CDCEL913PWG4 [TI]
Programmable 1-PLL VCXO Clock Synthesizer With 1.8-V, 2.5-V, and 3.3-V Outputs; 可编程1 - PLL VCXO时钟合成器,具有1.8 V, 2.5 V和3.3 V输出型号: | CDCEL913PWG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | Programmable 1-PLL VCXO Clock Synthesizer With 1.8-V, 2.5-V, and 3.3-V Outputs |
文件: | 总25页 (文件大小:459K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CDCE913
CDCEL913
www.ti.com
SCAS849E –JUNE 2007–REVISED MARCH 2010
Programmable 1-PLL VCXO Clock Synthesizer With 1.8-V, 2.5-V, and 3.3-V Outputs
Check for Samples: CDCE913, CDCEL913
1
FEATURES
–
CDCEL913: 1.8 V
2345
•
Member of Programmable Clock Generator
Family
•
Flexible Clock Driver
–
Three User-Definable Control Inputs
[S0/S1/S2], for example., SSC Selection,
Frequency Switching, Output Enable, or
Power Down
–
–
–
–
CDCE913/CDCEL913: 1-PLL, 3 Outputs
CDCE925/CDCEL925: 2-PLL, 5 Outputs
CDCE937/CDCEL937: 3-PLL, 7 Outputs
CDCE949/CDCEL949: 4-PLL, 9 Outputs
–
–
Generates Highly Accurate Clocks for
Video, Audio, USB, IEEE1394, RFID,
Bluetooth™, WLAN, Ethernet™, and GPS
•
•
In-System Programmability and EEPROM
–
–
Serial Programmable Volatile Register
Generates Common Clock Frequencies
Used With TI- DaVinci™, OMAP™, DSPs
Nonvolatile EEPROM to Store Customer
Setting
–
–
Programmable SSC Modulation
Enables 0-PPM Clock Generation
Flexible Input Clocking Concept
–
–
–
External Crystal: 8 MHz to 32 MHz
On-Chip VCXO: Pull Range ±150 ppm
Single-Ended LVCMOS up to 160 MHz
•
•
•
•
1.8-V Device Power Supply
Wide Temperature Range –40° C to 85° C
Packaged in TSSOP
•
•
Free Selectable Output Frequency up to
230 MHz
Development and Programming Kit for Easy
PLL Design and Programming (TI Pro-Clock™)
Low-Noise PLL Core
–
–
PLL Loop Filter Components Integrated
Low Period Jitter (Typical 50 ps)
APPLICATIONS
•
D-TV, STB, IP-STB, DVD-Player, DVD-Recorder,
Printer
•
Separate Output Supply Pins
CDCE913: 3.3 V and 2.5 V
–
V
V
GND
DD
DDOUT
V
ctr
LV
CMOS
Y1
Xin/CLK 1
S0 2
14 Xout
VCXO
XO
13 S1/SDA
12 S2/SCL
11 Y1
Divider
and
Output
V
V
3
4
5
6
7
DD
LV
CMOS
LVCMOS
Y2
Y3
ctr
PLL
Control
10 GND
GND
DDOUT
DDOUT
EEPROM
Programming
and
Control Register
with SSC
V
V
3
9
8
Y2
Y3
LV
CMOS
S2/S1/S0 or
SDA/SCL
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
4
5
DaVinci, OMAP, Pro-Clock are trademarks of Texas Instruments.
Bluetooth is a trademark of Bluetooth SIG.
I2C is a trademark of Philips Electronics.
Ethernet is a trademark of Xerox Corporattion.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2010, Texas Instruments Incorporated
CDCE913
CDCEL913
SCAS849E –JUNE 2007–REVISED MARCH 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION
The CDCE913 and CDCEL913 are modular PLL-based low-cost, high-performance, programmable clock
synthesizers, multipliers, and dividers. They generate up to 3 output clocks from a single input frequency. Each
output can be programmed in-system for any clock frequency up to 230 MHz, using the integrated configurable
PLL.
The CDCx913 has separate output supply pins, VDDOUT, which is 1.8 V for CDCEL913 and 2.5 V to 3.3 V for
CDCE913.
The input accepts an external crystal or LVCMOS clock signal. If an external crystal is used, an on-chip load
capacitor is adequate for most applications. The value of the load capacitor is programmable from 0 to 20 pF.
Additionally, an on-chip VCXO is selectable which allows synchronization of the output frequency to an external
control signal, that is, PWM signal.
The deep M/N divider ratio allows the generation of zero-ppm audio/video, networking (WLAN, BlueTooth,
Ethernet, GPS) or interface (USB, IEEE1394, Memory Stick) clocks from e.g., a 27 MHz reference input
frequency.
The PLL supports SSC (spread-spectrum clocking). SSC can be center-spread or down-spread clocking which is
a common technique to reduce electro-magnetic interference (EMI).
Based on the PLL frequency and the divider settings, the internal loop filter components are automatically
adjusted to achieve high stability and optimized jitter transfer characteristic.
The device supports non-volatile EEPROM programming for ease customization of the device to the application.
It is preset to a factory default configuration (see the DEFAULT DEVICE CONFIGURATION section). It can be
re-programmed to a different application configuration before PCB assembly, or re-programmed by in-system
programming. All device settings are programmable through SDA/SCL bus, a 2-wire serial interface.
Three programmable control inputs, S0, S1 and S2, can be used to select different frequencies, or change SSC
setting for lowering EMI, or other control features like, outputs disable to low, outputs 3-state, power down, PLL
bypass etc).
The CDCx913 operates in a 1.8 V environment. It operates in a temperature range of –40° C to 85° C.
