFSET_REMOVAL_
ACC_CYCLES
These bits define the number of samples required to generate
an offset in auto offset correction mode
PAT_SELECT_IND
0 = All LVDS output lines have the same pattern, as determined
by the PAT_MODES[2:0] bits
1 = Different test patterns can be sent on different LVDS lines,
depending upon the channel and register; see the Test Patterns
section for further details
7
6
5
PRBS_SYNC
PRBS_MODE
PRBS_EN
R/W
R/W
R/W
0h
0h
0h
0 = Normal operation
1 = PRBS generator is in a reset state
0 = 23-bit PRBS generator
1 = 9-bit PRBS generator
0 = PRBS sequence generation block disabled
1 = PRBS sequence generation block enabled; see the Test
Patterns section for further details
4
MSB_FIRST
R/W
0h
0 = The LSB is transmitted first on serialized output data
1 = The MSB is transmitted first on serialized output data
3
2
0
R/W
R/W
R/W
0h
0h
0h
Must write 0
Must write 0
0
1-0
ADC_RES
These bits control the ADC resolution.
00 = 12-bit resolution
01 = 14-bit resolution
10, 11 = Unused
102
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13.1.2.1.5 Register 5 (address = 5h)
Figure 120. Register 5
15
7
14
6
13
5
12
11
10
2
9
1
8
0
CUSTOM_PATTERN[15:0]
R/W-0h
4
3
CUSTOM_PATTERN[13:0]
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 32. Register 5 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
CUSTOM_PATTERN[15:0]
R/W
0h
If the pattern mode is programmed to a custom pattern mode,
then the custom pattern value can be provided by programming
these bits; see the Test Patterns section for further details.
13.1.2.1.6 Register 7 (address = 7h)
Figure 121. Register 7
15
14
13
12
11
10
0
9
0
8
0
AUTO_OFFSET_REMOVAL_VAL_RD_CH_SEL
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
CHOPPER_EN
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 33. Register 7 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
AUTO_OFFSET_REMOVAL_
VAL_RD_CH_SEL
R/W
0h
Write the channel number to read the offset value in auto offset
correction mode for a corresponding channel number (read the
offset value in register 8, bits 13-0)
10-1
0
0
R/W
R/W
0h
0h
Must write 0
CHOPPER_EN
The chopper can be used to move low-frequency, 1 / f noise to
an fS / 2 frequency.
0 = Chopper disabled
1 = Chopper enabled
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13.1.2.1.7 Register 8 (address = 8h)
Figure 122. Register 8
15
0
14
0
13
5
12
11
10
9
1
8
0
AUTO_OFFSET_REMOVAL_VAL_RD[13:0]
R/W-0h
R/W-0h
R/W-0h
7
6
4
3
2
AUTO_OFFSET_REMOVAL_VAL_RD[13:0]
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 34. Register 8 Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
0h
Description
15-14
13-0
0
Must write 0
AUTO_OFFSET_REMOVAL_VAL_RD
0h
Read the offset value applied in auto offset correction mode
for a specific channel number as defined in the
AUTO_OFFSET_REMOVAL_VAL_RD_CH_SEL[4:0] register
bit.
13.1.2.1.8 Register 11 (address = Bh)
Figure 123. Register 11
15
0
14
0
13
0
12
0
11
10
0
9
0
8
0
EN_DITHER
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 35. Register 11 Field Descriptions
Bit
15-12
11
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
EN_DITHER
0h
Dither can be used to remove higher-order harmonics.
0 = Dither disabled
1 = Dither enabled
Note: Enabling the dither converts higher-order harmonics power
in noise. Thus, enabling this mode removes harmonics but
degrades SNR.
10-0
0
R/W
0h
Must write 0
104
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13.1.2.1.9 Register 13 (address = Dh)
Figure 124. Register 13
15
7
14
6
13
12
11
10
0
9
1
8
0
GAIN_CH1
R/W-0h
OFFSET_CH1
R/W-0h
R/W-0h
5
4
3
2
OFFSET_CH1
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 36. Register 13 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH1
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 1 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH1
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 1 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 14, bits 9-0.
13.1.2.1.10 Register 14 (address = Eh)
Figure 125. Register 14
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH1
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH1
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 37. Register 14 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH1
0h
When the DIG_OFFSET_EN bit is set to 1, then the offset value
for channel 1 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 13, bits 9-0.
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13.1.2.1.11 Register 15 (address = Fh)
Figure 126. Register 15
15
7
14
6
13
12
11
10
0
9
1
8
GAIN_CH2
R/W-0h
OFFSET_CH2
R/W-0h
R/W-0h
5
4
3
2
0
OFFSET_CH2
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 38. Register 15 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH2
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 2 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH2
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 2 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 16, bits 9-0.
13.1.2.1.12 Register 16 (address = 10h)
Figure 127. Register 16
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH2
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH2
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 39. Register 16 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH2
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 2 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 15, bits 9-0.
106
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13.1.2.1.13 Register 17 (address = 11h)
Figure 128. Register 17
15
7
14
6
13
12
11
10
0
9
1
8
0
GAIN_CH3
R/W-0h
OFFSET_CH3
R/W-0h
R/W-0h
5
4
3
2
OFFSET_CH3
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 40. Register 17 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH3
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 3 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH3
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 3 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 18, bits 9-0.
13.1.2.1.14 Register 18 (address = 12h)
Figure 129. Register 18
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH3
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH3
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 41. Register 18 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH3
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 3 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 17, bits 9-0.
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13.1.2.1.15 Register 19 (address = 13h)
Figure 130. Register 19
15
7
14
6
13
12
11
10
0
9
1
8
GAIN_CH4
R/W-0h
OFFSET_CH4
R/W-0h
R/W-0h
5
4
3
2
0
OFFSET_CH4
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 42. Register 19 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH4
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 4 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH4
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 4 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 20, bits 9-0.
13.1.2.1.16 Register 20 (address = 14h)
Figure 131. Register 20
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH4
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH4
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 43. Register 20 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH4
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 4 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 19, bits 9-0.
108
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13.1.2.1.17 Register 21 (address = 15h)
Figure 132. Register 21
15
14
13
12
11
10
9
1
8
PAT_PRBS_
LVDS1
PAT_PRBS_
LVDS2
PAT_PRBS_
LVDS3
PAT_PRBS_
LVDS4
PAT_
LVDS2[2:0]
PAT_LVDS1[2:0]
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
2
R/W-0h
0
3
HPF_ROUND_
EN_CH1-8
DIG_HPF_EN_
CH1-4
PAT_LVDS2[2:0]
R/W-0h
HPF_CORNER_CH1-4[3:0]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 44. Register 21 Field Descriptions
Bit
Field
Type
Reset
Description
15
PAT_PRBS_LVDS1
R/W
0h
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 1 can be enabled with this bit; see the Test
Patterns section for further details.
14
13
PAT_PRBS_LVDS2
PAT_PRBS_LVDS3
PAT_PRBS_LVDS4
PAT_LVDS1[2:0]
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 2 can be enabled with this bit; see the Test
Patterns section for further details.
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 3 can be enabled with this bit; see the Test
Patterns section for further details.
12
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 4 can be enabled with this bit; see the Test
Patterns section for further details.
11-9
8-6
5
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 1 can be programmed with these bits; see
Table 45 for bit descriptions.
PAT_LVDS2[2:0]
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 2 can be programmed with these bits; see
Table 45 for bit descriptions.
HPF_ROUND_EN_CH1-8
0 = Rounding in the ADC HPF is disabled for channel 1 to 8.
HPF output is truncated to be mapped to the ADC resolution
bits.
1 = HPF output of channel 1 to 8 is mapped to the ADC
resolution bits by the round-off operation.
4-1
HPF_CORNER_CH1-4[3:0]
R/W
0h
When the DIG_HPF_EN_CH1-4 bit is set to 1, the digital HPF
characteristic for the corresponding channels can be
programmed by setting the value of k with these bits.
Characteristics of a digital high-pass transfer function applied to
the output data for a given value of k is defined by:
2k
Y(n) =
[x(n) - x(n - 1) + y(n - 1)]
2k + 1
Note that the value of k can be from 2 to 10 (0010b to 1010b);
see the Digital HPF section for further details.
0
DIG_HPF_EN_CH1-4
R/W
0h
0 = Digital HPF disabled for channels 1 to 4 (default)
1 = Enables digital HPF for channels 1 to 4
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Table 45. Pattern Mode Bit Description
PAT_MODES[2:0]
DESCRIPTION
Normal operation
Sync (half frame 0, half frame 1)
Alternate 0s and 1s
Custom pattern
All 1s
000
001
010
011
100
101
110
111
Toggle mode
All 0s
Ramp pattern
13.1.2.1.18 Register 23 (address = 17h)
Figure 133. Register 23
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
1
0
0
0
PAT_LVDS3[2:0]
R/W-0h
PAT_LVDS4[2:0]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 46. Register 23 Field Descriptions
Bit
15-8
7-5
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
PAT_LVDS3[2:0]
0h
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 3 can be programmed with these bits; see
Table 45 for bit descriptions.
4-2
1-0
PAT_LVDS4[2:0]
0
R/W
R/W
0h
0h
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 4 can be programmed with these bits; see
Table 45 for bit descriptions.
