DS36C278_14 [TI]
DS36C278 Low Power Multipoint EIA-RS-485 Transceiver;
| 型号： | DS36C278_14 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DS36C278 Low Power Multipoint EIA-RS-485 Transceiver |
| 文件： | 总16页 (文件大小：870K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS36C278
www.ti.com
SNLS096C –JULY 1998–REVISED APRIL 2013
DS36C278 Low Power Multipoint EIA-RS-485 Transceiver
Check for Samples: DS36C278
1
FEATURES
DESCRIPTION
The DS36C278 is a low power differential bus/line
transceiver designed to meet the requirements of RS-
485 standard for multipoint data transmission. In
addition it is compatible with TIA/EIA-422-B.
2
•
100% RS-485 Compliant
Guaranteed RS-485 Device Interoperation
–
•
•
Low Power CMOS Design: ICC 500 μA Max
Built-In Power Up/Down Glitch-Free Circuitry
The CMOS design offers significant power savings
over its bipolar and ALS counterparts without
sacrificing ruggedness against ESD damage. The
device is ideal for use in battery powered or power
conscious applications. ICC is specified at 500 μA
maximum.
–
Permits Live Transceiver
Insertion/Displacement
•
•
PDIP and SOIC Packages Available
Industrial Temperature Range: −40°C to
+85°C
The driver and receiver outputs feature TRI-STATE
capability. The driver outputs operate over the entire
common mode range of −7V to +12V. Bus contention
or fault situations that cause excessive power
dissipation within the device are handled by a thermal
shutdown circuit, which forces the driver outputs into
the high impedance state.
•
On-Board Thermal Shutdown Circuitry
–
Prevents Damage to the Device in the Event
of Excessive Power Dissipation
•
•
•
•
•
•
Wide Common Mode Range: −7V to +12V
(1)
Receiver Open Input Fail-Safe
¼ Unit Load (DS36C278): ≥12 Nodes
½ Unit Load (DS36C278T): ≥64 Nodes
ESD (Human Body Model): ≥2 kV
Drop in Replacement for:
The receiver incorporates a fail safe circuit which
guarantees a high output state when the inputs are
(1)
left open.
The DS36C278T is fully specified over the industrial
–
LTC485, MAX485, DS75176, DS3695
temperature range (−40°C to +85°C).
(1) Non-terminated, open input only
Connection Diagram
Figure 1. 8-Pin PDIP or SOIC
Package Numbers D0008A and P0008E
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS36C278
SNLS096C –JULY 1998–REVISED APRIL 2013
www.ti.com
Pin Descriptions
Pin No. Name
Description
1
RO
Receiver Output: When RE (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥ DO*/RI* by 200 mV, RO
will be HIGH. If DO/RI ≤ DO*/RI* by 200 mV, RO will be LOW. Additionally RO will be HIGH for OPEN (Non-terminated)
Inputs.
2
3
4
RE*
DE
DI
Receiver Output Enable: When RE* is LOW the receiver output is enabled. When RE* is HIGH, the receiver output is in
TRI-STATE (OFF).
Driver Output Enable: When DE is HIGH, the driver outputs are enabled. When DE is LOW, the driver outputs are in
TRI-STATE (OFF).
Driver Input: When DE (Driver Enable) is HIGH, the driver is enabled, if DI is LOW, then DO/RI will be LOW and
DO*/RI* will be HIGH. If DI is HIGH, then DO/RI is HIGH and DO*/RI* is LOW.
5
6
7
8
GND Ground Connection.
DO/RI Driver Output/Receiver Input, 485 Bus Pin.
DO*/RI* Driver Output/Receiver Input, 485 Bus Pin.
VCC
Positive Power Supply Connection: Recommended operating range for VCC is +4.75V to +5.25V.
