BQ79600PWRQ1 [TI]
具备自动主机唤醒功能且符合功能安全标准的汽车类 SPI/UART 通信接口 | PW | 16 | -40 to 125;型号: | BQ79600PWRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具备自动主机唤醒功能且符合功能安全标准的汽车类 SPI/UART 通信接口 | PW | 16 | -40 to 125 通信 |
文件: | 总71页 (文件大小:3519K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BQ79600-Q1
ZHCSR35A –NOVEMBER 2019 –REVISED AUGUST 2020
BQ79600-Q1 具备自动主机唤醒功能且符合功能安全标准的汽车类SPI/UART 通
信接口
1 特性
2 应用
• 符合汽车应用要求
• 具有符合AEC-Q100 标准的下列特性:
• 电池管理系统(BMS)
• 其他HEV/EV
• 燃料电池
– 器件温度等级1:–40°C 至+125°C 环境工作
温度范围
• 能源存储
– 器件HBM ESD 分类等级2
– 器件CDM ESD 分类等级C4B
• 符合功能安全标准
3 说明
BQ79600-Q1 是一款通信(网桥)IC,旨在连接微控
制器 (MCU) 和 TI 电池监测 IC,例如 BQ7961X-Q1。
器件将来自 MCU 的信息转换为信号,而 TI 的电池管
理菊花链协议用于识别这种信号,并将其传输出来。来
自菊花链的信号被解码为位流,然后发送回MCU。
– 专为功能安全应用开发
– 有助于进行ISO 26262 系统设计的文档
• 安全手册
• 功能安全分析报告
– 系统可满足ASIL D 级要求
– 硬件可满足ASIL-D 要求
• 在环形架构中检测到故障时,自动唤醒BMS/BMU
系统
使用环形架构时如果检测到了任何未屏蔽的故障,则
BQ79600-Q1 可以将处于关断/睡眠模式的 MCU 和
PMIC 唤醒。
器件信息
• 支持的电源电压范围为4.75V 至40V
• UART/SPI 主机接口
• 兼容3.3V/5V 逻辑
• 隔离式差分菊花链
器件型号(1)
BQ79600-Q1
封装尺寸(标称值)
封装
6.6mm × 5.1mm
TSSOP(16 引脚)
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
– 支持包含一台设备的环形架构
– 支持变压器/电容器隔离
• 经过专门设计,旨在实现BCI/EMI/EMC 稳健性
• 支持BQ7961X-Q1 系列、BQ7965X、BQ7963X 和
未来产品。
12V Battery
Battery
Battery
Battery
Battery
EN
SBC
(PMIC)
Balance and Filter
Components
Balance and Filter
Components
Balance and Filter
Components
Balance and Filter
Components
BAT
VIO
uC
NFAULT
UART
/SPIBQ79600-Q1
BQ796XX-Q1
BQ796XX-Q1
BQ796XX-Q1
BQ796XX-Q1
INH
COML
COMH
COML
COMH
COML
COMH
COML
COMH
COML
COMH
CAP
CAP
CAP or
Transfomer
CAP or
Transfomer
CAP or
Transfomer
CAP or
Transfomer
Transformer
Transformer
BMU
CMU
CMU
BMU
isolation
Low Voltage
Boundary
Optional: Ring Enables Fault
and Reverse Wakeup Feature
简化版系统图
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLUSDS1
BQ79600-Q1
ZHCSR35A –NOVEMBER 2019 –REVISED AUGUST 2020
www.ti.com.cn
Table of Contents
7.5 Register Maps...........................................................37
8 Application and Implementation..................................55
8.1 Application Information............................................. 55
8.2 Typical Applications.................................................. 55
9 Power Supply Recommendations................................59
10 Layout...........................................................................60
10.1 Layout Guidelines................................................... 60
10.2 Layout Example...................................................... 60
11 Device and Documentation Support..........................63
11.1 Device Support........................................................63
11.2 第三方产品免责声明................................................63
11.3 接收文档更新通知................................................... 63
11.4 支持资源..................................................................63
11.5 Trademarks............................................................. 63
11.6 静电放电警告...........................................................63
11.7 术语表..................................................................... 63
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
Pin Functions.................................................................... 3
6 规格................................................................................... 4
6.1 Absolute Maximum Ratings ....................................... 4
6.2 ESD Ratings .............................................................. 4
6.3 Recommended Operating Conditions ........................4
6.4 Thermal Information ...................................................4
6.5 Electrical Characteristics ............................................5
6.6 Timing Requirements .................................................6
6.7 Typical Characteristics................................................9
7 Detailed Description......................................................10
7.1 Overview...................................................................10
7.2 Functional Block Diagram.........................................10
7.3 Feature Description...................................................10
7.4 Device Functional Modes..........................................36
Information.................................................................... 64
4 Revision History
Changes from Revision * (November 2019) to Revision A (June 2020)
Page
• 将“预告信息”更改为“量产数据”.................................................................................................................. 1
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5 Pin Configuration and Functions
INH
16
15
14
13
12
11
DVDD
1
2
3
4
5
6
7
8
BAT
NFAULT
CVDD
COMHP
COMHN
VIO
MOSI/RX
16-TSSOP
5.1x6.6x1.2(mm)
No thermal pad
MISO/TX
COMLN
COMLP
GND
SCLK
nCS
10
9
nUART/SPI (SPI_RDY)
图5-1. PW Package 16-Pin TSSOP Top View
Pin Functions
PIN
NAME
TYPE(1)
DESCRIPTION
NO.
VIO
3
P
Power supply input for UART/SPI input/output pins. Decouple with a 0.1μF capacitor to GND.
VIO should be powered before SCLK, nCS, RX/MOSI, TX/MISO, NFAULT, nUART/SPI
(SPI_RDY) is driven.
SCLK
6
7
4
5
DI
DI
SPI clock input. If SPI interface is used, this pin is connected to SPI master controller. Connect
to GND with a 10-100kohm pull-down resistor. If not used, connect to GND.
nCS
Active low chip select pin for SPI interface. Connect to VIO with 10-100kohm pull-up resistor in
SPI mode. Cannot hardwire to GND in SPI mode. Connect to GND in UART mode.
RX/MOSI
TX/MISO
DI
UART receiver input or SPI master out slave in. Connect to VIO with a 10-100kohm pull-up
resistor. Don't leave it unconnected.
DO
UART transmitter output or SPI master in slave out. Pull up to VIO with a 10-100kohm pull-up
resistor at MCU side. MISO pin drives high in SPI idle mode, cannot directly support SPI
multidrop, if multidrop is needed, add a tri-state buffer between BQ79600-Q1 and MCU.
NFAULT
2
8
DO
Fault indication output. Open drain active low. Pull up to VIO with 100kohm resistor. Connect
NFAULT to host MCU GPIO. If not used, connect to GND.
nUART/SPI
(SPI_RDY)
DI/O
If used as UART mode, connect this pin to GND. If used as SPI mode, connect to VIO through
10-100kohm pull up resistor and connect this pin to MCU GPIO. This pin is used as an input pin
to select SPI or UART interface before device finishes wakeup/reset initialization (SPI
communication is ready). If SPI mode is selected, SPI_RDY has to be used by host to decide if
read/write can be initiated or needing further wait. Refer to 节7.3.2.1.2.2.1 details.
DVDD
1
P
1.8V regulated output. DVDD supplies the internal digital circuits. Bypass DVDD with a 0.22μF
(recommended) or a 0.47μF capacitor to GND.
GND
9
P
P
Ground.
CVDD
14
Dedicated 5V supply used for the daisy chain communications. Decouple with a 0.22μF
(recommended) or a 0.47μF to GND.
COMHN
COMHP
12
13
AC-I/O This is an AC coupled bi-directional I/O pin for daisy chain (VIF) communication. Do not apply
external DC voltage to this pin. Shall connect to COMLN/P of adjacent device through proper
AC-I/O
isolation, see 节7.3.2.1.1. Leave unconnected if (Ring Architecture) not used.
COMLN
COMLP
11
10
AC-I/O This is an AC coupled bi-directional I/O pin for daisy chain (VIF) communication. Do not apply
external DC voltage to this pin. Shall connect to COMHN/P of adjacent device through proper
AC-I/O
isolation, see 节7.3.2.1.1. Leave unconnected if (Ring Architecture) not used.
INH
16
HV-O
HV-P
Inhibit pin (PMOS open drain) to control system voltage regulators, connect 100kohm resistor
to GND. If reverse wake up feature is not used, connect this pin to BAT pin. Don’t leave this
pin floating.
BAT
15
Battery supply Input. Supply internal LDOs and wakeup circuit. Connect to external supply
through 10ohm resistor. Bypass to GND with 0.1μF.
(1) DI = digital input, DO = digital output, HV = high voltage
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6 规格
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
MAX
40
UNIT
BAT to GND
V
V
V
V
INH to GND (INH is lower than BAT)
VIO, CVDD to GND
40
5.5
DVDD to GND
Input Voltage
1.98
MISO/TX, MOSI/RX, nCS, SCLK, NFAULT, nUART/SPI(SPI_RDY) to
GND
VIO+0.3
V
–0.3
COMHP, COMHN, COMLP, COMLN to GND
COMHP to COMHN, COMLP to COMLN
INH current
10
6.5
4
V
V
–10
–6.5
mA
mA
°C
°C
°C
I/O current
MISO/TX current (100pF load, VIO=5V, 10ns transition-time)
Ambient temperature
8
TA
125
150
150
–40
–40
–65
TJ
Junction temperature
Tstg
Storage temperature
(1) Stresses beyond those listed under Absolute Maximum Rating may caµse permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per AEC Q100-002(1)
±2000
±750
±500
V(ESD) Electrostatic discharge
Corner pins (1, 8, 9 and 16)
Other pins
V
Charged device model (CDM), per
AEC Q100-011
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
VBAT, INH
BAT, INH (INH is equal to or lower than BAT) (Powered by 12V Battery)
5.5
24
V
VIO input (applies to nCS, MOSI/RX, MISO/TX, SLCK, nUART/SPI
(SPI_RDY), NFAULT)
VVIO_RANGE
3.135
5.25
V
IMISO/TX
IINH
MISO/TX current
3
2
mA
mA
°C
INH output current
Operation temperature
TA
125
–40
6.4 Thermal Information
BQ79600-Q1
THERMAL METRIC(1)
PW(TSSOP)
UNIT
16 PINS
102
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
28.9
49
14
ΨJT
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BQ79600-Q1
THERMAL METRIC(1)
PW(TSSOP)
16 PINS
48.2
UNIT
Junction-to-board characterization parameter
°C/W
ΨJB
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
VIO = 3.3V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OPERATION VOLTAGE
When reverse wakeup feature is used,
BAT pin is powered by "12V battery"
VBAT
5.5
24
V
V
When reverse wakeup feature is not
used, BAT/CVDD are powered by
regulated 5V
VBAT
4.75
5.25
THERMAL SHUTDOWN
TSHUT_R Thermal shutdown (rising direction)
TSHUT_F Thermal shutdown (falling direction)
SUPPLY CURRENTS
DieTemp sensor
DieTemp sensor
126
116
138
150
141
°C
°C
Supply current in SHUTDOWN mode
ISHDN_1
VBAT shorted to CVDD, both equal to 5V,
measured through GND pin
7
µA
device powered by regulated 5V supply
Supply current in SHUTDOWN mode
ISHDN_2
VBAT= 17V, CVDD self
powered, measured through GND pin
9
168
110
µA
µA
µA
powered by "12V" battery directly
IVALIDATE Supply current in VALIDATE mode
ISLP(IDLE) Baseline supply current in SLEEP mode
ISLP_RX_O Additional supply current to SLEEP mode
Current on BAT pin
Current on BAT pin, no fault, COMH and
COML RX disabled, no HB TX
When COML OR COMH RX is on
35
µA
µA
base line
N
ISLP_TX_O Additional supply current to SLEEP mode When COML or COMH tone transmiter is
8
4
base line
on (HB tone)
N
Current on BAT pin, no fault, no
communication, Tone RX/TX is off
IACT(IDLE) Baseline supply current in ACTIVE mode
3
mA
Average current into VBAT when
BQ79600 transmits 14 bytes of data
(brdcast write 8 bytes of 0x00 into
address 0X1B)
Additional average current for one of
ICOMT
10
mA
BQ79600 daisy chain transmitters is on
Supplies (AVAO_REF, always on internal supply)
VAVAORE
AVAOREG voltage
VBAT > min VBAT
2.45
V
V
G
VAVDDREF
AVDDREF OV threshold
VBAT > min VBAT, hys = 130mV
2.8
3.1
_OV
Supplies (CVDD)
No external load, CSUPPLIES = 0.22µF,
ACTIVE mode
VCVDD
CVDD output voltage
4.9
5.3
5
5.5
4.5
4.6
5.1
5.65
4.65
4.75
V
V
V
V
VCVDD_O
CVDD OV rising threshold
CVDD UV falling threshold
CVDD UV rising threshold
Hys = 140mV
V
VCVDD_U
4.35
4.45
V_F
VCVDD_U
V_R
VCVDD_ILI
CVDD current limit
53
81
mA
µF
MIT
CCVDD
Capacitance range on CVDD pin
Not capacitor value
0.1
0.8
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VIO = 3.3V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Supplies (DVDD)
No external load, CSUPPLIES = 0.22µF,
ACTIVE mode
VDVDD
DVDD output voltage
1.75
1.9
1.8
1.85
2.1
V
V
V
V
VDVDD_O
DVDD OV rising threshold
DVDD UV falling threshold
DVDD UV rising threshold
Hys = 65mV
V
VDVDD_U
1.63
1.68
1.69
1.75
V_F
VDVDD_U
V_R
VDVDD_ILI
DVDD current limit
20
57
mA
µF
MIT
DDVDD
Load capacitance on DVDD pin
Not capacitor value
0.1
0.8
SNIFF DETECTOR
VVAL_THR Sniffer detector threshold, rising swing on Sniffer is enabled, and device is in
3.2
3.6
1
V
COMHP has to be larger than value
SHUTDOWN mode
_P
INH Driver
VDROP_IN When INH is pulled up, voltage drop from
IINH = -0.5mA
0.5
V
V
BAT to INH
H
VINH_DET Threshold to set [INH_STAT] to '1'
Reference Voltages
2.2
2.5
Digital I/Os (TX, RX, NFAULT)
VVIO_UV_
VIO UV rising
Hys = 200mV
3.1
0.1
V
V
V
V
R
VVIO–
VOH
VOL
VIH
VIL
Output as logic level high (TX)
Output as logic level low (TX)
FET pull up, Iout=1mA, VIO = 3.3V or 5V
0.1
FET pull down, Iout=1mA, VIO = 3.3V or
5V
Input as logic level high (RX), requirement
for user
0.75 x
VVIO
VIO = 3.3V or 5V
Input as logic level low (RX), requirement
for user
0.25 x
VVIO
VIO = 3.3V or 5V
V
RNFAULT NFAULT pull down impedance
Use 100kohm external pull up
1000
Ω
Daisy-chain Communication Bus
Common mode voltage (COML and
VDCCM_1
COMH)
ACTIVE mode
2.2
1
V
V
V
V
Common mode voltage (COML and
VDCCM_2
COMH)
SLEEP or VALIDATE mode
VCOMM_D COMM port data receiver threshold range
1.04
1.13
1.75
1.94
(VCOMP-VCOMN
VCOMM_T COMM port HB/FAULT tone receiver
threshold range (VCOMP-VCOMN
)
ATA
)
ONE
6.6 Timing Requirements
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER STATE TIMING
From VBAT (rising) > VPOR to device ready
to receive WAKE ping, ramp up VBAT
and VIO in 10µs
tPOR2COM
1
ms
M
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
From receiving WAKE ping (RX ping
going low-to-high) to device in ACTIVE
mode (ready to do µART /SPI
communication) (CVDD= 0.22µF
capacitor DVDD = 0.22µF capacitor)
tSU(WAKE_ Startup from SHUTDOWN/VALIDATE to
2
3.5
ms
ACTIVE mode
SHUT)
From receiving SLP2ACT ping (RX ping
going low-to-high) to device in ACTIVE
mode (ready to do UART /
tSU(SLP2A Startup from SLEEP to ACTIVE mode
260
600
µs
µs
(with Sleep2active ping)
CT)
SPIcommunication)
From receiving WAKE ping (RX ping
going low-to-high) to device in ACTIVE
mode (ready to do UART /
tSU(WAKE_ Startup from SLEEP to ACTIVE mode
(with WAKE ping)
SLP)
SPIcommunication)
From receiving WAKE ping (RX ping
going low-to-high) or
CONTROL1[SOFT_RESET]=1 to device
in ACTIVE mode (ready to do UART /SPI
communication)
Reset time from ACTIVE mode to
ACTIVE mode
tRST
600
µs
From receiving SLEEP entry condition to
enter in SLEEP mode
tSLP
From ACTIVE to SLEEP mode
100
5
µs
From receiving SHUTDOWN entry
condition to enter in SHUTDOWN mode
(CVDD<1.2V)
From ACTIVE/SLEEP/VALIDATE to
SHUTDOWN mode
tSHTDN
ms
tVALID_EN
From fault tone toggling on COM port to
DVDD hit above 1.75V
From SHUTDOWN to VALIDATE
10
ms
ms
TRY
tVALID_TIM time to validate fault tone before transition
Start from DVDD out of reset
150
720
to SHUTDOWN state
EOUT
INH Driver TIMING
After device enters VALIDATE, from first
tINH_DLY
µs
couplet of fault tone to INH pulled high
PING SIGNAL TIMING
tHLD_WAK From user perspective, WAKE ping low
VBAT > VPOR, RX pin (low-pulse width)
VIO = 3.3 or 5V
2.5
12.5
250
3
ms
ms
µs
time on MOSI/RX pin
E
From user perspective, SHUTDOWN ping VBAT > VPOR, RX pin (low-pulse
low time on MOSI/RX pin
tHLD_SD
tStA
width) VIO = 3.3 or 5V
From user perspective, SLEEPtoACTIVE
ping low time on MOSI/RX pin
VBAT > VPOR
300
Daisy-chain Communication Bus TIMING
COMM data Pulse width of data (half bit
time) for communiction
tPW_DC
230
10.67
0.97
250
11
1
270
11.33
1.03
ns
µs
µs
Time between pulses within a comm tone Transmit. From the beginning of a pulse
(HFO based).
tCOMTONE
until the beginning of the next pulse.
tCOMTONE
Comm tone pulse width(HFO based)
Transmit
_PLS
Only transmit HB tone, not FAULT
tone. From the beginning of a pulse until
the beginning of the next pulse.