Must write 0
110
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13.1.2.1.19 Register 24 (address = 18h)
Figure 134. Register 24
15
14
13
12
11
10
9
8
PDN_DIG_
CH4
PDN_DIG_
CH3
PDN_DIG_
CH2
PDN_DIG_
CH1
PDN_LVDS4
PDN_LVDS3
PDN_LVDS2
PDN_LVDS1
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
PDN_ANA_
CH4
PDN_ANA_
CH3
PDN_ANA_
CH2
PDN_ANA_
CH1
INVERT_
CH4
INVERT_
CH3
INVERT_
CH2
INVERT_
CH1
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 47. Register 24 Field Descriptions
Bit
Field
Type
Reset
Description
15
PDN_DIG_CH4
R/W
0h
0 = Normal operation (default)
1 = Powers down the digital block for channel 4
14
13
12
11
10
9
PDN_DIG_CH3
PDN_DIG_CH2
PDN_DIG_CH1
PDN_LVDS4
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0 = Normal operation (default)
1 = Powers down the digital block for channel 3
0 = Normal operation (default)
1 = Powers down the digital block for channel2
0 = Normal operation (default)
1 = Powers down the digital block for channel 1
0 = Normal operation (default)
1 = Powers down LVDS output line 4
PDN_LVDS3
0 = Normal operation (default)
1 = Powers down LVDS output line 3
PDN_LVDS2
0 = Normal operation (default)
1 = Powers down LVDS output line 2
8
PDN_LVDS1
0 = Normal operation (default)
1 = Powers down LVDS output line 1
7
PDN_ANA_CH4
PDN_ANA_CH3
PDN_ANA_CH2
PDN_ANA_CH1
INVERT_CH4
INVERT_CH3
INVERT_CH2
INVERT_CH1
0 = Normal operation (default)
1 = Powers down the analog block for channel 4
6
0 = Normal operation (default)
1 = Powers down the analog block for channel 3
5
0 = Normal operation (default)
1 = Powers down the analog block for channel 2
4
0 = Normal operation (default)
1 = Powers down the analog block for channel 1
3
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 4(1)
2
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 3(1)
1
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 2(1)
0
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 1(1)
(1) Has no effect on test patterns.
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13.1.2.1.20 Register 25 (address = 19h)
Figure 135. Register 25
15
7
14
6
13
12
11
10
0
9
1
8
GAIN_CH5
R/W-0h
OFFSET_CH5
R/W-0h
R/W-0h
5
4
3
2
0
OFFSET_CH5
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 48. Register 25 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH5
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 5 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH5
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 5 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 26, bits 9-0.
13.1.2.1.21 Register 26 (address = 1Ah)
Figure 136. Register 26
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH5
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH5
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 49. Register 26 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH5
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 5 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 25, bits 9-0.
112
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13.1.2.1.22 Register 27 (address = 1Bh)
Figure 137. Register 27
15
7
14
6
13
12
11
10
0
9
1
8
0
GAIN_CH6
R/W-0h
OFFSET_CH6
R/W-0h
R/W-0h
5
4
3
2
OFFSET_CH6
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 50. Register 27 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH6
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 6 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH6
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 6 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 28, bits 9-0.
13.1.2.1.23 Register 28 (address = 1Ch)
Figure 138. Register 28
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH6
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH6
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 51. Register 28 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH6
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 6 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 27, bits 9-0.
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13.1.2.1.24 Register 29 (address = 1Dh)
Figure 139. Register 29
15
7
14
6
13
12
11
10
0
9
1
8
GAIN_CH7
R/W-0h
OFFSET_CH7
R/W-0h
R/W-0h
5
4
3
2
0
OFFSET_CH7
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 52. Register 29 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH7
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 7 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH7
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 7 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 30, bits 9-0.
13.1.2.1.25 Register 30 (address = 1Eh)
Figure 140. Register 30
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH7
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH7
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 53. Register 30 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH7
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 7 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 29, bits 9-0.
114
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13.1.2.1.26 Register 31 (address = 1Fh)
Figure 141. Register 31
15
7
14
6
13
12
11
10
0
9
1
8
0
GAIN_CH8
R/W-0h
OFFSET_CH8
R/W-0h
R/W-0h
5
4
3
2
OFFSET_CH8
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 54. Register 31 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH8
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 8 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH8
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 8 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 32, bits 9-0.
13.1.2.1.27 Register 32 (address = 20h)
Figure 142. Register 32
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH8
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH8
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 55. Register 32 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH8
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 16 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 31, bits 9-0.
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13.1.2.1.28 Register 33 (address = 21h)
Figure 143. Register 33
15
14
13
12
11
10
9
1
8
PAT_PRBS_
LVDS5
PAT_PRBS_
LVDS6
PAT_PRBS_
LVDS7
PAT_PRBS_
LVDS8
PAT_
LVDS6[2:0]
PAT_LVDS5[2:0]
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
2
R/W-0h
0
3
DIG_HPF_EN_
CH5-8
PAT_LVDS6[2:0]
R/W-0h
0
HPF_CORNER_CH5-8[3:0]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 56. Register 33 Field Descriptions
Bit
Field
Type
Reset
Description
15
PAT_PRBS_LVDS5
R/W
0h
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 5 can be enabled with this bit; see the Test
Patterns section for further details.
14
13
PAT_PRBS_LVDS6
PAT_PRBS_LVDS7
PAT_PRBS_LVDS8
PAT_LVDS5[2:0]
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 6 can be enabled with this bit; see the Test
Patterns section for further details.
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 7 can be enabled with this bit; see the Test
Patterns section for further details.
12
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 8 can be enabled with this bit; see the Test
Patterns section for further details.
11-9
8-6
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 5 can be programmed with these bits; see
Table 45 for bit descriptions.
PAT_LVDS6[2:0]
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 6 can be programmed with these bits; see
Table 45 for bit descriptions.
5
0
R/W
R/W
0h
0h
Must write 0
4-1
HPF_CORNER_CH5-8[3:0]
When the DIG_HPF_EN_CH5-8 bit is set to 1, the digital HPF
characteristic for the corresponding channels can be
programmed by setting the value of k with these bits.
Characteristics of a digital high-pass transfer function applied to
the output data for a given value of k is defined by:
2k
Y(n) =
[x(n) - x(n - 1) + y(n - 1)]
2k + 1
Note that the value of k can be from 2 to 10 (0010b to 1010b);
see the Digital HPF section for further details.
0
DIG_HPF_EN_CH5-8
R/W
0h
0 = Digital HPF disabled for channels 5 to 8 (default)
1 = Enables digital HPF for channels 5 to 8(1)
(1) Should be set same as DIG_HPF_EN_CH1-4
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13.1.2.1.29 Register 35 (address = 23h)
Figure 144. Register 35
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
1
0
0
0
PAT_LVDS7[2:0]
R/W-0h
PAT_LVDS8[2:0]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 57. Register 35 Field Descriptions
Bit
15-8
7-5
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
PAT_LVDS7[2:0]
0h
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 7 can be programmed with these bits; see
Table 45 for bit descriptions.
4-2
1-0
PAT_LVDS8[2:0]
0
R/W
R/W
0h
0h
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 8 can be programmed with these bits; see
Table 45 for bit descriptions.
Must write 0
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13.1.2.1.30 Register 36 (address = 24h)
Figure 145. Register 36
15
14
13
12
11
10
9
8
PDN_DIG_
CH8
PDN_DIG_
CH7
PDN_DIG_
CH6
PDN_DIG_
CH5
PDN_LVDS8
PDN_LVDS7
PDN_LVDS6
PDN_LVDS5
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
PDN_ANA_
CH8
PDN_ANA_
CH7
PDN_ANA_
CH6
PDN_ANA_
CH5
INVERT_
CH8
INVERT_
CH7
INVERT_
CH6
INVERT_
CH5
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 58. Register 36 Field Descriptions
Bit
Field
Type
Reset
Description
15
PDN_DIG_CH8
R/W
0h
0 = Normal operation (default)
1 = Powers down the digital block for channel 8
14
13
12
11
10
9
PDN_DIG_CH7
PDN_DIG_CH6
PDN_DIG_CH5
PDN_LVDS8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0 = Normal operation (default)
1 = Powers down the digital block for channel 7
0 = Normal operation (default)
1 = Powers down the digital block for channel 6
0 = Normal operation (default)
1 = Powers down the digital block for channel 5
0 = Normal operation (default)
1 = Powers down LVDS output line 8
PDN_LVDS7
0 = Normal operation (default)
1 = Powers down LVDS output line 7
PDN_LVDS6
0 = Normal operation (default)
1 = Powers down LVDS output line 6
8
PDN_LVDS5
0 = Normal operation (default)
1 = Powers down LVDS output line 5
7
PDN_ANA_CH8
PDN_ANA_CH7
PDN_ANA_CH6
PDN_ANA_CH5
INVERT_CH8
INVERT_CH7
INVERT_CH6
INVERT_CH5
0 = Normal operation (default)
1 = Powers down the analog block for channel 8
6
0 = Normal operation (default)
1 = Powers down the analog block for channel 7
5
0 = Normal operation (default)
1 = Powers down the analog block for channel 6
4
0 = Normal operation (default)
1 = Powers down the analog block for channel 5
3
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 8(1)
2
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 7(1)
1
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 6(1)
0
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 5(1)
(1) Has no effect on test patterns.