Table 1. Truth Table(1)
DRIVER SECTION
RE*
DE
H
DI
H
L
DO/RI
DO*/RI*
X
H
L
L
H
Z
X
H
X
L
X
Z
RECEIVER SECTION
RE*
L
DE
L
RI-RI*
≥+0.2V
≤−0.2V
X
RO
H
L
L
L
H
L
Z
(1)
L
L
OPEN
H
(1) Non-terminated, open input only
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage (VCC
Input Voltage (DE, RE*, & DI)
Common Mode (VCM
)
+12V
−0.5V to (VCC +0.5V)
)
Driver Output/Receiver Input
Input Voltage (DO/RI, DO*/RI*)
Receiver Output Voltage
±15V
±14V
−0.5V to (VCC +0.5V)
Maximum Package Power Dissipation
@ +25°C
D0008A Package 1190 mW, derate
P0008E Package 744 mW, derate
Storage Temperature Range
9.5 mW/°C above +25°C
6.0 mW/°C above +25°C
−65°C to +150°C
Lead Temperature
(Soldering 4 sec)
+260°C
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to
imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device
operation.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
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SNLS096C –JULY 1998–REVISED APRIL 2013
Recommended Operating Conditions
Min
+4.75
−7
Typ
Max
+5.25
+12
Units
Supply Voltage (VCC
)
+5.0
V
V
Bus Voltage
Operating Free-Air Temperature (TA)
DS36C278T
−40
25
25
+85
+70
°C
°C
DS36C278
0
(1) (2)
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Parameter
Test Conditions
Reference
Min
Typ
Max
Units
DIFFERENTIAL DRIVER CHARACTERISTICS
VOD1
VOD0
VOD0*
VOD2
Differential Output Voltage
Output Voltage
IO = 0 mA (No Load)
1.5
0
5.0
5.0
5.0
V
V
V
V
V
V
(422)
(485)
IO = 0 mA
Output Voltage
(Output to GND)
RL = 50Ω
0
Differential Output Voltage
(Termination Load)
Balance of VOD2
(422)
(485)
Figure 2
2.0
1.5
−0.2
2.8
2.3
0.1
RL = 27Ω
5.0
(3)
ΔVOD2
RL = 27Ω or 50Ω
+0.2
|VOD2 − V0D2*
|
(422, 485)
Figure 3
VOD3
VOC
Differential Output Voltage
(Full Load)
R1 = 54Ω, R2 = 375Ω
VTEST = −7V to +12V
1.5
2.0
5.0
V
Driver Common Mode
Output Voltage
RL = 27Ω
RL = 50Ω
(485)
(422)
0
0
3.0
3.0
V
V
Figure 2
(3)
ΔVOC
Balance of VOC
RL = 27Ω or
RL = 50Ω
−0.2
+0.2
V
|VOC − VOC*
|
(422, 485)
(485)
IOSD
Driver Output Short-Circuit
Current
VO = +12V
200
+250
mA
mA
VO = −7V
(485)
−190
−250
RECEIVER CHARACTERISTICS
VTH
Differential Input High
Threshold Voltage
VO = VOH, IO = −0.4V
−7V ≤ VCM ≤ +12V
+0.035 +0.2
−0.2 −0.035
V
V
(4)
(422, 485)
VTL
Differential Input Low
Threshold Voltage
VO = VOL, IO = 0.4 mA
−7V ≤ VCM ≤ +12V
(5)
VHST
RIN
RIN
IIN
Hysteresis
VCM = 0V
70
mV
kΩ
Input Resistance
Input Resistance
−7V ≤ VCM ≤ +12V
−7V ≤ VCM ≤ +12V
Other Input = 0V,
DE = VIL, RE* = VIL,
VCC= 4.75 to 5.25
or 0V
DS36C278T
DS36C278
VIN = +12V
VIN = −7V
VIN = +12V
VIN = −7V
VIN = +12V
VIN = −7V
VIN = +12V
VIN = −7V
24
48
0
68
68
kΩ
Line Input Current
(6)
DS36C278
DS36C278T
DS36C278
DS36C278T
0.19
−0.1
0.19
−0.1
0.19
−0.1
0.19
−0.1
0.25
−0.2
0.5
mA
mA
mA
mA
mA
mA
mA
mA
mV
0
0
0
−0.4
0.25
−0.2
0.5
IING
Line Input Current Glitch
(6)
Other Input = 0V,
DE = VIL, RE* = VIL,
VCC = +3.0V or 0V,
TA = 25°C
0
0
0
0
−0.4
±400
(7)
IB
Input Balance Test
RS = 500Ω
(422)
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except VOD1 and VOD2
.
(2) All typicals are given for: VCC = +5.0V, TA = + 25°C.
