CDCVF310_15 [TI]

2.5-V TO 3.3-V HIGH-PERFORMANCE CLOCK BUFFER;
CDCVF310_15
型号: CDCVF310_15
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2.5-V TO 3.3-V HIGH-PERFORMANCE CLOCK BUFFER

文件: 总12页 (文件大小:144K)
中文:  中文翻译
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CDCVF310  
www.ti.com  
SCAS771AAUGUST 2004REVISED AUGUST 2004  
2.5-V TO 3.3-V HIGH-PERFORMANCE CLOCK BUFFER  
High-Performance 1:10 Clock Driver for  
General-Purpose Applications  
PW PACKAGE  
(TOP VIEW)  
Pin-to-Pin Skew < 100 ps at VDD 3.3 V  
VDD Range = 2.3 V to 3.6 V  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
GND  
CLK  
2
V
DD  
V
DD  
Input Clock Up To 200 MHz (See Figure 7)  
Operating Temperature Range –40°C to 85°C  
Output Enable Glitch Suppression  
3
1Y0  
1Y1  
1Y2  
GND  
GND  
1Y3  
V
DD  
4
2Y0  
2Y1  
GND  
GND  
2Y2  
2Y3  
5
Distributes One Clock Input to Two Banks of  
Five Outputs  
6
7
8
Packaged in 24-Pin TSSOP  
9
1Y4  
Pin-to-Pin Compatible to the CDCVF2310,  
Except the R = 22-Series Damping  
Resistors at Yn  
10  
11  
12  
V
DD  
V
V
DD  
1G  
2Y4  
DD  
2G  
DESCRIPTION  
The CDCVF310 is a high-performance, low-skew clock buffer that operates up to 200 MHz. Two banks of five  
outputs each provide low-skew copies of CLK. After power up, the default state of the outputs is low regardless  
of the state of the control pins. For normal operation, the outputs of bank 1Y[0:4] or 2Y[0:4] can be placed in a  
low state when the control pins (1G or 2G, respectively) are held low and a negative clock edge is detected on  
the CLK input. The outputs of bank 1Y[0:4] or 2Y[0:4] can be switched into the buffer mode when the control pins  
(1G and 2G) are held high and a negative clock edge is detected on the CLK input. The device operates in a  
2.5-V and 3.3-V environment. The built-in output enable glitch suppression ensures a synchronized output enable  
sequence to distribute full period clock signals.  
The CDCVF310 is characterized for operation from –40°C to 85°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
CDCVF310  
www.ti.com  
SCAS771AAUGUST 2004REVISED AUGUST 2004  
FUNCTIONAL BLOCK DIAGRAM  
3
4
1Y0  
1Y1  
1Y2  
1Y3  
1Y4  
5
8
9
11  
Logic Control  
Logic Control  
1G  
13  
2G  
21  
20  
17  
16  
12  
2Y0  
2Y1  
2Y2  
2Y3  
2Y4  
24  
CLK  
2
CDCVF310  
www.ti.com  
SCAS771AAUGUST 2004REVISED AUGUST 2004  
FUNCTION TABLE  
INPUT  
OUTPUT  
1G  
L
2G  
L
CLK  
1Y[0:4]  
2Y[0:4]  
L
L
H
L
L
CLK(1)  
L
H
H
L
CLK(1)  
CLK(1)  
H
CLK(1)  
(1) After detecting one negative edge on the CLK input, the output  
follows the input CLK if the control pin is held high.  
Terminal Functions  
TERMINAL  
NO.  
I/O  
DESCRIPTION  
NAME  
1G  
11  
I
Output enable control for 1Y[0:4] outputs. This output enable is active-high, meaning the  
1Y[0:4] clock outputs follow the input clock (CLK) if this pin is logic high.  
2G  
13  
I
Output enable control for 2Y[0:4] outputs. This output enable is active-high, meaning the  
2Y[0:4] clock outputs follow the input clock (CLK) if this pin is logic high.  
