DRV10974RUMR [TI]
12V 标称电压、2.5A 峰值无传感器正弦控制三相 BLDC 电机驱动器 | RUM | 16 | -40 to 125;型号: | DRV10974RUMR |
厂家: | TEXAS INSTRUMENTS |
描述: | 12V 标称电压、2.5A 峰值无传感器正弦控制三相 BLDC 电机驱动器 | RUM | 16 | -40 to 125 电动机控制 电机 驱动 传感器 驱动器 |
文件: | 总41页 (文件大小:2302K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DRV10974
ZHCSHA0E –JANUARY 2018 –REVISED MARCH 2021
DRV10974 12V、三相无传感器BLDC 电机驱动器
器件信息(1)
1 特性
封装尺寸(标称值)
5.00mm x 4.40mm
4.00mm × 4.00mm
器件型号
DRV10974
封装
• 输入电压范围:4.4 V 至18 V
• 总驱动器H + L rDS(on):750mΩ(典型值),
TA = 25°C 时
HTSSOP (16)
WQFN (16
(1) 如需了解所有可用封装,请参阅产品说明书末尾的可订购产品
附录。
• 相位驱动电流:1A 连续(峰值1.5A)
• 180° 正弦换向,可实现最优声学性能
• 可利用电阻器配置超前角
DRV10974
PWM
• 可利用电阻器配置电流限制
FR
FG
• 软启动和可通过电阻器配置的加速曲线
• 提供内置电流感应,无需使用外部电流感应电阻器
• 专有无传感器控制,无需电机中心抽头
• 简单的用户接口:
– 用于启动的单引脚配置
– PWM 输入指定施加到电机的电压幅度
– 开漏FG 输出提供速度反馈
– 用于正向/反向控制的引脚
• 全方位保护:
V
M
180° Sensorless
Sinusoidal
Lead Angle
Accel Profile
Current Limit
4.4 V to 18 V
VCP
Copyright © 2017, Texas Instruments Incorporated
– 电机锁定检测和重启
– 过流、短路、过热和欠压保护
应用原理图
2 应用
• 白色家电
• 风扇、风机和泵
• BLDC 电机模块
3 说明
DRV10974 器件是一款具有集成功率 MOSFET 的三相
无传感器电机驱动器,可提供高达 1A (rms) 的持续驱
动电流。该器件专为成本敏感型、低噪声和低外部组件
数量的应用而设计。
DRV10974 器件使用一个专有无传感器控制方案提供
可靠换向。180° 正弦换向显著减少了 120°(梯形)换
向中较为典型的纯音。DRV10974 旋转使用一个外部
低功耗电阻器进行配置。电流限制可使用外部低功耗电
阻器进行设置。
通过施加一个用于控制驱动电压幅度的 PWM 输入,或
者使用模拟电压驱动 PWM 引脚,然后监控FG 引脚上
的速度反馈,DRV10974 器件可以轻松控制电机的转
速。
DRV10974 器件包含许多可提高效率的特性。由于该
器件支持借助电阻器配置超前角,因此用户可通过调整
相电流和相 BEMF 来优化驱动器效率。此外,该器件
使用的MOSFET 的rDS(on) 较低,有助于在驱动电机时
节省电力。
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLVSDN2
DRV10974
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ZHCSHA0E –JANUARY 2018 –REVISED MARCH 2021
Table of Contents
8 Application and Implementation..................................24
8.1 Application Information............................................. 24
8.2 Typical Application.................................................... 24
9 Power Supply Recommendations................................26
10 Layout...........................................................................27
10.1 Layout Guidelines................................................... 27
10.2 Layout Example...................................................... 27
11 Device and Documentation Support..........................28
11.1 Device Support........................................................28
11.2 接收文档更新通知................................................... 28
11.3 支持资源..................................................................28
11.4 Trademarks............................................................. 28
11.5 静电放电警告...........................................................28
11.6 术语表..................................................................... 28
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 5
6.1 Absolute Maximum Ratings........................................ 5
6.2 ESD Ratings............................................................... 5
6.3 Recommended Operating Conditions.........................5
6.4 Thermal Information....................................................5
6.5 Electrical Characteristics.............................................6
6.6 Typical Characteristics..............................................10
7 Detailed Description......................................................11
7.1 Overview................................................................... 11
7.2 Functional Block Diagram.........................................12
7.3 Feature Description...................................................12
7.4 Device Functional Modes..........................................19
Information.................................................................... 28
4 Revision History
Changes from Revision D (June 2020) to Revision E (March 2021)
Page
• Updated Human-body model (HBM).................................................................................................................. 5
Changes from Revision B (June 2018) to Revision C (September 2018)
Page
• 将文档状态从“混合状态”更改为“量产数据”................................................................................................ 1
• 删除了器件信息表WQFN 条目中的“高级信息”标识......................................................................................1
• Deleted the "Advance informatoin" note from the WQFN pinout drawing.......................................................... 3
• Deleted the "Advance Information" note from the Thermal Information table.....................................................5
• Added description of Analog Mode Speed Control...........................................................................................12
• Added Kt High and Kt Low descriptions in abnormal Kt lock detect figure.......................................................16
• Added layout example for QFN package type..................................................................................................27
Changes from Revision A (April 2018) to Revision B (June 2018)
Page
• 向器件信息表中添加了WQFN 封装...................................................................................................................1
• Added pinout drawing for the WQFN package................................................................................................... 3
• Added a column to the Pin Functions table for the WQFN package, and added the TYPE column.................. 3
• Added a column to the Thermal Information table for the VQFN package.........................................................5
• Changed rDS(on) vs. Temperature graph to include VCC condition.................................................................... 10
• Changed Speed-Control Transfer Function figure to clearly show when the device enters and exits low power
mode ................................................................................................................................................................12
• Updated Lock BEMF Abnormal text for clarity..................................................................................................16
