BQ25100YFPT [TI]
具有 4.2V 充电电压和可编程预充电功能的独立型单节电池 250mA 线性电池充电器 | YFP | 6 | 0 to 125;型号: | BQ25100YFPT |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有 4.2V 充电电压和可编程预充电功能的独立型单节电池 250mA 线性电池充电器 | YFP | 6 | 0 to 125 电池 |
文件: | 总34页 (文件大小:1411K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
bq2510x 250mA 单节锂离子电池充电器,1mA 终止电流、75nA 电池泄漏
电流
1 特性
bq2510x 具有一个可为电池充电的电源输出。 如果在
10 小时的安全定时器期间内平均系统负载无法让电池
充满电,则可以使系统负载与电池并联。
1
•
充电
–
–
–
–
–
–
–
1% 充电电压准确度
10% 充电电流准确度
电池充电经历以下三个阶段:调节,恒定电流和恒定电
压。 在所有充电阶段,内部控制环路都会监控 IC 结
温,当其超过内部温度阈值时,它会减少充电电流。
支持充电电流超低(10mA 至 250mA)的应用
支持最低 1mA 充电终止电流
超低电池输出泄漏电流:75nA(最大值)
可调节的终止和预充电阈值
充电器功率级和充电电流感测功能均完全集成。 该充
电器具有高精度电流和电压调节环路以及充电终止功
能。 预充电电流和终止电流阈值可通过 bq2510x 上的
一个外部电阻进行编程。 快速充电电流值也可通过一
个外部电阻进行编程。
高电压化学支持:bq25100H/01H 为
4.35V,bq25100A 为 4.30V
•
保护
–
–
–
–
–
30V 额定输入电压;具有 6.5V 输入过压保护
器件信息(1)
输入电压动态电源管理
125°C 热调节;150°C 热关断保护
OUT 短路保护和 ISET 短路检测
器件型号
bq25100
封装
DSBGA (6)
封装尺寸(标称值)
1.60mm × 0.90mm
1.60mm × 0.90mm
1.60mm × 0.90mm
1.60mm × 0.90mm
1.60mm × 0.90mm
1.60mm × 0.90mm
通过电池负温度系数 (NTC) 在 JEITA 范围内运
行 – 冷故障时的快速充电电流折半,热故障时
的电压为 4.06V (bq25100/01) 或 4.2V
(bq25100H/01H)
bq25101
DSBGA (6)
DSBGA (6)
DSBGA (6)
DSBGA (6)
DSBGA (6)
bq25100A
bq25100H
bq25101H
bq25100L(2)
–
固定 10 小时安全定时器
•
系统
(1) 如需了解所有可用封装,请见数据表末尾的可订购产品附录。
–
针对电池组缺失情况的自动终止和定时器禁用模
式 (TTDM)
(2) 产品预览。 欲了解器件的详细信息,请联系当地的德州仪器
(TI) 代表。
–
采用小型 1.60mm × 0.90mm 芯片尺寸球状引
脚栅格阵列 (DSBGA) 封装
SYSTEM
USB Port or
Adapter
VBUS
IN
OUT
TS
D+
D-
1ÛF
1ÛF
VSS
GND
PACK+
2 应用
TEMP
ISET
HOST
•
•
•
•
健身配件
1.35k
PRETERM
PACK-
智能手表
Bluetooth® 耳机
6k
bq25100
CE
低功耗手持器件
3 说明
bq2510x 系列器件是面向空间受限类便携式应用的高
度集成锂离子和锂聚合物线性充电器。 具有输入过压
保护的高输入电压范围支持低成本、未稳压的适配器。
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
English Data Sheet: SLUSBV8
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
www.ti.com.cn
目录
8.4 Device Functional Modes........................................ 18
Application and Implementation ........................ 22
9.1 Application Information............................................ 22
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings .................................... 4
7.2 Handling Ratings....................................................... 4
7.3 Recommended Operating Conditions ..................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics.......................................... 5
7.6 Typical Characteristics.............................................. 8
Detailed Description ............................................ 12
8.1 Overview ................................................................. 12
8.2 Functional Block Diagram ....................................... 14
8.3 Feature Description................................................. 15
9
9.2 Typical Application - Charger Application Design
Example ................................................................... 22
10 Power Supply Recommendations ..................... 24
10.1 Leakage Current Effects on Battery Capacity....... 24
11 Layout................................................................... 24
11.1 Layout Guidelines ................................................. 24
11.2 Layout Example .................................................... 25
11.3 Thermal Package.................................................. 25
12 器件和文档支持 ..................................................... 26
12.1 器件支持 ............................................................... 26
12.2 相关链接................................................................ 26
12.3 商标....................................................................... 26
12.4 静电放电警告......................................................... 26
12.5 术语表 ................................................................... 26
13 机械、封装和可订购信息....................................... 26
8
4 修订历史记录
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (October 2014) to Revision C
Page
•
•
•
已更改 数据表标题.................................................................................................................................................................. 1
已删除 器件信息表中 bq25101H 的产品预览注释 .................................................................................................................. 1
Deleted product preview note from bq25101H in Device Comparison Table ....................................................................... 3
Changes from Revision A (September 2014) to Revision B
Page
•
•
已删除 器件信息表中 bq25101 和 bq25100H 的产品预览注释............................................................................................... 1
Deleted product preview note from bq25101 and bq25100H in Device Comparison Table ................................................. 3
Changes from Original (August 2014) to Revision A
Page
•
已发布为量产数据................................................................................................................................................................... 1
2
Copyright © 2014, Texas Instruments Incorporated
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com.cn
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
5 Device Comparison Table
PART NUMBER
bq25100
VO(REG)
4.20 V
4.20 V
4.30 V
4.35 V
4.35 V
4.06 V
VOVP
6.5 V
6.5 V
6.5 V
6.5 V
6.5 V
6.5V
PreTerm /CHG
PreTerm
CHG
TS
TS (JEITA)
TS (JEITA)
TS
bq25101
bq25100A
bq25100H
bq25101H
bq25100L(1)
PreTerm
PreTerm
CHG
TS (JEITA)
TS (JEITA)
TS
PreTerm
(1) Product preview. Contact the local TI representative for device details.
6 Pin Configuration and Functions
SPACING
6-Pin DSBGA
YFP Package
(Top View)
6-Pin DSBGA
YFP Package
(Top View)
1
2
1
2
A
B
C
OUT
TS
IN
A
B
C
OUT
TS
IN
ISET
VSS
ISET
VSS
PRE-
TERM
CHG
bq25100/100A/100H/100L
bq25101/101H
Pin Functions
PIN
I/O
DESCRIPTION
NAME
CHG
NUMBER
C1(1)
Low (FET on) indicates charging and open drain (FET off) indicates no charging or the first charge
cycle complete.
Input power, connected to external DC supply (AC adapter or USB port). Expected range of bypass
IN
A2
B2
I
I
capacitors 1 μF to 10 μF, connect from IN to VSS
.
Programs the fast-charge current setting. External resistor from ISET to VSS defines fast charge
current value. Recommended range is 13.5 kΩ (10 mA) to 0.54 kΩ (250 mA).
ISET
Battery Connection. System Load may be connected. Expected range of bypass capacitors 1 μF to
10 μF.