Terminal Functions for CDCE913, CDCEL913
TERMINAL
I/O
DESCRIPTION
NAME
Y1–Y3
PIN TSSOP14
11, 9, 8
O
LVCMOS outputs
Xin/CLK
Xout
1
14
4
I
Crystal oscillator input or LVCMOS clock Input (selectable via SDA/SCL bus)
Crystal oscillator output (leave open or pullup when not used)
VCXO control voltage (leave open or pullup when not used)
1.8-V power supply for the device
O
I
VCtrl
VDD
3
Power
CDCEL913: 1.8-V supply for all outputs
VDDOUT
6, 7
Power
CDCE913: 3.3-V or 2.5-V supply for all outputs
GND
S0
5, 10
2
Ground Ground
User-programmable control input S0; LVCMOS inputs; internal pullup 500k
SDA: bidirectional serial data input/output (default configuration), LVCMOS internal
I/O or I pullup; or
S1: user-programmable control input; LVCMOS inputs; internal pullup 500k
I
SDA/S1
SCL/S2
13
12
SCL: serial clock input LVCMOS (default configuration), internal pullup 500k or
S2: user-programmable control input; LVCMOS inputs; internal pullup 500k
I
2
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Product Folder Link(s): CDCE913 CDCEL913
CDCE913
CDCEL913
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SCAS849E –JUNE 2007–REVISED MARCH 2010
V
GND
V
DD
DDOUT
Input Clock
V
ctr
LV
Pdiv1
Y1
CMOS
10-Bit
Xin/CLK
VCXO
XO
LV
CMOS
Pdiv2
7-Bit
Y2
Y3
PLL 1
LVCMOS
with SSC
Xout
LV
CMOS
Pdiv3
7-Bit
PLL Bypass
EEPROM
Programming
and
S0
S1/SDA
S2/SCL
SDA/SCL
Register
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE
–0.5 to 2.5
–0.5 to VDD + 0.5
–0.5 to VDD + 0.5
20
UNIT
V
VDD
VI
Supply voltage range
Input voltage range(2) (3)
Output voltage range(2)
Input current (VI < 0, VI > VDD
Continuous output current
Storage temperature range
V
VO
II
V
)
mA
mA
°C
°C
IO
50
Tstg
TJ
–65 to 150
125
Maximum junction temperature
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(3) SDA and SCL can go up to 3.6V as stated in the Recommended Operating Conditions table.
PACKAGE THERMAL RESISTANCE for TSSOP (PW) PACKAGE(1) (2)
over operating free-air temperature range (unless otherwise noted)
AIRFLOW
(lfm)
TSSOP14
°C/W
PARAMETER
0
106
93
92
90
85
43
66
1.4
62
150
200
250
500
—
TJA
Thermal Resistance Junction to Ambient
TJC
Thermal Resistance Junction to Case
Thermal Resistance Junction to Board
Thermal Resistance Junction to Top
Thermal Resistance Junction to Bottom
TJB
—
RqJT
RqJB
—
—
(1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Copyright © 2007–2010, Texas Instruments Incorporated
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RECOMMENDED OPERATING CONDITIONS
MIN
1.7
2.3
1.7
NOM
MAX
1.9
UNIT
VDD
VO
Device supply voltage
1.8
V
Output Yx supply voltage for CDCE913, VDDOUT
Output Yx supply voltage for CDCEL913, VDDOUT
Low-level input voltage LVCMOS
High-level input voltage LVCMOS
Input voltage threshold LVCMOS
Input voltage range S0
3.6
V
1.9
VIL
0.3 VDD
V
V
V
VIH
0.7 VDD
VI (thresh)
0.5 VDD
0
0
0
1.9
3.6
1.9
±12
±10
±8
VI(S)
V
V
Input voltage range S1, S2, SDA, SCL; VI(thresh) = 0.5 VDD
Input voltage range CLK
VI(CLK)
Output current (VDDOUT = 3.3 V)
Output current (VDDOUT = 2.5 V)
Output current (VDDOUT = 1.8 V)
Output load LVCMOS
IOH /IOL
mA
CL
TA
15
pF
°C
Operating free-air temperature
–40
85
RECOMMENDED CRYSTAL/VCXO SPECIFICATIONS(1)
MIN
NOM
MAX
32
UNIT
MHz
Ω
fXtal
ESR
fPR
Crystal input frequency range (fundamental mode)
Effective series resistance
Pulling range (0 V ≤ VCtrl ≤ 1.8 V)(2)
Frequency control voltage, VCtrl
Pullability ratio
8
27
100
±120
0
±150
ppm
V
VDD
220
20
C0/C1
CL
On-chip load capacitance at Xin and Xout
0
pF
(1) For more information about VCXO configuration, and crystal recommendation, see application report (SCAA085).
(2) Pulling range depends on crystal-type, on-chip crystal load capacitance and PCB stray capacitance; pulling range of min ±120 ppm
applies for crystal listed in the application report (SCAA085).