• Changed Detailed Design Procedure to cover the high level tuning process of the RMP, ADV, and CS
settings............................................................................................................................................................. 25
Changes from Revision * (January 2018) to Revision A (April 2018)
Page
• 添加或更改了节1 列表中的项目.........................................................................................................................1
• 更改了节3 部分第三段的内容.............................................................................................................................1
• Added parameter symbol (fPWM_OUT) to the 25-kHz PWM signal.....................................................................12
• Added parameter symbol (fPWM_OUT) to the 25-kHz PWM signal.....................................................................12
• Added parameter symbol (DCSTEP) for the control resolution.......................................................................... 12
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• Added parameter symbol (DCON_MIN) for the minimum-operation duty cycle...................................................12
• Changed "pulse durations" to "duty cycles"......................................................................................................12
• Changed PWMDC to PWMdc ............................................................................................................................12
• Added parameter symbol (fFG_MIN) for the motor speed...................................................................................15
• Changed the number of lock-detect schemes from five to six..........................................................................15
• Added a table note stating the required resistor tolerance............................................................................... 18
• Added a new 节7.4.1.2 section........................................................................................................................19
• Added a parameter symbol (tALIGN) in the 节7.4.1.3 section, and reworded the last sentence thereof...........20
• Changed the column headings of the two rightmost columns in 表7-2 ...........................................................20
• Added three table notes following 表7-2 .........................................................................................................20
• Changed "programmed resistor" to "selected resistor".....................................................................................21
• Added a table note stating the required resistor tolerance............................................................................... 21
• Added a table note stating the required resistor tolerance............................................................................... 22
• Added a ±30% tolerance to the V1P8 capacitor in 表8-1 ............................................................................... 24
• Changed content of Row 4 in 表8-2 to "Motor electrical constant"..................................................................25
• Deleted all previous content from the 节8.2.2 section and replaced it with a reference to the DRV10974
Tuning Guide ....................................................................................................................................................25
• Changed 图8-3 ............................................................................................................................................... 25
• Added location information for the capacitor in the 节9 section.......................................................................26
5 Pin Configuration and Functions
ADV
FR
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
VCP
FG
V
CC
PWM
V1P8
RMP
GND
CS
W
Thermal
Pad
V
U
PGND
NC
Not to scale
NC –No internal connection
图5-1. PWP PowerPAD™ Package 16-Pin HTSSOP With Exposed Thermal Pad Top View
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FG
PWM
V1P8
RMP
1
2
3
4
12
11
10
9
VCC
W
Thermal
Pad
V
U
Not to scale
NC –No internal connection
图5-2. RUM Package 16-Pin WQFN With Exposed Thermal Pad Top View
表5-1. Pin Functions
PIN
NO.
HTSSOP WQFN
I/O
TYPE(1)
DESCRIPTION
NAME.
Selects the applied lead angle by 1/8-W resistor; not to be driven externally with a
source; leaving the pin open results in the longest lead angle; the lead angle is
determined by the ADV pin voltage at power up.
ADV
1
8
15
6
I
I
D
D
Selects current limit by 1/8-W resistor; not to be driven externally with a source; leaving
the pin open results in the highest current limit; the current limit is determined by the CS
pin voltage at power up.
CS
Provides motor speed feedback; open-drain output with internal pullup to V3P3; needs
a pullup resistor to limit current if pullup voltage is higher than V3P3
FG
FR
3
2
1
O
I
D
D
Direction control. FR = 0: U→V→W; FR = 1: U→W→V; value is determined by the FR
pin state on exit of low-power mode; internal pulldown
16
GND
NC
7, 16
9
5, 14
Digital and analog ground
—
—
—
—
NC
P
8
7
No internal connection
PGND
10
Power ground connection for motor power
Motor speed-control input; auto detect for analog or digital mode; internal pullup to
2.2 V
PWM
RMP
4
6
2
4
I
I
D
D
Acceleration ramp-rate control; 1/8-W resistor to GND to set acceleration rate; leaving
the pin open results in the slowest acceleration rate; the acceleration rate is determined
by the RMP pin voltage at power up.
U
V
11
12
9
I/O
I/O
A
A
Motor phase U
Motor phase V
10
LDO regulator for internal operation; 1-µF, 6.3-V ceramic capacitor tied to GND. Can
supply a maximum of 3 mA to an extenal load.
V1P8
5
3
O
P
VCC
VCP
W
14
15
13
12
13
11
I
P
A
A
Power-supply connection; 10-µF, 25-V ceramic capacitor tied to GND
Charge-pump output; 100-nF, 10-V ceramic capacitor tied to VCC
Motor phase W
O
I/O
The exposed thermal pad must be electrically connected to the ground plane by
soldering to the PCB for proper operation, and connected to the bottom side of the PCB
through vias for better thermal spreading.
