BQ20Z90DBTR-V150 [TI]
SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29330; SBS 1.1标准的电量监测计启用Impedance Track技术为使用的bq29330
| 型号： | BQ20Z90DBTR-V150 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29330 |
| 文件： | 总15页 (文件大小：274K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
bq20z90
www.ti.com
SLUS778–JULY 2007
SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK™
TECHNOLOGY FOR USE WITH THE bq29330
1
FEATURES
•
•
Lifetime Data Logging
30-Pin TSSOP (DBT)
2
•
Patented Impedance Track™ Technology
Accurately Measures Available Charge in
Li-Ion and Li-Polymer Batteries
APPLICATIONS
•
•
•
Notebook PCs
Medical and Test Equipment
Portable Instrumentation
•
•
•
Better than 1% Error Over Lifetime of the
Battery
Instant Accuracy – No Learning Cycle
Required
DESCRIPTION
Automatically adjusts for battery aging,
battery self discharge and temperature
inefficiencies
The bq20z90 SBS-compliant gas gauge IC,
incorporating
patented
Impedance
Track™
technology, is designed for battery-pack or in-system
installation. The bq20z90 measures and maintains an
accurate record of available charge in Li-ion or
•
•
Supports the Smart Battery Specification SBS
V1.1
Works With the TI bq29330 Analog Front-End
(AFE) Protection IC to Provide Complete Pack
Electronics Solution
Li-polymer
batteries
using
its
integrated
high-performance analog peripherals. The bq20z90
monitors capacity change, battery impedance,
open-circuit voltage, and other critical parameters of
the battery pack, and reports the information to the
system host controller over a serial-communication
bus. It is designed to work with the bq29330 analog
front-end (AFE) protection IC to maximize
functionality and safety, and minimize component
count and cost in smart battery circuits.
•
•
•
•
•
Full Array of Programmable Voltage, Current,
and Temperature Protection Features
Integrated Time Base Removes Need for
External Crystal with Optional Crystal Input
Electronics for 7.2-V, 10.8-V or 14.4-V Battery
Packs With 50% Fewer External Components
Based on a Powerful Low-Power RISC CPU
Core With High-Performance Peripherals
The Impedance Track technology continuously
analyzes the battery impedance, resulting in superior
gas-gauging accuracy. This enables remaining
capacity to be calculated with discharge rate,
temperature, and cell aging all accounted for during
each stage of every cycle.
Integrated Field Programmable FLASH
Memory Eliminates the Need for External
Configuration Memory
•
Measures Charge Flow Using a
High-Resolution, 16-Bit Integrating
Delta-Sigma Converter
AVAILABLE OPTIONS
PACKAGE
–
–
Better Than 0.65 nVh of Resolution
Self-Calibrating
TA
30-PIN TSSOP (DBT)
Tube
30-PIN TSSOP (DBT)
Tape & Reel
–40°C to
85°C
bq20z90DBT(1)
bq20z90DBTR(2)
•
Uses 16-Bit Delta-Sigma Converter for
Accurate Voltage and Temperature
Measurements
•
•
•
Extensive Data Reporting Options For
Improved System Interaction
Optional Pulse Charging Feature for Improved
Charge Times
Drives 3-, 4- or 5-Segment LED Display for
Remaining Capacity Indication
(1) A single tube quantity is 50 units.
(2) A single reel quantity is 2000 units
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
•
Supports SHA-1 Authentication
2
IMPEDANCE TRACK is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
bq20z90
www.ti.com
SLUS778–JULY 2007
SYSTEM PARTITIONING DIAGRAM
Discharge / Charge /
Pre-Charge FETs
Fuse
Pack +
16 Dig GPIO & Peripherals
8 Dig GPIO or Analog GPI
LDO +
Reset
Nch FET Drive
(Charge Pumps)
Precharge
Control
2.5V / 3.3V (LED)
Reset
32.768kHz
Watchdog &
32kHz Oscillator and 8MHz System Clock
SMBus
Protection Timing
HDQ
System Interface
I2C
System Interface
RAM Configuration, Status
and Control Registers
2k Bytes of
Data Flash
2k Bytes
of RAM
TOUT and LEDOUT
Power Support
6k x 22
24k x 22 Program
Flash
T1
Mask ROM
Analog Output Drive
Standard Delta-Sigma A to D Converter
Integrating Delta-Sigma A to D Converter
2-Tier Over Current
Protection
Pack -
TSSOP (DBT)
(TOP VIEW)
NC
1
2
3
30
29
28
27
26
25
24
23
VCELL-
VCELL+
NC
XALERT
SDATA
SCLK
CLKOUT
TS1
4
5
RBI
VCC
6
VSS
7
TS2
MRST
SRN
PRES
PFIN
8
22
21
20
9
SRP
SAFE
SMBD
NC
10
11
12
*VSS
LED5
LED4
LED3
LED2
LED1
19
18
17
16
SMBC
13
14
15
DISP
NC
NC - No internal connection
2
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SLUS778–JULY 2007
TERMINAL FUNCTIONS
TERMINAL
I/O(1)
DESCRIPTION
NO.
