DRV3245AEPHPRQ1 [TI]
具有精确电流感应和增强保护功能的汽车 0 级 12V 电池三相栅极驱动器单元 | PHP | 48 | -40 to 150;
| 型号： | DRV3245AEPHPRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有精确电流感应和增强保护功能的汽车 0 级 12V 电池三相栅极驱动器单元 | PHP | 48 | -40 to 150 电池 栅极驱动 驱动器 |
| 文件： | 总12页 (文件大小：798K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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DRV3245E-Q1
ZHCSJL0 –APRIL 2019
具有高性能传感、保护和诊断功能的DRV3245E-Q1三相 0 级汽车栅极驱动
器单元 (GDU)
1 特性
– 过热警告
1
•
符合面向汽车应用的 AEC-Q100 标准：
2 应用
–
器件温度等级 0：
–40°C 至 +150°C，TA
•
高温 12V 汽车应用
–
–
–
手自一体变速器和双离合器变速器
线控换档
•
SafeTI™半导体组件
根据 ISO 26262 标准的相应要求开发
–
分动箱和泵
•
•
•
•
4.5V 至 45V 工作电压范围
可编程峰值栅极驱动电流高达 1A
支持 100% 占空比的电荷泵栅极驱动器
电流分流放大器和相位比较器
3 说明
DRV3245E-Q1 器件是一款适用于三相电机驱动 应
用。此器件适用于高温汽车 应用 ，根据 ISO 26262
标准中有关功能安全应用的相应要求设计 而成。该器
件具有三个半桥驱动器，每个驱动器都能够驱动高侧和
低侧 N 沟道 MOSFET，同时还具有先进的 FET 保护
和监控功能。电荷泵驱动器可在冷启动运行期间实现
100% 占空比并支持低电池电压。凭借所集成的电流检
测放大器、相位比较器和基于 SPI 的配置省去了大多
数外部和无源组件，从而减少了所需物料并减小了印刷
电路板 (PCB) 空间。
–
A 器件：3 个电流分流放大器和三相比较器，具
有状态，通过 SPI
–
B 器件：2 个电流分流放大器和三相比较器，具
有实时监控器，通过数字引脚
•
•
•
•
•
•
高达 20kHz 的 3 PWM 或 6 PWM 输入控制
能够进行单 PWM 模式换向
支持 3.3V 和 5V 数字接口
串行外设接口 (SPI)
耐热增强型 48 引脚 HTQFP 封装
保护 功能：
DRV3245E-Q1 器件还为内部时钟集成了诊断和保护功
能，并可提供常用系统诊断检查支持，二者皆可进行实
例化并通过 SPI 进行报告。这种集成 特性 的灵活性使
得该器件能够无缝集成到各种安全架构中。
–
–
–
–
–
–
–
–
内部稳压器、电池电压监控器
SPI CRC
时钟监控器
模拟内置自检
器件信息 (1)
可编程的死区时间控制
MOSFET 击穿保护
MOSFET VDS 过流监视器
栅源电压实时监控器
器件型号
封装
封装尺寸（标称值）
DRV3245E-Q1
HTQFP (48)
7.00mm × 7.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
简化原理图
4.5 to 45 V
4.5 to 45 V
B Device
Shutdown
Shutdown
A Device
2
PWM
6
2
PWM
3-Phase Gate
Driver
Gate Drive
Gate Drive
3-Phase Gate
Driver
6
SPI
6(Gate)
+6(Source)
6(Gate)
+6(Source)
SPI
4
Protection
Diagnostics
Monitoring
4
M
M
Protection
Diagnostics
Monitoring
nFAULT
nFAULT
Shunt Amplifiers
Sense
Sense
Shunt Amplifiers
3
Phase
Comparators
Shunt Amplifiers
3
3(P) + 2(N)
2(P) + 2(N)
Phase
Comparators
Shunt Amplifiers
3
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSEE5
DRV3245E-Q1
ZHCSJL0 –APRIL 2019
www.ti.com.cn
4 器件和文档支持
4.1 器件支持
4.1.1 器件命名规则
图 1 显示了 DRV3245E-Q1 器件的完整可订购器件名称的解读图例
DRV32 (45) (A) (Q) (PHP) (R) (Q1)
Prefix
DRV32: Three Phase Gate Driver
AEC-Q100
Q1: Automotive qualification
Blank: Non-automotive
Series
45: 4.5 œ 45 V device
Tape and Reel
R: 3000 pieces/reel
T: 250 pieces/reel
Current-shunt amplifiers
A: 3x current-shunt amplifiers
B: 2x current-shunt amplifiers
Package
PHP: 48-pin QFP
Temperature Range
Q: œ40°C to 125°C
E: œ40°C to 150°C
图 1. 器件命名规则
4.2 文档支持
相关文档请参见以下部分：
•
•
•
•
德州仪器 (TI)，《PowerPAD™ 热增强型封装》应用报告
德州仪器 (TI)，《PowerPAD™ 速成》应用报告
德州仪器 (TI)，《使用 MSP430 的传感器式三相 BLDC 电机控制》应用报告
德州仪器 (TI)，《了解 TI 电机栅极驱动器中的 IDRIVE 和 TDRIVE》应用报告
4.3 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
4.4 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