OUT
A1
O
I
Programs the current termination threshold ( 1% to 50% of Iout, 1mA minimum). The pre-charge
current is twice the termination current level.
PRE-TERM
C1(1)
Expected range of programming resistor is 600 Ω to 30 kΩ (6k: Ichg/10 for term; Ichg/5 for
precharge)
Temperature sense pin connected to 10k at 25°C NTC thermistor, in the battery pack. Floating TS
pin or pulling high puts part in TTDM “Charger” mode and disables TS monitoring, Timers and
Termination. Pulling pin low disables the IC. If NTC sensing is not needed, connect this pin to VSS
through an external 10-kΩ resistor. A 250-kΩ resistor from TS to ground will prevent IC entering
TTDM mode when battery with thermistor is removed.
TS
B1
C2
I
VSS
–
Ground pin
(1) Spins have different pin definitions
Copyright © 2014, Texas Instruments Incorporated
3
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
MAX
UNIT
V
IN (with respect to VSS)
30
7
OUT (with respect to VSS)
V
Input voltage
PRE-TERM, ISET, TS, CHG
(with respect to VSS)
–0.3
7
V
Input current
IN
300
300
15
mA
mA
mA
°C
Output current (continuous) OUT
Output sink current
CHG
TJ
Junction temperature
–40
150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
7.2 Handling Ratings
MIN
MAX
UNIT
ESD
Electrostatic discharge
(IEC61000-4-2)(1)
IN, OUT, TS
1 µF between IN and GND,
1 µF between TS and GND,
2 µF between OUT and GND,
x5R Ceramic or equivalent
8
kV
contact
15 Air
TSTG
Storage temperature
–65
150
°C
(1) The test was performed on IC pins that may potentially be exposed to the customer at the product level. The bq2510x IC requires a
minimum of the listed capacitance, external to the IC, to pass the ESD test.
(1)
7.3 Recommended Operating Conditions
MIN
3.5
NOM
28
UNIT
V
IN voltage range
VIN
IN operating voltage range, Restricted by VDPM and VOVP
Input current, IN pin
4.45
6.45
250
250
125
30
V
IIN
mA
mA
°C
IOUT
Current, OUT pin
TJ
Junction temperature
0
0.6
RPRE-TERM
RISET
RTS
Programs precharge and termination current thresholds
Fast-charge current programming resistor
10k NTC thermistor range without entering BAT_EN or TTDM
kΩ
kΩ
kΩ
0.54
1.66
13.5
258
(1) Operation with VIN less than 4.5V or in drop-out may result in reduced performance.
7.4 Thermal Information
bq25100
THERMAL METRIC(1)
UNIT
YFP (6 PINS)
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
132.9
1.3
RθJCtop
RθJB
21.8
5.6
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
21.8
n/a
RθJCbot
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Copyright © 2014, Texas Instruments Incorporated
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com.cn
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
7.5 Electrical Characteristics
Over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
INPUT
UVLO
Undervoltage lock-out exit
VIN: 0 V → 4 V
VIN: 4 V→0 V;
3.15
3.3
3.45
130
V
VHYS_UVLO
Hysteresis on VUVLO_RISE falling
250
mV
VUVLO_FALL = VUVLO_RISE – VHYS-UVLO
Input power good detection
threshold is VOUT + VIN-DT
Input power good if VIN > VOUT + VIN-DT;
VOUT = 3.6 V; VIN: 3.5 V → 4 V
VIN-DT
15
60
31
29
mV
mV
ms
VHYS-INDT
tDGL(PG_PWR)
tDGL(PG_NO-PWR)
VOVP
Hysteresis on VIN-DT falling
VOUT = 3.6 V; VIN: 4 V → 3.5 V
Time measured from VIN: 0 V → 5 V 1-μs rise-
time to charge enables; VOUT = 3.6 V
Deglitch time on exiting sleep
Deglitch time on VHYS-INDT power Time measured from VIN: 5 V → 3.2 V 1-μs fall-
down. Same as entering sleep.
29
ms
V
time to charge disables; VOUT = 3.6 V
Input over-voltage protection
threshold
VIN: 5 V → 12 V
6.52
4.25
6.67
6.82
tDGL(OVP-SET)
VHYS-OVP
Input over-voltage blanking time
Hysteresis on OVP
VIN: 5 V → 12 V
VIN: 11 V → 5 V
113
110
μs
mV
Time measured from VIN: 12 V → 5 V 1-μs fall-
time to charge enables
tDGL(OVP-REC)
VIN-DPM
Deglitch time exiting OVP
450
μs
Low input voltage protection.
Restricts lout at VIN-DPM
Limit input source current to 50 mA;
VOUT = 3.5 V; RISET = 1.35 kΩ
4.31
4.37
450
V
ISET SHORT CIRCUIT TEST
Highest resistor value considered RISET: 540 Ω → 250 Ω, Iout latches off;
a fault (short). Cycle power to reset
RISET_SHORT
tDGL_SHORT
IOUT_CL
420
1
Ω
Deglitch time transition from ISET Clear fault by disconnecting IN or cycling (high /
short to Iout disable
ms
mA
low) TS/BAT_EN
Maximum OUT current limit
regulation (Clamp)
VIN = 5 V; VOUT = 3.6 V; RISET: 540 Ω → 250 Ω;
IOUT latches off after tDGL-SHORT
550
600
650
BATTERY SHORT PROTECTION
OUT pin short-circuit detection
threshold/ precharge threshold
VOUT(SC)
VOUT:3 V → 0.5 V; No deglitch
0.75
0.8
77
11
0.85
V
Recovery ≥ VOUT(SC) + VOUT(SC-HYS); Rising; No
deglitch
VOUT(SC-HYS)
IOUT(SC)
OUT pin Short hysteresis
mV
mA
Source current to OUT pin during
short-circuit detection
9
13
QUIESCENT CURRENT
VIN = 0 V; 0°C to 125°C
VIN = 0 V; 0°C to 85°C
75
50
IOUT(PDWN)
Battery current into OUT pin
nA
OUT pin current, charging
terminated
IOUT(DONE)
IIN(STDBY)
VIN = 6 V; VOUT > VOUT(REG)
6
μA
μA
Standby current into IN pin
TS = GND; VIN ≤ 6 V
125
TS = open, VIN = 6 V;
ICC
Active supply current, IN pin
TTDM – no load on OUT pin; VOUT > VOUT(REG)
;
0.75
1
mA
IC enabled
BATTERY CHARGER FAST-CHARGE