Thermal
pad
—
—
—
—
(1) I = Input, O = Output, I/O = Input/output, P = Power, D = Digital, A = Analog, NC = No connection
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6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–1
MAX
UNIT
VCC
20
PWM, FR
CS, RMP, ADV
5.5
2
GND, PGND
0.3
Pin voltage
V
U, V, W
20
V1P8
2
20
–0.3
–0.3
–0.3
–40
–55
FG
VCP
VCC + 5.5
150
Maximum junction temperature, TJmax
Storage temperature, Tstg
°C
°C
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted)
MIN
4.4
NOM
MAX
18
UNIT
Supply voltage
VCC
V
U, V, W
18
–0.7
–0.1
0.5
PWM, FR
5.5
18
FG
Voltage
V
CS
1.8
0.1
1.8
3
–0.1
–0.1
–0.1
0
PGND, GND
RMP, ADV
Current
V1P8 regulator-output current; external load
mA
°C
Operating ambient temperature, TA
Operating junction temperature, TJ
85
–40
–40
125
°C
6.4 Thermal Information
DRV10974
THERMAL METRIC(1)
PWP (HTSSOP)
16 PINS
37.8
RUM (VQFN)
UNIT
16 PINS
34.5
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
RθJC(top)
RθJB
25.2
27
20.7
13.3
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UNIT
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DRV10974
THERMAL METRIC(1)
PWP (HTSSOP)
RUM (VQFN)
16 PINS
0.7
16 PINS
0.3
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
°C/W
°C/W
°C/W
ψJT
20.5
1.9
13.3
4
ψJB
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
6.5 Electrical Characteristics
over operating junction temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SUPPLY CURRENT
ICC
Supply current
TA = 25°C, VCC = 12 V, no motor load
TA = 25°C, VCC = 12 V
5
7
mA
µA
ICC(LP)
Low power mode
380
UVLO
V(UVLO_F)
V(UVLO_R)
Vhys(UVLO)
VCC UVLO falling
VCC UVLO rising
4.2
4.5
4.3
4.7
400
3.7
4.0
330
1.4
1.5
100
4.4
V
V
4.85
VCC UVLO hysteresis
mV
V
VVCP(UVLO_F) Charge pump UVLO falling
VVCP(UVLO_R) Charge pump UVLO rising
3.35
3.65
4.05
4.37
V
V
VCP –VCC
VCP –VCC
V
Vhys(VCP)
V(V1P8_F)
V(V1P8_R)
Vhys(V1P8)
Charge pump UVLO hysteresis
V1P8 UVLO falling
mV
V
1.25
1.35
1.55
1.65
V1P8 UVLO rising
V
V1P8 UVLO hysteresis
mV
VOLTAGE REGULATORS
VV1P8
IV1P8
V1P8 voltage
1.7
1.8
1.9
3
V
TA = 25°C, C(V1P8) = 1 μF
TA = 25°C, C(V1P8) = 1 μF
Maximum external load from V1P8
mA
INTEGRATED MOSFET
rds(on)_HS High-side FET on-resistance
rds(on)_LS Low-side FET on-resistance
PHASE DRIVER
TA = 25°C, VCC = 12 V, IO = 100 mA
TA = 25°C, VCC = 12 V, IO = 100 mA
0.375
0.375
0.425
0.425
Ω
Ω
SlewRate = 0; measure 20% to 80%;
VCC = 12 V; phase current > 20 mA
SLPH_LH
SLPH_HL
Phase slew rate switching low to high
70
70
120
170
170
V/μs
V/μs
SlewRate = 0; measure 80% to 20%;
VCC = 12 V; phase current > 20 mA
Phase slew rate switching high to low
120
25
fPWM_OUT
tdead_time
CHARGE PUMP
Phase output PWM frequency
kHz
ns
Recommended dead time
440
VVCP
VCP voltage
VCC = 4.4 V to 18 V
VCC + 4 VCC + 5 VCC + 5.5
V
CURRENT LIMIT
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over operating junction temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
0.2
0.4
0.6
0.8
1
MAX UNIT
VCC = 12 V, R(CS) = 7.32 kΩ±1%
VCC = 12 V, R(CS) = 16.2 kΩ±1%
VCC = 12 V, R(CS) = 25.5 kΩ±1%
VCC = 12 V, R(CS) = 38.3 kΩ±1%
VCC = 12 V, R(CS) = 54.9 kΩ±1%
VCC = 12 V, R(CS) = 80.6 kΩ±1%
VCC = 12 V, R(CS) = 115 kΩ±1%
ILIMIT
Current-limit threshold
A
1.2
1.4
VCC = 12 V, R(CS) = 182 kΩ±1%,
open loop and closed loop current
limit
1.6
1.5
VCC = 12 V, R(CS) = 182 kΩ±1%,
align current limit
RANGE OF MOTORS SUPPORTED
Rm
Motor resistance measurement
Phase to center tap
Phase to center tap
1
5
20
Ω
Kt
Motor BEMF constant measurement
Motor align time
150 mV/Hz
s
tALIGN
0.67
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over operating junction temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
2.2
TYP
MAX UNIT
PWM - DIGITAL MODE
VIH(DIG)
VIL(DIG)
ƒPWM
PWM input high voltage
PWM input low voltage
PWM input frequency
V
0.6
V
0.1
100
kHz
VVCC < 14 V
VCC ≥14 V
100 %
[(14 /
VVCC) ×
100] %
DCMAX
Maximum output PWM duty cycle
V
Minimum output PWM duty cycle device
DCMIN
needs to guarantee (irrespective of input Lower duty cycle from 15% down
PWM DC)
15%
Minimum input duty cycle that device
uses to drive motor
DCON_MIN
1.5 %
DCSTEP
Duty cycle step size/resolution
0.2 %
1.695
VIH(AUTO)
PWM input high voltage for auto detection
1.62
1.77
V
V
PWM input low voltage for exiting PWM
mode
VIL(AUTO)
Rpu(PWM)
1.315
1.39
120
1.465
Internal PWM pullup resistor to V3P3
kΩ
LOW-POWER MODE
PWM pulse duration to exit low-power
mode
t(EX_LPM)
PWM > VIH(DIG)
1
µs
V(EX_LPM)
t(EN_LPM)
PWM voltage to exit low-power mode
PWM low time to enter low-power mode
1.5
25
V
PWM < VIL(DIG);motor stationary
ms
PWM - ANALOG MODE
VANA_FS
VANA_ZS
Rout(PWM)
tSAM
Analog full-speed voltage
1.8
V
Analog zero-speed voltage
20
mV
kΩ
µs
External analog driver output impedance
Analog speed sample period
Analog voltage resolution
50
320
3.5
VANA_RES
mV
DIGITAL I/O (FG OUTPUT, FR INPUT)
Minimum FG output frequency during
coast
fFG_MIN
10
Hz
VIH(FR)
VIL(FR)
Input high