4.5 商标
SafeTI, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
4.6 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
2
版权 © 2019, Texas Instruments Incorporated
DRV3245E-Q1
www.ti.com.cn
ZHCSJL0 –APRIL 2019
4.7 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
5 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此产品说明书的浏览器版本，请查阅左侧的导航栏。
版权 © 2019, Texas Instruments Incorporated
3
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DRV3245AEPHPRQ1
DRV3245BEPHPRQ1
ACTIVE
ACTIVE
HTQFP
HTQFP
PHP
PHP
48
48
1000 RoHS & Green
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 150
-40 to 150
D3245AE
D3245BE
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Feb-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV3245AEPHPRQ1
DRV3245BEPHPRQ1
HTQFP
HTQFP
PHP
PHP
48
48
1000
1000
330.0
330.0
16.4
16.4
9.6
9.6
9.6
9.6
1.5
1.5
12.0
12.0
16.0
16.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Feb-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DRV3245AEPHPRQ1
DRV3245BEPHPRQ1
HTQFP
HTQFP
PHP
PHP
48
48
1000
1000
350.0
350.0
350.0
350.0
43.0
43.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PHP 48
7 x 7, 0.5 mm pitch
TQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226443/A
www.ti.com
PACKAGE OUTLINE
PHP0048G
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
7.2
6.8
B
NOTE 3
37
48
PIN 1 ID
1
36
7.2
6.8
9.2
TYP
8.8
NOTE 3
12
25
13
24
A
0.27
48X
44X 0.5
0.17
0.08
C A B
4X 5.5
1.2 MAX
C
SEATING PLANE
SEE DETAIL A
0.08
(0.13)
TYP
13
24
12
25
0.25
(1)
GAGE PLANE
5.17
3.89
49
0.75
0.45
0.15
0.05
0 -7
A
16
36
DETAIL A
TYPICAL
1
48
37
5.17
3.89
4X (0.109) NOTE 5
4225861/A 4/2020
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MS-026.
5. Feature may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
PHP0048G
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(
6.5)
NOTE 10
(5.17)
SYMM
48
37
SOLDER MASK
DEFINED PAD
48X (1.6)
1
36
48X (0.3)
SYMM
49
(5.17)
(1.1 TYP)
(8.5)
44X (0.5)
12
25
(R0.05) TYP
(
0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
13
24
(1.1 TYP)
SEE DETAILS
(8.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4225861/A 4/2020
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
PHP0048G
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(5.17)
BASED ON
0.125 THICK STENCIL
SEE TABLE FOR
SYMM
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
48
37
48X (1.6)
1
36
48X (0.3)
(8.5)
(5.17)
SYMM
49
BASED ON
0.125 THICK
STENCIL
44X (0.5)
12
25
(R0.05) TYP
METAL COVERED
BY SOLDER MASK
24
13
(8.5)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
5.78 X 5.78
5.17 X 5.17 (SHOWN)
4.72 X 4.72
0.125
0.150
0.175
4.37 X 4.37
4225861/A 4/2020
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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