TJ = 0°C to 125°C; IOUT = 0 mA to 250 mA;
VIN = 5.0 V; VTS-45°C≤ VTS ≤ VTS-0°C (bq25100/101)
4.16
4.26
4.2
4.3
4.23
4.33
TJ = 0°C to 125°C; IOUT = 0 mA to 250 mA;
VIN = 5.0 V; VTS-45°C≤ VTS ≤ VTS-0°C (bq25100A)
VOUT(REG)
Output voltage
V
TJ = 0°C to 125°C; IOUT = 0 mA to 250 mA;
VIN = 5.0 V; VTS-45°C≤ VTS ≤ VTS-0°C
(bq25100H/101H)
4.31
4.35
4.38
TJ = -5°C to 55°C; IOUT = 10mA to 75 mA;
VIN = 5.0 V; VTS-45°C≤ VTS ≤ VTS-0°C (bq25100A)
4.275
4.02
4.16
10
4.3
4.06
4.2
4.325
4.1
VIN = 5.0 V; IOUT =10 mA to 250 mA;
VTS-60°C≤ VTS ≤ VTS-45°C (bq25100/101)
VO_HT(REG)
Battery hot regulation voltage
V
VIN = 5.0 V; IOUT =10 mA to 250 mA;
4.24
250
VTS-60°C≤ VTS ≤ VTS-45°C (bq25100H/101H)
Programmed output “fast charge” VOUT(REG) > VOUT > VLOWV; VIN = 5 V;
current range RISET = 0.54 kΩ to 13.5 kΩ
IOUT(RANGE)
mA
Copyright © 2014, Texas Instruments Incorporated
5
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
www.ti.com.cn
Electrical Characteristics (continued)
Over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Adjust VIN down until IOUT = 0.2 A; VOUT = 4.15 V;
RISET = 680 Ω; TJ ≤ 100°C
VDO(IN-OUT)
IOUT
Drop-Out, VIN – VOUT
Output “fast charge” formula
220
400
mV
A
VOUT(REG) > VOUT > VLOWV; VIN = 5 V
RISET = KISET /IOUT; 20 < IOUT < 250 mA
RISET = KISET /IOUT; 5 < IOUT < 20 mA
KISET/RISET
135
129
125
145
145
KISET
Fast charge current factor
AΩ
135
PRECHARGE – SET BY PRETERM PIN
Pre-charge to fast-charge
transition threshold
VLOWV
2.4
2.5
57
32
2.6
V
Deglitch time on pre-charge to
tDGL1(LOWV)
μs
ms
fast-charge transition
Deglitch time on fast-charge to
tDGL2(LOWV)
pre-charge transition
IPRE-TERM
Refer to the Termination Section
Pre-charge current, default
setting
VOUT < VLOWV; RISET = 2.7 kΩ; RPRE-TERM= High Z
or for BQ25101/101H
%IOUT-
18
20
22
320
340
11
CC
%
PRECHG
Pre-charge current formula
% Pre-charge Factor
RPRE-TERM = KPRE-CHG (Ω/%) × %PRE-CHG (%)
RPRE-TERM/KPRE-CHG%
VOUT < VLOWV; VIN = 5 V;
RPRE-TERM = 6 kΩ to 30 kΩ;
RISET = 1.8 kΩ;
280
300
300
10
Ω/%
Ω/%
RPRE-TERM = KPRE-CHG × %IPRE-CHG
,
where %IPRE-CHG is 20 to 100%
KPRE-CHG
VOUT < VLOWV; VIN = 5 V;
RPRE-TERM = 3 kΩ to 6 kΩ;
RISET = 1.8 kΩ;
265
RPRE-TERM = KPRE-CHG × %IPRE-CHG
where %IPRE-CHG is 10% to 20%
,
TERMINATION – SET BY PRE-TERM PIN
Termination threshold current,
VOUT > VRCH; RISET = 2.7 kΩ; RPRE-TERM = High Z
or for BQ25101/101H
%IOUT-
9
default setting
CC
%
TERM
Termination current threshold
formula
RPRE-TERM = KTERM (Ω/%) × %TERM (%)
RPRE-TERM/ KTERM
VOUT > VRCH; VIN = 5 V;
RPRE-TERM = 6 kΩ to 30 kΩ;
RISET = 1.8 kΩ, RPRE-TERM=KTERM × %ITERM
where %ITERM is 10 to 50%
575
600
620
680
25
640
685
1001
27
,
VOUT > VRCH; VIN = 5 V;
RPRE-TERM = 3 kΩ to 6 kΩ ;
RISET = 1.8 kΩ, RPRE-TERM= KTERM × %ITERM
where %ITERM is 5 to 10%
KTERM
% Term factor
555
352
Ω/%
,
VOUT > VRCH; VIN = 5 V;
RPRE-TERM = 750 Ω to 3 kΩ;
RISET = 1.8 kΩ, RPRE-TERM= KTERM × %ITERM
where %ITERM is 1.25% to 5%
,
Current for programming the
term. and pre-chg with resistor,
ITerm-Start is the initial PRE-TERM
current
IPRE-TERM
RPRE-TERM = 6 kΩ; VOUT = 4.15 V
23
1
μA
ITERM
Termination current range
Termination current formula
Minimum absolute termination current
mA
%
%TERM
RTERM/ KTERM
29
Deglitch time, termination
detected
tDGL(TERM)
ms
RECHARGE OR REFRESH
VIN = 5 V; VTS = 0.5 V;
Recharge detection threshold –
normal temp
VOUT: 4.25 V → VRCH (bq25100)
VOUT: 4.35 V → VRCH (bq25100A)
;
VO(REG) VO(REG)–0.0 VO(REG)–0.0
V
;
–0.125
95
75
VOUT: 4.40 V → VRCH (bq25100H)
VRCH
VIN = 5 V; VTS = 0.2 V;
VOUT: 4.15 V → VRCH (bq25100)
VOUT: 4.25 V → VRCH (bq25100H)
Recharge detection threshold –
hot temp
VO_HT(REG)
–0.130
VO_HT(REG)
–0.105
VO_HT(REG)
–0.080
;
V
VIN = 5 V; VTS = 0.5 V;
VOUT: 4.25 V → 3.5V in 1 μs;
tDGL(RCH) is time to ISET ramp
Deglitch time, recharge threshold
detected
tDGL1(RCH)
29
ms
6
Copyright © 2014, Texas Instruments Incorporated
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com.cn
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
Electrical Characteristics (continued)
Over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
VIN = 5 V; VTS = 0.5 V;
VOUT = 3.5 V inserted;
tDGL(RCH) is time to ISET ramp
Deglitch time, recharge threshold
detected in OUT-Detect Mode
tDGL2(RCH)
29
ms
BATTERY DETECT ROUTINE – (NOTE: In Hot mode VO(REG) becomes VO_HT(REG)
)
bq25100/101/bq25100H/101H;
VO(REG)
-
VO(REG)
-
VO(REG)
-
VIN = 5 V; VTS = 0.5 V, Battery absent
0.450
0.400
0.350
VOUT reduced regulation during
battery detect
VREG-BD
V
bq25100A;
VO(REG)
-
VO(REG)
-
VO(REG)
-
VIN = 5 V; VTS = 0.5 V; Battery absent
0.550
0.500
0.450
IBD-SINK
Sink current during VREG-BD
VIN = 5 V; VTS = 0.5 V; Battery absent
VIN = 5 V; VTS = 0.5 V; Battery absent
2
mA
ms
Regulation time at VREG or VREG-
tDGL(HI/LOW REG)
25
BD
VO(REG)
0.150
-
VO(REG)
0.100
-
VO(REG)-
0.050
VBD-HI
VBD-LO
High battery detection threshold
Low battery detection threshold
VIN = 5 V; VTS = 0.5 V; Battery absent
VIN = 5 V; VTS = 0.5 V; Battery absent
V
V
VREG-BD
+0.05
VREG-BD
+0.1
VREG-BD
+0.15
BATTERY CHARGING TIMERS AND FAULT TIMERS
Restarts when entering pre-charge;
Always enabled when in pre-charge.
