BQ75614PAPRQ1 [TI]

Automotive 16-S precision battery monitor, balancer and integrated protector with ASIL-D compliance | PAP | 64 | -40 to 125;


型号：	BQ75614PAPRQ1
厂家：	TEXAS INSTRUMENTS
描述：	Automotive 16-S precision battery monitor, balancer and integrated protector with ASIL-D compliance \| PAP \| 64 \| -40 to 125
文件：	总13页 (文件大小：1867K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BQ75614-Q1

ZHCSKB3A –SEPTEMBER 2019 –REVISED JULY 2021

BQ75614-Q1 具有集成电流检测功能的14 节或16 节串联汽车类独立式精密监

测器、平衡器

1 特性

2 应用

• 符合汽车应用要求

• 具有符合AEC-Q100 标准的下列特性：

• 汽车类48V 锂离子电池系统

• 电动自行车、电动踏板车

– 器件温度等级1：–40°C 至+125°C 环境工作

温度范围

3 说明

BQ75614-Q1 器件可在不到 200µs 的时间内提供高达

16S 电池模块的高精度电池电压测量，同时该器件还

支持分流电阻器电流检测测量。借助集成式前端滤波

器，可以在电池输入通道上使用简单、低额定电压的差

分 RC 滤波器来实现系统。集成式后 ADC 低通滤波器

可以执行经过滤波、类似于直流电的电压测量。该器件

还支持集成电流检测功能，可选择与电池电压测量同

步，以更好地计算荷电状态 (SOC)。此器件支持自主

内部电池平衡，并通过监测温度来自动暂停和恢复平

衡，以免出现过热条件。

– 器件HBM ESD 分类等级2

– 器件CDM ESD 分类等级C4B

• 符合功能安全标准

– 专为功能安全应用开发

– 可帮助进行ISO 26262 系统设计的文档

– 系统可满足ASIL D 级要求

– 硬件可满足ASIL D 要求

• +/- 1.5mV ADC 精度

• 兼容引脚/封装和软件的器件系列：

– 可堆叠监测器16S（BQ79616-Q1、BQ79656-

Q1）、14S（BQ79614-Q1、BQ79654-Q1）和

12S（BQ79612-Q1、BQ79652-Q1）

– 独立式监测器48V 系统(BQ75614-Q1)