NAME
NC
1
2
3
4
5
6
7
8
–
I
Not used— leave floating
XALERT
SDATA
SCLK
CLKOUT
TS1
Input from bq29330 XALERT output.
Data transfer to and from bq29330
Communication clock to the bq29330
I/O
I/O
O
I
32.768-kHz output for the bq29330. This pin should be directly connected to the AFE.
1st Thermistor voltage input connection to monitor temperature
TS2
I
2nd Thermistor voltage input connection to monitor temperature
PRES
I
Active low input to sense system insertion and typically requires additional ESD protection
Active low input to detect secondary protector output status and allows the bq20z90 to report the
status of the 2nd level protection output
9
PFIN
I
10
11
12
13
SAFE
SMBD
NC
O
I/OD
–
Active high output to enforce additional level of safety protection; e.g., fuse blow.
SMBus data open-drain bidirectional pin used to transfer address and data to and from the bq20z90
Not used— leave floating
SMBC
I/OD
SMBus clock open-drain bidirectional pin used to clock the data transfer to and from the bq20z90
Display control for the LEDs. This pin is typically connected to bq29330 REG via a 100-kΩ resistor
and a push-button switch to VSS.
14
DISP
I
15
16
17
18
19
20
21
NC
–
O
O
O
O
O
–
Not used— leave floating
LED1
LED2
LED3
LED4
LED5
VSS
LED1 display segment that drives an external LED depending on the firmware configuration
LED2 display segment that drives an external LED depending on the firmware configuration
LED3 display segment that drives an external LED depending on the firmware configuration
LED4 display segment that drives an external LED depending on the firmware configuration
LED5 display segment that drives an external LED depending on the firmware configuration
Connected I/O pin to VSS
Connections to the top of a small-value sense resistor to monitor the battery charge- and
discharge-current flow
22
23
24
SRP
SRN
IA
IA
I
Connections to the bottom of a small-value sense resistor to monitor the battery charge- and
discharge-current flow
Master reset input that forces the device into reset when held low. Must be held high for normal
operation
MRST
25
26
VSS
VCC
P
P
Negative Supply Voltage
Positive Supply Voltage
Backup power to the bq20z90 data registers during periods of low operating voltage. RBI accepts a
storage capacitor or a battery input.
27
RBI
P
28
29
30
NC
–
I
Not used— leave floating
VCELL+
VCELL-
Input from bq29330 used to read a scaled value of individual cell voltages
Input from bq29330 used to read a scaled value of individual cell voltages
I
(1) I = Input, IA = Analog input, I/O = Input/output, I/OD = Input/Open-drain output, O = Output, OA = Analog output, P = Power
Copyright © 2007, Texas Instruments Incorporated
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SLUS778–JULY 2007
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
RANGE
VCC relative to VSS
V(IOD) relative to VSS
VI relative to VSS
TA
Supply voltage range
–0.3 V to 2.75 V
–0.3 V to 6 V
Open-drain I/O pins
Input voltage range to all other pins
Operating free-air temperature range
Storage temperature range
–0.3 V to VCC + 0.3 V
–40°C to 85°C
Tstg
–65°C to 150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
2.5
MAX UNIT
VCC Supply voltage
2.4
2.6
V
No flash programming
bq20z90 + bq29330
Sleep mode
400(1)
ICC Operating mode current
μA
475
8(1)
I(SLP) Low-power storage mode current
μA
bq20z90 + bq29330
IOL = 0.5 mA
51
Output voltage low SMBC, SMBD, SDATA, SCLK, SAFE
0.4
0.4
V
V
V
VOL
LED1 – LED5
IOL = 10 mA
VOH Output high voltage, SMBC, SMBD, SDATA, SCLK, SAFE
IOH = –1 mA
VCC – 0.5
–0.3
VIL
VIH
CIN
Input voltage low SMBC, SMBD, SDATA, SCLK, XALERT,
PRES, PFIN
0.8
V
V
V
DISP
–0.3
2
0.8
6