EEPROM SPECIFICATION
MIN
100
10
TYP
MAX
UNIT
cycles
years
EEcyc
EEret
Programming cycles of EEPROM
Data retention
1000
4
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CDCEL913
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SCAS849E –JUNE 2007–REVISED MARCH 2010
TIMING REQUIREMENTS
over recommended ranges of supply voltage, load, and operating free-air temperature
MIN
NOM
MAX
UNIT
CLK_IN REQUIREMENTS
PLL bypass mode
0
8
160
160
3
fCLK
tr / tf
LVCMOS clock input frequency
MHz
ns
PLL mode
Rise and fall time CLK signal (20% to 80%)
Duty cycle CLK at VDD/2
40%
60%
STANDARD
MODE
FAST
MODE
UNIT
MIN
MAX
MIN
MAX
SDA/SCL TIMING REQUIREMENTS (see Figure 12)
fSCL
SCL clock frequency
0
4.7
4
100
0
0.6
0.6
1.3
0.6
0
400
kHz
ms
ms
ms
ms
ms
ns
ns
ns
ms
ms
tsu(START)
th(START)
tw(SCLL)
tw(SCLH)
th(SDA)
tsu(SDA)
tr
START setup time (SCL high before SDA low)
START hold time (SCL low after SDA low)
SCL low-pulse duration
4.7
4
SCL high-pulse duration
SDA hold time (SDA valid after SCL low)
SDA setup time
0
3.45
0.9
250
100
SCL/SDA input rise time
1000
300
300
300
tf
SCL/SDA input fall time
tsu(STOP)
tBUS
STOP setup time
4
0.6
1.3
Bus free time between a STOP and START condition
4.7
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DEVICE CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP(1)
MAX
UNIT
OVERALL PARAMETER
All outputs off, fCLK = 27 MHz, All PLLS on
fVCO = 135 MHz;
fOUT = 27 MHz
11
9
IDD
Supply current (see Figure 3)
mA
Per PLL
VDDOUT = 3.3 V
VDDOUT = 1.8 V
1.3
0.7
No load, all outputs on,
fOUT = 27 MHz
IDD(OUT)
Supply current (see Figure 4 and Figure 5)
mA
Power-down current. Every circuit powered
down except SDA/SCL
IDD(PD)
V(PUC)
fVCO
fIN = 0 MHz,
VDD = 1.9 V
30
mA
Supply voltage Vdd threshold for power-up
control circuit
0.85
80
1.45
V
VCO frequency range of PLL
230
230
230
MHz
VDDOUT = 3.3 V
VDDOUT = 1.8 V
fOUT
LVCMOS output frequency
MHz
LVCMOS PARAMETER
VIK
II
LVCMOS input voltage
VDD = 1.7 V; II = –18 mA
VI = 0 V or VDD; VDD = 1.9 V
VI = VDD; VDD = 1.9 V
VI = 0 V; VDD = 1.9 V
VIClk = 0 V or VDD
–1.2
±5
5
V
LVCMOS Input current
mA
mA
mA
IIH
IIL
LVCMOS Input current for S0/S1/S2
LVCMOS Input current for S0/S1/S2
Input capacitance at Xin/Clk
Input capacitance at Xout
–4
6
2
3
CI
VIXout = 0 V or VDD
pF
Input capacitance at S0/S1/S2
VIS = 0 V or VDD
CDCE913 - LVCMOS PARAMETER FOR VDDOUT = 3.3 V – MODE
VDDOUT = 3 V, IOH = –0.1 mA
2.9
2.4
2.2
VOH
LVCMOS high-level output voltage
LVCMOS low-level output voltage
VDDOUT = 3 V, IOH = –8 mA
VDDOUT = 3 V, IOH = –12 mA
VDDOUT = 3 V, IOL = 0.1 mA
VDDOUT = 3 V, IOL = 8 mA
VDDOUT = 3 V, IOL = 12 mA
PLL bypass
V
V
0.1
0.5
0.8
VOL
tPLH, tPHL Propagation delay
3.2
0.6
50
ns
ns
ps
ps
ps
tr/tf
Rise and fall time
Cycle-to-cycle jitter(2)
Peak-to-peak period jitter(3)
Output skew (4) , See Table 2
VDDOUT = 3.3 V (20%–80%)
1 PLL switching, Y2-to-Y3
1 PLL switching, Y2-to-Y3
fOUT = 50 MHz; Y1-to-Y3
fVCO = 100 MHz; Pdiv = 1
(3)
tjit(cc)
tjit(per)
tsk(o)
odc
70
100
60
60
(5)
Output duty cycle
45%
55%
CDCE913 – LVCMOS PARAMETER for VDDOUT = 2.5 V – Mode
VDDOUT = 2.3 V, IOH = –0.1 mA
2.2
1.7
1.6
VOH
LVCMOS high-level output voltage
LVCMOS low-level output voltage
VDDOUT = 2.3 V, IOH = –6 mA
VDDOUT = 2.3 V, IOH = –10 mA
VDDOUT = 2.3 V, IOL = 0.1 mA
VDDOUT = 2.3 V, IOL = 6 mA
VDDOUT = 2.3 V, IOL = 10 mA
PLL bypass
V
V
0.1
0.5
0.7
VOL
tPLH, tPHL Propagation delay
3.6
0.8
50
ns
ns
ps
ps
ps
tr/tf
Rise and fall time
Cycle-to-cycle jitter(2)
Peak-to-peak period jitter(3)
Output skew(4) , See Table 2
Output duty cycle(5)
VDDOUT = 2.5 V (20%–80%)
1 PLL switching, Y2-to-Y3
1 PLL switching, Y2-to-Y3
fOUT = 50 MHz; Y1-to-Y3
fVCO = 100 MHz; Pdiv = 1
(3)
tjit(cc)
tjit(per)
tsk(o)
odc
70
100
60
60
45%
55%
(1) All typical values are at respective nominal VDD
.
(2) 10000 cycles.
(3) Jitter depends on configuration. Jitter data is for input frequency = 27 MHz, fVCO = 108 MHz, fOUT = 27 MHz (measured at Y2).
(4) The tsk(o) specification is only valid for equal loading of each bank of outputs, and the outputs are generated from the same divider.
(5) odc depends on output rise and fall time (tr/tf); data sampled on rising edge (tr)
6
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CDCEL913
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SCAS849E –JUNE 2007–REVISED MARCH 2010
DEVICE CHARACTERISTICS (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP(1)
MAX
UNIT
V
CDCEL913 — LVCMOS PARAMETER for VDDOUT = 1.8 V – Mode
VDDOUT = 1.7 V, IOH = –0.1 mA
1.6
1.4
1.1
VOH
LVCMOS high-level output voltage
LVCMOS low-level output voltage
VDDOUT = 1.7 V, IOH = –4 mA
VDDOUT = 1.7 V, IOH = –8 mA
VDDOUT = 1.7 V, IOL = 0.1 mA
VDDOUT = 1.7 V, IOL = 4 mA
VDDOUT = 1.7 V, IOL = 8 mA
PLL bypass
0.1
0.3
0.6
VOL
V
tPLH, tPHL Propagation delay
2.6
0.7
80
ns
ns
ps
ps
ps
tr/tf
Rise and fall time
VDDOUT = 1.8 V (20%–80%)
1 PLL switching, Y2-to-Y3
1 PLL switching, Y2-to-Y3
fOUT = 50 MHz; Y1-to-Y3
fVCO = 100 MHz; Pdiv = 1
(6) (7)
tjit(cc)
tjit(per)
tsk(o)
odc
Cycle-to-cycle jitter
110
130
50
Peak-to-peak period jitter(7)
Output skew(8) , See Table 2
Output duty cycle(9)
100
45%
55%
SDA/SCL PARAMETER
VIK
IIH
SCL and SDA input clamp voltage
VDD = 1.7 V; II = –18 mA
VI = VDD; VDD = 1.9 V
–1.2
±10
V
mA
V
SCL and SDA input current
SDA/SCL input high voltage(10)
SDA/SCL input low voltage(10)
SDA low-level output voltage
SCL/SDA Input capacitance
VIH
VIL
VOL
CI
0.7 VDD
0.3 VDD
0.2 VDD
10
V
IOL = 3 mA, VDD = 1.7 V
VI = 0 V or VDD
V
3
pF
(6) 10000 cycles.
