DRV10974 [TI]

12V 标称电压、2.5A 峰值无传感器正弦控制三相 BLDC 电机驱动器;


型号：	DRV10974
厂家：	TEXAS INSTRUMENTS
描述：	12V 标称电压、2.5A 峰值无传感器正弦控制三相 BLDC 电机驱动器电机驱动传感器驱动器
文件：	总41页 (文件大小：2302K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DRV10974

ZHCSHA0E –JANUARY 2018 –REVISED MARCH 2021

DRV10974 12V、三相无传感器BLDC 电机驱动器

器件信息⁽¹⁾

1 特性

封装尺寸（标称值）

5.00mm x 4.40mm

4.00mm × 4.00mm

器件型号

DRV10974

封装

• 输入电压范围：4.4 V 至18 V

• 总驱动器H + L r_DS(on)：750mΩ（典型值），

T_A= 25°C 时

HTSSOP (16)

WQFN (16

(1) 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品

附录。

• 相位驱动电流：1A 连续（峰值1.5A）

• 180° 正弦换向，可实现最优声学性能

• 可利用电阻器配置超前角

DRV10974

PWM

• 可利用电阻器配置电流限制

• 软启动和可通过电阻器配置的加速曲线

• 提供内置电流感应，无需使用外部电流感应电阻器

• 专有无传感器控制，无需电机中心抽头

• 简单的用户接口：

– 用于启动的单引脚配置

– PWM 输入指定施加到电机的电压幅度

– 开漏FG 输出提供速度反馈

– 用于正向/反向控制的引脚

• 全方位保护：

180° Sensorless

Sinusoidal

Lead Angle

Accel Profile

Current Limit

4.4 V to 18 V

VCP

– 电机锁定检测和重启

– 过流、短路、过热和欠压保护

应用原理图

2 应用

• 白色家电

• 风扇、风机和泵

• BLDC 电机模块

3 说明

DRV10974 器件是一款具有集成功率 MOSFET 的三相

无传感器电机驱动器，可提供高达 1A (rms) 的持续驱

动电流。该器件专为成本敏感型、低噪声和低外部组件

数量的应用而设计。

DRV10974 器件使用一个专有无传感器控制方案提供

可靠换向。180° 正弦换向显著减少了 120°（梯形）换

向中较为典型的纯音。DRV10974 旋转使用一个外部

低功耗电阻器进行配置。电流限制可使用外部低功耗电

阻器进行设置。

通过施加一个用于控制驱动电压幅度的 PWM 输入，或

者使用模拟电压驱动 PWM 引脚，然后监控FG 引脚上

的速度反馈，DRV10974 器件可以轻松控制电机的转

速。

DRV10974 器件包含许多可提高效率的特性。由于该

器件支持借助电阻器配置超前角，因此用户可通过调整

相电流和相 BEMF 来优化驱动器效率。此外，该器件

使用的MOSFET 的r_DS(on)较低，有助于在驱动电机时

节省电力。

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLVSDN2

DRV10974

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ZHCSHA0E –JANUARY 2018 –REVISED MARCH 2021

Table of Contents

8 Application and Implementation..................................24

8.1 Application Information............................................. 24

8.2 Typical Application.................................................... 24

9 Power Supply Recommendations................................26

10 Layout...........................................................................27

10.1 Layout Guidelines................................................... 27

10.2 Layout Example...................................................... 27

11 Device and Documentation Support..........................28

11.1 Device Support........................................................28

11.2 接收文档更新通知................................................... 28

11.3 支持资源..................................................................28

11.4 Trademarks............................................................. 28

11.5 静电放电警告...........................................................28

11.6 术语表..................................................................... 28

12 Mechanical, Packaging, and Orderable

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 5

6.1 Absolute Maximum Ratings........................................ 5

6.2 ESD Ratings............................................................... 5

6.3 Recommended Operating Conditions.........................5

6.4 Thermal Information....................................................5

6.5 Electrical Characteristics.............................................6

6.6 Typical Characteristics..............................................10

7 Detailed Description......................................................11

7.1 Overview................................................................... 11

7.2 Functional Block Diagram.........................................12

7.3 Feature Description...................................................12

7.4 Device Functional Modes..........................................19

Information.................................................................... 28

4 Revision History

Changes from Revision D (June 2020) to Revision E (March 2021)

Page

• Updated Human-body model (HBM).................................................................................................................. 5

Changes from Revision B (June 2018) to Revision C (September 2018)

Page

• 将文档状态从“混合状态”更改为“量产数据”................................................................................................ 1

• 删除了器件信息表WQFN 条目中的“高级信息”标识......................................................................................1

• Deleted the "Advance informatoin" note from the WQFN pinout drawing.......................................................... 3

• Deleted the "Advance Information" note from the Thermal Information table.....................................................5

• Added description of Analog Mode Speed Control...........................................................................................12

• Added Kt High and Kt Low descriptions in abnormal Kt lock detect figure.......................................................16

• Added layout example for QFN package type..................................................................................................27

Changes from Revision A (April 2018) to Revision B (June 2018)

Page

• 向器件信息表中添加了WQFN 封装...................................................................................................................1

• Added pinout drawing for the WQFN package................................................................................................... 3

• Added a column to the Pin Functions table for the WQFN package, and added the TYPE column.................. 3

• Added a column to the Thermal Information table for the VQFN package.........................................................5

• Changed r_DS(on)vs. Temperature graph to include V_CCcondition.................................................................... 10

• Changed Speed-Control Transfer Function figure to clearly show when the device enters and exits low power

mode ................................................................................................................................................................12

• Updated Lock BEMF Abnormal text for clarity..................................................................................................16

• Changed Detailed Design Procedure to cover the high level tuning process of the RMP, ADV, and CS

settings............................................................................................................................................................. 25

Changes from Revision * (January 2018) to Revision A (April 2018)