2.2
5
V
Input low
0.6
V
I(FG_SINK)
Rpu(FG)
Rpd(FR)
Output sink current, FG
Internal FG pullup resistor to 3.3V
Internal FR pulldown resistor to ground
VO = 0.3 V
mA
kΩ
kΩ
20
100
LOCK DETECTION RELEASE TIME
t(LOCK_OFF) Lock release time
OVERCURRENT PROTECTION
5
5
s
IOC_limit
tOC_retry
Overcurrent protection
TA = 25°C
2.5
A
s
Overcurrent protection retry time
THERMAL SHUTDOWN
TSD
Shutdown temperature threshold
140
150
15
°C
°C
Shutdown temperature threshold
hysteresis
TSD(hys)
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over operating junction temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
LEAD ANGLE
10
25
VCC = 12 V, R(ADV) = 10.7 kΩ±1%
VCC = 12 V, R(ADV) = 14.3 kΩ±1%
VCC = 12 V, R(ADV) = 17.8 kΩ±1%
VCC = 12 V, R(ADV) = 22.1 kΩ±1%
VCC = 12 V, R(ADV) = 28 kΩ±1%
VCC = 12 V, R(ADV) = 34 kΩ±1%
VCC = 12 V, R(ADV) = 41.2 kΩ±1%
VCC = 12 V, R(ADV) = 49.9 kΩ±1%
VCC = 12 V, R(ADV) = 59 kΩ±1%
VCC = 12 V, R(ADV) = 71.5 kΩ±1%
VCC = 12 V, R(ADV) = 86.6 kΩ±1%
VCC = 12 V, R(ADV) = 105 kΩ±1%
VCC = 12 V, R(ADV) = 124 kΩ±1%
VCC = 12 V, R(ADV) = 150 kΩ±1%
VCC = 12 V, R(ADV) = 182 kΩ±1%
50
100
150
200
250
300
400
500
600
700
800
900
1000
ADVselect
Lead angle selection
µs
ACCELERATION RAMP RATE
0
1
VCC = 12 V, R(RMP) = 7.32 kΩ±1%
VCC = 12 V, R(RMP) = 10.7 kΩ±1%
VCC = 12 V, R(RMP) = 14.3 kΩ±1%
VCC = 12 V, R(RMP) = 17.8 kΩ±1%
VCC = 12 V, R(RMP) = 22.1 kΩ±1%
VCC = 12 V, R(RMP) = 28 kΩ±1%
VCC = 12 V, R(RMP) = 34 kΩ±1%
VCC = 12 V, R(RMP) = 41.2 kΩ±1%
VCC = 12 V, R(RMP) = 49.9 kΩ±1%
VCC = 12 V, R(RMP) = 59 kΩ±1%
VCC = 12 V, R(RMP) = 71.5 kΩ±1%
VCC = 12 V, R(RMP) = 86.6 kΩ±1%
VCC = 12 V, R(RMP) = 105 kΩ±1%
VCC = 12 V, R(RMP) = 124 kΩ±1%
VCC = 12 V, R(RMP) = 150 kΩ±1%
VCC = 12 V, R(RMP) = 182 kΩ±1%
2
3
4
5
6
7
RMPselect
RMP selection for acceleration profile
code
8
9
10
11
12
13
14
15
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6.6 Typical Characteristics
4.98
4.97
4.96
4.95
4.94
4.93
4.92
4.91
4.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
4.89
4.88
4.87
0
5
10
VCC (V)
15
20
-40
-20
0
20 40
Temperature (°C)
60
80
100
D001
D002
图6-1. Supply Current vs Power Supply
VCC = 12 V
图6-2. rDS(on) vs Temperature When VCC = 12 V
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7 Detailed Description
7.1 Overview
The DRV10974 device is a three-phase sensorless motor driver with integrated power MOSFETs, which provide
drive-current capability up to 1 A continuous (rms). The device is specifically designed for low-noise, low
external-component count, 12-V motor-drive applications. The 180° commutation requires no configuration
beyond setting the peak current, the lead angle, and the acceleration profile, each of which is configured by an
external resistor.
The 180° sensorless-control scheme provides sinusoidal output voltages to the motor phases as shown in 图
7-1.
图7-1. 180° Sensorless-Control Scheme
Interfacing to the DRV10974 device is simple and intuitive. The DRV10974 device receives a PWM input that it
uses to control the speed of the motor. The duty cycle of the PWM input is used to determine the magnitude of
the voltage applied to the motor. The resulting motor speed can be monitored on the FG pin. The FR pin is used
to control the direction of rotation for the motor. The acceleration ramp rate is controlled by the RMP pin. The
current limit is controlled by a resistor on the CS pin. The lead angle is controlled by a resistor on the ADV pin.
When the motor is not spinning, a low-power mode turns off unused circuits to conserve power.
The DRV10974 device features extensive protection and fault-detect mechanisms to ensure reliable operation.
The device provides overcurrent protection without the requirement for an external current-sense resistor. Rotor-
lock detect uses several methods to reliably determine when the rotor stops spinning unexpectedly. The device
provides additional protection for undervoltage lockout (UVLO), for thermal shutdown, and for phase short circuit
(phase to phase, phase to ground, phase to supply).
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7.2 Functional Block Diagram
VCC
VCP
VCC
VCC
VCC
VCP
VCC
Charge
Pump
Linear Reg
Linear Reg
U
V1P8
Phase U
predriver
VCC
V3P3
V3P3
VCC
PWM
FR
VCC
VCP
V
Phase V
predriver
RMP
ADC
(4 bit)
Core
Logic
VCC
VCC
VCP
CS
W
ADC
(3 bit)
Phase W
predriver
ADV
ADC
(4 bit)
V3P3
Lock
FG
Overcurrent
Thermal
GND
PGND
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7.3 Feature Description
7.3.1 Speed Input and Control
The DRV10974 device has a three-phase 25-kHz PWM (fPWM_OUT) output that has an average value of
sinusoidal waveforms from phase to phase as shown in 图 7-2. When any phase is measured with reference to
ground, the waveform observed is a PWM-encoded sinusoid coupled with third-order harmonics as shown in 图
7-3. This encoding scheme simplifies the driver requirements because one phase output is always equal to zero.
