BQ25170J [TI]

适用于单节锂离子和磷酸铁锂电池、符合 JEITA 标准的 800mA 线性电池充电器;


型号：	BQ25170J
厂家：	TEXAS INSTRUMENTS
描述：	适用于单节锂离子和磷酸铁锂电池、符合 JEITA 标准的 800mA 线性电池充电器电池
文件：	总32页 (文件大小：3001K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BQ25170J

ZHCSMW0 –OCTOBER 2021

BQ25170J：适用于单芯锂离子、锂聚合物和磷酸铁锂电池且符合JEITA 标准

的800mA 线性电池充电器

1 特性

3 说明

• 可承受高达30V 的输入电压

• 自动睡眠模式，可降低功耗

BQ25170J 是一款集成式 800mA 线性充电器，适用于

面向空间受限型便携式应用的单芯锂离子、锂聚合物和

磷酸铁锂电池。该器件具有为电池充电的单电源输出。

只要安全计时器期间内平均系统负载不会妨碍电池充满

电，就可以使系统负载与电池并联。当系统负载与电池

并联时，充电电流会由系统和电池共享。

– 350nA 电池泄漏电流

– 禁用充电时，输入泄漏电流为80µA

• 支持单芯锂离子、锂聚合物和磷酸铁锂电池

• 操作可使用外部电阻器进行编程

– 用于设置电池稳压电压的VSET：

• 锂离子电池：4.05V、4.1V、4.2V、4.35V、

4.4V

• 磷酸铁锂电池：3.5V、3.6V、3.7V

– 用于设置10mA 至800mA 充电电流的ISET

• 高精度

该器件分三个阶段为锂离子电池充电：对完全放电电池

进行恢复性充电的预充电阶段，为电池充上大部分电量

的恒流快速充电阶段，以及使电池电量充满的电压调节

阶段。

在所有充电阶段，内部控制环路都会监控 IC 结温，当

其超过内部温度阈值T_REG时，它会减少充电电流。

– 充电电压精度为±0.5%

– 充电电流精度为±10%

• 充电特性

充电器功率级和充电电流感测功能均完全集成。该充电

器具有高精度电流和电压调节环路功能、充电状态显示

和自动充电终止功能。充电电压和快速充电电流可通过

外部电阻编程设定。预充电和终止电流阈值由快速充电

电流设置决定。

– 预充电电流为20% ISET

– 用于控制充电过程在JEITA 标准范围内的TS 引

脚

– 终止电流为10% ISET

器件信息

– 用于监控电池温度的NTC 热敏电阻输入

– 用于控制充电功能的引脚

– 用于状态和故障指示的开漏输出

– 用于电源正常指示的开漏输出

• 集成故障保护

器件型号⁽¹⁾

BQ25170J

封装尺寸（标称值）

封装

WSON (8)

2.0mm x 2.0mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

– 6.6V 输入过压保护

– 基于VSET 的输出过压保护

– 1000mA 过流保护

– 125°C 热调节；150°C 热关断保护

– OUT 短路保护

– VSET、ISET 引脚短路/开路保护

2 应用

• 真正无线耳机

• 可穿戴附件、智能手环

• 美容美发

简化版原理图

• 电动牙刷

• 车队管理、资产跟踪

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLUSEF8

BQ25170J

ZHCSMW0 –OCTOBER 2021

www.ti.com.cn

Table of Contents

7.4 Device Functional Modes..........................................18

8 Application and Implementation..................................20

8.1 Application Information............................................. 20

8.2 Typical Applications.................................................. 20

9 Power Supply Recommendations................................24

10 Layout...........................................................................24

10.1 Layout Guidelines................................................... 24

10.2 Layout Example...................................................... 24

11 Device and Documentation Support..........................25

11.1 Device Support........................................................25

11.2 Receiving Notification of Documentation Updates..25

11.3 支持资源..................................................................25

11.4 Trademarks............................................................. 25

11.5 Electrostatic Discharge Caution..............................25

11.6 术语表..................................................................... 25

12 Mechanical, Packaging, and Orderable

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings ....................................... 4

6.2 ESD Ratings .............................................................. 4

6.3 Recommended Operating Conditions ........................4

6.4 Thermal Information ...................................................5

6.5 Electrical Characteristics ............................................6

6.6 Timing Requirements .................................................8

6.7 Typical Characteristics................................................9

7 Detailed Description......................................................11

7.1 Overview................................................................... 11

7.2 Functional Block Diagram.........................................13

7.3 Feature Description...................................................14

Information.................................................................... 26

4 Revision History

DATE

REVISION

NOTES

October 2021

Initial Release

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5 Pin Configuration and Functions

图5-1. WSON Package 8-Pin Top View

表5-1. Pin Functions

I/O

DESCRIPTION

NAME

NUMBER

Input power, connected to external DC supply. Bypass IN with at least 1-μF capacitor to GND,

placed close to the IC.

ISET

Programs the device fast-charge current. External resistor from ISET to GND defines fast charge

current value. Expected range is 30 kΩ (10 mA) to 375 Ω (800 mA). ICHG = K_ISET/ R_ISET

Precharge current is defined as 20% of ICHG. Termination current is defined as 10% of ICHG.