Time between pulses within a fault tone
(LFO based).
tFLTTONE
10.3
11.5
12.7
µs
tFLTTONE_ Fault tone or HB tone pulse width (analog
1
16
64
µs
delay based)
PLS
HEARTBEAT: Number of pulses to detect
nHBDET
Detect
Detect
pulses
pulses
as a valid tone (dig counter)
nFTONEDE FAULT TONE: Number of pulses to detect
as a valid tone (dig counter)
T
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
HEARTBEAT: Period between
tHB_PERIO HEARTBEAT Burst (from the beginning of
360
400
440
1.1
ms
a HEARTBEAT to the beginning of the
D
next HEARTBEAT)
tHB_TIMEO HEARTBEAT: Timeout to considered as
0.9
1
s
not receving HEARTBEAT
UT
HEARTBEAT: If HEARTBEAT is received
tHB_FAST within this time, it is considered receving
HEARTBEAT too fast
200
ms
tFTONE_PE Defined by BQ7961X, FAULT TONE:
From the beginning of a FAULT TONE to
the beginning of the next FAULT TONE
50
24
ms
µs
Period between FAULT TONE Burst
RIOD
tFT_LATEN
From the time device receives the tone to
the time asserts NFAULT
Fault Tone latency in Base Device
CY
I/O TIMING (TX, RX, NFAULT)
tRISE_TX Rise Time
tFALL_TX Fall Time
CLOAD = 100pF, VIO=3.3V or 5V
CLOAD = 100pF, VIO=3.3V or 5V
15
15
ns
ns
tFALL/
RX pin rise/fall time
100
1.5
ns
RISE_RX
UART TIMING
UARTER UART TX/RX baud rate (either 250K or
R_BAUD 1Mbps) error
%
–1.5
15
tUART(CLR
UART Comm Clear low time
20 bit period
bit period
)
tUART(RX_ UART high time after Comm Clear, before
1
sending Clear or Reset
HIGH)
SPI TIMING
SCLK
SPI clock freq
2
6
MHz
bit
nSPI(CLR) SPI Comm Clear low time
8
tSPI_R
tSPI_F
SPI clock rising edge
SPI clock falling edge
25% to 75%
25% to 75%
10
10
ns
ns
tSPI_CLKH SPI clock high time
tSPI_CLKL SPI clock low time
70
70
ns
ns
Max SPI_RDY service interval. This time
doesn't apply if total response bytes
(payload + overhead) is less than 256
bytes
Read SCLK = 6MHz, with 30% SPI BUS
idle time
t8
1
ms
t9
From nCS (25%) to SCLK rising (75%)
From SCLK falling (25%) to nCS (75%)
500
500
ns
ns
t10
From nCS rising(75%) to nCS
falling(25%)
t11
Don't drop nCS while SPI_RDY is low
1
µs
ns
Timing is defined at device pins, exclude
propergation delay of PCB traces (from
device perspective)
From nCS falling (25%) to stable
MISO(L:20% H:80%)
t12
42
42
42
Timing is defined at device pins, exclude
propergation delay of PCB traces (from
device perspective)
From SCLK falling (25%) to stable
MISO(L:20% H:80%)
t13
ns
ns
Timing is defined at device pins, exclude
propergation delay of PCB traces (from
device perspective)
From nCS rising (75%) to MISO drive to
'1' (80%)
t14
tSU
tH
Setup time, refer to 75% of SCLK rising
Hold time, refer to 75% of SCLK rising
20
20
ns
ns
SNIFF DETECTOR
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Number of pulses needed (digital counter) Sniffer is enabled, and device is in
nVALIDATE
64
pulses
to transition to validate mode
SHUTDOWN mode
Timer length. Once timer expired, it resets Sniffer is enabled, and device is in
tSNIFFIDLE
20
52
µs
the 64 counter
OSCILLATOR
SHUTDOWN mode
fHFO
HFO frequency
31.52
32
32.48
35
MHz
µs
Reset digital if HFO is stuck or period is >
than the watchdog timer
tHFOWDG HFO watchdog time
fLFO
LFO frequency
235.8
262
288.2
35
kHz
µs
Reset digital if LFO is stuck or period is >
than the watchdog timer
tLFOWDG LFO watchdog time
6.7 Typical Characteristics
图6-1. Typical COMHN and COMHP characteristic
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7 Detailed Description
7.1 Overview
The BQ79600-Q1 is a bridge IC designed to interface between microcontroller (MCU) and TI battery monitoring
ICs (BQ7961X-Q1 family). It translates between daisy chain interface and SPI/UART interface. It is fully
compatible with BQ7961X-Q1 family. When working with BQ7961X-Q1 family, BQ79600-Q1 supports automatic
host wakeup through INH pin when unmask fault is detected in high voltage battery pack. Details can be found in
节 7.3.5 and 节 7.3.4. For convenience of traceability, each device is marked by DIE IDs and PARTID which
could be found in 节7.5 Register Summary Table.
7.2 Functional Block Diagram
BAT
VIO
AVAOREF
REFSYS/
Ping
Detect
AVDDREF
Powermode
Control
INH
CVDD
VIO
DVDD
CVDD
OSC
MOSI/RX
MISO/TX
32MHz
262KHz
DVDD
DVDD
nCS
SCLK
RX
COMHP
COMHN
COMLP
COMLN
nUART/SPI (SPI_RDY)
TX
Digital
Core
Daisy Chain
NFAULT
TX
RX
图7-1. Functional Block Diagram
7.3 Feature Description
7.3.1 Functional Modes and Power Supply
7.3.1.1 Power Mode
The device has four power modes plus an Complete Off state. The functions supported under each power
modes are summarized in 表7-1 and the power state diagram is shown in 图7-2.
• COMPLETE OFF: The voltage at the BAT pin is less than VBAT min, and all circuits are powered off.
• SHUTDOWN: The lowest power mode. Without VIO, device can only transition to VALIDATE. (If Sniffer used)
• SLEEP: A low power mode. Transition to ACTIVE is much faster compared to SHUTDOWN.
• ACTIVE: Full power mode. Device can communicate between MCU and daisy chain.
• VALIDATE: This state is to validate if there is real fault tone from stack devices. If fault tone is validated, drive
INH pin towards VBAT (INH pin is latched until cleared by user). Device goes back to SHUTDOWN if
tVALID_TIMEOUT or sleep timer expires. (tVALID_TIMEOUT timer is reset if fault tone is detected, detecting
Heartbeat tone doesn’t reset timer.) This state is bypassed if 节7.3.5 is disabled (by default). Once entered
this state, a status bit [VALIDATE_DET] is set in next ACTIVE such that host knows what happened. Without
VIO, device can only transition to SHUTDOWN. NFAULT pin is low in this mode.
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表7-1. Functions Summary
SHUTDOWN
FUNCTIONAL BLOCK(1)
VALIDATE(3)
SLEEP
ACTIVE
Data Communication RX/TX
Time out
If VIO_UV_R = 1
Comm Timeout
Sleep Timeout
Sleep Timeout
Tone RX (HB/Fault)
Depends on [DIR_SEL] and [TONE_RX_EN]
√
Tone TX (WAKE/ SLP2ACT/
SHUTDOWN/ HWRST) (5)
√
Tone TX (HB)
Depends on [DIR_SEL]
and [HB_TX_EN]
COM embedded fault
Sniff detector on COM*
[FCOMM_EN] =1
If host enables this
feature (2)
Wake/Shutdown Ping
SLP2ACT Ping
NFAULT Driver
LFO
If VIO_UV_R = 1
If VIO_UV_R = 1
If VIO_UV_R = 1
If VIO_UV_R = 1
√
√
√
√
√
√
√
√
HFO
INH Driver
INH_DIS[1:0] != 2’
Holds State
INH_DIS[1:0] != 2’b11
√
b11(4)
CVDD/DVDD
√
√
√
√
√
√
Thermal Shutdown
(1) Once device in SLEEP/ACTIVE, losing VIO doesn’t directly cause change of state, it causes loss of data communication to MCU.
(2) If host writes [SNIFDET_EN] =1 & [SNIFDET_DIS] = 0 in ACTIVE mode, even device shuts down, enable signal is still valid. Sniff
detector is enabled or disabled by a latch powered by always on power supply.
(3) This mode is bypassed if sniff detector is not enabled, see register DEV_CONF1.
(4) INH can only be triggered by [INH_SET_GO] bit in ACTIVE.
(5) Device does not recognize WAKE/ SLP2ACT/ SHUTDOWN/ HWRST tone sent by stack devices.
VBAT < Min VBAT
COMPLETE OFF
1. Set CONTROL1[GOTO_SLEEP] = 1, OR
2. Long comm timeout occurs w/
COMM_TIMEOUT[CTL_ACT] = 0
VBAT < Min VBAT
VBAT > Min VBAT
SLEEP MODE
1. SleeptoActive Ping, OR
2. Receive WAKE Ping
1. Thermal shutdown, OR
2. SHUTDOWN Ping, OR
3. Sleep timer expires
Wake Ping
VALIDATE MODE
(bypassed by default)
ACTIVE MODE
1. Receive WAKE Ping, OR
2. Set CONTROL1[SOFT_RESET] = 1
1. Thermal shutdown, OR
2. SHUTDOWN Ping, OR
SNIFF Det = 1
if enabled
3. tVALID_TIMEOUT
4. Sleep timer expires
Device reset
expires, OR
1. Thermal shutdown, OR
Wake Ping
2. Long comm timeout occurs w/
COMM_TIMEOUT[CTL_ACT] = 1, OR
3. Receive SHUTDOWN Ping, OR
SHUTDOWN MODE
4. Set CONTROL1[GOTO_SHTUTDOWN] = 1
图7-2. Power State Diagram
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7.3.1.2 Pings
A “ping” is a specific signal pattern to change power mode of BQ79600-Q1. There are total of 3 different
pings:
timing follows SPI physical
layer requirement
Hardwired to GND
nCS
nCS
RX
MOSI
WAKE Ping high-low-high
tHLD_WAKE
tHLD_WAKE
RX
RX
MOSI
MOSI
SHUTDOWN Ping high-low-high
tHLD_SD
tHLD_SD
1us: 1Mbps(default)
4us: 250Kbps
SLEEPtoACTIVE Ping high-low
tStA
SPI mode (see notes below for SCLK control)
tStA
UART mode
图7-3. Communication Pings
• In SPI mode, ping can be sent without SCLK toggling or host can treat sending a ping like sending a series of
logic ‘0’(drive nCS and SCLK properly, refer to SPI physical layer requirement, 节7.3.2.1.2.2).
• Device does not transmit any tones to stack devices due to the receiving of pings.
• After sending in SHUTDOWN ping, host has to wait tSHTDN before sending another ping.
• If nCS = ‘1’, all of the pings above are ignored by the device.
备注
If device is shut down through SHUTDOWN ping (COMH RX and COML RX are disabled at next
wake up), host needs to send 1st WAKE ping, wait tSU(WAKE_SHUT), and then send 2nd WAKE ping.
表7-2. Device Behavior when SLP2ACT Ping is Sent
UART
SPI WITH SCLK TOGGLING
SPI WITHOUT SCLK TOGGLING
ACTIVE
SLEEP
[COMMCLR_DET]=1, [STOP_DET] =1
[COMCLR_ERR]=1,
[COMMCLR_DET]=0
[FMT_ERR]=1, [COMCLR_ERR]=0,
[COMMCLR_DET]=0
[COMMCLR_DET]=1, [STOP_DET] =0,
transitions to active mode
[COMCLR_ERR]=0,
[COMMCLR_DET]=0, transitions to
active mode
[FMT_ERR]=0, [COMCLR_ERR]=0,
[COMMCLR_DET]=0, transitions to active
mode
7.3.1.3 SPI/UART 选择
通过硬件选择 SPI 或 UART 接口:通过电阻器将 nUART/SPI 引脚连接到 VIO(SPI 接口),或连接到 GND
(UART 接口)。每次从关断模式切换到活动模式时,器件都会确定 UART 或 SPI 模式。在切换到活动模式之
前,所选模式被锁定。VIO 必须高于 VVIO_UV_R。活动模式下,nUART/SPI 引脚用作 SPI_RDY 的输出指示。更
多信息请查阅节7.3.2.1.2.2.1。
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7.3.1.4 Digital Reset
Digital reset is when digital core of the device in reset mode. It is not a power mode. Once device comes out of
digital reset, [DRST] bit is set to '1', registers that are not included in NVM are set to RESET VALUE, registers
included in NVM would be NVM program value. There are several conditions in which the device will go through
a digital reset:
• A WAKE ping is received.
• The CONTROL1 [SOFT_RESET] = 1 command is sent in ACTIVE mode.
• Power supply faults. DVDD UV or CVDD UV is detected.
• A HFO or LFO watchdog fault will reset the digital.
7.3.1.5 Power Mode in BMS System
It is recommended to follow the power state combinations below to save system level power.
表7-3. Power Mode Combination Summary
STACK MONITORING IC
ACTIVE
BQ79600-Q1
ACTIVE
COMMENT
Recommended
Recommended
Recommended
Recommended
SLEEP
SLEEP
SLEEP
SHUTDOWN
SHUTDOWN
SHUTDOWN
Other combinations
Not recommended
7.3.1.6 Power Supply
This section provides an overview of each supplies for both user cases: without using Reverse Wakeup and with
using Reverse Wakeup. See the 节7.3.6 for diagnostic control and fault detection on the power supplies block.
表7-4. Power Supply Summary
NAME
W/O REVERSE WAKEUP USER CASE
W/ REVERSE WAKEUP USER CASE
VIO
BAT
This supply is powered by regulated 3.3V or 5V from SBC (PMIC), it powers UART/SPI interface pins.
This supply is powered by regulated 5V from SBC (PMIC). This supply is powered by unregulated 12V battery.
AVAOREF
AVDDREF
DVDD
This supply is generated from VBAT. It is always on if VBAT exists. It powers REFSYS and Power mode control
block.
This supply is derived from AVAOREF. AVDDREF and AVAOREF are connected by a switch, the switch is open in
SHUTDOWN mode.
This supply is generated by the internal DVDD LDO. It is the supply for the digital circuits. It takes the input voltage
from CVDD and generates a nominal 1.8V. It will not be used to power any external circuit.
CVDD
This supply is powered by regulated 5V from SBC(PMIC). It This supply is generated by the internal CVDD LDO.
is the supply for daisy chain interface.
It is the supply for the daisy chain interface (or vertical
interface, VIF). It takes the input voltage from VBAT
and generates a nominal 5V. It will not be used to
power any external circuit.
7.3.1.7 Shutdown
Power Mode Transition Example
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ACTIVE
Sleep
Transition Transition
ACTIVE
SHUTDOWN
Complete Off
Transition
Transition
Min VBAT
BAT
AVAOREF
VIO_UVZ
VIO ramp time is system dependent and not specified
VIO
tPOR2COMM
AVDDREF
CVDD
DVDD
tSU(WAKE_SHUT)
Communication
Ready
tSU(SLP2ACT)/
tSU(WAKE_SLP)
tSLP
e
e
d
o
g
d
n
o
time
i
p
m
m
e
E
p
K
v
i
t
e
e
A
l
c
S
W
A
o
o
d
t
t
n
e
n
v
i
o
i
e
c
o
i
t
i
t
i
s
n
s
Re
n
a
a
r
r
T
T
图7-4. Shutdown -> Active -> Sleep -> Active
Transition to Active then to Validate
as a status bit indicates device wakes
up due to SNIF_DET
VALIDATE
SHUTDOWN
ACTIVE
Complete Off
Transition
Transition
Transition
Min VBAT
BAT
AVAOREF
VIO
tDepend on system
INH enables PMIC
which enables VIO
tPOR2COMM
AVDDREF
CVDD
DVDD
tFTONE_PERIOD
tFTONE_PERIOD
Fault tones from
stack device
on COMM* pins
tVALID_ENTRY
tINH_DLY
SNIF_DET
(internal signal)
INH
time
图7-5. Shutdown -> Validate -> Active
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7.3.2 Communication
This device is used as a bridge (base) device in daisy chain configuration, as showed in figure below. It
communicates with MCU through UART or SPI and communicates with stack devices through daisy chain
(proprietary interface). MCU always initiates communication with a Command frame. In the system, BQ devices
would never send data back to MCU before MCU requests. And MCU needs to wait all expected response
frames before sending next command frame. Thus, communication scenarios can be put into 2 categories:
• MCU sends Write Command frames to BQ devices. Write Command frames don't incur Response frame.
• MCU sends one Read Command frame to BQ devices and waits till all Response frames are received.
Half-duplex
Half-duplex
Half-duplex
SPI or UART
(Asynchronous
proprietary protocol )
(Asynchronous
proprietary protocol )
SPI_RDY
SCLK
zCS
BQ79600
(Base Device)
MCU
BQ796XX monitoring IC
(Stack N)
BQ796XX monitoring IC
(Stack 1)
Command Frame
Response Frame
Command Frame
Response Frame
Command Frame
Response Frame
MOSI/RX
MISO/TX
COM
COM
COM
COM
Address N
Address 1
Address 0
Both Command and Response Frames shall
follow the Transaction Frame Structure
图7-6. System Communication Diagram
Rest of the section talks about how data and tone are communicated among host, bridge, and stack devices: 节
7.3.2.1 (节7.3.2.1.1 and 节7.3.2.1.2 protocol), 节7.3.2.2. It also talks about 节7.3.2.3 and 节7.3.2.4.
7.3.2.1 Data Communication Protocol
7.3.2.1.1 Frame Layer
The communication frame is defined in figure below. It is made up of 5 types of information: initialization
character (INIT), device address characters, register address character, data character(s) and CRC characters.
Each character is transmitted at UART/ SPI/ Daisy Chain physical level, whose format is defined in following 节
7.3.2.1.2 section. There are 3 types of transaction frames: Read Command Frames, Write Command Frames
and Response Frames. They follow the structure in the figure below.
INIT [7:0]
DEV ADR [7:0]
REG ADR [15:0]
DATA byte(s)
CRC [15:0]
Frames
Single Device Read
INIT
Always 0x80
DEV ADR REG ADR
Y
DATA
# of byte requested (max value
127, meaning 128)
CRC
Y
Read
Command
Frame
Y
Stack Read
Always 0xA0
Always 0xC0
Y
N
N
Y
N
N
N
Y
Y
Y
Y
Y
Y
Y
Broadcast Read
Single Device Write
Stack Write
Y
Y
Write
Command
Frame
Actual payload (1-8 bytes)
Y
Y
Broadcast Write
Broadcast Write
Reverse (5)
Y
Y(5)
Y
Y(5)
Y(5)
Response Frame
Y
Y
Y
Actual payload (1-128 bytes)
Y
图7-7. Command/Response Frame Structure
Notes:
• When BQ79600-Q1 is used as bridge device, to read BQ devices information, host SHALL NOT use
Broadcast Read command but only Single Device Read or Stack Read. The reason is BQ79600-Q1 register
address does not overlap with stack devices, it would only return 0x00 to Broadcast Read command.
• For Stack Read command, the response is broken into individual response frames from each device
addressed. Each device (address N) in the stack waits until the device above it (address N+1) responds
before device N sends its own data back.
• After a read command frame is transmitted, the host must wait for all expected responses to return (or
timeout: tWAIT_READ_MAX ) before initiating a new command frame.
• A response frame is not mandatary. A response frame is only received after a read command frame.
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• Broadcast Write Reverse command frame should only be used to config [DIR_SEL] bit, not for any other
purposes. INIT byte is 0xE0, Reg address byte is 0x309 (BQ7961X-Q1), data byte is 0x80.
• Bytes received on COMH/COML are NOT propagated up to the stack; while bytes received on the SPI/UART
are propagated to COMH or COML depending on [DIR_SEL].
• Even if there is a byte error, data is still forwarded from VIF to SPI (buffer)/UART; if there is a byte error, data
doesn’t forward from SPI/UART to VIF.