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U
V
U-V
V-W
W-U
W
Sinusoidal Voltage from Phase to GND
With 3rd-Order Harmonics
Sinusoidal Voltage from Phase to Phase
图7-2. Sinusoidal Voltage
PWM output
Average value
图7-3. PWM Encoded Phase Output and the Average Value
The output amplitude is determined by the supply voltage (VCC) and the PWM-commanded duty cycle (PWM) as
calculated in 方程式1 and shown in 图7-4. The maximum amplitude is applied when the commanded PWM duty
cycle is slightly less than 100% in order to keep the 25-kHz PWM rate (fPWM_OUT).
V
= PWMdc ì VCC
phpk
(1)
100% PWM input
100% peak output
VM
50% PWM input
50% peak output
VM/2
图7-4. Output Voltage Amplitude Adjustment
The motor speed is controlled indirectly by using the PWM command to control the amplitude of the phase
voltages which are applied to the motor. The PWM pin can be driven by either a digital duty cycle or an analog
voltage.
The duty cycle of the PWM input (PWM) is passed through a low-pass filter that ramps from 0% to 100% duty
cycle in 120 ms. The control resolution is approximately 0.2% (DCSTEP). The signal path from PWM input to
PWM motor is shown in 图7-5.
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Amplitude of Output
Sine Wave
PWM Output
PWM Input
LPF
图7-5. PWM Command Input Control Diagram
The output peak amplitude is described by 方程式 1 when PWMdc > 15% (the minimum-operation duty cycle).
When the PWM-commanded duty cycle is lower than the minimum-operation duty cycle and higher than 1.5%
(DCON_MIN), the output is controlled the by the minimum-operation duty cycle (DCMIN). This is shown in 图7-6 for
analog input, and for duty cycles greater than 1.5% (DCON_MIN) for digital input. If the supply voltage (VVCC) > 14
V, the maximum PWMdc is limited to 14 V / VVCC
.
511 100%
PWM Mode
15%
76
15%
76
100%
511
0
0
PWM duty ‰
图7-6. PWM-Mode Speed-Control Transfer Function
When the PWM pin is driven with an analog voltage, the output peak amplitude depends on the supply voltage,
the analog voltage on the PWM pin (VANA), and the voltage of V1P8 (VV1P8). This is shown in 方程式2:
VANA
V
=
ì VCC
phpk
V1P8
(2)
Note the output peak amplitude is described by 方程式 2 when the VANA > 0.27 V or 15% of 1.8 V. This is the
equivalent of the minimum-operation duty cycle percentage of 15% (DCMIN). When the analog voltage on the
PWM pin is lower than the minimum-operation duty-cycle percentage but higher than the zero-speed analog
voltage (VANA_ZS), the output is controlled by the minimum-operation duty cycle. When the analog voltage on the
PWM pin is below zero-speed analog voltage, the DRV10974 enters low-power mode. This is shown in 图7-7.
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511 100%
Analog Mode
15%
76
15%
0.27 V
100%
1.8 V
0
0
Analog Voltage (VANA) ‰
VANA_ZS
图7-7. Analog-Mode Speed-Control Transfer Function
7.3.2 Motor Direction Change
The DRV10974 device can be easily configured to drive the motor in either direction by setting the input on the
FR (forward-reverse) pin to a logic 1 or logic 0 state. The direction of commutation as described by the
commutation sequence is defined as follows:
FR = 0
FR = 1
U→V→W
U→W→V
7.3.3 Motor-Frequency Feedback (FG)
During operation of the DRV10974 device, the FG pin provides an indication of the speed of the motor. The FG
pin toggles at a rate of one time during an electrical cycle. Using this information and the number of pole pairs in
the motor, use 方程式3 to calculate the mechanical speed of the motor.
ƒ(FG) ì 60
RPM =
pole _pairs
(3)
During open-loop acceleration the FG pin indicates the frequency of the signal that is driving the motor. The lock
condition of the motor is unknown during open-loop acceleration and therefore the FG pin could toggle during
this time even though the motor is not moving.
During spin down, the DRV10974 device continues to provide speed feedback on the FG pin. The DRV10974
device provides the output of the U-phase comparator on the FG pin until the motor speed drops below 10 Hz
(fFG_MIN). When the motor speed falls below 10 Hz, the device enters into the low-power mode and the FG
output is held at a logic high.
7.3.4 Lock Detection
When the motor is locked by some external condition, the DRV10974 device detects the lock condition and acts
to protect the motor and the device. The lock condition must be properly detected whether the condition occurs
as a result of a slowly increasing load or a sudden shock.
The DRV10974 device reacts to the lock condition by stopping the motor drive. To stop driving the motor, the
phase outputs are placed into a high-impedance state. After successfully transitioning into a high-impedance
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state as the result of a lock condition, the DRV10974 device attempts to restart the motor after t(LOCK_OFF)
seconds.
The DRV10974 device has a comprehensive lock-detect function that includes six different lock-detect schemes.
Each of these schemes detects a particular condition of the lock as shown in 图7-8.
Kt Measure
No Motor
High-
Impedance and
Restart Logic
Open Loop Abnormal
BEMF Abnormal
Closed Loop Abnormal
Speed Abnormal
图7-8. Lock Detect
The following sections describe each lock-detect scheme.
7.3.4.1 Lock Kt Measure
The DRV10974 device measures the actual Kt of the motor when transitioning from open-loop acceleration to
closed-loop acceleration. If the measured Kt is less than 200 mV, the device indicates that the handoff Kt level
was not properly reached and the lock is triggered.
7.3.4.2 Lock No Motor
The phase-U current is checked at the end of the align state. If the phase-U current is not greater than 50 mA,
then the motor is not connected. This condition is reported as a lock condition.
7.3.4.3 Lock Open Loop Abnormal
Transition from open loop to closed loop is based on the estimated value of BEMF. If during open-loop
acceleration the electrical commutation rate exceeds 200 Hz without reaching the handoff threshold, this lock is
triggered.
7.3.4.4 Lock BEMF Abnormal
For any specific motor, the integrated value of BEMF during half of an electrical cycle is a constant as shown by
the shaded gray area in 图 7-9. This value is constant regardless of whether the motor runs fast or slow. The
DRV10974 device monitors this value and uses it as a criterion to determine if the motor is in a lock condition.