Temperature Qualification Voltage Input. Connect a negative temperature coefficient (NTC)

thermistor directly from TS to GND (AT103-2 recommended). Charge suspends when the TS pin

voltage is out of range. If TS function is not needed, connect an external 10-kΩresistor from this

pin to GND. Pulling TS < V_{TS_ENZ}will disable the charger.

GND

STAT

Ground pin

–

Open drain charger status indication output. Connect to pull-up rail via 10-kΩresistor.

LOW indicates charge in progress. HIGH indicates charge complete or charge disabled. When a

fault condition is detected STAT pin blinks at 1 Hz.

Open drain charge power good indication output. Connect to pull-up rail via 10-kΩresistor.

PG pulls low when V_IN> V_{IN_LOWV}and VOUT + V_SLEEPZ< V_IN< V_{IN_OV}

VSET

Programs the regulation voltage for OUT pin with a pull-down resistor. Valid resistor range is 18 kΩ

to 100 kΩ, values outside this range will suspend charge. Refer to 节7.3.1.2 for voltage level

details. Recommend using ±1% tolerance resistor with <200 ppm/ºC temperature coefficient.

OUT

Battery Connection. System Load may be connected in parallel to battery. Bypass OUT with at least

1-μF capacitor to GND, placed close to the IC.

Thermal Pad

Exposed pad beneath the IC for heat dissipation. Solder thermal pad to the board with vias

connecting to solid GND plane.

—

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.3

MAX

UNIT

Voltage

OUT

Voltage

ISET, PG, STAT, TS, VSET

PG, STAT

5.5

Output Sink Current

°C

T_J

Junction temperature

Storage temperature

150

–40

–65

T_stg

(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins⁽¹⁾

±2500

V_(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins⁽²⁾

±1500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

6.6

UNIT

V_IN

Input voltage

3.0

V_OUT

Output voltage

4.4

I_OUT

Output current

0.8

T_J

Junction temperature

IN capacitor

125

°C

–40

C_IN

µF

C_OUT

R_VSET

R_{VSET_TOL}

R_{VSET_TEMPCO}

R_ISET

R_TS

OUT capacitor

µF

VSET resistor

-1

100

kΩ

Tolerance for VSET resistor

Temperature coefficient for VSET resistor

ISET resistor

200

ppm/℃

kΩ

0.375

TS thermistor resistor (recommend 103AT-2)

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6.4 Thermal Information

BQ25170J

DSG

8 PINS

75.2

THERMAL METRIC⁽¹⁾

UNIT

R_θJA

Junction-to-ambient thermal resistance (JEDEC⁽¹⁾

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

)

°C/W

R_θJC(top)

R_θJB

93.4

41.8

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

3.8

Ψ_JT

41.7

Ψ_JB

R_θJC(bot)

17.0

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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6.5 Electrical Characteristics

3.0V < V_IN< V_{IN_OV}and V_IN> V_OUT+ V_SLEEP, T_J= -40°C to +125°C, and T_J= 25°C for typical values (unless otherwise

noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

QUIESCENT CURRENTS

OUT= 4.2V, IN floating or IN = 0V - 5V,

Charge Disabled, T_J= 25 °C

0.350

0.6 µA

0.8 µA

110 µA

µA

I_{Q_OUT}

Quiescent output current (OUT)

OUT= 4.2V, IN floating or IN = 0V - 5V,

Charge Disabled, T_J< 105 °C

Shutdown input current (IN) with

charge disabled via TS pin

IN = 5V, Charge Disabled (V_TS< V_{TS_ENZ}),

no battery

I_{SD_IN_TS}

I_{STANDBY_IN}

I_{Q_IN}

Standby input current (IN) with charge

terminated

IN = 5V, Charge Enabled, charge terminated

190

IN = 5V, OUT = 3.8V, Charge Enabled,

ICHG = 0A

Quiescent input current (IN)

0.45

0.6 mA

INPUT

V_{IN_OP}

IN operating range

3.0

3.05

2.80

6.6

3.15

3.10

V_{IN_LOWV}

V_SLEEPZ

V_SLEEP

V_{IN_OV}

IN voltage to start charging

IN voltage to stop charging

Exit sleep mode threshold

Sleep mode threshold hysteresis

VIN overvoltage rising threshold

VIN overvoltage falling threshold

IN rising

3.09

2.95

135

IN falling

IN rising, V_IN- V_OUT, OUT = 4V

IN falling, V_IN- V_OUT, OUT = 4V

IN rising

175 mV

6.60

6.75

6.63

6.90

V_{IN_OVZ}

IN falling

CONFIGURATION PINS SHORT/OPEN PROTECTION

R_ISETbelow this at startup, charger does not

initiate charge, power cycle or TS toggle to

reset

Highest resistor value considered

short

R_{ISET_SHORT}

350

2.8

R_VSETbelow this at startup, charger does

not initiate charge, power cycle or TS toggle

to reset

Highest resistor value considered

short

R_{VSET_SHORT}

kΩ

R_VSETabove this at startup, charger does

Lowest resistor value considered open not initiate charge, power cycle or TS toggle

to reset

R_{VSET_OPEN}

120

BATTERY CHARGER

V_DO

Dropout voltage (V_IN- V_OUT

)

