BQ2002EPN [TI]

NiCd/NiMH Fast-Charge Management ICs; 镍镉/镍氢电池快速充电管理IC
BQ2002EPN
型号: BQ2002EPN
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

NiCd/NiMH Fast-Charge Management ICs
镍镉/镍氢电池快速充电管理IC

电源电路 电池 电源管理电路 光电二极管
文件: 总13页 (文件大小:79K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
bq2002E/G  
NiCd/NiMH Fast-Charge Management ICs  
Features  
General Description  
Fast charge is terminated by any of  
the following:  
Fast charge of nickel cadmium  
or nickel-metal hydride batter-  
Th e bq2002E a n d bq2002G Fa st -  
Charge ICs are low-cost CMOS bat-  
tery-charge controllers providing reli-  
able charge termination for both NiCd  
and NiMH battery applications. Con-  
trolling a current-limited or con-  
st a n t -cu r r en t su pply a llows t h e  
bq2002E/G to be the basis for a cost-  
effective stand-alone or system-inte-  
grated charger. The bq2002E/G inte-  
grates fast charge with optional top-off  
and pulsed- trickle control in a single  
IC for charging one or more NiCd or  
NiMH battery cells.  
n
n
n
n
n
Peak voltage detection (PVD)  
Negative delta voltage (-V)  
Maximum voltage  
ies  
Dir ect LE D ou t pu t displa ys  
charge status  
Maximum temperature  
Maximum time  
Fast-charge termination by -V,  
ma ximum volta ge, ma ximum  
t em per a t u r e, a n d m a xim u m  
time  
After fast charge, the bq2002E/G op-  
tionally tops-off and pulse-trickles the  
battery per the pre-configured limits.  
Fast charge may be inhibited using  
the INH pin. The bq2002E/G may  
also be placed in low-standby-power  
mode to reduce system power con-  
sumption.  
Internal band-gap voltage ref-  
erence  
Optional top-off charge  
Fast charge is initiated on application  
of the charging supply or battery re-  
placement. For safety, fast charge is  
inhibited if the battery temperature  
and voltage are outside configured  
limits.  
Selectable pulse trickle charge  
rates  
T h e b q 2 0 0 2 E d iffe r s fr om t h e  
bq2002G only in that a slightly dif-  
ferent set of fast-charge and top-off  
time limits is available. All differ-  
ences between the two ICs are illus-  
trated in Table 1.  
Low-power mode  
8-pin 300-mil DIP or 150-mil  
SOIC  
Pin Connections  
Pin Names  
TS  
Temperature sense input  
Supply voltage input  
Charge inhibit input  
Charge control output  
TM  
Timer mode select input  
Charging status output  
Battery voltage input  
System ground  
TM  
LED  
BAT  
1
2
3
4
8
7
6
5
CC  
VCC  
INH  
CC  
LED  
BAT  
VSS  
INH  
V
CC  
V
SS  
TS  
8-Pin DIP or  
Narrow SOIC  
PN-200201.eps  
bq2002E/G Selection Guide  
Part No. LBAT  
TCO  
HTF  
LTF  
PVD Fast Charge  
tMTO  
Top-Off  
None  
C/16  
Maintenance  
-V  
bq2002E  
None  
C/2  
1C  
2C  
C/2  
1C  
2C  
200  
80  
C/32  
C/32  
C/32  
C/32  
C/32  
C/32  
0.175  
VCC  
0.5  
VCC  
0.6  
VCC  
40  
None  
None  
C/16  
bq2002G  
None  
160  
80  
0.175  
VCC  
0.5  
VCC  
0.6  
VCC  
40  
None  
2/99  
1
bq2002E/G  
sumes operation at the point where initially  
suspended.  
Pin Descriptions  
Timer mode input  
TM  
Ch ar ge con tr ol ou tpu t  
CC  
A three-level input that controls the settings  
for the fast charge safety timer, voltage ter-  
mination mode, top-off, pulse-trickle, and  
voltage hold-off time.  
An open-drain output used to control the  
charging current to the battery. CC switch-  
ing to high impedance (Z) enables charging  
current to flow, and low to inhibit charging  
current. CC is modulated to provide top-off,  
if enabled, and pulse trickle.  
Ch ar gin g ou tpu t statu s  
LED  
BAT  
Open-drain output that indicates the charging  
status.  
Functional Description  
Batter y in pu t voltage  
Figure 2 shows a state diagram and Figure 3 shows a  
block diagram of the bq2002E/G.  