The DRV10974 device uses the integrated BEMF to determine the Kt value of the motor during the initial motor
start. Based on this measurement, a range of acceptable Kt values is established. Then, during closed-loop
motor operation the Ktc (Kt calculated) value is continuously updated. Finally, the Ktc value is checked to see if it
is within the range between ½ Kt and 2Kt. If the Ktc value goes beyond the acceptable range, a lock condition is
triggered as shown in 图 7-10. Note, there is a blanking period of 0.3 s after the transition from open loop to
closed loop where the abnormal BEMF lock is momentarily disabled. The device uses this time to finalize the Kt
value that Ktc is compared against.
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图7-9. BEMF Integration
Kt
Kt_high = 2 Kt
Ktc
Kt
Kt_low = 0.5 Kt
time
Lock detect
图7-10. Abnormal Kt Lock Detect
7.3.4.5 Lock Closed Loop Abnormal
This lock condition is active when the DRV10974 device is operating in the closed-loop mode. The motor is
indicated as not moving when the closed-loop commutation period becomes lower than half the previous
commutation period. This condition triggers the closed-loop abnormal-lock condition.
7.3.4.6 Lock Speed Abnormal
If the motor is in normal operation, the motor BEMF is always less than the voltage applied to the phase. The
sensorless-control algorithm of the DRV10974 device is continuously updating the value of the motor BEMF
based on the speed of the motor and the motor Kt as shown in 图7-11. If the calculated value for motor BEMF is
1.5 times higher than the applied voltage on phase U (VU) for an electrical period then an error is present in the
system, and the calculated value for motor BEMF is wrong or the motor is out of phase with the commutation
logic. When this condition is detected, a lock is triggered.
Rm
VU
M
BEMF = Kt × speed
V
U
If speed >
Kt
Lock is triggered
图7-11. BEMF Monitoring
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7.3.5 Soft Current-Limit
The current-limit function provides active protection for preventing damage as a result of high current. The soft
current-limit does not use direct-current measurement for protection, but rather, uses the measured motor
resistance (Rm) and motor velocity constant (Kt) to limit the voltage applied to the phase (U) such that the
current does not exceed the limit value (I(LIMIT)). The soft current-limit scheme is shown in 图 7-12 based on the
calculation in 方程式4.
The soft current-limit is only active when in normal closed-loop mode and does not result in a fault condition nor
does it result in the motor being stopped. The soft current-limit is typically useful for limiting the current that
results from heavy loading during motor acceleration. The I(LIMIT) current is configured by an external resistor
(R(CS)) as shown in 表7-1.
Rm
VU = BEMF + I × Rm
M
BEMF = Kt × speed
If VU < BEMF + I(LIMIT) × Rm
I < I(LIMIT)
Current Limit:
VUmax = BEMF + I(LIMIT) × Rm
图7-12. Current Limit
Use 方程式4 to calculate the I(LIMIT) value.
V
- Speed´Kt
(U)LIMIT
I(LIMIT)
=
Rm
(4)
表7-1 can be used to determine the I(LIMIT) value.
表7-1. Soft Current-Limit Selections
R(CS) [kΩ](1)
I(LIMIT) [mA]
7.32
200
16.2
400
25.5
600
38.3
800
54.9
1000
80.6
1200
1400
115
182
1600 (1500 during align)
(1) All resistors are ±1 %.
Spacer
备注
The soft current-limit is not correct if the motor is out of phase with the commutation control logic
(locked rotor). The soft current-limit is not effective under this condition.
7.3.6 Short-Circuit Current Protection
The short-circuit current protection function shuts off drive to the motor by placing the motor phases into a high-
impedance state if the current in any motor phase exceeds the short-circuit protection limit I(OC_LIMIT). The
DRV10974 device goes through the initialization sequence and attempts to restart the motor after the short-
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circuit condition is improved. This function is intended to protect the device and the motor from catastrophic
failure when subjected to a short-circuit condition.
7.3.7 Overtemperature Protection
The DRV10974 device has a thermal shutdown function which disables the motor operation when the device
junction temperature has exceeded the TSD temperature. Motor operation resumes when the junction
temperature becomes lower than TSD –TSD(hys)
.
7.3.8 Undervoltage Protection
The DRV10974 device has an undervoltage lockout feature, which prevents motor operation whenever the
supply voltage (VCC) becomes too low. Upon power up, the DRV10974 device operates when VCC rises above
V(UVLO_F) + Vhys(UVLO). The DRV10974 device continues to operate until VCC falls below V(UVLO_F)
.
7.4 Device Functional Modes
7.4.1 Spin-Up Settings
7.4.1.1 Motor Start
The DRV10974 device starts the motor using a procedure which is shown in 图7-13.
Power On (low
power mode)
PWM > 1 us
Initial Speed
Detection / Coast
FR Pin Change
Y
N
f < 10Hz or
t > 5 s
Temp <
threshold-hys
Y
N
Y
t = 5 s
Y
Align
N
UVLO
Sleep
Over temp
Over current
Lock
t = 5 s
N
Measure Motor
Resistance
Acceleration profile from
RMP pin
Open Loop
Acceleration
Coast / Measure Kt
Acceleration profile from
RMP pin
Closed Loop
Acceleration / Run
图7-13. DRV10974 Initialization and Motor Start-Up Sequence
7.4.1.2 Initial Speed Detect
Every time the DRV10974 device exits low-power mode, it determines if the motor is spinning using a function
called initial speed detect. If the frequency on the FG pin is less than 10 Hz, the motor is considered stationary. If
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the frequency is greater than 10 Hz the motor is decelerated until it is below 10 Hz or a 5-second time-out has
occurred.
7.4.1.3 Align
To align the rotor to the commutation logic, the DRV10974 device applies a current equivalent to the closed-loop
run current to phase U by driving phases V and W equally. This condition is maintained for a maximum of 0.67 s
(tALIGN). To avoid a sudden change in current that could result in undesirable acoustics, the voltage applied to
the motor is changed gradually to obtain a current change of 12 A/s.
