BQ2002EPN [TI]
NiCd/NiMH Fast-Charge Management ICs; 镍镉/镍氢电池快速充电管理IC型号: | BQ2002EPN |
厂家: | TEXAS INSTRUMENTS |
描述: | NiCd/NiMH Fast-Charge Management ICs |
文件: | 总13页 (文件大小:79K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
bq2002E/G
NiCd/NiMH Fast-Charge Management ICs
Features
General Description
Fast charge is terminated by any of
the following:
➤
Fast charge of nickel cadmium
or nickel-metal hydride batter-
Th e bq2002E a n d bq2002G Fa st -
Charge ICs are low-cost CMOS bat-
tery-charge controllers providing reli-
able charge termination for both NiCd
and NiMH battery applications. Con-
trolling a current-limited or con-
st a n t -cu r r en t su pply a llows t h e
bq2002E/G to be the basis for a cost-
effective stand-alone or system-inte-
grated charger. The bq2002E/G inte-
grates fast charge with optional top-off
and pulsed- trickle control in a single
IC for charging one or more NiCd or
NiMH battery cells.
n
n
n
n
n
Peak voltage detection (PVD)
Negative delta voltage (-∆V)
Maximum voltage
ies
➤
➤
Dir ect LE D ou t pu t displa ys
charge status
Maximum temperature
Maximum time
Fast-charge termination by -∆V,
ma ximum volta ge, ma ximum
t em per a t u r e, a n d m a xim u m
time
After fast charge, the bq2002E/G op-
tionally tops-off and pulse-trickles the
battery per the pre-configured limits.
Fast charge may be inhibited using
the INH pin. The bq2002E/G may
also be placed in low-standby-power
mode to reduce system power con-
sumption.
➤
Internal band-gap voltage ref-
erence
➤
➤
Optional top-off charge
Fast charge is initiated on application
of the charging supply or battery re-
placement. For safety, fast charge is
inhibited if the battery temperature
and voltage are outside configured
limits.
Selectable pulse trickle charge
rates
T h e b q 2 0 0 2 E d iffe r s fr om t h e
bq2002G only in that a slightly dif-
ferent set of fast-charge and top-off
time limits is available. All differ-
ences between the two ICs are illus-
trated in Table 1.
➤
➤
Low-power mode
8-pin 300-mil DIP or 150-mil
SOIC
Pin Connections
Pin Names
TS
Temperature sense input
Supply voltage input
Charge inhibit input
Charge control output
TM
Timer mode select input
Charging status output
Battery voltage input
System ground
TM
LED
BAT
1
2
3
4
8
7
6
5
CC
VCC
INH
CC
LED
BAT
VSS
INH
V
CC
V
SS
TS
8-Pin DIP or
Narrow SOIC
PN-200201.eps
bq2002E/G Selection Guide
Part No. LBAT
TCO
HTF
LTF
PVD Fast Charge
tMTO
Top-Off
None
C/16
Maintenance
-∆V
➤
bq2002E
None
➤
➤
C/2
1C
2C
C/2
1C
2C
200
80
C/32
C/32
C/32
C/32
C/32
C/32
0.175
VCC
0.5
VCC
0.6
VCC
40
None
None
C/16
bq2002G
None
➤
➤
160
80
0.175
VCC
0.5
VCC
0.6
VCC
➤
40
None
2/99
1
bq2002E/G
sumes operation at the point where initially
suspended.
Pin Descriptions
Timer mode input
TM
Ch ar ge con tr ol ou tpu t
CC
A three-level input that controls the settings
for the fast charge safety timer, voltage ter-
mination mode, top-off, pulse-trickle, and
voltage hold-off time.
An open-drain output used to control the
charging current to the battery. CC switch-
ing to high impedance (Z) enables charging
current to flow, and low to inhibit charging
current. CC is modulated to provide top-off,
if enabled, and pulse trickle.
Ch ar gin g ou tpu t statu s
LED
BAT
Open-drain output that indicates the charging
status.
Functional Description
Batter y in pu t voltage
Figure 2 shows a state diagram and Figure 3 shows a
block diagram of the bq2002E/G.