Command Frame
Description
Response Frame
Description
Command/Response Frame
Description
Bit
Bit Name
Bit Name
Bit
7
Bit Name
RSVD
RSVD
7
FRAME_TYPE
1 = Command Frame
FRAME_TYPE
0 = Response
Frame
Should always write —0“
6
Should always write —0“
Set the device address range from
0x00 to 0x3F
6
5
REQ_TYPE
000 = Single Device Read
001 = Single Device Write
010 = Stack Read
RESPONSE_BYTE
Number of the data
bytes
5:0 Device Address
011 = Stack Write
0x00 = 1 byte
0x01 = 2 bytes
:
Command/Response Frame
Description
100 = Broadcast Read
101 = Broadcast Write
110 = Broadcast Write Reverse
111 = RSVD (1)
4
Bit
7:0 Register
Address (MSB)
7:0 Register
Address (LSB)
Bit Name
0x7F = 128 bytes
Target or beginning of the register
address
3
2
1
0
RSVD
RSVD. This bit is ignored
Target or beginning of the register
address
DATA_SIZE
Number of data bytes, excluding
device address, register
address or CRC
Bit
7:0 Data Byte[0]
……
7:0 Data Byte [n]
Bit Name
Description
Data Byte[0]
……
000 = 1 byte
001 = 2 bytes
:
…
Data Byte[n]
111 = 8 bytes
Command/Response Frame
Bit
Bit Name
Description
7:0 CRC (MSB)
CRC-16-IBM polynomial (x16
+ x15 + x2 + 1 or
11000000000000101)
with 0xFFFF initialization
CRC-16-IBM polynomial (x16
+ x15 + x2 + 1 or
7:0 CRC (LSB)
11000000000000101)
with 0xFFFF initialization
图7-8. Frame Byte Definition
Notes:
• INIT character: (1) No function to this selection, but this selection sets the [RC_IERR] error flag.
• Device Address character: Bit 6 and 7 are reserved; 0x4F to 0xFF is decoded as 0x3F by device.
• Register Address characters: Register addresses are two bytes in length. They indicate the targeted register
address on a single byte read/write, or the beginning of the register address on a multi-byte read/write. If an
invalid register address is set on a write command, the command will be ignored. If an invalid register
address is set on a read command, a 0x00 will be returned as response.
• Data characters can be:
– Single data byte, it represents number of registers requested in Read Command Frame. The BQ79600-
Q1 supports up to 128 byte reads. The valid data byte for read command frame is 0b0000000 -
0b1111111. The MSB of the data byte is ignored for read command frames. For example, 0b10011001 is
read as 0b00011001 and returns data from 26 registers.
– Actual payload in Write Command Frame (max 8 byte) or Response Frame (max 128 byte).
• CRC characters:
– The CRC value is checked as the first step (assume no physical layer error, no [RC_IERR], no [RC_SOF],
no [RC_BYTE_ERR]) after receiving the communication frame. If the CRC is incorrect, the entire frame is
discarded and not processed. Any additional frame errors are not checked.
– The frame with CRC error is still transferred up/down the stack. Every device processing this frame will
also detect a CRC error. Hence, it is possible to have multiple devices indicating CRC fault on the same
communication frame. If a CRC error occurs in the response frame from address N+1, device N does
NOT append its own message and an invalid CRC fault is generated. For example, if device 15 finds
response frame from device 16 has invalid CRC, device 15 doesn’t send its own response frame.
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– The device uses a CRC (cyclic redundancy check) to protect data integrity during transmission. The
device uses the CRC-16-IBM polynomial (x16 + x15 + x2 + 1 ) with 0xFFFF initialization.
7.3.2.1.1.1 Calculating Frame CRC Value
The CRC calculation by the transmitter is in bit-stream order across the entire transmission frame (except for the
CRC). When determining bit-stream order for implementing the CRC algorithm, it is important to note that
protocol bytes transmit serially, least-significant bit first. 图7-9 illustrates the bit-stream order concept.
图7-9. Bit-Stream Order Explanation
The CRC (0x0000) is appended to the end of the bit-stream. This bit-stream is then initialized by XOR'ing with
0xFFFF to catch any leading 0 errors. This new bit-stream is then divided by the polynomial (0xC002) until only
the 2-byte CRC remains. During this process, the most significant 17 bits of the bit stream are XOR’d with the
polynomial. The leading zeroes of the result are removed and that result is XOR’d with the polynomial once
again. The process is repeated until only the 2-byte CRC remains. For example:
Example 1: CRC Calculation Using Polynomial Division
Command Frame = 0x80 00 02 0F 0B (0b1000 0000 0000 0000 0000 0010 0000 1111 0000 1011)
Command Frame in bit stream order
1101 0000)
= 0x01 00 40 F0 D0 (0b0000 0001 0000 0000 0100 0000 1111 0000
After Initialization (XOR with 0xFFFF) = 0b1111 1110 1111 1111 0100 0000 1111 0000 1101 0000
1111 1110 1111 1111 0100 0000 1111 0000 1101 0000 0000 0000 0000 0000 #append 0x0000 for CRC
1100 0000 0000 0010 1 #XOR with polynomial
0011 1110 1111 1101 1100 0000 1111 0000 1101 0000 0000 0000 0000 0000
11 1110 1111 1101 1100 0000 1111 0000 1101 0000 0000 0000 0000 0000 #delete leading zeros from
previous result
11 0000 0000 0000 101 #XOR with polynomial
00 1110 1111 1101 0110 0000 1111 0000 1101 0000
……
……
……
1100 0110 0000 0001 0000 0000
1100 0000 0000 0010 1 #XOR with polynomial
0000 0110 0000 0011 1000 0000
110 0000 0011 1000 0000
110 0000 0000 0001 01 #XOR with polynomial
000 0000 0011 1001 0100
0000 0011 1001 0100 #CRC result in bit stream order
1100 0000 0010 1001 #final CRC result in normal order
CRC final 0xC029
7.3.2.1.1.2 Verifying Frame CRC
There are several methods for checking the CRC of a frame. One method is to simply calculate the CRC for the
transmitted command except the last two bytes (CRC bytes) using the method described in the previous section,
and then compare that result with the transmitted CRC bytes. A more simple option is to run the entire
transmission through the CRC algorithm. If the CRC is correct, the result is 0000. In this case, the initial zero
padding of the bit-stream with 16 zeroes is not necessary. Using the previous result and running through the
algorithm produces the following results:
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Example 1: CRC Verification Using Polynomial Division:
Command Frame = 0x80 00 02 0F 0B (0b1000 0000 0000 0000 0000 0010 0000 1111 0000 1011)
CRC to Check = 0xC029
Command Frame w/ CRC in bit stream order = 0x80 00 02 0F 0B C0 29 (0b1000 0000 0000 0000 0000 0010
0000 1111 0000 1011 0000 0011 1001 0100)
After Initialization (XOR with 0xFFFF) = 0b0 1111 1110 1111 1111 0100 0000 1111 0000 1101 0000 0000
0011 1001 0100
1111 1110 1111 1111 0100 0000 1111 0000 1101 0000 0000 0011 1001 010 #delete leading zeros from
previous result
1100 0000 0000 0010 1 #XOR with polynomial
0011 1110 1111 1101 1100 0000 1111 0000 1101 0000 0000 0011 1001 0100
11 1110 1111 1101 1100 0000 1111 0000 1101 0000 0000 0011 1001 0100 #delete leading zeros from
previous result
11 0000 0000 0000 101 #XOR with polynomial
00 1110 1111 1101 0110 0000 1111 0000 1101 0000 0000 0011 1001 0100
……
……
……
1100 0110 0000 0010 1001 0100
1100 0000 0000 0010 1 #XOR with polynomial
0000 0110 0000 0000 0001 0100
1 1000 0000 0000 0101 00
1 1000 0000 0000 0101 #XOR with polynomial
0 0000 0000 0000 0000 00
0x0000 #verfiy that CRC checks out valid
备注
The result of ‘0b0000 0000 0000 0000’for the CRC indicates a successful check.
7.3.2.1.2 Physical Layer
7.3.2.1.2.1 UART
Communication between host and BQ79600-Q1 can be configured to UART mode, refer to 节 7.3.1.3. The
UART interface baud rate is default to 1Mbps at power up or digital reset. The UART interface follows the
standard serial protocol of 8-N-1 (see 图7-10), where it sends information as a START bit, followed by eight data
bits, and then one STOP bit. The STOP bit indicates the end of the byte. The protocol also supports two STOP
bits. When the device is configured as 2 stop bits ([TWO_STOP_EN] = 1, stack devices should also be set as
two stop bits), the UART response frame from the device to MCU will always return with 2 stop bits.
The UART sends data on the TX pin and receives data on the RX pin. When idle, the TX and RX are high. TX is
always pulled to VIO internally while in ACTIVE or SLEEP mode, whether enabled or disabled.
The UART interface is strictly a half-duplex interface. While transmitting, any attempted communication on RX is
ignored. The only exception is 节7.3.2.1.2.1.2.
1 or 2 bit
period
LSB
bit period = 1/ baud rate
MSB
. . .
. . .
START
bit0
bit1
bit2
bit3
bit4
bit5
bit6
bit7
STOP
Start is
ꢀoÁꢀÇ• Z0[
Stop is
ꢀoÁꢀÇ• Z1[
图7-10. UART Character Definition
Note: User can change baud rate using register bit [UART_VIF_BAUD] for debug purpose.
7.3.2.1.2.1.1 TX HOLD OFF
UART transmitter is configurable to wait a specified number of bit periods after the last bit reception of Single
Device read command frame from host before starting transmitting Response Frame using the TX_HOLD_OFF
register, as showed in 图 7-11. This provides time for the host to switch the bus direction at the end of its
transmission.
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备注
Host does not need to configure register TX_HOLD_OFF in BQ79600-Q1 if Stack Read command is
used. Host shall not use Broadcast Read Command.
Single Device Read
Command frame
TX_HOLD_OFF
Response frame
Last bit of the command
received at RX pin
1st bit of the response
frame sent on TX pin
Time
图7-11. TX HOLD OFF Timing Diagram
7.3.2.1.2.1.2 UART COMM CLEAR
备注
Comm Clear concept only applies to bridge device not stack device.
Comm Clear command is used to clear the receiver and instruct it to look for a new start of frame. (Resync up
with host) The next byte following the Comm Clear is considered a "start of frame" byte. The digital receiver
continuously monitors the RX line for Comm Clear condition which is RX pin is held low for tUART (CLR) bit
periods, showed in 图7-12.
When Comm Clear is detected, FAULT_COMM1 [COMMCLR_DET] and FAULT_COMM1 [STOP_DET] are set.
[STOP_DET] flag is set because the Comm Clear timing violates the typical byte timing and the STOP bit is seen
as '0'. The only exception to this is when a COMM CLEAR is sent while BQ79600-Q1 is in sleep. If this is the
case, there is no STOP error flag.
1 bit period
RX pin
Command frame
tUART(CLR)
tUART(RX_HIGH)
图7-12. Comm Clear Timing
7.3.2.1.2.2 SPI
备注
为支持菊花链(异步协议)和SPI(同步协议)之间的通信,BQ79600-Q1 需要使用节7.3.2.1.2.2.1。
主机与 BQ79600-Q1 之间的通信可配置为 SPI 模式。请参阅 节 7.3.1.3。主机始终是 SPI 主设备,而 BQ79600-
Q1 始终是从设备。在物理层,SPI 是一个五引脚接口,包括4 个通用引脚(nCS、SCLK、MOSI 和MISO)以及
SPI_RDY。在 SPI 接口上,每个位在时钟从低电平到高电平转换时被捕捉,在时钟从高电平到低电平转换时被传
输,一个字节包括 8 位,如图 7-13 所示。请注意,MISO 在空闲模式下被驱动为高电平。如果 MCU 与多个从器
件通信,请在BQ79600 MISO 和MCU 之间添加一个三态缓冲器。
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t9
t10
t11
nCS
tSPI_CLK
tSPI_CLKL
SCLK
tSPI_CLKH
tSU
tH
tH
Hi or Low
Hi or Low
LSB_n
MSB_n
MSB_n
MOSI
MISO
t14
t12
t13
LSB_n
MSB_n+1
t>0
SPI_RDY
SPI_RDY high indicates host
can read/write predefined
number of bytes
SPI_RDY may go low (and it is ok)
before finish read/write this batch
One Byte
Bit 0
Bit 7
MSB
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
LSB
Bit 7
bit period = tSPI_CLK
图7-13. SPI 时序和字节定义
备注
虽然SPI 接口在物理层是全双工的,但在帧层,它实际上是半双工,因为菊花链仅支持半双工。这意味
着在给定的时间,MCU 和器件之间只传输一个命令帧或响应帧。
• 当命令从MCU 发送到器件时,BQ79600 TX FIFO(2 个缓冲器)应为空,0xFF 发送到MCU
(FIFO 诊断模式下除外)。
• 当响应从器件发送到MCU 时,MCU 应在0xFF 中计时
• 主机应在2MHz 至6MHz 范围内提供SPI 时钟。此范围由FIFO 的预定义大小确定。即使SPI 能够以6MHz
频率运行,它也不会增加整个系统的吞吐量,因为菊花链速度仍会限制吞吐量。
• 为避免菊花链接口上的冲突,MCU 必须等到接收到所有预期的响应帧(或等待计时器到期)后再向BQ79600
发送另一个命令帧。请参阅图7-16 中的流程图。
• 当不向器件发送命令帧时,主器件应始终将MOSI 驱动为‘1’。
• 主机读取模式:从主机角度来看,读取模式介于有效读取命令的第一个字节和接收到的最后一个预期字节之
间。
• 器件读取模式:从有效读取命令的第一个字节开始,当TX FIFO 超时且FIFO 为空时,器件为读取模式。器件
读取模式是主机读取模式的子集。(用于理解通信故障寄存器0x2301 和0x2302 的概念)
• 除Comm Clear 外,器件在退出器件读取模式之前拒绝来自MOSI 的任何数据。
• TX FIFO 超时后,SPI 模块拒绝来自菊花链(堆栈器件)或自身的任何数据List item.referenceTitle,直到再次
进入器件读取模式。
• 对于命令帧,器件使用nCS 的下降沿指示帧开始,上升沿指示帧结束。MCU 需要在整个帧(最多14 个字
符)内切换并保持nCS 处于低电平,在该帧结束时将nCS 切换回高电平。当nCS 为低电平时,冻结SCLK
是合法的。不支持命令帧中间的nCS 脉冲。
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• 对于响应帧,nCS 无需始终保持低电平,尽管它可以像发送命令帧一样。主机可以将nCS 切换为高电平,在
帧中间(字节边界处)停止SPI 读取。
nCS
IDLE
frame A
IDLE
frame B
IDLE
frame C
IDLE
Data
Supported in command frame and response frame
nCS
IDLE
1st half of frame A
IDLE
2nd half of frame A
IDLE
Data
Only Supported in response frame
图7-14. 发送帧时的nCS 行为
7.3.2.1.2.2.1 SPI_RDY 和SPI FIFO
SPI_RDY 是一个输出信号,指示主机数据已准备好进行通信。SPI FIFO 图7-15 是器件中用于临时存储传入/传出
数据的缓冲器。需要它们的原因如下:
• 菊花链波特率默认约为1Mbps,一旦主机请求大量数据,例如400 字节,器件的菊花链接收器会尝试将其发
送回主机,但由于器件不具有SCLK,无法控制何时读取数据。因此,当主机未读取数据时,器件需要将传入
的数据存储在TX FIFO 中。即使主机正在读取数据,仍需要FIFO 来处理SPI 和菊花链之间的波特率差异。
• 由于TX FIFO 的深度有限,因此需要SPI_RDY。如果主机请求的数据超过256 字节,而主机未及时为器件提
供服务(读出数据),则会发生数据溢出。SPI_RDY 指示主机已准备好读取或写入一定数量的数据,例如,
如果主机请求129 字节,SPI_RDY 第一次会标记128 字节就绪,第二次标记1 个字节就绪。有关详细信息,
请参阅表7-5。
COMH/COML Pins
Aprox. 1Mbps
Asynchronous
Daisy Chain Transceiver
Aprox. 1Mbps
Asynchronous
Aprox. 1Mbps
Asynchronous
Ping Buffer
128 bytes
Pong Buffer
128 bytes
32 bytes
RX FIFO
TX FIFO
BQ79600-Q1
For simplicity, the drawing only shows
dataflow from/to stack devices, it
ꢀ}ꢁ•v[š •Z}Á šZꢁ ꢀꢂšꢂ(o}Á }( Œꢁꢂꢀ (Œ}u/
write to BQ79600 itself.
SCLK: 2MHz -
6MHz
MOSI
MISO
图7-15. SPI FIFO 简化图
TX FIFO 包含两个128 字节缓冲器(一起用作乒乓缓冲器)。
1. Ping 缓冲器填满时,Pong 缓冲器应为空,以便存储传入的数据。
2. 填写Pong 缓冲器时,正在读取Ping 缓冲器。一旦被读取,缓冲器中的每个字节被复位为0xFF。在Pong 缓
冲器填满之前,Ping 缓冲器应为空(读出)。
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3. Pong 缓冲器填满后,Ping 缓冲器会接替上来。
4. 器件执行此循环(步骤1 至3),直到接收到所有响应数据。
5. 主机必须以足够快的速度读取TX FIFO,以便在Pong (Ping) 缓冲器写满之前读取Ping (Pong) 缓冲器并准备
好存储来自菊花链的数据。
表7-5. SPI_RDY 行为总结
案例编
号
高-> 低
a
低-> 高
b
主机写
入
1
2
当RX FIFO >= 16 字节时,在2μs 内。
在器件接收到读取命令帧的第1 个字节后5μs 内。
当RX FIFO < 8 个字节时,在a1 事件后2μs 内。
Ping (pong) 缓冲器填满后1us 内。
发生TX FIFO 超时
正在读取的TX 缓冲器变为空(在向外传输缓冲器中最后一个字节
主机读
取
注意:当SPI_RDY 为高电平时(主机正在读取TX
FIFO 时),可能会发生TX FIFO 超时。在这种情况
下,在事件a3 之后,SPI_RDY 会保持低电平大约
2μs,然后恢复为高电平。
的最后一位之前)
注意:一旦变为低电平,SPI_RDY 无论如何都会保持低电平
2μs。
3
注:
• SPI_RDY 仅设置标志,不控制数据流入或流出设备。
• 一旦进入设备读取模式,设备将拒绝来自主机的COMM CLEAR 以外的任何数据,a1 和b1 不再适用。
• TX FIFO 超时:SPI 模块从菊花链或BQ79600-Q1 本地接收到一个字节的数据后,计时器启动;如果30μs
内没有收到数据,则该计时器超时。
7.3.2.1.2.2.2 Flow to Read/Write BQ79600-Q1
User shall follow flow chart 图7-16 to do read from device and 图7-17 to do write to device activities.
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Device
Initialization
Start
NO
SPI_RDY = Z1[?
delay
YES
Drop nCS, Send one Single Device Read or Stack Read
Command frame, raise nCS @2-6Mbps;
M = expected total Response bytes,
i = int(M/128), K = M- i*128;
NO
YES
NO
NO
Wait
t<= t8
Total wait time >
tWAIT_READ_MAX
Comm Clear,
Reread
SPI_RDY = Z1[?
