DRV3245SQPHPRQ1 [TI]
具有精确电流感应和增强保护功能的汽车 1 级 12V 电池三相栅极驱动器单元 | PHP | 48 | -40 to 150;
| 型号： | DRV3245SQPHPRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有精确电流感应和增强保护功能的汽车 1 级 12V 电池三相栅极驱动器单元 | PHP | 48 | -40 to 150 电池 栅极驱动 驱动器 |
| 文件： | 总19页 (文件大小：1329K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DRV3245Q-Q1
ZHCSI80C –NOVEMBER 2017 –REVISED MAY 2023
DRV3245Q-Q1 具有高性能检测、保护和诊断功能的三相汽车栅极驱动器单元
(GDU)
1 特性
2 应用
• 符合面向汽车应用的AEC-Q100 标准：
• 12V 汽车电机控制应用
– 器件温度等级1：
–40°C 至+125°C，TA
• SafeTI™ 半导体组件
– 电动助力转向（EPS、EHPS）
– 电气制动和制动辅助
– 变速器和泵
– 根据ISO 26262 标准的相应要求开发
• 4.5V 至45V 工作电压范围
• 可编程峰值栅极驱动电流高达1A
• 支持100% 占空比的电荷泵栅极驱动器
• 分流放大器和相位比较器
3 说明
DRV3245Q-Q1 器件是一款适用于三相电机驱动应用
的 FET 栅极驱动器 IC，并根据 ISO 26262 针对功能
安全应用的相关要求进行设计。该器件具有三个半桥驱
动器，每个驱动器都能够驱动高侧和低侧 N 沟道
MOSFET，同时还具有先进的 FET 保护和监控功能。
电荷泵驱动器可在冷启动运行期间实现 100% 占空比
并支持低电池电压。凭借所集成的电流检测放大器、相
位比较器和基于 SPI 的配置以及外设，该系列驱动器
省去了大多数外部和无源器件，从而减少了所需物料并
减小了印刷电路板(PCB) 空间。
– A/C 器件：3 个分流放大器(1) 和三相比较器，具
有状态，通过SPI 1
– B 器件：2 个分流放大器和三相比较器，具有实
时监控器，通过数字引脚
– S 器件：3 个分流放大器
• 高达20kHz 的3 PWM 或6 PWM 输入控制
• 能够进行单PWM 模式换向
• 支持3.3V 和5V 数字接口
• 串行外设接口(SPI)
• 耐热增强型48 引脚HTQFP 封装
• 保护特性：
DRV3245Q-Q1 器件还为内部时钟集成了诊断和保护
功能，并可提供常用系统诊断检查支持，二者皆可进行
实例化并通过 SPI 进行报告。这种集成功能的灵活性
使该器件能够无缝集成到各种安全架构中。
– 内部稳压器、电池电压监控器
– SPI CRC
– 时钟监控器
封装信息
器件型号(1)
封装尺寸（标称值）
封装
PHP（HTQFP，
48）
DRV3245Q-Q1
7.00mm x 7.00mm
– 模拟内置自检
– 可编程的死区时间控制
– MOSFET 击穿保护
– MOSFET VDS 过流监视器
– 栅源电压实时监控器
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
– 过热警告和关断
4.5 to 45 V
4.5 to 45 V
Shutdown
Shutdown
A Device
C Device
B Device
2
2
PWM
3-Phase Gate
Driver
PWM
Gate Drive
Gate Drive
3-Phase Gate
6
SPI
6
Driver
6(Gate)
+6(Source)
6(Gate)
+6(Source)
SPI
Protection
Diagnostics
Monitoring
4
4
M
M
Protection
Diagnostics
Monitoring
nFAULT
nFAULT
Shunt Amplifiers
Sense
Sense
Shunt Amplifiers
3
Phase
Comparators
Shunt Amplifiers
3
3(P) + 2(N)
2(P) + 2(N)
Phase
Comparators
Shunt Amplifiers
3
简化版原理图
1
C 器件：低温漂精密放大器
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSEE3
DRV3245Q-Q1
ZHCSI80C –NOVEMBER 2017 –REVISED MAY 2023
www.ti.com.cn
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 Device Support........................................................... 3
5.2 Documentation Support.............................................. 3
5.3 接收文档更新通知....................................................... 3
5.4 支持资源......................................................................3
5.5 Trademarks.................................................................3
5.6 静电放电警告.............................................................. 3
5.7 术语表......................................................................... 4
7 Mechanical, Packaging, and Orderable Information....4
7.1 Package Option Addendum........................................5
7.2 Tape and Reel Information..........................................6
7.3 Mechanical Data......................................................... 8
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision B (October 2019) to Revision C (May 2023)
Page
• 添加了 DRV3245S 器件......................................................................................................................................1
• 将提到 SPI 的旧术语的所有实例更改为控制器和外设........................................................................................1
Changes from Revision A (May 2018) to Revision B (October 2019)
Page
• 添加了 DRV3245C 器件..................................................................................................................................... 1
Changes from Revision * (November 2017) to Revision A (May 2018)
Page
• 将器件状态从预告信息 更改为量产数据 ............................................................................................................ 1
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLVSEE3
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5 Device and Documentation Support
5.1 Device Support
5.1.1 Device Nomenclature
图5-1 shows a legend for reading the complete orderable device name for the DRV3245Q-Q1 device
DRV32 (45) (A) (Q) (PHP) (R) (Q1)
Prefix
AEC-Q100
DRV32: Three Phase Gate Driver