tPRECHG
tMAXCH
Pre-charge safety timer value
Charge safety timer value
1700
1940
2250
s
s
Clears fault or resets at UVLO, TS disable, OUT
Short, exiting LOWV and Refresh
34000
38800
45000
BATTERY-PACK NTC MONITOR (see Note 1); TS pin: 10k NTC
INTC-10k
NTC bias current
VTS = 0.3 V
VTS = 0 V
48.5
27
50.5
30
52.5
33
μA
μA
10k NTC bias current when
charging is disabled
INTC-DIS-10k
INTC is reduced prior to entering
TTDM to keep cold thermistor
from entering TTDM
INTC-FLDBK-10k
VTS: Set to 1.525 V
4
5
6.5
μA
Termination and timer disable
mode Threshold – Enter
VTTDM(TS)
VTS: 0.5 V → 1.7 V; Timer held in reset
1550
1600
1650
mV
VHYS-TTDM(TS)
VCLAMP(TS)
Hysteresis exiting TTDM
VTS: 1.7 V → 0.5 V; Timer enabled
100
mV
mV
TS maximum voltage clamp
VTS = Open (float)
1900
1950
2000
Deglitch exit TTDM between
states
57
8
ms
tDGL(TTDM)
Deglitch enter TTDM between
states
μs
TS voltage where INTC is reduce INTC adjustment (90 to 10%; 45 to 6.6 uA) takes
VTS_I-FLDBK
to keep thermistor from entering
TTDM
place near this spec threshold;
VTS: 1.425 V → 1.525 V
1475
mV
CTS
Optional capacitance – ESD
0.22
μF
Low temp charging to pending;
VTS: 1 V → 1.5 V
VTS-0°C
Low temperature CHG pending
1230
775
1255
1280
830
mV
At 0°C;
VHYS-0°C
VTS-10°C
VHYS-10°C
Hysteresis
Charge pending to low temp charging;
VTS: 1.5 V → 1 V
100
800
55
mV
mV
mV
Normal charging to low temp charging;
VTS: 0.5 V → 1 V
Low temperature, half charge
Hysteresis
At 10°C;
Low temp charging to normal CHG;
VTS: 1 V → 0.5 V
At 4.1V (bq25100/101) or 4.2V (bq25100H/101H);
Normal charging to high temp CHG;
VTS: 0.5 V → 0.2 V
VTS-45°C
VHYS-45°C
VTS-60°C
VHYS-60°C
High temperature
Hysteresis
253
160
268
20
283
180
mV
mV
mV
mV
At 45°C;
High temp charging to normal CHG;
VTS: 0.2 V → 0.5 V
bq25100/01/100H/101H/100L;
High temp charge to pending;
VTS: 0.2 V → 0.1 V
High temperature disable
Hysteresis
170
20
At 60°C (bq25100/01/100H/101H/100L);
Charge pending to high temp CHG;
VTS: 0.1 V → 0.2 V
Copyright © 2014, Texas Instruments Incorporated
7
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
www.ti.com.cn
Electrical Characteristics (continued)
Over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Normal to cold operation; VTS: 0.6 V → 1 V
Cold to normal operation; VTS: 1 V → 0.6 V
50
tDGL(TS_10C)
Deglitch for TS thresholds: 10C
ms
12
Deglitch for TS thresholds:
0/45/60C
tDGL(TS)
Battery charging
30
92
12
ms
Charge enable threshold, (10k
NTC)
VTS-EN-10k
VTS-DIS_HYS-10k
VTS: 0 V → 0.175 V
VTS: 0.125 V → 0 V
84
100
mV
mV
HYS below VTS-EN-10k to disable,
(10k NTC)
THERMAL REGULATION
TJ(REG)
Temperature regulation limit
125
155
20
°C
°C
°C
TJ(OFF)
Thermal shutdown temperature
Thermal shutdown hysteresis
TJ(OFF-HYS)
LOGIC LEVELS ON /CHG
VOL
Output low voltage
Leakage current into IC
ISINK = 5 mA
V CHG = 5 V
0.4
1
V
ILEAK
μA
7.6 Typical Characteristics
Setup: Typical Applications Schematic; VIN = 5 V, VBAT = 3.6 V (unless otherwise noted)
VIN
VIN 2 V/div
2 V/div
VOUT 2 V/div
VOUT
2 V/div
IOUT 60 mA/div
IOUT 60 mA/div
VISET 1 V/div
t-time – 10 ms/div
t-time – 20 ms/div
No Battery, No Load
Hot Plug
图 3. Power Up Timing
图 4. OVP 7-V Adaptor
8
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Typical Characteristics (接下页)
Setup: Typical Applications Schematic; VIN = 5 V, VBAT = 3.6 V (unless otherwise noted)
VIN 2 V/div
VIN 2 V/div
VTS 500 mV/div
VOUT 2 V/div
IOUT 60 mA/div
IOUT 60 mA/div
VISET 1 V/div
VISET 1 V/div
t-time – 50 ms/div
t-time – 50 ms/div
VIN 0 V -5 V-7 V-5 V
图 5. OVP from Normal Power-Up Operation
图 6. TS Enable and Disable
VIN 1 V/div
VIN 5 V/div
IOUT 60 mA/div
VOUT 2 V/div
VOUT 2 V/div
IOUT 100 mA/div
VISET 1 V/div
VISET 1 V/div
t-time – 5 ms/div
t-time – 20 ms/div
VIN Regulated
图 7. DPM-Adaptor Current Limits
图 8. Hot Plug Source
with No Battery - Battery Detection
VIN 5 V/div
VIN 5 V/div
IOUT 100 mA/div
VOUT 2 V/div
VOUT 2 V/div
VISET 1 V/div
VISET 1 V/div
IOUT 100 mA/div
t-time – 20 ms/div
t-time – 200 μs/div
No Load
图 9. Battery Removal
图 10.