?
YES
Drop nCS, Read K
bytes, raise nCS
i > 0?
YES
Host reads
expected # of
valid data
YES
Finish
Reading
Drop nCS, Read 128 bytes then
stop (stop SCLK, raise nCS high),
i = i -1;
NO
Comm Clear
图7-16. Flow Chart to Read from Device
备注
MCU shall check SPI_RDY pin at least every t8 (max service interval). t8 = 1ms at SCLK = 6MHz /
890μs at SCLK = 4MHz /550μs at SCLK = 2MHz assuming host starts to read TX FIFO right after
detecting SPI_RDY = '1 and SPI bus has 30% idle time in the process of reading 128 bytes.
• For response frame, nCS has to be toggled high after reading the last byte of data in the current buffer.
• tWAIT_READ_MAX
– stack read/single device read from stack devices, with n stack devices, request m bytes in total (payload +
overheads, from all stack devices), wait time: (n-1)*3μs*2 + m*10μs + 100μs.
– single device read from BQ79600-Q1, request m bytes , wait time: 100μs + m*10μs.
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Start
NO
NO
YES
NO
Total wait time >
250us?
SPI_RDY = Z1[?
Wait t
SPI_RDY = Z1[?
Comm Clear
YES
YES
Toggle nCS low, Send 1 Write
Command frame (up to 14
bytes) @SCLK 2Mhz-6MHz,
toggle nCS high
NO
YES
More Write cmd
to send?
End
图7-17. Flow Chart to Send Write Command Frame to Device
Notes:
• Since write command frame doesn’t incur response frames, host shall discard data from MISO pin.
• If host sends partial data, the device would keep waiting the rest of command data till communication time out
happens. Refer to 节7.3.2.4 for details.
7.3.2.1.2.2.3 SPI COMM CLEAR
备注
SPI Comm Clear 命令仅适用于桥接器件,用于清除FIFO 并复位SPI 模块。
它使 BQ79600-Q1 停止发送响应;它无法停止堆栈器件向 BQ79600-Q1 发送响应数据。如果主机仍然无法与器
件通信,主机最终可以使用 SHUTDOWN ping,然后使用 WAKE ping 重启器件。器件在 ACTIVE 状态下仅响应
Comm Clear 命令。在以下情况下使用SPI Comm Clear 命令:
• SPI_RDY 为低电平超过预期时间,即READ 模式中的tSPI_RD_WAIT_MAX (图7-16),而在将写命令帧发送到器
件时为220μs。请勿在此等待时间结束前发送Comm Clear 命令。
• 主机读回的数据有CRC 错误。
• 主机无法与器件通信。
nCS
t9
t10
8 clk cycles
SCLK
tSU
tH
MOSI pin
Hi or Low
Hi or Low
COMM CLEAR
图7-18. SPI Comm Clear
SPI Comm Clear 被严格定义为 nCS 切换至低电平,8 位 ‘0’,nCS 切换至高电平如图 7-18 所示。nCS 在发
送 Comm Clear 时必须保持低电平。如果在 nCS 变为高电平之前在 MOSI 引脚上检测到其他数据,则设置
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[COMCLR_ERR] 位, 器件将忽略格式错误的 Comm Clear 。格式正确的 Comm Clear 仅触发
[COMMCLR_DET]。如果使用 Comm Clear,可以触发 DEBUG_SPI_FRAME [TR_SOF](发送本地数据时)、
[RC_SOF](接收部分数据)和[TS_WAIT](发送菊花链数据时)。
7.3.2.1.2.3 Daisy Chain
Daisy chain is the interface (COMH/COML) communicating to stack devices. It is bi-directional and half duplex,
and, therefore, has a transmitter (TX) and receiver (RX) on both COMH and COML interfaces, 图 7-1. Signal
going in and out of daisy chain port is taken care by the device. To use the device, host does not need to know
daisy chain physical layer protocol (bit definition, byte definition and byte transferring). Host just needs to control
SPI or UART port properly. Still, for user's information, daisy chain physical layer protocol is described below.
Daisy chain bit is transmitted between COM*P and COM*N in fully differential fashion, see 图7-19.
Daisy chain byte uses an asynchronous 13-bit byte-transfer protocol. The definition of each bit in the byte is
defined in 表7-6. Byte to byte transmission is captured in 图7-20.
Z1[
Z0[
COM*P
COM*N
2 x tPW_DC
tPW_DC
COM*P t COMP*N
tPW_DC
tPW_DC
图7-19. Daisy Chain Bit Definition
SYNC [1:0]
DATA[7:0]
+1
COM*P t COMP*N
-1
D7
D4
D6
D1
D3
D5
D0
D2
SYNC = 2'b00
1.375us of bus idle
0.5us of bus short
6.5us nominal
Daisy Chain Byte Definition
Up to 8.375us for a byte
Up to 8.375us for a byte
Byte
Byte
10.875us at 1Mbps, 40.6us at 250Kbps
Daisy Chain Byte Transfer
图7-20. Daisy Chain Byte/ Byte Transfer Definition
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表7-6. Daisy Chain Byte Definition
BIT NAME
DESCRIPTION
Preamble (half-bit)
Indicates a start of byte transaction, signaling the receiver to start sampling. This half-bit and the following 2
SYNC bits are used for extra timing information.
SYNC[1:0]
Always 0b00. The SYNC bits are used for the digital to assess the timing and noise level on the byte, improving
the detection of a '1' and '0' in a noisy environment.
Start-Of-Frame (1-bit)
The Start-Of-Frame (SOF) bit defines the byte as the INIT byte (initialization byte) in the frame, refer to 图7-8.
Stack device needs this information in order to process the communication.
Data[7:0]
The actual 8-bit payload.
Byte Error BERR (1-bit)
For BQ79600-Q1, BERR is always ‘0’in command frames sent to stack device. While in received response
frames, if it is ‘1’, it indicates last device DEBUG_COM*_PHY[PERR] = 1.
Postamble (half-bit)
Indicates the end of byte transaction.
7.3.2.2 Tone Communication Protocol
Other than data, certain information is transmitted using tone: signals to change power state of stack device
(SLP2ACT tone, WAKE tone, SHUTDOWN tone, HWRST tone), signals related to faults (FAULT tone and
HEARTBEAT tone). The definition of each tone is defined in 图7-22 and 图7-21.
Device can transmit and receive tones in summary below:
表7-7. Available Tones to BQ79600-Q1
DIRECTION
NAME
Receive
Transmit
FAULT tone and HEARTBEAT tone
SLP2ACT tone, WAKE tone, SHUTDOWN tone, HWRST tone, HEARTBEAT tone
Note:
• Device does not transmit Fault Tone as it uses 节7.3.3.2.1 to signal fault if enabled.
• SLP2ACT/WAKE/SHUTDOWN/HWRST tone transmitting is on demand when corresponding bit in register
CONTROL1 and CONTROL2 is set.
• When bridge device in SHUTDOWN, wakeup bridge device doesn’t change power mode of stack devices.
• Receiving threshold value is defined as nHBDET, nFTONEDET in section 6.6.
• Transmitting number is predefined by device in 表7-8.
表7-8. Transmitting Tones Summary Table
SLP2ACT
WAKE
SHUTDOWN
HWRST
HEARTBEAT (SLEEP only)
N of Couplets Transmitted in
Single Burst
30
90
270
NA
810
30
Burst Period
NA
NA
NA
400ms
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COM*P
COM*N
VDCCM
tFLTTONE_PLS
tFLTTONE
COM*P t COMP*N
tFLTTONE_PLS
A pulse
One Burst
(N of couplets)
One Burst
(N of couplets)
tHB_PERIOD or tFTONE_PERIOD
图7-21. FAULT Tone and HEARTBEAT Tone Definition
COM*P
COM*N
COM*P
COM*N
VDCCM
VDCCM
tCOMTONE_PLS
tCOMTONE_PLS
tCOMTONE
tCOMTONE
COM*P t COMP*N
tCOMTONE_PLS
COM*P t COMP*N
tCOMTONE_PLS
(N of couplets)
SHUTDOWN, HEARTBEAT, HWRST Tone
(N of couplets)
WAKE, SLP2ACT Tone
图7-22. SHUTDOWN, HEARTBEAT, HWRST, SLP2ACT Tone Definition
7.3.2.3 Device Auto Addressing / Ring Communication
备注
The host starts communication at least 100µs after changing the [DIR_SEL] setting to ensure the
device finishes the COMH/COML reconfiguration.
7.3.2.3.1 Auto-Addressing
To properly communicate to every device in daisy chain, host has to assign a unique device address to every
device. This process is called Auto-addressing. This step is required every time devices come out of
SHUTDOWN or digital reset. 表 7-9 describes a procedure to bring up a system of 1 bridge device and 3 stack
devices from SHUTDOWN to a state ready to do read/write communication.
• All device addresses must be sequential
表7-9. Auto-Addressing with Figure 7-22(a), assume all devices are in SHUTDOWN
STEP
WORK WITH BQ7961X-Q1
1
2
3
4
send WAKE ping on RX (wakeup BQ79600-Q1)
single device write to BQ79600-Q1 CONTROL1 [SEND_WAKE] = 1 (wake up stack devices)
dummy stack write data 0x00 to register 0x343 to 0x34A (sync up internal DLL). These are 8 separate write commands.
brdcast write 0x01 to address 0x309 (enable auto addressing)
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表7-9. Auto-Addressing with Figure 7-22(a), assume all devices are in SHUTDOWN (continued)
STEP
WORK WITH BQ7961X-Q1
5
6
7
brdcast write consecutively to 0x306 = 0,1,2,3 (address 1-3 assigned to BQ7961X-Q1, 0 assigned to BQ79600-Q1)
brdcast write 0x02 to address 0x308 (set BQ7961X-Q1 as stack device )
single device write to device 3: data 0x03 to address 0x308 (set 3rd BQ7961X-Q1 as top of stack, BQ79600-Q1 is default to
base)
8
9
dummy stack read registers 0x343 to 0x34A (sync up internal DLL). These are 8 separate read commands.
stack read address 0x306 (read back to verify address are correct for stack devices)
single device read to BQ79600-Q1, verify 0x2001 = 0x14
10
11
finish initialization
7.3.2.3.2 Ring Communication (optional)
A ring communication (optional) allows the system to establish communication from either direction. This allows
the system to continue communicating to all stack devices even if one piece of daisy chain cable is broken.
表 7-10 describes a procedure auto address 图 7-23(b): to bring up a system of 1 bridge device and 3 stack
devices from SHUTDOWN to a state ready to do read/write communication in reverse direction.
To change communication direction from 图7-23(a) to 图7-23(b), follow the steps 2, 4-14. (Assuming all devices
in (a) are already in ACTIVE and auto addressed as described in 表7-9)
COMH
COMH
bq Monitoring IC
bq Monitoring IC
(Top Of Stack)
(S1)
COML
COML
COMH
COMH
bq Monitoring IC
bq Monitoring IC
(S2)
(S2)
COML
COML
COMH
COMH
bq Monitoring IC
(Top of Stack)
bq Monitoring IC
(S1)
COML
COML
COMH
COMH
bq79600
(Base, B0)
bq79600
(Base, B0)
MCU
MCU
COML
COML
a). [DIR_SEL] = 0: Command from
COMH -> COML)
b). [DIR_SEL] = 1: Command from
COML -> COMH)
图7-23. Example to Change Communication Direction in Daisy Chain
表7-10. Auto-Addressing Figure 7-22(b), assume all devices are in SHUTDOWN
WORK WITH BQ7961X-Q1
STEP
1
2
3
4
5
6
7
8
send WAKE ping on RX (wakeup BQ79600-Q1)
single device write to BQ79600-Q1 control 1 [DIR_SEL] = 1 (change BQ79600-Q1 direction)
single device write to BQ79600-Q1 CONTROL1 [SEND_WAKE] = 1 (wake up stack devices)
dummy stack write data 0x00 to registers 0x343 to 0x34A (sync up internal DLL). These are 8 separate write commands.
brdcast write reverse 0x80 to address 0x309 (change stack devices direction DIR_SEL =1)
brdcast Write 0x02 to address 0x308(1)
brdcast Write 0x81 to address 0x309 (enable BQ7961X-Q1 auto addressing)
brdcast Write consecutively to address 0x307 = 0,1,2,3 (address 1-3 assigned to BQ7961X-Q1, 0 assigned to BQ79600-Q1)
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表7-10. Auto-Addressing Figure 7-22(b), assume all devices are in SHUTDOWN (continued)
WORK WITH BQ7961X-Q1
STEP
9
brdcast write 0x02 to address 0x308 (set BQ7961X-Q1 as stack device )
10
single device write to device 3: data 0x03 to address 0x308 (set 3rd BQ7961X-Q1 as top of stack, BQ79600-Q1 is default to
base)
11
12
13
14
dummy stack read registers 0x343 to 0x34A (sync up internal DLL). These are 8 separate read commands.
stack read address 0x307 (read back to verify address are correct for stack device)
single device read to BQ79600-Q1, verify 0x2001 = 0x14
finish initialization
(1) Clear the previous TOP_STACK flag after communication direction is changed because top of stack device cannot be reached if one
cable is broken
7.3.2.4 Communication Timeout
In ACTIVE, there are two programmable communication timeout timers, comm timeout short (once expires,
flag fault) and comm timeout long (once expired, transition to SLEEP or SHUTDOWN). They monitor the
absence of a valid frame from either UART/SPI or daisy chain communications. A valid frame is defined as any
frame (response or command) that does NOT contain any errors that prevent the frame from being processed.
In SHUTDOWN, the timers are disabled and reset. In SLEEP, the last timer values are held frozen. The timer is
reset every time a valid response or command frame is received.
How to set the timer, timer expiration action are described in COMM_TIMEOUT. In order to avoid entering
SHUTDOWN mode before a communications timeout fault, ensure the COMM_TIMEOUT [CTS_TIME] is shorter
than the COMM_TIMEOUT [CTL_TIME].
7.3.2.5 Communication Debug Mode
The device provides a communication debug mode to ease the initial development phase. Enter/exit debug is
controlled by setting of register DEBUG_CTRL_UNLOCK. Once device is in debug mode, user is able to control
the UART/daisy chain baud rate and on/off of COMH/COML RX/TX. Please refer to register
DEBUG_COMM_CTRL. User can always read DEBUG_COMM_STAT register for comm status disregard the
setting/mode of device.
In addition to that, device provides communication low level faults (physical and frame layer)to facilitate debug.
Refer to registers from address 0x2301 –0x2307.
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7.3.3 Fault Handling
7.3.3.1 Fault Status Hierarchy/Reset/Mask
7.3.3.1.1 Fault Status Hierarchy
BQ79600-Q1 reports faults in hierarchy, as shown in 图7-24:
• Level 1 is FAULT_SUMMARY register in which each bit represents an OR function of all the bits in its own
hierarchy captured in level 2.
• Level 2 bit is the OR function of level 3 bits in its own hierarchy.
• Level 3 contains debug register bits meant to inform host frame and physical layer fault. Level 3 fault is useful
in firmware development.
• Any bit triggered in lower level would trigger higher level bit in its hierarchy, e.g. if [TXFIFO_OV] is set,
[SPI_PHY], [FAULT_COMM] would also be set.
备注
Host system can periodically poll the FAULT_SUMMARY to check the fault status and only read the
lower level fault registers if needed.
7.3.3.1.2 Fault Reset and Mask
Once fault is detected, the fault status bit is latched until cleared using the reset bit.
When a specific fault reset bit is set, the same color coded bits in level 1 to level 3 are cleared if the fault
condition is gone. If the fault condition persists and the reset bit is written, the fault status bit is not reset. For
example, if [TXFIFO_OV], [DVDD_OV] bits are set, [SPI_PHY], [FAULT_COMM] and [FAULT_PWR] are set, if
fault conditions are eliminated and write '1' to [RST_UART_SPI] and [RST_PWR], 5 faults bits would be '0'.
When a specific fault mask bit is set, the same color coded bits would be masked, meaning the fault bits will still
be set, but the faults will not be reflected in level 1, FAULT_SUMMARY register. For example, if
[MSK_UART_SPI] = 1, any bits being set marked green in level 2 and 3 won't set [FAULT_COMM] bit.
When fault is masked, it will also prevent the device from asserting the NFAULT pin when the masked faults
occur. See 节7.3.3.2 for details.
MASK/RST
MSK_REG
RST_REG
MSK_SYS
RST_SYS
MSK_PWR
RST_PWR
Mask
Reset
Bit
Bit
MSK_COML_H MSK_UART_SPI MSK_FCOMM_DET MSK_FTONE_DET MSK_HB
RST_COML_H RST_UART_SPI RST_FCOMM_DET RST_FTONE_DET RST_HB
Fault Status
Level 1
Bit
FAULT_COMM
FAULT_REG
FAULT_SYS
FAULT_PWR
Fault Summary
Level 2
Detailed Fault Register
FAULT_COMM1
FCOMM_DET
FTONE_DET
HB_FAIL
FAULT_COMM2
SPI_FRAME
FAULT_REG
CONF_MON_ERR
FACTLDERR
FAULT_SYS
FAULT_PWR
CVDD_UV_DRST
CVDD_OV
VALIDATE_DET
Bit
SPI_PHY
LFO
COML_FRAME
COML_PHY
FACT_CRC
SHUTDOWN_REC
DVDD_OV
HB_FAST
DRST
CTL
AVDDREF_OV
AVAO_SW_FAIL
UART_FRAME
COMMCLR_DET
STOP_DET
COMH_FRAME
COMH_PHY
CTS
TSHUT
INH
Level 3
Debug Info
Register
Bit
DEBUG_UART_FRAME
TR_SOF
DEBUG_SPI_FRAME DEBUG_SPI_PHY DEBUG_COML_FRAME DEBUG_COML_PHY DEBUG_COMH_FRAME DEBUG_COMH_PHY
TR_SOF
FMT_ERR
RR_IERR
PERR
RR_IERR
PERR
TR_WAIT
TR_WAIT
RC_IERR
RC_SOF
COMCLR_ERR
TXDATA_UNEXP
RXDATA_UNEXP
TXFIFO_OF
RR_SOF
BERR_TAG
SYNC2
SYNC1
BIT
RR_SOF
BERR_TAG
SYNC2
SYNC1
BIT
RC_IERR
RR_BYTE_ERR
RR_UNEXP
RR_CRC
RR_BYTE_ERR
RR_UNEXP
RR_CRC
RC_SOF
RC_BYTE_ERR
RC_CRC
RC_BYTE_ERR
RC_CRC
TXFIFO_UF
RXFIFO_OF
图7-24. Fault Status Hierarchy, Mask and Reset
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7.3.3.2 Fault Interface
Host can acquire the fault status with the following two methods:
• Host ignores NFAULT pin, constantly polls the FAULT_SUMMARY register of each device. If
FAULT_SUMMARY is non-zero, read the low level fault status registers to obtain more information.
• Host monitors NFAULT pin status. Enable fault status to pass down the daisy chain to bridge device. Enable
bridge device’s NFAULT pin to be asserted when the FAULT_SUMMARY is non-zero. When NFAULT is
triggered, host polls fault information to diagnose further.