Page

• 添加或更改了节1 列表中的项目.........................................................................................................................1

• 更改了节3 部分第三段的内容.............................................................................................................................1

• Added parameter symbol (f_{PWM_OUT}) to the 25-kHz PWM signal.....................................................................12

• Added parameter symbol (DC_STEP) for the control resolution.......................................................................... 12

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• Added parameter symbol (DC_{ON_MIN}) for the minimum-operation duty cycle...................................................12

• Changed "pulse durations" to "duty cycles"......................................................................................................12

• Changed PWM_DCto PWM_dc............................................................................................................................12

• Added parameter symbol (f_{FG_MIN}) for the motor speed...................................................................................15

• Changed the number of lock-detect schemes from five to six..........................................................................15

• Added a table note stating the required resistor tolerance............................................................................... 18

• Added a new 节7.4.1.2 section........................................................................................................................19

• Added a parameter symbol (t_ALIGN) in the 节7.4.1.3 section, and reworded the last sentence thereof...........20

• Changed the column headings of the two rightmost columns in 表7-2 ...........................................................20

• Added three table notes following 表7-2 .........................................................................................................20

• Changed "programmed resistor" to "selected resistor".....................................................................................21

• Added a table note stating the required resistor tolerance............................................................................... 21

• Added a table note stating the required resistor tolerance............................................................................... 22

• Added a ±30% tolerance to the V1P8 capacitor in 表8-1 ............................................................................... 24

• Changed content of Row 4 in 表8-2 to "Motor electrical constant"..................................................................25

• Deleted all previous content from the 节8.2.2 section and replaced it with a reference to the DRV10974

Tuning Guide ....................................................................................................................................................25

• Changed 图8-3 ............................................................................................................................................... 25

• Added location information for the capacitor in the 节9 section.......................................................................26

5 Pin Configuration and Functions

ADV

GND

VCP

PWM

V1P8

RMP

GND

Thermal

Pad

PGND

Not to scale

NC –No internal connection

图5-1. PWP PowerPAD™ Package 16-Pin HTSSOP With Exposed Thermal Pad Top View

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PWM

V1P8

RMP

VCC

Thermal

Pad

Not to scale

NC –No internal connection

图5-2. RUM Package 16-Pin WQFN With Exposed Thermal Pad Top View

表5-1. Pin Functions

NO.

HTSSOP WQFN

I/O

TYPE⁽¹⁾

DESCRIPTION

NAME.

Selects the applied lead angle by 1/8-W resistor; not to be driven externally with a

source; leaving the pin open results in the longest lead angle; the lead angle is

determined by the ADV pin voltage at power up.

ADV

Selects current limit by 1/8-W resistor; not to be driven externally with a source; leaving

the pin open results in the highest current limit; the current limit is determined by the CS

pin voltage at power up.

Provides motor speed feedback; open-drain output with internal pullup to V3P3; needs

a pullup resistor to limit current if pullup voltage is higher than V3P3

Direction control. FR = 0: U→V→W; FR = 1: U→W→V; value is determined by the FR

pin state on exit of low-power mode; internal pulldown

GND

7, 16

5, 14

Digital and analog ground

—

No internal connection

PGND

Power ground connection for motor power

Motor speed-control input; auto detect for analog or digital mode; internal pullup to

2.2 V

PWM

RMP

Acceleration ramp-rate control; 1/8-W resistor to GND to set acceleration rate; leaving

the pin open results in the slowest acceleration rate; the acceleration rate is determined

by the RMP pin voltage at power up.

I/O

Motor phase U

Motor phase V

LDO regulator for internal operation; 1-µF, 6.3-V ceramic capacitor tied to GND. Can

supply a maximum of 3 mA to an extenal load.

V1P8

V_CC

VCP

Power-supply connection; 10-µF, 25-V ceramic capacitor tied to GND

Charge-pump output; 100-nF, 10-V ceramic capacitor tied to V_CC

Motor phase W

I/O

The exposed thermal pad must be electrically connected to the ground plane by

soldering to the PCB for proper operation, and connected to the bottom side of the PCB

through vias for better thermal spreading.

Thermal

pad

—

(1) I = Input, O = Output, I/O = Input/output, P = Power, D = Digital, A = Analog, NC = No connection

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6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.3

–1

MAX

UNIT

V_CC

PWM, FR

CS, RMP, ADV

5.5

GND, PGND

0.3

Pin voltage

U, V, W

V1P8

–0.3

–40

–55

VCP

V_CC+ 5.5

150

Maximum junction temperature, T_Jmax

Storage temperature, T_stg

°C

150

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

±2000

±500

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

V_(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

4.4

NOM

MAX

UNIT

Supply voltage

V_CC

U, V, W

–0.7

–0.1

0.5

PWM, FR

5.5

Voltage

1.8

0.1

1.8

–0.1

PGND, GND

RMP, ADV

Current

V1P8 regulator-output current; external load

°C

Operating ambient temperature, T_A

Operating junction temperature, T_J

–40

125

°C

6.4 Thermal Information

DRV10974

THERMAL METRIC⁽¹⁾

PWP (HTSSOP)

16 PINS

37.8

RUM (VQFN)

UNIT

16 PINS

34.5

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_θJC(top)

R_θJB

25.2

20.7

13.3

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UNIT

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DRV10974

THERMAL METRIC⁽¹⁾

PWP (HTSSOP)

RUM (VQFN)

16 PINS

0.7

16 PINS

0.3

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

°C/W

ψ_JT

20.5

1.9

13.3

ψ_JB

R_θJC(bot)

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

6.5 Electrical Characteristics

over operating junction temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

SUPPLY CURRENT

I_CC

Supply current

T_A= 25°C, V_CC= 12 V, no motor load

T_A= 25°C, V_CC= 12 V

µA

I_CC(LP)

Low power mode

380

UVLO

V_{(UVLO_F)}

V_{(UVLO_R)}

V_hys(UVLO)

