AWR6443ABGABLRQ1 [TI]
集成 MCU 和雷达加速器的单芯片 60GHz 至 64GHz 汽车雷达传感器 | ABL | 161 | -40 to 125;型号: | AWR6443ABGABLRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 集成 MCU 和雷达加速器的单芯片 60GHz 至 64GHz 汽车雷达传感器 | ABL | 161 | -40 to 125 雷达 传感器 |
文件: | 总84页 (文件大小:3121K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AWR6443, AWR6843
ZHCSL77D –APRIL 2020 –REVISED JANUARY 2022
AWR6443、AWR6843 单芯片60GHz 至64GHz 毫米波传感器
• 为用户应用提供的其他接口
– 多达6 个ADC 通道(低采样率监控)
– 多达2 个SPI 端口
– 多达2 个UART
1 特性
• FMCW 收发器
– 集成PLL、发送器、接收器、基带和ADC
– 60GHz 至64GHz 的覆盖范围,具有4GHz 的连
续带宽
– 2 个CAN-FD 接口
– I2C
– 四个接收通道
– 三个发送通道
– 支持6 位移相器
– GPIO
– 用于原始ADC 数据和调试仪表的双通道LVDS
接口
– 基于分数N PLL 的超精确线性调频脉冲引擎
– TX 功率:12dBm
– RX 噪声系数:
• 12dB
– 1MHz 时的相位噪声:
• 器件安全(在部分器件型号上)
– 支持经过身份验证和加密的安全引导
– 具有密钥撤销功能的客户可编程根密钥、对称密
钥(256 位)、非对称密钥(最高RSA-2K)
– 加密软件加速器–PKA、AES(最高256
位)、SHA(最高256 位)、TRNG/DRGB
• 符合功能安全标准
• –93dBc/Hz
• 内置校准和自检
– 基于Arm® Cortex®-R4F 的无线电控制系统
– 内置固件(ROM)
– 针对工艺和温度进行自校准的系统
– 在符合功能安全标准的器件上提供嵌入式自监
控,无需主机处理器参与
– 专为功能安全应用开发
– 文档有助于使ISO 26262 功能安全系统设计满
足ASIL-D 级要求
– 硬件完整性高达ASIL-B 级
– 安全相关认证
• 经TUV SUD 进行ISO 26262 认证达到ASIL
B 级
• 也提供非功能安全型号
• 符合AEC-Q100 标准
• 电源管理
• 用于高级信号处理的C674x DSP(仅限
AWR6843)
• 用于FFT、滤波和CFAR 处理的硬件加速器
• 存储器压缩
• 用于物体检测和接口控制的Arm® Cortex®-R4F 微
控制器
– 内置LDO 网络,可增强PSRR
– I/O 支持双电压3.3V/1.8V
• 时钟源
– 支持自主模式(从QSPI 闪存加载用户应用)
• 具有ECC 的内部存储器
– 具有内部振荡器的40.0MHz 晶体
– 支持频率为40MHz 的外部振荡器
– 支持外部驱动、频率为40MHz 的时钟(方波/正
弦波)
– AWR6843:1.75MB,分为MSS 程序RAM
(512KB)、MSS 数据RAM (192KB)、DSP
L1RAM (64KB) 和L2 RAM (256KB) 以及L3 雷
达数据立方体RAM (768KB)
– AWR6443:1.4MB,分为MSS 程序RAM
(512KB)、MSS 数据RAM (192KB) 和L3 雷达
数据立方体RAM (768KB)
• 轻松的硬件设计
– 0.65mm 间距、161 引脚10.4mm × 10.4mm 覆
晶BGA 封装,可实现轻松组装和低成本PCB
设计
– 技术参考手册包括允许的大小修改
– 小解决方案尺寸
• 运行条件:
– 结温范围为–40°C 至125°C
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SWRS248
AWR6443, AWR6843
ZHCSL77D –APRIL 2020 –REVISED JANUARY 2022
www.ti.com.cn
• 安全带提醒装置
• 驾驶员生命体征监测
• 脚踢传感器/接入传感器
• 手势识别
2 应用
• 车内感应
• 车内儿童检测
• 占位检测
3 说明
该AWR 器件是一款能够在60GHz 至64GHz 频带中运行且基于FMCW 雷达技术的集成式单芯片毫米波传感器。
该器件采用 TI 的低功耗 45nm RFCMOS 工艺制造,并且在超小封装中实现了出色的集成度。这是适用于汽车领
域低功耗、自监控、超精确雷达系统的理想解决方案。当前提供多种符合汽车标准的型号,包括功能安全合规型
器件和非功能安全器件。
器件信息
封装(1)
托盘/卷带包装
器件型号
封装尺寸
AWR6843AQGABLRQ1
AWR6843AQGABLQ1
AWR6843ABGABLRQ1
AWR6843ABGABLQ1
AWR6843ABSABLRQ1
AWR6843ABSABLQ1
AWR6443ABGABLRQ1
AWR6443ABGABLQ1
FCBGA (161)
FCBGA (161)
FCBGA (161)
FCBGA (161)
FCBGA (161)
FCBGA (161)
FCBGA (161)
FCBGA (161)
10.4mm × 10.4mm
10.4mm × 10.4mm
10.4mm × 10.4mm
10.4mm × 10.4mm
10.4mm × 10.4mm
10.4mm × 10.4mm
10.4mm × 10.4mm
10.4mm × 10.4mm
卷带包装
托盘
卷带包装
托盘
卷带包装
托盘
卷带包装
托盘
(1) 如需更多信息,请参阅节12 机械、封装和可订购信息。
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4 功能方框图
图4-1 展示了器件的功能方框图
Serial Flash Interface
QSPI
Cortex R4F
@ 200MHz
LNA
LNA
LNA
LNA
IF
IF
IF
IF
ADC
ADC
ADC
ADC
Optional External
MCU Interface
SPI
(User Programmable)
Digital
Front-End
PMIC Control
SPI / I2C
CAN-FD
CAN-FD
UARTs
Prog RAM
(512kB)
Data RAM
(192kB)
Boot
ROM
(Decimation
Filter Chain)
Primary Communication
Interfaces (Automotive)
Radar Hardware Accelerator
(FFT, Log Mag, And Others)
DMA
Main Sub-System
(Customer Programmed)
Test/
Debug
JTAG For Debug/
Development
ADC
Buffer
PA
´Å
´Å
´Å
Mailbox
High-Speed ADC Output
Interface (For Recording)
LVDS
HIL
Synth
(20 GHz)
Ramp
Generator
PA
x3
C674x DSP
@ 600 MHz
High-Speed Input For
Hardware-In-Loop Verification
Radio (BIST)
Processor
PA
GPADC
Osc.
(AWR6843 only)
6
(For RF Calibration
& Self-Test œ TI
Programmed)
L1P L1D
(32kB) (32kB)
L2 (256kB)
Prog RAM
& ROM
Data
RAM
Temp
DMA
CRC
Radar Data Memory
768 kB
Radio Processor
Sub-System
(TI Programmed)
DSP Sub-System
(Customer Programmed)
RF/Analog Sub-System
图4-1. 功能方框图
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Table of Contents
8 Detailed Description......................................................58
8.1 Overview...................................................................58
8.2 Functional Block Diagram.........................................58
8.3 Subsystems.............................................................. 59
8.4 Other Subsystems.................................................... 63
9 Monitoring and Diagnostics......................................... 65
9.1 Monitoring and Diagnostic Mechanisms................... 65
10 Applications, Implementation, and Layout............... 70
10.1 Application Information........................................... 70
10.2 Reference Schematic..............................................70
11 Device and Documentation Support..........................71
11.1 Device Nomenclature..............................................71
11.2 Tools and Software..................................................73
11.3 Documentation Support.......................................... 73
11.4 支持资源..................................................................73
11.5 Trademarks............................................................. 73
11.6 Electrostatic Discharge Caution..............................73
11.7 术语表..................................................................... 73
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 2
3 说明................................................................................... 2
4 功能方框图.........................................................................3
Revision History................................................................. 5
5 Device Comparison.........................................................6
5.1 Related Products........................................................ 7
6 Terminal Configuration and Functions..........................8
6.1 Pin Diagram................................................................ 8
6.2 Signal Descriptions................................................... 13
6.3 Pin Attributes.............................................................18
7 Specifications................................................................ 27
7.1 Absolute Maximum Ratings...................................... 27
7.2 ESD Ratings............................................................. 27
7.3 Power-On Hours (POH)............................................28
7.4 Recommended Operating Conditions.......................29
7.5 Power Supply Specifications.....................................29
7.6 Power Consumption Summary................................. 30
7.7 RF Specification........................................................31
7.8 CPU Specifications................................................... 32
7.9 Thermal Resistance Characteristics for FCBGA
Information.................................................................... 74
12.1 Packaging Information............................................ 74
12.2 Tray Information for ABL, 10.4 × 10.4 mm .............78
Package [ABL0161] ....................................................33
7.10 Timing and Switching Characteristics..................... 34
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Revision History
Changes from April 2, 2021 to January 10, 2022 (from Revision C (April 2021) to Revision D
(January 2022))
Page
• 通篇:进行了更新,以反映功能安全合规性;在主/从术语方面改用了更具包容性的措辞.................................. 1
•
(特性):更新了功能安全合规性认证资料;添加了关于器件安全的详细信息;提及了毫米波传感器的额定工
作温度范围..........................................................................................................................................................1
(器件信息):添加了功能安全合规型安全量产器件AWR6843ABSABLRQ1 和AWR6843ABSABLQ1..........2
•
• (Device Comparison) Changed/Updated to include AWR1843AOP; Updated/Changed the AWR6843AOP
Product status from "AI" to "PD" ........................................................................................................................ 6
• (Device Comparison) Removed information on Functional-Safety compliance from the table and instead
added a table-note for this and LVDS Interface; Additional information on Device security updated.................6
• (Signal Descriptions): Updated/Changed CLKP and CLKM descriptions.........................................................16
• (Absolute Maximum Ratings): Added entries for externally supplied power on the RF inputs (TX and RX) and
a table-note for the signal level applied on TX..................................................................................................27
• (Clock Specifications): Updated/Changed Crystal Electrical Characteristics (Oscillator Mode) to reflect correct
device operating temperature range.................................................................................................................35
• (Table. External Clock Mode Specifications): Revised frequency tolerance specs from +/-50 to +/-100 ppm..35
• (QSPI Timings):Updated/Changed Setup Time from 7.3us to 5us and Hold Time from 1.5us to 1us for QSPI
Timings............................................................................................................................................................. 52
• (QSPI Timings): Updated/Changed Delay time, sclk falling edge to d[1] transition [Q6, Q9] from -3.5us to
-2.5us (Min) and 7us to 4us (Max) in QSPI Switching Characteristics............................................................. 53
• (Transmit Subsystem): Updated/Changed figure..............................................................................................61
• (Monitoring and Diagnostic Mechanisms): Updated/Changed table header and description to reflect
Functional Safety-Compliance; added a note for reference to safety related collateral .................................. 65
• (Device Nomenclature) : Updated/modified figure to reflect Functional Safety compliance.............................71
• Tray Information for ABL, 10.4 × 10.4 mm: Added tray information for secure part......................................... 78
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5 Device Comparison
Unless otherwise noted, the device-specific information, in this document, relates to both the AWR6843 and
AWR6443 devices. The device differences are highlighted in 表5-1, Device Features Comparison.
表5-1. Device Features Comparison
FUNCTION
AWR6843AOP
AWR1843AOP
AWR6843 (1)
AWR6443 (1)
AWR1843
AWR1642
AWR1443
Antenna on Package (AOP)
Number of receivers
Number of transmitters
RF frequency range
On-chip memory
Yes
Yes
—
—
—
—
—
4
3(2)
4
3(2)
4
3(2)
4
3(2)
4
3(2)
4
4
2
76 to 81 GHz
1.5MB
5
3
76 to 81 GHz
576KB
5
60 to 64 GHz
1.75MB
10
76 to 81 GHz
2MB
60 to 64 GHz
1.75MB
10
60 to 64 GHz
1.4MB
10
76 to 81 GHz
2MB
Max I/F (Intermediate Frequency) (MHz)
Max real sampling rate (Msps)
Max complex sampling rate (Msps)
Device Security(3)
10
10
25
25
25
25
25
12.5
12.5
12.5
12.5
12.5
12.5
12.5
6.25
6.25
Yes
Yes
Yes
Yes
Yes
—
—
Processors
MCU (R4F)
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
DSP (C674x)
—
—
Peripherals
Serial Peripheral Interface (SPI) ports
Quad Serial Peripheral Interface (QSPI)
Inter-Integrated Circuit (I2C) interface
Controller Area Network (DCAN) interface
Controller Area Network (CAN-FD) interface
Trace
2
Yes
1
2
2
Yes
1
2
Yes
1
2
2
Yes
1
1
Yes
1
Yes
1
Yes
1
1
1
1
1
—
2
—
2
—
2
1
1
—
—
—
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
PWM
—
Hardware In Loop (HIL/DMM)
GPADC
—
Yes
Yes
LVDS/Debug(4)
CSI2
—
—
—
—
—
—
—
—
Hardware accelerator
1-V bypass mode
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
JTAG
Product Preview (PP),
Product
Advance Information (AI),
status
PD(5)
PD(5)
PD(5)
PD(5)
PD(5)
PD(5)
PD(5)
or Production Data (PD)
(1) Developed for Functional Safety applications, the device supports hardware integrity upto ASIL-B. Refer to the related documentation
for more details. Non-Functional Safety Variants are also available for AWR6843 device.
(2) 3 Tx Simultaneous operation is supported only with 1-V LDO bypass and PA LDO disable mode. In this mode, the 1-V supply needs to
be fed on the VOUT PA pin.
(3) Device security features including Secure Boot and Customer Programmable Keys are available in select devices for only select part
variants as indicated by the Device Type identifier in Section 3, Device Information table.
(4) The LVDS interface is not a production interface and is only used for debug.
(5) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. ADVANCE INFORMATION for pre-production products; subject to change without notice.
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5.1 Related Products
For information about other devices in this family of products or related products see the links that follow.
mmWave sensors
TI’s mmWave sensors rapidly and accurately sense range, angle and velocity with less
power using the smallest footprint mmWave sensor portfolio for automotive applications.
Automotive
mmWave sensors
TI’s automotive mmWave sensor portfolio offers high-performance radar front end to
ultra-high resolution, small and low-power single-chip radar solutions. TI’s scalable
sensor portfolio enables design and development of ADAS system solution for every
performance, application and sensor configuration ranging from comfort functions to
safety functions in all vehicles.
Companion
products for
AWR6843
Review products that are frequently purchased or used in conjunction with this product.
Reference designs TI Designs Reference Design Library is a robust reference design library spanning
for AWR6843
analog, embedded processor and connectivity. Created by TI experts to help you jump-
start your system design, all TI Designs include schematic or block diagrams, BOMs, and
design files to speed your time to market. Search and download designs at ti.com/
tidesigns.
Vehicle occupant
This reference design demonstrates the use of the AWR6843 60GHz single-chip
detection reference mmWave sensor with integrated DSP, as a Vehicle Occupant Detection (VOD) and Child
design
Presence Detection (CPD) Sensor enabling the detection of life forms in a vehicle. This
design provides a reference software processing chain which runs on the C674x DSP,
enabling the generation of a heat map to detect occupants in a Field of View (FOV) of ±60
degrees.