(7) Jitter depends on configuration. Jitter data is for input frequency = 27 MHz, fVCO = 108 MHz, fOUT = 27 MHz (measured at Y2).
(8) The tsk(o) specification is only valid for equal loading of each bank of outputs, and the outputs are generated from the same divider.
(9) odc depends on output rise and fall time (tr/tf); data sampled on rising edge (tr)
(10) SDA and SCL pins are 3.3 V tolerant.
PARAMETER MEASUREMENT INFORMATION
CDCE913
CDCEL913
1 kW
LVCMOS
10 pF
1 kW
Figure 1. Test Load
CDCE913
CDCEL913
LVCMOS
LVCMOS
Series
Termination
~ 18 W
Line Impedance
Zo = 50 W
Typical Driver
Impedance
~ 32 W
Figure 2. Test Load for 50-Ω Board Environment
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TYPICAL CHARACTERISTICS
CDCE913, CDCEL913
SUPPLY CURRENT
vs
CDCE913
OUTPUT CURRENT
vs
PLL FREQUENCY
OUTPUT FREQUENCY
30
16
V
= 1.8 V
V
V
= 1.8 V,
DD
DD
14
12
10
8
= 3.3 V,
DDOUT
25
20
15
10
5
no load
3 Outputs on
1 PLL on
1 Output on
6
4
all PLL off
2
0
all Outputs off
0
10 30 50 70 90 110 130 150 170 190 210 230
10
60
f
110
160
210
f
- Output Frequency - MHz
- Frequency - MHz
OUT
VCO
Figure 3.
Figure 4.
CDCEL913
OUTPUT CURRENT
vs
OUTPUT FREQUENCY
4.5
V
= 1.8 V,
DD
4
3.5
3
V
= 1.8 V,
DDOUT
no load
3 Outputs on
2.5
2
1 Output on
1.5
1
all Outputs off
0.5
0
10 30 50 70 90 110 130 150 170 190 210 230
f
- Output Frequency - MHz
OUT
Figure 5.
8
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APPLICATION INFORMATION
CONTROL TERMINAL CONFIGURATION
The CDCE913/CDCEL913 has three user-definable control terminals (S0, S1, and S2) which allow external
control of device settings. They can be programmed to any of the following functions:
•
•
•
Spread spectrum clocking selection → spread type and spread amount selection
Frequency selection → switching between any of two user-defined frequencies
Output state selection → output configuration and power down control
The user can predefine up to eight different control settings. Table 1 and Table 2 explain these settings.
Table 1. Control Terminal Definition
External Control Bits
PLL1 Setting
Y1Setting
PLL Frequency
Selection
Control Function
SSC Selection Output Y2/Y3 Selection
Output Y1 and Power-Down Selection
Table 2. PLLx Setting (can be selected for each PLL individual)(1)
SSC Selection (Center/Down)
SSCx [3-bits]
Center
0% (off)
±0.25%
±0.5%
Down
0% (off)
–0.25%
–0.5%
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
±0.75%
±1.0%
–0.75%
–1.0%
±1.25%
±1.5%
–1.25%
–1.5%
±2.0%
–2.0%
FREQUENCY SELECTION(2)
FSx
0
FUNCTION
Frequency0
Frequency1
1
OUTPUT SELECTION(3) (Y2 ... Y3)
YxYx
FUNCTION
0
1
State0
State1
(1) Center/Down-Spread, Frequency0/1 and State0/1 are user-definable in PLLx Configuration Register;
(2) Frequency0 and Frequency1 can be any frequency within the specified fVCO range.
(3) State0/1 selection is valid for both outputs of the corresponding PLL module and can be power down,
3-state, low or active
Table 3. Y1 Setting(1)
Y1 SELECTION
Y1
0
FUNCTION
State 0
1
State 1
(1) State0 and State1 are user definable in Generic Configuration
Register and can be power down, 3-state, low, or active.
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S1/SDA and S2/SCL pins of the CDCE913/CDCEL913 are dual function pins. In default configuration they are
defined as SDA/SCL for the serial programming interface. They can be programmed as control-pins (S1/S2) by
setting the appropriate bits in the EEPROM. Note that the changes to the Control Register (Bit [6] of Byte 02h)
have no effect until they are written into the EEPROM.
Once they are set as control pins, the serial programming interface is no longer available. However, if VDDOUT is
forced to GND, the two control pins, S1 and S2, temporally act as serial programming pins (SDA/SCL).
S0 is not a multi use pin; it is a control pin only.
DEFAULT DEVICE CONFIGURATION
The internal EEPROM of CDCE913/CDCEL913 is pre-configured with a factory default configuration as shown in
Figure 6 (The input frequency is passed through the output as a default).This allows the device to operate in
default mode without the extra production step of programming it. The default setting appears after power is
supplied or after power-down/up sequence until it is reprogrammed by the user to a different application
configuration. A new register setting is programmed via the serial SDA/SCL Interface.