V_CCUVLO falling

V_CCUVLO rising

4.2

4.5

4.3

4.7

400

3.7

4.0

330

1.4

1.5

100

4.4

4.85

V_CCUVLO hysteresis

V_{VCP(UVLO_F)}Charge pump UVLO falling

V_{VCP(UVLO_R)}Charge pump UVLO rising

3.35

3.65

4.05

4.37

_VCP–V_CC

V_hys(VCP)

V_{(V1P8_F)}

V_{(V1P8_R)}

V_hys(V1P8)

Charge pump UVLO hysteresis

V1P8 UVLO falling

1.25

1.35

1.55

1.65

V1P8 UVLO rising

V1P8 UVLO hysteresis

VOLTAGE REGULATORS

V_V1P8

I_V1P8

V1P8 voltage

1.7

1.8

1.9

T_A= 25°C, C_(V1P8)= 1 μF

Maximum external load from V1P8

INTEGRATED MOSFET

r_{ds(on)_HS}High-side FET on-resistance

r_{ds(on)_LS}Low-side FET on-resistance

PHASE DRIVER

T_A= 25°C, V_CC= 12 V, I_O= 100 mA

0.375

0.425

SlewRate = 0; measure 20% to 80%;

VCC = 12 V; phase current > 20 mA

SL_{PH_LH}

SL_{PH_HL}

Phase slew rate switching low to high

120

170

V/μs

SlewRate = 0; measure 80% to 20%;

VCC = 12 V; phase current > 20 mA

Phase slew rate switching high to low

120

f_{PWM_OUT}

t_{dead_time}

CHARGE PUMP

Phase output PWM frequency

kHz

Recommended dead time

440

V_VCP

VCP voltage

V_CC= 4.4 V to 18 V

V_CC+ 4 V_CC+ 5 V_CC+ 5.5

CURRENT LIMIT

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over operating junction temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

0.2

0.4

0.6

0.8

MAX UNIT

V_CC= 12 V, R_(CS)= 7.32 kΩ±1%

V_CC= 12 V, R_(CS)= 16.2 kΩ±1%

V_CC= 12 V, R_(CS)= 25.5 kΩ±1%

V_CC= 12 V, R_(CS)= 38.3 kΩ±1%

V_CC= 12 V, R_(CS)= 54.9 kΩ±1%

V_CC= 12 V, R_(CS)= 80.6 kΩ±1%

V_CC= 12 V, R_(CS)= 115 kΩ±1%

I_LIMIT

Current-limit threshold

1.2

1.4

V_CC= 12 V, R_(CS)= 182 kΩ±1%,

open loop and closed loop current

limit

1.6

1.5

V_CC= 12 V, R_(CS)= 182 kΩ±1%,

align current limit

RANGE OF MOTORS SUPPORTED

R_m

Motor resistance measurement

Phase to center tap

K_t

Motor BEMF constant measurement

Motor align time

150 mV/Hz

t_ALIGN

0.67

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over operating junction temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

2.2

TYP

MAX UNIT

PWM - DIGITAL MODE

V_IH(DIG)

V_IL(DIG)

ƒ_PWM

PWM input high voltage

PWM input low voltage

PWM input frequency

0.6

0.1

100

kHz

V_VCC< 14 V

_VCC≥14 V

100 %

[(14 /

V_VCC) ×

100] %

DC_MAX

Maximum output PWM duty cycle

Minimum output PWM duty cycle device

DC_MIN

needs to guarantee (irrespective of input Lower duty cycle from 15% down

PWM DC)

15%

Minimum input duty cycle that device

uses to drive motor

DC_{ON_MIN}

1.5 %

DC_STEP

Duty cycle step size/resolution

0.2 %

1.695

V_IH(AUTO)

PWM input high voltage for auto detection

1.62

1.77

PWM input low voltage for exiting PWM

mode

V_IL(AUTO)

R_pu(PWM)

1.315

1.39

120

1.465

Internal PWM pullup resistor to V3P3

kΩ

LOW-POWER MODE

PWM pulse duration to exit low-power

mode

t_{(EX_LPM)}

PWM > V_IH(DIG)

µs

V_{(EX_LPM)}

t_{(EN_LPM)}

PWM voltage to exit low-power mode

PWM low time to enter low-power mode

1.5

PWM < V_IL(DIG);motor stationary

PWM - ANALOG MODE

V_{ANA_FS}

V_{ANA_ZS}

R_out(PWM)

t_SAM

Analog full-speed voltage

1.8

Analog zero-speed voltage

kΩ

µs

External analog driver output impedance

Analog speed sample period

Analog voltage resolution

320

3.5

V_{ANA_RES}

DIGITAL I/O (FG OUTPUT, FR INPUT)

Minimum FG output frequency during

coast

f_{FG_MIN}

V_IH(FR)

V_IL(FR)

Input high

2.2

Input low

0.6

I_{(FG_SINK)}

R_pu(FG)

R_pd(FR)

Output sink current, FG

Internal FG pullup resistor to 3.3V

Internal FR pulldown resistor to ground

V_O= 0.3 V

kΩ

100

LOCK DETECTION RELEASE TIME

t_{(LOCK_OFF)}Lock release time

OVERCURRENT PROTECTION

I_{OC_limit}

t_{OC_retry}

Overcurrent protection

T_A= 25°C

2.5

Overcurrent protection retry time

THERMAL SHUTDOWN

T_SD

Shutdown temperature threshold

140

150

°C

Shutdown temperature threshold

hysteresis

T_SD(hys)

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over operating junction temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