7.3.3.2.1 NFAULT
Device integrates an NMOS open-drain output (NFAULT) to signal the MCU that a fault has occurred in the
system (either fault from BQ79600-Q1 or from monitoring IC). The NFAULT driver is enabled when
[NFAULT_EN] = 1. When BQ79600-Q1 detects an unmasked fault, NFAULT asserts low. When NFAULT is
disabled, the device will set the corresponding flag in FAULT_SUMMARY register but will not assert NFAULT.
If the fault information of stack devices are not transmitted to bridge device through 节 7.3.3.2.2, NFAULT output
only indicates faults in BQ79600-Q1.
7.3.3.2.2 Daisy Chain (COMH and COML)
When using BQ79600-Q1 NFAULT pin to signal the host under a fault detection, the stack devices have to
transfer their fault status information to the base device. The information is transmitted through COMH/L
interface through the same communication cables:
• In ACTIVE, BQ79600-Q1 detects embedded fault info in response frame from stack device.
• In SLEEP, stack device sends Heartbeat and Fault tone to BQ79600-Q1.
• In SHUTDOWN, use Sniff Detector of BQ79600-Q1 monitors stack device Fault tone.
7.3.3.2.2.1 Fault Transmitting when BQ79600-Q1 in ACTIVE
In ACTIVE mode, stack devices can embed their fault status in their response frames (refer to 图 7-7) that are
sent to BQ79600-Q1. The BQ79600-Q1 can detect their embedded fault info and sets [FTONE_DET] bit once
criteria in 图7-25 is met. Please refer to BQ7961X-Q1 on how to use embeded fault feature.
To pass on the fault status of the stack devices, the host sends a stack read which will result with response
frame pass through every device in the daisy chain, giving each device an opportunity to embed their fault status
to response frame.
CRC[7:0]
DATA MSB[7:0]
REG ADR[7:0]
INIT[7:0]
Dev ADR[7:0]
REG ADR[15:8]
SYNC [1:0]
SYNC [1:0]
SYNC [1:0]
SYNC [1:0]
+1
+1
+1
+1
SYNC = 2'b00
SYNC = 2'b00
SYNC = 2'b00
SYNC = 2'b00
SOF = 1
SOF bit of DEV ADR SOF bit of REG ADR[15:8] SOF bit of REG ADR[7:0] Fault Status
1
1
x
0
0
x
x
1
x
1
0
x
0
x
x
1
1
x
0
0
x
[FCOMM_DET] = '1'
[FCOMM_EN] = '1'
[FCOMM_EN] = '0'
[FCOMM_DET] = '0'
[FCOMM_DET] = '0'
图7-25. Embed Fault Detection in Response Frame
7.3.3.2.2.2 Fault Transmitting when BQ79600-Q1 in SLEEP
Because data communication is not available in SLEEP mode, the device provides following options to
transmitting fault information:
• Transmit the Heartbeat tone (enabled by [HB_TX_EN], used to check integrity of cable between bridge and
first stack device). Device does not transmitted fault tone as it has NFAULT.
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• Detect Heartbeat and Fault tone, enabled, by [TONE_RX_EN].
These tones are transmitted in the same direction as a communication command frame, which is based on the
CONTROL1[DIR_SEL] setting. For the tone signal to return back to BQ79600-Q1 (so NFAULT can be triggered
if needed), a Ring architecture must be used to support transmitting fault status in SLEEP mode.
Scenario1: No Fault
Scenario3: Fault Detected
Scenario2: HB Stop
2) S2 ꢀ}ꢁ•v[š Œꢁꢂꢁ]ÀꢁŒ I. š}vꢁ ꢃ•
expected, set fault, send Fault tone
to B0
Non-bq79606
(Top of Stack)
S2
Non-bq79606
(Top of Stack)
S2
Non-bq79606
(Top of Stack)
S2
2) Receive S1 Fault tone , S2 sends
Fault tone to B0.
3) S1 has no fault, send HB tone to B0
2) S1 has no fault, send HB tone to S2
Sleep
Sleep
Sleep
1) S1 receives HB tone from B0 as
expected, S1 has no fault, send HB
tone to S2
1) S1 receives HB tone from B0 as
expected, S1 has fault, send Fault tone
to S2
Non-bq79606
S1
Sleep
Non-bq79606
S1
Sleep
Non-bq79606
Fault
S1
Detected
Sleep
Shutdown
MCU
Sleep
B0
(base device)
Shutdown
MCU
Sleep
B0
(base device)
Shutdown
MCU
Sleep
1)B0 detects HB tone from S2, B0
itself has no fault, send HB tone to S1
(optional)
3)B0 receivers fault tone from S2, set
[FTONE_DET], drive INH pin high,
NFAULT pin low
3)B0 receivers fault tone from S2, set
[FTONE_DET], drive INH pin high,
NFAULT pin low
B0
(base device)
IHN
IHN
IHN
图7-26. Heartbeat and Fault Tone Examples
Both the Heartbeat and Fault Tone are a type of tone similar to the communication. One main difference is a
communication tone only transmits with a single burst of couplets, while Heartbeat and Fault Tones are sent with
a burst of couplets periodically. See 图7-21 for details.
7.3.3.2.2.3 Fault Transmitting (Automatic Host Wakeup/Reverse Wakeup) when BQ79600-Q1 in SHUTDOWN
备注
This feature (Auto Host Wakeup/Reverse Wakeup) is only available if 节7.3.5 is enabled.
The purpose of this user case is to keep BQ79600-Q1 in lowest power mode while still being able to detect fault
information from stack devices. In this case, fault information transmittion is similar to that of SLEEP: top of stack
device sends HB or Fault tone to BQ79600-Q1. The difference lies in the detection of those tones in BQ79600-
Q1. In SHUTDOWN, TONE RX is off, only low power 节 7.3.5 is available. Once sniffer detects FAULT tone, it
puts device into VALIDATE mode in which full power TONE RX is available, device would validate if true Fault
tone exists or not. If yes, it triggers INH. See 图7-27 for different case.
Scenario3: Fault Detected
Scenario1: No Fault
Scenario2: HB Stop
2) Receive S1 HB tone as expected,
S2 has no fault, ꢀ}v[š •ꢁvꢀ Cꢃµoš š}vꢁ
to B0.
Non-bq79606
(Top of Stack)
S2
Non-bq79606
(Top of Stack)
S2
Non-bq79606
(Top of Stack)
S2
2) 5}ꢁ•v[š Œꢁꢂꢁ]Àꢁ {1 HB tone as
expected, S2 sends Fault tone to B0.
2) Receive S1 Fault tone , S2 sends
Fault tone to B0.
Sleep
Sleep
Sleep
1) Mask HB Tone RX fault from B0. S1
has no fault, send HB tone to S2.
Non-bq79606
S1
1) Mask HB Tone RX fault from B0. S1
has no fault, send HB tone to S2.
1) Mask HB Tone RX fault from B0. S1
has no fault, send HB tone to S2.
Non-bq79606
S1
Non-bq79606
Fault
S1
Sleep
Sleep
Detected
Sleep
Shutdown
MCU
Shutdown
MCU
Shutdown
MCU
Shutdown
B0
(base device)
Shutdown
B0
(base device)
Shutdown
3)B0 receives Fault tone from S2,
transition to Fault Validate, validate
Fault tone from S2, drive INH pin high
3)B0 receives Fault tone from S2,
transition to Fault Validate, validate
Fault tone from S2, drive INH pin high
3)B0 ꢀ}ꢁ•v[š Œꢁꢂꢁ]Àꢁ Cꢃµoš š}vꢁ (Œ}u
S2, No Action
B0
(base device)
Shutdown
Shutdown
Shutdown
PMIC
PMIC
PMIC
INH
INH
INH
图7-27. Reverse Wakeup User Case
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7.3.4 INH/ Reverse Wakeup
备注
INH pin is used if Reverse Wakeup feature is used. If this feature is not used, connect this pin to BAT
pin, refer to schematic in 图8-1.
Reverse wakeup feature is a mechanism where BQ79600-Q1 can wakeup the host, through INH pin, on faulty
status from either BQ79600-Q1 or stack devices like BQ7961X-Q1. MCU and its supply (PMIC/SBC) are in
SHUTDOWN for power saving on low voltage battery side.
The INH pin is a high voltage output pin that provides voltage from the BAT minus VDROP_INH to enable an
external high voltage regulators (SBC, PMIC). These regulators are usually used to support the microprocessor
and VIO pin. When INH PMOS pullup is not activated, INH pin goes to a high Z state, it relies on external circuit
to define the pin voltage (in application circuit, 100kohm resistor to GND is used.)
INH PMOS pullup can be triggered:
• In SLEEP mode or VALIDATE mode if following faults are detected regardless of setting of register
FAULT_MSK: [FTONE_DET], [HB_FAIL], [HB_FAST], [AVAO_SW_FAIL], [FACT_CRC], [CONF_MON_ERR].
• In ACTIVE, INH can only be triggered by setting [INH_SET_GO] =1.
Once INH triggered, it remains latched in all modes as long as VBAT is not removed.
INH function described above can be disabled by configuring INH_DIS[1:0] = 2’b11.
Every time INH PMOS is activated, fault bit [INH] is set. To clear the fault, set INH_DIS[1:0] = 2’b11 (disarm
INH driver), then write [RST_SYS] = 1. After this, to use INH feature, set INH_DIS[1:0] = 2’b00.
As part of safety diagnostic (SM202 in Safety Manual), host can trigger INH in ACTIVE and check if pin voltage
is set properly: If INH pin voltage is higher than VINH_DET, [INH_STAT] = 1.
备注
INH pin should be considered a "high voltage logic" terminal, thus should be used to drive the EN
terminal of the system’s power management device. It should be not used as a switch for power
management supply itself. This terminal is not reverse battery protected and thus should not be
connected outside of the system module.
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7.3.5 Sniff Detector
备注
Sniff detector is only used if reverse wakeup feature is used.
Sniff detector, powered by AVAOREF, is used to detect fault tone from stack device on COMH* or COML*. This
detector would trigger if it detects/counts no less than nVALIDATE of continuous couplets (either “-” or “+”)
with amplitude larger than VVAL_THR. If any couplet timing interval is larger than tSNIFFIDLE, detector/counter is
reset.
This sniff detector rejects HB tone since nVALIDATE is more than 30, both HB/Fault tone are “-” tone;
detector doesn’t expect “+”tone.
备注
The usage assumption of this detector is when system is in idle mode, BQ79600-Q1 in SHUTDOWN.
Sniff detector is only effective in SHUTDOWN. Once detector is triggered, device transitions from SHUTDOWN
to VALIDATE. The sniff detector is by default disabled when first transition from COMPLETE OFF to
SHUTDOWN. To enable the feature, host has to keep [SNIFDET_EN] = ‘1’& [SNIFDET_DIS] = ‘0’before
transitioning to SHUTDOWN. After enabling the detector, if device doesn’t transition to COMPLETE OFF, the
only way to disable the detector is to keep [SNIFDET_DIS] = ‘1’. (Disable bit has higher priority so don’t
care about the setting of [SNIFDET_EN]) before transitioning to SHUTDOWN.)
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7.3.6 Device Diagnostic
The product is developed as a safety element out of context (SEooC), with a target safety goal of ASIL-D for
communication. The following sub-sections describe the diagnostic control and fault status that can be used as
part of the safety mechanisms.
The Safety Manual and FMEDA for BQ79600-Q1 are available separately from Texas Instruments. Contact TI
Sales Associate or Applications Engineer for further information.
7.3.6.1 Power Supplies Check
7.3.6.1.1 Power Supply Diagnostic Check
The internal power supply circuits have overvoltage, undervoltage, and/or current limit checks. The table below
summarizes the diagnostics that apply for each power supply and the corresponding action when failure is
detected.
表7-11. Power Supply Diagnostic Summary
SUPPLY
OV CHECK
UV CHECK
CURRENT LIMIT
DVDD
If fails, set [DVDD_OV]
If fails, digital reset
Limit current to EC table current
limit specification
CVDD
AVAOREF
AVDDREF
VIO
If fails, set [CVDD_OV]
If fails, digital reset, set
[CVDD_UV_DRST]
Limit current to EC table current
limit specification
If fails, set [AVDDREF_OV]
(AVAOREF supplies AVDDREF)
If fails, device shuts down
If fails, set [AVDDREF_OV]
If fails, set [AVAO_SW_FAIL] or
digital reset
If fails, device losses data
communication and Ping function
7.3.6.1.2 Power Supply BIST
The device implemented a power supply BIST (Built-In Self-Test) function to test CVDD, DVDD, AVDDREF OV
detection comparator integrity. It is a command base function initiated by host. Steps below explains how it
works, and further details can be found in Safety Manual (SM017).
1. Host shall read the register FAULT_PWR to verify [CVDD_OV], [DVDD_OV], [AVDDREF_OV] are low.
2. Host shall write [PWR_DIAG_GO] = 1.
3. After 1.7ms, host shall read if [PWR_DIAG_RDY] = 1, else shall, keep waiting, reread.
4. If yes, host shall read FAULT_PWR register, [CVDD_OV], [DVDD_OV], [AVDDREF_OV] to verify the bits are
asserted.
5. Host shall reset faults above.
7.3.6.2 Thermal Shutdown
Thermal shutdown (TSHUT) event occurs when the Thermal Shutdown sensor value exceeds the thermal
shutdown temperature threshold. The sensor operates without interaction and is separated from the ADC
measured die sensor. The thermal shutdown function has a register-status indicator flag (FAULT_SYS[TSHUT])
that is saved during the shutdown event and can be read after the device is waken back up. When a TSHUT
fault occurs, the device immediately enters the SHUTDOWN mode. Any pending transactions on UART or daisy
chain are discarded. There is no fault signaling when a thermal shutdown event occurs, as the device
immediately shuts down.
To awaken the device, host shall ensure the ambient temperature is below TSD_FALL and sends a WAKE ping to
the base device. Host shall not attempt to wake the device if the ambient temperature is still above TSD_FALL
.
Upon waking up, the FAULT_SYS[TSHUT] bit is set. The FAULT_SYS[SHUTDOWN_REC] = 1 indicating the
prior shutdown was caused by abnormal event. See 节 7.5.17 for more details. If the system faults are
unmasked, FAULT_MSK1[MSK_SYS] = 0, the thermal shutdown will be reflected as FAULT and will be indicated
in the FAULT_SUMMARY register and the assertion of the NFAULT pin.
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7.3.6.3 Oscillators Watchdog
The oscillators are monitored by watchdog circuits. There are two oscillators in the device, the HFO and the
LFO. If these oscillators are not functioning, the device does not operate. If the HFO or LFO does not transition
within the expected time, the watchdog circuits trigger Digital Reset.
When such unexpected reset occurs, it is recommended for the host to send a SHUTDOWN ping/tone to the
problem device and follow up a WAKE ping to reset the daisy chain. If the oscillators are truly damaged, the
device will not restart and must be replaced.
In addition to the watchdog, the LFO frequency is monitored to ensure it stays within acceptable limits. If the LFO
frequency falls outside of the expected range, the FAULT_SYS_FAULT[LFO] bit is set.
7.3.6.4 Register Bit Flip Monitor
This bit flip checker monitors 2 configuration registers: DEV_CONF1, FAULT_MSK. It is always running when
device is out of SHUTDOWN. Whenever user changes those 2 register settings or any of the register bit flips,
fault bit [CONF_MON_ERR] is set.
Once user changes the setting, user shall write [CONF_MON_GO]=1 (resample 2 register values), write
[RST_REG] =1 to clear the [CONF_MON_ERR] fault, after this point, if any bit flips among those 2 registers,
[CONF_MON_ERR] is set. After device resets (receive WAKE ping or [SOFT_RESET] = 1), [CONF_MON_ERR]
= 0.
This device does not have customer register CRC check and the register bit flip monitor provides the protection
for the above mentioned customer registers.