V
V
DDOUT
GND
DD
Input Clock
LV
CMOS
Pdiv1 =1
Y1 = 27 MHz
Y2 = 27 MHz
Y3 = 27 MHz
Xin
27 MHz
Crystal
X-tal
LV
CMOS
PLL1
power down
Pdiv2 = 1
Xout
S0
LV
CMOS
Pdiv3 = 1
PLL Bypass
EEPROM
1 = Output Enabled
0 = Output 3-State
Programming
and
SDA
SCL
SDA/SCL
Register
Programming Bus
Figure 6. Default Configuration
Table 4 shows the factory default setting for the Control Terminal Register. Note that even though 8 different
register settings are possible, in default configuration, only the first two settings (0 and 1) can be selected with
S0, as S1 and S2 are configured as programming pins in default mode.
Table 4. Factory Default Setting for Control Terminal Register(1)
Y1
Output Selection
Y1
PLL1 Settings
External Control Pins
Frequency Selection
SSC Selection
Output Selection
Y2Y3
S2
S1
S0
0
FS1
SSC1
off
SCL (I2C)
SCL (I2C)
SDA (I2C)
SDA (I2C)
3-state
fVCO1_0
fVCO1_0
3-state
1
enabled
off
enabled
(1) In default mode or when programmed respectively, S1 and S2 act as serial programming interface, SDA/SCL. They do not have any
control-pin function but they are internally interpreted as if S1=0 and S2=0. S0, however, is a control-pin which in the default mode
switches all outputs ON or OFF (as previously predefined).
SDA/SCL SERIAL INTERFACE
The CDCE913/CDCEL913 operates as a slave device of the 2-wire serial SDA/SCL bus, compatible with the
popular SMBus or I2C specification. It operates in the standard-mode transfer (up to 100kbit/s) and fast-mode
transfer (up to 400kbit/s) and supports 7-bit addressing.
The S1/SDA and S2/SCL pins of the CDCE913/CDCEL913 are dual function pins. In the default configuration
they are used as SDA/SCL serial programming interface. They can be re-programmed as general purpose
control pins, S1 and S2, by changing the corresponding EEPROM setting, Byte 02h, Bit [6].
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DATA PROTOCOL
The device supports Byte Write and Byte Read and Block Write and Block Read operations.
For Byte Write/Read operations, the system controller can individually access addressed bytes.
For Block Write/Read operations, the bytes are accessed in sequential order from lowest to highest byte (with
most significant bit first) with the ability to stop after any complete byte has been transferred. The numbers of
Bytes read-out are defined by Byte Count in the Generic Configuration Register. At Block Read instruction, all
bytes defined in the Byte Count must be readout to correctly finish the read cycle.
Once a byte has been sent, it is written into the internal register and is effective immediately. This applies to
each transferred byte regardless of whether this is a Byte Write or a Block Write sequence.
If the EEPROM Write Cycle is initiated, the internal SDA registers are written into the EEPROM. During this Write
Cycle, data is not accepted at the SDA/SCL bus until the write cycle is completed. However, data can be read
out during the programming sequence (Byte Read or Block Read). The programming status can be monitored by
EEPIP, byte 01h–bit 6.
The offset of the indexed byte is encoded in the command code, as described in Table 5.
Table 5. Slave Receiver Address (7 Bits)
DEVICE
A6
1
A5
1
A4
0
A3
0
A2
1
A1(1)
A0(1)
R/W
1/0
1/0
1/0
1/0
CDCE913/CDCEL913
CDCE925/CDCEL925
CDCE937/CDCEL937
CDCE949/CDCEL949
0
0
0
0
1
0
1
0
1
1
0
0
1
1
1
0
1
1
1
1
0
1
1
(1) Address bits A0 and A1 are programmable via the SDA/SCL bus (byte 01, bit [1:0]. This allows addressing up to 4 devices connected to
the same SDA/SCL bus. The least-significant bit of the address byte designates a write or read operation.
COMMAND CODE DEFINITION
Table 6. Command Code Definition
BIT
DESCRIPTION
0 = Block Read or Block Write operation
1 = Byte Read or Byte Write operation
7
(6:0)
Byte Offset for Byte Read, Block Read, Byte Write and Block Write operation.
Generic Programming Sequence
1
7
1
1
8
1
1
S
Slave Address
A
Data Byte
A
P
R/W
MSB
LSB
MSB
LSB
S
Start Condition
Sr Repeated Start Condition
1 = Read (Rd) From CDCE9xx Device; 0 = Write (Wr) to CDCE9xxx
Acknowledge (ACK = 0 and NACK =1)
Stop Condition
R/W
A
P
Master-to-Slave Transmission
Slave-to-Master Transmission
Figure 7. Generic Programming Sequence
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Byte Write Programming Sequence
1
7
1
1
8
1
8
1
1
S
Slave Address
Wr
A
CommandCode
A
Data Byte
A
P
Figure 8. Byte Write Protocol
Byte Read Programming Sequence
1
7
1
1
8
1
1
7
1
1
S
Slave Address
Wr
A
CommandCode
A
S
Slave Address
Rd
A
8
1
1
Data Byte
A
P
Figure 9. Byte Read Protocol
Block Write Programming Sequence
1
7
1
1
8
1
8
1
S
Slave Address
Wr
A
CommandCode
A
Byte Count = N
A
8
1
8
1
8
1
1
Data Byte 0
A
Data Byte 1
A
…
Data Byte N-1
A
P
(1) Data byte 0 bits [7:0] is reserved for Revision Code and Vendor Identification. Also, it is used for internal test purpose
and should not be overwritten.