The battery voltage sense input. The input to  
this pin is created by a high-impedance re-  
sistor divider network connected between  
the positive and negative terminals of the  
battery.  
Battery Voltage and Temperature  
Measurements  
Battery voltage and temperature are monitored for  
maximum allowable values. The voltage presented on  
t h e ba t t er y sen se in pu t , BAT, sh ou ld r epr esen t a  
single-cell potential for the battery under charge.  
resistor-divider ratio of  
System gr ou n d  
VSS  
TS  
Tem per atu r e sen se in pu t  
A
Input for an external battery temperature  
monitoring thermistor.  
RB1  
= N - 1  
RB2  
Su pply voltage in pu t  
5.0V ±20% power input.  
Ch ar ge in h ibit in pu t  
VCC  
INH  
is recommended to maintain the battery voltage within  
the valid range, where N is the number of cells, RB1 is  
the resistor connected to the positive battery terminal,  
and RB2 is the resistor connected to the negative bat-  
tery terminal. See Figure 1.  
When high, INH suspends the fast charge in  
progress. When returned low, the IC re-  
Note: This resistor-divider network input impedance to  
end-to-end should be at least 200kand less than 1 M.  
V
CC  
PACK +  
RT  
V
RB1  
RB2  
R3  
R4  
CC  
BAT  
TM  
T
S
N
T
bq2002E/G  
bq2002E/G  
C
V
SS  
V
SS  
BAT pin connection  
Mid-level  
setting for TM  
NTC = negative temperature coefficient thermistor.  
Thermistor connection  
Fg2002E/G01.eps  
Figure 1. Voltage and Temperature Monitoring and TM Pin Configuration  
2
bq2002E/G  
Chip on  
4.0V  
Battery Voltage  
too High?  
V
CC  
V
>
2V  
BAT  
V
< 2V  
BAT  
Battery Voltage  
too Low?  
V
< 0.175 V  
CC  
BAT  
0.175  
> 0.6  
V
V
< V  
BAT  
CC  
V
V
< 0.6  
V
CC  
TS  
CC  
TS  
Battery  
Temperature?  
Charge  
Pending  
V or  
(PVD or -  
Maximum Time Out)  
and TM = Low  
Fast  
LED =  
Low  
Trickle  
LED =  
Flash  
V
V
V
> 0.175  
< 2V, and  
> V /2  
CC  
V
,
CC  
BAT  
BAT  
TS  
V
> 2V  
BAT  
V
> 2V or  
Top-off  
LED = Z  
BAT  
< V /2 or  
V
TS  
CC  
((PVD or - V or  
Maximum Time Out)  
V
2V  
BAT  
Low)  
and TM  
Trickle  
V
V
2V or  
/2 or  
BAT  
TS  
LED = Z  
V
CC  
Maximum Time Out  
SD2002C.eps  
Figure 2. State Diagram  
Clock  
Phase  
Generator  
OSC  
TM  
INH  
Sample  
History  
Timing  
Control  
Voltage  
Reference  
PVD, - V  
ALU  
A to D  
Converter  
Charge-Control  
State Machine  
LBAT  
Check  
MCV  
Check  
BAT  
HTF TCO  
Check Check  
Power-On  
Reset  
Power  
Down  
CC  
LED  
V
TS  
V
CC  
SS  
Bd2002CEG.eps  
Figure 3. Block Diagram  
3
bq2002E/G  
V
CC  
= 0  
Fast Charging  
Top-Off  
(optional)  
Pulse-Trickle  
Fast Charging  
See Table 1  
73ms  
CC Output  
1.17s  
Charge initiated by application of power  
Charge initiated by battery replacement  
1.17s  
LED  
TD2002EG.eps  
Figure 4. Charge Cycle Phases  
1. Application of power to VCC or  
A ground-referenced negative temperature coefficient ther-  
mistor placed near the battery may be used as a low-cost  
temperature-to-voltage transducer. The temperature  
sense voltage input at TS is developed using a resistor-  
thermistor network between VCC and VSS. See Figure 1.  
2. Voltage at the BAT pin falling through the maximum  
cell voltage VMCV where  
VMCV = 2V ±5%.  