VIN falling, VOUT = 4.35V, IOUT = 500mA

Tj = 25℃, all VSET settings

425

300

0.5

0.8

–0.5

–0.8

OUT charge voltage regulation

accuracy

V_{REG_ACC}

Tj = -40℃to 125℃, all VSET settings

Typical charge current regulation

range

I_{CHG_RANGE}

K_ISET

V_OUT> V_{BAT_LOWV}

800 mA

330

Charge current setting factor, I_CHG

K_ISET/ R_ISET

10mA < ICHG < 800mA

270

AΩ

720

450

800

500

100

880 mA

550 mA

110 mA

11 mA

R_ISET= 375Ω, OUT = 3.8V

R_ISET= 600Ω, OUT = 3.8V

R_ISET= 3.0kΩ, OUT = 3.8V

R_ISET= 30kΩ, OUT = 3.8V

I_{CHG_ACC}

Charge current accuracy

Typical pre-charge current, as

percentage of ICHG

I_PRECHG

V_OUT< V_{BAT_LOWV}

144

160

100

176 mA

110 mA

22 mA

2.6 mA

R_ISET= 375Ω, OUT = 2.5V

R_ISET= 600Ω, OUT = 2.5V

R_ISET= 3.0kΩ, OUT = 2.5V

R_ISET= 30kΩ, OUT = 2.5V

I_{PRECHG_ACC}

Precharge current accuracy

1.4

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6.5 Electrical Characteristics (continued)

3.0V < V_IN< V_{IN_OV}and V_IN> V_OUT+ V_SLEEP, T_J= -40°C to +125°C, and T_J= 25°C for typical values (unless otherwise

noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Typical termination current, as

percentage of ICHG

I_TERM

V_OUT= V_REG

8.5

0.4

55 mA

11.5 mA

1.6 mA

R_ISET= 600Ω, OUT = VREG = 4.2V

R_ISET= 3.0kΩ, OUT = VREG = 4.2V

R_ISET=30kΩ, OUT = VREG = 4.2V

I_{TERM_ACC}

Termination current accuracy

Output (OUT) short circuit voltage

rising threshold, for Li-Ion chemistry

V_{BAT_SHORT}

OUT rising, VSET configured for Li-Ion

OUT rising, VSET configured for LiFePO₄

2.1

1.1

2.2

1.2

2.3

1.3

Output (OUT) short circuit voltage

rising threshold, for LiFePO₄

chemistry

V_{BAT_SHORT}

Output (OUT) short circuit voltage

hysteresis

V_{BAT_SHORT_HYS}

I_{BAT_SHORT}

OUT falling

200

OUT short circuit charging current

V_OUT< V_{BAT_SHORT}

20 mA

Pre-charge to fast-charge transition

threshold, for Li-Ion chemistry

V_{BAT_LOWV}

OUT rising, VSET configured for Li-Ion

2.7

2.8

3.0

2.1

Pre-charge to fast-charge transition

threshold for Li-FePO₄chemistry

V_{BAT_LOWV}

V_{BAT_LOWV_HYS}

V_RECHG

OUT rising, VSET configured for LiFePO₄

OUT falling

1.9

2.0

100

Battery LOWV hysteresis

Battery recharge threshold for Li-Ion

chemistry

OUT falling, VSET configured for Li-

IonV_{REG_ACC}- VOUT

125 mV

225 mV

Battery recharge threshold for

LiFePO₄chemistry

OUT falling, VSET configured for LiFePO₄,

V_{REG_ACC}- VOUT

V_RECHG

175

200

IOUT = 400mA, T_J= 25°C

845

1000

1450

mΩ

R_ON

Charging path FET on-resistance

IOUT = 400mA, T_J= -40 - 125°C

BATTERY CHARGER PROTECTION

V_{OUT_OVP}

I_{OUT_OCP}

OUT overvoltage rising threshold

VOUT rising, as percentage of VSET

VOUT falling, as percentage of VSET

IOUT rising

103

101

0.9

104

102

105

103

1.1

OUT overvoltage falling threshold

Output current limit threshold

TEMPERATURE REGULATION AND TEMPERATURE SHUTDOWN

Typical junction temperature

regulation

T_REG

125

°C

Thermal shutdown rising threshold

Thermal shutdown falling threshold

Temperature increasing

150

135

°C

T_SHUT

Temperature decreasing

BATTERY-PACK NTC MONITOR

I_{TS_BIAS}TS nominal bias current

36.5

0.99

39.5 µA

Cool to cold temperature theshold;

Charge disabled

TS rising (approx. 0°C)

TS falling (approx. 4°C)

1.04

1.09

0.93

V_COLD

Cold to cool temperature threshold;

Charge current target increased to

20% x ISET

0.83

650

580

0.88

680

610

Normal to cool temperature threshold;

Charge current target reduced to 20% TS rising (approx. 10°C)

x ISET

710 mV

640 mV

V_COOL

Cool to normal temperature threshold;