Figure 10. Block Write Protocol
Block Read Programming Sequence
1
7
1
1
8
1
1
7
1
1
S
Slave Address
Wr
A
CommandCode
A
Sr
Slave Address
Rd
A
8
1
8
1
8
1
1
Byte Count N
A
Data Byte 0
A
…
Data Byte N-1
A
P
Figure 11. Block Read Protocol
Timing Diagram for the SDA/SCL Serial Control Interface
Bit 7 (MSB)
Bit 6
Bit 0 (LSB)
P
S
A
P
t
w(SCLL)
t
w(SCLH)
t
r
t
f
V
IH
SCL
V
IL
t
t
t
su(START)
h(START)
su(SDA)
t
t
h(SDA)
su(STOP)
t
f
t
t
r
(BUS)
V
IH
SDA
V
IL
Figure 12. Timing Diagram for SDA/SCL Serial Control Interface
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SDA/SCL HARDWARE INTERFACE
Figure 13 shows how the CDCE913/CDCEL913 clock synthesizer is connected to the SDA/SCL serial interface
bus. Multiple devices can be connected to the bus but the speed may need to be reduced (400 kHz is the
maximum) if many devices are connected.
Note that the pullup resistors (RP) depends on the supply voltage, bus capacitance, and number of connected
devices. The recommended pullup value is 4.7 kΩ. It must meet the minimum sink current of 3 mA at
VOLmax = 0.4 V for the output stages (for more details see the SMBus or I2C™ Bus specification).
CDCE913
CDCEL913
R
R
P
Master
SDA
P
Slave
SCL
C
C
BUS
BUS
Figure 13. SDA / SCL Hardware Interface
SDA/SCL CONFIGURATION REGISTERS
The clock input, control pins, PLLs, and output stages are user configurable. The following tables and
explanations describe the programmable functions of the CDCE913/CDCEL913. All settings can be manually
written into the device via the SDA/SCL bus or easily programmed by using the TI Pro-Clock™ software. TI
Pro-Clock™ software allows the user to quickly make all settings and automatically calculates the values for
optimized performance at lowest jitter.
Table 7. SDA/SCL Registers
Address Offset
Register Description
Generic Configuration Register
PLL1 Configuration Register
Table
Table 9
Table 10
00h
10h
The grey-highlighted bits, described in the Configuration Registers tables in the following pages, belong to the
Control Terminal Register. The user can predefine up to eight different control settings. These settings then can
be selected by the external control pins, S0, S1, and S2. See the Control Terminal Configuration section.
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Table 8. Configuration Register,
External Control Terminals
Y1
PLL1 Settings
SSC Selection
External Control
Pins
Output Selection
Frequency Selection
Output Selection
S2
0
S1
0
S0
0
Y1
FS1
SSC1
Y2Y3
0
1
2
3
4
5
6
7
Y1_0
Y1_1
Y1_2
Y1_3
Y1_4
Y1_5
Y1_6
Y1_7
04h
FS1_0
FS1_1
FS1_2
FS1_3
FS1_4
FS1_5
FS1_6
FS1_7
13h
SSC1_0
SSC1_1
SSC1_2
SSC1_3
SSC1_4
SSC1_5
SSC1_6
SSC1_7
10h–12h
Y2Y3_0
Y2Y3_1
Y2Y3_2
Y2Y3_3
Y2Y3_4
Y2Y3_5
Y2Y3_6
Y2Y3_7
15h
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
Address Offset(1)
(1) Address Offset refers to the byte address in the Configuration Register in Table 9 and Table 10.
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Table 9. Generic Configuration Register
Offset(1)
Bit(2)
7
Acronym
E_EL
RID
Default(3)
Description
Xb
Xb
1h
0b
Device identification (read-only): 1 is CDCE913 (3.3 V out), 0 is CDCEL913 (1.8 V out)
Revision Identification Number (read only)
00h
6:4
3:0
7
VID
Vendor Identification Number (read only)
–
Reserved – always write 0
0 – EEPROM programming is completed
1 – EEPROM is in programming mode
6
5
EEPIP
0b
0b
EEPROM Programming Status4:(4) (read only)
Permanently Lock EEPROM Data(5)
0 – EEPROM is not locked
1 – EEPROM will be permanently locked
EELOCK
Device Power Down (overwrites S0/S1/S2 setting; configuration register settings are unchanged)
Note: PWDN cannot be set to 1 in the EEPROM.
01h
4
PWDN
0b
0 – device active (PLL1 and all outputs are enabled)
1 – device power down (PLL1 in power down and all outputs in 3-state)
00 – Xtal
10 – LVCMOS
11 – reserved
3:2
INCLK
00b
Input clock selection:
01 – VCXO
1:0
7
SLAVE_ADR
M1
01b
1b
Address Bits A0 and A1 of the Slave Receiver Address
Clock source selection for output Y1:
0 – input clock
1 – PLL1 clock
Operation mode selection for pin 12/13(6)
6
SPICON
0b
0 – serial programming interface SDA (pin 13) and SCL (pin 12)
1 – control pins S1 (pin 13) and S2 (pin 12)
02h
03h
04h
5:4
3:2
Y1_ST1
Y1_ST0
11b
01b
Y1-State0/1 Definition
00 – device power down (all PLLs in power down and all
outputs in 3-State)
01 – Y1 disabled to 3-state
10 – Y1 disabled to low
11 – Y1 enabled
1:0
7:0
7
Pdiv1 [9:8]
Pdiv1 [7:0]
Y1_7
0 – divider reset and stand-by
1-to-1023 – divider value
001h
10-Bit Y1-Output-Divider Pdiv1:
0b
0b
0b
0b
0b
0b
1b
0b
6
Y1_6
5
Y1_5
4
Y1_4
0 – State0 (predefined by Y1_ST0)
1 – State1 (predefined by Y1_ST1)
Y1_x State Selection(7)
3
Y1_3
2
Y1_2
1
Y1_1
0
Y1_0
Crystal Load Capacitor Selection(8)
Reserved – do not write other than 0
00h → 0 pF
01h → 1 pF
02h → 2 pF
Vctr
Xin
VCXO
XO
20pF
20pF
i.e.
XCSEL = 10pF
7:3
2:0
XCSEL
0Ah
0b
:14h-to-1Fh → 20 pF
05h
Xout
(1) Writing data beyond ‘20h’ may affect device function.
(2) All data transferred with the MSB first.