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13.1.2.1.31 Register 37 (address = 25h)
Figure 146. Register 37
15
7
14
6
13
12
11
10
0
9
1
8
0
GAIN_CH9
R/W-0h
OFFSET_CH9
R/W-0h
R/W-0h
5
4
3
2
OFFSET_CH9
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 59. Register 37 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH9
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 9 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH9
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 9 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 38, bits 9-0.
13.1.2.1.32 Register 38 (address = 26h)
Figure 147. Register 38
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH9
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH9
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 60. Register 38 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH9
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 9 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 37, bits 9-0.
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13.1.2.1.33 Register 39 (address = 27h)
Figure 148. Register 39
15
7
14
6
13
12
11
10
0
9
1
8
GAIN_CH10
R/W-0h
OFFSET_CH10
R/W-0h
R/W-0h
5
4
3
2
0
OFFSET_CH10
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 61. Register 39 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH10
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 10 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH10
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 10 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 40, bits 9-0.
13.1.2.1.34 Register 40 (address = 28h)
Figure 149. Register 40
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH10
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH10
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 62. Register 40 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH10
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 10 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 39, bits 9-0.
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13.1.2.1.35 Register 41 (address = 29h)
Figure 150. Register 41
15
7
14
6
13
12
11
10
0
9
1
8
0
GAIN_CH11
R/W-0h
OFFSET_CH11
R/W-0h
R/W-0h
5
4
3
2
OFFSET_CH11
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 63. Register 41 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH11
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 11 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH11
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 11 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 42, bits 9-0.
13.1.2.1.36 Register 42 (address = 2Ah)
Figure 151. Register 42
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH11
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH11
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 64. Register 42 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH11
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 11 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 41, bits 9-0.
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13.1.2.1.37 Register 43 (address = 2Bh)
Figure 152. Register 43
15
7
14
6
13
12
11
10
0
9
1
8
GAIN_CH12
R/W-0h
OFFSET_CH12
R/W-0h
R/W-0h
5
4
3
2
0
OFFSET_CH12
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 65. Register 43 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH12
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 12 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH12
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 12 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 44, bits 9-0.
13.1.2.1.38 Register 44 (address = 2Ch)
Figure 153. Register 44
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH12
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH12
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 66. Register 44 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH12
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 12 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 43, bits 9-0.
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13.1.2.1.39 Register 45 (address = 2Dh)
Figure 154. Register 45
15
14
13
12
11
10
9
1
8
PAT_PRBS_
LVDS9
PAT_PRBS_
LVDS10
PAT_PRBS_
LVDS11
PAT_PRBS_
LVDS12
PAT_
LVDS10[2:0]
PAT_LVDS9[2:0]
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
2
R/W-0h
0
3
HPF_ROUND_
EN_CH9-16
DIG_HPF_EN_
CH9-12
PAT_LVDS10[2:0]
R/W-0h
HPF_CORNER_CH9-12[3:0]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 67. Register 45 Field Descriptions
Bit
Field
Type
Reset
Description
15
PAT_PRBS_LVDS9
R/W
0h
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 9 can be enabled with this bit; see the Test
Patterns section for further details.
14
13
PAT_PRBS_LVDS10
PAT_PRBS_LVDS11
PAT_PRBS_LVDS12
PAT_LVDS9[2:0]
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 10 can be enabled with this bit; see the Test
Patterns section for further details.
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 11 can be enabled with this bit; see the Test
Patterns section for further details.
12
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 12 can be enabled with this bit; see the Test
Patterns section for further details.
11-9
8-6
5
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 9 can be programmed with these bits; see
Table 45 for bit descriptions.
PAT_LVDS10[2:0]
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 10 can be programmed with these bits; see
Table 45 for bit descriptions.
HPF_ROUND_EN_CH9-16
0 = Rounding in the ADC HPF is disabled for channels 9-16.
The HPF output is truncated to be mapped to the ADC
resolution bits.
1 = HPF output of channels 9-16 is mapped to the ADC
resolution bits by the round-off operation.
4-1
HPF_CORNER_CH9-12[3:0]
R/W
0h
When the DIG_HPF_EN_CH9-12 bit is set to 1, the digital HPF
characteristic for the corresponding channels can be
programmed by setting the value of k with these bits.
Characteristics of a digital high-pass transfer function applied to
the output data for a given value of k is defined by:
2k
Y(n) =
[x(n) - x(n - 1) + y(n - 1)]
2k + 1
Note that the value of k can be from 2 to 10 (0010b to 1010b);
see the Digital HPF section for further details.
0
DIG_HPF_EN_CH9-12
R/W
0h
0 = Digital HPF disabled for channels 9 to 12 (default)
1 = Enables digital HPF for channels 9 to 12
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13.1.2.1.40 Register 47 (address = 2Fh)
Figure 155. Register 47
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
1
0
0
0
PAT_LVDS11[2:0]
R/W-0h
PAT_LVDS12[2:0]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 68. Register 47 Field Descriptions
Bit
15-8
7-5
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
PAT_LVDS11[2:0]
0h
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 11 can be programmed with these bits; see
Table 45 for bit descriptions.
4-2
1-0
PAT_LVDS12[2:0]
0
R/W
R/W
0h
0h
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 12 can be programmed with these bits; see
Table 45 for bit descriptions.
Must write 0
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13.1.2.1.41 Register 48 (address = 30h)
Figure 156. Register 48
15
14
13
12
11
10
9
8
PDN_DIG_
CH12
PDN_DIG_
CH11
PDN_DIG_
CH10
PDN_DIG_
CH9
PDN_LVDS12 PDN_LVDS11 PDN_LVDS10
PDN_LVDS9
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
PDN_ANA_
CH12
PDN_ANA_
CH11
PDN_ANA_
CH10
PDN_ANA_
CH9
INVERT_
CH12
INVERT_
CH11
INVERT_
CH10
INVERT_
CH9
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 69. Register 48 Field Descriptions
Bit
Field
Type
Reset
Description
15
PDN_DIG_CH12
R/W
0h
0 = Normal operation (default)
1 = Powers down the digital block for channel 12
14
13
12
11
10
9
PDN_DIG_CH11
PDN_DIG_CH10
PDN_DIG_CH9
PDN_LVDS12
PDN_LVDS11
PDN_LVDS10
PDN_LVDS9
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0 = Normal operation (default)
1 = Powers down the digital block for channel 11
0 = Normal operation (default)
1 = Powers down the digital block for channel 10
0 = Normal operation (default)
1 = Powers down the digital block for channel 9
0 = Normal operation (default)
1 = Powers down LVDS output line 12
0 = Normal operation (default)
1 = Powers down LVDS output line 11
0 = Normal operation (default)
1 = Powers down LVDS output line 10
8
0 = Normal operation (default)
1 = Powers down LVDS output line 9
7
PDN_ANA_CH12
PDN_ANA_CH11
PDN_ANA_CH10
PDN_ANA_CH9
INVERT_CH12
INVERT_CH11
INVERT_CH10
INVERT_CH9
0 = Normal operation (default)
1 = Powers down the analog block for channel 12
6
0 = Normal operation (default)
1 = Powers down the analog block for channel 11
5
0 = Normal operation (default)
1 = Powers down the analog block for channel 10
4
0 = Normal operation (default)
1 = Powers down the analog block for channel 9
3
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 12(1)
2
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 11(1)
1
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 10(1)
0
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 9(1)
(1) Has no effect on test patterns.
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13.1.2.1.42 Register 49 (address = 31h)
Figure 157. Register 49
15
7
14
6
13
12
11
10
0
9
1
8
GAIN_CH13
R/W-0h
OFFSET_CH13
R/W-0h
R/W-0h
5
4
3
2
0
OFFSET_CH13
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 70. Register 49 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH13
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 13 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH13
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 13 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 50, bits 9-0.
13.1.2.1.43 Register 50 (address = 32h)
Figure 158. Register 50
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH13
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH13
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 71. Register 50 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH13
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 13 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 49, bits 9-0.
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13.1.2.1.44 Register 51 (address = 33h)
Figure 159. Register 51
15
7
14
6
13
12
11
10
0
9
1
8
0
GAIN_CH14
R/W-0h
OFFSET_CH14
R/W-0h
R/W-0h
5
4
3
2
OFFSET_CH14
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 72. Register 51 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH14
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 14 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH14
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 14 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 52, bits 9-0.
13.1.2.1.45 Register 52 (address = 34h)
Figure 160. Register 52
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH14
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH14
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 73. Register 52 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH14
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 14 can be obtained with this 10-bit register. The offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 51, bits 9-0.
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13.1.2.1.46 Register 53 (address = 35h)
Figure 161. Register 53
15
7
14
6
13
12
11
10
0
9
1
8
GAIN_CH15
R/W-0h
OFFSET_CH15
R/W-0h
R/W-0h
5
4
3
2
0
OFFSET_CH15
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 74. Register 53 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH15
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 15 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH15
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 15 can be obtained with this 10-bit register. the offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 54, bits 9-0.