7.3.6.5 SPI FIFO 诊断
FIFO 诊断模式为主机提供了使用RX/TX FIFO 的方法。详细的 FIFO 诊断安全机制实现(SM132),请参阅安全手
册。
7.4 Device Functional Modes
See 节7.3.1
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7.5 Register Maps
Addr R/W Type Reset Value
Data
Hex
Bit7
"0000 0000" RSVD
"0000 0000" RSVD
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
DIR0_ADDR
306 R/W
RSVD
ADDRESS[5]
ADDRESS[5]
SEND_SHUTDOWN SEND_WAKE
ADDRESS[4]
ADDRESS[4]
SEND_SLPTOACT
RSVD
ADDRESS[3]
ADDRESS[3]
GOTO_SHUTDOWN
RSVD
ADDRESS[2]
ADDRESS[2]
GOTO_SLEEP
RSVD
ADDRESS[1]
ADDRESS[0]
ADDRESS[0]
ADDR_WR
RSVD
DIR1_ADDR
CONTROL1
CONTROL2
DIAG_CTRL
DEV_CONF1
DEV_CONF2
TX_HOLD_OFF
SLP_TIMEOUT
COMM_TIMEOUT
SPI_FIFO_UNLOCK
FAULT_MSK
FAULT_RST
FAULT_SUMMARY
FAULT_REG
FAULT_SYS
FAULT_PWR
FAULT_COMM1
FAULT_COMM2
DEV_DIAG_STAT
PARTID
307 R/W
RSVD
ADDRESS[1]
309 R/W-AC
30A R/W-AC
2000 R/W-AC
2001 R/W
"0000 0000" DIR_SEL
"0000 0000" RSVD
SOFT_RESET
SEND_HW_RESET
FLIP_TR_CRC
RESERVED
RSVD
RSVD
"0000 0000" RSVD
RSVD
CONF_MON_GO
TONE_RX_EN
RSVD
PWR_DIAG_GO
FCOMM_EN
RSVD
SPI_FIFO_DIAG_GO
TWO_STOP_EN
RSVD
FLIP_FACT_CRC
NFAULT_EN
RSVD
INH_SET_GO
HB_TX_EN
"0001 0100" SNIFDET_EN
"0000 0000" RSVD
SNIFDET_DIS
RSVD
2002 R/W
INH_DIS[1]
DLY[1]
INH_DIS[0]
DLY[0]
2003 R/W
"0000 0000" DLY[7]
"0000 0011" RSVD
DLY[6]
DLY[5]
DLY[4]
DLY[3]
DLY[2]
2004 R/W
RSVD
RSVD
RSVD
RSVD
SLP_TIME[2]
CTL_TIME[2]
CODE[2]
SLP_TIME[1]
CTL_TIME[1]
CODE[1]
SLP_TIME[0]
CTL_TIME[0]
CODE[0]
MSK_PWR
RST_PWR
FAULT_PWR
FACT_CRC
INH
2005 R/W
"0011 0100" RSVD
CTS_TIME[2]
RSVD
CTS_TIME[1]
RSVD
CTS_TIME[0]
RSVD
CTL_ACT
CODE[3]
MSK_HB
RST_HB
FAULT_COMM
RSVD
2010 R/W
"0000 0000" RSVD
2020 R/W
"0000 0000" MSK_COML_H
"0000 0000" RST_COML_H
"0000 0000" RSVD
MSK_UART_SPI
RST_UART_SPI
RSVD
MSK_FCOMM_DET MSK_FTONE_DET
RST_FCOMM_DET RST_FTONE_DET
MSK_REG
RST_REG
FAULT_REG
CONF_MON_ERR
CTS
MSK_SYS
2030 R/W-AC
RST_SYS
2100
2101
2102
2103
2104
2105
2110
R
R
R
R
R
R
R
RSVD
RSVD
RSVD
RSVD
FAULT_SYS
FACTLDERR
TSHUT
"0000 0000" RSVD
RSVD
"0000 0000" VALIDATE_DET LFO
RSVD
SHUTDOWN_REC DRST
CTL
"0000 0000" RSVD
"0000 0000" RSVD
"0000 0000" RSVD
"0000 0000" RSVD
"0000 0000" REV[7]
"0000 0000" ID[7]
"0000 0000" ID[7]
"0000 0000" ID[7]
"0000 0000" ID[7]
"0000 0000" ID[7]
"0000 0000" ID[7]
"0000 0000" ID[7]
"0000 0000" ID[7]
"0000 0000" ID[7]
"0000 0000" CODE[7]
"0111 1000" RSVD
"0001 0011" RSVD
"0000 0000" RSVD
"0000 0000" RSVD
"0000 0000" RSVD
"0000 0000" RSVD
"0000 0000" RSVD
"0000 0000" RSVD
"0000 0000" RSVD
RSVD
CVDD_UV_DRST
CVDD_OV
HB_FAST
COML_FRAME
RSVD
DVDD_OV
UART_FRAME
COML_PHY
RSVD
AVDDREF_OV
COMMCLR_DET
COMH_FRAME
AVAO_SW_FAIL
STOP_DET
COMH_PHY
INH_STAT
REV[0]
FCOMM_DET
RSVD
RSVD
REV[6]
ID[6]
FTONE_DET
SPI_FRAME
RSVD
HB_FAIL
SPI_PHY
RSVD
PWR_DIAG_RDY
REV[1]
2120 R
2121 R
2122 R
2123 R
2124 R
2125 R
2126 R
2127 R
2128 R
2129 R
REV[5]
ID[5]
REV[4]
REV[3]
REV[2]
DIE_ID1
ID[4]
ID[3]
ID[2]
ID[1]
ID[0]
DIE_ID2
ID[6]
ID[5]
ID[4]
ID[3]
ID[2]
ID[1]
ID[0]
DIE_ID3
ID[6]
ID[5]
ID[4]
ID[3]
ID[2]
ID[1]
ID[0]
DIE_ID4
ID[6]
ID[5]
ID[4]
ID[3]
ID[2]
ID[1]
ID[0]
DIE_ID5
ID[6]
ID[5]
ID[4]
ID[3]
ID[2]
ID[1]
ID[0]
DIE_ID6
ID[6]
ID[5]
ID[4]
ID[3]
ID[2]
ID[1]
ID[0]
DIE_ID7
ID[6]
ID[5]
ID[4]
ID[3]
ID[2]
ID[1]
ID[0]
DIE_ID8
ID[6]
ID[5]
ID[4]
ID[3]
ID[2]
ID[1]
ID[0]
DIE_ID9
ID[6]
ID[5]
ID[4]
ID[3]
ID[2]
ID[1]
ID[0]
DEBUG_CTRL_UNLOCK2200 R/W
DEBUG_COMM_CTRL 2201 R/W
CODE[6]
COML_TX_EN
RSVD
FMT_ERR
RSVD
RSVD
RSVD
RSVD
RSVD
RSVD
CODE[5]
COML_RX_EN
RSVD
CODE[4]
COMH_TX_EN
HW_DAISY_DRV
TXDATA_UNEXP
TR_WAIT
TR_WAIT
PERR
CODE[3]
COMH_RX_EN
COML_TX_ON
RXDATA_UNEXP
RC_IERR
RC_IERR
BERR_TAG
RR_SOF
BERR_TAG
RR_SOF
CODE[2]
CODE[1]
USER_UART_EN
COMH_TX_ON
TXFIFO_UF
RC_BYTE_ERR
RC_BYTE_ERR
SYNC1
CODE[0]
USER_DAISY_EN
COMH_RX_ON
RXFIFO_OF
RC_CRC
RC_CRC
BIT
UART_VIF_BAUD
COML_RX_ON
TXFIFO_OF
RC_SOF
RC_SOF
SYNC2
DEBUG_COMM_STAT 2300
R
R
R
R
R
R
R
R
DEBUG_SPI_PHY
2301
2302
COMCLR_ERR
TR_SOF
TR_SOF
RSVD
DEBUG_SPI_FRAME
DEBUG_UART_FRAME 2303
DEBUG_COMH_PHY 2304
DEBUG_COMH_FRAME 2305
DEBUG_COML_PHY 2306
DEBUG_COML_FRAME 2307
RSVD
RR_IERR
PERR
RR_BYTE_ERR
SYNC2
RR_UNEXP
SYNC1
RR_CRC
BIT
RSVD
RSVD
RR_IERR
RR_BYTE_ERR
RR_UNEXP
RR_CRC
图7-28. Register Summary
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7.5.1 Register Summary Table
NVM
VALUES
ADDRESS
REGISTER
DIR0_ADDR
DESCRIPTION
R/W MODE RESET VALUE
INCLUDED IN NVM?
0x306
0x307
Device Address North Direction
Device Address South Direction
Control1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
0x00
0x00
0x00
0x00
0x00
0x14
0x00
0x00
0x03
0x34
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x78
0x13
0x00
0x00
0x00
0x00
0x00
0x00
0x00
n/a
no
DIR1_ADDR
n/a
no
0x309
CONTROL1
n/a
no
0x30A
CONTROL2
Control2
n/a
no
0x2000
0x2001
0x2002
0x2003
0x2004
0x2005
0x2010
0x2020
0x2030
0x2100
0x2101
0x2102
0x2103
0x2104
0x2105
0x2110
0x2120
0x2121
0x2122
0x2123
0x2124
0x2125
0x2126
0x2127
0x2128
0x2129
0x2200
0x2201
0x2300
0x2301
0x2302
0x2303
0x2304
0x2305
0x2306
0x2307
DIAG_CTRL
Diagnostic Control
Device Configure1
Device Configure2
Transmitter Hold off Control
Sleep Timer
n/a
no
DEV_CONF1
n/a
no
DEV_CONF2
n/a
no
TX_HOLD_OFF
SLP_TIMEOUT
COMM_TIMEOUT
SPI_FIFO_UNLOCK
FAULT_MSK
n/a
no
n/a
no
Communication Timeout Control
FIFO Diagnostic Unlock
Fault Mask
n/a
no
n/a
no
n/a
no
FAULT_RST
Fault Reset
n/a
no
FAULT_SUMMARY
FAULT_REG
Fault Summary
n/a
no
Register Fault
R
n/a
no
FAULT_SYS
System Fault
R
n/a
no
FAULT_PWR
Power Fault
R
n/a
no
FAULT_COMM1
FAULT_COMM2
DEV_DIAG_STAT
PARTID
Communication Fault1
Communication Fault2
Diagnostic Status
Part ID
R
n/a
no
R
n/a
no
R
n/a
no
R
various
various
various
various
various
various
various
various
various
various
n/a
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
no
DIE_ID1
Die ID1
R
DIE_ID2
Die ID2
R
DIE_ID3
Die ID3
R
DIE_ID4
Die ID4
R
DIE_ID5
Die ID5
R
DIE_ID6
Die ID6
R
DIE_ID7
Die ID7
R
DIE_ID8
Die ID8
R
DIE_ID9
Die ID9
R
DEBUG_CTRL_UNLOCK
DEBUG_COMM_CTRL
DEBUG_COMM_STAT
DEBUG_SPI_PHY
DEBUG_SPI_FRAME
DEBUG_UART_FRAME
DEBUG_COMH_PHY
DEBUG_COMH_FRAME
DEBUG_COML_PHY
DEBUG_COML_FRAME
Debug Control Unlock
Debug Communication Control
Debug Communication Status
SPI Physical Layer Error
SPI Frame Layer Error
UART Frame Layer Error
COMH Physical Layer Error
COMH Frame Layer Error
COML Physical Layer Error
COML Frame Layer Error
R/W
R/W
R
n/a
no
n/a
no
R
n/a
no
R
n/a
no
R
n/a
no
R
n/a
no
R
n/a
no
R
n/a
no
R
n/a
no
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7.5.2 Register: DIR0_ADDR
Address: 0x306
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
ADDRESS[5:0]
0
RW
0
0
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
ADDRESS [5:0]
Follow steps in section “Device Addressing”to config this register. Always shows the current Device Address used by the device when
[DIR_SEL] = 0.
Default to 0x00 when digital core out of digital reset. MCU can re-address the device by writing a different device address to this register,
and the device will take on the new address immediately.
7.5.3 Register: DIR1_ADDR
Address: 0x307
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
ADDRESS[5:0]
0
RW
0
0
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
ADDRESS [5:0]
Follow steps in section “Device Addressing”to config this register. Always shows the current Device Address used by the device when
[DIR_SEL] = 1.
Default to 0x00 when digital core out of digital reset. MCU can re-address the device by writing a different device address to this register,
and the device will take on the new address immediately.
7.5.4 Register: CONTROL1
Address: 0x0309
B7
B6
B5
B4
B3
B2
B1
B0
DIR_SEL
SEND_SHUTDO
WN
SEND_WAKE
SEND_SLPTOAC GOTO_SHUTDO
GOTO_SLEEP
SOFT_RESET
ADDR_WR
T
0
WN
0
0
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
RW
DIR_SEL
Select daisy chain comm direction. Not self-clear bit.
0: In a device, command frame travels from MCU to COMH
1: In a device, command frame travels from MCU to COML
SEND_SHUTDO Sends SHUTDOWN tone to next device up the stack. The device receiving this bit is unaffected. Self-clear bit.
WN
0: Ready
1: Send SHUTDWON tone up the stack
SEND_WAKE
Send WAKE tone up the stack. Self-clear bit.
0: Ready
1: Send WAKE tone up the stack, then reset its own
SEND_SLPTOAC Send SLEEPtoWAKE tone up the stack. Self-clear bit.
T
0: Ready
1: Send SLEEPtoWAKE tone up the stack
GOTO_SHUTDO Transition device to SHUTDOWN mode. Self-clear bit.
WN
0: Ready
1: Enter SHUTDOWN mode
GOTO_SLEEP
Transition device to SLEEP mode. Self-clear bit.
0: Ready
1: Enter SLEEP mode
SOFT_RESET
ADDR_WR
Reset the digital to OTP default. Self-clear bit.
0: Ready
1: Reset device
Enable device to start auto-addressing. See auto-addressing chapter for detail. Self cleared.
0: Not performing auto-address. Device forwards communication transaction as normal
1: Device is being auto-addressed; the 1st communication transaction it received will not be forwarded.
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7.5.5 Register: CONTROL2
Address: 0x30A
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
SEND_HW_RESE
T
SPARE
0
0
0
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
RW
SEND_HW_RESE Send HW_RESET tone up the stack. Self-clear bit.
T
0: Ready
1: Send HW_RESET tone to next stack device up
7.5.6 Register: DIAG_CTRL
Address: 0x2000
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
CONF_MON_GO PWR_DIAG_GO SPI_FIFO_DIAG_ FLIP_FACT_CRC
GO
FLIP_TR_CRC
INH_SET_GO
0
0
0
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
RW
CONF_MON_GO Resample the 2 registers (DEV_CONF1, FAULT_MSK) setting that bit flip monitor checks against. self-clear bit. For usage, refer to
paragraph: Register Bit Flip Monitor
0: No action
1: Resample 2 registers setting
PWR_DIAG_GO Indicates a power supply BIST diagnostic is initiated, self-clear bit.
0: No action
1: Initiate power BIST diagnostic
SPI_FIFO_DIAG_ Write the unlock code 0x0A to SPI_FIFO_UNLOCK and followed by writing [SPI_FIFO_DIAG_GO] = 1 to do FIFO diagnostic. For detailed
GO
steps of FIFO diagnostic, refer to safety manual. This bit is self-cleared.
0: No action
1: Initiate SPI FIFO diagnostic
FLIP_FACT_CRC An enable bit to flip the factory CRC expected value. This is for factory CRC diagnostic.
0: No action
1: flip the CRC expected value. This will cause a factory CRC fault, FAULT_REG[FACT_CRC]
FLIP_TR_CRC
INH_SET_GO
Sends a purposely incorrect communication (during transmitting response) CRC by inverting all of the calculated CRC bits
0: Send CRC as calculated
1: Send inverted CRC
This bits intentionally activates INH PMOS pull up, sets [INH] and [INH_STAT] to 1. (self-cleared)
0: mission mode
1: Trigger INH PMOS pull up
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7.5.7 Register: DEV_CONF1
Address: 0x2001
B7
SNIFDET_EN
0
B6
B5
B4
B3
B2
B1
B0
SNIFDET_DIS
TONE_RX_EN
FCOMM_EN
TWO_STOP_EN
NFAULT_EN
RESERVED
HB_TX_EN
0
0
1
0
1
0
0
RW
RW
RW
RW
RW
RW
RW
RW
SNIFDET_EN
Enable the Sniff detector on COM* port, this bit is latched into AVAOREF domain, once latched in, this bit is still effective in SHUTDOWN
0: no effect
1: SNIF DET is enabled in SHUTDOWN
SNIFDET_DIS
TONE_RX_EN
Enable the Sniff detector on COM* port, this bit is latched into AVAOREF domain, once latched in, this bit is still effective in SHUTDOWN
0: no effect
1: SNIF DET is disabled in SHUTDOWN, if both SNIFDET_EN and SNIFDET_DIS are ‘1’, SNIFDET_DIS takes priority.
Enable the Tone receiver, depends on [DIR_SEL], one of the COML/COMH tone recover is enabled. COMH/COML tone receivers are
enabled in VALIDATE disregarding setting of this bit.
0: Disable
1: Enable
FCOMM_EN
Enable the fault state detection through communication in ACTIVE mode
0: Disable
1: Enable
TWO_STOP_EN Enables two stop bits for the UART in case of severe oscillator error in both the host and device
0: One STOP bit
1: Two STOP bit
NFAULT_EN
Enables the NFAULT function
0: NFAULT driver is disabled
1: NFAULT pulls low to indicate an unmasked fault is detected
RESERVED
HB_TX_EN
Reserved. Default value is 0. Please don't alter.
Enable HEARTBEAT transmitter when device is in SLEEP mode
0: Disable
1: Enable
7.5.8 Register: DEV_CONF2
Address: 0x2002
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
INH_DIS[1:0]
0
RW
0
0
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
INH_DIS[1:0]
Disable INH driver (PMOS pull up). In all modes, this bit overwrites [INH_SET_GO] and fault tone detection event
00: INH function is enabled
01: INH function is enabled
10: INH function is enabled
11: INH function is DISABLED
7.5.9 Register: TX_HOLD_OFF
Address: 0x2003
B7
B6
B5
B4
B3
B2
B1
B0
DLY[7:0]
0
0
0
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
RW
DLY[7:0]
Set the number of bit period delay from 0 to 255, after receiving the STOP bit of a command frame and before transmitting the 1st bit of
response frame
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7.5.10 Register: SLP_TIMEOUT
Address: 0x2004
B7
B6
B5
RSVD
0
B4
B3
B2
B1
B0
SLP_TME[2:0]
0
RW
0
0
0
0
1
1
RW
RW
RW
RW
RW
RW
RW
SLP_TME[2:0]
This timer starts counting when device enters SLEEP or VALIDATE. When the timer expires, the device enters SHUTDOWN. The timer
reset if device wakes up to ACTIVE.
000: no timeout. Device remains in SLEEP
001: 5s
010: 10s
011: 1min
100: 10mins
101: 30mins
110: 1hour
111: 2hours
7.5.11 Register: COMM_TIMEOUT
Address: 0x2005
B7
B6
B5
B4
B3
CTL_ACT
0
B2
B1
B0
RSVD
CTS_TIME[2:0]
CTL_TIME[2:0]
0
RW
0
1
1
1
0
0
RW
RW
RW
RW
RW
RW
RW
CTS_TIME[2:0]
Set the short communication timeout. When this timer expires, the device set the FAULT_SYS [CTS] bit. This can be used as an alert to the
system to prevent a long communication timeout.
000: disable short communication timeout
001: 100ms
010: 2s
011: 10s (default)
100: 1min
101: 10mins
110: 30min
111: 1hour
CTL_ACT
Configure the device action when long communication timeout timer expires
0: set FAULT_SYS[CTL] and send device to SLEEP mode (default at reset)
1: Send the device to SHUTDOWN. FAULT_SYS[CTL] bit will not be set
CTL_TIME[2:0]
Set the long communication timeout. When this timer expires, the device takes the action configured by the [CTL_ACT] bit.
000: disable long communication timeout
001: 100ms
010: 2s
011: 10s
100: 1min (default)
101: 10mins
110: 30min
111: 1hour
7.5.12 Register: SPI_FIFO_UNLOCK
Address: 0x2010
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
CODE[3:0]
0
RW
0
0
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
CODE[3:0]
In UART mode - write has no impact and read always returns 0 In SPI mode - Write the unlock code 0x0A to SPI_FIFO_UNLOCK (MSB 4
bits are don’t care, e.g. 0x2A would also unlock) and followed by writing [SPI_FIFO_DIAG_GO] = 1 to do FIFO diagnostic. For detailed
steps of FIFO diagnostic, refer to safety manual. After these bits are written, read cmd doesn’t affect them while any write cmd clears
them.
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7.5.13 Register: FAULT_MSK
Address: 0x2020
B7
B6
B5
B4
B3
B2
B1
B0
MSK_COML_H
MSK_UART_SPI MSK_FCOMM_D MSK_FTONE_DE
MSK_HB
MSK_REG
MSK_SYS
MSK_PWR
ET
0
T
0
0
RW
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
MSK_COML_H
If this bit is set, [FAULT_COMM] bit in FAULT_SUMMARY register is not set (NFAULT won’t toggle) due to bits: [COML_FRAME],
[COMH_FRAME], [COML_PHY], [COMH_PHY] and registers: DEBUG_COMH_PHY, DEBUG_COMH_FRAME, DEBUG_COML_PHY,
DEBUG_COML_FRAME
0: Assert NFAULT and set [FAULT_COMM] if fault above is detected
1: No NFAULT action, [FAULT_COMM] not set due to faults above
MSK_UART_SPI
If this bit is set, [FAULT_COMM] bit in FAULT_SUMMARY register is not set (NFAULT won’t toggle) due to [STOP_DET],
[COMMCLR_DET], [UART_FRAME], [SPI_FRAME], [SPI_PHY] bits and DEBUG_UART_FRAME, DEBUG_SPI_PHY,
DEBUG_SPI_FRAME registers
0: Assert NFAULT and set [FAULT_COMM] if fault above is detected
1: No NFAULT action, [FAULT_COMM] not set due to faults above
MSK_FCOMM_D
ET
If this bit is set, [FAULT_COMM] bit in FAULT_SUMMARY register is not set (NFAULT won’t toggle) due to [FCOMM_DET]
0: Assert NFAULT and set [FAULT_COMM] if fault above is detected
1: No NFAULT action, [FAULT_COMM] not set due to faults above
MSK_FTONE_DE
T
If this bit is set, [FAULT_COMM] bit in FAULT_SUMMARY register is not set (NFAULT won’t toggle) due to [FTONE_DET]
0: Assert NFAULT and set [FAULT_COMM] if fault above is detected
1: No NFAULT action, [FAULT_COMM] not set due to faults above
MSK_HB
If this bit is set, [FAULT_COMM] bit in FAULT_SUMMARY register is not set (NFAULT won’t toggle) due to [HB_FAIL] and [HB_FAST]
0: Assert NFAULT and set [FAULT_COMM] if fault above is detected
1: No NFAULT action, [FAULT_COMM] not set due to faults above
MSK_REG
If this bit is set, [FAULT_REG] bit in FAULT_SUMMARY register is not set and NFAULT won’t toggle due to OTP fault. It doesn’t affect
FAULT_REG register.