Input voltage high SMBC, SMBD, SDATA, SCLK, XALERT,
PRES, PFIN
DISP
2
VCC + 0.3
V
Input capacitance
5
pF
V(AI1) Input voltage range VCELL+, VCELL-,TS1, TS2
V(AI2) Input voltage range SRN, SRP
- 0.2
– 0.20
8
0.8XVCC
0.20
V
Z(AI2) Input impedance VCELL+, VCELL-, TS1, TS2
Z(AI1) Input impedance SRN, SRP
0 V–1 V
0 V–1 V
MΩ
MΩ
2.5
(1) This value does not include the bq29330
4
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SLUS778–JULY 2007
POWER-ON RESET
VCC = 2.4V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
1.7
50
TYP
MAX UNIT
VIT–
Negative-going voltage input
Power-on reset hysteresis
1.8
1.9
V
VHYS
125
200
mV
POWER ON RESET BEHAVIOR
VS
FREE-AIR TEMPERATURE
1.81
1.8
1.79
1.78
1.77
1.76
-40
-20
0
20
40
60
80
TA - Free-Air Temperature - °C
INTEGRATING ADC (Coulomb Counter) CHARACTERISTICS
VCC = 2.4V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V(SR) = V(SRN) – V(SRP)
MIN
–0.2
TYP
MAX UNIT
V(SR)
Input voltage range, V(SRN) and V(SRP)
0.2
V
V(SROS) Input offset
10
0.007% 0.034%
μV
INL
Integral nonlinearity error
OSCILLATOR
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
HIGH FREQUENCY OSCILLATOR
f(OSC) Operating Frequency
TEST CONDITIONS
MIN
TYP
MAX UNIT
4.194
3%
2%
5
MHz
-3% 0.25%
-2% 0.25%
2.5
f(EIO) Frequency Error(1)(2)
TA = 20°C to 70°C
t(SXO) Start-up Time(3)
ms
LOW FREQUENCY OSCILLATOR
f(LOSC) Operating Frequency
32.768
-2.5% 0.25%
-1.5% 0.25%
KHz
2.5%
1.5%
f(LEIO) Frequency Error(2)(4)
TA = 20°C to 70°C
(1) The frequency error is measured from 4.194 MHz.
(2) The frequency drift is included and measured from the trimmed frequency at VCC = 2.5 V, TA = 25°C.
(3) The start-up time is defined as the time it takes for the oscillator output frequency to be within 1% of the specified frequency.
(4) The frequency error is measured from 32.768 kHz.
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OSCILLATOR (continued)
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
(5)
t(LSXO) Start-up time
500
μs
(5) The start-up time is defined as the time it takes for the oscillator output frequency to be ± 3%.
DATA FLASH MEMORY CHARACTERISTICS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Data retention
Flash programming write-cycles
t(WORDPROG) Word programming time
I(DDdPROG) Flash-write supply current
TEST CONDITIONS
MIN
10
TYP
MAX UNIT
Years
(1)
(1)
(1)
(1)
tDR
See
See
See
See
20,000
Cycles
2
ms
5
10
mA
(1) Assured by design. Not production tested
REGISTER BACKUP
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
I(RB)
RB data-retention input current
V(RB) > V(RBMIN), VCC < VIT-
1500
160
nA
V(RB) > V(RBMIN), VCC < VIT-, TA = 0°C
to 50°C
40
V(RB)
RB data-retention voltage(1)
1.7
V
(1) Specified by design. Not production tested.
6
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SLUS778–JULY 2007
SMBus TIMING SPECIFICATIONS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
fSMB
SMBus operating frequency
SMBus master clock frequency
Bus free time between start and stop
Hold time after (repeated) start
Repeated start setup time
Stop setup time
Slave mode, SMBC 50% duty cycle
10
100
kHz
fMAS
Master mode, no clock low slave extend
51.2
tBUF
4.7
4
tHD:STA
tSU:STA
tSU:STO
μs
4.7
4
Receive mode
Transmit mode
0
tHD:DAT
Data hold time
300
250
25
4.7
4
ns
tSU:DAT
tTIMEOUT
tLOW
Data setup time
(1)
Error signal/detect
See
35
ms
Clock low period
μs
(2)
tHIGH
Clock high period
See
50
25
(3)
tLOW:SEXT
Cumulative clock low slave extend time
See
ms
ns
(4)
tLOW:MEXT Cumulative clock low master extend time
See
10
tF
Clock/data fall time
Clock/data rise time
(VILMAX – 0.15 V) to (VIHMIN + 0.15 V)
0.9 VCC to (VILMAX – 0.15 V)
300
1000
tR
(1) The bq20z90 times out when any clock low exceeds tTIMEOUT
.