LEAD ANGLE

V_CC= 12 V, R_(ADV)= 10.7 kΩ±1%

V_CC= 12 V, R_(ADV)= 14.3 kΩ±1%

V_CC= 12 V, R_(ADV)= 17.8 kΩ±1%

V_CC= 12 V, R_(ADV)= 22.1 kΩ±1%

V_CC= 12 V, R_(ADV)= 28 kΩ±1%

V_CC= 12 V, R_(ADV)= 34 kΩ±1%

V_CC= 12 V, R_(ADV)= 41.2 kΩ±1%

V_CC= 12 V, R_(ADV)= 49.9 kΩ±1%

V_CC= 12 V, R_(ADV)= 59 kΩ±1%

V_CC= 12 V, R_(ADV)= 71.5 kΩ±1%

V_CC= 12 V, R_(ADV)= 86.6 kΩ±1%

V_CC= 12 V, R_(ADV)= 105 kΩ±1%

V_CC= 12 V, R_(ADV)= 124 kΩ±1%

V_CC= 12 V, R_(ADV)= 150 kΩ±1%

V_CC= 12 V, R_(ADV)= 182 kΩ±1%

100

150

200

250

300

400

500

600

700

800

900

1000

ADV_select

Lead angle selection

µs

ACCELERATION RAMP RATE

V_CC= 12 V, R_(RMP)= 7.32 kΩ±1%

V_CC= 12 V, R_(RMP)= 10.7 kΩ±1%

V_CC= 12 V, R_(RMP)= 14.3 kΩ±1%

V_CC= 12 V, R_(RMP)= 17.8 kΩ±1%

V_CC= 12 V, R_(RMP)= 22.1 kΩ±1%

V_CC= 12 V, R_(RMP)= 28 kΩ±1%

V_CC= 12 V, R_(RMP)= 34 kΩ±1%

V_CC= 12 V, R_(RMP)= 41.2 kΩ±1%

V_CC= 12 V, R_(RMP)= 49.9 kΩ±1%

V_CC= 12 V, R_(RMP)= 59 kΩ±1%

V_CC= 12 V, R_(RMP)= 71.5 kΩ±1%

V_CC= 12 V, R_(RMP)= 86.6 kΩ±1%

V_CC= 12 V, R_(RMP)= 105 kΩ±1%

V_CC= 12 V, R_(RMP)= 124 kΩ±1%

V_CC= 12 V, R_(RMP)= 150 kΩ±1%

V_CC= 12 V, R_(RMP)= 182 kΩ±1%

RMP_select

RMP selection for acceleration profile

code

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6.6 Typical Characteristics

4.98

4.97

4.96

4.95

4.94

4.93

4.92

4.91

4.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

4.89

4.88

4.87

V_CC(V)

-40

-20

20 40

Temperature (°C)

100

D001

D002

图6-1. Supply Current vs Power Supply

V_CC= 12 V

图6-2. r_DS(on)vs Temperature When V_CC= 12 V

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7 Detailed Description

7.1 Overview

The DRV10974 device is a three-phase sensorless motor driver with integrated power MOSFETs, which provide

drive-current capability up to 1 A continuous (rms). The device is specifically designed for low-noise, low

external-component count, 12-V motor-drive applications. The 180° commutation requires no configuration

beyond setting the peak current, the lead angle, and the acceleration profile, each of which is configured by an

external resistor.

The 180° sensorless-control scheme provides sinusoidal output voltages to the motor phases as shown in 图

7-1.

图7-1. 180° Sensorless-Control Scheme

Interfacing to the DRV10974 device is simple and intuitive. The DRV10974 device receives a PWM input that it

uses to control the speed of the motor. The duty cycle of the PWM input is used to determine the magnitude of

the voltage applied to the motor. The resulting motor speed can be monitored on the FG pin. The FR pin is used

to control the direction of rotation for the motor. The acceleration ramp rate is controlled by the RMP pin. The

current limit is controlled by a resistor on the CS pin. The lead angle is controlled by a resistor on the ADV pin.

When the motor is not spinning, a low-power mode turns off unused circuits to conserve power.

The DRV10974 device features extensive protection and fault-detect mechanisms to ensure reliable operation.

The device provides overcurrent protection without the requirement for an external current-sense resistor. Rotor-

lock detect uses several methods to reliably determine when the rotor stops spinning unexpectedly. The device

provides additional protection for undervoltage lockout (UVLO), for thermal shutdown, and for phase short circuit

(phase to phase, phase to ground, phase to supply).

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7.2 Functional Block Diagram

V_CC

VCP

V_CC

VCP

V_CC

Charge

Pump

Linear Reg

V1P8

Phase U

predriver

V_CC

V3P3

V_CC

PWM

V_CC

VCP

Phase V

predriver

RMP

ADC

(4 bit)

Core

Logic

V_CC

VCP

ADC

(3 bit)

Phase W

predriver

ADV

ADC

(4 bit)

V3P3

Lock

Overcurrent

Thermal

GND

PGND

7.3 Feature Description

7.3.1 Speed Input and Control

The DRV10974 device has a three-phase 25-kHz PWM (f_{PWM_OUT}) output that has an average value of

sinusoidal waveforms from phase to phase as shown in 图 7-2. When any phase is measured with reference to

ground, the waveform observed is a PWM-encoded sinusoid coupled with third-order harmonics as shown in 图

7-3. This encoding scheme simplifies the driver requirements because one phase output is always equal to zero.

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U-V

V-W

W-U

Sinusoidal Voltage from Phase to GND

With 3^rd-Order Harmonics

Sinusoidal Voltage from Phase to Phase

图7-2. Sinusoidal Voltage

PWM output

Average value

图7-3. PWM Encoded Phase Output and the Average Value

The output amplitude is determined by the supply voltage (V_CC) and the PWM-commanded duty cycle (PWM) as

calculated in 方程式1 and shown in 图7-4. The maximum amplitude is applied when the commanded PWM duty

cycle is slightly less than 100% in order to keep the 25-kHz PWM rate (f_{PWM_OUT}).