ISET Shorted During Normal Operation
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Typical Characteristics (接下页)
Setup: Typical Applications Schematic; VIN = 5 V, VBAT = 3.6 V (unless otherwise noted)
VIN 5 V/div
VIN 5 V/div
VOUT 5 V/div
VOUT 5 V/div
IOUT 100 mA/div
VISET 1 V/div
IOUT 100 mA/div
VISET 1 V/div
t-time – 10 ms/div
t-time – 10 ms/div
20-Ω resistor at OUT, No input, VBAT = 3.7 V
20-Ω resistor at OUT, No input, VBAT = 3.7 V
图 12. Battery Removal
图 11. Battery Plug In
VIN 2 V/div
VIN 2 V/div
VISET 2 V/div
VOUT 2 V/div
ILOAD 70 mA/div
IOUT 400 mA/div
VISET 1 V/div
IOUT 70 mA/div
t-time – 10 ms/div
t-time – 10 ms/div
90-mA Load, 120-mA ICHG
图 13. ISET Short Prior to Power Up
图 14. Power Up
4.21
4.202
4.201
4.2
VREG = 0qC
4.208
4.206
4.204
4.202
4.2
VREG = 25qC
VREG = 85qC
VREG = 125qC
4.199
4.198
4.197
4.196
4.195
4.194
VREG = 0qC
VREG = 25qC
VREG = 85qC
VREG = 125qC
4.198
4.196
4.194
4.192
4.19
1 mA 10 mA 50 mA 100 mA 150 mA 200 mA 250 mA
Load Current (mA)
4.5 V
5 V
5.5 V
6 V
6.5 V
D001
D002
Input Voltage (V)
图 15. Load Regulation Over Temperature
图 16. Line Regulation Over Temperature
10
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ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
Typical Characteristics (接下页)
Setup: Typical Applications Schematic; VIN = 5 V, VBAT = 3.6 V (unless otherwise noted)
80
6.4
5.6
4.8
4
112
IOUT (mA)
VOUT (V)
70
111
60
110
109
108
107
106
50
40
30
20
10
0
3.2
2.4
1.6
0.8
0
IO = 0qC
IO = 25qC
IO = 85qC
IO = 125qC
2.5 V
3 V
3.5 V
4 V
4.1 V
D004
D003
Output Voltage (V)
bq25100 charge cycle, ICHG = 75 mA, VBAT_REG = 4.2 V
图 17. Current Regulation Over Temperature
图 18. Battery Voltage vs Charge Current
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bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
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8 Detailed Description
8.1 Overview
The bq2510x is a highly integrated family of single cell Li-Ion and Li-Pol chargers. The charger can be used to
charge a battery, power a system or both. The charger has three phases of charging: pre-charge to recover a
fully discharged battery, fast-charge constant current to supply the charge safely and voltage regulation to safely
reach full capacity. The charger is very flexible, allowing programming of the fast-charge current and Pre-
charge/Termination Current. This charger is designed to work with a USB connection (100-mA limit) or Adaptor
(DC output). The charger also checks to see if a battery is present.
The charger also comes with
a
full set of safety features: JEITA Temperature Standard
(bq25100/01/100H/101H), Over-Voltage Protection, DPM-IN, Safety Timers, and ISET short protection. All of
these features and more are described in detail below.
The charger is designed for a single power path from the input to the output to charge a single cell Li-Ion or
Li-Pol battery pack. Upon application of a 5-V DC power source the ISET and OUT short checks are performed
to assure a proper charge cycle.
If the battery voltage is below the LOWV threshold, the battery is considered discharged and a preconditioning
cycle begins. The amount of precharge current can be programmed using the PRE-TERM pin which programs a
percent of fast charge current (10 to 100%) as the precharge current. This feature is useful when the system load
is connected across the battery “stealing” the battery current. The precharge current can be set higher to account
for the system loading while allowing the battery to be properly conditioned. The PRE-TERM pin is a dual
function pin which sets the precharge current level and the termination threshold level. The termination "current
threshold" is always half of the precharge programmed current level.
Once the battery voltage has charged to the VLOWV threshold, fast charge is initiated and the fast charge
current is applied. The fast charge constant current is programmed using the ISET pin. The constant current
provides the bulk of the charge. Power dissipation in the IC is greatest in fast charge with a lower battery voltage.
If the IC reaches 125°C, the IC enters thermal regulation, slows the timer clock by half, and reduces the charge
current as needed to keep the temperature from rising any further. 图 19 shows the charging profile with thermal
regulation. Typically under normal operating conditions, the IC’s junction temperature is less than 125°C and
thermal regulation is not entered.
Once the cell has charged to the regulation voltage the voltage loop takes control and holds the battery at the
regulation voltage until the current tapers to the termination threshold. The termination can be disabled if desired.
Further details are described in the Operating Modes section.
12
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bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
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ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
Overview (接下页)
Thermal
Regulation
Phase
Current
Regulation
Phase
Voltage Regulation and
Charge Termination
Phase
Pre-
Conditioning
Phase
DONE
V
O(REG)
I
O(OUT)
Battery Current,
I
FAST-CHARGE
CURRENT
(OUT)
Battery
Voltage,
V
(OUT)
Charge
Complete
Status,
Charger
Off
PRE-CHARGE
CURRENT AND
TERMINATION
THRESHOLD
V
O(LOWV)
I
(TERM)
I
O(PRECHG)
T
(THREG)
0A
Temperature, Tj
T
DONE
(CHG)
T
(PRECHG)
图 19. Charging Profile With Thermal Regulation
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bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
www.ti.com.cn
8.2 Functional Block Diagram
Internal Charge
Current Sense
w/ Multiple Outputs
IN
OUT
+
-
Input
Power
80 mV
Detect
IN
OUT
_
+
+
_
+
_
OUT
IN-DPMREF
OUTREGREF
TJ
Charge
Pump
_
+
FAST CHARGE
PRE-CHARGE
1.5V
125ÛCREF
ISET
IN
_
+
PRE-CHG Reference
_
+
22mA Startup Current
Limit
Internal Current
Sensing Resistor
Term Reference
TJ
+
_
_
+
150ÛCREF
Thermal Shutdown
Charge
Pump
ꢀꢁPA
PRE-TERM
IN
_
+
OVPREF
+
_
OUT
+
_
VTERM_EN
CHARGE
CONTROL
VCOOL-10ÛC
_
+
_
+
VWARM-45ÛC
VCOLD-0ÛC
_
+
_
+
VHOT-60ÛC
LO=LDO MODE
TS
VLDO
+
_
+
_
HI=CHIP DISABLE
VDISABLE
Cold Temperature Sink
Current
Disable Sink
Current = 20PA
= 45PA
VCLAMP=1.4V
+
_
+
_
5PA
45PA
14
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ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
8.3 Feature Description
8.3.1 Overvoltage-Protection (OVP) – Continuously Monitored
If the input source applies an overvoltage, the pass FET, if previously on, turns off after a deglitch, tBLK(OVP). The
timer stops counting. Once the overvoltage returns to a normal voltage, the timer and charge continues.
8.3.2 CHG Pin Indication (bq25101, bq25101H)
The charge pin has an internal open drain FET which is on (pulls down to VSS) during the first charge only
(independent of TTDM) and is turned off once the battery reaches voltage regulation and the charge current
tapers to the termination threshold set by the PRE-TERM resistor. The bq25101/01H terminates at 10% of the
programmed charge current. The charge pin is high impedance in sleep mode and OVP and returns to its
previous state once the condition is removed. Cycling input power, removing and replacing the battery, pulling
the TS pin low and releasing or entering pre-charge mode causes the CHG pin to go reset (go low if power is
good and a discharged battery is attached) and is considered the start of a first charge.
8.3.3 CHG Pin LED Pull-up Source (bq25101, bq25101H)
For host monitoring, a pull-up resistor is used between the CHG pin and the VCC of the host and for a visual
indication a resistor in series with an LED is connected between the /CHG pin and a power source. If the CHG
source is capable of exceeding 7 V, a 6.2-V zener should be used to clamp the voltage. If the source is the OUT
pin, note that as the battery changes voltage, and the brightness of the LEDs vary.
