HPA02141ERTER [TI]
AUTONOMOUS AUDIO HEADSET SWITCH;
| 型号： | HPA02141ERTER |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AUTONOMOUS AUDIO HEADSET SWITCH |
| 文件： | 总10页 (文件大小：552K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TS3A225E
www.ti.com
SCDS329 –NOVEMBER 2011
AUTONOMOUS AUDIO HEADSET SWITCH
Check for Samples: TS3A225E
1
FEATURES
APPLICATIONS
•
•
•
•
VDD Range = 2.7 V to 4.5 V
•
•
Mobile Phones/ Tablet PCs
Notebook Computers
Break Before Make Stereo Jack Switches
Ground FET Switches ( <100mΩ)
DESCRIPTION
The TS3A225E is an audio headset switch device.
The device detects the presence of an analog
microphone and switches
microphone pin between different connectors in an
audio stereo jack. The microphone connection in a
stereo connector can be swapped with the ground
connection depending on manufacturer. When the
TAS3A225E detects a certain configuration, the
device automatically connects the microphone line to
the appropriate pin. The device also reports the
presence of an analog microphone on an audio
stereo jack.
Autonomous Detection of GND and MIC
Connections
Detection Triggered by I2C or External Trigger
Pin
•
a
system analog
•
•
•
HDA Compatible MIC Present Indicator
1.8V Compatible I2C Switch Control
ESD Performance Tested Per JESD 22:
–
2000-V Human-Body Model (A114-B, Class
II)
–
500-V Charged-Device Model (C101)
•
ESD Performance (SLEEVE, RING2, TIP)
±8-kV Contact Discharge (IEC 61000-4-2)
In some systems, it is desirable to connect the stereo
jack pin to ground. The TS3A225E provides two
internal low resistance (<100mΩ) FET switches for
ground shorting.
–
TIP
R1
MIC_BIAS
RING1
TS3A225E
C1
C2
C3
SLEEVE_SENSE
MICI
MICp
S1
RING2_SENSE
MIC_REF
MICn / HP_REF
SLEEVE
RING2
VDD
SCL
TIP_SENSE
SDA
FET2
FET1
Control
Logic
I2C_ADDR_SEL
/MIC_PRESENT
DET_TRIGGER
GND
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
–40°C to 85°C
YFF- WCSP
RTE- QFN
Tape and reel
Tape and reel
TS3A225EYFFR
YP225E
ZTL
TS3A225ERTER
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
To request a full data sheet, please send an email to:
signal-switches@list.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
27-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
HPA02141EYFFR
TS3A225ERTER
TS3A225EYFFR
ACTIVE
ACTIVE
ACTIVE
DSBGA
WQFN
DSBGA
YFF
RTE
YFF
16
16
16
3000
3000
3000
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
SNAGCU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TS3A225ERTER
TS3A225EYFFR
WQFN
RTE
YFF
16
16
3000
3000
330.0
180.0
12.4
8.4
3.3
3.3
1.1
8.0
4.0
12.0
8.0
Q2
Q1
DSBGA
1.65
1.65
0.81
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TS3A225ERTER
TS3A225EYFFR
WQFN
RTE
YFF
16
16
3000
3000
367.0
210.0
367.0
185.0
35.0
35.0
DSBGA
Pack Materials-Page 2
D: Max = 1.59 mm, Min = 1.53 mm
E: Max = 1.59 mm, Min = 1.53 mm
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