= PWM_dcì V_CC

ph_pk

(1)

100% PWM input

100% peak output

50% PWM input

50% peak output

VM/2

图7-4. Output Voltage Amplitude Adjustment

The motor speed is controlled indirectly by using the PWM command to control the amplitude of the phase

voltages which are applied to the motor. The PWM pin can be driven by either a digital duty cycle or an analog

voltage.

The duty cycle of the PWM input (PWM) is passed through a low-pass filter that ramps from 0% to 100% duty

cycle in 120 ms. The control resolution is approximately 0.2% (DC_STEP). The signal path from PWM input to

PWM motor is shown in 图7-5.

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Amplitude of Output

Sine Wave

PWM Output

PWM Input

LPF

图7-5. PWM Command Input Control Diagram

The output peak amplitude is described by 方程式 1 when PWM_dc> 15% (the minimum-operation duty cycle).

When the PWM-commanded duty cycle is lower than the minimum-operation duty cycle and higher than 1.5%

(DC_{ON_MIN}), the output is controlled the by the minimum-operation duty cycle (DC_MIN). This is shown in 图7-6 for

analog input, and for duty cycles greater than 1.5% (DC_{ON_MIN}) for digital input. If the supply voltage (V_VCC) > 14

V, the maximum PWM_dcis limited to 14 V / V_VCC

511 100%

PWM Mode

15%

100%

511

PWM duty ‰

图7-6. PWM-Mode Speed-Control Transfer Function

When the PWM pin is driven with an analog voltage, the output peak amplitude depends on the supply voltage,

the analog voltage on the PWM pin (V_ANA), and the voltage of V1P8 (V_V1P8). This is shown in 方程式2:

V_ANA

ì V_CC

ph_pk

V_1P8

(2)

Note the output peak amplitude is described by 方程式 2 when the V_ANA> 0.27 V or 15% of 1.8 V. This is the

equivalent of the minimum-operation duty cycle percentage of 15% (DC_MIN). When the analog voltage on the

PWM pin is lower than the minimum-operation duty-cycle percentage but higher than the zero-speed analog

voltage (V_{ANA_ZS}), the output is controlled by the minimum-operation duty cycle. When the analog voltage on the

PWM pin is below zero-speed analog voltage, the DRV10974 enters low-power mode. This is shown in 图7-7.

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511 100%

Analog Mode

15%

0.27 V

100%

1.8 V

Analog Voltage (V_ANA) ‰

V_{ANA_ZS}

图7-7. Analog-Mode Speed-Control Transfer Function

7.3.2 Motor Direction Change

The DRV10974 device can be easily configured to drive the motor in either direction by setting the input on the

FR (forward-reverse) pin to a logic 1 or logic 0 state. The direction of commutation as described by the

commutation sequence is defined as follows:

FR = 0

FR = 1

U→V→W

U→W→V

7.3.3 Motor-Frequency Feedback (FG)

During operation of the DRV10974 device, the FG pin provides an indication of the speed of the motor. The FG

pin toggles at a rate of one time during an electrical cycle. Using this information and the number of pole pairs in

the motor, use 方程式3 to calculate the mechanical speed of the motor.

ƒ_(FG)ì 60

RPM =

pole _pairs

(3)

During open-loop acceleration the FG pin indicates the frequency of the signal that is driving the motor. The lock

condition of the motor is unknown during open-loop acceleration and therefore the FG pin could toggle during

this time even though the motor is not moving.

During spin down, the DRV10974 device continues to provide speed feedback on the FG pin. The DRV10974

device provides the output of the U-phase comparator on the FG pin until the motor speed drops below 10 Hz

(f_{FG_MIN}). When the motor speed falls below 10 Hz, the device enters into the low-power mode and the FG

output is held at a logic high.

7.3.4 Lock Detection

When the motor is locked by some external condition, the DRV10974 device detects the lock condition and acts

to protect the motor and the device. The lock condition must be properly detected whether the condition occurs

as a result of a slowly increasing load or a sudden shock.

The DRV10974 device reacts to the lock condition by stopping the motor drive. To stop driving the motor, the

phase outputs are placed into a high-impedance state. After successfully transitioning into a high-impedance

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state as the result of a lock condition, the DRV10974 device attempts to restart the motor after t_{(LOCK_OFF)}

seconds.

The DRV10974 device has a comprehensive lock-detect function that includes six different lock-detect schemes.

Each of these schemes detects a particular condition of the lock as shown in 图7-8.

Kt Measure

No Motor

High-

Impedance and

Restart Logic

Open Loop Abnormal

BEMF Abnormal

Closed Loop Abnormal

Speed Abnormal

图7-8. Lock Detect

The following sections describe each lock-detect scheme.

7.3.4.1 Lock Kt Measure

The DRV10974 device measures the actual Kt of the motor when transitioning from open-loop acceleration to

closed-loop acceleration. If the measured Kt is less than 200 mV, the device indicates that the handoff Kt level

was not properly reached and the lock is triggered.

7.3.4.2 Lock No Motor

The phase-U current is checked at the end of the align state. If the phase-U current is not greater than 50 mA,

then the motor is not connected. This condition is reported as a lock condition.

7.3.4.3 Lock Open Loop Abnormal

Transition from open loop to closed loop is based on the estimated value of BEMF. If during open-loop

acceleration the electrical commutation rate exceeds 200 Hz without reaching the handoff threshold, this lock is

triggered.

7.3.4.4 Lock BEMF Abnormal

For any specific motor, the integrated value of BEMF during half of an electrical cycle is a constant as shown by

the shaded gray area in 图 7-9. This value is constant regardless of whether the motor runs fast or slow. The

DRV10974 device monitors this value and uses it as a criterion to determine if the motor is in a lock condition.