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6 Terminal Configuration and Functions
6.1 Pin Diagram
图 6-1 shows the pin locations for the 161-pin FCBGA package. 图 6-2, 图 6-3, 图 6-4, and 图 6-5 show the
same pins, but split into four quadrants.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
VOUT
_14APLL
OSC
_CLKOUT
VSSA
VSSA
A
B
C
D
E
F
VSSA
VOUT_PA
VSSA
VSSA
VSSA
VSSA
VOUT_
14SYNTH
VIN
_18CLK
VIN
_18VCO
VSSA
VSSA
VOUT_PA
VSSA
VSSA
TX1
VSSA
VSSA
TX2
VSSA
VSSA
TX3
VSSA
VSSA
VBGAP
VSSA
VSSA
CLKP
CLKM
VIN
_13RF2
VSSA
VSSA
VSSA
GPADC5
VIOIN_
18DIFF
VIN
_13RF2
SPIA_MOSI
GPADC6
VSSA
VSSA
VSSA
VSSA
VSSA
RX4
VSSA
VSSA
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
SPIA_CLK
SPIA_MISO
SPIB_CLK
SPIB_MISO
SPIA_CS_N
SPIB_MOSI
VIN_18BB
VSS
VSS
VSS
VIOIN
VIN
_13RF1
G
H
J
VSSA
RX3
VSSA
VSS
VSS
VSS
VSS
VSS
VSS
SYNC_OUT
GPIO_0
GPIO_1
GPIO_2
VPP
VIN_SRAM
VIN
_13RF1
VSSA
VSS
SPIB_CS_N
VDDIN
VIN
_13RF1
VSSA
RX2
VSSA
VSS
VSS
VSS
VSS
VSS
VSS
LVDS_TXP[0] LVDS_TXM[0]
LVDS_TXP[1] LVDS_TXM[1]
LVDS_CLKP LVDS_CLKM
K
L
VSSA
VIN_18BB
VSS
VSSA
RX1
VSSA
VSS
LVDS
_FRCLKP
LVDS
_FRCLKM
M
N
P
R
VSSA
NERROR
_OUT
MCU
_CLKOUT
WARM
_RESET
VSSA
GPADC1
VSSA
VSSA
GPADC2
GPADC4
VSSA
RS232_RX
RS232_TX
GPIO_32
GPIO_33
NERROR_IN
GPIO_36
TMS
TCK
VDDIN
QSPI_CS_N
TDI
QSPI[1]
QSPI[3]
TDO
DMM_SYNC
GPIO_47
VDDIN
PMIC
_CLKOUT
SPI_HOST
_INTR
GPIO_34
VDDIN
GPADC3
NRESET
SYNC_IN
GPIO_31
GPIO_38
GPIO_37
VNWA
GPIO_35
VIOIN_18
VIOIN
QSPI_CLK
QSPI[0]
QSPI[2]
VSS
Not to scale
图6-1. Pin Diagram (Top View)
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1
2
3
4
5
6
7
8
A
B
C
D
E
F
VSSA
VOUT_PA
VSSA
VSSA
VSSA
VSSA
VSSA
VOUT_PA
VSSA
VSSA
TX1
VSSA
VSSA
TX2
VSSA
VSSA
TX3
VIN
_13RF2
VSSA
VSSA
VSSA
VIN
_13RF2
VSSA
VSSA
VSSA
VSSA
VSSA
VSS
VSS
VSS
RX4
VIN_18BB
VIN
_13RF1
G
VSSA
VSSA
VSS
VSS
VSS
Not to scale
1
3
2
4
图6-2. Top Left Quadrant
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9
10
11
12
13
14
15
VOUT
OSC
A
B
C
D
E
F
VSSA
VSSA
VSSA
_14APLL
_CLKOUT
VIN
_18CLK
VIN
VOUT
VSSA
VSSA
VBGAP
VSSA
VSSA
CLKP
CLKM
_18VCO
_14SYNTH
GPADC5
SPIA_MOSI
SPIA_CLK
SPIB_MOSI
SYNC_OUT
VIOIN
_18DIFF
GPADC6
SPIA_MISO
SPIB_CLK
SPIB_MISO
SPIA_CS_N
VSS
VSS
VSS
VSS
VIOIN
VSS
VIN_SRAM
G
Not to scale
1
3
2
4
图6-3. Top Right Quadrant
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1
2
3
4
5
6
7
8
VIN
_13RF1
H
RX3
VSSA
VSS
VIN
_13RF1
J
VSSA
VSSA
VSSA
VSSA
VSS
VSS
VSS
VSS
VSS
VSS
K
L
RX2
VIN_18BB
VSSA
VSSA
VSSA
VSS
VSS
M
N
P
R
RX1
VSSA
NERROR
_OUT
MCU
_CLKOUT
VSSA
GPADC1
VSSA
VSSA
VSSA
RS232_RX
SYNC_IN
GPIO_31
RS232_TX
GPIO_32
GPIO_33
NERROR_IN
GPADC2
GPADC4
GPADC3
NRESET
GPIO_34
GPIO_36
GPIO_38
VDDIN
GPIO_35
GPIO_37
Not to scale
1
3
2
4
图6-4. Bottom Left Quadrant
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9
10
11
12
13
14
15
H
J
VSS
VSS
GPIO_0
SPIB_CS_N
VDDIN
VSS
VSS
VSS
GPIO_1
GPIO_2
VPP
LVDS_TXP[0] LVDS_TXM[0]
LVDS_TXP[1] LVDS_TXM[1]
LVDS_CLKP LVDS_CLKM
K
L
VSS
VSS
LVDS
_FRCLKP
LVDS
_FRCLKM
M
N
P
R
WARM
_RESET
GPIO_47
VDDIN
TMS
TCK
VDDIN
QSPI_CS_N
TDI
QSPI[1]
QSPI[3]
QSPI_clk
TDO
DMM_SYNC
PMIC
_CLKOUT
SPI_HOST_
INTR_1
VNWA
VIOIN_18
VIOIN
QSPI[0]
QSPI[2]
VSS
Not to scale
1
3
2
4
图6-5. Bottom Right Quadrant
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6.2 Signal Descriptions
备注
All IO pins of the device (except NERROR IN, NERROR_OUT, and WARM_RESET) are non-failsafe;
hence, care needs to be taken that they are not driven externally without the VIO supply being present
to the device.
备注
The GPIO state during the power supply ramp is not ensured. In case the GPIO is used in the
application where the state of the GPIO is critical, even when NRESET is low , a tri-state buffer should
be used to isolate the GPIO output from the radar device and a pull resister used to define the
required state in the application. The NRESET signal to the radar device could be used to control the
output enable (OE) of the tri-state buffer.
6.2.1 Signal Descriptions - Digital
SIGNAL NAME
BSS_UART_TX
PIN TYPE
DESCRIPTION
Debug UART Transmit [Radar Block]
BALL NO.
F14, H14, K13, N10, N13,
N4, N5, R8
O
CAN1_FD_RX
CAN1_FD_TX
CAN2_FD_RX
CAN2_FD_TX
DMM0
I
O
I
CAN1 FD (MCAN) Receive Signal
D13, F14, N10, N4, P12
CAN1 FD (MCAN) Transmit Signal
E14, H14, N5, P10, R14
CAN2 FD (MCAN) Receive Signal
E13
E15
R4
P5
IO
I
CAN2 FD (MCAN) Transmit Signal
Debug Interface (Hardware In Loop) - Data Line
Debug Interface (Hardware In Loop) - Data Line
Debug Interface (Hardware In Loop) - Data Line
Debug Interface (Hardware In Loop) - Data Line
Debug Interface (Hardware In Loop) - Data Line
Debug Interface (Hardware In Loop) - Data Line
Debug Interface (Hardware In Loop) - Data Line
Debug Interface (Hardware In Loop) - Data Line
Debug Interface (Hardware In Loop) - Clock
DMM1
I
DMM2
I
R5
P6
DMM3
I
DMM4
I
R7
P7
DMM5
I
DMM6
I
R8
P8
DMM7
I
DMM_CLK
I
N15
Debug Interface (Hardware In Loop) Mux Select between DMM1 and
DMM2 (Two Instances)
DMM_MUX_IN
I
G13, J13, P4
DMM_SYNC
DSS_UART_TX
EPWM1A
I
Debug Interface (Hardware In Loop) - Sync
Debug UART Transmit [DSP]
PWM Module 1 - Output A
N14
O
O
O
I
D13, E13, G14, P8, R12
N5, N8
EPWM1B
PWM Module 1 - Output B
H13, N5, P9
EPWM1SYNCI
EPWM2A
J13
O
O
O
O
O
IO
IO
IO
IO
IO
PWM Module 2- Output A
PWM Module 2 - Output B
H13, N4, N5, P9
EPWM2B
N4
R7
EPWM2SYNCO
EPWM3A
PWM Module 3 - Output A
N4
EPWM3SYNCO
GPIO_0
P6
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
H13
J13
K13
E13
H14
GPIO_1
GPIO_2
GPIO_3
GPIO_4
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BALL NO.
SIGNAL NAME
GPIO_5
PIN TYPE
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
O
DESCRIPTION
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
General-purpose I/O
I2C Clock
F14
P11
R12
R13
N12
R14
P12
P13
H13
N5
GPIO_6
GPIO_7
GPIO_8
GPIO_9
GPIO_10
GPIO_11
GPIO_12
GPIO_13
GPIO_14
GPIO_15
GPIO_16
GPIO_17
GPIO_18
GPIO_19
GPIO_20
GPIO_21
GPIO_22
GPIO_23
GPIO_24
GPIO_25
GPIO_26
GPIO_27
GPIO_28
GPIO_29
GPIO_30
GPIO_31
GPIO_32
GPIO_33
GPIO_34
GPIO_35
GPIO_36
GPIO_37
GPIO_38
GPIO_47
I2C_SCL
N4
J13
P10
N10
D13
E14
F13
G14
R11
N13
N8
K13
P9
P4
G13
C13
R4
P5
R5
P6
R7
P7
R8
P8
N15
G14, N4
F13, N5
J14
J15
K14
K15
L14
L15
M14
M15
N8
I2C_SDA
LVDS_TXP[0]
LVDS_TXM[0]
LVDS_TXP[1]
LVDS_TXM[1]
LVDS_CLKP
LVDS_CLKM
LVDS_FRCLKP
LVDS_FRCLKM
MCU_CLKOUT
I2C Data
Differential data Out –Lane 0
Differential data Out –Lane 1
Differential clock Out
O
O
O
O
O
O
Differential Frame Clock
O
O
Programmable clock given out to external MCU or the processor
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SIGNAL NAME
PIN TYPE
DESCRIPTION
Main Subsystem - UART A Receive
BALL NO.
F14, N4, R11
H14, N13, N5, R4
N4, P4
MSS_UARTA_RX
MSS_UARTA_TX
MSS_UARTB_RX
I
O
IO
Main Subsystem - UART A Transmit
Main Subsystem - UART B Receive
F14, H14, K13, N13, N5,
P10, P7
MSS_UARTB_TX
NDMM_EN
O
I
Main Subsystem - UART B Transmit
Debug Interface (Hardware In Loop) Enable - Active Low Signal
N13, N5
Failsafe input to the device. Nerror output from any other device can
be concentrated in the error signaling monitor module inside the
device and appropriate action can be taken by Firmware
NERROR_IN
I
N7
Open drain fail safe output signal. Connected to PMIC/
Processor/MCU to indicate that some severe criticality fault has
happened. Recovery would be through reset.
NERROR_OUT
O
N6
PMIC_CLKOUT
QSPI[0]
O
IO
I
Output Clock from AWR6843 device for PMIC
QSPI Data Line #0 (Used with Serial Data Flash)
QSPI Data Line #1 (Used with Serial Data Flash)
QSPI Data Line #2 (Used with Serial Data Flash)
QSPI Data Line #3 (Used with Serial Data Flash)
QSPI Clock (Used with Serial Data Flash)
QSPI Clock (Used with Serial Data Flash)
QSPI Chip Select (Used with Serial Data Flash)
Debug UART (Operates as Bus Master) - Receive Signal
Debug UART (Operates as Bus Master) - Transmit Signal
Sense On Power - Line#0
H13, K13, P9
R13
QSPI[1]
N12
QSPI[2]
I
R14
QSPI[3]
I
P12
QSPI_CLK
QSPI_CLK_EXT
QSPI_CS_N
RS232_RX
RS232_TX
SOP[0]
O
I
R12
H14
O
I
P11
N4
O
I
N5
N13
SOP[1]
I
Sense On Power - Line#1
G13
SOP[2]
I
Sense On Power - Line#2
P9
SPIA_CLK
SPIA_CS_N
SPIA_MISO
SPIA_MOSI
SPIB_CLK
SPIB_CS_N
SPIB_CS_N_1
SPIB_CS_N_2
SPIB_MISO
SPIB_MOSI
SPI_HOST_INTR
SYNC_IN
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
O
I
SPI Channel A - Clock
E13
SPI Channel A - Chip Select
E15
SPI Channel A - Master In Slave Out
SPI Channel A - Master Out Slave In
SPI Channel B - Clock
E14
D13
F14, R12
SPI Channel B Chip Select (Instance ID 0)
SPI Channel B Chip Select (Instance ID 1)
SPI Channel B Chip Select (Instance ID 2)
SPI Channel B - Master In Slave Out
SPI Channel B - Master Out Slave In
Out of Band Interrupt to an external host communicating over SPI
Low frequency Synchronization signal input
Low Frequency Synchronization Signal output
JTAG Test Clock
H14, P11
G13, J13, P13
G13, J13, N12
G14, R13
F13, N12
P13
P4
SYNC_OUT
TCK
O
I
G13, J13, K13, P4
P10
R11
N13
N10
N15
N14
R4
TDI
I
JTAG Test Data Input
TDO
O
I
JTAG Test Data Output
TMS
JTAG Test Mode Signal
TRACE_CLK
TRACE_CTL
TRACE_DATA_0
TRACE_DATA_1
TRACE_DATA_2
TRACE_DATA_3
O
O
O
O
O
O
Debug Trace Output - Clock
Debug Trace Output - Control
Debug Trace Output - Data Line
Debug Trace Output - Data Line
P5
Debug Trace Output - Data Line
R5
Debug Trace Output - Data Line
P6
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BALL NO.
SIGNAL NAME
TRACE_DATA_4
PIN TYPE
DESCRIPTION
Debug Trace Output - Data Line
O
O
O
O
O
O
O
R7
P7
TRACE_DATA_5
TRACE_DATA_6
TRACE_DATA_7
FRAME_START
CHIRP_START
CHIRP_END
Debug Trace Output - Data Line
Debug Trace Output - Data Line
R8
Debug Trace Output - Data Line
P8
Pulse signal indicating the start of each frame
Pulse signal indicating the start of each chirp
Pulse signal indicating the end of each chirp
N8, K13, P9
N8, K13, P9
N8, K13, P9
Open drain fail safe warm reset signal. Can be driven from PMIC for
diagnostic or can be used as status signal that the device is going
through reset.
WARM_RESET
IO
N9
6.2.2 Signal Descriptions - Analog
PIN
TYPE
INTERFACE
SIGNAL NAME
DESCRIPTION
Single ended transmitter1 o/p
BALL NO.
TX1
TX2
TX3
RX1
RX2
RX3
RX4
O
O
O
I
B4
B6
B8
M2
K2
H2
F2
R3
Transmitters
Single ended transmitter2 o/p
Single ended transmitter3 o/p
Single ended receiver1 i/p
Single ended receiver2 i/p
Single ended receiver3 i/p
Single ended receiver4 i/p
Power on reset for chip. Active low
I
Receivers
Reset
I
I
NRESET
I
In XTAL mode: Input for the reference crystal
In External clock mode: Single ended input
reference clock port
CLKP
I
I
B15
Reference
Oscillator
In XTAL mode: Feedback drive for the reference
crystal
In External clock mode: Connect this port to ground
CLKM
C15
A14
Reference clock output from clocking subsystem
after cleanup PLL (1.4V output voltage swing).
Reference clock
Bandgap voltage
OSC_CLKOUT
O
O
VBGAP
VDDIN
Device's Band Gap Reference Output
B10
H15, N11, P15, R6
G15
Power 1.2V digital power supply
VIN_SRAM
VNWA
Power 1.2V power rail for internal SRAM
Power 1.2V power rail for SRAM array back bias
P14
I/O Supply (3.3V or 1.8V): All CMOS I/Os would
operate on this supply
VIOIN
Power
R10, F15
Power supply
VIOIN_18
VIN_18CLK
VIOIN_18DIFF
VPP
Power 1.8V supply for CMOS IO
Power 1.8V supply for clock module
Power 1.8V supply for LVDS port
Power Voltage supply for fuse chain
R9
B11
D15
L13
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INTERFACE
PIN
TYPE
SIGNAL NAME
VIN_13RF1
DESCRIPTION
BALL NO.
1.3V Analog and RF supply,VIN_13RF1 and
VIN_13RF2 could be shorted on the board
Power
G5, H5, J5
VIN_13RF2
VIN_18BB
VIN_18VCO
Power 1.3V Analog and RF supply
Power 1.8V Analog base band power supply
Power 1.8V RF VCO supply
C2,D2
K5, F5
B12
L5, L6, L8, L10, K7,
K8, K9, K10, K11,
J6, J7, J8, J10, H7,
H9, H11, G6, G7,
G8, G10, F9, F11,
E5, E6, E8, E10,
E11, R15
VSS
Ground Digital ground
Power supply
A1, A3, A5, A7, A9,
A13, A15, B1, B3,
B5, B7, B9, B14,
C1, C3, C4, C5, C6,
C7, C8, C9, C14,
E1, E2, E3, F3, G1,
G2, G3, H3, J1, J2,
J3, K3, L1, L2, L3,
M3, N1, N2, N3, R1
VSSA
Ground Analog ground
VOUT_14APLL
O
Internal LDO output
A10
B13
A2, B2
P1
Internal LDO output/
inputs
VOUT_14SYNTH
O
Internal LDO output
VOUT_PA
IO
IO
IO
IO
IO
IO
IO
Internal LDO output
Analog Test1 / GPADC1
Analog Test2 / GPADC2
Analog Test3 / GPADC3
Analog Test4 / GPADC4
ANAMUX / GPADC5
VSENSE / GPADC6
Analog IO dedicated for ADC service
Analog IO dedicated for ADC service
Analog IO dedicated for ADC service
Analog IO dedicated for ADC service
Analog IO dedicated for ADC service
Analog IO dedicated for ADC service
Test and Debug
output for pre-
production phase.