(3) Unless customer-specific setting.
(4) During EEPROM programming, no data is allowed to be sent to the device via the SDA/SCL bus until the programming sequence is
completed. Data, however, can be read out during the programming sequence (Byte Read or Block Read).
(5) If this bit is set to high in the EEPROM, the actual data in the EEPROM is permanently locked. No further programming is possible.
Data, however can still be written via SDA/SCL bus to the internal register to change device function on the fly. But new data can no
longer be saved to the EEPROM. EELOCK is effective only, if written into the EEPROM.
(6) Selection of “control pins” is effective only if written into the EEPROM. Once written into the EEPROM, the serial programming pins are
no longer available. However, if VDDOUT is forced to GND, the two control pins, S1 and S2, temporally act as serial programming pins
(SDA/SCL), and the two slave receiver address bits are reset to A0=”0” and A1=“0”.
(7) These are the bits of the Control Terminal Register (see Table 8). The user can predefine up to eight different control settings. These
settings then can be selected by the external control pins, S0, S1, and S2.
(8) The internal load capacitor (C1, C2) has to be used to achieve the best clock performance. External capacitors should be used only to
finely adjust CL by a few picofarads. The value of CL can be programmed with a resolution of 1 pF for a crystal load range of 0 pF to 20
pF. For CL > 20 pF, use additional external capacitors. Also, the value of the device input capacitance has to be considered which
always adds 1.5 pF (6 pF//2 pF) to the selected CL. For more information about VCXO configuration and crystal recommendation, see
application report SCAA085.
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Table 9. Generic Configuration Register (continued)
Offset(1)
06h
Bit(2)
Acronym
Default(3)
Description
7-Bit Byte Count (defines the number of bytes which will be sent from this device at the next Block Read transfer); all bytes
have to be read out to correctly finish the read cycle.
7:1
BCOUNT
20h
0– no EEPROM write cycle
1 – start EEPROM write cycle (internal register are saved to the EEPROM)
(4) (9)
0
EEWRITE
—
0b
0h
Initiate EEPROM Write Cycle
07h-0Fh
Unused address range
(9) The EEPROM WRITE bit must be sent last. This ensures that the content of all internal registers are stored in the EEPROM. The
EEWRITE cycle is initiated with the rising edge of the EEWRITE bit. A static level high does not trigger an EEPROM WRITE cycle. The
EEWRITE bit has to be reset to low after the programming is completed. The programming status can be monitored by reading out
EEPIP. If EELOCK is set to high, no EEPROM programming is possible.
Table 10. PLL1 Configuration Register
OFFSET(1)
Bit(2)
7:5
4:2
1:0
7
Acronym
SSC1_7 [2:0]
SSC1_6 [2:0]
SSC1_5 [2:1]
SSC1_5 [0]
SSC1_4 [2:0]
SSC1_3 [2:0]
SSC1_2 [2]
SSC1_2 [1:0]
SSC1_1 [2:0]
SSC1_0 [2:0]
FS1_7
Default(3)
DESCRIPTION
SSC1: PLL1 SSC Selection (Modulation Amount)(4)
000b
10h
000b
Down
Center
000 (off)
000 (off)
001 – 0.25%
010 – 0.5%
011 – 0.75%
100 – 1.0%
101 – 1.25%
110 – 1.5%
111 – 2.0%
001 ± 0.25%
010 ± 0.5%
011 ± 0.75%
100 ± 1.0%
101 ± 1.25%
110 ± 1.5%
111 ± 2.0%
000b
6:4
3:1
0
000b
000b
11h
12h
000b
7:6
5:3
2:0
7
000b
000b
0b
(4)
FS1_x: PLL1 Frequency Selection
6
FS1_6
0b
5
FS1_5
0b
4
FS1_4
0b
13h
14h
0 – fVCO1_0 (predefined by PLL1_0 – Multiplier/Divider value)
1 – fVCO1_1 (predefined by PLL1_1 – Multiplier/Divider value)
3
FS1_3
0b
2
FS1_2
0b
1
FS1_1
0b
0
FS1_0
0b
0 – PLL1
7
6
MUX1
M2
1b
1b
PLL1 Multiplexer:
1 – PLL1 Bypass (PLL1 is in power down)
0 – Pdiv1
1 – Pdiv2
Output Y2 Multiplexer:
Output Y3 Multiplexer:
00 – Pdiv1-Divider
01 – Pdiv2-Divider
10 – Pdiv3-Divider
11 – reserved
5:4
M3
10b
3:2
1:0
Y2Y3_ST1
Y2Y3_ST0
11b
01b
00 – Y2/Y3 disabled to 3-State (PLL1 is in power down)
01 – Y2/Y3 disabled to 3-State
10–Y2/Y3 disabled to low
Y2, Y3-State0/1definition:
11 – Y2/Y3 enabled
(4)
7
6
5
4
3
2
1
0
Y2Y3_7
Y2Y3_6
Y2Y3_5
Y2Y3_4
Y2Y3_3
Y2Y3_2
Y2Y3_1
Y2Y3_0
0b
0b
0b
0b
0b
0b
1b
0b
Y2Y3_x Output State Selection
15h
0 – state0 (predefined by Y2Y3_ST0)
1 – state1 (predefined by Y2Y3_ST1)
(1) Writing data beyond 20h may adversely affect device function.
(2) All data is transferred MSB-first.
(3) Unless a custom setting is used
(4) The user can predefine up to eight different control settings. In normal device operation, these settings can be selected by the external
control pins, S0, S1, and S2.