Charge current target increased to

ISET

TS falling (approx. 13°C)

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6.5 Electrical Characteristics (continued)

3.0V < V_IN< V_{IN_OV}and V_IN> V_OUT+ V_SLEEP, T_J= -40°C to +125°C, and T_J= 25°C for typical values (unless otherwise

noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Normal to warm temperature

threshold; Charge current target

reduced to 50% x ISET; V_REGreduced

to 4.1V for VSET = 4.2 V, 4.35 V, 4.4 V

TS falling (approx. 45°C)

176

188

200 mV

V_WARM

Warm to normal temperature

threshold; Charge current target

increased to ISET; V_REGincreased to

VSET for VSET = 4.2 V, 4.35 V, 4.4 V

TS rising (approx. 40°C)

TS falling (approx. 55°C)

TS rising (approx. 51°C)

208

125

148

220

135

158

232 mV

145 mV

168 mV

Warm to hot temperature threshold;

charge disabled

Hot to warm temperature threshold;

Charge current target increased to

50% x ISET; V_REGset to 4.1V for

VSET = 4.2 V, 4.35 V, 4.4 V

V_HOT

Charger shutdown threshold; IC

enters shutdown mode

V_{TS_ENZ}

V_{TS_EN}

TS falling

TS rising

60 mV

85 mV

Charge enable threshold; Crossing

this threshold restarts IC operation

V_{TS_CLAMP}

I_{TS_LEAK}

TS maximum voltage clamp

TS pin high-level leakage

TS open-circuit (float)

Pull-up rail 1.8V

2.3

2.6

2.9

µA

LOGIC OUTPUT PIN (STAT, PG)

V_OL

Output low threshold level

High-level leakage current

Sink current = 5mA

Pull up rail 3.3V

0.4

I_{OUT_BIAS}

µA

6.6 Timing Requirements

MIN

NOM

MAX

UNIT

BATTERY CHARGER

t_{TS_DUTY_ON}

t_{TS_DUTY_OFF}

t_{OUT_OCP_DGL}

t_PRECHG

TS turn-on time during TS duty cycle mode

TS turn-off time during TS duty cycle mode

100

Deglitch time for I_{OUT_OCP}, IOUT rising

Pre-charge safety timer accuracy

Fast-charge safety timer accuracy

100

µs

min

28.5

9.5

31.5

10.5

t_SAFETY

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6.7 Typical Characteristics

C_IN= 1 µF, C_OUT= 1 µF, V_IN= 5 V, V_OUT= 3.8 V (unless otherwise specified)

I_OUT= 10 mA

V_OUT= 4.2 V

V_IN= 5 V

V_OUT= 4.2 V

图6-1. Line Regulation

图6-2. Load Regulation

V_IN= 5 V

Temp = 25ºC

V_IN= 5 V

V_OUT= 3.8 V

图6-3. ICHG Accuracy vs. V_OUT

图6-4. ICHG Accuracy vs. Temperature

图6-6. Dropout Voltage vs. Output Current

I_OUT= 10 mA

图6-5. VSET Accuracy vs. Temperature

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ICHG = 0 A

V_OUT= 0 V

TS Pin = LOW

V_OUT= 0 V

图6-8. Input Quiescent Current vs. Input Voltage

图6-7. Input Shutdown Current vs. Input Voltage

V_OUT= 4.35 V

V_IN= 0 V

图6-10. Termination Current Accuracy vs.

图6-9. Output Quiescent Current vs. Output

Termination Current Setting

Voltage

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7 Detailed Description

7.1 Overview

The BQ25170J is an integrated 800-mA linear charger for 1-cell Li-Ion, Li-Polymer, and LiFePO₄batteries. The

device has a single power output that charges the battery. The system load can be placed in parallel with the

battery, as long as the average system load does not prevent the battery from charging fully within the safety

timer duration. When the system load is placed in parallel with the battery, the input current is shared between

the system and the battery.

The device has three phases for charging a Li-Ion battery: precharge to recover a fully discharged battery, fast-

charge constant current to supply the bulk of the charge, and voltage regulation to reach full capacity.

The charger includes flexibility in programming of the fast-charge current and regulation voltage. This charger is

designed to work with a standard USB connection or dedicated charging adapter (DC output).

The charger also comes with a full set of safety features: battery temperature monitoring, overvoltage protection,

charge safety timers, and configuration pin (VSET, ISET) short and open protection. All of these features and

more are described in detail below.

The charger is designed for a single path from the input to the output to charge the battery. Upon application of a

valid input power source, the configuration pins are checked for short/open circuit.

If the Li-Ion battery voltage is below the V_{BAT_LOWV}threshold, the battery is considered discharged and a

preconditioning cycle begins. The amount of precharge current is 20% of the programmed fast-charge current

via ISET pin. The t_PRECHGsafety timer is active, and stops charging after expiration if battery voltage fails to rise

above V_{BAT_LOWV}

Once the battery has charged to the V_{BAT_LOWV}threshold, Fast Charge Mode is initiated, applying the fast

charge current and starting the t_SAFETYtimer. The fast charge constant current is programmed using the ISET

pin. The constant current phase provides the bulk of the charge. Power dissipation in the IC is greatest in fast

charge with a lower battery voltage. If the IC temperature reaches T_REG, the IC enters thermal regulation, slows

the timer clock by half, and reduces the charge current as needed to keep the temperature from rising any

further. 图 7-1 shows the typical Lithium battery charging profile with thermal regulation. Under normal operating

conditions, the IC’s junction temperature is less than T_REGand thermal regulation is not entered.