0: Mask disabled
1: Mask enabled to prevent fault signaling
MSK_SYS
MSK_PWR
If this bit is set, [FAULT_SYS] bit in FAULT_SUMMARY register is not set and NFAULT won’t toggle due to SYS fault. It doesn’t affect
FAULT_SYS register.
0: Assert NFAULT if any bit from FAULT_SYS is set to ‘1’
1: No NFAULT action regardless of FAULT_SYS status
If this bit is set, [FAULT_PWR] bit in FAULT_SUMMARY register is not set and NFAULT won’t toggle due to PWR fault. It doesn’t affect
FAULT_PWR register.
0: Mask disabled
1: Mask enabled to prevent fault signaling
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7.5.14 Register: FAULT_RST
Address: 0x2030
B7
B6
B5
B4
B3
B2
B1
B0
RST_COML_H
RST_UART_SPI RST_FCOMM_DE RST_FTONE_DE
RST_HB
RST_REG
RST_SYS
RST_PWR
T
0
T
0
0
RW
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
RST_COML_H
Reset bits: COML_FRAME, COMH_FRAME, COML_PHY, COMH_PHY and registers: DEBUG_COMH_PHY, DEBUG_COMH_FRAME,
DEBUG_COML_PHY, DEBUG_COML_FRAME. self-cleared bit.
0: Do not reset
1: Reset to 0x00
RST_UART_SPI Reset STOP_DET, COMMCLR_DET, UART_FRAME, SPI_FRAME, SPI_PHY bits and DEBUG_UART_FRAME, DEBUG_SPI_PHY,
DEBUG_SPI_FRAME registers. self-cleared bit.
0: Do not reset
1: Reset to 0x00
RST_FCOMM_DE Reset FCOMM_DET bit, self-cleared bit.
T
0: Do not reset
1: Reset to '0'
RST_FTONE_DE Reset FTONE_DET bit, self-cleared bit.
T
0: Do not reset
1: Reset to '0'
RST_HB
Reset HB_FAIL and HB_FAST bit, self-cleared bit.
0: Do not reset
1: Reset to '0'
RST_REG
RST_SYS
RST_PWR
Resets FAULT_SUMMARY [FAULT_REG] to '0', self-cleared bit.
0: Do not reset
1: Reset to '0'
This bit is self-clear to 0 after writing to 1.
0: Do not reset
1: Reset register FAULT_SYS and [FAULT_SYS] to 0x00 and ‘0’
Resets FAULT_SUMMARY [FAULT_PWR] to '0' and register FAULT_PWR, self-cleared bit.
0: Do not reset
1: Reset
7.5.15 Register: FAULT_SUMMARY
Address: 0x2100
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
FAULT_COMM
FAULT_REG
FAULT_SYS
FAULT_PWR
0
R
0
0
0
0
0
0
0
R
R
R
R
R
R
R
FAULT_COMM
Indicate communication related fault is detected (any bits in register FAULT_COMM1, FAULT_COMM2 is set)
0: No fault
1: Fault
FAULT_REG
FAULT_SYS
FAULT_PWR
Indicate registers related fault is detected
0: No fault
1: Fault
Indicates system fault is detected (any bits in register FAULT_SYS).
0: No fault
1: Fault
Indicates a power supply fault is detected (any bits in register FAULT_PWR)
0: No fault
1: Fault
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7.5.16 Register: FAULT_REG
Address: 0x2101
B7
B6
B5
RSVD
0
B4
B3
B2
B1
B0
CONF_MON_ERR
FACTLDERR
FACT_CRC
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
CONF_MON_ER Indicates monitored 2 registers (DEV_CONF1, FAULT_MSK) have at least one bit flip. For usage, refer to paragraph: Register Bit Flip
R
Monitor.
0: No fault
1: Fault
FACTLDERR
FACT_CRC
Indicates the factory NVM registers could not be loaded from OTP.
0: No fault
1: Fault
Indicates a CRC error has occurred in the factory register space.
0: No fault
1: Fault
7.5.17 Register: FAULT_SYS
Address: 0x2102
B7
B6
LFO
0
B5
B4
DRST
0
B3
CTL
0
B2
CTS
0
B1
B0
INH
0
VALIDATE_DET
SHUTDOWN_REC
TSHUT
0
R
0
0
R
R
R
R
R
R
R
VALIDATE_DET
Indicates device transitioned to VALIDATE mode
0: no transitioned to VALIDATE MODE
1: transitioned to VALIDATE MODE
LFO
Indicated LFO frequency is off by +/-25%
0: no fault
1: fault
SHUTDOWN_RE Indicates the device was shut down using SHUTDOWN ping. If this bit is set, the COML and COMH RX are both disabled at wake up as a
C
way to isolate itself from the stack. Send another wake ping or [SOFT_RESET] to re-enable COMH/L RX.
0: The previous SHUTDOWN was normal
1: The previous SHUTDOWN was caused by ping, which is not a usual SHUTDOWN method, indicating potential communication issue with
the device
DRST
CTL
Indicates a digital reset has occurred.
0: no digital reset
1: digital reset has occurred
Indicates a long communication timeout occurred. Device action is configured by [CTL_ACT]. This bit is not observable if the action is set to
device shutdown.
0: No fault
1: long communication timeout occurs. Observable if long timeout action is set to SLEEP
CTS
Indicates a short communication timeout occurred. No action from the device. This can be served as an alert to system before reaching
long communication timeout.
0: No fault
1: short communication timeout occurs
TSHUT
INH
Indicates the previous shutdown was due to thermal shutdown
0: die temp is < thermal shutdown threshold
1: the previous shutdown was to due thermal shutdown
Indicates INH PMOS is enabled
0: INH driver is off
1: INH driver enabled, pulls pin up to BAT
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7.5.18 Register: FAULT_PWR
Address: 0x2103
B7
B6
RSVD
0
B5
B4
B3
B2
B1
B0
CVDD_UV_DRST
CVDD_OV
DVDD_OV
AVDDREF_OV
AVAO_SW_FAIL
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
CVDD_UV_DRST Indicates CVDDUV fault caused DRST. Shutdown/power up event shall not trigger this fault.
0: no fault
1: fault
CVDD_OV
Indicates an over voltage fault on the CVDD pin
0: no fault
1: fault
DVDD_OV
Indicates an over voltage fault on the DVDD pin
0: no fault
1: fault
AVDDREF_OV
Indicates an over voltage fault on the AVDD_REF internal supply
0: no fault
1: fault
AVAO_SW_FAIL Indicates a fault is detected on the AVAO_REF switch.
0: no fault
1: fault
7.5.19 Register: FAULT_COMM1
Address: 0x2104
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
FCOMM_DET
FTONE_DET
HB_FAIL
HB_FAST
UART_FRAME
COMMCLR_DET
STOP_DET
0
R
0
0
0
0
0
0
0
R
R
R
R
R
R
R
FCOMM_DET
Indicates the fault status bit in comm frame is set by stack devices. At least a fault in stack devices happened. Only apply to non-bq79606
family
0: no fault
1: fault
FTONE_DET
HB_FAIL
Indicates the fault tone is detected, COM Port in sleep mode if work with non-bq79606 (Detection is monitoring the COML side if [DIR_SEL]
= 0 and vice versa.)
0: no fault
1: fault
Indicates HB tone is NOT detected within tHB_PERIOD, not supported with BQ79606A-Q1 ( Detection is monitoring the COML side if
[DIR_SEL] = 0 and vice versa.)
0: no fault, HB tone detected as expected
1: fault
HB_FAST
Indicates HB tone is detected within tHB_FAST (too frequent), not supported with BQ79606A-Q1 ( Detection is monitoring the COML side if
[DIR_SEL] = 0 and vice versa.) This bit could also be set when [FTONE_DET]=1 depends on how soon the Fault Tone is detected from
previous Heartbeat tone.
0: no fault
1: fault
UART_FRAME
Indicates a UART FAULT detected when receiving command or transmitting response frames Further detail of the fault information is
available in the DEBUG_UART_FRAME register
0: no fault
1: fault
COMMCLR_DET A UART/SPI communication clear signal is detected. This bit is set when Sleep2active ping is sent in UART mode. While in SPI mode, it is
not set when sleep2active ping is sent.
0: no UART/SPI Comm Clear
1: UART/SPI Comm Clear detected
STOP_DET
Indicates and unexpected STOP condition is received. Apply to UART mode. This bit is set when Sleep2active ping is sent in ACTIVE.
0: no fault
1: fault
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7.5.20 Register: FAULT_COMM2
Address: 0x2105
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
SPI_FRAME
SPI_PHY
COML_FRAME
COML_PHY
COMH_FRAME
COMH_PHY
0
R
0
0
0
0
0
0
0
R
R
R
R
R
R
R
SPI_FRAME
Indicates a SPI frame level FAULT detected when receiving command or transmitting response frames. Further detail of the fault
information is available in the DEBUG_SPI_FRAME register
0: no fault
1: fault
SPI_PHY
Indicates a SPI bit level FAULT detected when receiving command or transmitting response frames. Further detail of the fault information is
available in the DEBUG_SPI_PHY register
0: no fault
1: fault
COML_FRAME
COML_PHY
COMH_FRAME
COMH_PHY
Indicate a COML byte level fault detected when receiving response frames. Further details of the fault information is available in
DEBUG_COML_FRAME
0: no fault
1: fault
Indicate a COML bit level fault detected, which would cause at least a byte level (RC_RR) fault. Further details of the fault information are
available in DEBUG_COML_PHY register.
0: no fault
1: fault
Indicate a COMH byte level fault detected when receiving response frames. Further details of the fault information is available in
DEBUG_COMH_FRAME
0: no fault
1: fault
Indicate a COMH bit level fault detected, which would cause at least a byte level (RC_RR) fault. Further details of the fault information are
available in DEBUG_COMH_PHY register.
0: no fault
1: fault
7.5.21 Register: DEV_DIAG_STAT
Address: 0x2110
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
PWR_DIAG_RDY
INH_STAT
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
PWR_DIAG_RDY Indicates a power supply BIST test is done. It is cleared when [PWR_DIAG_GO] bit is set.
0: BIST is not done
1: BIST is done
INH_STAT
Indicates INH Pin see VINH_DET, this bit reflects real time value of pin INH
0: Voltage not detected
1: Voltage detected
7.5.22 Register: PARTID
Address: 0x2120
B7
B6
B5
B4
B3
B2
B1
B0
REV[7:0]
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
REV[7:0]
Device revision 0x00 = A0, 0x01 = A1, 0x02 = A2, etc.
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7.5.23 Register: DIE_ID1
Address: 0x2121
B7
B6
B5
B4
B3
B2
B1
B0
ID[7:0]
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
ID[7:0]
Digital reset value 0x00, after factory NVM loaded successfully, it is value in the NVM.
7.5.24 Register: DIE_ID2
Address: 0x2122
B7
B6
B5
B4
B3
B2
B1
B0
ID[7:0]
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
ID[7:0]
Digital reset value 0x00, after factory NVM loaded successfully, it is value in the NVM.
7.5.25 Register: DIE_ID3
Address: 0x2123
B7
B6
B5
B4
B3
B2
B1
B0
ID[7:0]
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
ID[7:0]
Digital reset value 0x00, after factory NVM loaded successfully, it is value in the NVM.
7.5.26 Register: DIE_ID4
Address: 0x2124
B7
B6
B5
B4
B3
B2
B1
B0
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
ID[7:0]
Digital reset value 0x00, after factory NVM loaded successfully, it is value in the NVM.
7.5.27 Register: DIE_ID5
Address: 0x2125
B7
B6
B5
B4
B3
B2
B1
B0
ID[7:0]
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
ID[7:0]
Digital reset value 0x00, after factory NVM loaded successfully, it is value in the NVM.
7.5.28 Register: DIE_ID6
Address: 0x2126
B7
B6
B5
B4
B3
B2
B1
B0
ID[7:0]
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
ID[7:0]
Digital reset value 0x00, after factory NVM loaded successfully, it is value in the NVM.
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7.5.29 Register: DIE_ID7
Address: 0x2127
B7
B6
B5
B4
B3
B2
B1
B0
ID[7:0]
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
ID[7:0]
Digital reset value 0x00, after factory NVM loaded successfully, it is value in the NVM.
7.5.30 Register: DIE_ID8
Address: 0x2128
B7
B6
B5
B4
B3
B2
B1
B0
ID[7:0]
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
ID[7:0]
Digital reset value 0x00, after factory NVM loaded successfully, it is value in the NVM.
7.5.31 Register: DIE_ID9
Address: 0x2129
B7
B6
B5
B4
B3
B2
B1
B0
ID[7:0]
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
ID[7:0]
Digital reset value 0x00, after factory NVM loaded successfully, it is value in the NVM.
7.5.32 Register: DEBUG_CTRL_UNLOCK
Address: 0x2200
B7
B6
B5
B4
B3
B2
B1
B0
CODE[7:0]
0
RW
0
0
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
CODE[7:0]
Write the unlock code (0xA5) to this register to activate the setting in the DEBUG_COMM_CTRL register. Any other value than the unlock
code will deactivate any effect in the DEBUG_COMM_CTRL setting and return to the device’s normal setting. This register doesn't affect
DEBUG_COMM_STAT register.
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7.5.33 Register: DEBUG_COMM_CTRL
Address: 0x2201
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
COML_TX_EN
COML_RX_EN
COMH_TX_EN
COMH_RX_EN UART_VIF_BAUD USER_UART_E
N
USER_DAISY_EN
0
RW
1
1
1
1
0
0
0
RW
RW
RW
RW
RW
RW
RW
COML_TX_EN
Enable COML transmitter
0: disable
1: enable
COML_RX_EN
COMH_TX_EN
COMH_RX_EN
Enable COML receiver
0: disable
1: enable
Enable COMH transmitter
0: disable
1: enable
Enable COMH receiver
0: disable
1: enable
UART_VIF_BAUD This bit changes the baud rate of UART and Daisy Chain (Also called VIF) to 250kb/s. Useful on Daisy Chain debug. When system set all
the daisy chain devices to the 250kb/s baud rate, it slows down the response byte through the Daisy Chain to increase the robustness of
the Daisy Chain for debug purpose.
0: 1Mbps
1: 250kbps
USER_UART_EN This bit enables [UART_VIF_BAUD] setting
0: disable
1: enable
USER_DAISY_E This bit enables the setting of bits [6:3] in this register
N
0: the setting of bits [6:3 ] of current register has no effect
1: the device will configure the COML and COMH per current register setting
7.5.34 Register: DEBUG_COMM_STAT
Address: 0x2300
B7
B6
RSVD
0
B5
B4
B3
B2
B1
B0
HW_DAISY_DRV
COML_TX_ON
COML_RX_ON
COMH_TX_ON
COMH_RX_ON
0
0
1
0
0
1
1
R
R
R
R
R
R
R
R
HW_DAISY_DRV Indicates the COML and COMH are controlled by the device itself or by MCU control
0: the DEBUG_COMM_CTRL [USER_DAISY_EN] = 1. COML and COMH are under manual control through DEBUG_COMM_CTRL
register
1: COML and COMH are controlled by the device
COML_TX_ON
COML_RX_ON
COMH_TX_ON
COMH_RX_ON
Show the current COML transmitter status
0: Disabled
1: Enabled
Show the current COML receiver status
0: Disables
1: Enables
Show the current COMH transmitter status
0: Disabled
1: Enabled
Show the current COMH receiver status
0: Disabled
1: Enabled
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7.5.35 Register: DEBUG_SPI_PHY
Address: 0x2301
B7
RSVD
0
B6
B5
B4
B3
B2
B1
B0
FMT_ERR
COMCLR_ERR
TXDATA_UNEXP RXDATA_UNEXP
TXFIFO_OF
TXFIFO_UF
RXFIFO_OF
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
FMT_ERR
When not in Host Read mode (after sending a write cmd frame), indicates malformed cmd is received: 1. first byte of data after nCS falling
edge is 0xFF 2. devices receives not multiple of 8bit . 3. In ACTIVE, nCS pulses low without SCLK toggling (send SLP2ACT ping) Comm
clear doesn’t trigger this fault. This fault doesn’t lock down SPI interface.
0: No fault
1: Fault
COMCLR_ERR
More than 8 SCLK pulses are received during a comm clear. Once this fault is detected, device ignores the malformed comm clear. This
fault doesn’t affect SPI_RDY nor data storing into RX/TX FIFO.
0: No fault
1: Fault
TXDATA_UNEXP This fault occurs when: 1. device receives unexpected data from itself or daisy chain after a Comm clr OR 2. device receives unexpected
data from daisy chain(or from bq79600) after a TX FIFO timeout. Once this fault is detected, device doesn’t store any new data into
RX/TX FIFO. Device sends out 0xFF on MISO after current byte finished transmission(FIFO data mask happens at byte boundary).
SPI_RDY held low till Comm Clear detected. Comm Clear needed for recovery.
0: No fault
1: Fault
RXDATA_UNEXP Host sends data other than 0xFF during Device Read mode OR initiates SPI communication when SPI_RDY = 0 (e.g. While FIFO2 is being
filled up, host continues reading FIFO2 right after FIFO1 is read out. SPI_DRY is low at this point) Once this fault is detected, device
doesn’t store any new data into RX/TX FIFO. Device would sends out 0xFF on MISO after current byte finished transmission(FIFO data
mask happens at byte boundary). SPI_RDY held low till Comm Clear detected. Comm Clear needed for recovery.
0: No fault
1: Fault
TXFIFO_OF
TXFIFO_UF
If SPI module receives data (from itself or daisy chain) when current FIFO is full and 2nd FIFO is not empty (host hasn't complete reading
the 2nd FIFO). Once this fault is detected, device doesn’t store any new data into RX/TX FIFO. Device sends out 0xFF on MISO after
current byte finished transmission(FIFO data mask happens at byte boundary). SPI_RDY held low till Comm Clear detected. Comm Clear
needed for recovery.
0: No fault
1: Fault
In Host Read mode, when both FIFOs are empty and the host continues to send clocks for more read data (send 0xFF through MOSI). SPI
Slave sets this fault flag and continues to send 0xFF on MISO when host requests data. Once this fault is detected, device doesn’t store
any new data into RX/TX FIFO. Device sends out 0xFF on MISO after current byte finished transmission(FIFO data mask happens at byte
boundary). SPI_RDY held low till Comm Clear detected. Comm Clear needed for recovery. (FIFO 1 is read out, FIFO2 is still buffering, if
reading happens, it is RXDATA_UNEXP fault) Once FIFO is empty, device rejects any 0xFF until nCS going high.