8.3.4 IN-DPM (VIN-DPM or IN-DPM)
The IN-DPM feature is used to detect an input source voltage that is folding back (voltage dropping), reaching its
current limit due to excessive load. When the input voltage drops to the VIN-DPM threshold the internal pass FET
starts to reduce the current until there is no further drop in voltage at the input. This would prevent a source with
voltage less than VIN-DPM to power the out pin. This is an added safety feature that helps protect the source from
excessive loads. This feature is not applicable for bq25100A.
8.3.5 OUT
The Charger’s OUT pin provides current to the battery and to the system, if present. This IC can be used to
charge the battery plus power the system, charge just the battery or just power the system (TTDM) assuming the
loads do not exceed the available current. The OUT pin is a current limited source and is inherently protected
against shorts. If the system load ever exceeds the output programmed current threshold, the output will be
discharged unless there is sufficient capacitance or a charged battery present to supplement the excessive load.
8.3.6 ISET
An external resistor is used to Program the Output Current (10 to 250 mA) and can be used as a current monitor.
RISET = KISET ÷ IOUT
(1)
Where:
IOUT is the desired fast charge current;
KISET is a gain factor found in the electrical specification
For greater accuracy at lower currents, part of the sense FET is disabled to give better resolution. Going from
higher currents to low currents, there is hysteresis and the transition occurs around 50 mA.
The ISET resistor is short protected and will detect a resistance lower than ≉420 Ω. The detection requires at
least 50 mA of output current. If a “short” is detected, then the IC will latch off and can be reset by cycling the
power or cycling TS pin. The OUT current is internally clamped to a maximum current of 600 mA typical and is
independent of the ISET short detection circuitry.
For charge current that is below 50 mA, an extra RC circuit is recommended on ISET to acheive more stable
current signal. More detail is available in 9.1 Application Information.
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Feature Description (接下页)
60C 45C
10C
Programmed VBAT_REG
0C
No Operation
During Cold Fault
Reduced VBAT_REG
Programmed ICHG
(100%)
50%
Cold Fault
0
0.2
0.4
0.6
0.8
1.0
1.2
VCOLD
1.4
1.6
1.8
Termination
Disable
VHOT VWARM
VCOOL
TS Voltage-V
图 20. Operation Over TS Bias Voltage - bq25100, bq25100H, bq25101, bq25101H
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ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
Feature Description (接下页)
45C
10C
Programmed VBAT_REG
0C
No Operation
During Cold Fault
Hot Fault
Charge Disable
Programmed ICHG
(100%)
50%
Cold Fault
0
0.2
0.4
0.6
0.8
1.0
1.2
VCOLD
1.4
1.6
1.8
Termination
Disable
VHOT VWARM
VCOOL
TS Voltage-V
图 21. Operation Over TS Bias Voltage – bq25100A
8.3.7 PRE_TERM – Pre-Charge and Termination Programmable Threshold
Pre-Term is used to program both the pre-charge current and the termination current threshold. The pre-charge
current level is a factor of two higher than the termination current level. The termination can be set between 5
and 50% (recommended range) of the programmed output current level set by ISET. If left floating the
termination and pre-charge are set internally at 10/20% respectively. The RPRE-TERM is ranged from 600 Ω to 30
kΩ and the minimum termination current can be programmed to 1 mA. The pre-charge-to-fast-charge, Vlowv
threshold is set to 2.5 V.
RPRE-TERM = %Term × KTERM = %Pre-CHG × KPRE-CHG
(2)
Where:
%Term is the percent of fast charge current where termination occurs;
%Pre-CHG is the percent of fast charge current that is desired during precharge;
KTERM and KPRE-CHG are gain factors found in the electrical specifications.
8.3.8 TS
The TS function for the bq2510x family is designed to follow the new JEITA temperature standard
(bq25100/bq25100H/bq25101/bq25101H) for Li-Ion and Li-Pol batteries. There are now four thresholds, 60°C,
45°C, 10°C, and 0°C. Normal operation occurs between 10°C and 45°C. If between 0°C and 10°C the charge
current level is cut in half and if between 45°C and 60°C the regulation voltage is reduced to 4.1 V max for
bq25100 and 4.2 V max for bq25100H, see 图 20. The TS function for the bq25100A cut the charge current level
in half between 0°C and 10°C and disables charging when the NTC temperature is above 45°C.
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Feature Description (接下页)
The TS feature is implemented using an internal 50μA current source to bias the thermistor (designed for use
with a 10-k NTC β = 3370 (SEMITEC 103AT-2 or Mitsubishi TH05-3H103F) connected from the TS pin to VSS. If
this feature is not needed, a fixed 10-k can be placed between TS and VSS to allow normal operation. This may
be done if the host is monitoring the thermistor and then the host would determine when to pull the TS pin low to
disable charge.
The TS pin has two additional features, when the TS pin is pulled low or floated/driven high. A low disables
charge and a high puts the charger in TTDM.
Above 60°C (45°C for bq25100A) or below 0°C the charge is disabled. Once the thermistor reaches ≉–10°C the
TS current folds back to keep a cold thermistor (between –10°C and –50°C) from placing the IC in the TTDM
mode. If the TS pin is pulled low into disable mode, the current is reduce to ≉30 μA. Since the ITS curent is fixed
along with the temperature thresholds, it is not possible to use thermistor values other than the 10-k NTC (at
25°C).
8.3.9 Timers
The pre-charge timer is set to 30 minutes. The pre-charge current, can be programmed to off-set any system
load, making sure that the 30 minutes is adequate.
The fast charge timer is fixed at 10 hours and can be increased real time by going into thermal regulation or IN-
DPM. The timer clock slows by a factor of 2, resulting in a clock than counts half as fast when in these modes. If
either the 30 minute or ten hour timer times out, the charging is terminated and for bq25101/1H the CHG pin
goes high impedance if not already in that state. The timer is reset by disabling the IC, cycling power or going
into and out of TTDM.
8.3.10 Termination
Once the OUT pin goes above VRCH, (reaches voltage regulation) and the current tapers down to the
termination threshold, a battery detect route is run to determine if the battery was removed or the battery is full. If
the battery is present, the charge current will terminate. If the battery was removed along with the thermistor,
then the TS pin is driven high and the charge enters TTDM. If the battery was removed and the TS pin is held in
the active region, then the battery detect routine will continue until a battery is inserted. The termination current
can be programmed down to 625 uA, however, the accuracy will reduce acoordingly when the termination
current is below 1 mA.
8.4 Device Functional Modes
8.4.1 Power-Down or Undervoltage Lockout (UVLO)
The bq2510x family is in power down mode if the IN pin voltage is less than UVLO. The part is considered
“dead” and all the pins are high impedance. Once the IN voltage rises above the UVLO threshold the IC will
enter Sleep Mode or Active mode depending on the OUT pin (battery) voltage.
8.4.2 Power-up
The IC is alive after the IN voltage ramps above UVLO (see sleep mode), resets all logic and timers, and starts
to perform many of the continuous monitoring routines. Typically the input voltage quickly rises through the
UVLO and sleep states where the IC declares power good, starts the qualification charge at 22 mA, sets the
charge current base on the ISET pin, and starts the safety timer.
8.4.3 Sleep Mode
If the IN pin voltage is between VOUT+VDT and UVLO, the charge current is disabled, the safety timer counting
stops (not reset). As the input voltage rises and the charger exits sleep mode, the safety timer continues to count
and the charge is enabled. See 图 22.
