BQ2002C [TI]

NiCd/NiMH Fast-Charge Management IC; 镍镉/镍氢电池快速充电管理IC
BQ2002C
型号: BQ2002C
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

NiCd/NiMH Fast-Charge Management IC
镍镉/镍氢电池快速充电管理IC

电池
文件: 总12页 (文件大小:77K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
bq2002C  
NiCd/NiMH Fast-Charge Management IC  
Features  
General Description  
Fast charge is terminated by any of  
the following:  
Fast charge of nickel cadmium  
or nickel-metal hydride batter-  
The bq2002C Fast-Charge IC is a low-  
cost CMOS battery-charge controller  
providing reliable charge termination  
for both NiCd and NiMH battery appli-  
cations. Controlling a current-limited  
or constant-current supply allows the  
bq2002C to be the basis for a cost-  
effective stand-alone or system-inte-  
grated charger. The bq2002C inte-  
grates fast charge with pulsed-trickle  
control in a single IC for charging one  
or more NiCd or NiMH battery cells.  
n
n
n
n
n
Peak voltage detection (PVD)  
Negative delta voltage (-V)  
Maximum voltage  
ies  
Dir ect LE D ou t pu t displa ys  
charge status  
Maximum temperature  
Maximum time  
Fast-charge termination by -V,  
m a xim u m volt a ge, m a xim u m  
t em per a t u r e, a n d m a xim u m  
time  
After fast charge, the bq2002C pulse-  
t r ickles t h e ba t t er y per t h e pr e-  
configured limits. Fast charge may be  
inhibited using the INH pin. The  
bq2002C may also be placed in low-  
s t a n d by-p ower m od e t o r ed u ce  
system power consumption.  
Internal band-gap voltage ref-  
erence  
Fast charge is initiated on application  
of the charging supply or battery  
replacement. For safety, fast charge is  
inhibited if the battery temperature  
and voltage are outside configured  
limits.  
Selectable pulse-trickle charge  
rates  
Low-power mode  
8-pin 300-mil DIP or 150-mil  
SOIC  
Pin Connections  
Pin Names  
TS  
Temperature sense input  
Supply voltage input  
Charge inhibit input  
Charge control output  
TM  
Timer mode select input  
Charging status output  
Battery voltage input  
System ground  
VCC  
INH  
CC  
LED  
BAT  
VSS  
TM  
LED  
BAT  
1
2
3
4
8
7
6
5
CC  
INH  
V
CC  
V
SS  
TS  
8-Pin DIP or  
Narrow SOIC  
PN-200201.eps  
9/97 B  
1
bq2002C  
Ch ar ge con tr ol ou tpu t  
CC  
Pin Descriptions  
An open-drain output used to control the  
charging current to the battery. CC switch-  
ing to high impedance (Z) enables charging  
current to flow, and low to inhibit charging  
current. CC is modulated to provide pulse  
trickle.  
Timer mode input  
TM  
A three-level input that controls the settings  
for the fast charge safety timer, voltage ter-  
mination mode, pulse-trickle, and voltage  
hold-off time.  
Ch ar gin g ou tpu t statu s  
LED  
BAT  
Functional Description  
Open-drain output that indicates the charging  
status.  
Figure 2 shows a state diagram and Figure 3 shows a  
block diagram of the bq2002C.  
Batter y in pu t voltage  
Battery Voltage and Temperature  
Measurements  
The battery voltage sense input. The input to  
this pin is created by a high-impedance re-  
sistor divider network connected between  
the positive and negative terminals of the  
battery.  
Battery voltage and temperature are monitored for  
maximum allowable values. The voltage presented on  
t h e ba t t er y sen se in pu t , BAT, sh ou ld r epr esen t a  
single-cell potential for the battery under charge.  
resistor-divider ratio of  
A
System gr ou n d  
VSS  
TS  
RB1  
Tem per atu r e sen se in pu t  
= N - 1  
RB2  
Input for an external battery temperature  
monitoring thermistor.  
is recommended to maintain the battery voltage within  
the valid range, where N is the number of cells, RB1 is  
the resistor connected to the positive battery terminal,  
a n d RB2 is t h e r esist or con n ect ed t o t h e n ega t ive  
battery terminal. See Figure 1.  