Q1: Automotive qualification
Blank: Non-automotive
Series
Tape and Reel
45: 4.5 –
V device
R: 3000 pieces/reel
T: 250 pieces/reel
Current-shunt amplifiers
A: 3x current-shunt amplifiers
B: 2x current-shunt amplifiers
C: 3x high-precision current-
shunt amplifiers
Package
PHP: 48-pin QFP
Temperature Range
Q: –40°C to 125°C
E: –40°C to 150°C
S: 3x current-shunt amplifiers
图5-1. Device Nomenclature
5.2 Documentation Support
5.2.1 Related Documentation
For related documentation, see the following:
• Texas Instruments, PowerPADTM Integrated Circuit Package Thermally Enhanced Package application report
• Texas Instruments, PowerPADTM Integrated Circuit Package Made Easy application report
• Texas Instruments, Sensored 3-Phase BLDC Motor Control Using MSP430TMMicrotocontroller application
report
• Texas Instruments, Understanding IDRIVE and TDRIVE in TI Motor Gate Drivers application report
5.3 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.4 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.5 Trademarks
SafeTI™ is a trademark of Texas Instruments.
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.6 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
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English Data Sheet: SLVSEE3
DRV3245Q-Q1
ZHCSI80C –NOVEMBER 2017 –REVISED MAY 2023
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5.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLVSEE3
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7.1 Package Option Addendum
表7-1. Packaging Information
Package
Type
Package
Drawing
Package
Qty
Lead/Ball
Orderable Device
Status (1)
Pins
Eco Plan (2)
MSL Peak Temp (3)
Op Temp (°C)
Device Marking(5) (6)
Finish(4)
DRV3245AQPHPRQ1
DRV3245BQPHPRQ1
DRV3245CQPHPRQ1
DRV3245SQPHPRQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
HTQFP
HTQFP
HTQFP
HTQFP
PHP
PHP
PHP
PHP
48
48
48
48
1000
1000
1000
1000
RoHS & Green
RoHS & Green
RoHS & Green
RoHS & Green
NIPDAU
NIPDAU
NIPDAU
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
DRV3245AQ
DRV3245BQ
DRV3245CQ
DRV3245SQ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1%
by weight in homogeneous material)
space
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(4) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
space
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by
third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable
steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain
information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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ZHCSI80C –NOVEMBER 2017 –REVISED MAY 2023
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7.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
DRV3245AQPHPRQ1
DRV3245BQPHPRQ1
DRV3245CQPHPRQ1
DRV3245SQPHPRQ1
HTQFP
HTQFP
HTQFP
HTQFP
PHP
PHP
PHP
PHP
48
48
48
48
1000
1000
1000
1000
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
9.6
9.6
9.6
9.6
9.6
9.6
9.6
9.6
1.5
1.5
1.5
1.5
12.0
12.0
12.0
12.0
16.0
16.0
16.0
16.0
Q2
Q2
Q2
Q2
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English Data Sheet: SLVSEE3
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
SPQ
1000
1000
1000
1000
Length (mm) Width (mm)
Height (mm)
43.0
DRV3245AQPHPRQ1
DRV3245BQPHPRQ1
DRV3245CQPHPRQ1
DRV3245SQPHPRQ1
HTQFP
HTQFP
HTQFP
HTQFP
PHP
PHP
PHP
PHP
48
48
48
48
350.0
350.0
350.0
350.0
350.0
350.0
350.0
350.0
43.0
43.0
43.0
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English Data Sheet: SLVSEE3
DRV3245Q-Q1
ZHCSI80C –NOVEMBER 2017 –REVISED MAY 2023
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7.3 Mechanical Data
PACKAGE OUTLINE
PowerPADTM HTQFP - 1.2 mm max height
PHP0048G
0
PLASTIC QUAD FLATPACK
7.2
6.8
B
NOTE 3
37
48
PIN 1 ID
1
36
7.2
6.8
9.2
TYP
8.8
NOTE 3
12
25
13
24
A
0.27
48X
44X 0.5
4X 5.5
0.17
0.08
C A B
1.2 MAX
C
SEATING PLANE
SEE DETAIL A
0.08
(0.13)
TYP
13
24
12
25
0.25
(1)
GAGE PLANE
5.17
3.89
49
0.75
0.45
0.15
0.05
0 -7
A
16
36
DETAIL A
TYPICAL
1
48
37
5.17
3.89
4X (0.109) NOTE 5
4225861/A 4/2020
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MS-026.