7.4.2 Open-Loop Acceleration
After the motor is confirmed to be stationary and after completing the motor initialization, the DRV10974 device
begins to accelerate the motor. This acceleration is accomplished by applying a voltage to the motor at the
appropriate drive state and increasing the rate of commutation without regard to the actual position of the motor
(referred to as open-loop operation). The function of the open-loop operation is to drive the motor to a minimum
speed so that the motor generates sufficient BEMF to allow the commutation control logic to drive the motor
accurately.
The motor start-up profile can be configured using an external resistor to set the acceleration profile before
transitioning to closed-loop operation. 图 7-14 shows this acceleration profile. During closed-loop operation the
RMP pin controls the closed-loop acceleration and deceleration. 表 7-2 lists the selectable acceleration
parameters.
表7-2. Acceleration Profile Settings
CLOSED-LOOP-
ACCELERATION
TRANSITION TIME
[s](2)
CLOSED-LOOP-
DECELERATION
TRANSITION TIME
[s](3)
RRMP [kΩ](1)
RMP SELECTION
Accel2 [Hz/s2]
Accel1 [Hz/s]
0
1
7.32
10.7
14.3
17.8
22.1
28
0.22
1.65
1.65
3.3
7
4.6
9.2
15
25
25
35
50
75
75
50
35
25
25
15
9.2
4.6
2.7
2.7
1
44
22
22
11
44
22
22
11
11
22
22
44
11
22
22
44
2
3
1
4
0.2
0.2
0.2
0.2
5.4
8
5
7
6
34
14
7
41.2
49.9
59
27
8
27
9
14
10
11
12
13
14
15
71.5
86.6
105
124
150
182
7
11
22
5.4
8
7
3.3
1.65
1.65
0.22
11
22
(1) All resistors are ±1%
(2) Time to transition from 0 to 100% duty cycle.
(3) Time to transition from 100% to 0% duty cycle.
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Speed = Accel1 x t + 0.5 x Accel2 x t2
Speed
Closed Loop
Align Time
Time
Open Loop Acceleration
图7-14. Start-Up Profile
7.4.3 Start-Up Current Sensing
The start-up peak current is controlled by the current-sense limit resistor, R(CS). The start current is set by
selecting the R(CS) resistor based on 表 7-3. The current should be selected to allow the motor to accelerate
reliably to the handoff threshold. Heavier loads may require a higher current setting, but the rate of acceleration
is limited by the selected resistor, R(RMP)
.
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表7-3. Start-Up Current Limit
R(CS) [kΩ](1)
I(LIMIT) [mA]
7.32
200
16.2
25.5
38.3
54.9
80.6
115
400
600
800
1000
1200
1400
182
1600 (1500 for align)
(1) All resistors are ±1%.
7.4.4 Closed Loop
When the motor accelerates to the target BEMF threshold, commutation control transitions from open-loop mode
to closed-loop mode. During this transition, the motor is allowed to coast for one electrical cycle to measure Kt.
The commutation drive sequence and timing are determined by the internal control algorithm, and the applied
voltage is determined by the PWM-commanded duty-cycle input. The closed-loop acceleration and deceleration
values are provided in 表7-2.
7.4.5 Control Advance Angle
To achieve the best efficiency, the drive state of the motor must be controlled such that the current is aligned with
the BEMF voltage of the motor. 图 7-15 illustrates the operation when the drive angle has been optimized. For
complete flexibility, the DRV10974 device offers a wide range of fixed lead times. The options for lead time are
controlled by a resistor on the ADV pin. The values available are shown in 表7-4.
U phase voltage
U phase BEMF
U phase current
û§
图7-15. Drive Angle Adjustment
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表7-4. Lead Time Selection
RADV [kΩ](1)
LEAD TIME [µs]
10.7
14.3
17.8
22.1
28
10
25
50
100
150
200
250
300
400
500
600
700
800
900
1000
34
41.2
49.9
59
71.5
86.6
105
124
150
182
(1) All resistors are ±1%.
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8 Application and Implementation
备注
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
8.1 Application Information
The DRV10974 device is used in sensorless 3-phase BLDC motor control. The driver provides a high-
performance, high-reliability, flexible, and simple solution for appliance fan, pump, and blower applications. The
following design shows a common application of the DRV10974 device.
8.2 Typical Application
ADV
FR
GND
VCP
1
2
16
15
59k
FR
FG
10uF
100nF
FG
VCC
W
3
4
5
6
7
8
14
13
12
11
10
9
VCC
PWM
V1P8
RMP
GND
CS
PWM IN
V
1 µF
U
7.32k
115k
PGND
NC
图8-1. Typical Application Schematic
表8-1. Recommended External Components
NODE 1
NODE 2
GND
VCC
COMPONENT
VCC
VCP
V1P8
RMP
CS
10-μF, 25-V ceramic capacitor tied from VCC to ground
100-nF, 10-V ceramic capacitor tied from VCP to VCC
1-μF ±30%, 6.3-V ceramic capacitor tied from V1P8 to ground
GND
GND
GND
GND
1%, 1/8 watt resistor tied from RMP to ground to set the desired acceleration profile
1%, 1/8-watt resistor tied from CS to ground to set the desired current limit
1%, 1/8-watt resistor tied from ADV to ground to set the desired lead angle (time)
ADV
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8.2.1 Design Requirements
表8-2 provides design input parameters and motor parameters for system design.
表8-2. Recommended Application Range
MIN
NOM
MAX
18
UNIT
V
Motor voltage
4.4
5
12
BEMF constant
Phase to center tap, measured while motor is coasting
150
20
mV/Hz
Ω
Motor phase resistance Phase to center tap
1
Motor electrical
constant
1 phase; inductance divided by resistance, measured phase to
phase, yields the electrical constant for 1 phase.