(2) tHIGH:MAX. is minimum bus idle time. SMBC = 1 for t > 50 μs causes reset of any transaction involving the bq20z90 that is in progress.
(3) tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.
(4) tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop.
SMBus TIMING DIAGRAM
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SLUS778–JULY 2007
FEATURE SET
Primary (1st Level) Safety Features
The bq20z90 supports a wide range of battery and system protection features that can easily be configured. The
primary safety features include:
•
•
•
•
•
•
•
•
Battery cell over/under voltage protection
Battery pack over/under voltage protection
2 independent charge overcurrent protection
3 independent discharge overcurrent protection
Short circuit protection
Over temperature protection
AFE Watchdog
Host Watchdog
Secondary (2nd Level) Safety Features
The secondary safety features of the bq20z90 can be used to indicate more serious faults via the SAFE (pin 10)
pin. This pin can be used to blow an in-line fuse to permanently disable the battery pack from charging or
discharging. The secondary safety features include:
•
•
•
•
•
•
•
•
•
•
•
•
Safety over voltage
Battery cell imbalance
2nd level protection IC input
Safety over current
Safety over temperature
Open thermistor
Charge FET and Zero-Volt Charge FET fault
Discharge FET fault
Fuse blow failure detection
AFE Communication error
AFE Verification error
Internal flash data error
Charge Control Features
The bq20z90 charge control features include:
•
Report the appropriate charging current needed for constant current charging and the appropriate charging
voltage needed for constant voltage charging to a smart charger using SMBus broadcasts.
•
Determine the chemical state of charge of each battery cell using Impedance Track™. Using cell balancing
algorithm, gradually decrease the differences in the cells' state of charge in a fully charged state. This
prevents high cells from overcharging, causing excessive degradation and also increases the usable pack
energy by preventing early charge termination.
•
•
•
•
•
Support Pre-charging/Zero-volt charging
Support Fast charging
Support Pulse charging
Support Charge Inhibit and Charge Suspend modes
Report charging faults and also indicate charging status via charge and discharge alarms.
Gas Gauging
The bq20z90 uses the Impedance Track™ Technology to measure and calculate the available charge in battery
cells. The achievable accuracy is better than 1% error over the lifetime of the battery and there is no full
charge-discharge learning cycle required.
8
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SLUS778–JULY 2007
See Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm application note (SLUA364)
for further details.
LED Display
The bq20z90 can drive a 3-, 4-, or 5- segment LED display for remaining capacity indication. The LED drive
current can be adjusted to 3mA, 4mA and 5mA digitally.
LifeTime Data Logging Features
The bq20z90 offers a lifetime data logging array, where all important measurements are stored for warranty and
analysis purposes. The data monitored include:
•
•
•
•
•
•
•
•
•
•
•
•
•
Lifetime maximum temperature
Lifetime minimum temperature
Lifetime maximum battery cell voltage
Lifetime minimum battery cell voltage
Lifetime maximum battery pack voltage
Lifetime minimum battery pack voltage
Lifetime maximum charge current
Lifetime maximum discharge current
Lifetime maximum charge power
Lifetime maximum discharge power
Lifetime maximum average discharge current
Lifetime maximum average discharge power
Lifetime average temperature
Authentication
The bq20z90 supports authentication by the host using SHA-1.
Power Modes
The bq20z90 supports 3 different power modes to reduce power consumption:
•
•
•
In Normal Mode, the bq20z90 performs measurements, calculations, protection decisions, and data updates
in 1 second intervals. Between these intervals, the bq20z90 is in a reduced power stage.
In Sleep Mode, the bq20z90 performs measurements, calculations, protection decisions, and data updates in
adjustable time intervals. Between these intervals, the bq20z90 is in a reduced power stage.
In Shutdown Mode the bq20z90 is completety disabled.
CONFIGURATION
Oscillator Function
The bq20z90 fully integrates the system and processor oscillators and, therefore, requires no pins or
components for this feature.
System Present Operation
The bq20z90 periodically verifies the PRES pin and detects that the battery is present in the system via a low
state on a PRES input. When this occurs, bq20z90 enters normal operating mode. When the pack is removed
from the system and the PRES input is high, the bq20z90 enters the battery-removed state, disabling the charge,
discharge and ZVCHG FETs. The PRES input is ignored and can be left floating when non-removal mode is set
in the data flash.