13.1.2.1.47 Register 54 (address = 36h)
Figure 162. Register 54
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH15
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH15
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 75. Register 54 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH15
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 15 can be obtained with this 10-bit register. the offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 53, bits 9-0.
128
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13.1.2.1.48 Register 55 (address = 37h)
Figure 163. Register 55
15
7
14
6
13
12
11
10
0
9
1
8
0
GAIN_CH16
R/W-0h
OFFSET_CH16
R/W-0h
R/W-0h
5
4
3
2
OFFSET_CH16
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 76. Register 55 Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_CH16
R/W
0h
When the DIG_GAIN_EN bit is set to 1, the digital gain value for
channel 16 can be obtained with this register. For an N value
(decimal equivalent of binary) written to these bits, the digital
gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_CH16
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 16 can be obtained with this 10-bit register. the offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 56, bits 9-0.
13.1.2.1.49 Register 56 (address = 38h)
Figure 164. Register 56
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
0
OFFSET_CH16
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
OFFSET_CH16
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 77. Register 56 Field Descriptions
Bit
15-10
9-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
OFFSET_CH16
0h
When the DIG_OFFSET_EN bit is set to 1, the offset value for
channel 16 can be obtained with this 10-bit register. the offset
value is in twos complement format and its LSB corresponds to
a 14-bit LSB. Write the same offset value in register 55, bits 9-0.
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13.1.2.1.50 Register 57 (address = 39h)
Figure 165. Register 57
15
14
13
12
11
10
9
1
8
PAT_PRBS_
LVDS13
PAT_PRBS_
LVDS14
PAT_PRBS_
LVDS15
PAT_PRBS_
LVDS16
PAT_
LVDS14[2:0]
PAT_LVDS13[2:0]
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
2
R/W-0h
0
3
DIG_HPF_EN_
CH13-16
PAT_LVDS14[2:0]
R/W-0h
0
HPF_CORNER_CH13-16[3:0]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 78. Register 57 Field Descriptions
Bit
Field
Type
Reset
Description
15
PAT_PRBS_LVDS13
R/W
0h
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 13 can be enabled with this bit; see the Test
Patterns section for further details.
14
13
PAT_PRBS_LVDS14
PAT_PRBS_LVDS15
PAT_PRBS_LVDS16
PAT_LVDS13[2:0]
PAT_LVDS14[2:0]
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 14 can be enabled with this bit; see the Test
Patterns section for further details.
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 15 can be enabled with this bit; see the Test
Patterns section for further details.
12
When the PAT_SELECT_IND bit is set to 1, the PRBS pattern
on LVDS output 16 can be enabled with this bit; see the Test
Patterns section for further details.
11-9
8-6
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 13 can be programmed with these bits; see
Table 45 for bit descriptions.
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 14 can be programmed with these bits; see
Table 45 for bit descriptions.
5
0
R/W
R/W
0h
0h
Must write 0
4-1
HPF_CORNER_CH13-16[3:0]
When the DIG_HPF_EN_CH13-16 bit is set to 1, the digital HPF
characteristic for the corresponding channels can be
programmed by setting the value of k with these bits.
Characteristics of a digital high-pass transfer function applied to
the output data for a given value of k is defined by:
2k
Y(n) =
[x(n) - x(n - 1) + y(n - 1)]
2k + 1
Note that the value of k can be from 2 to 10 (0010b to 1010b);
see the Digital HPF section for further details.
0
DIG_HPF_EN_CH13-16
R/W
0h
0 = Digital HPF disabled for channels 13 to 16 (default)(1)
1 = Enables digital HPF for channels 13 to 16
(1) Should be set same as DIG_HPF_EN_CH9-12
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13.1.2.1.51 Register 59 (address = 3Bh)
Figure 166. Register 59
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
2
1
0
0
0
PAT_LVDS15[2:0]
R/W-0h
PAT_LVDS16[2:0]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 79. Register 59 Field Descriptions
Bit
15-8
7-5
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
PAT_LVDS15[2:0]
0h
When the PAT_SELECT_IND bit is set to 1, the different pattern
on LVDS output 15 can be programmed with these bits; see
Table 45 for bit descriptions.
4-2
1-0
PAT_LVDS16[2:0]
0
R/W
R/W
0h
0h
When the PAT_SELECT_IND bit is set to 1, then the different
pattern on LVDS output 16 can be programmed with these bits;
see Table 45 for bit descriptions.
Must write 0
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13.1.2.1.52 Register 60 (address = 3Ch)
Figure 167. Register 60
15
14
13
12
11
10
9
8
PDN_DIG_
CH16
PDN_DIG_
CH15
PDN_DIG_
CH14
PDN_DIG_
CH13
PDN_LVDS16 PDN_LVDS15 PDN_LVDS14 PDN_LVDS13
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
PDN_ANA_
CH16
PDN_ANA_
CH15
PDN_ANA_
CH14
PDN_ANA_
CH13
INVERT_
CH16
INVERT_
CH15
INVERT_
CH14
INVERT_
CH13
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 80. Register 60 Field Descriptions
Bit
Field
Type
Reset
Description
15
PDN_DIG_CH16
R/W
0h
0 = Normal operation (default)
1 = Powers down the digital block for channel 16
14
13
12
11
10
9
PDN_DIG_CH15
PDN_DIG_CH14
PDN_DIG_CH13
PDN_LVDS16
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0 = Normal operation (default)
1 = Powers down the digital block for channel 15
0 = Normal operation (default)
1 = Powers down the digital block for channel 14
0 = Normal operation (default)
1 = Powers down the digital block for channel 13
0 = Normal operation (default)
1 = Powers down LVDS output line 16
PDN_LVDS15
0 = Normal operation (default)
1 = Powers down LVDS output line 15
PDN_LVDS14
0 = Normal operation (default)
1 = Powers down LVDS output line 14
8
PDN_LVDS13
0 = Normal operation (default)
1 = Powers down LVDS output line 13
7
PDN_ANA_CH16
PDN_ANA_CH15
PDN_ANA_CH14
PDN_ANA_CH13
INVERT_CH16
INVERT_CH15
INVERT_CH14
INVERT_CH13
0 = Normal operation (default)
1 = Powers down the analog block for channel 16
6
0 = Normal operation (default)
1 = Powers down the analog block for channel 15
5
0 = Normal operation (default)
1 = Powers down the analog block for channel 14
4
0 = Normal operation (default)
1 = Powers down the analog block for channel 13
3
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 16(1)
2
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 15(1)
1
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 14(1)
0
0 = Normal operation (default)
1 = Inverts digital output data sent on LVDS output line 13(1)
(1) Has no effect on test patterns.
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13.1.2.1.53 Register 65 (address = 41h)
Figure 168. Register 65
15
14
0
13
0
12
0
11
0
10
0
9
0
8
0
PLLRST1
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 81. Register 65 Field Descriptions
Bit
Field
Type
Reset
Description
15
PLLRST1
R/W
0h
Part of initialization sequence.
To initialize PLL1, first set PLLRST1 to '1' and again set
PLLRST1 to '0'
14-0
0
R/W
0h
Must write 0
13.1.2.1.54 Register 66 (address = 42h)
Figure 169. Register 66
15
14
0
13
0
12
0
11
0
10
0
9
0
8
0
PLLRST2
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 82. Register 66 Field Descriptions
Bit
Field
Type
Reset
Description
15
PLLRST2
R/W
0h
Part of initialization sequence.
To initialize PLL2, first set PLLRST2 to '1' and again set
PLLRST1 to '0'
14-0
0
R/W
0h
Must write 0
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13.1.2.1.55 Register 67 (address = 43h)
Figure 170. Register 67
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
3
2
1
0
0
LVDS_DCLK_DELAY_PROG[3:0]
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 83. Register 67 Field Descriptions
Bit
15-5
4-1
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
LVDS_DCLK_DELAY_PROG[3:0]
0h
The LVDS DCLK output delay is programmable with 110-ps
steps. Delay values are in twos complement format. Increasing
the positive delay increases setup time and reduces hold time,
and vice-versa for the negative delay.
0000 = No delay
0001 = 110 ps
0010 = 220 ps
…
1110 = –220 ps
1111 = –110 ps
…
0
0
R/W
0h
Must write 0
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13.1.3 VCA Register Map
This section discusses the VCA register map. A register map is available in Table 84.
DTGC_WR_EN must be set to 0 before programming the VCA register map.