5. Feature may not be present.
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EXAMPLE BOARD LAYOUT
PowerPADTM HTQFP - 1.2 mm max height
PHP0048G
PLASTIC QUAD FLATPACK
( 6.5)
NOTE 10
(5.17)
SYMM
48
37
SOLDER MASK
DEFINED PAD
48X (1.6)
1
36
48X (0.3)
SYMM
49
(5.17)
(1.1 TYP)
(8.5)
44X (0.5)
12
25
(R0.05) TYP
(
0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
13
24
(1.1 TYP)
SEE DETAILS
(8.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4225861/A 4/2020
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.
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ZHCSI80C –NOVEMBER 2017 –REVISED MAY 2023
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EXAMPLE STENCIL DESIGN
PowerPADTM HTQFP - 1.2 mm max height
PHP0048G
PLASTIC QUAD FLATPACK
(5.17)
BASED ON
0.125 THICK STENCIL
SEE TABLE FOR
SYMM
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
48
37
48X (1.6)
1
36
48X (0.3)
(8.5)
(5.17)
SYMM
49
BASED ON
0.125 THICK
STENCIL
44X (0.5)
12
25
(R0.05) TYP
METAL COVERED
BY SOLDER MASK
24
13
(8.5)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
5.78 X 5.78
5.17 X 5.17 (SHOWN)
4.72 X 4.72
0.125
0.150
0.175
4.37 X 4.37
4225861/A 4/2020
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Jun-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DRV3245AQPHPRQ1
DRV3245BQPHPRQ1
DRV3245CQPHPRQ1
DRV3245SQPHPRQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
HTQFP
HTQFP
HTQFP
HTQFP
PHP
PHP
PHP
PHP
48
48
48
48
1000 RoHS & Green
1000 RoHS & Green
1000 RoHS & Green
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
-40 to 125
-40 to 150
DR3245AQ
Samples
Samples
Samples
Samples
NIPDAU
NIPDAU
NIPDAU
DR3245BQ
DR3245CQ
DR3245SQ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Jun-2023
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV3245AQPHPRQ1
DRV3245BQPHPRQ1
DRV3245CQPHPRQ1
DRV3245SQPHPRQ1
HTQFP
HTQFP
HTQFP
HTQFP
PHP
PHP
PHP
PHP
48
48
48
48
1000
1000
1000
1000
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
9.6
9.6
9.6
9.6
9.6
9.6
9.6
9.6
1.5
1.5
1.5
1.5
12.0
12.0
12.0
12.0
16.0
16.0
16.0
16.0
Q2
Q2
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DRV3245AQPHPRQ1
DRV3245BQPHPRQ1
DRV3245CQPHPRQ1
DRV3245SQPHPRQ1
HTQFP
HTQFP
HTQFP
HTQFP
PHP
PHP
PHP
PHP
48
48
48
48
1000
1000
1000
1000
350.0
350.0
350.0
350.0
350.0
350.0
350.0
350.0
43.0
43.0
43.0
43.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PHP 48
7 x 7, 0.5 mm pitch
TQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226443/A
www.ti.com
PACKAGE OUTLINE
PHP0048G
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
7.2
6.8
B
NOTE 3
37
48
PIN 1 ID
1
36
7.2
6.8
9.2
TYP
8.8
NOTE 3
12
25
13
24
A
0.27
48X
44X 0.5
0.17
0.08
C A B
4X 5.5
1.2 MAX
C
SEATING PLANE
SEE DETAIL A
0.08
(0.13)
TYP
13
24
12
25
0.25
(1)
GAGE PLANE
5.17
3.89
49
0.75
0.45
0.15
0.05
0 -7
A
16
36
DETAIL A
TYPICAL
1
48
37
5.17
3.89
4X (0.109) NOTE 5
4225861/A 4/2020
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MS-026.
5. Feature may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
PHP0048G
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(
6.5)
NOTE 10
(5.17)
SYMM
48
37
SOLDER MASK
DEFINED PAD
48X (1.6)
1
36
48X (0.3)
SYMM
49
(5.17)
(1.1 TYP)
(8.5)
44X (0.5)
12
25
(R0.05) TYP
(
0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
13
24
(1.1 TYP)
SEE DETAILS
(8.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4225861/A 4/2020
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
PHP0048G
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(5.17)
BASED ON
0.125 THICK STENCIL
SEE TABLE FOR
SYMM
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
48
37
48X (1.6)
1
36
48X (0.3)
(8.5)
(5.17)
SYMM
49
BASED ON
0.125 THICK
STENCIL
44X (0.5)
12
25
(R0.05) TYP
METAL COVERED
BY SOLDER MASK
24
13
(8.5)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
5.78 X 5.78
5.17 X 5.17 (SHOWN)
4.72 X 4.72
0.125
0.150
0.175
4.37 X 4.37
4225861/A 4/2020
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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