BATTERY PARAMETER MEASUREMENTS
The bq20z90 uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement, and a
second delta-sigma ADC for individual cell and battery voltage, and temperature measurement.
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SLUS778–JULY 2007
Charge and Discharge Counting
The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltage
drop across a small-value sense resistor between the SRP and SRN pins. The integrating ADC measures bipolar
signals from -0.25 V to 0.25 V. The bq20z90 detects charge activity when VSR = V(SRP)-V(SRN)is positive and
discharge activity when VSR = V(SRP)-V(SRN) is negative. The bq20z90 continuously integrates the signal over
time, using an internal counter. The fundamental rate of the counter is 0.65 nVh.
Voltage
The bq20z90 updates the individual series cell voltages through the bq29330 at one second intervals. The
bq20z90 configures the bq29330 to connect the selected cell, cell offset, or bq29330 VREF to the CELL pin of
the bq29330, which is required to be connected to VIN of the bq20z90. The internal ADC of the bq20z90
measures the voltage, scales it, and calibrates itself appropriately. This data is also used to calculate the
impedance of the cell for the Impedance Track™ gas-gauging.
Current
The bq20z90 uses the SRP and SRN inputs to measure and calculate the battery charge and discharge current
using a 5 mΩ to 20 mΩ typ. sense resistor.
Wake Function
The bq20z90 can exit sleep mode, if enabled, by the presence of a programmable level of current signal across
SRP and SRN.
Auto Calibration
The bq20z90 provides an auto-calibration feature to cancel the voltage offset error across SRP and SRN for
maximum charge measurement accuracy. The bq20z90 performs auto-calibration when the SMBus lines stay
low continuously for a minimum of a programmable amount of time.
Temperature
The bq20z90 TS1 and TS2 inputs, in conjunction with two identical NTC thermistors (default are Semitec
103AT), measure the battery environmental temperature. The bq20z90 can also be configured to use its internal
temperature sensor.
COMMUNICATIONS
The bq20z90 uses SMBus v1.1 with Master Mode and package error checking (PEC) options per the SBS
specification.
SMBus On and Off State
The bq20z90 detects an SMBus off state when SMBC and SMBD are logic-low for ≥ 2 seconds. Clearing this
state requires either SMBC or SMBD to transition high. Within 1 ms, the communication bus is available.
SBS Commands
Table 1. SBS COMMANDS
SBS Cmd Mode Name
Format
Size in Min
Max
Default Value
Unit
Bytes
Value
Value
0x00
0x01
R/W
R/W
ManufacturerAccess
hex
2
2
0x0000
0
0xffff
—
RemainingCapacityAlarm
unsigned int
65535
300
mAh or
10mWh
0x02
0x03
0x04
0x05
0x06
R/W
R/W
R/W
R
RemainingTimeAlarm
BatteryMode
unsigned int
hex
2
2
2
2
2
0
65535
0xe383
32767
65534
65534
10
—
—
—
—
min
0x0000
AtRate
signed int
unsigned int
unsigned int
-32768
mA or 10mW
AtRateTimeToFull
AtRateTimeToEmpty
0
0
min
min
R
10
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SLUS778–JULY 2007
Table 1. SBS COMMANDS (continued)
SBS Cmd Mode Name
Format
Size in Min
Max
Default Value
Unit
Bytes
Value
Value
0x07
0x08
0x09
0x0a
0x0b
0x0c
0x0d
0x0e
0x0f
R
AtRateOK
unsigned int
unsigned int
unsigned int
signed int
2
2
2
2
2
1
1
1
2
0
65535
65535
65535
32767
32767
100
—
—
—
—
—
—
—
—
—
R
Temperature
0
0.1°K
mV
mA
mA
%
R
Voltage
0
R
Current
-32768
R
AverageCurrent
MaxError
signed int
-32768
R
unsigned int
unsigned int
unsigned int
unsigned int
0
0
0
0
R
RelativeStateOfCharge
AbsoluteStateOfCharge
RemainingCapacity
100
%
R
100+
65535
%
R/W
mAh or
10mWh
0x10
R
FullChargeCapacity
unsigned int
2
0
65535
—
mAh or
10mWh
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
R
RunTimeToEmpty
AverageTimeToEmpty
AverageTimeToFull
ChargingCurrent
ChargingVoltage
BatteryStatus
unsigned int
unsigned int
unsigned int
unsigned int
unsigned int
unsigned int
unsigned int
unsigned int
2
2
2
2
2
2
2
2
0
65534
65534
65534
65534
65534
0xdbff
65535
65535
—
min
min
min
mA
mV
R
0
—
R
0
—
R
0
—
R
0
—
R
0x0000
—
R/W
R/W
CycleCount
0
0
—
DesignCapacity
4400
mAh or
10mWh
0x19
0x1a
0x1b
0x1c
0x20
0x21
0x22
0x23
0x2f
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
DesignVoltage
SpecificationInfo
ManufactureDate
SerialNumber
ManufacturerName
DeviceName
unsigned int
hex
2
0
65535
0xffff
—
14400
0x0031
01-Jan-1980
0x0001
Texas Inst.
