DLP301SFQS [TI]
0.3 英寸、360 万像素、大功率、近紫外 DLP® 数字微镜器件 (DMD) | FQS | 99 | 0 to 40;
| 型号： | DLP301SFQS |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 0.3 英寸、360 万像素、大功率、近紫外 DLP® 数字微镜器件 (DMD) | FQS | 99 | 0 to 40 |
| 文件： | 总7页 (文件大小：869K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DLP301S
ZHCSNK3 –JULY 2021
DLP301S 适用于TI DLP® 3D 打印机的0.3 英寸360 万像素DMD
1 特性
3 说明
• 0.3 英寸(7.93mm) 对角线微镜阵列
DLP301S 数字微镜器件 (DMD) 是一款数控微光机电
系统(MOEMS) 空间照明调制器(SLM)。当与适当的光
学系统成对使用时，DMD 可显示非常清晰的高质量图
像。该 DMD 是由 DLP301S DMD、DLPC1438 3D 打
印控制器和 DLPA200x/DLPA300x PMIC/LED 驱动器
所组成的芯片组的一部分。此 DMD 外形小巧，与控制
器和 PMIC/LED 驱动器共同组成完整的系统解决方
案，从而实现适用于快速、高分辨率的可靠 DLP 3D
打印机的高输出光学引擎。
– 1280 × 720 铝制微米级微镜阵列，采用正交布
局
– 5.4 微米微镜间距
– ±17° 微镜倾斜度（相对于平坦表面）
– 采用侧面照明，实现出色的效率和光学引擎尺寸
– 偏振无关型铝微镜表面
• 8 位SubLVDS 输入数据总线
• 专用DLPC1438 3D 打印控制器和DLPA200x/
DLPA300x PMIC/LED 驱动器，确保可靠运行
TI DLP® 光控制技术入门页，了解如何开始使用
DLP300S。
2 应用
ti.com 上的 DLP 先进光控制资源可加快上市速度，这
些资源包括参考设计、光学模块制造商和 DLP 设计网
络合作伙伴。
• TI DLP® 3D 打印机
– 增材制造
– 光聚合
– 掩模立体光刻（mSLA 3D 打印机）
• 牙科DLP 3D 打印机
• 曝光：可编程空间和时间曝光
器件信息(1)
封装尺寸（标称值）
器件型号
DLP301S
封装
FQS (99)
19.25mm×7.20mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
D_P(0)
DLPC1438
Display
D_N(0)
DLPA2000
DLPA2005
DLPA3000
DLPA3005
Controller
VOFFSET
VBIAS
D_P(1)
D_N(1)
Power
Management
600 MHz
SubLVDS
DDR
D_P(6)
D_N(6)
VRESET
DLP301S DMD
Interface
Digital
Micromirror
Device
D_P(7)
D_N(7)
VDDI
VDD
DCLK_P
DCLK_N
LS_WDATA
LS_CLK
120 MHz
SDR
Interface
LS_RDATA
VSS
DMD_DEN_ARSTZ
(System signal routing omitted for clarity)
简化版应用
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: DLPS218
DLP301S
ZHCSNK3 –JULY 2021
www.ti.com.cn
Table of Contents
5.3 Related Links.............................................................. 3
5.4 支持资源......................................................................4
5.5 Trademarks.................................................................4
5.6 Electrostatic Discharge Caution..................................4
5.7 术语表......................................................................... 4
6 Mechanical, Packaging, and Orderable Information....4
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 Device Support........................................................... 3
5.2 接收文档更新通知....................................................... 3
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
DATE
REVISION
NOTES
July 2021
*
Initial release.
Copyright © 2022 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: DLP301S
DLP301S
ZHCSNK3 –JULY 2021
www.ti.com.cn
5 Device and Documentation Support
5.1 Device Support
5.1.1 Device Nomenclature
DLP301S FQS
Package Type
Device Descriptor
图5-1. Part Number Description
5.1.2 Device Markings
The device marking includes the legible character string GHJJJJK DLP301SFQS. GHJJJJK is the lot trace code.
DLP301SFQS is the orderable device number.
Two-dimension matrix code
DMD part number and lot
trace code
Lot Trace Code
Part Marking
图5-2. DMD Marking
5.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.3 Related Links
表 5-1 lists quick access links. Categories include technical documents, support and community resources, tools
and software, and quick access to sample or buy.
表5-1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
DLP301S
DLPC1438
DLPA2000
DLPA2005
DLPA3000
DLPA3005
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: DLP301S
DLP301S
ZHCSNK3 –JULY 2021
www.ti.com.cn
5.4 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
DLP® is a registered trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: DLP301S
重要声明和免责声明
TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没
有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。
TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI
提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021，德州仪器(TI) 公司
PACKAGE OPTION ADDENDUM
www.ti.com
28-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DLP301SFQS
ACTIVE
CLGA
FQS
99
120
RoHS & Green
NI/AU
N / A for Pkg Type
0 to 40
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022，德州仪器 (TI) 公司
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