Su pply voltage in pu t  
5.0V ±20% power input.  
Ch ar ge in h ibit in pu t  
VCC  
INH  
Note: This resistor-divider network input impedance to  
end-to-end should be at least 200kand less than 1 M.  
When high, INH suspends the fast charge in  
progress. When returned low, the IC re-  
sumes operation at the point where initially  
suspended.  
A ground-referenced negative temperature coefficient  
thermistor placed near the battery may be used as a low-  
cost temperature-to-voltage transducer. The temperature  
sense voltage input at TS is developed using a resistor-  
thermistor network between VCC and VSS. See Figure 1.  
V
CC  
PACK +  
RT  
V
RB1  
RB2  
R3  
R4  
CC  
BAT  
TM  
T
S
N
T
bq2002C  
bq2002C  
C
V
SS  
V
SS  
BAT pin connection  
Mid-level  
setting for TM  
NTC = negative temperature coefficient thermistor.  
Thermistor connection  
Fg2002/C.eps  
Figure 1. Voltage and Temperature Monitoring and TM Pin Configuration  
2
bq2002C  
Chip on  
4.0V  
Battery Voltage  
too High?  
V
CC  
V
>
2V  
BAT  
V
< 2V  
BAT  
Battery Voltage  
too Low?  
V
< 0.84V  
BAT  
0.84V < V  
BAT  
V
< V /2  
CC  
V
> V /2  
CC  
TS  
TS  
Battery  
Temperature?  
Charge  
Pending  
Fast  
LED =  
Low  
Trickle  
LED =  
Flash  
V
V
V
> 0.84V and  
< 2V and  
> V /2  
CC  
BAT  
BAT  
TS  
V
> 2V  
BAT  
V
V
> 2V or  
BAT  
< V /2 or  
TS  
CC  
PVD or - V or  
V
2V  
BAT  
Maximum Time Out  
Trickle  
LED = Z  
SD2002C.eps  
Figure 2. State Diagram  
Clock  
Phase  
Generator  
OSC  
TM  
Sample  
History  
Timing  
Control  
Voltage  
Reference  
INH  
PVD, - V  
ALU  
A to D  
Converter  
Charge-Control  
State Machine  
LBAT  
Check  
MCV  
Check  
BAT  
HTF TCO  
Check Check  
Power-On  
Reset  
Power  
Down  
CC  
LED  
V
TS  
V
CC  
SS  
Bd2002CEG.eps  
Figure 3. Block Diagram  
3
bq2002C  
V
= 0  
Fast Charging  
Pulse-Trickle  
1s  
Fast Charging  
CC  
CC Output  
See  
Table1  
Charge initiated by application of power  
Charge initiated by battery replacement  
LED  
TD2002C1.eps  
Figure 4. Charge Cycle Phases  
pending state. In this state pulse trickle charge is  
applied to the battery and the LED flashes until the  
voltage and temperature come into the allowed fast  
Starting A Charge Cycle  
charge range or VBAT rises above VMCV  
. Anytime VBAT  
Either of two events starts a charge cycle (see Figure 4):  
1. Application of power to VCC or  
VMCV, the IC enters the Charge Complete/Battery  
Absent state. In this state the LED is off and trickle  
charge is applied to the battery until the next new  
charge cycle begins.  
2. Voltage at the BAT pin falling through the maximum  
cell voltage VMCV where  
Fast charge continues until termination by one or more of  
the five possible termination conditions:  
VMCV = 2V ±5%.  
If the battery is within the configured temperature and  
voltage limits, the IC begins fast charge. The valid  
battery voltage range is VLBAT < VBAT < VMCV, where  
n
n
n
n
n
Peak voltage detection (PVD)  
Negative delta voltage (-V)  
Maximum voltage  
VLBAT = 0.175 VCC ±20%  
The valid temperature range is VTS > VHTF where  
VHTF = 0.6 VCC ±5%.  