1Y[0:4]  
2Y[0:4]  
CLK  
3, 4, 5, 8, 9  
21, 20, 17, 16, 12  
24  
O
O
I
Buffered output clocks  
Buffered output clocks  
Input reference frequency  
Ground  
GND  
1, 6, 7, 18, 19  
2, 10, 14, 15, 22, 23  
VDD  
DC power supply, 2.3 V – 3.6 V  
3
CDCVF310  
www.ti.com  
SCAS771AAUGUST 2004REVISED AUGUST 2004  
DETAILED DESCRIPTION  
Output Enable Glitch Suppression Circuit  
The purpose of the glitch suppression circuitry is to ensure the output enable sequence is synchronized with the  
clock input such that the output buffer is enabled or disabled on the next full period of the input clock (negative  
edge triggered by the input clock) (see Figure 1).  
The G input must fulfill the timing requirements (tsu, th) according to the Switching Characteristics table for  
predictable operation.  
CLK  
G
n
n
Y
t
t
h(en)  
su(en)  
a) Enable Mode  
CLK  
G
n
n
Y
t
t
h(dis)  
su(dis)  
b) Disable Mode  
Figure 1. Enable and Disable Mode Relative to CLK↓  
4
 
CDCVF310  
www.ti.com  
SCAS771AAUGUST 2004REVISED AUGUST 2004  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range (unless otherwise noted)  
(1)  
Supply voltage range, VDD  
Input voltage range, VI(2)(3)  
–0.5 V to 4.6 V  
–0.5 V to VDD + 0.5 V  
–0.5 V to VDD + 0.5 V  
±50 mA  
(2)(3)  
Output voltage range, VO  
Input clamp current, IIK (VI < 0 or VI> VDD  
)
Output clamp current, IOK (VO < 0 or VO > VDD  
)
±50 mA  
Continuous total output current, IO (VO = 0 to VDD  
Package thermal impedance, θJA(4): PW package  
Storage temperature range Tstg  
)
±50 mA  
88°C/W, high K  
120°C/W, low K  
–65°C to 150°C  
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating  
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
(3) This value is limited to 4.6 V maximum.  
(4) The package thermal impedance is calculated in accordance with JESD 51.  
(1)  
RECOMMENDED OPERATING CONDITIONS  
MIN NOM  
MAX UNIT  
2.3  
2.5  
3.3  
Supply voltage, VDD  
V
3.6  
VDD = 3 V to 3.6 V  
VDD = 2.3 V to 2.7 V  
VDD = 3 V to 3.6 V  
VDD = 2.3 V to 2.7 V  
0.8  
V
Low-level input voltage, VIL  
0.7  
2
1.7  
0
High-level input voltage, VIH  
Input voltage, VI  
V
VDD  
-12  
-6  
V
VDD = 3 V to 3.6 V  
VDD = 2.3 V to 2.7 V  
VDD = 3 V to 3.6 V  
VDD = 2.3 V to 2.7 V  
High-level output current, IOH  
mA  
12  
6
Low-level output current, IOL  
mA  
Operating free-air temperature, TA  
-40  
85  
°C  
(1) Unused inputs must be held high or low to prevent them from floating.  
TIMING REQUIREMENTS  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VDD = 2.3 V to 3.6 V, See Figure 7  
MIN  
TYP  
MAX  
200  
UNIT  
fclk  
Clock frequency  
0
MHz  
5
CDCVF310  
www.ti.com  
SCAS771AAUGUST 2004REVISED AUGUST 2004  
ELECTRICAL CHARACTERISTICS  
over recommended operating free-air temperature range (unless otherwise noted)(1)  
PARAMETER  
Input voltage  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VIK  
II  
VDD = 3 V,  
II = –18 mA  
–1.2  
±5  
V
Input current  
VI = 0 V or VDD  
µA  
µA  
pF  
pF  
pF  
(2)  
IDD  
CI  
Static device current  
Input capacitance  
Output capacitance  
Power dissipation(3)  
CLK = 0 V or VDD = 3.6 V, IO = 0 mA  
80  
VDD = 2.3 V to 3.6 V,  
VDD = 2.3 V to 3.6 V,  
VDD = 2.3 V to 3.6 V,  
VI = 0 V or VDD  
2.5  
2.6  
CO  
VI = 0 V or VDD  
VI= 0 V or VDD  
CPD  
32  
(1) All typical values are with respect to nominal VDD  
.