(3) Delta |VOD2| and Delta |VOC| are changes in magnitude of VOD2 and VOC, respectively, that occur when input changes state.
(4) Threshold parameter limits specified as an algebraic value rather than by magnitude.
(5) Hysteresis defined as VHST = VTH − VTL
.
(6) IIN includes the receiver input current and driver TRI-STATE leakage current.
(7) For complete details of test, see RS-485.
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Electrical Characteristics (1) (2) (continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Parameter
Test Conditions
IOH = −4 mA, VID = +0.2V
IOL = +4 mA, VID = −0.2V
VO = GND
Reference
Min
Typ
4.6
0.3
35
Max
Units
V
VOH
VOL
IOSR
IOZR
High Level Output Voltage
Low Level Output Voltage
Short Circuit Current
3.5
RO
Figure 12
0.5
85
±1
V
7
mA
μA
RO
TRI-STATE Leakage Current
VO = 0.4V to 2.4V
DEVICE CHARACTERISTICS
VIH
VIL
IIH
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
2.0
VCC
0.8
2
V
GND
V
DE,
RE*,
DI
VIH = VCC
VCC = 5V
μA
μA
μA
μA
μA
μA
μA
IIL
−2
VIL = 0V
VCC = +3.0V
−2
ICC
Power Supply Current
(No Load)
Driver and Receiver ON
Driver OFF, Receiver ON
Driver ON, Receiver OFF
Driver and Receiver OFF
200
200
200
200
500
500
500
500
ICCR
ICCD
ICCZ
VCC
Switching Characteristics(1)(2)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Parameter
Test Conditions
Reference
Min
Typ
Max
Units
DRIVER CHARACTERISTICS
tPHLD
tPLHD
tSKD
Differential Propagation
Delay High to Low
RL = 54Ω, CL = 100 pF
10
10
0
39
40
1
80
80
10
ns
ns
ns
Differential Propagation
Delay Low to High
Figure 7
Differential Skew
|tPHLD − tPLHD
Rise Time
Fall Time
|
tr
3
25
25
80
80
50
65
50
ns
ns
ns
ns
ns
ns
tf
3
50
tPHZ
tPLZ
tPZH
tPZL
Disable Time High to Z
Disable Time Low to Z
Enable Time Z to High
Enable Time Z to Low
CL = 15 pF
RE * = L
Figure 8, Figure 9
Figure 10, Figure 11
Figure 8, Figure 9
Figure 10, Figure 11
—
—
—
—
200
200
200
200
CL = 100 pF
RE * = L
RECEIVER CHARACTERISTICS
tPHL
Propagation Delay
High to Low
CL = 15 pF
30
30
210
190
400
400
ns
ns
tPLH
Propagation Delay
Low to High
Figure 13, Figure 14
tSK
Skew, |tPHL − tPLH
|
0
20
50
55
40
45
50
ns
ns
ns
ns
ns
tPLZ
tPHZ
tPZL
tPZH
Output Disable Time
CL = 15 pF
—
—
—
—
150
150
150
150
Figure 15, Figure 16,
Figure 17
Output Enable Time
(1) All typicals are given for: VCC = +5.0V, TA = + 25°C.
(2) CL includes probe and jig capacitance.