The battery voltage sense input. The input to
this pin is created by a high-impedance re-
sistor divider network connected between
the positive and negative terminals of the
battery.
Battery Voltage and Temperature
Measurements
Battery voltage and temperature are monitored for
maximum allowable values. The voltage presented on
t h e ba t t er y sen se in pu t , BAT, sh ou ld r epr esen t a
single-cell potential for the battery under charge.
resistor-divider ratio of
System gr ou n d
VSS
TS
Tem per atu r e sen se in pu t
A
Input for an external battery temperature
monitoring thermistor.
RB1
= N - 1
RB2
Su pply voltage in pu t
5.0V ±20% power input.
Ch ar ge in h ibit in pu t
VCC
INH
is recommended to maintain the battery voltage within
the valid range, where N is the number of cells, RB1 is
the resistor connected to the positive battery terminal,
and RB2 is the resistor connected to the negative bat-
tery terminal. See Figure 1.
When high, INH suspends the fast charge in
progress. When returned low, the IC re-
Note: This resistor-divider network input impedance to
end-to-end should be at least 200kΩ and less than 1 MΩ.
V
CC
PACK +
RT
V
RB1
RB2
R3
R4
CC
BAT
TM
T
S
N
T
bq2002E/G
bq2002E/G
C
V
SS
V
SS
BAT pin connection
Mid-level
setting for TM
NTC = negative temperature coefficient thermistor.
Thermistor connection
Fg2002E/G01.eps
Figure 1. Voltage and Temperature Monitoring and TM Pin Configuration
2
bq2002E/G
Chip on
4.0V
Battery Voltage
too High?
V
CC
V
>
2V
BAT
V
< 2V
BAT
Battery Voltage
too Low?
V
< 0.175 V
CC
BAT
0.175
> 0.6
V
V
< V
BAT
CC
V
V
< 0.6
V
CC
TS
CC
TS
Battery
Temperature?
Charge
Pending
V or
(PVD or -
Maximum Time Out)
and TM = Low
Fast
LED =
Low
Trickle
LED =
Flash
V
V
V
> 0.175
< 2V, and
> V /2
CC
V
,
CC
BAT
BAT
TS
V
> 2V
BAT
V
> 2V or
Top-off
LED = Z
BAT
< V /2 or
V
TS
CC
((PVD or - V or
Maximum Time Out)
V
2V
BAT
Low)
and TM
Trickle
V
V
2V or
/2 or
BAT
TS
LED = Z
V
CC
Maximum Time Out
SD2002C.eps
Figure 2. State Diagram
Clock
Phase
Generator
OSC
TM
INH
Sample
History
Timing
Control
Voltage
Reference
PVD, - V
ALU
A to D
Converter
Charge-Control
State Machine
LBAT
Check
MCV
Check
BAT
HTF TCO
Check Check
Power-On
Reset
Power
Down
CC
LED
V
TS
V
CC
SS
Bd2002CEG.eps
Figure 3. Block Diagram
3
bq2002E/G
V
CC
= 0
Fast Charging
Top-Off
(optional)
Pulse-Trickle
Fast Charging
See Table 1
73ms
CC Output
1.17s
Charge initiated by application of power
Charge initiated by battery replacement
1.17s
LED
TD2002EG.eps
Figure 4. Charge Cycle Phases
1. Application of power to VCC or
A ground-referenced negative temperature coefficient ther-
mistor placed near the battery may be used as a low-cost
temperature-to-voltage transducer. The temperature
sense voltage input at TS is developed using a resistor-
thermistor network between VCC and VSS. See Figure 1.
2. Voltage at the BAT pin falling through the maximum
cell voltage VMCV where
VMCV = 2V ±5%.