Table 84. VCA Register Map
REGISTER
ADDRESS
REGISTER DATA(1)
DECIMAL
HEX
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1X_CLK_
BUF_
MODE
16X_CLK_
BUF_
MODE
CW_TGC_
SEL
192
C0
0
0
0
0
0
0
0
0
0
0
0
CW_CLK_MODE
193
194
195
196
197
C1
C2
C3
C4
C5
CW_MIX_PH_CH4
CW_MIX_PH_CH8
CW_MIX_PH_CH12
CW_MIX_PH_CH16
CW_MIX_PH_CH3
CW_MIX_PH_CH7
CW_MIX_PH_CH11
CW_MIX_PH_CH15
CW_MIX_PH_CH2
CW_MIX_PH_CH6
CW_MIX_PH_CH10
CW_MIX_PH_CH14
CW_MIX_PH_CH1
CW_MIX_PH_CH5
CW_MIX_PH_CH9
CW_MIX_PH_CH13
PDCH16
0
PDCH15
0
PDCH14
0
PDCH13
0
PDCH12
0
PDCH11
0
PDCH10
0
PDCH9
0
PDCH8
0
PDCH7
0
PDCH6
0
PDCH5
0
PDCH4
PDCH3
PDCH2
PDCH1
PDWN_
FILTER
PDWN_
LNA
GBL_
PDWN
FAST_
PDWN
198
C6
LNA_HPF_
DIS
199
200
206
C7
C8
CE
0
0
0
0
0
0
0
0
0
LNA_HPF_PROG
LPF_PROG
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
LOW_POW
0
0
0
0
0
0
0
0
0
0
0
MEDIUM_
POW
TR_EXT_
DIS
230
E6
0
0
0
0
0
0
0
0
0
0
0
TR_DIS4
TR_DIS3
TR_DIS2
TR_DIS1
(1) The default value of all registers is 0.
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13.1.3.1 Description of VCA Registers
13.1.3.1.1 Register 192 (address = C0h)
Figure 171. Register 192
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
3
2
1
0
1X_CLK_BUF_ 16X_CLK_BUF
CW_CLK_MODE
R/W-0h
CW_TGC_SEL
R/W-0h
MODE
_MODE
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 85. Register 192 Field Descriptions
Bit
15-5
4
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
1X_CLK_BUF_MODE
0h
0 = Accepts CMOS clocks
1 = Accepts differential clocks
3
16X_CLK_BUF_MODE
CW_CLK_MODE
R/W
R/W
0h
0h
0 = Accepts differential clocks
1 = Accepts CMOS clocks
2-1
Programs CW path clock mode
00 = 16X mode
01 = 8X mode
10 = 4X mode
11 = 1X mode
0
CW_TGC_SEL
R/W
0h
0 = TGC mode
1 = CW mode
Note: In CW mode, the LNA gain changes to a fixed value of 18 dB
and the input attenuator block and low-pass filter are disabled. Thus,
TGC and CW mode cannot be used at the same time.
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13.1.3.1.2 Register 193 (address = C1h)
Figure 172. Register 193
15
7
14
13
12
11
10
9
8
0
CW_MIX_PH_CH4
R/W-0h
CW_MIX_PH_CH3
R/W-0h
6
5
4
3
2
1
CW_MIX_PH_CH2
R/W-0h
CW_MIX_PH_CH1
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 86. Register 193 Field Descriptions
Bit
Field
Type
Reset
Description
15-12
CW_MIX_PH_CH4
R/W
0h
These bits control the CW mixer phase for channel 4.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
11-8
7-4
CW_MIX_PH_CH3
CW_MIX_PH_CH2
CW_MIX_PH_CH1
R/W
R/W
R/W
0h
0h
0h
These bits control the CW mixer phase for channel 3.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
These bits control the CW mixer phase for channel 2.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
3-0
These bits control the CW mixer phase for channel 1.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
13.1.3.1.3 Register 194 (address = C2h)
Figure 173. Register 194
15
7
14
13
12
11
10
9
8
0
CW_MIX_PH_CH8
R/W-0h
CW_MIX_PH_CH7
R/W-0h
6
5
4
3
2
1
CW_MIX_PH_CH6
R/W-0h
CW_MIX_PH_CH5
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 87. Register 194 Field Descriptions
Bit
Field
Type
Reset
Description
15-12
CW_MIX_PH_CH8
R/W
0h
These bits control the CW mixer phase for channel 8.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
11-8
7-4
CW_MIX_PH_CH7
CW_MIX_PH_CH6
CW_MIX_PH_CH5
R/W
R/W
R/W
0h
0h
0h
These bits control the CW mixer phase for channel 7.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
These bits control the CW mixer phase for channel 6.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
3-0
These bits control the CW mixer phase for channel 5.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
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13.1.3.1.4 Register 195 (address = C3h)
Figure 174. Register 195
15
7
14
13
12
11
10
9
8
0
CW_MIX_PH_CH12
R/W-0h
CW_MIX_PH_CH11
R/W-0h
6
5
4
3
2
1
CW_MIX_PH_CH10
R/W-0h
CW_MIX_PH_CH9
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 88. Register 195 Field Descriptions
Bit
Field
Type
Reset
Description
15-12
CW_MIX_PH_CH12
R/W
0h
These bits control the CW mixer phase for channel 12.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
11-8
7-4
CW_MIX_PH_CH11
CW_MIX_PH_CH10
CW_MIX_PH_CH9
R/W
R/W
R/W
0h
0h
0h
These bits control the CW mixer phase for channel 11.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
These bits control the CW mixer phase for channel 10.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
3-0
These bits control the CW mixer phase for channel 9.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
13.1.3.1.5 Register 196 (address = C4h)
Figure 175. Register 196
15
7
14
CW_MIX_PH_CH16
R/W-0h
13
12
11
10
9
8
0
CW_MIX_PH_CH15
R/W-0h
6
5
4
3
2
1
CW_MIX_PH_CH14
R/W-0h
CW_MIX_PH_CH13
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 89. Register 196 Field Descriptions
Bit
Field
Type
Reset
Description
15-12
CW_MIX_PH_CH16
R/W
0h
These bits control the CW mixer phase for channel 16.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
11-8
7-4
CW_MIX_PH_CH15
CW_MIX_PH_CH14
CW_MIX_PH_CH13
R/W
R/W
R/W
0h
0h
0h
These bits control the CW mixer phase for channel 15.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
These bits control the CW mixer phase for channel 14.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
3-0
These bits control the CW mixer phase for channel 13.
Writing N to these bits sets the corresponding channel phase to
N × 22.5° (N = 0 to 15); see Table 90 for further details.
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Table 90. CW Mixer Phase Delay vs Register Settings
BIT SETTINGS
0000
CW_MIX_PH_CHX, CW_MIX_PH_CHY PHASE SHIFT
0
0001
22.5°
45°
0010
0011
67.5°
90°
0100
0101
112.5°
135°
0110
0111
157.5°
180°
1000
1001
202.5°
225°
1010
1011
247.5°
270°
1100
1101
292.5°
315°
1110
1111
337.5°
13.1.3.1.6 Register 197 (address = C5h)
Figure 176. Register 197
15
14
13
12
11
10
9
8
PDCH16
R/W-0h
PDCH15
R/W-0h
PDCH14
R/W-0h
PDCH13
R/W-0h
PDCH12
R/W-0h
PDCH11
R/W-0h
PDCH10
R/W-0h
PDCH9
R/W-0h
7
6
5
4
3
2
1
0
PDCH8
R/W-0h
PDCH7
R/W-0h
PDCH6
R/W-0h
PDCH5
R/W-0h
PDCH4
R/W-0h
PDCH3
R/W-0h
PDCH2
R/W-0h
PDCH1
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 91. Register 197 Field Descriptions
Bit
Field
Type
Reset
Description
15
PDCH16
R/W
0h
0 = Default
1 = Channel 16 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
14
13
12
11
10
PDCH 15
PDCH 14
PDCH 13
PDCH 12
PDCH 11
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0 = Default
1 = Channel 15 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 14 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 13 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 12 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 11 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
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Table 91. Register 197 Field Descriptions (continued)
Bit
Field
Type
Reset
Description
9
PDCH 10
R/W
0h
0 = Default
1 = Channel 10 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
8
7
6
5
4
3
2
1
0
PDCH 9
PDCH 8
PDCH 7
PDCH 6
PDCH 5
PDCH 4
PDCH 3
PDCH 2
PDCH 1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0h
0h
0 = Default
1 = Channel 9 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 8 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 7 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 6 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 5 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 4 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 3 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 2 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
0 = Default
1 = Channel 1 is powered down.
This bit powers down the channel of the VCA die only (LNA,
LPF, CW mixer). This bit does not affect the ADC channel.
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13.1.3.1.7 Register 198 (address = C6h)
Figure 177. Register 198
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
2
1
0
PDWN_FILTER
R/W-0h
PDWN_LNA
R/W-0h
GBL_PDWN
R/W-0h
FAST_PDWN
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 92. Register 198 Field Descriptions
Bit
15-4
3
Field
Type
R/W
R/W
Reset
0h
Description
Must write 0
0 = Default
0
PDWN_FILTER
0h
1 = The LPF in the VCA die is powered down
2
1
PDWN_LNA
GBL_PDWN
R/W
R/W
0h
0h
0 = Default
1 = The LNA in the VCA is powered down
0 = Normal operation
1 = The LNA, LPF, CW mixer, and TGC control engine are
completely powered down (slow wake response) for the VCA
die.
Note that enabling this bit does not power-down the ADC. This
bit only powers down the VCA die.
0
FAST_PDWN
R/W
0h
0 = Normal operation
1 = The LNA, LPF, and CW mixer are partially powered down
(fast wake response) for the VCA die.
Note that enabling this bit does not power-down the ADC. This
bit only powers down the VCA die.