Maximum temperature  
Maximum time  
If VBAT VLBAT or VTS VHTF, the IC enters the charge-  
Table 1. Fast-Charge Safety Time/Hold-Off Table  
Typical  
Fast-  
Charge  
Time Limits  
(minutes)  
Maximum  
Synchronized  
Sampling  
Period  
Typical PVD  
and -V  
Hold-Off  
Pulse-  
Trickle  
Pulse Width  
(ms)  
Corresponding  
Fast-Charge  
Rate  
Pulse-  
Trickle  
Rate  
TM  
Mid  
Low  
High  
Termination  
PVD  
Time (seconds)  
(seconds)  
C/2  
1C  
2C  
160  
80  
300  
150  
75  
C/32  
C/32  
C/32  
73  
37  
18  
18.7  
18.7  
9.4  
PVD  
-V  
40  
Notes:  
Typical conditions = 25°C, VCC = 5.0V  
Mid = 0.5 CC ±0.5V  
Tolerance on all timing is ±12%.  
V
*
4
bq2002C  
Maximum charge time is configured using the TM pin.  
Time settings are available for corresponding charge  
rates of C/2, 1C, and 2C. Maximum time-out termina-  
tion is enforced on the fast-charge phase, then reset, and  
enforced again on the top-off phase, if selected. There is  
no time limit on the trickle-charge phase.  
PVD and -V Termination  
There are two modes for voltage termination, depend-  
ing on the state of TM. For -V (TM = high), if VBAT is  
lower than any previously measured value by 12mV  
±3mV, fast charge is terminated. For PVD (TM = low or  
m id), a decr ea se of 2.5m V ±2.5m V t er m in a t es fa st  
charge. The PVD and -V tests are valid in the range  
1V < VBAT < 2V.  
Pulse-Trickle Charge  
Pulse-trickle is used to compensate for self-discharge  
while the battery is idle in the charger. The battery is  
pulse-trickle charged by driving the CC pin active once  
per second for the period specified in Table 1. This  
results in a trickle rate of C/32.  
Synchronized Voltage Sampling  
Voltage sampling at the BAT pin for PVD and -V termi-  
nation may be synchronized to an external stimulus  
u sin g t h e IN H in pu t . Low-h igh -low in pu t pu lses  
between 100ns and 3.5ms in width must be applied at  
the INH pin with a frequency greater than the maxi-  
mum synchronized sampling period” set by the state of  
the TM pin as shown in Table 1. Voltage is sampled on  
the falling edge of such pulses. If the time between  
pulses is greater than the synchronizing period, voltage  
sampling free-runs” at once every 17 seconds. A sample  
is taken by averaging together voltage measurements  
taken 57µs apart. The IC takes 32 measurements in  
PVD mode and 16 measurements in -V mode. The  
resulting sample periods (9.17 and 18.18ms, respec-  
tively) filter out harmonics centered around 55 and  
109Hz. This technique minimizes the effect of any AC  
line ripple that may feed through the power supply from  
either 50 or 60Hz AC sources. If the INH input remains  
high for more than 12ms, the voltage sample history  
kept by the IC and used for PVD and -V termination  
decisions is erased and a new history is started. Such a  
reset is required when transitioning from free-running  
to synchronized voltage sampling. The response of the  
IC to pulses less than 100ns in width or between 3.5ms  
and 12ms is indeterminate. The tolerance on all timing  
is ±12%.  
TM Pin  
The TM pin is a three-level pin used to select the  
charge timer, top-off, voltage termination mode, trickle  
r a t e, a n d volt a ge h old-off per iod opt ion s. Ta ble 1  
descr ibes t h e st a t es select ed by t h e TM pin . Th e  
m id-level select ion in pu t is developed by a r esist or  
divider bet ween VCC and ground that fixes the volt-  
age on TM at VCC/2 ± 0.5V. See Figure 4.  