If the battery is within the configured temperature and  
voltage limits, the IC begins fast charge. The valid bat-  
tery voltage range is VLBAT < VBAT < VMCV, where  
Starting A Charge Cycle  
Either of two events starts a charge cycle (see Figure 4):  
Table 1. Fast-Charge Safety Time/Hold-Off/Top-Off Table  
Typical Fast-  
Charge and  
Top-Off  
Maximum  
Synchro-  
Corre-  
sponding  
Fast-Charge  
Rate  
Time Limits  
(minutes)  
Typical PVD  
and -V  
Hold-Off Time Top-Off Trickle  
(seconds)  
Pulse-  
Trickle Sampling  
Width  
(ms)  
nized  
Pulse-  
Period  
(seconds)  
bq2002E bq2002G  
TM  
Mid  
Low  
High  
Termination  
PVD  
Rate  
Disabled  
C/16  
Rate  
C/32  
C/32  
C/32  
C/2  
1C  
2C  
200  
80  
160  
80  
300  
73  
37  
18  
18.7  
18.7  
9.4  
PVD  
150  
-V  
40  
40  
75  
Disabled  
Notes:  
Typical conditions = 25°C, VCC = 5.0V  
Mid = 0.5 VCC ±0.5V  
*
Tolerance on all timing is ±12%.  
4
bq2002E/G  
The response of the IC to pulses less than 100ns in  
width or between 3.5ms and 12ms is indeterminate. Tol-  
erance on all timing is ±12%.  
VLBAT = 0.175 VCC ±20%  
The valid temperature range is VTS > VHTF where  
VHTF = 0.6 VCC ±5%.  
Voltage Termination Hold-off  
If the battery voltage or temperature is outside of these  
limits, the IC pulse-trickle charges until the next new  
charge cycle begins.  
A hold-off period occurs at the start of fast charging.  
During the hold-off time, the PVD and -V terminations  
are disabled. This avoids premature termination on the  
voltage spikes sometimes produced by older batteries  
when fast-charge current is first applied. Maximum  
voltage and temperature terminations are not affected  
by the hold-off period.  
If VMCV < VBAT < VPD (see Low-Power Mode) when a  
new battery is inserted, a delay of 0.35 to 0.9s is imposed  
before the new charge cycle begins.  
Fast charge continues until termination by one or more of  
the five possible termination conditions:  
Maximum Voltage, Temperature, and Time  
n
n
n
n
n
Peak voltage detection (PVD)  
Negative delta voltage (-V)  
Maximum voltage  
Any time the voltage on the BAT pin exceeds the maxi-  
mum cell voltage,VMCV, fast charge or optional top-off  
charge is terminated.  
Maximum temperature termination occurs anytime the  
voltage on the TS pin falls below the temperature cut-off  
threshold VTCO where  
Maximum temperature  
Maximum time  
VTCO = 0.5 VCC ± 5%.  
PVD and -V Termination  
Maximum charge time is configured using the TM pin.  
Time settings are available for corresponding charge  
rates of C/2, 1C, and 2C. Maximum time-out termina-  
tion is enforced on the fast-charge phase, then reset, and  
enforced again on the top-off phase, if selected. There is  
no time limit on the trickle-charge phase.  
There are two modes for voltage termination, depending  
on the state of TM. For -V (TM = high), if VBAT is lower  
than any previously measured value by 12mV ±3mV, fast  
charge is terminated. For PVD (TM = low or mid), a de-  
crease of 2.5mV ±2.5mV terminates fast charge. The PVD  
and -V tests are valid in the range 1V < VBAT < 2V.  
Top-off Charge  
Synchronized Voltage Sampling  
An optional top-off charge phase may be selected to  
follow fast charge termination for 1C and C/2 rates.  
This phase may be necessary on NiMH or other bat-  
tery chemistries that have a tendency to terminate  
charge before reaching full capacity. With top-off en-  
a bled, ch a r gin g con t in u es a t a r edu ced r a t e a ft er  
fast-charge termination for a period of time selected  
by the TM pin. (See Table 1.) During top-off, the CC  
pin is modulated at a duty cycle of 73ms active for  
every 1097ms inactive. This modulation results in an  
average rate 1/16th that of the fast charge rate. Maxi-  
mum voltage, time, and temperature are the only ter-  
mination methods enabled during top-off.  
Voltage sampling at the BAT pin for PVD and -V termi-  
nation may be synchronized to an external stimulus us-  
ing the INH input. Low-high-low input pulses between  
100ns and 3.5ms in width must be applied at the INH  
pin with a frequency greater than the maximum syn-  
chronized sampling period” set by the state of the TM  
pin as shown in Table 1. Voltage is sampled on the fal-  
ling edge of such pulses.  