Can be pinned out
on production
hardware for field
debug
P2
P3
R2
C13
D14
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6.3 Pin Attributes
表6-1. Pin Attributes (ABL0161 Package)
PINCNTL
BALL RESET
STATE [7]
PULL UP/DOWN
BALL NUMBER [1]
BALL NAME [2]
SIGNAL NAME [3]
MODE [5] [9]
TYPE [6]
ADDRESS [4]
TYPE [8]
H13
GPIO_0
GPIO_1
GPIO_13
0xFFFFEA04
0
IO
IO
O
O
O
IO
IO
O
I
Output Disabled
Pull Down
GPIO_0
1
PMIC_CLKOUT
EPWM1B
2
10
11
0
ePWM2A
J13
GPIO_16
0xFFFFEA08
Output Disabled
Pull Down
GPIO_1
1
SYNC_OUT
DMM_MUX_IN
SPIB_CS_N_1
SPIB_CS_N_2
EPWM1SYNCI
GPIO_26
2
12
13
14
15
0
IO
IO
I
K13
GPIO_2
0xFFFFEA64
IO
IO
O
O
O
O
O
O
O
O
O
IO
I
Output Disabled
Pull Down
GPIO_2
1
OSC_CLKOUT
MSS_UARTB_TX
BSS_UART_TX
SYNC_OUT
PMIC_CLKOUT
CHIRP_START
CHIRP_END
FRAME_START
TRACE_DATA_0
GPIO_31
2
7
8
9
10
11
12
13
0
R4
GPIO_31
0xFFFFEA7C
Output Disabled
Pull Down
1
DMM0
2
MSS_UARTA_TX
TRACE_DATA_1
GPIO_32
4
IO
O
IO
I
P5
R5
P6
GPIO_32
GPIO_33
GPIO_34
0xFFFFEA80
0xFFFFEA84
0xFFFFEA88
0
Output Disabled
Output Disabled
Output Disabled
Pull Down
Pull Down
Pull Down
1
DMM1
2
TRACE_DATA_2
GPIO_33
0
O
IO
I
1
DMM2
2
TRACE_DATA_3
GPIO_34
0
O
IO
I
1
DMM3
2
EPWM3SYNCO
4
O
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表6-1. Pin Attributes (ABL0161 Package) (continued)
PINCNTL
BALL RESET
STATE [7]
PULL UP/DOWN
BALL NUMBER [1]
BALL NAME [2]
SIGNAL NAME [3]
MODE [5] [9]
TYPE [6]
ADDRESS [4]
TYPE [8]
R7
P7
GPIO_35
GPIO_36
GPIO_37
GPIO_38
GPIO_47
TRACE_DATA_4
GPIO_35
0xFFFFEA8C
0xFFFFEA90
0xFFFFEA94
0xFFFFEA98
0xFFFFEABC
0
1
2
4
0
1
2
5
0
1
2
5
0
1
2
5
0
1
2
0
2
0
1
2
6
7
12
0
0
O
IO
I
Output Disabled
Output Disabled
Output Disabled
Output Disabled
Output Disabled
Pull Down
Pull Down
Pull Down
Pull Down
Pull Down
DMM4
EPWM2SYNCO
TRACE_DATA_5
GPIO_36
O
O
IO
I
DMM5
MSS_UARTB_TX
TRACE_DATA_6
GPIO_37
O
O
IO
I
R8
P8
DMM6
BSS_UART_TX
TRACE_DATA_7
GPIO_38
O
O
IO
I
DMM7
DSS_UART_TX
TRACE_CLK
GPIO_47
O
O
IO
I
N15
DMM_CLK
N14
N8
DMM_SYNC
TRACE_CTL
DMM_SYNC
GPIO_25
0xFFFFEAC0
0xFFFFEA60
O
I
Output Disabled
Output Disabled
Pull Down
Pull Down
MCU_CLKOUT
IO
O
O
O
O
O
I
MCU_CLKOUT
CHIRP_START
CHIRP_END
FRAME_START
EPWM1A
N7
N6
P9
NERROR_IN
NERROR_IN
NERROR_OUT
SOP[2]
0xFFFFEA44
0xFFFFEA4C
0xFFFFEA68
Input
NERROR_OUT
PMIC_CLKOUT
O
I
Hi-Z (Open Drain)
Output Disabled
During Power Up
Pull Down
GPIO_27
0
IO
O
O
O
O
O
O
PMIC_CLKOUT
CHIRP_START
CHIRP_END
FRAME_START
EPWM1B
1
6
7
8
11
12
EPWM2A
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表6-1. Pin Attributes (ABL0161 Package) (continued)
PINCNTL
BALL RESET
STATE [7]
PULL UP/DOWN
BALL NUMBER [1]
BALL NAME [2]
SIGNAL NAME [3]
MODE [5] [9]
TYPE [6]
ADDRESS [4]
TYPE [8]
R13
N12
QSPI[0]
QSPI[1]
GPIO_8
0xFFFFEA2C
0
1
2
0
1
2
8
0
1
8
0
1
8
0
1
2
6
0
1
2
0
1
2
6
7
8
9
10
11
12
IO
IO
IO
IO
I
Output Disabled
Pull Down
QSPI[0]
SPIB_MISO
GPIO_9
0xFFFFEA30
Output Disabled
Pull Down
QSPI[1]
SPIB_MOSI
SPIB_CS_N_2
GPIO_10
IO
IO
IO
I
R14
P12
R12
QSPI[2]
0xFFFFEA34
0xFFFFEA38
0xFFFFEA3C
Output Disabled
Output Disabled
Output Disabled
Pull Down
Pull Down
Pull Down
QSPI[2]
CAN1_FD_TX
GPIO_11
O
IO
I
QSPI[3]
QSPI[3]
CAN1_FD_RX
GPIO_7
I
QSPI_CLK
IO
O
IO
O
IO
O
IO
IO
I
QSPI_CLK
SPIB_CLK
DSS_UART_TX
GPIO_6
P11
N4
QSPI_CS_N
RS232_RX
0xFFFFEA40
0xFFFFEA74
Output Disabled
Input Enabled
Pull Up
Pull Up
QSPI_CS_N
SPIB_CS_N
GPIO_15
RS232_RX
MSS_UARTA_RX
BSS_UART_TX
MSS_UARTB_RX
CAN1_FD_RX
I2C_SCL
I
IO
IO
I
IO
O
O
O
EPWM2A
EPWM2B
EPWM3A
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表6-1. Pin Attributes (ABL0161 Package) (continued)
PINCNTL
BALL RESET
STATE [7]
PULL UP/DOWN
BALL NUMBER [1]
BALL NAME [2]
SIGNAL NAME [3]
MODE [5] [9]
TYPE [6]
ADDRESS [4]
TYPE [8]
N5
RS232_TX
GPIO_14
0xFFFFEA78
0
IO
O
IO
IO
IO
O
IO
O
O
I
Output Enabled
RS232_TX
1
MSS_UARTA_TX
MSS_UARTB_TX
BSS_UART_TX
CAN1_FD_TX
I2C_SDA
5
6
7
10
11
12
13
14
15
0
EPWM1A
EPWM1B
NDMM_EN
EPWM2A
O
IO
IO
I
E13
SPIA_CLK
GPIO_3
0xFFFFEA14
Output Disabled
Pull Up
SPIA_CLK
1
CAN2_FD_RX
DSS_UART_TX
GPIO_30
6
7
O
IO
IO
0
E15
E14
D13
SPIA_CS_N
SPIA_MISO
SPIA_MOSI
0xFFFFEA18
0xFFFFEA10
0xFFFFEA0C
0
Output Disabled
Output Disabled
Output Disabled
Pull Up
Pull Up
Pull Up
SPIA_CS_N
CAN2_FD_TX
GPIO_20
1
6
0
IO
IO
O
IO
IO
I
SPIA_MISO
CAN1_FD_TX
GPIO_19
1
2
0
SPIA_MOSI
CAN1_FD_RX
DSS_UART_TX
GPIO_5
1
2
8
O
IO
IO
I
F14
SPIB_CLK
0xFFFFEA24
0
Output Disabled
Pull Up
SPIB_CLK
1
MSS_UARTA_RX
MSS_UARTB_TX
BSS_UART_TX
CAN1_FD_RX
GPIO_4
2
6
O
O
I
7
8
H14
SPIB_CS_N
0xFFFFEA28
0
IO
IO
O
O
IO
I
Output Disabled
Pull Up
SPIB_CS_N
MSS_UARTA_TX
MSS_UARTB_TX
BSS_UART_TX
QSPI_CLK_EXT
CAN1_FD_TX
1
2
6
7
8
9
O
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表6-1. Pin Attributes (ABL0161 Package) (continued)
PINCNTL
BALL RESET
STATE [7]
PULL UP/DOWN
BALL NUMBER [1]
BALL NAME [2]
SIGNAL NAME [3]
MODE [5] [9]
TYPE [6]
ADDRESS [4]
TYPE [8]
G14
SPIB_MISO
GPIO_22
0xFFFFEA20
0
1
2
6
0
1
2
0
1
6
0
1
6
7
9
IO
IO
IO
O
IO
IO
IO
IO
O
IO
IO
I
Output Disabled
Pull Up
SPIB_MISO
I2C_SCL
DSS_UART_TX
GPIO_21
F13
P13
P4
SPIB_MOSI
SPI_HOST_INTR
SYNC_IN
0xFFFFEA1C
0xFFFFEA00
0xFFFFEA6C
Output Disabled
Output Disabled
Output Disabled
Pull Up
SPIB_MOSI
I2C_SDA
GPIO_12
Pull Down
Pull Down
SPI_HOST_INTR
SPIB_CS_N_1
GPIO_28
SYNC_IN
MSS_UARTB_RX
DMM_MUX_IN
SYNC_OUT
SOP[1]
IO
I
O
I
G13
SYNC_OUT
0xFFFFEA70
During Power Up
Output Disabled
Pull Down
GPIO_29
0
IO
O
I
SYNC_OUT
DMM_MUX_IN
SPIB_CS_N_1
SPIB_CS_N_2
GPIO_17
1
9
10
IO
IO
IO
I
11
P10
TCK
0xFFFFEA50
0
Input Enabled
Pull Down
Pull Up
TCK
1
MSS_UARTB_TX
CAN1_FD_TX
GPIO_23
2
O
O
IO
I
8
R11
N13
TDI
0xFFFFEA58
0xFFFFEA5C
0
Input Enabled
TDI
1
MSS_UARTA_RX
SOP[0]
2
I
TDO
During Power Up
I
Output Enabled
GPIO_24
0
1
2
6
7
9
0
1
2
6
IO
O
O
O
O
I
TDO
MSS_UARTA_TX
MSS_UARTB_TX
BSS_UART_TX
NDMM_EN
GPIO_18
N10
TMS
0xFFFFEA54
IO
I
Input Enabled
Pull Down
TMS
BSS_UART_TX
CAN1_FD_RX
O
I
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表6-1. Pin Attributes (ABL0161 Package) (continued)
PINCNTL
BALL RESET
STATE [7]
PULL UP/DOWN
BALL NUMBER [1]
BALL NAME [2]
SIGNAL NAME [3]
MODE [5] [9]
TYPE [6]
ADDRESS [4]
TYPE [8]
N9
WARM_RESET
WARM_RESET
0xFFFFEA48
0
IO
Hi-Z Input (Open
Drain)
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The following list describes the table column headers:
1. BALL NUMBER: Ball numbers on the bottom side associated with each signal on the bottom.
2. BALL NAME: Mechanical name from package device (name is taken from muxmode 1).
3. SIGNAL NAME: Names of signals multiplexed on each ball (also notice that the name of the ball is the signal name in muxmode 1).
4. PINCNTL ADDRESS: MSS Address for PinMux Control
5. MODE: Multiplexing mode number: value written to PinMux Cntl register to select specific Signal name for this Ball number. Mode column has bit
range value.
6. TYPE: Signal type and direction:
• I = Input
• O = Output
• IO = Input or Output
7. BALL RESET STATE: The state of the terminal after supplies are stable after power-on-reset (NRESET) is asserted
8. PULL UP/DOWN TYPE: indicates the presence of an internal pullup or pulldown resistor. Pullup and pulldown resistors can be enabled or disabled
via software.
• Pull Up: Internal pullup
• Pull Down: Internal pulldown
• An empty box means No pull.
9. Pin Mux Control Value maps to lower 4 bits of register.
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IO MUX registers are available in the MSS memory map and the respective mapping to device pins is as follows:
表6-2. PAD IO Control Registers
Default Pin/Ball Name
SPI_HOST_INTR
GPIO_0
Package Ball /Pin (Address)
Pin Mux Config Register
0xFFFFEA00
0xFFFFEA04
0xFFFFEA08
0xFFFFEA0C
0xFFFFEA10
0xFFFFEA14
0xFFFFEA18
0xFFFFEA1C
0xFFFFEA20
0xFFFFEA24
0xFFFFEA28
0xFFFFEA2C
0xFFFFEA30
0xFFFFEA34
0xFFFFEA38
0xFFFFEA3C
0xFFFFEA40
0xFFFFEA44
0xFFFFEA48
0xFFFFEA4C
0xFFFFEA50
0xFFFFEA54
0xFFFFEA58
0xFFFFEA5C
0xFFFFEA60
0xFFFFEA64
0xFFFFEA68
0xFFFFEA6C
0xFFFFEA70
0xFFFFEA74
0xFFFFEA78
P13
H13
J13
D13
E14
E13
E15
F13
G14
F14
H14
R13
N12
R14
P12
R12
P11
N7
GPIO_1
SPIA_MOSI
SPIA_MISO
SPIA_CLK
SPIA_CS_N
SPIB_MOSI
SPIB_MISO
SPIB_CLK
SPIB_CS_N
QSPI[0]
QSPI[1]
QSPI[2]
QSPI[3]
QSPI_CLK
QSPI_CS_N
NERROR_IN
WARM_RESET
NERROR_OUT
TCK
N9
N6
P10
N10
R11
N13
N8
TMS
TDI
TDO
MCU_CLKOUT
GPIO_2
K13
P9
PMIC_CLKOUT
SYNC_IN
P4
SYNC_OUT
RS232_RX
RS232_TX
G13
N4
N5
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表6-2. PAD IO Control Registers (continued)
Default Pin/Ball Name
GPIO_31
Package Ball /Pin (Address)
Pin Mux Config Register
0xFFFFEA7C
0xFFFFEA80
0xFFFFEA84
0xFFFFEA88
0xFFFFEA8C
0xFFFFEA90
0xFFFFEA94
0xFFFFEA98
0xFFFFEABC
0xFFFFEAC0
R4
P5
GPIO_32
GPIO_33
R5
P6
GPIO_34
GPIO_35
R7
P7
GPIO_36
GPIO_37
R8
P8
GPIO_38
GPIO_47
N15
N14
DMM_SYNC
The register layout is as follows:
表6-3. PAD IO Register Bit Descriptions
RESET (POWER
ON DEFAULT)
BIT
FIELD
TYPE
DESCRIPTION
31-11 NU
RW
RW
0
0
Reserved
10
9
SC
IO slew rate control:
0 = Higher slew rate
1 = Lower slew rate
PUPDSEL
PI
RW
RW
0
0
Pullup/PullDown Selection
0 = Pull Down
1 = Pull Up (This field is valid only if Pull Inhibit is set as '0')
8
Pull Inhibit/Pull Disable
0 = Enable
1 = Disable
7
6
OE_OVERRIDE
RW
RW
1
1
Output Override
OE_OVERRIDE_CTRL
Output Override Control:
(A '1' here overrides any o/p manipulation of this IO by any of the peripheral block hardware it is
associated with for example a SPI Chip select)
5
4
IE_OVERRIDE
RW
RW
0
0
Input Override
IE_OVERRIDE_CTRL
Input Override Control:
(A '1' here overrides any i/p value on this IO with a desired value)
3-0
FUNC_SEL
RW
1
Function select for Pin Multiplexing (Refer to the Pin Mux Sheet)
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7 Specifications
7.1 Absolute Maximum Ratings
PARAMETERS(1) (2)
1.2 V digital power supply
MIN
–0.5
–0.5
–0.5
MAX
1.4
UNIT
VDDIN
V
V
V
VIN_SRAM
VNWA
1.2 V power rail for internal SRAM
1.4
1.2 V power rail for SRAM array back bias
1.4
I/O supply (3.3 V or 1.8 V): All CMOS I/Os would operate on this
supply.