Charge Status Indication  
A fast charge in progress is uniquely indicated when the  
LED pin goes low. In the charge pending state, the LED  
pin is driven low for 500ms, then to high-Z for 500ms.  
The LED pin is driven to the high-Z state for all other  
conditions. Figure 2 outlines the state of the LED pin  
during charge.  
Charge Inhibit  
Fast charge and top-off may be inhibited by using the  
INH pin. When high, INH suspends all fast charge and  
top-off activity and the internal charge timer. INH  
fr eezes t h e cu r r en t st a t e of LE D u n t il in h ibit is  
removed. Temperature monitoring is not affected by the  
INH pin. During charge inhibit, the bq2002C continues  
to pulse-trickle charge the battery per the TM selection.  
When INH returns low, charge control and the charge  
timer resume from the point where INH became active.  
Voltage Termination Hold-off  
A hold-off period occurs at the start of fast charging.  
During the hold-off time, the PVD and -V terminations  
are disabled. This avoids premature termination on the  
voltage spikes sometimes produced by older batteries  
when fast-charge current is first applied. Maximum  
voltage and temperature terminations are not affected  
by the hold-off period.  
Low-Power Mode  
The IC enters a low-power state when VBAT is driven  
above the power-down threshold (VPD) where  
Maximum Voltage, Temperature, and Time  
VPD = VCC - (1V ±0.5V)  
Any time the voltage on the BAT pin exceeds the maxi-  
mum cell voltage, VMCV, fast charge is terminated.  
Both the CC pin and the LED pin are driven to the  
high-Z state. The operating current is reduced to less  
than 1µA in this mode. When VBAT returns to a value  
below VPD, the IC pulse-trickle charges until the next  
new charge cycle begins.  
Maximum temperature termination occurs anytime the  
voltage on the TS pin falls below the temperature cut-off  
threshold VTCO, where  
VTCO = 0.5 VCC ± 5%.  
5
bq2002C  
Absolute Maximum Ratings  
Symbol  
VCC  
Parameter  
VCC relative to VSS  
Minimum  
-0.3  
Maximum  
+7.0  
Unit  
V
Notes  
VT  
DC voltage applied on any pin  
excluding VCC relative to VSS  
-0.3  
+7.0  
V
TOPR  
Operating ambient temperature  
Storage temperature  
0
-40  
-
+70  
+85  
°C  
°C  
°C  
°C  
Commercial  
TSTG  
TSOLDER  
TBIAS  
Soldering temperature  
+260  
+85  
10 sec max.  
Temperature under bias  
-40  
Note:  
Permanent device damage may occur if Absolu te Ma xim u m Ra tin gs are exceeded. Functional opera-  
tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Expo-  
sure to conditions beyond the operational limits for extended periods of time may affect device reliability.  
DC Thresholds (T = 0 to 70°C; V  
±20%)  
CC  
A
Symbol  
Parameter  
Rating  
Tolerance  
Unit  
Notes  
VTCO  
Temperature cutoff  
0.5 VCC  
*
V
±5%  
VTS VTCO inhibits/terminates  
fast charge  
VHTF  
High-temperature fault  
Maximum cell voltage  
Minimum cell voltage  
V
V
0.6 VCC  
±5%  
±5%  
VTS VHTF inhibits fast charge  
start  
VMCV  
2
VBAT VMCV inhibits/terminates  
fast charge  
VLBAT  
V
0.175 VCC  
-12  
±20%  
±3  
VBAT VLBAT inhibits fast charge  
BAT input change for  
mV  
-V  
-V detection  
PVD  
BAT input change for  
PVD detection  
-2.5  
mV  
±2.5  
6
bq2002C  
Recommended DC Operating Conditions (T = 0 to 70°C)  
A
Symbol  
VCC  
Condition  
Supply voltage  
Minimum  
Typical  
Maximum  
Unit  
V
Notes  
4.0  
5.0  
6.0  
2
VDET  
VBAT  
VTS  
-V, PVD detect voltage  
Battery input  
1
0
-
-
-
-
-
-
V
VCC  
VCC  
-
V
Thermistor input  
Logic input high  
Logic input high  
Logic input mid  
0.5  
V
VTS < 0.5V prohibited  
VIH  
0.5  
V
INH  
TM  
TM  
VCC - 0.5  
-
V
VCC  
VCC  
VIM  
V
- 0.5  
+ 0.5  
2
2
VIL  
Logic input low  
Logic input low  
Logic output low  
Power down  
-
-
-
-
-
0.1  
V
V
V
V
INH  
-
0.5  
TM  
VOL  
VPD  
-
0.8  
LED, CC, IOL = 10mA  
VCC - 1.5  
VCC - 0.5  
VBAT VPD max. powers  
down bq2002C;  
VBAT < VPD min. =  
normal operation.  