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13.1.3.1.8 Register 199 (address = C7h)
Figure 178. Register 199
15
0
14
0
13
0
12
0
11
LNA_HPF_PROG
R/W-0h
10
9
8
LNA_HPF_DIS
R/W-0h
LPF_PROG
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
0
5
0
4
0
3
0
2
0
1
0
0
0
LPF_PROG
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 93. Register 199 Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
0h
Description
15-12
11-10
0
Must write 0
LNA_HPF_PROG
0h
These bits control the LNA HPF cutoff frequency.
00 = 75 kHz
01 = 150 kHz
10 = 300 kHz
11 = 600 kHz
9
LNA_HPF_DIS
LPF_PROG
R/W
R/W
0h
0h
0 = LNA HPF enabled
1 = LNA HPF disabled
8-7
These bits program the cutoff frequency of the antialiasing LPF.
00 = 15 MHz in low-noise and medium-power mode, 7.5 MHz in
low-power mode
01 = 10 MHz in low-noise and medium-power mode, 5 MHz in
low-power mode
10 = 25 MHz in low-noise and medium-power mode, 12.5 MHz
in low-power mode
11 = 20 MHz in low-noise and medium-power mode, 10 MHz in
low-power mode
6-0
0
R/W
0h
Must write 0
13.1.3.1.9 Register 200 (address = C8h)
Figure 179. Register 200
15
0
14
0
13
0
12
11
0
10
0
9
0
8
0
LOW_POW
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 94. Register 200 Field Descriptions
Bit
15-13
12
Field
Type
R/W
R/W
Reset
0h
Description
Must write 0
0 = Default
0
LOW_POW
0h
1 = In TGC mode the VCA die is set to low-power mode. No
effect in CW mode.
11-0
0
R/W
0h
Must write 0
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13.1.3.1.10 Register 206 (address = CEh)
Figure 180. Register 206
15
0
14
13
0
12
0
11
0
10
0
9
0
8
0
MEDIUM_POW
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 95. Register 206 Field Descriptions
Bit
15
14
Field
Type
R/W
R/W
Reset
0h
Description
Must write 0
0 = Default
0
MEDIUM_POW
0h
1 = In TGC mode, the VCA die is set to medium-power mode.
The LOW_POW bit must be set to 0 to enable this mode. This
bit has no effect in CW mode.
13-0
0
R/W
0h
Must write 0
13.1.3.1.11 Register 230 (address = E6h)
Figure 181. Register 230
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
3
2
1
0
TR_EXT_DIS
R/W-0h
TR_DIS4
R/W-0h
TR_DIS3
R/W-0h
TR_DIS2
R/W-0h
TR_DIS1
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 96. Register 230 Field Descriptions
Bit
15-5
4
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
TR_EXT_DIS(1)
0h
0 = The TR_EN<x> pins are used to disconnect the LNA HPF
from the INP pins
1 = The TR_DIS[4:1] register bits are used to disconnect the
LNA HPF from the INP pin
3
2
TR_DIS4(1)
TR_DIS3(1)
R/W
R/W
0h
0h
When the TR_EXT_DIS bit is set to 1:
0 = Disconnects the LNA HPF from the input of channels 13, 14,
15, and 16
1 = Enables the LNA HPF at the input of channels 13, 14, 15,
and 16
When the TR_EXT_DIS bit is set to 1:
0 = Disconnects the LNA HPF from the input of channels 9, 10,
11, and 12
1 = Enables the LNA HPF at the input of channels 9, 11, 11, and
12
1
0
TR_DIS2(1)
TR_DIS1(1)
R/W
R/W
0h
0h
When the TR_EXT_DIS bit set to 1:
0 = Disconnects the LNA HPF from the input of channels 5, 6, 7,
and 8
1 = Enables the LNA HPF at the input of channels 5, 6, 7, and 8
When the TR_EXT_DIS bit is set to 1:
0 = Disconnects the LNA HPF from the input of channels 1, 2, 3,
and 4
1 = Enables the LNA HPF at the input of channels 1, 2, 3, and 4
(1) Note that when this bit is enabled, the LNA HPF remains powered up and is disconnected only from the input. This feature can be used
for better overload recovery by disconnecting the LNA HPF during AFE overload conditions.
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13.1.4 DTGC Register Map
This section discusses the DTGC register map. A register map is available in Table 24.
DTGC_WR_EN must be set to 1 before programming other bits of the global register map.
Table 97. DTGC Register Map
REGISTER ADDRESS
REGISTER DATA
DECIMAL
1
HEX
1
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MEM_WORD_0
2-160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
2-A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
MEM_WORD_1 to MEM_WORD_159
START_GAIN_0
POS_STEP_0
STOP_GAIN_0
NEG_STEP_0
STOP_INDEX_0
START_INDEX_0
START_GAIN_TIME_0
HOLD_GAIN_TIME_0
START_GAIN_1
POS_STEP_1
STOP_GAIN_1
NEG_STEP_1
STOP_INDEX_1
START_INDEX_1
START_GAIN_TIME_1
HOLD_GAIN_TIME_1
START_GAIN_2
POS_STEP_2
STOP_GAIN_2
NEG_STEP_2
STOP_INDEX_2
START_INDEX_2
START_GAIN_TIME_2
HOLD_GAIN_TIME_2
START_GAIN_3
POS_STEP_3
STOP_GAIN_3
NEG_STEP_3
STOP_INDEX_3
START_INDEX_3
START_GAIN_TIME_3
HOLD_GAIN_TIME_3
ENABLE_
INT_
START
SLOPE_
FAC[0]
MANUAL_
START
181
B5
MEM_BANK_SEL
0
0
MANUAL_GAIN_DTGC
PROFILE_
EXT_DIS
FLIP_
ATTEN
DIS_
ATTEN
182
183
B6
B7
MODE_SEL
PROFILE_REG_SEL
INP_RES_SEL
SLOPE_FAC[3:1]
0
0
NEXT_CYCLE_WAIT_TIME
FIX_
ATTEN_
EN_0
FIX_
ATTEN_
EN_1
185
186
B9
BA
ATTENUATION_0
ATTENUATION_2
ATTENUATION_1
ATTENUATION_3
FIX_
ATTEN_
EN_2
FIX_
ATTEN_
EN_3
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13.1.4.1 Description of DTGC Register
13.1.4.1.1 DTGC Registers
DTGC_WR_EN must be set to 1 to write these registers.
13.1.4.1.1.1 Register 1 (address = 1h)
Figure 182. Register 1
15
7
14
6
13
5
12
11
10
2
9
1
8
0
MEM_WORD_0
R/W-Undefined
4
3
MEM_WORD_0
R/W-Undefined
LEGEND: R/W = Read/Write; -n = value after reset
Table 98. Register 1 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
MEM_WORD_0
R/W
Undefined The memory word register 0 stores the gain step information
that is used in internal non-uniform mode; see the Internal Non-
Uniform Mode section for more details. A reset operation does
not reset this register. After power-up, this register must be
explicitly written to its desired content.
13.1.4.1.1.2 Registers 2-160 (address = 2h-A0h)
Figure 183. Registers 2-160
15
7
14
6
13
5
12
11
10
2
9
1
8
0
MEM_WORD_1 to MEM_WORD_159
R/W-Undefined
4
3
MEM_WORD_1 to MEM_WORD_159
R/W-Undefined
LEGEND: R/W = Read/Write; -n = value after reset
Table 99. Registers 2-160 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
MEM_WORD_1 to
MEM_WORD_159
R/W
Undefined The memory word registers from 1 to 159 store the gain step
information that is used in internal non-uniform mode; see the
Internal Non-Uniform Mode section for more details. A reset
operation does not reset this register. After power-up, this
register must be explicitly written to its desired content.
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13.1.4.1.1.3 Register 161 (address = A1h)
Figure 184. Register 161
15
7
14
6
13
5
12
11
10
2
9
1
8
0
START_GAIN_0
R/W-0h
4
3
STOP_GAIN_0
R/W-9Fh
LEGEND: R/W = Read/Write; -n = value after reset
Table 100. Register 161 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
START_GAIN_0
R/W
0h
These bits determine the start gain value for profile 0 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
7-0
STOP_GAIN_0
R/W
9Fh
These bits determine the stop gain value for profile 0 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
13.1.4.1.1.4 Register 162 (address = A2h)
Figure 185. Register 162
15
7
14
6
13
5
12
11
10
2
9
1
8
0
POS_STEP_0
R/W-0h
4
3
NEG_STEP_0
R/W-FFh
LEGEND: R/W = Read/Write; -n = value after reset
Table 101. Register 162 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
POS_STEP_0
R/W
0h
These bits determine the positive step value for profile 0 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
7-0
NEG_STEP_0
R/W
FFh
These bits determine the negative step value for profile 0 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
146
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13.1.4.1.1.5 Register 163 (address = A3h)
Figure 186. Register 163
15
7
14
6
13
5
12
START_INDEX _0
R/W-0h
11
10
2
9
1
8
0
4
3
STOP_INDEX _0
R/W-9Fh
LEGEND: R/W = Read/Write; -n = value after reset
Table 102. Register 163 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
START_INDEX _0
R/W
0h
These bits determine the start index value for profile 0, which is
used in internal non-uniform mode; see the Internal Non-Uniform
Mode section for more details.