0: No fault
1: Fault
RXFIFO_OF
While device is receiving command frame, more data is sent than device can accommodate in RX FIFO. Once this fault is detected, device
doesn’t store any new data into RX/TX FIFO. Device sends out 0xFF on MISO after current byte finished transmission(FIFO data mask
happens at byte boundary). SPI_RDY held low till Comm Clear detected. Comm Clear needed for recovery. Follow “Flow to send write
cmd frame into bq79600”to avoid this fault.
0: No fault
1: Fault
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7.5.36 Register: DEBUG_SPI_FRAME
Address: 0x2302
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
TR_SOF
TR_WAIT
RC_IERR
RC_SOF
RC_BYTE_ERR
RC_CRC
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
TR_SOF
Indicates that a SPI COMM CLEAR is received while there is data in output FIFO (SPI_RDY is 0 or SPI_RDY = 1 and receiving new data
from VIF.) If SPI_RDY = 1 and not receiving new data from VIF while receiving COMM CLEAR, it doesn’t assert this bit.
0: No fault
1: Fault
TR_WAIT
RC_IERR
Indicates that a SPI COMM CLEAR is received while there is no data in output FIFO regardless of SPI_RDY.
0: No fault
1: Fault
Detects initialization byte error in the received command frame. Example: •reserved command bits in the “INIT byte”is set, •expected
to a cmd “INIT byte’, but it is configured as response frame instead •extra data is sent other than one cmd frame during one nCS low
All bytes that follow are discarded until a Comm Clear is received or a SOF due to a properly formed new command is received (nCS
falling, etc).
0: No fault
1: Fault
RC_SOF
Detects a start-of-frame (SOF) error. Mostly, this is SPI COMM CLEAR is received on the SPI before the current frame is finished, e.g.
partial cmd frame is sent
0: No fault
1: Fault
RC_BYTE_ERR
Device receives data from the VIF that needs to go out on SPI, while host send data into device through SPI. (TXDATA_UNEXP should
also be set) CRC is not calculated and doesn’t forward communication in daisy chain. All bytes that follow are ignored until a
communication CLEAR is received.
0: No fault
1: Fault
RC_CRC
Detects CRC error in the received command frame from SPI. The frame will be considered as discarded frame. Frame CRC is calculated
only if no physical level error, IERR, BERR, SOF error detected.
0: No fault
1: Fault
7.5.37 Register: DEBUG_UART_FRAME
Address: 0x2303
B7
B6
B5
B4
B3
B2
B1
B0
RSVD
TR_SOF
TR_WAIT
RC_IERR
RC_SOF
RC_BYTE_ERR
RC_CRC
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
TR_SOF
Indicates that a UART COMM CLEAR is received while the device is still transmitting data to host.
0: No fault
1: Fault
TR_WAIT
RC_IERR
The device is waiting for its turn to transfer a response out but the action is terminated because: 1. the device receives a UART COMM
CLEAR signal, or 2. the device receives a new command This bit is valid when broadcast or stack read command has been issued.
0: No fault
1: Fault
Detects initialization byte error in the received command frame. Example: •a STOP error is detected, •reserved command bits in the
“INIT byte”is set, •expected a “INIT byte’, but it is configured as response frame instead (e.g. 1st byte received after COMM CLEAR
signal should but a “INIT byte”) All bytes that follow are ignored until a communication CLEAR is received.
0: No fault
1: Fault
RC_SOF
Detects a start-of-frame (SOF) error. Mostly, this is UART COMM CLEAR is received on the UART before the current frame is finished.
0: No fault
1: Fault
RC_BYTE_ERR
Other than INIT byte, if STOP error is detected in rest of byte in the frame or TX receives data while RX is using. CRC is not calculated and
doesn’t forward communication in daisy chain. All bytes that follow are ignored until a communication CLEAR is received.
0: No fault
1: Fault
RC_CRC
Detects CRC error in the received command frame from UART. The frame will be considered as discarded frame. Frame CRC is calculated
only if no physical level error, IERR, BERR, SOF error detected
0: No fault
1: Fault
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7.5.38 Register: DEBUG_COMH_PHY
Address: 0x2304
B7
B6
RSVD
0
B5
B4
PERR
0
B3
B2
B1
B0
BIT
0
BERR_TAG
SYNC2
SYNC1
0
0
0
0
0
R
R
R
R
R
R
R
R
PERR
Pertain to received response frame from stack device only. PERR is a lump bit of all physical errors. Any error bit that is set in this register
will also set the [PERR] bit. However, abnormality that isn’t classified in the register can also trigger the [PERR] bit (e.g. detecting missing
of data or wrong data order.)
0: no comm error detected
1: detected abnormality of the received comm frame. BERR is asserted to the forwarded communication.
BERR_TAG
SYNC2
Indicates BERR bit is set in at least one byte in received response frame from stack device
0: received response frame doesn’t have BERR
1: received response frame has BERR
Timing information extracted from the demodulation of the preamble half-bit and the two full bits of synchronization is outside of the
expected window, this bit is set and the byte is not processed.
0: No fault
1: Fault
SYNC1
BIT
If the demodulation of the preamble half-bit and the two full bits of synchronization data have errors and the timing is likely not correct, this
bit is set and the byte is not processed.
0: No fault
1: Fault
The device has detected a data bit, however, the detection samples is not enough to guarantee a strong ‘1’or ‘0’.
0: No fault
1: Fault
7.5.39 Register: DEBUG_COMH_FRAME
Address: 0x2305
B7
B6
RSVD
0
B5
B4
B3
B2
B1
B0
RR_IERR
RR_SOF
RR_BYTE_ERR
RR_UNEXP
RR_CRC
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
RR_IERR
Detects initialization byte error in the received response frame. This may due to improper formatting of a byte such as a frame initialization
byte is expected, but start-of-frame (SOF) bit is not set, or an invalid frame type is selected. All bytes from VIF that follows are ignored until
a SOF bit is received (BQ79600 still forwards data from VIF to UART/SPI).
0: No fault
1: Fault
RR_SOF
Valid when [DIR_SEL] = 0. Detects a start-of-frame (SOF) error on COMH. The SOF bit shall only be set in the initialization frame but the
SOF bit is set in the current frame that is not expected.
0: No fault
1: Fault
RR_BYTE_ERR
Valid when [DIR_SEL] = 0. Detected any byte errors, other than the error in the initialization byte, in the received response frame. If the
byte err is on the last byte of the CRC, it would check CRC in addition to discarding the frame. This error can be triggered by one or more
error bit set in the DEBUG_COMH_PHY register. All bytes from VIF that follows are ignored until a SOF bit is received (BQ79600 still
forwards data from VIF to UART/SPI).
0: No fault
1: Fault
RR_UNEXP
RR_CRC
If [DIR_SEL] = 1, but device received response frame from COMH which is an invalid condition and device will set this error bit.
0: No fault
1: Fault
Indicates one or more COMH response frames being discarded due to CRC error.
0: No fault
1: Fault
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7.5.40 Register: DEBUG_COML_PHY
Address: 0x2306
B7
B6
RSVD
0
B5
B4
PERR
0
B3
B2
B1
B0
BIT
0
BERR_TAG
SYNC2
SYNC1
0
0
0
0
0
R
R
R
R
R
R
R
R
PERR
Pertain to received response frame from stack device only. PERR is a lump bit of all physical errors. Any error bit that is set in this register
will also set the [PERR] bit. However, abnormality that isn’t classified in the register can also trigger the [PERR] bit (e.g. detecting missing
of data or wrong data order.)
0: no comm error detected
1: detected abnormality of the received comm frame. BERR is asserted to the forwarded communication.
BERR_TAG
SYNC2
Indicates BERR bit is set in at least one byte in received response frame from stack device
0: received response frame doesn’t have BERR
1: received response frame has BERR
Timing information extracted from the demodulation of the preamble half-bit and the two full bits of synchronization is outside of the
expected window, this bit is set and the byte is not processed.
0: No fault
1: Fault
SYNC1
BIT
If the demodulation of the preamble half-bit and the two full bits of synchronization data have errors and the timing is likely not correct, this
bit is set and the byte is not processed.
0: No fault
1: Fault
The device has detected a data bit, however, the detection samples is not enough to guarantee a strong ‘1’or ‘0’.
0: No fault
1: Fault
7.5.41 Register: DEBUG_COML_FRAME
Address: 0x2307
B7
B6
RSVD
0
B5
B4
B3
B2
B1
B0
RR_IERR
RR_SOF
RR_BYTE_ERR
RR_UNEXP
RR_CRC
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
RR_IERR
Detects initialization byte error in the received response frame. This may due to improper formatting of a byte such as a frame initialization
byte is expected, but start-of-frame (SOF) bit is not set, or an invalid frame type is selected. All bytes from VIF that follows are ignored until
a SOF bit is received (BQ79600 still forwards data from VIF to UART/SPI).
0: No fault
1: Fault
RR_SOF
Valid when [DIR_SEL] = 1. Detects a start-of-frame (SOF) error on COML. The SOF bit shall only be set in the initialization frame but the
SOF bit is set in the current frame that is not expected.
0: No fault
1: Fault
RR_BYTE_ERR
Valid when [DIR_SEL] = 1. Detected any byte errors, other than the error in the initialization byte, in the received response frame. If the
byte err is on the last byte of the CRC, it would check CRC in addition to discarding the frame. This error can be triggered by one or more
error bit set in the DEBUG_COML_PHY register. All bytes from VIF that follows are ignored until a SOF bit is received (BQ79600 still
forwards data from VIF to UART/SPI).
0: No fault
1: Fault
RR_UNEXP
RR_CRC
If [DIR_SEL] = 0, but device received response frame from COML which is an invalid condition and device will set this error bit.
0: No fault
1: Fault
Indicates one or more COML response frames being discarded due to CRC error.
0: No fault
1: Fault
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8 Application and Implementation
备注
以下应用部分的信息不属于TI 组件规范,TI 不担保其准确性和完整性。客户应负责确定 TI 组件是否适
用于其应用。客户应验证并测试其设计,以确保系统功能。
8.1 Application Information
This section is concerned with the external operation, what external components are required to add to the
device to make it usable in a particular design, and how to calculate the values for those external components.
8.2 Typical Applications
8.2.1 Bridge With Reverse Wakeup in UART
The following application circuit is used when user chooses to use UART interface and any of those features:
reverse wakeup, ring architecture, fault/heartbeat tone.
12V Battery
10
Low
Voltage
Domain
How
Voltage
Domain
50V 0.1uF
AFE fault
100K Real Time Clock
KEY ON
SBC
(PMIC)
3.3V/5V
CAN_WK
0.1uF
DVDD
INH
0.22uF
5.5V-40V
BAT
Twisted pair
cabling
CVDD
VIO
VIO
Ratio:1 to 1
0.22uF
51
100K
10K
10K
COMHP
PESD5V0L2BT
Cap/
Cap+choke/
XFMR
100pF
100pF
BQ battery
monitor
BQ battery
monitor
GPIO0
MOSI/RX
MISO/TX
1K
GPIO1
GPIO2
Isolation
51
MCU
COMHN
COMLP
SCLK
nCS
BQ79600-Q1
GPIO3
100pF
100pF
GND
nUART/SPI (SPI_RDY)
NFAULT
GPIO4
GPIO5
51
PESD5V0L2BT
GND
Cap/
Cap+choke/
XFMR
100pF
GND
1K
Isolation
51
COMLN
GND
100pF
图8-1. Typical Bridge with Reverse Wakeup in UART Applications Circuit
8.2.1.1 Design Requirements
表8-1 describes the design parameters.
表8-1. Recommended Design Requirement
PARAMETER
VALUE
UART speed
1Mbps
8.2.1.2 Detailed Design Procedure
8.2.1.2.1 MCU Interface (UART, NFAULT)
To select UART interface, connect nCS, nUART/SPI and SCLK pins to GND. UART interface includes RX/TX
pins. They are pulled up through a 10-100kΩresistor to VIO like figure above.
NFAULT pin, if not used, connect to GND. Otherwise, pull it up wtih 100kΩto VIO.
8.2.1.2.2 Daisy Chain Interface
Given that galvanic isolation is expected between BQ79600-Q1 and stack BQ devices, transformer isolation is
recommended. 节8.2.1 shows the interface components values.
Contact TI for transformer recommendations.
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8.2.1.2.3 INH Connection
INH pin is connected to the power management IC (PMIC) enable pin such that when reverse wakeup is
triggered, INH would be pulled towards BAT and enable PMIC. INH pin should always be lower than BAT pin.
The 100kΩconnected to INH in 节8.2.1 is to make sure INH pin potential is defined when INH driver is off.
8.2.1.3 Application Performance Plot
图8-2. Command and Response Frame for Read from 2 Stack Devices
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图8-3. Zoomed View of Response Frame for 8 Registers Read from Stack Devices
8.2.2 Bridge Without Reverse Wakeup in SPI
The following application circuit is used when user chooses to use SPI interface and none of those features:
reverse wakeup, ring architecture, fault/heartbeat tone.
12V Battery
Low
Voltage
Domain
How
Voltage
Domain
5V
Real Time Clock
KEY ON
SBC
(PMIC)
3.3V/5V
CAN_WK
0.1uF
DVDD
INH
0.22uF
BAT
Twisted pair
cabling
CVDD
VIO
VIO
Ratio:1 to 1
0.22uF
51
100K 100K 10K
10K
10K
COMHP
PESD5V0L2BT
Cap/
Cap+choke/
XFMR
100pF
100pF
BQ battery
monitor
BQ battery
monitor
GPIO0
MOSI/RX
MISO/TX
1K
GPIO1
GPIO2
Isolation
51
MCU
COMHN
COMLP
SCLK
nCS
BQ79600-Q1
GPIO3
100pF
100pF
nUART/SPI (SPI_RDY)
NFAULT
GPIO4
GPIO5
51
10K
PESD5V0L2BT
GND
Cap/
Cap+choke/
XFMR
100pF
GND
1K
Isolation
51
COMLN
GND
100pF
RED is optional
图8-4. Typical Bridge without Reverse Wakeup in SPI Applications Circuit
8.2.2.1 Design Requirements
表8-2 describes the design parameters.
表8-2. Key Requirements
PARAMETER
VALUE
SPI speed
2 - 6Mbps
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8.2.2.2 Detailed Design Procedure
8.2.2.2.1 MCU Interface (SPI, SPI_RDY, NFAULT)
To select SPI interface, connect MOSI, MISO, SCLK, nCS, nUART/SPI as figure above shows. Connect
SPI_RDY to MCU GPIO port for SPI flow control use, 节7.3.2.1.2.2.1.
NFAULT pin, if not used, connect to GND. Otherwise, pull it up wtih 100KΩto VIO.
8.2.2.2.2 Daisy Chain Interface
Refer to 节8.2.1.2.2.
8.2.2.3 Application Performance Plot
See Application Performance Plot for application performanace curve.
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9 Power Supply Recommendations
The BQ79600-Q1 can be powered by either directly from 12-V battery (nominal 9 - 16V) or regulated 5-V supply.
The design consideration for both options are described in the table below.
表9-1. Supply Design Considerations
12-V BATTERY (nominal 9 - 16 V)
REGULATED 5-V SUPPLY
3.125 - 5.25V, decouple 0.1-µF
capacitor to gnd
VIO
BAT
3.125 - 5.25V, decouple 0.1-µF capacitor to gnd
4.75 - 5.25V, decouple 0.22-µF
capacitor to gnd
Put RC between supply battery and BAT pin, R = 10Ω, C = 0.1-µF capacitor.
Make sure BAT pin sees no less than 5.5V and no larger than 40V.
CVDD
DVDD
Decouple 0.22-µF capacitor to gnd
Decouple 0.22-µF capacitor to gnd
shorted to BAT
Decouple 0.22-µF capacitor to gnd
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10 Layout
The layout for this device must be designed carefully. Any design outside these guidelines can affect the
communication robustness and EMI performance. Care must be taken in the layout of signals to and from the
device to avoid coupling noise onto sensitive inputs. The layout of ground and power connections, as well as
communication signals, should also be made carefully.
10.1 Layout Guidelines
10.1.1 Ground Planes
It is very important to establish a clean grounding scheme to ensure best performance of the device. There is
one ground pin (GND) on the device. It is a good practice to use top and bottom PCB layers for signal routing,
and use middle layers as ground planes. Even on a PCB layer that is mainly for signal routing, it is good practice
to have a small island of ground pour if possible to provide a low-impedance ground, rather than simply a via
through the ground trace to an lower ground plane. Create a keep-out area (no other traces and no ground
plane) around the daisy chain components in all PCB layers.
There is a strong recommendation to have a minimum of 4 layers in the PCB, with one fully dedicated layer as
an unbroken VSS plane (except thermal reliefs). Avoid placing tracks on this layer to maintain the unbroken
integrity of the plane structure.
10.1.2 Bypass Capacitors for Power Supplies
The bypass capacitors of the following pins must be placed as close to the device pins as possible to ensure
proper performance.
• BAT, VIO, CVDD, DVDD
10.1.3 UART/SPI communication
The UART/SPI interface (MISO/TX, MOSI/RX, SCLK, nCS, nUART/SPI_RDY) between MCU and BQ79600-Q1
shall be kept as short and straight as possible for optimized EMC performance.
10.1.4 Daisy Chain Communication
It is important to have proper layout on the COMHP/N and COMLP/N circuits in order to have the best robust
daisy chain communication.
• Keep differential traces as short as possible and as straight as possible. Minimize turns and avoid any
looping on the traces.
• Keep the differential traces on the same layers. Run the trace in parallel with shielding and matching trace
impedance.
• Place the isolation components close to the connectors.
• Create a keep-out area (no other traces and no ground plane) around the daisy chain components in all PCB
layers.
10.2 Layout Example
This section presents the BQ79600-Q1 Evaluation Module (EVM) design as a layout example. Given the EVM
doesn't have an MCU, the example of UART/SPI connection layout is not optimized.
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图10-1. Top Layer Layout
图10-2. Signal 1 Layer Layout
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图10-3. Signal 2 Layer Layout
图10-4. Bottom Layer Layout
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11 Device and Documentation Support
11.1 Device Support
11.2 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
11.3 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.4 支持资源
TI E2E™ 中文支持论坛是工程师的重要参考资料,可直接从专家处获得快速、经过验证的解答和设计帮助。搜索
现有解答或提出自己的问题,获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的使用条款。
11.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
11.6 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
11.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
Copyright © 2022 Texas Instruments Incorporated
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BQ79600-Q1
ZHCSR35A –NOVEMBER 2019 –REVISED AUGUST 2020
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12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ79600PWRQ1
ACTIVE
TSSOP
PW
16
2000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BQ79600
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ79600PWRQ1
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
TSSOP PW 16
SPQ
Length (mm) Width (mm) Height (mm)
356.0 356.0 35.0
BQ79600PWRQ1
2000
Pack Materials-Page 2
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
4.55
NOTE 3
8
9
0.30
16X
4.5
4.3
NOTE 4
1.2 MAX
0.19
B
0.1
C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
A
20
0 -8
DETAIL A
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
16
1
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
(PREFERRED)
SOLDER MASK DETAILS
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
16
1
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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