If the time between pulses is greater than the synchro-  
nizing period, voltage sampling free-runs” at once every  
17 seconds. A sample is taken by averaging together  
voltage measurements taken 57µs apart. The IC takes  
32 measurements in PVD mode and 16 measurements  
in -V mode. The resulting sample periods (9.17 and  
18.18ms, respectively) filter out harmonics centered  
around 55 and 109Hz. This technique minimizes the ef-  
fect of any AC line ripple that may feed through the  
power supply from either 50 or 60Hz AC sources.  
Pulse-Trickle Charge  
Pulse-trickle is used to compensate for self-discharge  
while the battery is idle in the charger. The battery is  
pulse-trickle charged by driving the CC pin active once  
every 1.17s for the period specified in Table 1. This re-  
sults in a trickle rate of C/32.  
If the INH input remains high for more than 12ms, the  
voltage sample history kept by the IC and used for PVD  
and -V termination decisions is erased and a new his-  
tory is started. Such a reset is required when transition-  
ing from free-running to synchronized voltage sampling.  
TM Pin  
The TM pin is a three-level pin used to select the  
charge timer, top-off, voltage termination mode, trickle  
5
bq2002E/G  
rate, and voltage hold-off period options. Table 1 de-  
scr ibes t h e st a t es select ed by t h e TM pin . Th e m id-  
level select ion in pu t is developed by a r esist or di-  
vider bet ween VCC and ground that fixes the voltage  
on TM at VCC/2 ± 0.5V. See Figure 4.  
Low-Power Mode  
The IC enters a low-power state when VBAT is driven  
above the power-down threshold (VPD) where  
VPD = VCC - (1V ±0.5V)  
Charge Status Indication  
Both the CC pin and the LED pin are driven to the  
high-Z state. The operating current is reduced to less  
than 1µA in this mode. When VBAT returns to a value  
below VPD, the IC pulse-trickle charges until the next  
new charge cycle begins.  
A fast charge in progress is uniquely indicated when the  
LED pin goes low. The LED pin is driven to the high-Z  
state for all conditions other than fast charge. Figure 2  
outlines the state of the LED pin during charge.  
Charge Inhibit  
Fast charge and top-off may be inhibited by using the  
INH pin. When high, INH suspends all fast charge and  
top-off activity and the internal charge timer. INH  
freezes the current state of LED until inhibit is removed.  
Temperature monitoring is not affected by the INH pin.  
During cha rge inhibit, the bq2002E/G continues to  
pulse-trickle charge the battery per the TM selection.  
When INH returns low, charge control and the charge  
timer resume from the point where INH became active.  
6
bq2002E/G  
Absolute Maximum Ratings  
Symbol  
VCC  
Parameter  
VCC relative to VSS  
Minimum  
-0.3  
Maximum  
+7.0  
Unit  
V
Notes  
VT  
DC voltage applied on any pin  
excluding VCC relative to VSS  
-0.3  
+7.0  
V
TOPR  
Operating ambient temperature  
Storage temperature  
0
-40  
-
+70  
+85  
°C  
°C  
°C  
°C  
Commercial  
TSTG  
TSOLDER  
TBIAS  
Soldering temperature  
+260  
+85  
10 sec max.  
Temperature under bias  
-40  
Note:  
Permanent device damage may occur if Absolu te Ma xim u m Ra tin gs are exceeded. Functional opera-  
tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Expo-  
sure to conditions beyond the operational limits for extended periods of time may affect device reliability.  
DC Thresholds (T = 0 to 70°C; V  
±20%)  
CC  
A
Symbol  
Parameter  
Rating  
Tolerance  
Unit  
Notes  
VTCO  
Temperature cutoff  
0.5 VCC  
*
±5%  
V
VTS VTCO inhibits/terminates  
fast charge and top-off  
VHTF  
VMCV  
VLBAT  
-V  
High temperature fault  
Maximum cell voltage  
Minimum cell voltage  
V
V
VTS < VHTF inhibits fast charge  
start  
0.6 VCC  
±5%  
±5%  
±20%  
±3  
2
0.175 VCC  
-12  
VBAT VMCV inhibits/terminates  
fast charge and top-off  
V
VBAT < VLBAT inhibits fast charge  
start  
BAT input change for  
-V detection  
mV  
mV  
PVD  
BAT input change for  
PVD detection  
-2.5  
±2.5  
7
bq2002E/G  
Recommended DC Operating Conditions (T = 0 to 70°C)  
A
Symbol  
VCC  
Condition  
Supply voltage  
Minimum  
Typical  
Maximum  
Unit  
V
Notes  
4.0  
5.0  
6.0  
2
VDET  
VBAT  
VTS  
-V, PVD detect voltage  
Battery input  
1
0
-
-
-
-
-
-
V
VCC  
VCC  
-
V
Thermistor input  
Logic input high  
Logic input high  
Logic input mid  
0.5  
V
VTS < 0.5V prohibited  
VIH  
0.5  
V
INH  
TM  
TM  
VCC - 0.5  
-
V
VCC  
VCC  
VIM  
V
- 0.5  
+ 0.5  
2
2
VIL  
Logic input low  
Logic input low  
Logic output low  
Power down  
-
-
-
-
-
0.1  
V
V
V
V
INH  
-
0.5  
TM  
VOL  
VPD  
-
0.8  
LED, CC, IOL = 10mA  
VCC - 1.5  
VCC - 0.5  
VBAT VPD max. powers  
down bq2002E/G;  
VBAT < VPD min. =  
normal operation.  
