AFE7950IALK [TI]
AFE7950 4T6R RF Sampling AFE with 12 GSPS DACs and 3 GSPS ADCs;
| 型号： | AFE7950IALK |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AFE7950 4T6R RF Sampling AFE with 12 GSPS DACs and 3 GSPS ADCs |
| 文件： | 总13页 (文件大小：740K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AFE7950
SBASA41A – FEBRUARY 2021 – REVISED SEPTEMBER 2021
AFE7950 4T6R RF Sampling AFE with 12 GSPS DACs and 3 GSPS ADCs
The TX signal paths support interpolation and digital
1 Features
up conversion options that deliver up to 1200 MHz
of signal bandwidth for four TX or 2400 MHz for two
TX. The output of the DUCs drives a 12-GSPS DAC
(digital to analog converter) with a mixed mode output
option to enhance 2nd Nyquist operation. The DAC
output includes a variable gain amplifier (TX DSA)
with 40-dB range and 1-dB analog and 0.125-dB
digital steps.
•
•
•
Quad RF sampling 12-GSPS transmit DACs
Quad RF sampling 3-GSPS receive ADCs
Dual RF sampling 3-GSPS feedback (auxilliary
RX) ADCs
•
•
•
Maximum RF signal bandwidth:
– 4TX or 2FB: 1200 MHz or 2TX: 2400 MHz
– RX): 1200 MHz (no FB), 600 MHz (with FB)
RF frequency range:
– TX: 600MHz - 12GHz
– RX/FB: 600MHz -12GHz
Device Information
PART NUMBER
AFE7950
PACKAGE(1)
BODY SIZE
FC-BGA
17.00 mm × 17.00 mm
Digital step attenuators (DSA):
(1) For more information, see Mechanical, Packaging, and
Orderable Information.
– TX: 40 dB range, 0.125-dB steps
– RX or FB: 25 dB range, 0.5-dB steps
Single or dual-band DUC or DDCs for TX and RX
16x NCOs per TX or RX and FB
Optional Internal PLL or VCO for DAC or ADC
clocks or external clock at DAC or ADC sample
rate
•
•
•
•
SerDes data interface:
– JESD204B and JESD204C compatible
– 8 SerDes transceivers up to 29.5 Gbps
– Subclass 1 multi-device synchronization
Package: 17-mm × 17-mm FCBGA, 0.8-mm pitch
•
2 Applications
•
•
•
•
•
Radar
Seeker front end
Defense radio
Tactical communications infrastructure
Wireless communications test
3 Description
The AFE7950 is
a
high performance, wide
bandwidth multi-channel transceiver, integrating four
RF sampling transmitter chains, four RF sampling
receiver chains and two RF sampling feedback chains
(six RF sampling ADCs total). With operation up to
12 GHz, this device enables direct RF sampling in
the L, S, C and X-band frequency ranges without
the need for additional frequency conversions stages.
This improvement in density and flexibility enables
high-channel-count, multi-mission systems.
Functional Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE7950
www.ti.com
SBASA41A – FEBRUARY 2021 – REVISED SEPTEMBER 2021
4 Description (continued)
Each receiver chain includes a 25-dB range DSA (Digital Step Attenuator), followed by a 3-GSPS ADC (analog-
to-digital converter). Each receiver channel has an analog peak power detector and various digital power
detectors to assist an external or internal autonomous automatic gain controller, and RF overload detectors for
device reliability protection. Flexible decimation options provide optimization of data bandwidth up to 1200 MHz
for four RX without FB paths or 600 MHz with two FB paths (1200 MHz BW each).
Copyright © 2021 Texas Instruments Incorporated
2
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Product Folder Links: AFE7950
AFE7950
www.ti.com
SBASA41A – FEBRUARY 2021 – REVISED SEPTEMBER 2021
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (February 2021) to Revision A (August 2021)
Page
•
Changed the datasheet status From: Advanced Information To: Production data............................................. 1
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: AFE7950
AFE7950
www.ti.com
SBASA41A – FEBRUARY 2021 – REVISED SEPTEMBER 2021
6 Device and Documentation Support
6.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
6.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
6.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
6.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
6.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2021 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: AFE7950
PACKAGE OPTION ADDENDUM
www.ti.com
18-Nov-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE7950IABJ
AFE7950IALK
ACTIVE
ACTIVE
FCBGA
FCBGA
ABJ
ALK
400
400
90
90
RoHS & Green
SNAGCU
Level-3-260C-168 HR
Level-3-220C-168 HR
-40 to 85
-40 to 85
AFE7950I
Non-RoHS
& Green
Call TI
AFE7950
SNPB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Nov-2021
Addendum-Page 2
PACKAGE OUTLINE
ABJ0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65 MAX
0.2 C
(2.08)
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
0.3
TYP
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
V
T
W
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4221311/B 04/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
EXAMPLE BOARD LAYOUT
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
4
5
2 3
6
7
8
10
16
18
19 20
17
1
9
11 12 13 14 15
A
B
C
D
E
F
(0.8) TYP
0.415
0.385
G
H
J
400X
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
(
0.4)
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4221311/B 04/2020
NOTES: (continued)
5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
EXAMPLE STENCIL DESIGN
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
4
5
2 3
6
7
8
16
18
19 20
17
1
9
11 12 13 14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4221311/B 04/2020
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
PACKAGE OUTLINE
ALK0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65 MAX
0.2 C
(2.08)
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
0.3
TYP
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
V
T
W
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4225930/A 05/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
5. Pb-Free die bump and SnPb solder ball.
www.ti.com
EXAMPLE BOARD LAYOUT
ALK0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
4
5
2 3
6
7
8
10
16
18
19 20
17
1
9
11 12 13 14 15
A
B
C
D
E
F
(0.8) TYP
G
H
J
400X ( 0.4)
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
(
0.4)
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4225930/A 05/2020
NOTES: (continued)
6. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
EXAMPLE STENCIL DESIGN
ALK0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
4
5
2 3
6
7
8
16
18
19 20
17
1
9
11 12 13 14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4225930/A 05/2020
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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Copyright © 2021, Texas Instruments Incorporated
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