BQ79631-Q1 [TI]
具有电压、电流和绝缘电阻检测功能的汽车类高电压电池包监测器;
| 型号： | BQ79631-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有电压、电流和绝缘电阻检测功能的汽车类高电压电池包监测器 电池 |
| 文件： | 总10页 (文件大小：1360K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BQ79631-Q1
ZHCSPF4 –DECEMBER 2021
BQ79631-Q1 具有电压、电流和绝缘电阻监测功能、适用于EV/BMS 高压汽车
类应用的UIR 传感器
1 特性
2 应用
• 符合汽车应用要求
• 具有符合AEC-Q100 标准的下列特性：
– 器件温度等级1：–40°C 至+125°C 环境工作
温度范围
– 器件HBM ESD 分类等级2
– 器件CDM ESD 分类等级C4B
• 符合功能安全标准
• 全电动、插电式混合动力和混合动力汽车
3 说明
BQ79631-Q1 提供高精度测量，能够测量来自高压节
点的分压电压，例如电池接线盒 (BJB) 或电池切断单
元 (BDU) 系统中的 Pack+（HV 电池正极）、Fuse、
Charge（端口）、Link（负载）。可以使用集成式数
字低通滤波器测量关键电压。该器件具有高度精确的集
成电流检测 ADC，能够测量低侧分流电阻器中的电
流。该器件能使用内部 ADC 测量绝缘电阻，并能控制
此测量所需的任何开关方案。有八个 GPIO/辅助输入
可用于热敏电阻测量、驱动继电器、测量电压以及用作
外围 SPI 器件的主 SPI 接口。隔离式双向菊花链端口
支持基于电容器或变压器的隔离。该器件还支持通过
UART 进行通信。
– 专为功能安全应用开发
– 可帮助进行ISO 26262 系统设计的文档
– 系统可满足ASIL D 级要求
– 硬件可满足ASIL D 要求
• 带集成滤波的差分电压测量
– Pack+、Fuse、Link±、Charge± 测量
– 隔离电阻电压测量
• 集成式精密电流测量
– 支持低侧分流电阻器
• 绝缘电阻监控功能
• 8 个GPIO 输入可用作IO、SPI、ADC 和温度检测
• 隔离式差分菊花链通信，采用可选的环形架构
器件信息
封装(1)
封装尺寸（标称值）
器件型号
BQ79631-Q1
10.00mm x 10.00mm
HTQFP（64 引脚）
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
– 通过消除安全MCU、CAN 收发器和多线接口简
化BJB/BDU 系统
• UART 主机接口
• 同步电流和电压测量
• 可与其他电芯和UI 监视器堆叠和同步，如16S
（BQ79616-Q1、BQ79656-Q1）、14S
（BQ79614-Q1、BQ79654-Q1）、12S
（BQ79612-Q1、BQ79652-Q1）和BQ79631
• 内置SPI 主器件
precharge
R
BJB/BDU
HV Separator
(PYROFUSE)
PACK+
VFUSE
LINK+
CHARGE+
HALL SENSOR
4
1
3
5
6
:
1
PACK MEASUREMENT
2
7
8
INSULATION MONITORING
LINK MEASUREMENT
CHARGE MEASUREMENT
HALL SENSOR
:
:
3
4
Rstring Switch
Control
5
6
BQ79631-Q1
DC fast
Charging
Port
VFUSE MEASUREMENT
:
LOAD
OC detect
Contactor
Control
---------------
Relay Driver
INSULATION
RESISTANCE
Current
Sense
UART
DIG
Chassis
Gnd
:
:
AMP
ISOLATOR
2
EEPROM
SAFETY
MCU
:
8
7
CAN
Rsense
LINK-
CHARGE-
PACK-
Either/OR
简化版系统图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSER7
BQ79631-Q1
ZHCSPF4 –DECEMBER 2021
www.ti.com.cn
4 说明（续）
主机与 BQ79631-Q1 之间的通信可以通过器件的专用 UART 接口或者通信桥接器件 BQ79600-Q1 进行连接。此
外，隔离式差分菊花链通信接口允许主机通过单个接口与其他 UIR 监视器甚至电芯监视器进行通信。可以将菊花
链通信接口配置为环形架构，以使主机在通信线路中断时能够与堆叠任一端的器件进行通信。
Copyright © 2022 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: BQ79631-Q1
BQ79631-Q1
ZHCSPF4 –DECEMBER 2021
www.ti.com.cn
5 Device and Documentation Support
5.1 Device Support
5.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
5.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: BQ79631-Q1
BQ79631-Q1
ZHCSPF4 –DECEMBER 2021
www.ti.com.cn
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: BQ79631-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
19-Dec-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ79631PAPRQ1
ACTIVE
HTQFP
PAP
64
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
BQ79631
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
GENERIC PACKAGE VIEW
PAP 64
10 x 10, 0.5 mm pitch
HTQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226442/A
www.ti.com
PACKAGE OUTLINE
TM
PAP0064F
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
10.2
9.8
B
NOTE 3
64
49
PIN 1 ID
1
48
10.2
9.8
12.2
TYP
11.8
NOTE 3
16
33
17
32
A
0.27
64X
60X 0.5
0.17
0.08
C A B
4X 7.5
C
SEATING PLANE
1.2 MAX
(0.127)
TYP
SEE DETAIL A
17
32
0.25
GAGE PLANE
(1)
8X (R0.091)
NOTE 4
33
16
0.15
0.05
0.08 C
0 -7
0.75
0.45
6.5
5.3
DETAIL A
65
A
17
TYPICAL
20X (R0.137)
NOTE 4
1
48
49
64
4226412/A 11/2020
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs.
4. Strap features may not be present.
5. Reference JEDEC registration MS-026.
www.ti.com
EXAMPLE BOARD LAYOUT
TM
PAP0064F
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(8)
NOTE 8
(6.5)
SYMM
SOLDER MASK
49
64
DEFINED PAD
64X (1.5)
(R0.05)
TYP
1
48
64X (0.3)
65
(11.4)
SYMM
(1.1 TYP)
60X (0.5)
33
16
(
0.2) TYP
VIA
METAL COVERED
32
17
SEE DETAILS
BY SOLDER MASK
(1.1 TYP)
(11.4)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4226412/A 11/2020
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,
plugged or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
TM
PAP0064F
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(6.5)
BASED ON
0.125 THICK STENCIL
SYMM
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
64
49
64X (1.5)
1
48
64X (0.3)
(R0.05) TYP
SYMM
65
(11.4)
60X (0.5)
33
16
METAL COVERED
BY SOLDER MASK
17
32
(11.4)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:6X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
7.27 X 7.27
6.5 X 6.5 (SHOWN)
5.93 X 5.93
0.125
0.15
0.175
5.49 X 5.49
4226412/A 11/2020
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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