7-0
STOP_INDEX _0
R/W
9Fh
These bits determine the stop index value for profile 0, which is
used internal non-uniform mode; see the Internal Non-Uniform
Mode section for more details.
13.1.4.1.1.6 Register 164 (address = A4h)
Figure 187. Register 164
15
7
14
6
13
5
12
11
10
2
9
1
8
0
START_GAIN_TIME_0
R/W-0h
4
3
START_GAIN_TIME_0
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 103. Register 164 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
START_GAIN_TIME_0
R/W
0h
These bits define the start gain time for profile 0 and are used in
internal non-uniform mode; see the Internal Non-Uniform Mode
section for more details.
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13.1.4.1.1.7 Register 165 (address = A5h)
Figure 188. Register 165
15
7
14
6
13
5
12
11
10
2
9
1
8
0
HOLD_GAIN_TIME_0
R/W-0h
4
3
HOLD_GAIN_TIME_0
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 104. Register 165 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
HOLD_GAIN_TIME_0
R/W
0h
These bits define the hold gain time for profile 0 and are used in
internal non-uniform mode; see the Internal Non-Uniform Mode
section for more details.
13.1.4.1.1.8 Register 166 (address = A6h)
Figure 189. Register 166
15
7
14
6
13
5
12
11
10
2
9
1
8
0
START_GAIN_1
R/W-0h
4
3
STOP_GAIN_1
R/W-9Fh
LEGEND: R/W = Read/Write; -n = value after reset
Table 105. Register 166 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
START_GAIN_1
R/W
0h
These bits determine the start gain value for profile 1 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
7-0
STOP_GAIN_1
R/W
9Fh
These bits determine the stop gain value for profile 1 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
148
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13.1.4.1.1.9 Register 167 (address = A7h)
Figure 190. Register 167
15
7
14
6
13
5
12
11
10
2
9
1
8
0
POS_STEP_1
R/W-0h
4
3
NEG_STEP_1
R/W-FFh
LEGEND: R/W = Read/Write; -n = value after reset
Table 106. Register 167 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
POS_STEP_1
R/W
0h
These bits determine the positive step value for profile 1 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
7-0
NEG_STEP_1
R/W
FFh
These bits determine the negative step value for profile 1 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
13.1.4.1.1.10 Register 168 (address = A8h)
Figure 191. Register 168
15
7
14
6
13
5
12
START_INDEX _1
R/W-0h
11
10
2
9
1
8
0
4
3
STOP_INDEX _1
R/W-9Fh
LEGEND: R/W = Read/Write; -n = value after reset
Table 107. Register 168 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
START_INDEX _1
R/W
0h
These bits determine the start index value for profile 1 that is
used in internal non-uniform mode; see the Internal Non-Uniform
Mode section for more details.
7-0
STOP_INDEX _1
R/W
9Fh
These bits determine the stop index value for profile 1 that is
used internal non-uniform mode; see the Internal Non-Uniform
Mode section for more details.
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13.1.4.1.1.11 Register 169 (address = A9h)
Figure 192. Register 169
15
7
14
6
13
5
12
11
10
2
9
1
8
0
START_GAIN_TIME_1
R/W-0h
4
3
START_GAIN_TIME_1
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 108. Register 169 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
START_GAIN_TIME_1
R/W
0h
These bits define the start gain time for profile 1 and are used in
internal non-uniform mode; see the Internal Non-Uniform Mode
section for more details.
13.1.4.1.1.12 Register 170 (address = AAh)
Figure 193. Register 170
15
7
14
6
13
5
12
11
10
2
9
1
8
0
HOLD_GAIN_TIME_1
R/W-0h
4
3
HOLD_GAIN_TIME_1
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 109. Register 170 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
HOLD_GAIN_TIME_1
R/W
0h
These bits define the hold gain time for profile 1 and are used in
internal non-uniform mode; see the Internal Non-Uniform Mode
section for more details.
13.1.4.1.1.13 Register 171 (address = ABh)
Figure 194. Register 171
15
7
14
6
13
5
12
11
10
2
9
1
8
0
START_GAIN_2
R/W-0h
4
3
STOP_GAIN_2
R/W-9Fh
LEGEND: R/W = Read/Write; -n = value after reset
Table 110. Register 171 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
START_GAIN_2
R/W
0h
These bits determine the start gain value for profile 2 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
7-0
STOP_GAIN_2
R/W
9Fh
These bits determine the stop gain value for profile 2 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
150
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13.1.4.1.1.14 Register 172 (address = ACh)
Figure 195. Register 172
15
7
14
6
13
5
12
11
10
2
9
1
8
0
POS_STEP_2
R/W-0h
4
3
NEG_STEP_2
R/W-FFh
LEGEND: R/W = Read/Write; -n = value after reset
Table 111. Register 172 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
POS_STEP_2
R/W
0h
These bits determine the positive step value for profile 2 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
7-0
NEG_STEP_2
R/W
FFh
These bits determine the negative step value for profile 2 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
13.1.4.1.1.15 Register 173 (address = ADh)
Figure 196. Register 173
15
7
14
6
13
5
12
START_INDEX _2
R/W-0h
11
10
2
9
1
8
0
4
3
STOP_INDEX _2
R/W-9Fh
LEGEND: R/W = Read/Write; -n = value after reset
Table 112. Register 173 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
START_INDEX _2
R/W
0h
These bits determine the start index value for profile 2 that is
used in internal non-uniform mode; see the Internal Non-Uniform
Mode section for more details.
7-0
STOP_INDEX _2
R/W
9Fh
These bits determine the stop index value for profile 2 that is
used internal non-uniform mode; see the Internal Non-Uniform
Mode section for more details.
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13.1.4.1.1.16 Register 174 (address = AEh)
Figure 197. Register 174
15
7
14
6
13
5
12
11
10
2
9
1
8
0
START_GAIN_TIME_2
R/W-0h
4
3
START_GAIN_TIME_2
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 113. Register 174 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
START_GAIN_TIME_2
R/W
0h
These bits define start gain time for profile 2 and are used in
internal non-uniform mode; see the Internal Non-Uniform Mode
section for more details.
13.1.4.1.1.17 Register 175 (address = AFh)
Figure 198. Register 175
15
7
14
6
13
5
12
11
10
2
9
1
8
0
HOLD_GAIN_TIME_2
R/W-0h
4
3
HOLD_GAIN_TIME_2
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 114. Register 175 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
HOLD_GAIN_TIME_2
R/W
0h
These bits define hold gain time for profile 2 and are used in
internal non-uniform mode; see the Internal Non-Uniform Mode
section for more details.
13.1.4.1.1.18 Register 176 (address = B0h)
Figure 199. Register 176
15
7
14
6
13
5
12
11
10
2
9
1
8
0
START_GAIN_3
R/W-0h
4
3
STOP_GAIN_3
R/W-9Fh
LEGEND: R/W = Read/Write; -n = value after reset
Table 115. Register 176 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
START_GAIN_3
R/W
0h
These bits determine the start gain value for profile 3 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
7-0
STOP_GAIN_3
R/W
9Fh
These bits determine the stop gain value for profile 3 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
152
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13.1.4.1.1.19 Register 177 (address = B1h)
Figure 200. Register 177
15
7
14
6
13
5
12
11
10
2
9
1
8
0
POS_STEP_3
R/W-0h
4
3
NEG_STEP_3
R/W-FFh
LEGEND: R/W = Read/Write; -n = value after reset
Table 116. Register 177 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
POS_STEP_3
R/W
0h
These bits determine the positive step value for profile 3 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
7-0
NEG_STEP_3
R/W
FFh
These bits determine the negative step value for profile 3 that is
used in different DTGC modes; see the Digital TGC Modes
section for more details.
13.1.4.1.1.20 Register 178 (address = B2h)
Figure 201. Register 178
15
7
14
6
13
5
12
11
10
2
9
1
8
0
START_INDEX _3
R/W-0h
4
3
NEG_STEP_0
R/W-9Fh
LEGEND: R/W = Read/Write; -n = value after reset
Table 117. Register 178 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
START_INDEX _3
R/W
0h
These bits determine the start index value for profile 3 that is
used in internal non-uniform mode; see the Internal Non-Uniform
Mode section for more details.
7-0
STOP_INDEX _3
R/W
9Fh
These bits determine the stop index value for profile 3 that is
used internal non-uniform mode; see the Internal Non-Uniform
Mode section for more details.
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13.1.4.1.1.21 Register 179 (address = B3h)
Figure 202. Register 179
15
7
14
6
13
5
12
11
10
2
9
1
8
0
START_GAIN_TIME_3
R/W-0h
4
3
START_GAIN_TIME_3
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 118. Register 179 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
START_GAIN_TIME_3
R/W
0h
These bits define the start gain time for profile 3 and are used in
internal non-uniform mode; see the Internal Non-Uniform Mode
section for more details.
13.1.4.1.1.22 Register 180 (address = B4h)
Figure 203. Register 180
15
7
14
6
13
5
12
11
10
2
9
1
8
0
HOLD_GAIN_TIME_3
R/W-0h
4
3
HOLD_GAIN_TIME_3
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 119. Register 180 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
HOLD_GAIN_TIME_3
R/W
0h
These bits define the hold gain time for profile 3 and are used in
internal non-uniform mode; see the Internal Non-Uniform Mode
section for more details.