• 支持电流检测测量

器件信息

器件型号⁽¹⁾

封装尺寸（标称值）

封装

BQ75614-Q1

10.00mm × 10.00mm

HTQFP（64 引脚）

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

• 保险丝和继电器打开和关闭诊断直接支持

• 用于电压、温度和电流诊断的内置冗余路径

• 可以在128µs 内对所有电池通道执行高度精确的电

池电压测量

FUSE

Relay

12 V

• 集成式后ADC 可配置数字低通滤波器

• 主机控制的内置硬件复位功能，可模拟类似于POR

的器件复位

Fuse/relay sense

PMIC

OUT

VCC

BAT

GPIOx

BQ75614

ISO

VCC2

VCC1

• 支持内部电池平衡

CVDD

MCU

– 240mA 的平衡电流

UART

– 内置平衡热管理，具有自动暂停和恢复控制功能

• 5V LDO 输出为外部数字隔离器供电

• UART 主机接口

Current sense

• 内置SPI 主器件

简化版系统图

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLUSDT6

BQ75614-Q1

ZHCSKB3A –SEPTEMBER 2019 –REVISED JULY 2021

www.ti.com.cn

4 说明（续）

此器件还包含八个GPIO 或辅助输入，可执行外部热敏电阻测量。

与的主机通信可通过以下方式进行连接：器件的专用UART 接口。。

English Data Sheet: SLUSDT6

Submit Document Feedback

Product Folder Links: BQ75614-Q1

BQ75614-Q1

ZHCSKB3A –SEPTEMBER 2019 –REVISED JULY 2021

www.ti.com.cn

5 Device and Documentation Support

5.1 Device Support

5.1.1 第三方产品免责声明

TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此

类产品或服务单独或与任何TI 产品或服务一起的表示或认可。

5.2 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

5.3 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

5.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

5.5 静电放电警告

静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理

和安装程序，可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参

数更改都可能会导致器件与其发布的规格不相符。

5.6 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

Submit Document Feedback

Product Folder Links: BQ75614-Q1

English Data Sheet: SLUSDT6

BQ75614-Q1

ZHCSKB3A –SEPTEMBER 2019 –REVISED JULY 2021

www.ti.com.cn

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

English Data Sheet: SLUSDT6

Submit Document Feedback

Product Folder Links: BQ75614-Q1

重要声明和免责声明

TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没

有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。

这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可

将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知

识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。

TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI

提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

PACKAGE OPTION ADDENDUM

www.ti.com

27-Jan-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

BQ75614PAPRQ1

ACTIVE

HTQFP

PAP

1000 RoHS & Green

NIPDAU

Level-3-260C-168 HR

-40 to 125

BQ75614

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

12-Jul-2021

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

BQ75614PAPRQ1

HTQFP

PAP

1000

330.0

24.4

13.0

1.5

16.0

24.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

12-Jul-2021

*All dimensions are nominal

Device

Package Type Package Drawing Pins

HTQFP PAP 64

SPQ

Length (mm) Width (mm) Height (mm)

367.0 367.0 55.0

BQ75614PAPRQ1

1000

Pack Materials-Page 2

GENERIC PACKAGE VIEW

PAP 64

10 x 10, 0.5 mm pitch

HTQFP - 1.2 mm max height

QUAD FLATPACK

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4226442/A

www.ti.com

PACKAGE OUTLINE

PAP0064F

PowerPAD TQFP - 1.2 mm max height

SCALE 1.300

PLASTIC QUAD FLATPACK

10.2

9.8

NOTE 3

PIN 1 ID

10.2

9.8

12.2

TYP

11.8

NOTE 3

0.27

64X

60X 0.5

0.17

0.08

C A B

4X 7.5

SEATING PLANE

1.2 MAX

(0.127)

TYP

SEE DETAIL A

0.25

GAGE PLANE

(1)

8X (R0.091)

NOTE 4

0.15

0.05

0.08 C

0 -7

0.75

0.45

6.5

5.3

DETAIL A

TYPICAL

20X (R0.137)

NOTE 4

4226412/A 11/2020

PowerPAD is a trademark of Texas Instruments.

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs.

4. Strap features may not be present.

5. Reference JEDEC registration MS-026.

www.ti.com

EXAMPLE BOARD LAYOUT

PAP0064F

PowerPAD TQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

(8)

NOTE 8

(6.5)

SYMM

SOLDER MASK

DEFINED PAD

64X (1.5)

(R0.05)

TYP

64X (0.3)

(11.4)

SYMM

(1.1 TYP)

60X (0.5)

(

0.2) TYP

VIA

METAL COVERED

SEE DETAILS

BY SOLDER MASK

(1.1 TYP)

(11.4)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:6X

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL

EXPOSED METAL

METAL UNDER

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

4226412/A 11/2020

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,

Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,

plugged or tented.

10. Size of metal pad may vary due to creepage requirement.

www.ti.com

EXAMPLE STENCIL DESIGN

PAP0064F

PowerPAD TQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

(6.5)

BASED ON

0.125 THICK STENCIL

SYMM

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

64X (1.5)

64X (0.3)

(R0.05) TYP

SYMM

(11.4)

60X (0.5)

METAL COVERED

BY SOLDER MASK

(11.4)

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:6X

STENCIL

THICKNESS

SOLDER STENCIL

OPENING

0.1

7.27 X 7.27

6.5 X 6.5 (SHOWN)

5.93 X 5.93

0.125

0.15

0.175

5.49 X 5.49

4226412/A 11/2020

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

BQ75614PAPRQ1 [TI]

相关型号：

BQ756506-Q1

BQ756506PAPRQ1

BQ76200

BQ76200PW

BQ76200PWR

BQ769142

BQ769142PFBR

BQ76920

BQ7692000PW

BQ7692000PWR

BQ7692003PW

BQ7692003PWR