(2) For dynamic IDD over Frequency see Figure 6.  
(3) This is the formula for the power dissipation calculation.  
P_tot + P_stat ) P_Dyn ) P_Load[W]  
P_stat + V   I [W]  
DD  
DD  
P_Dyn + C_PD   V   V   ƒ [W]  
DD  
DD  
P_Load + C_Load   V   V   ƒ   n [W]  
DD  
DD  
n + Number of switching output pins  
VDD = 3.3 V ±0.3 V  
PARAMETER  
TEST CONDITIONS  
MIN  
VDD - 0.2  
2.1  
TYP(1) MAX UNIT  
VDD = min to max,  
IOH = –100 µA  
IOH = –12 mA  
IOH = –6 mA  
IOL = 100 µA  
IOL = 12 mA  
IOL = 6 mA  
VOH  
VOL  
IOH  
IOL  
High-level output voltage  
Low-level output voltage  
High-level output current  
Low-level output current  
V
VDD = 3 V  
2.4  
VDD = min to max,  
VDD = 3 V  
0.2  
0.4  
0.3  
V
VDD = 3 V,  
VO = 1 V  
-37  
37  
VDD = 3.3 V,  
VDD = 3.6 V,  
VDD = 3 V,  
VO = 1.65 V  
VO = 3.135 V  
VO = 1.95 V  
VO = 1.65 V  
VO = 0.4 V  
-57  
57  
mA  
mA  
-38  
38  
VDD = 3.3 V,  
VDD = 3.6 V,  
(1) All typical values are with respect to nominal VDD  
.
VDD = 2.5 V ±0.2 V  
PARAMETER  
TEST CONDITIONS  
MIN TYP(1)  
MAX UNIT  
VDD = min to max,  
VDD = 2.3 V  
IOH = –100 µA  
IOH = –6 mA  
IOL = 100 µA  
IOL = 6 mA  
VO = 1 V  
VDD - 0.2  
1.8  
VOH  
High-level output voltage  
Low-level output voltage  
V
VDD = min to max,  
VDD = 2.3 V  
0.2  
V
VOL  
0.4  
VDD = 2.3 V,  
VDD = 2.5 V,  
VDD = 2.7 V,  
VDD = 2.3 V,  
VDD = 2.5 V,  
VDD = 2.7 V,  
-20  
20  
IOH  
High-level output current  
Low-level output current  
VO = 1.25 V  
VO = 2.375 V  
VO = 1.2 V  
VO = 1.25 V  
VO = 0.3 V  
-36  
mA  
-25  
IOL  
36  
mA  
25  
(1) All typical values are with respect to nominal VDD  
.
6
CDCVF310  
www.ti.com  
SCAS771AAUGUST 2004REVISED AUGUST 2004  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP(1)  
MAX UNIT  
VDD = 3.3 V ±0.3 V (see Figure 2)  
tPLH  
1
1
2.8  
ns  
CLK to Yn  
tPHL  
f = 0 MHz to 200 MHz  
2.8  
tsk(o)  
tsk(p)  
tsk(pp)  
tr  
Output skew (Ym to Yn) (2) (see Figure 4)  
100  
150  
250  
350  
2.7  
ps  
ps  
Pulse skew (see Figure 5)  
Part-to-part skew  
ps  
Rise time  
VO = 0.4 V to 2 V  
VO = 2 V to 0.4 V  
1.3  
1.3  
0.1  
0.1  
0.4  
0.4  
V/ns  
V/ns  
ns  
tf  
Fall time  
2.7  
tsu(en)  
tsu(dis)  
th(en)  
th(dis)  
Enable setup time, G_high before CLK ↓  
Disable setup time, G_low before CLK ↓  
Enable hold time, G_high after CLK ↓  
Disable hold time, G_low after CLK ↓  
ns  
ns  
ns  
VDD = 2.5 V ±0.2 V (see Figure 2)  
tPLH  
1.3  
1.3  
4
4
CLK to Yn  
tPHL  
f = 0 MHz to 200 MHz  
ns  
tsk(o)  
tsk(p)  
tsk(pp)  
tr  
Output skew (Ym to Yn) (2) (see Figure 4 )  
150  
230  
280  
400  
1.6  
1.6  
ps  
ps  
Pulse skew (see Figure 5)  
Part-to-part skew  
ps  
Rise time  
VO = 0.4 V to 1.7 V  
VO = 1.7 V to 0.4 V  
0.5  
0.5  
0.1  
0.1  
0.4  
0.4  
V/ns  
V/ns  
ns  
tf  
Fall time  
tsu(en)  
tsu(dis)  
th(en)  
th(dis)  
Enable setup time, G_high before CLK ↓  
Disable setup time, G_low before CLK ↓  
Enable hold time, G_high after CLK ↓  
Disable hold time, G_low after CLK ↓  
ns  
ns  
ns  
(1) All typical values are with respect to nominal VDD  
.