If the battery is within the configured temperature and
voltage limits, the IC begins fast charge. The valid bat-
tery voltage range is VLBAT < VBAT < VMCV, where
Starting A Charge Cycle
Either of two events starts a charge cycle (see Figure 4):
Table 1. Fast-Charge Safety Time/Hold-Off/Top-Off Table
Typical Fast-
Charge and
Top-Off
Maximum
Synchro-
Corre-
sponding
Fast-Charge
Rate
Time Limits
(minutes)
Typical PVD
and -∆V
Hold-Off Time Top-Off Trickle
(seconds)
Pulse-
Trickle Sampling
Width
(ms)
nized
Pulse-
Period
(seconds)
bq2002E bq2002G
TM
Mid
Low
High
Termination
PVD
Rate
Disabled
C/16
Rate
C/32
C/32
C/32
C/2
1C
2C
200
80
160
80
300
73
37
18
18.7
18.7
9.4
PVD
150
-∆V
40
40
75
Disabled
Notes:
Typical conditions = 25°C, VCC = 5.0V
Mid = 0.5 VCC ±0.5V
*
Tolerance on all timing is ±12%.
4
bq2002E/G
The response of the IC to pulses less than 100ns in
width or between 3.5ms and 12ms is indeterminate. Tol-
erance on all timing is ±12%.
VLBAT = 0.175 VCC ±20%
The valid temperature range is VTS > VHTF where
VHTF = 0.6 VCC ±5%.
Voltage Termination Hold-off
If the battery voltage or temperature is outside of these
limits, the IC pulse-trickle charges until the next new
charge cycle begins.
A hold-off period occurs at the start of fast charging.
During the hold-off time, the PVD and -∆V terminations
are disabled. This avoids premature termination on the
voltage spikes sometimes produced by older batteries
when fast-charge current is first applied. Maximum
voltage and temperature terminations are not affected
by the hold-off period.
If VMCV < VBAT < VPD (see “Low-Power Mode”) when a
new battery is inserted, a delay of 0.35 to 0.9s is imposed
before the new charge cycle begins.
Fast charge continues until termination by one or more of
the five possible termination conditions:
Maximum Voltage, Temperature, and Time
n
n
n
n
n
Peak voltage detection (PVD)
Negative delta voltage (-∆V)
Maximum voltage
Any time the voltage on the BAT pin exceeds the maxi-
mum cell voltage,VMCV, fast charge or optional top-off
charge is terminated.
Maximum temperature termination occurs anytime the
voltage on the TS pin falls below the temperature cut-off
threshold VTCO where
Maximum temperature
Maximum time
VTCO = 0.5 VCC ± 5%.
PVD and -∆V Termination
Maximum charge time is configured using the TM pin.
Time settings are available for corresponding charge
rates of C/2, 1C, and 2C. Maximum time-out termina-
tion is enforced on the fast-charge phase, then reset, and
enforced again on the top-off phase, if selected. There is
no time limit on the trickle-charge phase.
There are two modes for voltage termination, depending
on the state of TM. For -∆V (TM = high), if VBAT is lower
than any previously measured value by 12mV ±3mV, fast
charge is terminated. For PVD (TM = low or mid), a de-
crease of 2.5mV ±2.5mV terminates fast charge. The PVD
and -∆V tests are valid in the range 1V < VBAT < 2V.
Top-off Charge
Synchronized Voltage Sampling
An optional top-off charge phase may be selected to
follow fast charge termination for 1C and C/2 rates.
This phase may be necessary on NiMH or other bat-
tery chemistries that have a tendency to terminate
charge before reaching full capacity. With top-off en-
a bled, ch a r gin g con t in u es a t a r edu ced r a t e a ft er
fast-charge termination for a period of time selected
by the TM pin. (See Table 1.) During top-off, the CC
pin is modulated at a duty cycle of 73ms active for
every 1097ms inactive. This modulation results in an
average rate 1/16th that of the fast charge rate. Maxi-
mum voltage, time, and temperature are the only ter-
mination methods enabled during top-off.
Voltage sampling at the BAT pin for PVD and -∆V termi-
nation may be synchronized to an external stimulus us-
ing the INH input. Low-high-low input pulses between
100ns and 3.5ms in width must be applied at the INH
pin with a frequency greater than the “maximum syn-
chronized sampling period” set by the state of the TM
pin as shown in Table 1. Voltage is sampled on the fal-
ling edge of such pulses.