VIOIN
3.8
V
–0.5
VIOIN_18
1.8 V supply for CMOS IO
1.8 V supply for clock module
1.8 V supply for LVDS port
2
2
2
V
V
V
–0.5
–0.5
–0.5
VIN_18CLK
VIOIN_18DIFF
VIN_13RF1
VIN_13RF2
1.3 V Analog and RF supply, VIN_13RF1 and VIN_13RF2 could
be shorted on the board.
1.45
V
–0.5
VIN_13RF1
(1-V Internal LDO
bypass mode)
Device supports mode where external Power Management
block can supply 1 V on VIN_13RF1 and VIN_13RF2 rails. In
this configuration, the internal LDO of the device would be kept
bypassed.
1.4
V
–0.5
VIN_13RF2
(1-V Internal LDO
bypass mode)
VIN_18BB
VIN_18VCO supply
RX1-4
1.8-V Analog baseband power supply
1.8-V RF VCO supply
2
V
–0.5
–0.5
2
V
Externally applied power on RF inputs
Externally applied power on RF outputs(3)
Dual-voltage LVCMOS inputs, 3.3 V or 1.8 V (Steady State)
10
10
dBm
dBm
TX1-3
VIOIN + 0.3
VIOIN + 20% up to
–0.3V
Input and output
voltage range
V
Dual-voltage LVCMOS inputs, operated at 3.3 V/1.8 V
(Transient Overshoot/Undershoot) or external oscillator input
20% of signal period
CLKP, CLKM
Clamp current
Input ports for reference crystal
2
V
–0.5
Input or Output Voltages 0.3 V above or below their respective
power rails. Limit clamp current that flows through the internal
diode protection cells of the I/O.
20
mA
–20
TJ
Operating junction temperature range
125
150
°C
°C
–40
–55
TSTG
Storage temperature range after soldered onto PC board
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS, unless otherwise noted.
(3) This value is for an externally applied signal level on the TX. Additionally, a reflection coefficient up to Gamma = 1 can be applied on
the TX output.
7.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per AEC Q100-002(1)
Charged-device model (CDM), per AEC Q100-011(2)
V(ESD)
Electrostatic discharge
V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(2) Corner pins are rated as ±750 V
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7.3 Power-On Hours (POH)
OPERATING
CONDITION
JUNCTION TEMPERATURE (TJ)(1) (2)
NOMINAL CVDD VOLTAGE (V)
POWER-ON HOURS [POH] (HOURS)
600 (6%)
2000 (20%)
6500 (65%)
900 (9%)
–40°C
75°C
100% duty cycle
1.2
95°C
125°C
(1) This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard
terms and conditions for TI semiconductor products.
(2) The specified POH are applicable with max Tx output power settings using the default firmware gain tables. The specified POH would
not be applicable, if the Tx gain table is overwritten using an API.
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7.4 Recommended Operating Conditions
MIN
1.14
1.14
1.14
3.15
1.71
1.71
1.71
1.71
NOM
1.2
1.2
1.2
3.3
1.8
1.8
1.8
1.8
MAX
1.32
1.32
1.32
3.45
1.89
1.9
UNIT
VDDIN
1.2 V digital power supply
V
V
V
VIN_SRAM
VNWA
1.2 V power rail for internal SRAM
1.2 V power rail for SRAM array back bias
I/O supply (3.3 V or 1.8 V):
All CMOS I/Os would operate on this supply.
VIOIN
V
VIOIN_18
1.8 V supply for CMOS IO
1.8 V supply for clock module
1.8 V supply for LVDS port
V
V
V
VIN_18CLK
VIOIN_18DIFF
VIN_13RF1
VIN_13RF2
1.9
1.9
1.3 V Analog and RF supply. VIN_13RF1 and VIN_13RF2
could be shorted on the board
1.23
1.3
1.36
V
VIN_13RF1
(1-V Internal LDO
bypass mode)
Device supports mode where external Power Management
block can supply 1 V on VIN_13RF1 and VIN_13RF2 rails. In
this configuration, the internal LDO of the device would be
kept bypassed.
0.95
1
1.05
V
VIN_13RF2
(1-V Internal LDO
bypass mode)
VIN18BB
1.8-V Analog baseband power supply
1.8V RF VCO supply
1.71
1.71
1.17
2.25
1.8
1.8
1.9
1.9
V
V
VIN_18VCO
Voltage Input High (1.8 V mode)
Voltage Input High (3.3 V mode)
Voltage Input Low (1.8 V mode)
Voltage Input Low (3.3 V mode)
High-level output threshold (IOH = 6 mA)
Low-level output threshold (IOL = 6 mA)
VIL (1.8V Mode)
VIH
VIL
V
V
0.3*VIOIN
0.62
VOH
VOL
mV
mV
VIOIN –450
450
0.45
VIH (1.8V Mode)
0.96
1.57
NRESET
SOP[2:0]
V
VIL (3.3V Mode)
0.65
VIH (3.3V Mode)
7.5 Power Supply Specifications
表7-1 describes the four rails from an external power supply block of the AWR6843 device.
表7-1. Power Supply Rails Characteristics
SUPPLY
DEVICE BLOCKS POWERED FROM THE SUPPLY
RELEVANT IOS IN THE DEVICE
Input: VIN_18VCO, VIN18CLK, VIN_18BB,
VIOIN_18DIFF, VIOIN_18
LDO Output: VOUT_14SYNTH, VOUT_14APLL
Synthesizer and APLL VCOs, crystal oscillator, IF
Amplifier stages, ADC, LVDS
1.8 V
1.3 V (or 1 V in internal
LDO bypass mode)(1)
Power Amplifier, Low Noise Amplifier, Mixers and LO
Distribution
Input: VIN_13RF2, VIN_13RF1
LDO Output: VOUT_PA
3.3 V (or 1.8 V for 1.8 V
I/O mode)
Digital I/Os
Input VIOIN
1.2 V
Core Digital and SRAMs
Input: VDDIN, VIN_SRAM
(1) Three simultaneous transmitter operation is supported only in 1-V LDO bypass and PA LDO disable mode. In this mode 1V supply
needs to be fed on the VOUT PA pin.
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The 1.3-V (1.0 V) and 1.8-V power supply ripple specifications mentioned in 表 7-2 are defined to meet a target
spur level of –105 dBc (RF Pin = –15 dBm) at the RX. The spur and ripple levels have a dB-to-dB relationship,
for example, a 1-dB increase in supply ripple leads to a ~1 dB increase in spur level. Values quoted are rms
levels for a sinusoidal input applied at the specified frequency.
表7-2. Ripple Specifications
RF RAIL
VCO/IF RAIL
FREQUENCY (kHz)
1.0 V (INTERNAL LDO BYPASS)
1.3 V (µVRMS
)
1.8 V (µVRMS)
(µVRMS
)
137.5
275
7
5
648
76
22
4
83
21
11
6
550
3
1100
2200
4400
6600
2
11
13
22
82
93
117
13
19
29
7.6 Power Consumption Summary
表7-3 and 表7-4 summarize the power consumption at the power terminals.
表7-3. Maximum Current Ratings at Power Terminals
PARAMETER
SUPPLY NAME
DESCRIPTION
MIN
TYP
MAX
UNIT
Total current drawn by all
nodes driven by 1.2V rail
VDDIN, VIN_SRAM, VNWA
1000
Total current drawn by all
nodes driven by 1.3V or
1.0V rail (2TX, 4 RX
simultaneously)(3)
VIN_13RF1, VIN_13RF2
2000
850
Current consumption(1)
mA
VIOIN_18, VIN_18CLK,
VIOIN_18DIFF, VIN_18BB,
VIN_18VCO
Total current drawn by all
nodes driven by 1.8V rail
Total current drawn by all
nodes driven by 3.3V
rail(2)
VIOIN
50
(1) The specified current values are at typical supply voltage level.
(2) The exact VIOIN current depends on the peripherals used and their frequency of operation.
(3) Simultaneous 3 Transmitter operation is supported only with 1-V LDO bypass and PA LDO disable mode. In this mode, the 1-V supply
needs to be fed on the VOUT_PA pin. In this case, the peak 1-V supply current goes up to 2500 mA. To enable the LDO bypass mode,
see the Interface Control document in the mmWave software development kit (SDK).
表7-4. Average Power Consumption at Power Terminals
PARAMETER
CONDITION
DESCRIPTION
MIN
TYP MAX UNIT
1TX, 4RX
Regular power ADC mode 6.4
Msps complex transceiver,
13.13-ms frame, 64 chirps, 256
samples/chirp, 8.5-µs interchirp
time, DSP + Hardware
1.19
24% duty cycle
2TX, 4RX(1)
1TX, 4RX
1.25
1.0-V internal
LDO bypass
mode
accelerator active
Average power
consumption(1)
W
Regular power ADC mode 6.4
Msps complex transceiver,
13.13-ms frame, 64 chirps, 256
samples/chirp, 8.5-µs interchirp
time, DSP + Hardware
1.62
48% duty cycle
2TX, 4RX(1)
1.75
accelerator active
(1) Two TX antennas are on simultaneously.
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7.7 RF Specification
over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN
TYP
12
MAX UNIT
dB
Noise figure
60 to 64 GHz
1-dB compression point (Out Of Band )(1)
Maximum gain
dBm
–12
48
dB
Gain range
18
dB
Gain step size
2
dB
Receiver
IF bandwidth(2)
10 MHz
25 Msps
12.5 Msps
Bits
ADC sampling rate (real)
ADC sampling rate (complex 1x)
ADC resolution
12
–90
12
Idle Channel Spurs
Output power
dBFS
dBm
Transmitter
Power backoff range
Frequency range
26
dB
60
64 GHz
250 MHz/µs
dBc/Hz
Clock
subsystem
Ramp rate
Phase noise at 1-MHz offset
60 to 64 GHz
–93
(1) 1-dB Compression Point (Out Of Band) is measured by feed a Continuous wave Tone (10 kHz) well below the lowest HPF cut-off
frequency.
(2) The analog IF stages include high-pass filtering, with two independently configurable first-order high-pass corner frequencies. The set
of available HPF corners is summarized as follows:
Available HPF Corner Frequencies (kHz)
HPF1
HPF2
175, 235, 350, 700
350, 700, 1400, 2800
The filtering performed by the digital baseband chain is targeted to provide:
•
•
Less than ±0.5 dB pass-band ripple/droop, and
Better than 60 dB anti-aliasing attenuation for any frequency that can alias back into the pass-band.
图7-1 shows variations of noise figure and in-band P1dB parameters with respect to receiver gain programmed.
18
16
14
12
10
8
-18
-24
-30
-36
-42
-48
NF (dB)
In-band P1DB (dBm)
30
32
34
36
38 40
RX Gain (dB)
42
44
46
48
图7-1. Noise Figure, In-band P1dB vs Receiver Gain
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7.8 CPU Specifications
over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN
TYP
600
32
MAX UNIT
Clock Speed
DSP
MHz
KB
L1 Code Memory
Subsystem
(C674
Family)
L1 Data Memory
32
KB
L2 Memory
256
200
512
192
KB
Clock Speed
MHz
KB
Main
Subsystem
(R4F Family)
Tightly Coupled Memory - A (Program)
Tightly Coupled Memory - B (Data)
KB
Shared
Memory
Shared L3 Memory
768
KB
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7.9 Thermal Resistance Characteristics for FCBGA Package [ABL0161]
THERMAL METRICS(1)
°C/W(2) (3)
4.92
Junction-to-case
RΘJC
RΘJB
RΘJA
RΘJMA
PsiJT
6.57
Junction-to-board
22.3
Junction-to-free air
Junction-to-moving air
Junction-to-package top
Junction-to-board
N/A(4)
4.92
PsiJB
6.4
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.
(3) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/
JEDEC standards:
•
•
•
•
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(4) N/A = not applicable
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7.10 Timing and Switching Characteristics
7.10.1 Power Supply Sequencing and Reset Timing
The AWR6843 device expects all external voltage rails to be stable before reset is deasserted. 图 7-2 describes
the device wake-up sequence.
SOP
Setup
Time
SOP
Hold time to
nRESET
DC power
Stable before
nRESET
MSS
BOOT
START
nRESET
ASSERT
tPGDEL
DC
Power
notOK
DC
Power
OK
QSPI
READ
release
VDDIN,
VIN_SRAM
VNWA
VIOIN_18
VIN18_CLK
VIOIN_18DIFF
VIN18_BB
VIN_13RF1
VIN_13RF2
VIOIN
SOP IO
Reuse
SOP IO‘s can be used as functional IO‘s
SOP[2.1.0]
nRESET
WARMRESET
OUTPUT
VBGAP
OUTPUT
CLKP, CLKM
Using Crystal
MCUCLK
OUTPUT (1)
QSPI_CS
OUTPUT
8 ms (XTAL Mode)
850 µs (REFCLK Mode)
A. MCU_CLK_OUT in autonomous mode, where AWR6843 application is booted from the serial flash, MCU_CLK_OUT is not enabled by
default by the device bootloader.
图7-2. Device Wake-up Sequence
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7.10.2 Input Clocks and Oscillators
7.10.2.1 Clock Specifications
The AWR6843 requires external clock source (that is, a 40-MHz crystal or external oscillator to CLKP) for initial
boot and as a reference for an internal APLL hosted in the device. An external crystal is connected to the device
pins. 图7-3 shows the crystal implementation.
Cf1
XTALP
Cp
40 MHz
XTALM
Cf2
图7-3. Crystal Implementation
备注
The load capacitors, Cf1 and Cf2 in 图 7-3, should be chosen such that 方程式 1 is satisfied. CL in the
equation is the load specified by the crystal manufacturer. All discrete components used to implement
the oscillator circuit should be placed as close as possible to the associated oscillator CLKP and
CLKM pins.
C f2
CL = C f1
´
+CP
C
f1 +C f2
(1)
表7-5 lists the electrical characteristics of the clock crystal.
表7-5. Crystal Electrical Characteristics (Oscillator Mode)
NAME
DESCRIPTION
MIN
TYP
MAX
UNIT
MHz
pF
fP
Parallel resonance crystal frequency
40
CL
Crystal load capacitance
Crystal ESR
5
8
12
50
ESR
Ω
Temperature range Expected temperature range of operation
125
°C
–40
–50
Frequency
Crystal frequency tolerance(1) (2) (3)
tolerance
50
ppm
µW
Drive level
50
200
(1) The crystal manufacturer's specification must satisfy this requirement.
(2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance.
(3) Crystal tolerance affects radar sensor accuracy.
In the case where an external clock is used as the clock resource, the signal is fed to the CLKP pin only; CLKM
is grounded. The phase noise requirement is very important when a 40-MHz clock is fed externally. 表 7-6 lists
the electrical characteristics of the external clock signal.
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UNIT
表7-6. External Clock Mode Specifications
SPECIFICATION
PARAMETER
MIN
TYP
MAX
Frequency
40
MHz
mV (pp)
V
AC-Amplitude
700
0.00
1.6
1200
0.20
DC-Vil
DC-Vih
1.95
V
Input Clock:
External AC-coupled sine wave or DC-
coupled square wave
Phase Noise at 1 kHz
Phase Noise at 10 kHz
Phase Noise at 100 kHz
Phase Noise at 1 MHz
Duty Cycle
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
%
–132
–143
–152
–153
65
Phase Noise referred to 40 MHz
35
Freq Tolerance
100
ppm
–100
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7.10.3 Multibuffered / Standard Serial Peripheral Interface (MibSPI)
7.10.3.1 Peripheral Description
The MibSPI/SPI is a high-speed synchronous serial input/output port that allows a serial bit stream of
programmed length (2 to 16 bits) to be shifted into and out of the device at a programmed bit-transfer rate. The
MibSPI/SPI is normally used for communication between the microcontroller and external peripherals or another
microcontroller.
Standard and MibSPI modules have the following features:
• 16-bit shift register
• Receive buffer register
• 8-bit baud clock generator
• SPICLK can be internally-generated (master mode) or received from an external clock source
(slave mode)
• Each word transferred can have a unique format.
• SPI I/Os not used in the communication can be used as digital input/output signals
7.10.3.2 MibSPI Transmit and Receive RAM Organization
The Multibuffer RAM is comprised of 256 buffers. Each entry in the Multibuffer RAM consists of 4 parts: a 16-bit
transmit field, a 16-bit receive field, a 16-bit control field and a 16-bit status field. The Multibuffer RAM can be
partitioned into multiple transfer group with variable number of buffers each.