(2) The tsk(o) specification is only valid for equal loading of all outputs.  
7
CDCVF310  
www.ti.com  
SCAS771AAUGUST 2004REVISED AUGUST 2004  
PARAMETER MEASUREMENT INFORMATION  
From Output  
Under Test  
C
L
= 25 pF on Y  
500  
n
A. CL includes probe and jig capacitance.  
B. All input pulses are supplied by generators having the following characteristics: Clock Frequency 200 MHz, ZO = 50  
,  
tr < 1.2 ns, tf < 1.2 ns.  
Figure 2. Test Load Circuit  
V
DD  
CLK  
50% V  
0 V  
DD  
t
t
PHL  
PLH  
V
OH  
1.7 V or 2 V  
Y
n
50% V  
DD  
0.4 V  
0.4 V  
V
OL  
t
r
t
f
Figure 3. Voltage Waveforms Propagation Delay Times  
V
DD  
CLK  
0 V  
V
OH  
50% V  
Any Y  
DD  
V
V
OL  
OH  
50% V  
DD  
Any Y  
V
OL  
t
t
sk(o)  
sk(o)  
Figure 4. Output Skew  
V
DD  
50% V  
DD  
CLK  
0 V  
t
t
PHL  
PLH  
V
OH  
V
OL  
Y
n
50% V  
DD  
NOTE: t  
= | t  
− t  
PHL  
|
sk(p)  
PLH  
Figure 5. Pulse Skew  
8
CDCVF310  
www.ti.com  
SCAS771AAUGUST 2004REVISED AUGUST 2004  
DYNAMIC SUPPLY CURRENT  
vs  
CLOCK FREQUENCY  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
V
= 2.3 V to 3.6 V  
DD  
C (Y ) = No Load  
C
C
C = 3 x 2.5 pF  
I
All Outputs Switching  
L
n
= 32 pF  
= 10 x 2.6 pF  
V
DD  
= 3.3 V, No C_Load, T = 255C  
PD  
A
O
T
A
= -405C to 855C  
V
DD  
= 3.6 V, No C_Load, T = -405C  
A
V
= 2.7 V, No C_Load, T = -405C  
DD  
A
V
DD  
= 2.5 V, No C_Load, T = 255C  
A
0
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
200  
f
- Clock Frequency - MHz  
CLK  
Figure 6.  
C_LOAD(max) PER OUTPUT PIN Yn  
vs  
CLOCK FREQUENCY  
40  
35  
30  
25  
20  
15  
10  
5
V
= 2.7 V, T = -405C  
DD  
A
for High-K Material  
V
= 3.6 V, T = -405C  
DD  
A
for High-K Material  
V
= 2.3 V to 3.6 V  
DD  
C (Y ) max = According to Graph  
L
n
C
C
= 32 pF  
= 10 x 2.6 pF  
PD  
O
C = 3 x 2.5 pF  
I
All Outputs Switching  
T
A
= -405C to 855C  
0
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
200  
f
- Clock Frequency - MHz  
CLK  
Figure 7.  
9
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Mar-2005  
PACKAGING INFORMATION  
Orderable Device  
CDCVF310PW  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
PW  
24  
24  
24  
60  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
CDCVF310PWR  
CDCVF310PWRG4  
TSSOP  
TSSOP  
PW  
PW  
2000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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相关型号:

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