8.4.4 New Charge Cycle
A new charge cycle is started when a good power source is applied, performing a chip disable/enable (TS pin),
exiting Termination and Timer Disable Mode (TTDM), detecting a battery insertion or the OUT voltage dropping
below the VRCH threshold.
18
版权 © 2014, Texas Instruments Incorporated
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com.cn
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
Device Functional Modes (接下页)
Apply Input
Power
Is power good?
VBAT+VDT<VIN<VOVP
&VUVLO<VIN
No
Yes
No
Is chip enabled?
VTS>VEN
Yes
Set Input Current Limit to 22mA
And Start Charge
Perform ISET & OUT short tests
Set charge current
based on ISET setting
Return to
Charge
图 22. bq2510x Power-Up Flow Diagram
版权 © 2014, Texas Instruments Incorporated
19
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
www.ti.com.cn
Device Functional Modes (接下页)
8.4.5 Termination and Timer Disable Mode (TTDM) - TS Pin High
The battery charger is in TTDM when the TS pin goes high from removing the thermistor (removing battery
pack/floating the TS pin) or by pulling the TS pin up to the TTDM threshold.
When entering TTDM, the 10 hour safety timer is held in reset and termination is disabled. A battery detect
routine is run to see if the battery was removed or not. For bq25101/1H, if the battery was removed then the
CHG pin will go to its high impedance state if not already there. If a battery is detected the CHG pin does not
change states until the current tapers to the termination threshold, where the CHG pin goes to its high
impedance state if not already there (the regulated output will remain on).
The charging profile does not change (still has pre-charge, fast-charge constant current and constant voltage
modes). This implies the battery is still charged safely and the current is allowed to taper to zero.
When coming out of TTDM, the battery detect routine is run and if a battery is detected, then a new charge cycle
begins.
If TTDM is not desired upon removing the battery with the thermistor, one can add a 237-kΩ resistor between TS
and VSS to disable TTDM. This keeps the current source from driving the TS pin into TTDM. This creates ≉0.1°C
error at hot and a ≉3°C error at cold.
8.4.6 Battery Detect Routine
The battery detect routine should check for a missing battery while keeping the OUT pin at a useable voltage.
The battery detect routine is run when entering and exiting TTDM to verify if battery is present, or run all the time
if battery is missing and not in TTDM. On power-up, if battery voltage is greater than VRCH thereshold, a battery
detect routine is run to determine if a battery is present.
The battery detect routine is disabled while the IC is in TTDM, or has a TS fault. See 图 23 for the Battery Detect
Flow Diagram.
8.4.7 Refresh Threshold
After termination, if the OUT pin voltage drops to VRCH (100mV below regulation) then a new charge is initiated.
8.4.8 Starting a Charge on a Full Battery
The termination threshold is raised by ≉14% for the first minute of a charge cycle so if a full battery is removed
and reinserted or a new charge cycle is initiated, that the new charge terminates (less than 1 minute). Batteries
that have relaxed many hours may take several minutes to taper to the termination threshold and terminate
charge.
20
版权 © 2014, Texas Instruments Incorporated
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com.cn
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
Device Functional Modes (接下页)
Start
BATT_DETECT
Start 25ms timer
No
Timer Expired?
Yes
Battery Present
Turn off Sink Current
Return to flow
Yes
Is VOUT<VREG-100mV?
No
Set OUT REG
to VREG-400mV
Enable sink current
Reset & Start 25ms timer
No
Timer Expired?
Yes
Yes
Battery Present
Turn off Sink Current
Return to flow
Is VOUT>VREG-300mV?
No
Battery Absent
Don’t Signal Charge
Turn off Sink Current
Return to Flow
图 23. Battery Detect Routine
版权 © 2014, Texas Instruments Incorporated
21
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
www.ti.com.cn
9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The bq2510x series of devices are highly integrated Li-Ion and Li-Pol linear chargers targeted at space-limited
portable applications. The fast charge current can be programmed from 10 mA to 250 mA through an external
resistor on ISET pin. The pre_charge and termination current can also be programmed through the resistor
connected on PRETERM pin. The device has complete system-level protection such as input under-voltage
lockout (UVLO), input over-voltage protection (OVP), sleep mode, thermal regulation, safety timers, and NTC
monitoring input.
9.2 Typical Application - Charger Application Design Example
SYSTEM
USB Port or
Adapter
VBUS
IN
OUT
TS
D+
D-
1ÛF
1ÛF
VSS
PACK+
GND
TEMP
HOST
ISET
2.7k
3.4k
Optional
RC
PRETERM
PACK-
10 nF
6k
bq25100
CE
9.2.1 Design Requirements
•
•
•
•
•
•
Supply voltage = 5 V
Fast charge current: IOUT-FC = 40 mA;
Termination Current Threshold: %IOUT-FC = 10% of Fast Charge or ~4 mA
Pre-Charge Current by default is twice the termination Current or ~8 mA
TS – Battery Temperature Sense = 10-k NTC (103AT)
/CE is an open drain control pin
9.2.2 Detailed Design Procedures
•
•
•
The regulation voltage is set to 4.2 V, the input voltage is 5 V and the charge current is programmed to 40
mA.
For charge current that is below 50 mA, an extra RC circuit is recommended on ISET to acheive more stable
current signal. For applications that need higher charge current, the RC circuit is not needed.
For applications that use more than 200-mA current, there could be a very low level ~1% of charge current
ringing in the output. The ringing can be removed by increasing the input capacitance.
22
版权 © 2014, Texas Instruments Incorporated
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com.cn
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
Typical Application - Charger Application Design Example (接下页)
9.2.2.1 Calculations
9.2.2.1.1 Program the Fast Charge Current, ISET:
RISET = [K(ISET) / I(OUT)
]
from electrical characteristics table. . . K(SET) = 135 AΩ
RISET = [135 AΩ/0.04 A] = 3.4 kΩ
Selecting the closest standard value, use a 3.4-kΩ resistor between ISET and Vss.
9.2.2.1.2 Program the Termination Current Threshold, ITERM:
RPRE-TERM = K(TERM) × %IOUT-FC
RPRE-TERM = 600 Ω/% × 10% = 6 kΩ
Selecting the closest standard value, use a 6-kΩ resistor between PRETERM and Vss.
One can arrive at the same value by using 20% for a pre-charge value (factor of 2 difference).
RPRE-TERM = K(PRE-CHG) × %IOUT-FC
RPRE-TERM = 300 Ω/% × 20%= 6 kΩ
9.2.2.1.3 TS Function
Use a 10-k NTC thermistor in the battery pack (103AT).
To Disable the temp sense function, use a fixed 10-kΩ resistor between the TS and VSS.
9.2.2.1.4 Selecting IN and OUT Pin Capacitors
In most applications, all that is needed is a high-frequency decoupling capacitor (ceramic) on the power pin, input
and output pins. Using the values shown on the application diagram is recommended. After evaluation of these
voltage signals with real system operational conditions, one can determine if capacitance values can be adjusted
toward the minimum recommended values (DC load application) or higher values for fast, high amplitude, pulsed
load applications. Note if designed for high input voltage sources (bad adaptors or wrong adaptors), the capacitor
needs to be rated appropriately. Ceramic capacitors are tested to 2x their rated values so a 16-V capacitor may
be adequate for a 30-V transient (verify tested rating with capacitor manufacturer).