节7.10.3.2.2 and 节7.10.3.2.3 assume the operating conditions stated in 节7.10.3.2.1.
7.10.3.2.1 SPI Timing Conditions
MIN
TYP
MAX
UNIT
Input Conditions
tR
tF
Input rise time
Input fall time
1
1
3
3
ns
ns
Output Conditions
CLOAD
Output load capacitance
2
15
pF
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7.10.3.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
NO.(1) (2) (3)
PARAMETER
MIN
25
TYP
MAX
UNIT
1
tc(SPC)M
Cycle time, SPICLK(4)
256tc(VCLK)
0.5tc(SPC)M + 4
0.5tc(SPC)M + 4
0.5tc(SPC)M + 4
0.5tc(SPC)M + 4
ns
tw(SPCH)M
Pulse duration, SPICLK high (clock polarity = 0)
0.5tc(SPC)M –4
0.5tc(SPC)M –4
0.5tc(SPC)M –4
0.5tc(SPC)M –4
0.5tc(SPC)M –3
0.5tc(SPC)M –3
0.5tc(SPC)M –10.5
0.5tc(SPC)M –10.5
2(4)
3(4)
4(4)
5(4)
ns
ns
ns
ns
tw(SPCL)M
Pulse duration, SPICLK low (clock polarity = 1)
tw(SPCL)M
Pulse duration, SPICLK low (clock polarity = 0)
tw(SPCH)M
Pulse duration, SPICLK high (clock polarity = 1)
td(SPCH-SIMO)M
td(SPCL-SIMO)M
tv(SPCL-SIMO)M
tv(SPCH-SIMO)M
Delay time, SPISIMO valid before SPICLK low, (clock polarity = 0)
Delay time, SPISIMO valid before SPICLK high, (clock polarity = 1)
Valid time, SPISIMO data valid after SPICLK low, (clock polarity = 0)
Valid time, SPISIMO data valid after SPICLK high, (clock polarity = 1)
CSHOLD = 0
(C2TDELAY+2)*tc(VCLK)
(C2TDELAY+2) *
tc(VCLK) + 7
–7.5
Setup time CS active until SPICLK high
(clock polarity = 0)
CSHOLD = 1
CSHOLD = 0
CSHOLD = 1
(C2TDELAY +3) *
(C2TDELAY+3) *
tc(VCLK) + 7
t
c(VCLK) –7.5
6(5)
tC2TDELAY
ns
(C2TDELAY+2)*tc(VCLK)
(C2TDELAY+2) *
tc(VCLK) + 7
–7.5
Setup time CS active until SPICLK low
(clock polarity = 1)
(C2TDELAY +3) *
(C2TDELAY+3) *
tc(VCLK) + 7
t
c(VCLK) –7.5
Hold time, SPICLK low until CS inactive (clock polarity = 0)
Hold time, SPICLK high until CS inactive (clock polarity = 1)
0.5*tc(SPC)M
(T2CDELAY + 1)
+
0.5*tc(SPC)M +
(T2CDELAY + 1) *
tc(VCLK) + 7.5
*tc(VCLK) –7
7(5)
tT2CDELAY
ns
0.5*tc(SPC)M
+
0.5*tc(SPC)M +
(T2CDELAY + 1)
(T2CDELAY + 1) *
tc(VCLK) + 7.5
*tc(VCLK) –7
tsu(SOMI-SPCL)M
tsu(SOMI-SPCH)M
th(SPCL-SOMI)M
th(SPCH-SOMI)M
Setup time, SPISOMI before SPICLK low
(clock polarity = 0)
5
5
3
3
8(4)
ns
ns
Setup time, SPISOMI before SPICLK high
(clock polarity = 1)
Hold time, SPISOMI data valid after SPICLK low
(clock polarity = 0)
9(4)
Hold time, SPISOMI data valid after SPICLK high
(clock polarity = 1)
(1) The MASTER bit (SPIGCRx.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is cleared (where x= 0 or 1).
(2) tc(MSS_VCLK) = main subsystem clock time = 1 / f(MSS_VCLK). For more details, see the Technical Reference Manual.
(3) When the SPI is in Controller mode, the following must be true: For PS values from 1 to 255: tc(SPC)M ≥(PS +1)tc(MSS_VCLK) ≥25ns, where PS is the prescale value set in the SPIFMTx.
[15:8] register bits. For PS values of 0: tc(SPC)M = 2tc(MSS_VCLK) ≥25ns.
(4) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
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(5) C2TDELAY and T2CDELAY is programmed in the SPIDELAY register
11
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1
4
5
Master Out Data Is Valid
SPISIMO
8
9
Master In Data
Must Be Valid
SPISOMI
图7-4. SPI Controller Mode External Timing (CLOCK PHASE = 0)
Write to buffer
SPICLK
(clock polarity=0)
SPICLK
(clock polarity=1)
SPISIMO
SPICSn
Master Out Data Is Valid
6
7
图7-5. SPI Controller Mode Chip Select Timing (CLOCK PHASE = 0)
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7.10.3.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output,
SPISIMO = output, and SPISOMI = input)
NO.(1) (2) (3)
PARAMETER
MIN
25
TYP
MAX
UNIT
1
tc(SPC)M
Cycle time, SPICLK(4)
256tc(VCLK)
0.5tc(SPC)M + 4
0.5tc(SPC)M + 4
0.5tc(SPC)M + 4
0.5tc(SPC)M + 4
ns
tw(SPCH)M
Pulse duration, SPICLK high (clock polarity = 0)
0.5tc(SPC)M –4
0.5tc(SPC)M –4
0.5tc(SPC)M –4
0.5tc(SPC)M –4
0.5tc(SPC)M –3
0.5tc(SPC)M –3
0.5tc(SPC)M –10.5
0.5tc(SPC)M –10.5
2(4)
3(4)
4(4)
5(4)
ns
ns
ns
ns
tw(SPCL)M
Pulse duration, SPICLK low (clock polarity = 1)
tw(SPCL)M
Pulse duration, SPICLK low (clock polarity = 0)
tw(SPCH)M
Pulse duration, SPICLK high (clock polarity = 1)
td(SPCH-SIMO)M
td(SPCL-SIMO)M
tv(SPCL-SIMO)M
tv(SPCH-SIMO)M
tC2TDELAY
Delay time, SPISIMO valid before SPICLK low, (clock polarity = 0)
Delay time, SPISIMO valid before SPICLK high, (clock polarity = 1)
Valid time, SPISIMO data valid after SPICLK low, (clock polarity = 0)
Valid time, SPISIMO data valid after SPICLK high, (clock polarity = 1)
Setup time CS active until SPICLK high
(clock polarity = 0)
CSHOLD = 0
CSHOLD = 1
CSHOLD = 0
CSHOLD = 1
0.5*tc(SPC)M
+
0.5*tc(SPC)M +
(C2TDELAY+2) *
tc(VCLK) + 7.5
(C2TDELAY +
2)*tc(VCLK) –7
0.5*tc(SPC)M
+
0.5*tc(SPC)M +
(C2TDELAY+2) *
tc(VCLK) + 7.5
(C2TDELAY +
2)*tc(VCLK) –7
6(5)
ns
0.5*tc(SPC)M
+
0.5*tc(SPC)M +
(C2TDELAY+2) *
tc(VCLK) + 7.5
(C2TDELAY+2)*tc(V
CLK) –7
Setup time CS active until SPICLK low
(clock polarity = 1)
0.5*tc(SPC)M
+
0.5*tc(SPC)M +
(C2TDELAY+3)*tc(V
(C2TDELAY+3) *
tc(VCLK) + 7.5
CLK) –7
Hold time, SPICLK low until CS inactive (clock polarity = 0)
Hold time, SPICLK high until CS inactive (clock polarity = 1)
(T2CDELAY + 1)
*tc(VCLK) –7.5
(T2CDELAY + 1)
*tc(VCLK) + 7
7(5)
8(4)
9(4)
tT2CDELAY
ns
ns
ns
(T2CDELAY + 1)
*tc(VCLK) –7.5
(T2CDELAY + 1)
*tc(VCLK) + 7
tsu(SOMI-SPCL)M Setup time, SPISOMI before SPICLK low
(clock polarity = 0)
5
5
3
3
tsu(SOMI-SPCH)M Setup time, SPISOMI before SPICLK high
(clock polarity = 1)
th(SPCL-SOMI)M
Hold time, SPISOMI data valid after SPICLK low
(clock polarity = 0)
th(SPCH-SOMI)M
Hold time, SPISOMI data valid after SPICLK high
(clock polarity = 1)
(1) The MASTER bit (SPIGCRx.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is set ( where x = 0 or 1 ).
(2) tc(MSS_VCLK) = main subsystem clock time = 1 / f(MSS_VCLK). For more details, see the Technical Reference Manual.
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(3) When the SPI is in Controller mode, the following must be true: For PS values from 1 to 255: tc(SPC)M ≥(PS +1)tc(MSS_VCLK) ≥25 ns, where PS is the prescale value set in the SPIFMTx.
[15:8] register bits. For PS values of 0: tc(SPC)M = 2tc(MSS_VCLK) ≥25 ns.
(4) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
(5) C2TDELAY and T2CDELAY is programmed in the SPIDELAY register
1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
4
5
Master Out Data Is Valid
Data Valid
SPISIMO
8
9
Master In Data
Must Be Valid
SPISOMI
图7-6. SPI Controller Mode External Timing (CLOCK PHASE = 1)
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Write to buffer
SPICLK
(clock polarity=0)
SPICLK
(clock polarity=1)
SPISIMO
SPICSn
Master Out Data Is Valid
6
7
图7-7. SPI Controller Mode Chip Select Timing (CLOCK PHASE = 1)
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7.10.3.3 SPI Peripheral Mode I/O Timings
7.10.3.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input,
and SPISOMI = output)(1) (2) (3)
NO.
PARAMETER
MIN
25
TYP
MAX
UNIT
1
tc(SPC)S
Cycle time, SPICLK(4)
ns
tw(SPCH)S
tw(SPCL)S
tw(SPCL)S
tw(SPCH)S
td(SPCH-SOMI)S
Pulse duration, SPICLK high (clock polarity = 0)
Pulse duration, SPICLK low (clock polarity = 1)
Pulse duration, SPICLK low (clock polarity = 0)
Pulse duration, SPICLK high (clock polarity = 1)
10
2(5)
ns
ns
10
10
3(5)
10
Delay time, SPISOMI valid after SPICLK high
(clock polarity = 0)
10
10
4(5)
ns
ns
td(SPCL-SOMI)S
th(SPCH-SOMI)S
th(SPCL-SOMI)S
td(SPCH-SOMI)S
Delay time, SPISOMI valid after SPICLK low (clock
polarity = 1)
Hold time, SPISOMI data valid after SPICLK high
(clock polarity = 0)
2
2
5(5)
Hold time, SPISOMI data valid after SPICLK low
(clock polarity = 1)
Delay time, SPISOMI valid after SPICLK high
(clock polarity = 0; clock phase = 0) OR (clock
polarity = 1; clock phase = 1)
10
10
4(5)
5(5)
6(5)
7(5)
ns
ns
ns
ns
td(SPCL-SOMI)S
th(SPCH-SOMI)S
th(SPCL-SOMI)S
Delay time, SPISOMI valid after SPICLK low (clock
polarity = 1; clock phase = 0) OR (clock polarity =
0; clock phase = 1)
Hold time, SPISOMI data valid after SPICLK high
(clock polarity = 0; clock phase = 0) OR (clock
polarity = 1; clock phase = 1)
2
2
3
3
1
1
Hold time, SPISOMI data valid after SPICLK low
(clock polarity = 1; clock phase = 0) OR (clock
polarity = 0; clock phase = 1)
Setup time, SPISIMO before SPICLK low (clock
polarity = 0; clock phase = 0) OR (clock polarity =
1; clock phase = 1)
tsu(SIMO-SPCL)S
Setup time, SPISIMO before SPICLK high (clock
tsu(SIMO-SPCH)S polarity = 1; clock phase = 0) OR (clock polarity =
0; clock phase = 1)
Hold time, SPISIMO data valid after SPICLK low
(clock polarity = 0; clock phase = 0) OR (clock
polarity = 1; clock phase = 1)
th(SPCL-SIMO)S
Hold time, SPISIMO data valid after SPICLK high
(clock polarity = 1; clock phase = 0) OR (clock
polarity = 0; clock phase = 1)
th(SPCL-SIMO)S
(1) The MASTER bit (SPIGCRx.0) is cleared ( where x = 0 or 1 ).
(2) The CLOCK PHASE bit (SPIFMTx.16) is either cleared or set for CLOCK PHASE = 0 or CLOCK PHASE = 1 respectively.
(3) tc(MSS_VCLK) = main subsystem clock time = 1 / f(MSS_VCLK). For more details, see the Technical Reference Manual.
(4) When the SPI is in Peripheral mode, the following must be true: For PS values from 1 to 255: tc(SPC)S ≥(PS +1)tc(MSS_VCLK) ≥25 ns,
where PS is the prescale value set in the SPIFMTx.[15:8] register bits.For PS values of 0: tc(SPC)S = 2tc(MSS_VCLK) ≥25 ns.
(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
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1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
5
4
SPISOMI
SPISOMI Data Is Valid
6
7
SPISIMO Data
Must Be Valid
SPISIMO
图7-8. SPI Peripheral Mode External Timing (CLOCK PHASE = 0)
1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
4
5
SPISOMI
SPISOMI Data Is Valid
6
7
SPISIMO Data
Must Be Valid
SPISIMO
图7-9. SPI Peripheral Mode External Timing (CLOCK PHASE = 1)
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7.10.3.4 Typical Interface Protocol Diagram (Peripheral Mode)
1. Host should ensure that there is a delay of two SPI clocks between CS going low and start of SPI clock.
2. Host should ensure that CS is toggled for every 16 bits of transfer through SPI.
图7-10 shows the SPI communication timing of the typical interface protocol.
2 SPI clocks
CS
CLK
0x4321
0x1234
CRC
0x5678
0x8765
MOSI
MISO
IRQ
0xDCBA
0xABCD
CRC
16 bytes
图7-10. SPI Communication
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7.10.4 LVDS Interface Configuration
The supported LVDS lane configuration is two Data lanes (LVDS_TXP/M), one Bit Clock lane (LVDS_CLKP/M)
and one Frame clock lane (LVDS_FRCLKP/M). The LVDS interface is used for debugging. The LVDS interface
supports the following data rates:
• 900 Mbps (450 MHz DDR Clock)
• 600 Mbps (300 MHz DDR Clock)
• 450 Mbps (225 MHz DDR Clock)
• 400 Mbps (200 MHz DDR Clock)
• 300 Mbps (150 MHz DDR Clock)
• 225 Mbps (112.5 MHz DDR Clock)
• 150 Mbps (75 MHz DDR Clock)
Note that the bit clock is in DDR format and hence the numbers of toggles in the clock is equivalent to data.
LVDS_TXP/M
LVDS_FRCLKP/M
Data bitwidth
LVDS_CLKP/M
图7-11. LVDS Interface Lane Configuration And Relative Timings
7.10.4.1 LVDS Interface Timings
表7-7. LVDS Electrical Characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Duty Cycle Requirements
max 1 pF lumped capacitive load on
LVDS lanes
48%
52%
Output Differential Voltage
peak-to-peak single-ended with 100 Ω
resistive load between differential pairs
250
450
mV
Output Offset Voltage
Trise and Tfall
1125
1275
mV
ps
20%-80%, 900 Mbps
900 Mbps
330
80
Jitter (pk-pk)
ps
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Trise
LVDS_CLK
Clock Jitter = 6sigma
LVDS_TXP/M
LVDS_FRCLKP/M
1100 ps
图7-12. Timing Parameters
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7.10.5 General-Purpose Input/Output
节7.10.5.1 lists the switching characteristics of output timing relative to load capacitance.
7.10.5.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
PARAMETER(1) (2)
TEST CONDITIONS
CL = 20 pF
VIOIN = 1.8V
VIOIN = 3.3V
UNIT
2.8
6.4
9.4
2.8
6.4
9.4
3.3
6.7
9.6
3.1
6.6
9.6
3.0
6.9
10.2
2.8
6.6
9.8
3.3
7.2
10.5
3.1
6.6
9.6
tr
tf
tr
tf
Max rise time
CL = 50 pF
ns
CL = 75 pF
Slew control = 0
CL = 20 pF
CL = 50 pF
CL = 75 pF
CL = 20 pF
CL = 50 pF
CL = 75 pF
CL = 20 pF
CL = 50 pF
CL = 75 pF
Max fall time
Max rise time
Max fall time
ns
ns
ns
Slew control = 1
(1) Slew control, which is configured by PADxx_CFG_REG, changes behavior of the output driver (faster or slower output slew rate).