Once the battery has charged to the regulation voltage, the voltage loop takes control and holds the battery at

the regulation voltage until the current tapers to the termination threshold. The termination threshold is 10% of

the programmed fast-charge current.

Further details are described in 节7.3.

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Thermal

Regulation

Phase

Current

Regulation

Phase

Voltage Regulation and

Charge Termination

Phase

Pre-

Conditioning

Phase

DONE

REG

CHG

Battery Current,

FAST-CHARGE

CURRENT

OUT

Battery

Voltage,

OUT

Charge

Complete

Status,

Charger

Off

PRE-CHARGE

CURRENT AND

TERMINATION

THRESHOLD

BAT_LOWV

TERM

PRECHG

REG

Temperature, Tj

DONE

PRECHG

SAFETY

图7-1. Lithium-Ion Battery Charging Profile with Thermal Regulation

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7.2 Functional Block Diagram

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7.3 Feature Description

7.3.1 Device Power Up from Input Source

When an input source is plugged in and charge is enabled, the device checks the input source voltage to turn on

all the bias circuits. It detects and sets the charge current and charge voltage limits before the linear regulator is

started. The power up sequence from input source is as listed:

1. ISET pin detection

2. VSET pin detection to select charge voltage

3. Charger power up

7.3.1.1 ISET Pin Detection

After a valid VIN is plugged in, the device checks the resistor on the ISET pin for a short circuit (R_ISET

R_{ISET_SHORT}). If a short condition is detected, the charger remains in the FAULT state until the input or TS pin is

toggled. If the ISET pin is open-circuit, the charger proceeds through pin detection and starts the charger with no

charge current. This pin is monitored while charging and changes in R_ISETwhile the charger is operating will

immediately translate to changes in charge current.

An external pulldown resistor (±1% or better recommended to minimize charge current error) from ISET pin to

GND sets the charge current as:

K_ISET

I_CHG

R_ISET

(1)

where

• I_CHGis the desired fast-charge current

• K_ISETis a gain factor found in the electrical specifications

• R_ISETis the pulldown resistor from ISET pin to GND

For charge currents below 50 mA, an extra RC circuit is recommended on ISET to achieve more stable current

signal. For greater accuracy at lower currents, part of the current-sensing FET is disabled to give better

resolution.

7.3.1.2 VSET Pin Detection

VSET pin is used to program the device regulation voltage at end-of-charge using a ±1% pulldown resistor. The

available pulldown resistor and corresponding charging levels are:

表7-1. VSET Pin Resistor Value Table

RESISTOR

> 150 kΩ

100 kΩ

82 kΩ

CHARGE VOLTAGE (V)

No Charge (open-circuit)

1-cell LiFePO₄: 3.50 V

1-cell LiFePO₄: 3.60 V

1-cell LiFePO₄: 3.70 V

1-cell LiIon: 4.05 V

62 kΩ

47 kΩ

1-cell LiIon: 4.10 V

36 kΩ

1-cell LiIon: 4.20 V

27 kΩ

1-cell LiIon: 4.35 V

24 kΩ

1-cell LiIon: 4.40 V

18 kΩ

No Charge (short-circuit)

< 3.0 kΩ

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If either a short- or open-circuit condition is detected, charger stops operation and remains in the FAULT state

until the input or TS pin is toggled.

Once a valid resistor value has been detected, the corresponding charge voltage is latched in and the pin is not

continuously monitored during operation. A change in this pin will not be acknowledged by the IC until the input

supply or TS pin is toggled.

7.3.1.3 Charger Power Up

After VSET, ISET pin resistor values have been validated, the device proceeds to enable the charger. The

device automatically begins operation at the correct stage of battery charging depending on the OUT voltage.

7.3.2 Battery Charging Features

When charge is enabled , the device automatically completes a charging cycle according to the settings on

VSET, ISET pins without any intervention. The lithium-based charging cycle is automatically terminated when the

charging current is below termination threshold, charge voltage is above recharge threshold, and device is not in

thermal regulation (TREG). When a full battery is discharged below the recharge threshold (V_RECHG), the device

automatically starts a new charging cycle. After charge is done, toggling the input supply or the TS pin can

initiate a new charging cycle.

7.3.2.1 Lithium-Ion Battery Charging Profile

The device charges a lithium based battery in four phases: trickle charge, precharge, constant current and

constant voltage. At the beginning of a charging cycle, the device checks the battery voltage and regulates

current and voltage accordingly.

If the charger is in thermal regulation during charging, the actual charging current will be less than the

programmed value. In this case, termination is temporarily disabled and the charging safety timer is counted at

half the clock rate. For more information, refer to 节7.3.2.3.