bq20z90
LION
—
mV
2
0x0000
unsigned int
hex
2
—
ASCII
2
0x0000
0xffff
—
String
11+1
7+1
4+1
14+1
20+1
2
—
—
—
—
—
0
ASCII
ASCII
ASCII
ASCII
ASCII
mV
String
—
DeviceChemistry
ManufacturerData
Authenticate
String
—
String
—
String
—
—
0x3c
0x3d
0x3e
0x3f
CellVoltage4
unsigned int
unsigned int
unsigned int
unsigned int
65535
65535
65535
65535
—
R
CellVoltage3
2
0
—
mV
R
CellVoltage2
2
0
—
mV
R
CellVoltage1
2
0
—
mV
Table 2. EXTENDED SBS COMMANDS
SBS
Cmd
Mode Name
Format
Size in
Bytes
Min Value
Max Value Default
Value
Unit
0x45
0x46
0x4f
R
AFEData
String
hex
11+1
—
—
—
—
—
—
—
—
—
—
—
ASCII
R/W
R
FETControl
StateOfHealth
SafetyAlert
1
1
2
2
2
2
2
2
0x00
0x1e
100
unsigned int
hex
0
%
0x50
0x51
0x52
0x53
0x54
0x55
R
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0xffff
0xffff
0x9fff
0x9fff
0xf7f7
0xffff
R
SafetyStatus
PFAlert
hex
R
hex
R
PFStatus
hex
R
OperationStatus
ChargingStatus
hex
R
hex
Copyright © 2007, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): bq20z90
bq20z90
www.ti.com
SLUS778–JULY 2007
Table 2. EXTENDED SBS COMMANDS (continued)
SBS
Cmd
Mode Name
Format
Size in
Bytes
Min Value
Max Value Default
Value
Unit
0x57
0x58
0x5a
0x5d
0x60
0x61
0x62
0x63
0x64
0x65
0x66
0x70
0x71
0x77
0x78
0x79
0x7a
0x7b
0x7c
0x7d
0x7e
0x7f
R
ResetData
hex
2
0x0000
0xffff
—
—
---
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
R
WDResetData
unsigned int
unsigned int
unsigned int
hex
2
0
0
0
65535
65535
65535
R
PackVoltage
2
mV
mV
R
AverageVoltage
2
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
UnSealKey
4
0x00000000 0xffffffff
0x00000000 0xffffffff
0x00000000 0xffffffff
0x00000000 0xffffffff
0x00000000 0xffffffff
0x00000000 0xffffffff
0x00000000 0xffffffff
FullAccessKey
hex
4
PFKey
hex
4
AuthenKey3
hex
4
AuthenKey2
hex
4
AuthenKey1
hex
4
AuthenKey0
hex
4
ManufacturerInfo
SenseResistor
String
unsigned int
hex
8+1
2
—
—
ASCII
0
65535
0xffff
—
μΩ
DataFlashSubClassID
DataFlashSubClassPage1
DataFlashSubClassPage2
DataFlashSubClassPage3
DataFlashSubClassPage4
DataFlashSubClassPage5
DataFlashSubClassPage6
DataFlashSubClassPage7
DataFlashSubClassPage8
2
0x0000
—
hex
32
32
32
32
32
32
32
32
hex
—
—
hex
—
—
hex
—
—
hex
—
—
hex
—
—
hex
—
—
hex
—
—
12
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): bq20z90
PACKAGE OPTION ADDENDUM
www.ti.com
3-Dec-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
BQ20Z90DBT-V150
BQ20Z90DBT-V150G4
BQ20Z90DBTR-V150
BQ20Z90DBTR-V150G4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
DBT
DBT
DBT
DBT
30
30
30
30
60
60
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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