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Table 10. PLL1 Configuration Register (continued)
OFFSET(1)
Bit(2)
Acronym
Default(3)
DESCRIPTION
0 – down
1 – center
7
SSC1DC
0b
PLL1 SSC down/center selection:
16h
0 – reset and stand-by
1-to-127 is divider value
6:0
7
Pdiv2
—
01h
0b
7-Bit Y2-Output-Divider Pdiv2:
Reserved – do not write others than 0
7-Bit Y3-Output-Divider Pdiv3:
17h
0 – reset and stand-by
1-to-127 is divider value
6:0
Pdiv3
01h
18h
19h
7:0
7:4
3:0
7:3
2:0
7:5
4:2
PLL1_0N [11:4]
PLL1_0N [3:0]
PLL1_0R [8:5]
PLL1_0R[4:0]
PLL1_0Q [5:3]
PLL1_0Q [2:0]
PLL1_0P [2:0]
004h
000h
PLL1_0(5): 30-Bit Multiplier/Divider value for frequency fVCO1_0
(for more information, see paragraph PLL Multiplier/Divider Definition).
1Ah
10h
010b
1Bh
00 – fVCO1_0 < 125 MHz
01 – 125 MHz ≤ fVCO1_0 < 150 MHz
10 – 150 MHz ≤ fVCO1_0 < 175 MHz
1:0
VCO1_0_RANGE
00b
fVCO1_0 range selection:
11 – fVCO1_0 ≥ 175 MHz
1Ch
1Dh
1Eh
7:0
7:4
3:0
7:3
2:0
7:5
4:2
PLL1_1N [11:4]
PLL1_1N [3:0]
PLL1_1R [8:5]
PLL1_1R[4:0]
PLL1_1Q [5:3]
PLL1_1Q [2:0]
PLL1_1P [2:0]
004h
000h
PLL1_1(5): 30-Bit Multiplier/Divider value for frequency fVCO1_1
(for more information see paragraph PLL Multiplier/Divider Definition)
10h
1Fh
010b
00 – fVCO1_1 < 125 MHz
01 – 125 MHz ≤ fVCO1_1 < 150 MHz
10 – 150 MHz ≤ fVCO1_1 < 175 MHz
1:0
VCO1_1_RANGE
00b
fVCO1_1 range selection:
11 – fVCO1_1 ≥ 175 MHz
(5) PLL settings limits: 16≤q≤63, 0≤p≤7, 0≤r≤511, 0<N<4096
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PLL Multiplier/Divider Definition
At a given input frequency (ƒIN), the output frequency (ƒOUT) of the CDCE913/CDCEL913 can be calculated:
ƒ
IN
N
M
ƒ
+
OUT
Pdiv
(1)
where
M (1 to 511) and N (1 to 4095) are the multiplier/divide values of the PLL; Pdiv (1 to 127) is the output
divider.
The target VCO frequency (ƒVCO) of each PLL can be calculated:
N
M
ƒ
+ ƒ
VCO
IN
(2)
The PLL internally operates as fractional divider and needs the following multiplier/divider settings:
•
N
N
ǒlog Ǔ[if P t 0 then P + 0]
2 M
•
P = 4 – int
NȀ
ǒ Ǔ
M
•
•
Q = int
R = N′ – M × Q
where
N′ = N × 2P;
N ≥ M;
100 MHz < ƒVCO > 200 MHz;
16 ≤ q ≤ 63
0 ≤ p ≤ 7
0 ≤ r ≤ 51
Example:
for ƒIN = 27 MHz; M = 1; N = 4; Pdiv = 2;
→ fOUT = 54 MHz
for ƒIN = 27 MHz; M = 2; N = 11; Pdiv = 2;
→ fOUT = 74.25 MHz
→ fVCO = 108 MHz
→ fVCO = 148.50 MHz
→ P = 4 – int(log24) = 4 – 2 = 2
→ N′’ = 4 × 22 = 16
→ P = 4 – int(log25.5) = 4 – 2 = 2
→ N′’ = 11 × 22 = 44
→ Q = int(16) = 16
→ Q = int(22) = 22
→ R = 16 – 16 = 0
→ R = 44 – 44 = 0
The values for P, Q, R, and N’ are automatically calculated when using TI Pro-Clock™ software.
18
Submit Documentation Feedback
Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): CDCE913 CDCEL913
CDCE913
CDCEL913
www.ti.com
SCAS849E –JUNE 2007–REVISED MARCH 2010
REVISION HISTORY
Changes from Revision B (December 2007) to Revision C
Page
•
•
•
Added SDA and SCL can go up to 3.6V as stated in the Recommended Operating Conditions table ............................... 3
Deleted 230 value, moved to Max ........................................................................................................................................ 6
Deleted 230 value, moved to Max ........................................................................................................................................ 6
Changes from Revision C (September) to Revision D
Page
•
Deleted sentence - A different default setting can be programmed upon customer request. Contact Texas
Instruments sales or marketing representative for more information. ................................................................................ 10
Changes from Revision D (October 2009) to Revision E
Page
•
•
Added PLL settings limits: 16≤q≤63, 0≤p≤7, 0≤r≤511, 0<N<4096 foot to PLL1 Configure Register Table ....................... 17
Added PLL settings limits: 16≤q≤63, 0≤p≤7, 0≤r≤511 to PLL Multiplier/Divider Definition Section .................................... 18
Copyright © 2007–2010, Texas Instruments Incorporated
Submit Documentation Feedback
19
Product Folder Link(s): CDCE913 CDCEL913
PACKAGE OPTION ADDENDUM
www.ti.com
15-Jan-2010
PACKAGING INFORMATION
Orderable Device
CDCE913PW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
14
14
14
14
14
14
14
14
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CDCE913PWG4
CDCE913PWR
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CDCE913PWRG4
CDCEL913PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CDCEL913PWG4
CDCEL913PWR
CDCEL913PWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CDCEL913 :
Automotive: CDCEL913-Q1
•
NOTE: Qualified Version Definitions:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Jan-2010
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CDCE913PWR
CDCEL913PWR
TSSOP
TSSOP
PW
PW
14
14
2000
2000
330.0
330.0
12.4
12.4
6.9
6.9
5.6
5.6
1.6
1.6
8.0
8.0
12.0
12.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CDCE913PWR
CDCEL913PWR
TSSOP
TSSOP
PW
PW
14
14
2000
2000
346.0
346.0
346.0
346.0
29.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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