9.2.3 bq25100 Application Performance Plots
VIN
VIN 2 V/div
2 V/div
VOUT 2 V/div
VOUT 2 V/div
IOUT 60 mA/div
IOUT 60 mA/div
VISET 1 V/div
VISET 1 V/div
t-time – 20 ms/div
t-time – 50 ms/div
Hot Plug
VIN 0 V -5 V-7 V-5 V
图 24. OVP 7-V Adaptor
图 25. OVP from Normal Power-Up Operation
版权 © 2014, Texas Instruments Incorporated
23
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
www.ti.com.cn
Typical Application - Charger Application Design Example (接下页)
VIN 2 V/div
VIN 2 V/div
VTS 500 mV/div
VISET 2 V/div
ILOAD 70 mA/div
IOUT 60 mA/div
VISET 1 V/div
IOUT 70 mA/div
t-time – 50 ms/div
t-time – 10 ms/div
90-mA Load, 120-mA IOUT
图 26. TS Enable and Disable
图 27. Power Up
10 Power Supply Recommendations
10.1 Leakage Current Effects on Battery Capacity
To determine how fast a leakage current on the battery will discharge the battery is an easy calculation. The time
from full to discharge can be calculated by dividing the Amp-Hour Capacity of the battery by the leakage current.
For a 0.1-AHr battery and a 75-nA leakage current (100mAHr/75nA = 250000 Hours), it would take 1333k hours
or 152 years to discharge. In reality the self discharge of the cell would be much faster so the 75-nA leakage
would be considered negligible.
11 Layout
11.1 Layout Guidelines
To obtain optimal performance, the decoupling capacitor from IN to GND and the output filter capacitors from
OUT to GND should be placed as close as possible to the bq2510x, with short trace runs to both IN, OUT and
GND.
•
All low-current GND connections should be kept separate from the high-current charge or discharge paths
from the battery. Use a single-point ground technique incorporating both the small signal ground path and the
power ground path.
•
The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum
charge current in order to avoid voltage drops in these traces
24
版权 © 2014, Texas Instruments Incorporated
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com.cn
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
11.2 Layout Example
图 28. Board Layout
11.3 Thermal Package
The most common measure of package thermal performance is thermal impedance (θJA ) measured (or
modeled) from the chip junction to the air surrounding the package surface (ambient). The mathematical
expression for θJA is:
θJA = (TJ – T) / P
(3)
Where:
TJ = chip junction temperature
T = ambient temperature
P = device power dissipation
Factors that can influence the measurement and calculation of θJA include:
1. Whether or not the device is board mounted
2. Trace size, composition, thickness, and geometry
3. Orientation of the device (horizontal or vertical)
4. Volume of the ambient air surrounding the device under test and airflow
5. Whether other surfaces are in close proximity to the device being tested
Due to the charge profile of Li-Ion and Li-Pol batteries the maximum power dissipation is typically seen at the
beginning of the charge cycle when the battery voltage is at its lowest. Typically after fast charge begins the pack
voltage increases to ≉3.4 V within the first 2 minutes. The thermal time constant of the assembly typically takes a
few minutes to heat up so when doing maximum power dissipation calculations, 3.4 V is a good minimum voltage
to use.
The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal
PowerFET. It can be calculated from the following equation when a battery pack is being charged :
P = [V(IN) – V(OUT)] × I(OUT)
(4)
版权 © 2014, Texas Instruments Incorporated
25
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
ZHCSDZ5C –AUGUST 2014–REVISED NOVEMBER 2014
www.ti.com.cn
Thermal Package (接下页)
The thermal loop feature reduces the charge current to limit excessive IC junction temperature. It is
recommended that the design not run in thermal regulation for typical operating conditions (nominal input voltage
and nominal ambient temperatures) and use the feature for non typical situations such as hot environments or
higher than normal input source voltage. With that said, the IC will still perform as described, if the thermal loop
is always active.
12 器件和文档支持
12.1 器件支持
12.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此类
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
12.2 相关链接
以下表格列出了快速访问链接。 范围包括技术文档、支持与社区资源、工具和软件,并且可以快速访问样片或购买
链接。
表 1. 相关链接
器件
产品文件夹
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
样片与购买
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
工具与软件
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
支持与社区
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
bq25100
bq25101
bq25100A
bq25100H
bq25101H
bq25100L
12.3 商标
Bluetooth is a registered trademark of Bluetooth SIG, Inc..
12.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
12.5 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、首字母缩略词和定义。
13 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不
对本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
26
版权 © 2014, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ25100AYFPR
BQ25100AYFPT
BQ25100HYFPR
BQ25100HYFPT
BQ25100YFPR
BQ25100YFPT
BQ25101HYFPR
BQ25101HYFPT
BQ25101YFPR
BQ25101YFPT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
6
6
6
6
6
6
6
6
6
6
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
25100A
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
25100A
25100H
25100H
25100
25100
25101H
25101H
25101
25101
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Feb-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ25100AYFPR
BQ25100AYFPT
BQ25100HYFPR
BQ25100HYFPT
BQ25100YFPR
BQ25100YFPT
BQ25101HYFPR
BQ25101HYFPT
BQ25101YFPR
BQ25101YFPT
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
6
6
6
6
6
6
6
6
6
6
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
0.98
0.98
0.98
0.98
0.98
0.98
0.98
0.98
0.98
0.98
1.68
1.68
1.68
1.68
1.68
1.68
1.68
1.68
1.68
1.68
0.59
0.59
0.59
0.59
0.59
0.59
0.59
0.59
0.59
0.59
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
3000
250
3000
250
3000
250
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Feb-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
BQ25100AYFPR
BQ25100AYFPT
BQ25100HYFPR
BQ25100HYFPT
BQ25100YFPR
BQ25100YFPT
BQ25101HYFPR
BQ25101HYFPT
BQ25101YFPR
BQ25101YFPT
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
6
6
6
6
6
6
6
6
6
6
3000
250
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
3000
250
3000
250
3000
250
3000
250
Pack Materials-Page 2
PACKAGE OUTLINE
YFP0006
DSBGA - 0.5 mm max height
S
C
A
L
E
1
0
.
0
0
0
DIE SIZE BALL GRID ARRAY
B
E
A
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.05 C
0.19
0.13
BALL TYP
0.4
TYP
SYMM
C
B
D: Max = 1.608 mm, Min =1.547 mm
E: Max = 0.91 mm, Min = 0.85 mm
0.8
SYMM
TYP
0.4 TYP
A
0.25
0.21
C A B
6X
0.015
1
2
4223410/A 11/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YFP0006
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
6X ( 0.23)
2
1
A
B
(0.4) TYP
SYMM
C
SYMM
LAND PATTERN EXAMPLE
SCALE:50X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
(
0.23)
METAL
(
0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4223410/A 11/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YFP0006
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
6X ( 0.25)
1
2
A
B
(0.4) TYP
SYMM
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:50X
4223410/A 11/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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