If the time between pulses is greater than the synchro-
nizing period, voltage sampling “free-runs” at once every
17 seconds. A sample is taken by averaging together
voltage measurements taken 57µs apart. The IC takes
32 measurements in PVD mode and 16 measurements
in -∆V mode. The resulting sample periods (9.17 and
18.18ms, respectively) filter out harmonics centered
around 55 and 109Hz. This technique minimizes the ef-
fect of any AC line ripple that may feed through the
power supply from either 50 or 60Hz AC sources.
Pulse-Trickle Charge
Pulse-trickle is used to compensate for self-discharge
while the battery is idle in the charger. The battery is
pulse-trickle charged by driving the CC pin active once
every 1.17s for the period specified in Table 1. This re-
sults in a trickle rate of C/32.
If the INH input remains high for more than 12ms, the
voltage sample history kept by the IC and used for PVD
and -∆V termination decisions is erased and a new his-
tory is started. Such a reset is required when transition-
ing from free-running to synchronized voltage sampling.
TM Pin
The TM pin is a three-level pin used to select the
charge timer, top-off, voltage termination mode, trickle
5
bq2002E/G
rate, and voltage hold-off period options. Table 1 de-
scr ibes t h e st a t es select ed by t h e TM pin . Th e m id-
level select ion in pu t is developed by a r esist or di-
vider bet ween VCC and ground that fixes the voltage
on TM at VCC/2 ± 0.5V. See Figure 4.
Low-Power Mode
The IC enters a low-power state when VBAT is driven
above the power-down threshold (VPD) where
VPD = VCC - (1V ±0.5V)
Charge Status Indication
Both the CC pin and the LED pin are driven to the
high-Z state. The operating current is reduced to less
than 1µA in this mode. When VBAT returns to a value
below VPD, the IC pulse-trickle charges until the next
new charge cycle begins.
A fast charge in progress is uniquely indicated when the
LED pin goes low. The LED pin is driven to the high-Z
state for all conditions other than fast charge. Figure 2
outlines the state of the LED pin during charge.
Charge Inhibit
Fast charge and top-off may be inhibited by using the
INH pin. When high, INH suspends all fast charge and
top-off activity and the internal charge timer. INH
freezes the current state of LED until inhibit is removed.
Temperature monitoring is not affected by the INH pin.
During cha rge inhibit, the bq2002E/G continues to
pulse-trickle charge the battery per the TM selection.
When INH returns low, charge control and the charge
timer resume from the point where INH became active.
6
bq2002E/G
Absolute Maximum Ratings
Symbol
VCC
Parameter
VCC relative to VSS
Minimum
-0.3
Maximum
+7.0
Unit
V
Notes
VT
DC voltage applied on any pin
excluding VCC relative to VSS
-0.3
+7.0
V
TOPR
Operating ambient temperature
Storage temperature
0
-40
-
+70
+85
°C
°C
°C
°C
Commercial
TSTG
TSOLDER
TBIAS
Soldering temperature
+260
+85
10 sec max.
Temperature under bias
-40
Note:
Permanent device damage may occur if Absolu te Ma xim u m Ra tin gs are exceeded. Functional opera-
tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Expo-
sure to conditions beyond the operational limits for extended periods of time may affect device reliability.