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SNLS096C –JULY 1998–REVISED APRIL 2013
PARAMETER MEASUREMENT INFORMATION
Figure 2. Driver VOD2 and VOC
Figure 3. Driver VOD3
Figure 4. Driver VOH and VOL
Vtest = −7V to +12V
Figure 5. Driver IOSD
Figure 6. Driver Differential Propagation Delay Test Circuit
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Figure 7. Driver Differential Propagation Delays and Differential Rise and Fall Times
Figure 8. TRI-STATE Test Circuit (tPZH , tPHZ
)
Figure 9. TRI-STATE Waveforms (tPZH, tPHZ
)
Figure 10. TRI-STATE Test Circuit (tPZL, tPLZ
)
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SNLS096C –JULY 1998–REVISED APRIL 2013
Figure 11. TRI-STATE Waveforms (tPZL, tPLZ
)
Figure 12. Receiver VOH and VOL
Figure 13. Receiver Differential Propagation Delay Test Circuit
Figure 14. Receiver Differential Propagation Delay Waveforms
Figure 15. Receiver TRI-STATE Test Circuit
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Figure 16. Receiver Enable and Disable Waveforms (tPLZ, tPZL
)
Figure 17. Receiver Enable and Disable Waveforms (tPHZ, tPZH
)
Typical Application Information
Figure 18. Typical RS-485 Bus Interface
Unit Load
A unit load for an RS-485 receiver is defined by the input current versus the input voltage curve. The gray
shaded region is the defined operating range from −7V to +12V. The top border extending from −3V at 0 mA to
+12V at +1 mA is defined as one unit load. Likewise, the bottom border extending from +5V at 0 mA to −7V at
−0.8 mA is also defined as one unit load (see Figure 19). An RS-485 driver is capable of driving up to 32 unit
loads. This allows up to 32 nodes on a single bus. Although sufficient for many applications, it is sometimes
desirable to have even more nodes. For example, an aircraft that has 32 rows with 4 seats per row would benefit
from having 128 nodes on one bus. This would allow signals to be transferred to and from each individual seat to
1 main station. Usually there is one or two less seats in the last row of the aircraft near the restrooms and food
storage area. This frees the node for the main station.
The DS36C278, the DS36C279, and the DS36C280 all have ½ unit load and ¼ unit load (UL) options available.
These devices will allow up to 64 nodes or 128 nodes guaranteed over temperature depending upon which
option is selected. The ½ UL option is available in industrial temperature and the ¼ UL is available in commercial
temperature.
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SNLS096C –JULY 1998–REVISED APRIL 2013
First, for a ½ UL device the top and bottom borders shown in Figure 19 are scaled. Both 0 mA reference points
at +5V and −3V stay the same. The other reference points are +12V at +0.5 mA for the top border and −7V at
−0.4 mA for the bottom border (see Figure 19). Second, for a ¼ UL device the top and bottom borders shown in
Figure 19 are scaled also. Again, both 0 mA reference points at +5V and −3V stay the same. The other
reference points are +12V at +0.25 mA for the top border and −7V at −0.2 mA for the bottom border (see
Figure 19).
The advantage of the ½ UL and ¼ UL devices is the increased number of nodes on one bus. In a single master
multi-slave type of application where the number of slaves exceeds 32, the DS36C278/279/280 may save in the
cost of extra devices like repeaters, extra media like cable, and/or extra components like resistors.
The DS36C279 and DS36C280 have an additional feature which offers more advantages. The DS36C279 has
an automatic sleep mode function for power conscious applications. The DS36C280 has a slew rate control for
EMI conscious applications. Refer to the sleep mode and slew rate control portion of the application information
section in the corresponding datasheet for more information on these features.
Figure 19. Input Current vs Input Voltage Operating Range
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Aug-2017
PACKAGING INFORMATION
Orderable Device
DS36C278M/NOPB
DS36C278MX/NOPB
DS36C278TM
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LIFEBUY
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
8
8
8
8
8
8
95
Green (RoHS
& no Sb/Br)
CU SN
CU SN
Call TI
CU SN
Call TI
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
DS36C
278M
LIFEBUY
LIFEBUY
LIFEBUY
LIFEBUY
NRND
D
D
D
D
D
2500
95
Green (RoHS
& no Sb/Br)
0 to 70
DS36C
278M
TBD
0 to 70
36C27
8TM
DS36C278TM/NOPB
DS36C278TMX
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
0 to 70
36C27
8TM
2500
2500
TBD
0 to 70
36C27
8TM
DS36C278TMX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
0 to 70
36C27
8TM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Aug-2017
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS36C278MX/NOPB
DS36C278TMX
SOIC
SOIC
SOIC
D
D
D
8
8
8
2500
2500
2500
330.0
330.0
330.0
12.4
12.4
12.4
6.5
6.5
6.5
5.4
5.4
5.4
2.0
2.0
2.0
8.0
8.0
8.0
12.0
12.0
12.0
Q1
Q1
Q1
DS36C278TMX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS36C278MX/NOPB
DS36C278TMX
SOIC
SOIC
SOIC
D
D
D
8
8
8
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
DS36C278TMX/NOPB
Pack Materials-Page 2
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TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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