Regulation Voltage

VSET

V_RECHG

Battery Voltage

Charge Current

ISET

Charge Current

V_{BAT_LOWV}

V_{BAT_SHORT}

IPRECHG = ISET x 20%

ITERM = ISET x 10%

I_{BAT_SHORT}

Trickle Charge

Pre-charge

Re-

charge

Fast-Charge

Taper-Charge

Charge

Done

Precharge Timer

(30min)

Safety Timer

(10hr)

图7-2. Battery Charging Profile

7.3.2.2 Charge Termination and Battery Recharge

device terminates a charge cycle when the OUT pin voltage is above the recharge threshold (V_RECHG), and the

current is below the termination threshold (I_TERM). Termination is temporarily disabled when the charger device is

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in thermal regulation. After charge termination is detected, the linear regulator turns off and the device enters

STANDBY state. Once the OUT pin drops below the V_RECHGthreshold, a new charge cycle is automatically

initiated.

7.3.2.3 Charging Safety Timers

The device has built-in safety timers to prevent an extended charging cycle due to abnormal battery conditions.

The precharge timer is fixed at 30 minutes. The fast-charge safety timer is fixed at 10 hours. When safety timer

expires, the charge cycle ends. A toggle on the input supply or TS pin is required to restart a charge cycle after

the safety timer has expired.

During thermal regulation, the safety timer counts at half clock rate as the actual charge current is likely to be

below the ISET setting. For example, if the charger is in thermal regulation throughout the whole charging cycle,

and the safety timer is 10 hours, then the timer will expire in 20 hours.

During faults which disable charging, such as VIN OVP, BAT OVP, TSHUT or TS faults, the timer is suspended.

Once the fault goes away, charging and the safety timer resumes. If the charging cycle is stopped and started

again, the timer gets reset (toggle TS pin restarts the timer).

The safety timer restarts counting for the following events:

1. Charging cycle stop and restart (toggle TS pin, charged battery falls below recharge threshold, or toggle

input supply)

2. OUT pin voltage crosses the V_{BAT_LOWV}threshold in either direction

The precharge safety timer (fixed counter that runs when V_OUT< V_{BAT_LOWV}), follows the same rules as the fast-

charge safety timer in terms of getting suspended, reset, and counting at half-rate.

7.3.2.4 Battery Temperature Qualification (TS Pin)

While charging, the device continuously monitors battery temperature by sensing the voltage at the TS pin. A

negative temperature coefficient (NTC) thermistor should be connected between the TS and GND pins

(recommend: 103AT-2). If temperature sensing is not required in the application, connect a fixed 10-kΩ resistor

from TS to GND to allow normal operation.

The TS function for BQ25170J is designed to follow the JEITA temperature standard for Li-Ion and Li-Poly

batteries; charge current (ISET) and regulation voltage (V_REG) are reduced based on battery temp (TS). There

are four thresholds, Hot-55C, Warm-45C, Cool-10C and Cold-0C.

Normal operation occurs between 10C and 45C, charge current and voltage will be the normal values. When

battery is in the Cool temperature range, between 0C and 10C, the charger current level is 20% of ISET value

and regulation voltage is not changed. When the battery is in the Warm temperature range, between 45C and

55C, ISET is reduced by 50% and regulation voltage is reduced to 4.1V for VSET settings greater than 4.1V.

Regulation voltage is not reduced during the Warm region for VSET settings less than or equal to 4.1V. Charge

is suspended below Cold temp of 0C and above Hot temp of 55C. When charge is suspended device enters the

STANDBY state, and blinks the STAT pin. Once battery temperature returns to normal conditions, charging

resumes automatically. See 图7-3.

When charge current is reduced during Cool or Warm temp the safety timer runs at half the clock rate.

图7-3. Standard JEITA Profile figure

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In addition to battery temperature sensing, the TS pin can be used to disable the charger at any time by pulling

TS voltage below V_{TS_ENZ}. The device disables the charger and consumes I_{SD_IN_TS}from the input supply. In

order to minimize quiescent current, the TS current source (I_{TS_BIAS}) is duty-cycled, with an on-time of

t_{TS_DUTY_ON}and an off time of t_{TS_DUTY_OFF}. After the TS pin pull-down is released, the device may take up to

t_{TS_DUTY_OFF}to turn the I_{TS_BIAS}back on. After the source is turned on, the TS pin voltage will go above V_{TS_EN}

and re-enable the charger operation. The device treats this TS pin toggle as an input supply toggle, triggering

Device Power Up From Input Source (节7.3.1).

7.3.3 Status Outputs ( PG, STAT)

7.3.3.1 Power Good Indicator (PG Pin)

This open-drain pin pulls LOW to indicate a good input source when:

1. VIN above V_{IN_LOWV}

2. VIN above V_OUT+ VSLEEPZ (not in SLEEP)

3. VIN below V_{IN_OV}

7.3.3.2 Charging Status Indicator (STAT)

The device indicates the charging state on the open-drain STAT pin. This pin can drive an LED.