The DRV10974 device uses the integrated BEMF to determine the Kt value of the motor during the initial motor

start. Based on this measurement, a range of acceptable Kt values is established. Then, during closed-loop

motor operation the Ktc (Kt calculated) value is continuously updated. Finally, the Ktc value is checked to see if it

is within the range between ½ Kt and 2Kt. If the Ktc value goes beyond the acceptable range, a lock condition is

triggered as shown in 图 7-10. Note, there is a blanking period of 0.3 s after the transition from open loop to

closed loop where the abnormal BEMF lock is momentarily disabled. The device uses this time to finalize the Kt

value that Ktc is compared against.

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图7-9. BEMF Integration

Kt_high = 2 Kt

Ktc

Kt_low = 0.5 Kt

time

Lock detect

图7-10. Abnormal Kt Lock Detect

7.3.4.5 Lock Closed Loop Abnormal

This lock condition is active when the DRV10974 device is operating in the closed-loop mode. The motor is

indicated as not moving when the closed-loop commutation period becomes lower than half the previous

commutation period. This condition triggers the closed-loop abnormal-lock condition.

7.3.4.6 Lock Speed Abnormal

If the motor is in normal operation, the motor BEMF is always less than the voltage applied to the phase. The

sensorless-control algorithm of the DRV10974 device is continuously updating the value of the motor BEMF

based on the speed of the motor and the motor Kt as shown in 图7-11. If the calculated value for motor BEMF is

1.5 times higher than the applied voltage on phase U (V_U) for an electrical period then an error is present in the

system, and the calculated value for motor BEMF is wrong or the motor is out of phase with the commutation

logic. When this condition is detected, a lock is triggered.

V_U

BEMF = Kt × speed

If speed >

Lock is triggered

图7-11. BEMF Monitoring

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7.3.5 Soft Current-Limit

The current-limit function provides active protection for preventing damage as a result of high current. The soft

current-limit does not use direct-current measurement for protection, but rather, uses the measured motor

resistance (Rm) and motor velocity constant (Kt) to limit the voltage applied to the phase (U) such that the

current does not exceed the limit value (I_(LIMIT)). The soft current-limit scheme is shown in 图 7-12 based on the

calculation in 方程式4.

The soft current-limit is only active when in normal closed-loop mode and does not result in a fault condition nor

does it result in the motor being stopped. The soft current-limit is typically useful for limiting the current that

results from heavy loading during motor acceleration. The I_(LIMIT)current is configured by an external resistor

(R_(CS)) as shown in 表7-1.

V_U= BEMF + I × Rm

BEMF = Kt × speed

If V_U< BEMF + I_(LIMIT)× Rm

I < I_(LIMIT)

Current Limit:

V_Umax= BEMF + I_(LIMIT)× Rm

图7-12. Current Limit

Use 方程式4 to calculate the I_(LIMIT)value.

- Speed´Kt

(U)LIMIT

I_(LIMIT)

(4)

表7-1 can be used to determine the I_(LIMIT)value.

表7-1. Soft Current-Limit Selections

R_(CS)[kΩ]⁽¹⁾

I_(LIMIT)[mA]

7.32

200

16.2

400

25.5

600

38.3

800

54.9

1000

80.6

1200

1400

115

182

1600 (1500 during align)

(1) All resistors are ±1 %.

Spacer

备注

The soft current-limit is not correct if the motor is out of phase with the commutation control logic

(locked rotor). The soft current-limit is not effective under this condition.

7.3.6 Short-Circuit Current Protection

The short-circuit current protection function shuts off drive to the motor by placing the motor phases into a high-

impedance state if the current in any motor phase exceeds the short-circuit protection limit I_{(OC_LIMIT)}. The

DRV10974 device goes through the initialization sequence and attempts to restart the motor after the short-

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circuit condition is improved. This function is intended to protect the device and the motor from catastrophic

failure when subjected to a short-circuit condition.

7.3.7 Overtemperature Protection

The DRV10974 device has a thermal shutdown function which disables the motor operation when the device

junction temperature has exceeded the T_SDtemperature. Motor operation resumes when the junction

temperature becomes lower than T_SD–T_SD(hys)

7.3.8 Undervoltage Protection

The DRV10974 device has an undervoltage lockout feature, which prevents motor operation whenever the

supply voltage (V_CC) becomes too low. Upon power up, the DRV10974 device operates when V_CCrises above

V_{(UVLO_F)}+ V_hys(UVLO). The DRV10974 device continues to operate until V_CCfalls below V_{(UVLO_F)}

7.4 Device Functional Modes

7.4.1 Spin-Up Settings

7.4.1.1 Motor Start

The DRV10974 device starts the motor using a procedure which is shown in 图7-13.

Power On (low

power mode)

PWM > 1 us

Initial Speed

Detection / Coast

FR Pin Change

f < 10Hz or

t > 5 s

Temp <

threshold-hys

t = 5 s

Align

UVLO

Sleep

Over temp

Over current

Lock

t = 5 s

Measure Motor

Resistance

Acceleration profile from

RMP pin

Open Loop

Acceleration

Coast / Measure Kt

Acceleration profile from

RMP pin

Closed Loop

Acceleration / Run

图7-13. DRV10974 Initialization and Motor Start-Up Sequence

7.4.1.2 Initial Speed Detect

Every time the DRV10974 device exits low-power mode, it determines if the motor is spinning using a function

called initial speed detect. If the frequency on the FG pin is less than 10 Hz, the motor is considered stationary. If

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the frequency is greater than 10 Hz the motor is decelerated until it is below 10 Hz or a 5-second time-out has

occurred.

7.4.1.3 Align

To align the rotor to the commutation logic, the DRV10974 device applies a current equivalent to the closed-loop

run current to phase U by driving phases V and W equally. This condition is maintained for a maximum of 0.67 s

(t_ALIGN). To avoid a sudden change in current that could result in undesirable acoustics, the voltage applied to

the motor is changed gradually to obtain a current change of 12 A/s.