DC Thresholds (T = 0 to 70°C; V
±20%)
CC
A
Symbol
Parameter
Rating
Tolerance
Unit
Notes
VTCO
Temperature cutoff
0.5 VCC
*
±5%
V
VTS ≤ VTCO inhibits/terminates
fast charge and top-off
VHTF
VMCV
VLBAT
-∆V
High temperature fault
Maximum cell voltage
Minimum cell voltage
V
V
VTS < VHTF inhibits fast charge
start
0.6 VCC
±5%
±5%
±20%
±3
2
0.175 VCC
-12
VBAT ≥ VMCV inhibits/terminates
fast charge and top-off
V
VBAT < VLBAT inhibits fast charge
start
BAT input change for
-∆V detection
mV
mV
PVD
BAT input change for
PVD detection
-2.5
±2.5
7
bq2002E/G
Recommended DC Operating Conditions (T = 0 to 70°C)
A
Symbol
VCC
Condition
Supply voltage
Minimum
Typical
Maximum
Unit
V
Notes
4.0
5.0
6.0
2
VDET
VBAT
VTS
-∆V, PVD detect voltage
Battery input
1
0
-
-
-
-
-
-
V
VCC
VCC
-
V
Thermistor input
Logic input high
Logic input high
Logic input mid
0.5
V
VTS < 0.5V prohibited
VIH
0.5
V
INH
TM
TM
VCC - 0.5
-
V
VCC
VCC
VIM
V
- 0.5
+ 0.5
2
2
VIL
Logic input low
Logic input low
Logic output low
Power down
-
-
-
-
-
0.1
V
V
V
V
INH
-
0.5
TM
VOL
VPD
-
0.8
LED, CC, IOL = 10mA
VCC - 1.5
VCC - 0.5
VBAT ≥ VPD max. powers
down bq2002E/G;
VBAT < VPD min. =
normal operation.
ICC
Supply current
-
-
500
µA
µA
Outputs unloaded,
VCC = 5.1V
ISB
IOL
IL
Standby current
LED, CC sink
Input leakage
-
10
-
-
-
-
-
1
-
VCC = 5.1V, VBAT = VPD
mA @VOL = VSS + 0.8V
±1
-
µA
µA
INH, CC, V = VSS to VCC
LED, CC
IOZ
Output leakage in
high-Z state
-5
Note:
All voltages relative to VSS.
8
bq2002E/G
Impedance
Symbol
Parameter
Minimum
Typical
Maximum
Unit
MΩ
MΩ
RBAT
RTS
Battery input impedance
TS input impedance
50
50
-
-
-
-
Timing (T = 0 to +70°C; V
±10%)
CC
A
Symbol
dFCV
Parameter
Time base variation
Start-up delay
Minimum Typical Maximum
Unit
Notes
-12
-
-
12
%
s
tDLY
0.35
0.9
Starting from VMCV < VBAT < VPD
Note:
Typical is at TA = 25°C, VCC = 5.0V.
9
bq2002E/G
(
)
8-Pin DIP PN
(
)
8-Pin PN 0.300" DIP
Inches
Millimeters
Min.
Dimension
Min.
0.160
0.015
0.015
0.055
0.008
0.350
0.300
0.230
0.300
0.090
0.115
0.020
Max.
0.180
0.040
0.022
0.065
0.013
0.380
0.325
0.280
0.370
0.110
0.150
0.040
Max.
4.57
1.02
0.56
1.65
0.33
9.65
8.26
7.11
9.40
2.79
3.81
1.02
D
A
A1
B
4.06
0.38
0.38
1.40
0.20
8.89
7.62
5.84
7.62
2.29
2.92
0.51
B1
C
E1
E
A
B1
D
A1
E
L
E1
e
C
G
B
S
L
e
G
S
8-Pin SOIC Narrow (SN)
(
)
8-Pin SN 0.150" SOIC
Inches
Millimeters
Dimension
Min.
0.060
0.004
0.013
0.007
0.185
0.150
0.045
0.225
0.015
Max.
0.070
0.010
0.020
0.010
0.200
0.160
0.055
0.245
0.035
Min.
Max.
1.78
0.25
0.51
0.25
5.08
4.06
1.40
6.22
0.89
A
A1
B
1.52
0.10
0.33
0.18
4.70
3.81
1.14
5.72
0.38
C
D
E
e
H
L
10
bq2002E/G
Data Sheet Revision History
Change No.
Page No.
Description
Nature of Change
1
1
Added selection guide
Notes:
Change 1 = Feb. 1999 B changes from Sept. 1997
Ordering Information
bq2002E/G
Pa ck a ge Op tion :
PN = 8-pin plastic DIP
SN = 8-pin narrow SOIC
Device:
bq2002E Fast Charge IC
bq2002G Fast Charge IC
11
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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