表7-2. STAT pin state

CHARGING STATE

STAT PIN STATE

HIGH

Charge completed, charger in sleep mode or charge disabled (V_TS

V_{TS_ENZ}

)

Charge in progress (including automatic recharge)

LOW

Fault (VIN OVP, BAT OVP, BAT OCP, TS HOT, TS COLD, TMR_EXP,

VSET pin short/open or ISET pin short)

BLINK at 1Hz

7.3.4 Protection Features

The device closely monitors input and output voltage, as well as internal FET current and temperature for safe

linear regulator operation.

7.3.4.1 Input Overvoltage Protection (VIN OVP)

If the voltage at IN pin exceeds V_{IN_OV}, the device turns off after a deglitch, t_{VIN_OV_DGL}. The safety timer

suspends count and device enters STANDBY mode. Once the IN voltage recovers to normal level, the charge

cycle and the safety timer automatically resume operation.

7.3.4.2 Output Overvoltage Protection (BAT OVP)

If the voltage at OUT pin exceeds V_{OUT_OVP}, the device immediately stops charging. The safety timer suspends

count and device enters STANDBY mode. Once the OUT voltage recovers to normal level, the charge cycle and

the safety timer resume operation.

7.3.4.3 Output Overcurrent Protection (BAT OCP)

During normal operation, the OUT current should be regulated to ISET programmed value. However, if a short

circuit occurs on ISET pin, the OUT current may rise to unintended level. If the current at OUT pin exceeds

I_{OUT_OCP}, the device turns off after a deglitch, t_{OUT_OCP_DGL}. The safety timer resets the count, and device

remains latched off. An input supply or TS pin toggle is required to restart operation.

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I_{OUT_OCP}

ICHG

t_{OUT_OCP_DGL}

R_ISET

Short Circuit

event on ISET

Charger

latched off

图7-4. Overcurrent Protection

7.3.4.4 Thermal Regulation and Thermal Shutdown (TREG and TSHUT)

The device monitors its internal junction temperature (T_J) to avoid overheating and to limit the IC surface

temperature. When the internal junction temperature exceeds the thermal regulation limit, the device

automatically reduces the charge current to maintain the junction temperature at the thermal regulation limit

(TREG). During thermal regulation, the actual charging current is usually below the programmed value on the

ISET pin. Therefore, the termination comparator for the Lithium-Ion battery is disabled, and the safety timer runs

at half the clock rate.

Additionally, the device has thermal shutdown to turn off the linear regulator when the IC junction temperature

exceeds the TSHUT threshold. The charger resumes operation when the IC die temperature decreases below

the TSHUT falling threshold.

7.4 Device Functional Modes

7.4.1 Shutdown or Undervoltage Lockout (UVLO)

The device is in shutdown state if the IN pin voltage is less than V_{IN_LOWV}, or the TS pin is below V_{TS_ENZ}. The

internal circuitry is powered down, all the pins are high impedance, and the device draws I_{SD_IN_TS}from the input

supply. Once the IN voltage rises above the V_{IN_LOW}threshold and the TS pin is above V_{TS_EN}, the IC will enter

Sleep Mode or Active Mode depending on the OUT pin voltage.

7.4.2 Sleep Mode

The device is in Sleep Mode when V_{IN_LOWV}< V_IN< V_OUT+ V_SLEEPZ. The device waits for the input voltage to

rise above V_OUT+ V_SLEEPZto start operation.

7.4.3 Active Mode

The device is powered up and charges the battery when the TS pin is above V_{TS_ENZ}and the IN voltage ramps

above both V_{IN_LOWV}, and V_OUT+ V_SLEEPZ. The device draws I_{Q_IN}from the supply to bias the internal circuitry.

For details on device power-up sequence, refer to 节7.3.1.

7.4.3.1 Standby Mode

The device is in Standby Mode if a valid input supply is present and charge is terminated or if a recoverable fault

is detected. The internal circuitry is partially biased, and the device continues to monitor for either VOUT to drop

below V_RECHG, or the recoverable fault to be removed.

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7.4.4 Fault Mode

The fault conditions are categorized into recoverable and nonrecoverable as follows:

• Recoverable, from which the device should automatically recover once the fault condition is removed:

– VIN OVP

– BAT OVP

– TS HOT

– TS COLD

• Nonrecoverable, requiring TS pin or input supply toggle to resume operation:

– BAT OCP

– ISET pin short detected

– VSET pin short/open detected

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8 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

8.1 Application Information

A typical application consists of the device configured as a standalone battery charger for single-cell Lithium-Ion,

Li-Polymer, or LiFePO₄chemistries. The charge voltage and number of cells is configured using a pull-down

resistor on the VSET pin. The charge current is configured using a pull-down resistor on the ISET pin. A battery

thermistor may be connected to the TS pin to allow the device to monitor battery temperature and control

charging. Pulling the TS pin below V_{TS_ENZ}disables the charging function. The charger and input supply status

is reported via the STAT and PG pins.