ICC  
Supply current  
-
-
500  
µA  
µA  
Outputs unloaded,  
VCC = 5.1V  
ISB  
IOL  
IL  
Standby current  
LED, CC sink  
Input leakage  
-
10  
-
-
-
-
-
1
-
VCC = 5.1V, VBAT = VPD  
mA @VOL = VSS + 0.8V  
±1  
-
µA  
µA  
INH, CC, V = VSS to VCC  
LED, CC  
IOZ  
Output leakage in  
high-Z state  
-5  
Note:  
All voltages relative to VSS.  
7
bq2002C  
Impedance  
Symbol  
Parameter  
Minimum  
Typical  
Maximum  
Unit  
M  
MΩ  
RBAT  
RTS  
Battery input impedance  
TS input impedance  
50  
50  
-
-
-
-
Timing (T = 0 to +70°C; V  
±10%)  
CC  
A
Symbol  
dFCV  
Parameter  
Minimum Typical Maximum  
-12 12  
Unit  
Notes  
Time base variation  
-
%
Note:  
Typical is at TA = 25°C, VCC = 5.0V.  
8
bq2002C  
(
)
8-Pin DIP PN  
(
)
8-Pin PN 0.300" DIP  
Inches  
Millimeters  
D
Min.  
0.160  
0.015  
0.015  
0.055  
0.008  
0.350  
0.300  
0.230  
0.300  
0.090  
0.115  
0.020  
Max.  
0.180  
0.040  
0.022  
0.065  
0.013  
0.380  
0.325  
0.280  
0.370  
0.110  
0.150  
0.040  
Min.  
4.06  
0.38  
0.38  
1.40  
0.20  
8.89  
7.62  
5.84  
7.62  
2.29  
2.92  
0.51  
Max.  
4.57  
1.02  
0.56  
1.65  
0.33  
9.65  
8.26  
7.11  
9.40  
2.79  
3.81  
1.02  
Dimension  
A
A1  
B
E1  
E
B1  
C
A
B1  
A1  
D
E
L
C
E1  
e
B
S
G
L
e
G
S
9
bq2002C  
8-Pin SOIC Narrow (SN)  
(
)
8-Pin SN 0.150" SOIC  
Inches  
Millimeters  
Min.  
Min.  
0.060  
0.004  
0.013  
0.007  
0.185  
0.150  
0.045  
0.225  
0.015  
Max.  
0.070  
0.010  
0.020  
0.010  
0.200  
0.160  
0.055  
0.245  
0.035  
Max.  
1.78  
0.25  
0.51  
0.25  
5.08  
4.06  
1.40  
6.22  
0.89  
Dimension  
A
1.52  
0.10  
0.33  
0.18  
4.70  
3.81  
1.14  
5.72  
0.38  
A1  
B
C
D
E
e
H
L
10  
bq2002C  
Data Sheet Revision History  
Change No.  
Page No.  
Description  
Revised format and outline of this data sheet  
1
All  
Note:  
Change 1 = Sept. 1997 B changes from Dec. 1995.  
Ordering Information  
bq2002C  
Pa ck a ge Op tion :  
PN = 8-pin plastic DIP  
SN = 8-pin narrow SOIC  
Device:  
bq2002C Fast-Charge IC  
11  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1999, Texas Instruments Incorporated  

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