7.4.2 Open-Loop Acceleration

After the motor is confirmed to be stationary and after completing the motor initialization, the DRV10974 device

begins to accelerate the motor. This acceleration is accomplished by applying a voltage to the motor at the

appropriate drive state and increasing the rate of commutation without regard to the actual position of the motor

(referred to as open-loop operation). The function of the open-loop operation is to drive the motor to a minimum

speed so that the motor generates sufficient BEMF to allow the commutation control logic to drive the motor

accurately.

The motor start-up profile can be configured using an external resistor to set the acceleration profile before

transitioning to closed-loop operation. 图 7-14 shows this acceleration profile. During closed-loop operation the

RMP pin controls the closed-loop acceleration and deceleration. 表 7-2 lists the selectable acceleration

parameters.

表7-2. Acceleration Profile Settings

CLOSED-LOOP-

ACCELERATION

TRANSITION TIME

[s]⁽²⁾

CLOSED-LOOP-

DECELERATION

TRANSITION TIME

[s]⁽³⁾

R_RMP[kΩ]⁽¹⁾

RMP SELECTION

Accel2 [Hz/s²]

Accel1 [Hz/s]

7.32

10.7

14.3

17.8

22.1

0.22

1.65

3.3

4.6

9.2

4.6

2.7

0.2

5.4

41.2

49.9

71.5

86.6

105

124

150

182

5.4

3.3

1.65

0.22

(1) All resistors are ±1%

(2) Time to transition from 0 to 100% duty cycle.

(3) Time to transition from 100% to 0% duty cycle.

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Speed = Accel1 x t + 0.5 x Accel2 x t²

Speed

Closed Loop

Align Time

Time

Open Loop Acceleration

图7-14. Start-Up Profile

7.4.3 Start-Up Current Sensing

The start-up peak current is controlled by the current-sense limit resistor, R_(CS). The start current is set by

selecting the R_(CS)resistor based on 表 7-3. The current should be selected to allow the motor to accelerate

reliably to the handoff threshold. Heavier loads may require a higher current setting, but the rate of acceleration

is limited by the selected resistor, R_(RMP)

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表7-3. Start-Up Current Limit

R_(CS)[kΩ]⁽¹⁾

I_(LIMIT)[mA]

7.32

200

16.2

25.5

38.3

54.9

80.6

115

400

600

800

1000

1200

1400

182

1600 (1500 for align)

(1) All resistors are ±1%.

7.4.4 Closed Loop

When the motor accelerates to the target BEMF threshold, commutation control transitions from open-loop mode

to closed-loop mode. During this transition, the motor is allowed to coast for one electrical cycle to measure Kt.

The commutation drive sequence and timing are determined by the internal control algorithm, and the applied

voltage is determined by the PWM-commanded duty-cycle input. The closed-loop acceleration and deceleration

values are provided in 表7-2.

7.4.5 Control Advance Angle

To achieve the best efficiency, the drive state of the motor must be controlled such that the current is aligned with

the BEMF voltage of the motor. 图 7-15 illustrates the operation when the drive angle has been optimized. For

complete flexibility, the DRV10974 device offers a wide range of fixed lead times. The options for lead time are

controlled by a resistor on the ADV pin. The values available are shown in 表7-4.

U phase voltage

U phase BEMF

U phase current

û§

图7-15. Drive Angle Adjustment

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表7-4. Lead Time Selection

R_ADV[kΩ]⁽¹⁾

LEAD TIME [µs]

10.7

14.3

17.8

22.1

100

150

200

250

300

400

500

600

700

800

900

1000

41.2

49.9

71.5

86.6

105

124

150

182

(1) All resistors are ±1%.

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8 Application and Implementation

备注

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes. Customers should validate and test their design

implementation to confirm system functionality.

8.1 Application Information

The DRV10974 device is used in sensorless 3-phase BLDC motor control. The driver provides a high-

performance, high-reliability, flexible, and simple solution for appliance fan, pump, and blower applications. The

following design shows a common application of the DRV10974 device.

8.2 Typical Application

ADV

GND

VCP

59k

10uF

100nF

V_CC

PWM

V1P8

RMP

GND

PWM IN

1 µF

7.32k

115k

PGND

图8-1. Typical Application Schematic

表8-1. Recommended External Components

NODE 1

NODE 2

GND

V_CC

COMPONENT

V_CC

VCP

V1P8

RMP

10-μF, 25-V ceramic capacitor tied from V_CCto ground

100-nF, 10-V ceramic capacitor tied from VCP to V_CC

1-μF ±30%, 6.3-V ceramic capacitor tied from V1P8 to ground

GND

1%, 1/8 watt resistor tied from RMP to ground to set the desired acceleration profile

1%, 1/8-watt resistor tied from CS to ground to set the desired current limit

1%, 1/8-watt resistor tied from ADV to ground to set the desired lead angle (time)

ADV

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8.2.1 Design Requirements

表8-2 provides design input parameters and motor parameters for system design.

表8-2. Recommended Application Range

MIN

NOM

MAX

UNIT

Motor voltage

4.4

BEMF constant

Phase to center tap, measured while motor is coasting

150

mV/Hz

Motor phase resistance Phase to center tap

Motor electrical

constant

1 phase; inductance divided by resistance, measured phase to

phase, yields the electrical constant for 1 phase.

100

5000

μs

Motor winding current

(rms)

Absolute maximum

current

During locked condition

2.5

8.2.2 Detailed Design Procedure

Assuming the motor used in the application falls within the recommended application range shown in 表 8-2, the

DRV10974 device is simple and intuitive to interface with. The DRV10974 device receives a PWM input that it

uses to control the speed of the motor. The duty cycle of the PWM input is used to determine the magnitude of

the voltage applied to the motor. The resulting motor speed can be monitored on the FG pin. The FR pin is used

to control the direction of rotation for the motor. As a result, the only configuration and customization is dictated

by the RMP, ADV, and CS pins.