(2) The rise/fall time is measured as the time taken by the signal to transition from 10% and 90% of VIOIN voltage.
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7.10.6 Controller Area Network - Flexible Data-rate (CAN-FD)
The device integrates two CAN-FD (CAN with Flexible Data-rate) interfaces which allows high throughput and
increased payload per data frame. This enables support of a typical use case where one CAN-FD interface is
used as an ECU network interface while the other as a local network interface, providing communication with the
neighboring sensors.
The CAN-FD has the following features:
• Conforms with CAN Protocol 2.0 A, B and ISO 11898-1
• Full CAN FD support (up to 64 data bytes per frame)
• AUTOSAR and SAE J1939 support
• Up to 32 dedicated Transmit Buffers
• Configurable Transmit FIFO, up to 32 elements
• Configurable Transmit Queue, up to 32 elements
• Configurable Transmit Event FIFO, up to 32 elements
• Up to 64 dedicated Receive Buffers
• Two configurable Receive FIFOs, up to 64 elements each
• Up to 128 11-bit filter elements
• Internal Loopback mode for self-test
• Mask-able interrupts, two interrupt lines
• Two clock domains (CAN clock / Host clock)
• Parity / ECC support - Message RAM single error correction and double error detection (SECDED)
mechanism
• Full Message Memory capacity (4352 words).
7.10.6.1 Dynamic Characteristics for the CANx TX and RX Pins
PARAMETER
MIN
TYP
MAX
UNIT
td(CANx_FD_TX)
td(CANx_FD_RX)
Delay time, transmit shift register to
CANx_FD_TX pin(1)
15
ns
Delay time, CANx_FD_RX pin to receive shift
register(1)
10
ns
(1) These values do not include rise/fall times of the output buffer.
7.10.7 Serial Communication Interface (SCI)
The SCI has the following features:
• Standard universal asynchronous receiver-transmitter (UART) communication
• Standard non-return to zero (NRZ) format
• Double-buffered receive and transmit functions
• Asynchronous or iso-synchronous communication modes with no CLK pin
• Capability to use Direct Memory Access (DMA) for transmit and receive data
• Two external pins: RS232_RX and RS232_TX
7.10.7.1 SCI Timing Requirements
MIN
TYP
921.6
MAX
UNIT
f(baud)
Supported baud rate at 20 pF
kHz
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7.10.8 Inter-Integrated Circuit Interface (I2C)
The inter-integrated circuit (I2C) module is a multi-controller communication module providing an interface
between devices compliant with Philips Semiconductor I2C-bus specification version 2.1 and connected by an
I2C-bus™. This module will support any target or controller I2C compatible device.
The I2C has the following features:
• Compliance to the Philips I2C bus specification, v2.1 (The I2C Specification, Philips document number 9398
393 40011)
– Bit/Byte format transfer
– 7-bit and 10-bit device addressing modes
– General call
– START byte
– Multi-controller transmitter/ target receiver mode
– Multi-controller receiver/ target transmitter mode
– Combined controller transmit/receive and receive/transmit mode
– Transfer rates of 100 kbps up to 400 kbps (Phillips fast-mode rate)
• Free data format
• Two DMA events (transmit and receive)
• DMA event enable/disable capability
• Module enable/disable capability
• The SDA and SCL are optionally configurable as general purpose I/O
• Slew rate control of the outputs
• Open drain control of the outputs
• Programmable pullup/pulldown capability on the inputs
• Supports Ignore NACK mode
备注
This I2C module does not support:
• High-speed (HS) mode
• C-bus compatibility mode
• The combined format in 10-bit address mode (the I2C sends the target address second byte every
time it sends the target address first byte)
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7.10.8.1 I2C Timing Requirements
(1)
STANDARD MODE
FAST MODE
UNIT
MIN
10
MAX
MIN
2.5
MAX
tc(SCL)
Cycle time, SCL
μs
μs
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low
(for a repeated START condition)
4.7
0.6
th(SCLL-SDAL)
Hold time, SCL low after SDA low
4
0.6
μs
(for a START and a repeated START condition)
tw(SCLL)
Pulse duration, SCL low
4.7
4
1.3
0.6
100
0
μs
μs
μs
μs
μs
tw(SCLH)
Pulse duration, SCL high
tsu(SDA-SCLH)
th(SCLL-SDA)
tw(SDAH)
Setup time, SDA valid before SCL high
Hold time, SDA valid after SCL low
250
0
3.45(1)
0.9
Pulse duration, SDA high between STOP and START
conditions
4.7
1.3
tsu(SCLH-SDAH)
tw(SP)
Setup time, SCL high before SDA high
(for STOP condition)
4
0.6
0
μs
Pulse duration, spike (must be suppressed)
Capacitive load for each bus line
50
ns
(2) (3)
Cb
400
400
pF
(1) The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered
down.
(2) The maximum th(SDA-SCLL) for I2C bus devices has only to be met if the device does not stretch the low period (tw(SCLL)) of the
SCL signal.
(3) Cb = total capacitance of one bus line in pF. If mixed with fast-mode devices, faster fall-times are allowed.
SDA
tw(SDAH)
tsu(SDA-SCLH)
tw(SP)
tw(SCLL)
tr(SCL)
tsu(SCLH-SDAH)
tw(SCLH)
SCL
tc(SCL)
th(SCLL-SDAL)
tf(SCL)
th(SCLL-SDAL)
tsu(SCLH-SDAL)
th(SDA-SCLL)
Stop
Start
Repeated Start
Stop
图7-13. I2C Timing Diagram
备注
• A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the
VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL.
• The maximum th(SDA-SCLL) has only to be met if the device does not stretch the LOW period
(tw(SCLL)) of the SCL signal. E.A Fast-mode I2C-bus device can be used in a Standard-mode
I2C-bus system, but the requirement tsu(SDA-SCLH) ≥250 ns must then be met. This will
automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a
device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA
line tr max + tsu(SDA-SCLH)
.
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7.10.9 Quad Serial Peripheral Interface (QSPI)
The quad serial peripheral interface (QSPI) module is a kind of SPI module that allows single, dual, or quad read
access to external SPI devices. This module has a memory mapped register interface, which provides a direct
interface for accessing data from external SPI devices and thus simplifying software requirements. The QSPI
works as a master only. The QSPI in the device is primarily intended for fast booting from quad-SPI flash
memories.
The QSPI supports the following features:
• Programmable clock divider
• Six-pin interface
• Programmable length (from 1 to 128 bits) of the words transferred
• Programmable number (from 1 to 4096) of the words transferred
• Support for 3-, 4-, or 6-pin SPI interface
• Optional interrupt generation on word or frame (number of words) completion
• Programmable delay between chip select activation and output data from 0 to 3 QSPI clock cycles
节7.10.9.2 and 节7.10.9.3 assume the operating conditions stated in 节7.10.9.1.
7.10.9.1 QSPI Timing Conditions
MIN
TYP
MAX
UNIT
Input Conditions
tR
tF
Input rise time
Input fall time
1
1
3
3
ns
ns
Output Conditions
CLOAD
Output load capacitance
2
15
pF
7.10.9.2 Timing Requirements for QSPI Input (Read) Timings
Clock Mode 0 (clk polarity = 0 ; clk phase = 0 ) is the mode of operation.(1)
MIN
5
TYP
MAX
UNIT
ns
tsu(D-SCLK)
th(SCLK-D)
tsu(D-SCLK)
th(SCLK-D)
Setup time, d[3:0] valid before falling sclk edge
Hold time, d[3:0] valid after falling sclk edge
1
ns
5 –P(2)
1 + P(2)
Setup time, final d[3:0] bit valid before final falling sclk edge
Hold time, final d[3:0] bit valid after final falling sclk edge
ns
ns
(1) The Device captures data on the falling clock edge in Clock Mode 0, as opposed to the traditional rising clock edge. Although non-
standard, the falling-edge-based setup and hold time timings have been designed to be compatible with standard SPI devices that
launch data on the falling edge in Clock Mode 0.
(2) P = SCLK period in ns.
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7.10.9.3 QSPI Switching Characteristics
NO.
Q1
Q2
Q3
PARAMETER
Cycle time, sclk
MIN
12.5
TYP
MAX
UNIT
ns
tc(SCLK)
Y*P –3(1) (2)
Y*P –3(1)
tw(SCLKL)
tw(SCLKH)
td(CS-SCLK)
Pulse duration, sclk low
ns
Pulse duration, sclk high
ns
–M*P –1(1)
–M*P + 2.5(1)
Delay time, sclk falling edge to cs active edge
ns
Q4
Q5
(3)
(3)
td(SCLK-CS)
Delay time, sclk falling edge to cs inactive edge
N*P + 2.5(1)
ns
N*P –1(1) (3)
(3)
td(SCLK-D1)
tena(CS-D1LZ)
tdis(CS-D1Z)
td(SCLK-D1)
Delay time, sclk falling edge to d[1] transition
Enable time, cs active edge to d[1] driven (lo-z)
Disable time, cs active edge to d[1] tri-stated (hi-z)
ns
ns
ns
ns
Q6
Q7
Q8
4
–P +1(3)
–P +1(3)
–2.5
–P –4(3)
–P –4(3)
Delay time, sclk first falling edge to first d[1] transition
(for PHA = 0 only)
–2.5 –P(3)
4 –P(3)
Q9
Q12
Q13
tsu(D-SCLK)
th(SCLK-D)
tsu(D-SCLK)
Setup time, d[3:0] valid before falling sclk edge
Hold time, d[3:0] valid after falling sclk edge
5
1
ns
ns
ns
Setup time, final d[3:0] bit valid before final falling
sclk edge
5 —P(3)
Q14
Q15
th(SCLK-D)
Hold time, final d[3:0] bit valid after final falling sclk
edge
ns
1 + P(3)
(1) The Y parameter is defined as follows: If DCLK_DIV is 0 or ODD then, Y equals 0.5. If DCLK_DIV is EVEN then, Y equals
(DCLK_DIV/2) / (DCLK_DIV+1). For best performance, it is recommended to use a DCLK_DIV of 0 or ODD to minimize the duty cycle
distortion. All required details about clock division factor DCLK_DIV can be found in the device-specific Technical Reference Manual.
(2) P = SCLK period in ns.
(3) M = QSPI_SPI_DC_REG.DDx + 1, N = 2
图7-14. QSPI Read (Clock Mode 0)
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PHA=0
cs
Q5
Q4
Q1
Q2
Q3
POL=0
sclk
Q8
Q6
Q6
Q7
Q9
Q6
Command
Bit n-1
Command
Bit n-2
Write Data
Bit 1
Write Data
Bit 0
d[0]
d[3:1]
SPRS85v_TIMING_OSPI1_04
图7-15. QSPI Write (Clock Mode 0)
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7.10.10 ETM Trace Interface
节7.10.10.2 assumes the recommended operating conditions stated in 节7.10.10.1.
7.10.10.1 ETMTRACE Timing Conditions
MIN
TYP
MAX
UNIT
Output Conditions
CLOAD
Output load capacitance
2
20
pF
7.10.10.2 ETM TRACE Switching Characteristics
NO.
1
PARAMETER
Cycle time, TRACECLK period
Pulse Duration, TRACECLK High
Pulse Duration, TRACECLK Low
Clock and data rise time
MIN
TYP
MAX
UNIT
ns
tcyc(ETM)
th(ETM)
tl(ETM)
20
9
2
ns
3
9
ns
4
tr(ETM)
tf(ETM)
3.3
3.3
7
ns
5
Clock and data fall time
ns
td(ETMTRACE Delay time, ETM trace clock high to ETM data valid
1
1
ns
6
7
CLKH-
ETMDATAV)
td(ETMTRACE Delay time, ETM trace clock low to ETM data valid
7
ns
CLKl-
ETMDATAV)
tl(ETM)
th(ETM)
tr(ETM)
tf(ETM)
tcyc(ETM)
图7-16. ETMTRACECLKOUT Timing
图7-17. ETMDATA Timing
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7.10.11 Data Modification Module (DMM)
A Data Modification Module (DMM) gives the ability to write external data into the device memory.
The DMM has the following features:
• Acts as a bus master, thus enabling direct writes to the 4GB address space without CPU intervention
• Writes to memory locations specified in the received packet (leverages packets defined by trace mode of the
RAM trace port [RTP] module)
• Writes received data to consecutive addresses, which are specified by the DMM (leverages packets defined
by direct data mode of RTP module)
• Configurable port width (1, 2, 4, 8 pins)
• Up to 100 Mbit/s pin data rate
7.10.11.1 DMM Timing Requirements
MIN
10
1
TYP
MAX
UNIT
ns
tcyc(DMM)
tR
Clock period
Clock rise time
3
3
ns
tF
Clock fall time
1
ns
th(DMM)
tl(DMM)
tssu(DMM)
tsh(DMM)
tdsu(DMM)
tdh(DMM)
High pulse width
6
ns
Low pulse width
6
ns
SYNC active to clk falling edge setup time
DMM clk falling edge to SYNC deactive hold time
DATA to DMM clk falling edge setup time
DMM clk falling edge to DATA hold time
2
ns
3
ns
2
ns
3
ns
tl(DMM)
th(DMM)
tf
tr
tcyc(DMM)
图7-18. DMMCLK Timing
tssu(DMM)
tsh(DMM)
DMMSYNC
DMMCLK
DMMDATA
tdsu(DMM)
tdh(DMM)
图7-19. DMMDATA Timing
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7.10.12 JTAG Interface
节7.10.12.2 and 节7.10.12.3 assume the operating conditions stated in 节7.10.12.1.
7.10.12.1 JTAG Timing Conditions
MIN
TYP
MAX
UNIT
Input Conditions
tR
tF
Input rise time
Input fall time
1
1
3
3
ns
ns
Output Conditions
CLOAD
Output load capacitance
2
15
pF
7.10.12.2 Timing Requirements for IEEE 1149.1 JTAG
NO.
MIN
TYP
MAX
UNIT
ns
1
tc(TCK)
Cycle time TCK
66.66
26.67
26.67
2.5
1a
1b
tw(TCKH)
Pulse duration TCK high (40% of tc)
Pulse duration TCK low(40% of tc)
Input setup time TDI valid to TCK high
Input setup time TMS valid to TCK high
Input hold time TDI valid from TCK high
Input hold time TMS valid from TCK high
ns
tw(TCKL)
ns
tsu(TDI-TCK)
tsu(TMS-TCK)
th(TCK-TDI)
th(TCK-TMS)
ns
3
4
2.5
ns
18
ns
18
ns
7.10.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
NO.
PARAMETER
MIN
TYP
MAX
UNIT
2
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
0
25
ns
1
1a
1b
TCK
TDO
2
3
4
TDI/TMS
SPRS91v_JTAG_01
图7-20. JTAG Timing
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8 Detailed Description
8.1 Overview
The AWR6843 device includes the entire Millimeter Wave blocks and analog baseband signal chain for three
transmitters and four receivers, as well as a customer-programmable MCU. This device is applicable as a radar-
on-a-chip in use-cases with modest requirements for memory, processing capacity, and application code size.
These could be cost-sensitive automotive applications that are evolving from 24-GHz narrowband
implementation and some emerging simple ultra-short-range radar applications. Typical application examples for
this device include: child presence detection, occupant detection, seat belt reminder, gesture detection, driver
vital sign monitoring.
In terms of scalability, the AWR6843 device could be paired with a low-end external MCU, to address more
complex applications that might require additional memory for larger application software footprint and faster
interfaces. Because the AWR6843 device also provides high speed data interfaces like Serial-LVDS, it is suitable
for interfacing with more capable external processing blocks. Here system designers can choose the AWR6843
to provide raw ADC data.
8.2 Functional Block Diagram
Serial Flash Interface
QSPI
Cortex R4F
@ 200MHz
LNA
LNA
LNA
LNA
IF
IF
IF
IF
ADC
ADC
ADC
ADC
Optional External
MCU Interface
SPI
(User Programmable)
Digital
Front-End
PMIC Control
SPI / I2C
CAN-FD
CAN-FD
UARTs
Prog RAM
(512kB)
Data RAM
(192kB)
Boot
ROM
(Decimation
Filter Chain)
Primary Communication
Interfaces (Automotive)
Radar Hardware Accelerator
(FFT, Log Mag, And Others)
DMA
Main Sub-System
(Customer Programmed)
Test/
Debug
JTAG For Debug/
Development
ADC
Buffer
PA
´Å
´Å
´Å
Mailbox
High-Speed ADC Output
Interface (For Recording)
LVDS
HIL
Synth
(20 GHz)
Ramp
Generator
PA
x3
C674x DSP
@ 600 MHz
High-Speed Input For
Hardware-In-Loop Verification
Radio (BIST)
Processor
PA
GPADC
Osc.