154
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13.1.4.1.1.23 Register 181 (address = B5h)
Figure 204. Register 181
15
14
13
12
11
0
10
9
0
8
ENABLE_INT_
START
MANUAL_
START
MANUAL_GAIN_
DTGC
SLOPE_FAC[0]
MEM_BANK_SEL
R/W-0h
R/W-0h
7
R/W-0h
6
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
5
4
MANUAL_GAIN_DTGC
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 120. Register 181 Field Descriptions
Bit
Field
Type
Reset
Description
15
SLOPE_FAC[0]
R/W
0h
This bit is used to control the TGC gain curve slope in internal
non-uniform mode; see the Internal Non-Uniform Mode section
for more details.
14
ENABLE_INT_START
MEM_BANK_SEL
R/W
R/W
0h
0h
0 = External TGC start signal
1 = Periodic TGC start signal is generated by the device itself;
see the Digital TGC Test Modes section for more details.
13-12
These bits select the memory bank; see the Internal Non-
Uniform Mode section for more details.
11, 9
10
0
R/W
R/W
0h
0h
Must write 0
MANUAL_START
0 = No operation
1 = The TGC start signal is generated internally for single-shot
operation only; see the Digital TGC Test Modes section for more
details.
8-0
MANUAL_GAIN_DTGC
R/W
0h
The value of the gain code is determined with this register in
programmable fixed-gain mode; see the Programmable Fixed
Gain Mode section for more details.
13.1.4.1.1.24 Register 182 (address = B6h)
Figure 205. Register 182
15
14
13
12
11
10
2
9
8
PROFILE_EXT
_DIS
MODE_SEL
R/W-0h
PROFILE_REG_SEL
R/W-0h
INP_RES_SEL
R/W-0h
R/W-0h
7
6
5
4
3
1
0
0
0
INP_RES_SEL
R/W-0h
FLIP_ATTEN
R/W-0h
DIS_ATTEN
R/W-0h
SLOPE_FAC[3:1]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 121. Register 182 Field Descriptions
Bit
Field
Type
Reset
Description
15-14
MODE_SEL
R/W
0h
These bits determine the DTGC mode.
00 = External non-uniform mode
01 = Up, down ramp mode
10 = Programmable fixed-gain mode
11 = Internal non-uniform mode
13-12
PROFILE_REG_SEL
R/W
0h
These bits determine which profile register to use when the
PROFILE_EXT_DIS bit is 1.
00 = Profile 0
01 = Profile 1
10 = Profile 2
01 = Profile 3
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Table 121. Register 182 Field Descriptions (continued)
Bit
Field
Type
Reset
Description
11
PROFILE_EXT_DIS
R/W
0h
0 = Device pins TGC_PROF<2> and TGC_PROF<1> determine
which profile to use
1 = The PROFILE_REG_SEL register bits determine which
profile to use
10-7
6
INP_RES_SEL
FLIP_ATTEN
R/W
R/W
0h
0h
Depending upon source resistance, proper input attenuation
resistance must be selected to obtain 8-dB attenuation.
Table 122 lists the values to be written for different source
resistances.
0 = In the TGC gain curve, the attenuation of the attenuator
block varies first, followed by the LNA gain variation
1 = In the TGC gain curve, the LNA gain varies first, followed by
the attenuation of the attenuator block
5
DIS_ATTEN
R/W
R/W
0h
0h
0 = Attenuator is enabled
1 = Attenuator is disabled
4-2
SLOPE_FAC[3:1]
These bits are used to control the TGC gain curve slope in
internal non-uniform mode; see the Internal Non-Uniform Mode
section for more details.
1-0
0
R/W
0h
Must write 0
Table 122. INP_RES_SEL Values
BIT SETTING
SOURCE RESISTANCE
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
50 Ω
115 Ω
70 Ω
270 Ω
60 Ω
160 Ω
90 Ω
800 Ω
60 Ω
130 Ω
80 Ω
400 Ω
65 Ω
200 Ω
100 Ω
Open
156
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13.1.4.1.1.25 Register 183 (address = B7h)
Figure 206. Register 183
15
7
14
6
13
5
12
11
10
2
9
1
8
0
NEXT_CYCLE_WAIT_TIME
R/W-0h
4
3
NEXT_CYCLE_WAIT_TIME
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 123. Register 183 Field Descriptions
Bit
Field
Type
Reset
Description
15-0
NEXT_CYCLE_WAIT_TIME
R/W
0h
When ENABLE_INT_START is set to 1, the periodicity of the
internal start signal is controlled with this register; see the Digital
TGC Test Modes section for more details.
13.1.4.1.1.26 Register 185 (address = B9h)
Figure 207. Register 185
15
14
6
13
12
11
10
2
9
1
8
0
FIX_ATTEN_EN_0
R/W-0h
ATTENUATION_0
R/W-0h
7
5
4
3
FIX_ATTEN_EN_1
R/W-0h
ATTENUATION_1
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 124. Register 185 Field Descriptions
Bit
Field
Type
Reset
Description
15
FIX_ATTEN_EN_0
R/W
0h
0 = Default
1 = Enable fixed attenuation mode for profile 0
14-8
ATTENUATION_0
R/W
0h
When the FIX_ATTEN_EN_0 bit is set to 1, the attenuation level
of the attenuator block is set by the ATTENUATION_0 bits for
profile 0. A value of N written in the ATTENUATION_0 register
sets the attenuation level at –8 + N × 0.125 dB.
7
FIX_ATTEN_EN_1
ATTENUATION_1
R/W
R/W
0h
0h
0 = Default
1 = Enable fixed attenuation mode for profile 1
6-0
When the FIX_ATTEN_EN_1 bit is set to 1, the attenuation level
of the attenuator block is set by the ATTENUATION_1 bits for
profile 1. A value of N written in the ATTENUATION_1 register
sets the attenuation level at –8 + N × 0.125 dB.
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13.1.4.1.1.27 Register 186 (address = BAh)
Figure 208. Register 186
15
14
6
13
12
11
10
2
9
1
8
0
FIX_ATTEN_EN_2
R/W-0h
ATTENUATION_2
R/W-0h
7
5
4
3
FIX_ATTEN_EN_3
R/W-0h
ATTENUATION_3
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 125. Register 186 Field Descriptions
Bit
Field
Type
Reset
Description
15
FIX_ATTEN_EN_2
R/W
0h
0 = Default
1 = Enable fixed attenuation mode for profile 2
14-8
ATTENUATION_2
R/W
0h
When the FIX_ATTEN_EN_2 bit is set to 1, the attenuation level
of the attenuator block is set by the ATTENUATION_2 bits for
profile 2. A value of N written in the ATTENUATION_2 register
sets the attenuation level at –8 + N × 0.125 dB.
7
FIX_ATTEN_EN_3
ATTENUATION_3
R/W
R/W
0h
0h
0 = Default
1 = Enable fixed attenuation mode for profile 3
6-0
When the FIX_ATTEN_EN_3 bit is set to 1, the attenuation level
of the attenuator block is set by the ATTENUATION_3 bits for
profile 3. A value of N written in the ATTENUATION_3 register
sets the attenuation level at –8 + N × 0.125 dB.
158
版权 © 2015–2017, Texas Instruments Incorporated
AFE5816
www.ti.com.cn
ZHCSDT7E –APRIL 2015–REVISED SEPTEMBER 2017
14 器件和文档支持
14.1 文档支持
14.1.1 相关文档
《具有 140mW/通道功耗、0.75nV/√Hz 噪声、14 位 65MSPS 或 12 位 80MSPS ADC 以及 CW 无源混频器的
AFE5818 16 通道超声波模拟前端》
《ADS8413 16 位、2MSPS、LVDS 串行接口 SAR 模数转换器》
《具有并行接口、基准的 ADS8472 16 位、1MSPS、伪双极、全差分输入、微功耗采样模数转换器》
《CDCE72010 10 路输出高性能时钟同步器、抖动消除器和时钟分配器》
《CDCM7005 3.3V 高性能时钟同步器和抖动消除器》
《ISO724x 高速四通道数字隔离器》
《具有双环路 PLL 的 LMK0480x 低噪声时钟抖动清除器》
《OPA1632 高性能、全差分音频运算放大器》
《OPA2x11 1.1-nv/√Hz 噪声、低功耗、精密运算放大器》
《SN74AUP1T04 低功耗、1.8/2.5/3.3V 输入、3.3V CMOS 输出单反相器门》
《THS413x 高速、低噪声、全差分 I/O 放大器》
《MicroStar BGA 封装参考指南》
14.2 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
14.3 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
14.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
14.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据如有变更，恕不另行通知
和修订此文档。如欲获取此产品说明书的浏览器版本，请参阅左侧的导航。
版权 © 2015–2017, Texas Instruments Incorporated
159
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE5816ZAV
ACTIVE
NFBGA
ZAV
289
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
AFE5816
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
AFE5816ZAV
ZAV
NFBGA
289
126
7 X 18
150
315 135.9 7620 17.2
11.3 16.35
Pack Materials-Page 1
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