The resistor on the CS pin is usually determined by the application specifications. Because the CS pin

determines the current limit, specifications such as motor current or input power can determine what value the

current limit can be set to. Then, the RMP and ADV resistors must be set experimentally through tuning. The

RMP pin sets the acceleration profile of the motor. If the RMP pin is set to faster acceleration, the motor starts up

faster but may be more likely to fail start-up. In addition, the ADV resistor controls the lead time so the applied

current is aligned with the BEMF of the motor. If the ADV resistor is incorrectly selected, the motor may not run

efficiently or at all.

As a result, the RMP pin is usually set to the slowest profile while ADV is correctly tuned. Then, the RMP can be

set to a different value that allows for a faster acceleration with no impact to start-up reliability. This process, and

other design considerations, are documented extensively in the DRV10974 Technical Documents tab on the

DRV10974 product page.

8.2.3 Application Curves

图8-2. DRV10974 Operation Current Waveform

图8-3. DRV10974 Start-Up Waveform

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9 Power Supply Recommendations

The DRV10974 device is designed to operate from an input voltage supply, V_CC, range between 4.4 V and 18 V.

The user must place a minimum of a 10-µF capacitor rated for V_CCbetween the V_CCand GND pins and as close

as possible to the V_CCand GND pins.

If the power supply ripple is more than 200 mV, in addition to the local decoupling capacitors, a bulk capacitance

is required and must be sized according to the application requirements.

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10 Layout

10.1 Layout Guidelines

• Use thick traces when routing to the V_CC, GND, U, V, and W pins, because high current passes through these

traces.

• Place the 10-µF capacitor between V_CCand GND, and as close to the V_CCand GND pins as possible.

• Place the 100-nF capacitor between VCP and V_CC, and as close to the VCP and V_CCpins as possible.

• Connect GND and PGND under the thermal pad.

• Keep the thermal pad connection as large as possible. It should be one piece of copper without any gaps.

10.2 Layout Example

GND

VCP

V_CC

ADV

10 mF

100 nF

GND

PWM

V1P8

RMP

GND

(Thermal pad)

59 kW

1 mF

7.32 kW

PGND

115 kW

GND

图10-1. HTSSOP Layout Example

PWM

V1P8

RMP

VCC

GND

(PPAD)

1uF

7.32k

GND

图10-2. QFN Layout Example

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11 Device and Documentation Support

11.1 Device Support

11.2 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

11.3 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

11.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

11.5 静电放电警告

静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理

和安装程序，可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参

数更改都可能会导致器件与其发布的规格不相符。

11.6 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most-

current data available for the designated device. This data is subject to change without notice and without

revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.

Submit Document Feedback

Product Folder Links: DRV10974

PACKAGE OPTION ADDENDUM

www.ti.com

10-Feb-2023

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

DRV10974PWPR

DRV10974RUMR

ACTIVE

HTSSOP

WQFN

PWP

RUM

2000 RoHS & Green

3000 RoHS & Green

NIPDAU

Level-3-260C-168 HR

Level-1-260C-UNLIM

-40 to 125

10974

Samples

NIPDAU

DRV

10974

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Feb-2023

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

10-Feb-2023

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

DRV10974PWPR

DRV10974RUMR

HTSSOP PWP

WQFN RUM

2000

3000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

4.25

1.15

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

10-Feb-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

DRV10974PWPR

DRV10974RUMR

HTSSOP

WQFN

PWP

RUM

2000

3000

350.0

367.0

350.0

367.0

43.0

35.0

Pack Materials-Page 2

PACKAGE OUTLINE

PWP0016J

PowerPAD^TMTSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

SEATING

PLANE

6.6

6.2

TYP

0.1 C

PIN 1 INDEX

AREA

14X 0.65

5.1

4.9

4.55

NOTE 3

0.30

16X

4.5

4.3

0.19

0.1

C A B

(0.15) TYP

SEE DETAIL A

0.25

1.2 MAX

GAGE PLANE

3.55

2.68

0.15

0.05

0.75

0.50

0 -8

DETAIL A

TYPICAL

2.46

1.75

THERMAL

PAD

4223595/A 03/2017

PowerPAD is a trademark of Texas Instruments.

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MO-153.

www.ti.com

EXAMPLE BOARD LAYOUT

PWP0016J

PowerPAD^TMTSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

(3.4)

NOTE 8

METAL COVERED

BY SOLDER MASK

(2.46)

16X (1.5)

SEE DETAILS

SYMM

16X (0.45)

(1.3) TYP

(R0.05) TYP

SYMM

(0.65)

(3.55)

(5)

NOTE 8

14X (0.65)

(

0.2) TYP

VIA

(1.35) TYP

SOLDER MASK

DEFINED PAD

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 10X

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

OPENING

METAL

EXPOSED METAL

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

NON-SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

15.000

SOLDER MASK DETAILS

4223595/A 03/2017

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

7. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

8. Size of metal pad may vary due to creepage requirement.

9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged

or tented.

www.ti.com

EXAMPLE STENCIL DESIGN

PWP0016J

PowerPAD^TMTSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

(2.46)

BASED ON

0.125 THICK

STENCIL

16X (1.5)

METAL COVERED

BY SOLDER MASK

16X (0.45)

(R0.05) TYP

SYMM

(3.55)

BASED ON

0.125 THICK

STENCIL

14X (0.65)

SYMM

(5.8)

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 10X

STENCIL

THICKNESS

SOLDER STENCIL

OPENING

0.1

2.75 X 3.97

2.46 X 3.55 (SHOWN)

2.25 X 3.24

0.125

0.15

0.175

2.08 X 3.00

4223595/A 03/2017

NOTES: (continued)

10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

11. Board assembly site may have different recommendations for stencil design.

www.ti.com

GENERIC PACKAGE VIEW

RUM 16

4 x 4, 0.65 mm pitch

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224843/A

www.ti.com

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TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

DRV10974 [TI]

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