(AWR6843 only)
6
(For RF Calibration
& Self-Test œ TI
Programmed)
L1P L1D
(32kB) (32kB)
L2 (256kB)
Prog RAM
& ROM
Data
RAM
Temp
DMA
CRC
Radar Data Memory
768 kB
Radio Processor
Sub-System
(TI Programmed)
DSP Sub-System
(Customer Programmed)
RF/Analog Sub-System
图8-1. Functional Block Diagram
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8.3 Subsystems
8.3.1 RF and Analog Subsystem
The RF and analog subsystem includes the RF and analog circuitry – namely, the synthesizer, PA, LNA, mixer,
IF, and ADC. This subsystem also includes the crystal oscillator and temperature sensors. The three transmit
channels can be operated up to a maximum of two at a time (simultaneously) in 1.3-V mode. The three Transmit
channels simultaneous operation is supported only with 1-V LDO bypass and PA LDO disabled mode for
transmit beamforming purpose, as required. In this mode, the 1-V supply needs to be fed on the VIN_13RF1,
VIN_13RF2, and VOUT PA pin; whereas, the four receive channels can all be operated simultaneously.
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8.3.1.1 Clock Subsystem
The AWR6843 clock subsystem generates 60 to 64 GHz from an input reference of 40-MHz crystal. It has a
built-in oscillator circuit followed by a clean-up PLL and a RF synthesizer circuit. The output of the RF
synthesizer is then processed by an X3 multiplier to create the required frequency in the 60 to 64 GHz spectrum.
The RF synthesizer output is modulated by the timing engine block to create the required waveforms for effective
sensor operation.
The clean-up PLL also provides a reference clock for the host processor after system wakeup.
The clock subsystem also has built-in mechanisms for detecting the presence of a crystal and monitoring the
quality of the generated clock.
图8-2 describes the clock subsystem.
Self Test
SYNC_OUT
RX LO
Timing Engine
x3 MULT
SYNC_IN
TX LO
RFSYNTH
Lock Detect
Clean-Up
PLL
SoC
Clock
XO / Slicer
CLK Detect
OSC_CLKOUT
40 MHz
图8-2. Clock Subsystem
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8.3.1.2 Transmit Subsystem
The AWR6843 transmit subsystem consists of three parallel transmit chains, each with independent phase and
amplitude control. The device supports 6-bit linear phase modulation for MIMO radar.
The transmit chains also support programmable backoff for system optimization.
图8-3 describes the transmit subsystem.
Loopback
path
Self Test
0 or 180°
(From timing Engine)
PCB
50 W
DF
LO
6-bit Linear Phase
Shifter
图8-3. Transmit Subsystem (Per Channel)
8.3.1.3 Receive Subsystem
The AWR6843 receive subsystem consists of four parallel channels. A single receive channel consists of an
LNA, mixer, IF filtering, ADC conversion, and decimation. All four receive channels can be operational at the
same time an individual power-down option is also available for system optimization.
Unlike conventional real-only receivers, the AWR6843 device supports a complex baseband architecture, which
uses quadrature mixer and dual IF and ADC chains to provide complex I and Q outputs for each receiver
channel. The AWR6843 is targeted for fast chirp systems. The band-pass IF chain has configurable lower cutoff
frequencies above 175 kHz and can support bandwidths up to 10 MHz.
图8-4 describes the receive subsystem.
Self Test
DAC
Loopback
Path
DSM
PCB
I
RSSI
50 W
GSG
LO
Q
DSM
DAC
图8-4. Receive Subsystem (Per Channel)
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8.3.2 Processor Subsystem
Unified
128 KB x 2
ROM
L2
Cache/
RAM
TCM A 512 KB
TCM B 192 KB
L1P
32 KB
32 KB
EDMA
Main
R4F
DSP
HWA
HIL
JTAG
CRC
HIL
L1d
DSP/HWA Interconnect œ 128 bit @ 200 MHz
Main Interconnect
BSS Interconnect
Data
Handshake
Memory
CRC
ADC Buffer
Mail
Box
MSS
DMA
L3
32 KB
32 KB Ping-Pong
(static sharing
with R4F Space)
Interconnect
LVDS
PWM,
PMIC
CLK
I2C
QSPI
UART
SPI
CAN-FD
图8-5. Processor Subsystem
图 8-5shows the block diagram for customer programmable processor subsystems in the AWR6843 device. At a
high level there are two customer programmable subsystems, as shown separated by a dotted line in the
diagram. Left hand side shows the DSP Subsystem which contains TI's high-performance C674x DSP, hardware
accelerator, a high-bandwidth interconnect for high performance (128-bit, 200MHz), and associated peripherals
–four DMAs for data transfer,
LVDS interface for Measurement data output, L3 Radar data cube memory, ADC buffers, CRC engine, and data
handshake memory (additional memory provided on interconnect).
The C674x DSP and L1/L2 RAM portion of the DSP subsystem is not supported on the AWR6443 device and
therefore, the available memory is 1.4MB compared to 1.75MB on the IWR6843 device. For more information on
the features supported and not supported on each device, see the Device Features Comparison table.
The right side of the diagram shows the main subsystem. Main subsystem as the name suggests is the centre of
the device and controls all the device peripherals and house-keeping activities of the device. Main subsystem
contains Cortex-R4F (Main R4F) processor and associated peripherals and house-keeping components such as
DMAs, CRC and Peripherals (I2C, UART, SPIs, CAN-FD, PMIC clocking module, PWM, and others) connected
to Main Interconnect through Peripheral Central Resource (PCR interconnect).
Details of the DSP CPU core can be found at http://www.ti.com/product/TMS320C6748.
HIL module is shown in both the subsystems and can be used to perform the radar operations feeding the
captured data from outside into the device without involving the RF subsystem. HIL on main SS is for controlling
the configuration and HIL on DSPSS for high speed ADC data input to the device. Both HIL modules uses the
same IOs on the device, one additional IO (DMM_MUX_IN) allows selecting either of the two.
8.3.3 Automotive Interface
The AWR6843 communicates with the automotive network over the following main interfaces:
• 2 CAN-FD modules
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8.3.4 Host Interface
The host interface can be provided through a SPI, UART, or CAN-FD interface. In some cases the serial
interface for automotive applications is transcoded to a different serial standard.
This device communicates with the host radar processor over the following main interfaces:
• Reference Clock –Reference clock available for host processor after device wakeup
• Control –4-port standard SPI (slave) for host control . All radio control commands (and response) flow
through this interface.
• Reset –Active-low reset for device wakeup from host
• Host Interrupt - an indication that the mmwave sensor needs host interface
• Error –Used for notifying the host in case the radio controller detects a fault
8.3.5 Main Subsystem Cortex-R4F
The main system includes an ARM Cortex R4F processor, clock with a maximum operating frequency of 200
MHz. User applications executing on this processor control the overall operation of the device, including radar
control through well-defined API messages, radar signal processing (assisted by the radar hardware
accelerator), and peripherals for external interfaces.
See the Technical Reference Manual for a complete description and memory map.
8.3.6 DSP Subsystem
The DSP subsystem includes TI’s standard TMS320C674x megamodule and several blocks of internal
memory (L1P, L1D, and L2). For complete information including memory map, please refer to Technical
Reference Manual.
8.3.7 Hardware Accelerator
The Radar Hardware Accelerator (HWA) is an IP that enables off-loading the burden of certain frequently used
computations in FMCW radar signal processing from the main processor. FMCW radar signal processing
involves the use of FFT and Log-Magnitude computations to obtain a radar image across the range, velocity, and
angle dimensions. Some of the frequently used functions in FMCW radar signal processing can be done within
the radar hardware accelerator, while still retaining the flexibility of implementing other proprietary algorithms in
the main processor. See the Radar Hardware Accelerator User's Guide for a functional description and features
of this module and see the Technical Reference Manual for a complete list of register and memory map.
8.4 Other Subsystems
8.4.1 ADC Channels (Service) for User Application
The AWR6843 device includes provision for an ADC service for user application, where the
GPADC engine present inside the device can be used to measure up to six external voltages. The ADC1, ADC2,
ADC3, ADC4, ADC5, and ADC6 pins are used for this purpose.
• ADC itself is controlled by TI firmware running inside the BIST subsystem and access to it for customer’s
external voltage monitoring purpose is via ‘monitoring API’calls routed to the BIST subsystem. This API
could be linked with the user application running on the MSS R4F.
• BIST subsystem firmware will internally schedule these measurements along with other RF and Analog
monitoring operations. The API allows configuring the settling time (number of ADC samples to skip) and
number of consecutive samples to take. At the end of a frame, the minimum, maximum and average of the
readings will be reported for each of the monitored voltages.
GPADC Specifications:
• 625 Ksps SAR ADC
• 0 to 1.8V input range
• 10-bit resolution
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• For 5 out of the 6 inputs, an optional internal buffer (0.4-1.4V input range) is available. Without the buffer, the
ADC has a switched capacitor input load modeled with 5pF of sampling capacitance and 12pF parasitic
capacitance (GPADC channel 6, the internal buffer is not available).
5
ANALOG TEST 1-4,
GPADC
ANAMUX
5
VSENSE
A. GPADC structures are used for measuring the output of internal temperature sensors. The accuracy of these measurements is ±7°C.
图8-6. ADC Path
8.4.1.1 GP-ADC Parameter
PARAMETER
TYP
1.8
UNIT
V
ADC supply
ADC unbuffered input voltage range
ADC buffered input voltage range(1)
ADC resolution
V
0 –1.8
0.4 –1.3
10
V
bits
LSB
LSB
LSB
LSB
Ksps
ns
ADC offset error
±5
ADC gain error
±5
ADC DNL
–1/+2.5
±2.5
625
ADC INL
ADC sample rate(2)
ADC sampling time(2)
ADC internal cap
400
10
pF
ADC buffer input capacitance
ADC input leakage current
2
pF
3
uA
(1) Outside of given range, the buffer output will become nonlinear.
(2) ADC itself is controlled by TI firmware running inside the BIST subsystem. For more details please refer to the API calls.
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9 Monitoring and Diagnostics
9.1 Monitoring and Diagnostic Mechanisms
表 9-1 is a list of the main monitoring and diagnostic mechanisms available in the Functional Safety-Compliant
devices
表9-1. Monitoring and Diagnostic Mechanisms for Functional Safety-Compliant Devices
NO
FEATURE
DESCRIPTION
Device architecture supports hardware logic BIST (LBIST) engine self-test Controller (STC).
This logic is used to provide a very high diagnostic coverage (>90%) on the MSS R4F CPU
core and Vectored Interrupt Module (VIM) at a transistor level.
LBIST for the CPU and VIM need to be triggered by application code before starting the
functional safety application. CPU stays there in while loop and does not proceed further if a
fault is identified.
Boot time LBIST For MSS
R4F Core and associated
VIM
1
Main R4F has three Tightly coupled Memories (TCM) memories TCMA, TCMB0 and
TCMB1. Device architecture supports a hardware programmable memory BIST (PBIST)
engine. This logic is used to provide a very high diagnostic coverage (March-13n) on the
implemented MSS R4F TCMs at a transistor level.
PBIST for TCM memories is triggered by Bootloader at the boot time before starting
download of application from Flash or peripheral interface. CPU stays there in while loop
and does not proceed further if a fault is identified.
Boot time PBIST for MSS
R4F TCM Memories
2
3
TCMs diagnostic is supported by Single error correction double error detection (SECDED)
ECC diagnostic. An 8-bit code word is used to store the ECC data as calculated over the 64-
bit data bus. ECC evaluation is done by the ECC control logic inside the CPU. This scheme
provides end-to-end diagnostics on the transmissions between CPU and TCM. CPU can be
configured to have predetermined response (Ignore or Abort generation) to single and
double bit error conditions.
End to End ECC for MSS
R4F TCM Memories
Logical TCM word and its associated ECC code is split and stored in two physical SRAM
banks. This scheme provides an inherent diagnostic mechanism for address decode failures
in the physical SRAM banks. Faults in the bank addressing are detected by the CPU as an
ECC fault.
Further, bit multiplexing scheme implemented such that the bits accessed to generate a
logical (CPU) word are not physically adjacent. This scheme helps to reduce the probability
of physical multi-bit faults resulting in logical multi-bit faults; rather they manifest as multiple
single bit faults. As the SECDED TCM ECC can correct a single bit fault in a logical word,
this scheme improves the usefulness of the TCM ECC diagnostic.
Main R4F TCM bit
multiplexing
4
Both these features are hardware features and cannot be enabled or disabled by application
software.
Device architecture supports Three Digital Clock Comparators (DCCs) and an internal
RCOSC. Dual functionality is provided by these modules –Clock detection and Clock
Monitoring.
DCCint is used to check the availability/range of Reference clock at boot otherwise the
device is moved into limp mode (Device still boots but on 10MHz RCOSC clock source. This
provides debug capability). DCCint is only used by boot loader during boot time. It is
disabled once the APLL is enabled and locked.
DCC1 is dedicated for APLL lock detection monitoring, comparing the APLL output divided
version with the Reference input clock of the device. Initially (before configuring APLL),
DCC1 is used by bootloader to identify the precise frequency of reference input clock
against the internal RCOSC clock source. Failure detection for DCC1 would cause the
device to go into limp mode.
5
Clock Monitor
DCC2 module is one which is available for user software . From the list of clock options
given in detailed spec, any two clocks can be compared. One example usage is to compare
the CPU clock with the Reference or internal RCOSC clock source. Failure detection is
indicated to the MSS R4F CPU via Error Signaling Module (ESM).
Device architecture supports the use of an internal watchdog that is implemented in the real-
time interrupt (RTI) module. The internal watchdog has two modes of operation: digital
watchdog (DWD) and digital windowed watchdog (DWWD). The modes of operation are
mutually exclusive; the designer can elect to use one mode or the other but not both at the
same time.
7
RTI/WD for MSS R4F
Watchdog can issue either an internal (warm) system reset or a CPU non-mask able
interrupt upon detection of a failure.
The Watchdog is enabled by the bootloader in DWD mode at boot time to track the boot
process. Once the application code takes up the control, Watchdog can be configured again
for mode and timings based on specific customer requirements.
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表9-1. Monitoring and Diagnostic Mechanisms for Functional Safety-Compliant Devices (continued)
NO
FEATURE
DESCRIPTION
Cortex-R4F CPU includes an MPU. The MPU logic can be used to provide spatial
separation of software tasks in the device memory. Cortex-R4F MPU supports 12 regions. It
is expected that the operating system controls the MPU and changes the MPU settings
based on the needs of each task. A violation of a configured memory protection policy
results in a CPU abort.
8
MPU for MSS R4F
Device architecture supports a hardware programmable memory BIST (PBIST) engine for
Peripheral SRAMs as well.
PBIST for peripheral SRAM memories can be triggered by the application. User can elect to
PBIST for Peripheral interface run the PBIST on one SRAM or on groups of SRAMs based on the execution time, which
9
SRAMs - SPIs, CAN-FDs
can be allocated to the PBIST diagnostic. The PBIST tests are destructive to memory
contents, and as such are typically run only at boot time. However, the user has the freedom
to initiate the tests at any time if peripheral communication can be hindered.
Any fault detected by the PBIST results in an error indicated in PBIST status registers.
Peripheral interface SRAMs diagnostic is supported by Single error correction double error
detection (SECDED) ECC diagnostic. When a single or double bit error is detected the MSS
R4F is notified via ESM (Error Signaling Module). This feature is disabled after reset.
Software must configure and enable this feature in the peripheral and ESM module. ECC
failure (both single bit corrected and double bit uncorrectable error conditions) is reported to
the MSS R4F as an interrupt via ESM module.
ECC for Peripheral interface
SRAMs –SPIs, CAN-FDs
10
All the Main SS peripherals (SPIs, CAN-FDs, I2C, DMAs, RTI/WD, DCCs, IOMUX etc.) are
connected to interconnect via Peripheral Central resource (PCR). This provides two
diagnostic mechanisms that can limit access to peripherals. Peripherals can be clock gated
per peripheral chip select in the PCR. This can be utilized to disable unused features such
that they cannot interfere. In addition, each peripheral chip select can be programmed to
limit access based on privilege level of transaction. This feature can be used to limit access
to entire peripherals to privileged operating system code only.
Configuration registers
protection for Main SS
peripherals
11
These diagnostic mechanisms are disabled after reset. Software must configure and enable
these mechanisms. Protection violation also generates an ‘error’that result in abort to
MSS R4F or error response to other peripherals such as DMAs.