100
5000
1
μs
A
Motor winding current
(rms)
Absolute maximum
current
During locked condition
2.5
A
8.2.2 Detailed Design Procedure
Assuming the motor used in the application falls within the recommended application range shown in 表 8-2, the
DRV10974 device is simple and intuitive to interface with. The DRV10974 device receives a PWM input that it
uses to control the speed of the motor. The duty cycle of the PWM input is used to determine the magnitude of
the voltage applied to the motor. The resulting motor speed can be monitored on the FG pin. The FR pin is used
to control the direction of rotation for the motor. As a result, the only configuration and customization is dictated
by the RMP, ADV, and CS pins.
The resistor on the CS pin is usually determined by the application specifications. Because the CS pin
determines the current limit, specifications such as motor current or input power can determine what value the
current limit can be set to. Then, the RMP and ADV resistors must be set experimentally through tuning. The
RMP pin sets the acceleration profile of the motor. If the RMP pin is set to faster acceleration, the motor starts up
faster but may be more likely to fail start-up. In addition, the ADV resistor controls the lead time so the applied
current is aligned with the BEMF of the motor. If the ADV resistor is incorrectly selected, the motor may not run
efficiently or at all.
As a result, the RMP pin is usually set to the slowest profile while ADV is correctly tuned. Then, the RMP can be
set to a different value that allows for a faster acceleration with no impact to start-up reliability. This process, and
other design considerations, are documented extensively in the DRV10974 Technical Documents tab on the
DRV10974 product page.
8.2.3 Application Curves
图8-2. DRV10974 Operation Current Waveform
图8-3. DRV10974 Start-Up Waveform
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ZHCSHA0E –JANUARY 2018 –REVISED MARCH 2021
9 Power Supply Recommendations
The DRV10974 device is designed to operate from an input voltage supply, VCC , range between 4.4 V and 18 V.
The user must place a minimum of a 10-µF capacitor rated for VCC between the VCC and GND pins and as close
as possible to the VCC and GND pins.
If the power supply ripple is more than 200 mV, in addition to the local decoupling capacitors, a bulk capacitance
is required and must be sized according to the application requirements.
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ZHCSHA0E –JANUARY 2018 –REVISED MARCH 2021
10 Layout
10.1 Layout Guidelines
• Use thick traces when routing to the VCC, GND, U, V, and W pins, because high current passes through these
traces.
• Place the 10-µF capacitor between VCC and GND, and as close to the VCC and GND pins as possible.
• Place the 100-nF capacitor between VCP and VCC, and as close to the VCP and VCC pins as possible.
• Connect GND and PGND under the thermal pad.
• Keep the thermal pad connection as large as possible. It should be one piece of copper without any gaps.
10.2 Layout Example
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
VCP
VCC
W
ADV
FR
10 mF
100 nF
FG
GND
PWM
V1P8
RMP
GND
CS
(Thermal pad)
59 kW
1 mF
V
U
7.32 kW
PGND
NC
115 kW
GND
图10-1. HTSSOP Layout Example
1
2
3
4
12
11
10
9
FG
PWM
V1P8
RMP
VCC
W
V
GND
(PPAD)
1uF
U
7.32k
GND
图10-2. QFN Layout Example
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DRV10974
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ZHCSHA0E –JANUARY 2018 –REVISED MARCH 2021
11 Device and Documentation Support
11.1 Device Support
11.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
11.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
11.5 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
11.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most-
current data available for the designated device. This data is subject to change without notice and without
revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.
Copyright © 2023 Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Feb-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DRV10974PWPR
DRV10974RUMR
ACTIVE
ACTIVE
HTSSOP
WQFN
PWP
RUM
16
16
2000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-1-260C-UNLIM
-40 to 125
-40 to 125
10974
Samples
Samples
NIPDAU
DRV
10974
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Feb-2023
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Feb-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV10974PWPR
DRV10974RUMR
HTSSOP PWP
WQFN RUM
16
16
2000
3000
330.0
330.0
12.4
12.4
6.9
5.6
1.6
8.0
8.0
12.0
12.0
Q1
Q2
4.25
4.25
1.15
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Feb-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DRV10974PWPR
DRV10974RUMR
HTSSOP
WQFN
PWP
RUM
16
16
2000
3000
350.0
367.0
350.0
367.0
43.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PWP0016J
PowerPADTM TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
C
SEATING
PLANE
6.6
6.2
TYP
0.1 C
A
PIN 1 INDEX
AREA
14X 0.65
16
1
2X
5.1
4.9
4.55
NOTE 3
8
9
0.30
16X
4.5
4.3
B
0.19
0.1
C A B
(0.15) TYP
SEE DETAIL A
9
8
0.25
1.2 MAX
GAGE PLANE
3.55
2.68
0.15
0.05
0.75
0.50
0 -8
A
20
16
1
DETAIL A
TYPICAL
2.46
1.75
THERMAL
PAD
4223595/A 03/2017
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PWP0016J
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(3.4)
NOTE 8
METAL COVERED
BY SOLDER MASK
(2.46)
16X (1.5)
SEE DETAILS
SYMM
16X (0.45)
1
16
(1.3) TYP
(R0.05) TYP
SYMM
(0.65)
(3.55)
(5)
NOTE 8
14X (0.65)
(
0.2) TYP
VIA
8
9
(1.35) TYP
SOLDER MASK
DEFINED PAD
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
SOLDER MASK DETAILS
4223595/A 03/2017
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
7. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
8. Size of metal pad may vary due to creepage requirement.
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
PWP0016J
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(2.46)
BASED ON
0.125 THICK
STENCIL
16X (1.5)
METAL COVERED
BY SOLDER MASK
16X (0.45)
1
16
(R0.05) TYP
SYMM
(3.55)
BASED ON
0.125 THICK
STENCIL
14X (0.65)
9
8
SYMM
(5.8)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
2.75 X 3.97
2.46 X 3.55 (SHOWN)
2.25 X 3.24
0.125
0.15
0.175
2.08 X 3.00
4223595/A 03/2017
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
www.ti.com
GENERIC PACKAGE VIEW
RUM 16
4 x 4, 0.65 mm pitch
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224843/A
www.ti.com
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