8.2 Typical Applications

8.2.1 Li-Ion Charger Design Example

图8-1. BQ25170J Typical Application for Li-Ion Charging at 500 mA

8.2.1.1 Design Requirements

• Supply voltage = 5 V

• Battery is single-cell Li-Ion

• Fast charge current: I_CHG= 500 mA

• Charge Voltage: V_REG= 4.35 V

• Termination Current: I_TERM= 10% of I_CHGor 50 mA

• Pre-charge Current: I_PRECHG= 20% of I_CHGor 100 mA

• TS –Battery Temperature Sense = 10-kΩNTC (103AT)

• TS pin can be pulled down to disable charging

8.2.1.2 Detailed Design Procedure

The regulation voltage is set via the VSET pin to 4.35 V, the input voltage is 5 V and the charge current is

programmed via the ISET pin to 500 mA.

R_ISET= [K_ISET/ I_CHG

]

from electrical characteristics table. . . K_ISET= 300 AΩ

R_ISET= [300 AΩ/0.5 A] = 600 Ω

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Selecting the closest 1% resistor standard value, use a 604-Ω resistor between ISET and GND, for an expected

I_CHG497 mA.

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8.2.1.3 Application Curves

C_IN= 1 µF, C_OUT= 1 µF, V_IN= 5 V, V_OUT= 3.8 V, I_CHG= 250 mA (unless otherwise specified)

OUT = open-circuit

R_ISET= 1.2 kΩ

图8-2. Power Up With Battery

图8-3. Power Up Without Battery

TS pulled LOW

VIN = 5 V →0 V

图8-5. Charge Disable

图8-4. Power Down

TS pin released

VIN = 5 V →10 V →5 V

图8-6. Charge Enable

图8-7. IN OVP Response

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V_OUT= 3.5 V

V_OUT= VSET = 4.2 V

V_IN= 4 V →6 V

I_SYS= 0 mA →500 mA

图8-8. IN Transient Response

图8-9. OUT Transient Response

V_OUT= 4.0 V →0 V

I_SET= 1.2 kΩ→0

图8-10. OUT Short-Circuit Response

图8-11. ISET Short-Circuit Response

V_TSSweep from Cold Shutdown, Cool, Normal, Warm, Hot

Shutdown

ISET = 50 mA →500 mA

图8-12. ISET Change Response

图8-13. TS Change Response

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9 Power Supply Recommendations

The device is designed to operate from an input voltage supply range between 3.0 V and 6.6 V (up to 30 V

tolerant) and current capability of at least the maximum designed charge current. If located more than a few

inches from the IN and GND pins, a larger capacitor is recommended.

10 Layout

10.1 Layout Guidelines

To obtain optimal performance, the decoupling capacitor from IN to GND and the output filter capacitor from OUT

to GND should be placed as close as possible to the device, with short trace runs to both IN, OUT and GND.

• All low-current GND connections should be kept separate from the high-current charge or discharge paths

from the battery. Use a single-point ground technique incorporating both the small signal ground path and the

power ground path.

• The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum

charge current in order to avoid voltage drops in these traces.

10.2 Layout Example

GND

OUT

VREF

OUT

VSET

/PG

0402

/PG

0402

STAT

ISET

0402

VSET

GND

STAT

GND

图10-1. Board Layout Example

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11 Device and Documentation Support

11.1 Device Support

11.1.1 第三方产品免责声明

TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此

类产品或服务单独或与任何TI 产品或服务一起的表示或认可。

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.3 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

11.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

11.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.6 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

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12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGE OPTION ADDENDUM

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12-Apr-2023

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

BQ25170JDSGR

ACTIVE

WSON

DSG

3000 RoHS & Green

NIPDAU

Level-1-260C-UNLIM

-40 to 125

170J

Samples

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

GENERIC PACKAGE VIEW

DSG 8

2 x 2, 0.5 mm pitch

WSON - 0.8 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224783/A

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PACKAGE OUTLINE

DSG0008A

WSON - 0.8 mm max height

SCALE 5.500

PLASTIC SMALL OUTLINE - NO LEAD

2.1

1.9

0.32

0.18

PIN 1 INDEX AREA

2.1

1.9

0.4

0.2

ALTERNATIVE TERMINAL SHAPE

TYPICAL

0.8

0.7

SEATING PLANE

0.05

0.00

SIDE WALL

0.08 C

METAL THICKNESS

DIM A

OPTION 1

0.1

OPTION 2

0.2

EXPOSED

THERMAL PAD

(DIM A) TYP

0.9 0.1

6X 0.5

1.5

1.6 0.1

0.32

0.18

PIN 1 ID

(45 X 0.25)

0.4

0.2

0.1

C A B

0.05

4218900/E 08/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

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EXAMPLE BOARD LAYOUT

DSG0008A

WSON - 0.8 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

(0.9)

(

0.2) VIA

8X (0.5)

TYP

8X (0.25)

(0.55)

SYMM

(1.6)

6X (0.5)

SYMM

(1.9)

(R0.05) TYP

LAND PATTERN EXAMPLE

SCALE:20X

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

SOLDER MASK

OPENING

METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4218900/E 08/2022

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

EXAMPLE STENCIL DESIGN

DSG0008A

WSON - 0.8 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

8X (0.5)

METAL

SYMM

8X (0.25)

(0.45)

SYMM

(0.7)

6X (0.5)

(R0.05) TYP

(0.9)

(1.9)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 9:

87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:25X

4218900/E 08/2022

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

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