Device architecture supports hardware CRC engine on Main SS implementing the below
polynomials.
•
•
•
•
•
•
•
CRC16 CCITT –0x10
CRC32 Ethernet –0x04C11DB7
CRC64
CRC 32C –CASTAGNOLI –0x1EDC6F4
CRC32P4 –E2E Profile4 –0xF4ACFB1
CRC-8 –H2F Autosar –0x2F
CRC-8 –VDA CAN-FD –0x1D
Cyclic Redundancy Check –
Main SS
12
The read operation of the SRAM contents to the CRC can be done by CPU or by DMA. The
comparison of results, indication of fault, and fault response are the responsibility of the
software managing the test.
Device architecture supports MPUs on Main SS DMAs. Failure detection by MPU is reported
to the MSS R4F CPU core as an interrupt via ESM.
13
14
15
MPU for DMAs
DSPSS’s high performance EDMAs also includes MPUs on both read and writes master
ports. EDMA MPUs supports 8 regions. Failure detection by MPU is reported to the DSP
core as an interrupt via local ESM.
Device architecture supports hardware logic BIST (LBIST) even for BIST R4F core and
associated VIM module. This logic provides very high diagnostic coverage (>90%) on the
BIST R4F CPU core and VIM.
This is triggered by MSS R4F boot loader at boot time and it does not proceed further if the
fault is detected.
Boot time LBIST For BIST
R4F Core and associated
VIM
Device architecture supports a hardware programmable memory BIST (PBIST) engine for
BIST R4F TCMs which provide a very high diagnostic coverage (March-13n) on the BIST
R4F TCMs.
PBIST is triggered by MSS R4F Bootloader at the boot time and it does not proceed further
if the fault is detected.
Boot time PBIST for BIST
R4F TCM Memories
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表9-1. Monitoring and Diagnostic Mechanisms for Functional Safety-Compliant Devices (continued)
NO
FEATURE
DESCRIPTION
BIST R4F TCMs diagnostic is supported by Single error correction double error detection
(SECDED) ECC diagnostic. Single bit error is communicated to the BIST R4FCPU while
double bit error is communicated to MSS R4F as an interrupt so that application code
becomes aware of this and takes appropriate action.
End to End ECC for BIST
R4F TCM Memories
16
Logical TCM word and its associated ECC code is split and stored in two physical SRAM
banks. This scheme provides an inherent diagnostic mechanism for address decode failures
in the physical SRAM banks and helps to reduce the probability of physical multi-bit faults
resulting in logical multi-bit faults.
BIST R4F TCM bit
multiplexing
17
18
Device architecture supports an internal watchdog for BIST R4F. Timeout condition is
reported via an interrupt to MSS R4F and rest is left to application code to either go for SW
reset for BIST SS or warm reset for the device to come out of faulty condition.
RTI/WD for BIST R4F
Device architecture supports a hardware programmable memory BIST (PBIST) engine for
DSPSS’s L1P, L1D, L2 and L3 memories which provide a very high diagnostic coverage
(March-13n).
PBIST is triggered by MSS R4F Bootloader at the boot time and it does not proceed further
if the fault is detected.
Boot time PBIST for L1P,
L1D, L2 and L3 Memories
19
20
Device architecture supports Parity diagnostic on DSP’s L1P memory. Parity error is
reported to the CPU as an interrupt.
Note:- L1D memory is not covered by parity or ECC and need to be covered by application
level diagnostics.
Parity on L1P
Device architecture supports both Parity Single error correction double error detection
(SECDED) ECC diagnostic on DSP’s L2 memory. L2 Memory is a unified 256KB of
memory used to store program and Data sections for the DSP. A 12-bit code word is used to
store the ECC data as calculated over the 256-bit data bus (logical instruction fetch size).
The ECC logic for the L2 access is located in the DSP and evaluation is done by the ECC
control logic inside the DSP. This scheme provides end-to-end diagnostics on the
transmissions between DSP and L2. Byte aligned Parity mechanism is also available on L2
to take care of data section.
21
ECC on DSP’s L2 Memory
L3 memory is used as Radar data section in Device. Device architecture supports Single
error correction double error detection (SECDED) ECC diagnostic on L3 memory. An 8-bit
code word is used to store the ECC data as calculated over the 64-bit data bus.
Failure detection by ECC logic is reported to the MSS R4F CPU core as an interrupt via
ESM.
ECC on Radar Data Cube
(L3) Memory
22
23
Device architecture supports the use of an internal watchdog for BIST R4F that is
implemented in the real-time interrupt (RTI) module –replication of same module as used in
Main SS. This module supports same features as that of RTI/WD for Main/BIST R4F.
This watchdog is enabled by customer application code and Timeout condition is reported
via an interrupt to MSS R4F and rest is left to application code in MSS R4F to either go for
SW reset for DSP SS or warm reset for the device to come out of faulty condition.
RTI/WD for DSP Core
Device architecture supports dedicated hardware CRC on DSPSS implementing the below
polynomials.
•
•
•
CRC16 CCITT - 0x10
CRC32 Ethernet - 0x04C11DB7
CRC64
24
25
CRC for DSP Sub-System
The read of SRAM contents to the CRC can be done by DSP CPU or by DMA. The
comparison of results, indication of fault, and fault response are the responsibility of the
software managing the test.
Device architecture supports MPUs for DSP memory accesses (L1D, L1P, and L2). L2
memory supports 64 regions and 16 regions for L1P and L1D each. Failure detection by
MPU is reported to the DSP core as an abort.
MPU for DSP
Device architecture supports various temperature sensors all across the device (next to
power hungry modules such as PAs, DSP etc) which is monitored during the inter-frame
period.(1)
26
27
Temperature Sensors
Tx Power Monitors
Device architecture supports power detectors at the Tx output.(2)
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表9-1. Monitoring and Diagnostic Mechanisms for Functional Safety-Compliant Devices (continued)
NO
FEATURE
DESCRIPTION
When a diagnostic detects a fault, the error must be indicated. The device architecture
provides aggregation of fault indication from internal monitoring/diagnostic mechanisms
using a peripheral logic known as the Error Signaling Module (ESM). The ESM provides
mechanisms to classify errors by severity and to provide programmable error response.
ESM module is configured by customer application code and specific error signals can be
enabled or masked to generate an interrupt (Low/High priority) for the MSS R4F CPU.
Device supports Nerror output signal (IO) which can be monitored externally to identify any
kind of high severity faults in the design which could not be handled by the R4F.
Error Signaling
Error Output
28
Monitors Synthesizer’s frequency ramp by counting (divided-down) clock cycles and
comparing to ideal frequency ramp. Excess frequency errors above a certain threshold, if
any, are detected and reported.
Synthesizer (Chirp) frequency
monitor
29
30
Device architecture supports a ball break detection mechanism based on Impedance
measurement at the TX output(s) to detect and report any large deviations that can indicate
a ball break.
Monitoring is done by TIs code running on BIST R4F and failure is reported to the MSS R4F
via Mailbox.
Ball break detection for TX
ports (TX Ball break monitor)
It is completely up to customer SW to decide on the appropriate action based on the
message from BIST R4F.
Built-in TX to RX loopback to enable detection of failures in the RX path(s), including Gain,
inter-RX balance, etc.
31
32
33
34
RX loopback test
Built-in IF (square wave) test tone input to monitor IF filter’s frequency response and detect
failure.
IF loopback test
Provision to detect ADC saturation due to excessive incoming signal level and/or
interference.
RX saturation detect
Boot time LBIST for DSP core
Device device supports boot time LBIST for the DSP Core. LBIST can be triggered by the
MSS R4F application code during boot time.
(1) Monitoring is done by the TI's code running on BIST R4F. There are two modes in which it could be configured to report the
temperature sensed via API by customer application.
a. Report the temperature sensed after every N frames
b. Report the condition once the temperature crosses programmed threshold.
It is completely up to customer SW to decide on the appropriate action based on the message from BIST R4Fvia Mailbox.
(2) Monitoring is done by the TI's code running on BIST R4F.
There are two modes in which it could be configured to report the detected output power via API by customer application.
a. Report the power detected after every N frames
b. Report the condition once the output power degrades by more than configured threshold from the configured.
It is completely up to customer SW to decide on the appropriate action based on the message from BIST R4F.
备注
Refer to the Device Safety Manual or other relevant collaterals for more details on applicability of all
diagnostics mechanisms. For Certification details, refer to the device product page.
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9.1.1 Error Signaling Module
When a diagnostic detects a fault, the error must be indicated. AWR6443, AWR6843 architecture provides
aggregation of fault indication from internal diagnostic mechanisms using a peripheral logic known as the error
signaling module (ESM). The ESM provides mechanisms to classify faults by severity and allows programmable
error response. Below is the high level block diagram for ESM module.
Low Priority
Low Priority
Interrupt
Interrupy
Handing
Error Group 1
Interrupt Enable
High Priority
Interrupt
Handing
High Priority
Interrupy
Interrupt Priority
Error Group 2
Error Group 3
Nerror Enable
Error Signal
Handling
Device Output
Pin
图9-1. ESM Module Diagram
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10 Applications, Implementation, and Layout
备注
Information in the following Applications section is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI's customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
10.1 Application Information
Application information can be found on AWR Application web page.
10.2 Reference Schematic
Please check the device product page for latest Hardware design information under Design Kits - typically, at
Design & development.
Listed for convenience are: Design Files, Schematics, Layouts, and Stack up for PCB.
• Altium XWR6843 EVM Design Files
• XWR6843 EVM Schematic Drawing, Assembly Drawing, and Bill of Materials
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11 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions follow.
11.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for
example, AWR6843 ). Texas Instruments recommends two of three possible prefix designators for its support
tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering
prototypes (TMDX) through fully qualified production devices and tools (TMDS).
Device development evolutionary flow:
XA Experimental device that is not necessarily representative of the final device's electrical specifications and
may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical
specifications.
null Production version of the silicon die that is fully qualified.
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
TMDS Fully-qualified development-support product.
XA and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XA or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, ABL0161), the temperature range (for example, blank is the default automotive temperature
range). 图11-1 provides a legend for reading the complete device name for any AWR6843 device.
For orderable part numbers of AWR6843 devices in the ABL0161 package types, see the Package Option
Addendum of this document, the TI website ( www.ti.com ),or contact your TI sales representative.
For additional description of the device nomenclature markings on the die, see the AWR6843, AWR6443 Device
Errata .
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6
8
43
B
A
AWR
G
ABL
Qualification
Prefix
XA = Pre-production Automotive
AWR = Production Automotive
Blank = no special qual
Q1 = AEC-Q100
Generation
1 = 77 GHz Band
6 = 60 GHz Band
Variant
Tray or Tape & Reel
R = Tape & Reel
Blank = Tray
2 = FE
Package
4 = FE + FFT + MCU
6 = FE + MCU + DSP
8 = FE + MCU + FFT + DSP
ABL = BGA
Security
G = General
Num RX/TX Channels
S = Secure
RX = 1,2,3,4
TX = 1,2,3
Silicon PG Revision
blank = Rev1.0
A = Rev 2.0
Features
blank = baseline
R = Antenna on Package (AoP)
Safety Level
Q = Non-Functional Safety
B = Functional Safety-
Compliant, ASIL B
图11-1. Device Nomenclature
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11.2 Tools and Software
Models
xWR6843 BSDL model
Boundary scan database of testable input and output pins for IEEE 1149.1 of
the specific device.
xWR6843 IBIS model
IO buffer information model for the IO buffers of the device. For simulation on a
circuit board, see IBIS Open Forum.
xWR6843 checklist for
schematic review, layout
review,bringup/wakeup
A set of steps in spreadsheet form to select system functions and pinmux
options. Specific EVM schematic and layout notes to apply to customer
engineering. A bring up checklist is suggested for customers.
11.3 Documentation Support
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
The current documentation that describes the DSP, related peripherals, and other technical collateral follows.
Errata
AWR6843, AWR6443 Device Errata Describes known advisories, limitations, and cautions on silicon and
provides workarounds.
11.4 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
11.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
Arm® and Cortex® are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
所有商标均为其各自所有者的财产。
11.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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12 Mechanical, Packaging, and Orderable Information
12.1 Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OUTLINE
ABL0161B
FCBGA - 1.17 mm max height
SCALE 1.400
PLASTIC BALL GRID ARRAY
10.5
10.3
B
A
BALL A1 CORNER
10.5
10.3
1.17 MAX
C
SEATING PLANE
0.1 C
BALL TYP
0.37
0.27
TYP
9.1 TYP
PKG
(0.65) TYP
(0.65) TYP
R
P
N
M
L
K
J
PKG
H
G
F
9.1
TYP
E
D
C
0.45
161X
0.35
0.15
0.08
C A B
C
B
A
0.65 TYP
BALL A1 CORNER
1
2
3
4
5
6
7
8
9 10 11
12 13 14 15
0.65 TYP
4223365/A 10/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
ABL0161B
FCBGA - 1.17 mm max height
PLASTIC BALL GRID ARRAY
(0.65) TYP
161X ( 0.32)
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
A
B
C
(0.65) TYP
D
E
F
G
H
J
PKG
K
L
M
N
P
R
PKG
LAND PATTERN EXAMPLE
SCALE:10X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
( 0.32)
METAL
(
0.32)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4223365/A 10/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99).
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EXAMPLE STENCIL DESIGN
ABL0161B
FCBGA - 1.17 mm max height
PLASTIC BALL GRID ARRAY
(0.65) TYP
161X ( 0.32)
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
A
B
C
(0.65) TYP
D
E
F
G
H
J
PKG
K
L
M
N
P
R
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4223365/A 10/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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12.2 Tray Information for ABL, 10.4 × 10.4 mm
Package
Type
Package
Name
Unit Array
Matrix
Max Temp.
(°C)
L
W
(mm)
K0
(mm)
P1
(mm)
CL
CW
(mm)
Device
Pins
SPQ
(mm)
(mm)
16.80
16.80
16.80
16.80
AWR6843AQGABLQ1
AWR6843ABGABLQ1
AWR6843ABSABLQ1
AWR6443ABGABLQ1
FC/CSP
FC/CSP
FC/CSP
FC/CSP
ABL
ABL
ABL
ABL
161
161
161
161
176
176
176
176
8 × 22
8 × 22
8 × 22
8 × 22
150
150
150
150
315.0
315.0
315.0
315.0
135.9
135.9
135.9
135.9
7.62
7.62
7.62
7.62
13.40
13.40
13.40
13.40
17.20
17.20
17.20
17.20
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Jan-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AWR6443ABGABLQ1
ACTIVE
FCCSP
FCCSP
FCCSP
FCCSP
FCCSP
FCCSP
FCCSP
FCCSP
ABL
161
161
161
161
161
161
161
161
176
RoHS & Green
Call TI
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
AWR6443
BG
678A
678A ABL
AWR6443ABGABLRQ1
AWR6843ABGABLQ1
AWR6843ABGABLRQ1
AWR6843ABSABLQ1
AWR6843ABSABLRQ1
AWR6843AQGABLQ1
AWR6843AQGABLRQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ABL
ABL
ABL
ABL
ABL
ABL
ABL
1000 RoHS & Green
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
AWR6443
BG
678A
678A ABL
176
RoHS & Green
AWR6843
BG
678A
678A ABL
1000 RoHS & Green
AWR6843
BG
678A
678A ABL
176
RoHS & Green
AWR6843
BS
678A
678A ABL
1000 RoHS & Green
AWR6843
BS
678A
678A ABL
176
RoHS & Green
AWR6843
QG
678A
678A ABL
1000 RoHS & Green
AWR6843
QG
678A
678A ABL
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jan-2022
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
AWR6843ABGABLRQ1 FCCSP
AWR6843AQGABLRQ1 FCCSP
ABL
ABL
161
161
1000
1000
330.0
330.0
24.4
24.4
10.7
10.7
10.7
10.7
1.65
1.65
16.0
16.0
24.0
24.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
AWR6843ABGABLRQ1
AWR6843AQGABLRQ1
FCCSP
FCCSP
ABL
ABL
161
161
1000
1000
336.6
336.6
336.6
336.6
41.3
41.3
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2022
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
AWR6443ABGABLQ1
AWR6843ABGABLQ1
AWR6843AQGABLQ1
ABL
ABL
ABL
FCCSP
FCCSP
FCCSP
161
161
161
176
176
176
8 x 22
8 x 22
8 x 22
150
150
150
315 135.9 7620 13.4
315 135.9 7620 13.4
315 135.9 7620 13.4
16.8
16.8
16.8
17.2
17.2
17.2
Pack Materials-Page 3
重要声明和免责声明
TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
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证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
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