ICC  
Supply current  
-
-
500  
µA  
µA  
Outputs unloaded,  
VCC = 5.1V  
ISB  
IOL  
IL  
Standby current  
LED, CC sink  
Input leakage  
-
10  
-
-
-
-
-
1
-
VCC = 5.1V, VBAT = VPD  
mA @VOL = VSS + 0.8V  
±1  
-
µA  
µA  
INH, CC, V = VSS to VCC  
LED, CC  
IOZ  
Output leakage in  
high-Z state  
-5  
Note:  
All voltages relative to VSS.  
8
bq2002E/G  
Impedance  
Symbol  
Parameter  
Minimum  
Typical  
Maximum  
Unit  
MΩ  
MΩ  
RBAT  
RTS  
Battery input impedance  
TS input impedance  
50  
50  
-
-
-
-
Timing (T = 0 to +70°C; V  
±10%)  
CC  
A
Symbol  
dFCV  
Parameter  
Time base variation  
Start-up delay  
Minimum Typical Maximum  
Unit  
Notes  
-12  
-
-
12  
%
s
tDLY  
0.35  
0.9  
Starting from VMCV < VBAT < VPD  
Note:  
Typical is at TA = 25°C, VCC = 5.0V.  
9
bq2002E/G  
(
)
8-Pin DIP PN  
(
)
8-Pin PN 0.300" DIP  
Inches  
Millimeters  
Min.  
Dimension  
Min.  
0.160  
0.015  
0.015  
0.055  
0.008  
0.350  
0.300  
0.230  
0.300  
0.090  
0.115  
0.020  
Max.  
0.180  
0.040  
0.022  
0.065  
0.013  
0.380  
0.325  
0.280  
0.370  
0.110  
0.150  
0.040  
Max.  
4.57  
1.02  
0.56  
1.65  
0.33  
9.65  
8.26  
7.11  
9.40  
2.79  
3.81  
1.02  
D
A
A1  
B
4.06  
0.38  
0.38  
1.40  
0.20  
8.89  
7.62  
5.84  
7.62  
2.29  
2.92  
0.51  
B1  
C
E1  
E
A
B1  
D
A1  
E
L
E1  
e
C
G
B
S
L
e
G
S
8-Pin SOIC Narrow (SN)  
(
)
8-Pin SN 0.150" SOIC  
Inches  
Millimeters  
Dimension  
Min.  
0.060  
0.004  
0.013  
0.007  
0.185  
0.150  
0.045  
0.225  
0.015  
Max.  
0.070  
0.010  
0.020  
0.010  
0.200  
0.160  
0.055  
0.245  
0.035  
Min.  
Max.  
1.78  
0.25  
0.51  
0.25  
5.08  
4.06  
1.40  
6.22  
0.89  
A
A1  
B
1.52  
0.10  
0.33  
0.18  
4.70  
3.81  
1.14  
5.72  
0.38  
C
D
E
e
H
L
10  
bq2002E/G  
Data Sheet Revision History  
Change No.  
Page No.  
Description  
Nature of Change  
1
1
Added selection guide  
Notes:  
Change 1 = Feb. 1999 B changes from Sept. 1997  
Ordering Information  
bq2002E/G  
Pa ck a ge Op tion :  
PN = 8-pin plastic DIP  
SN = 8-pin narrow SOIC  
Device:  
bq2002E Fast Charge IC  
bq2002G Fast Charge IC  
11  
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any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1999, Texas Instruments Incorporated  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1999, Texas Instruments Incorporated  

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