INA159-EP_16 [TI]
PRECISION, GAIN OF 0.2 LEVEL TRANSLATION DIFFERENCE AMPLIFIER;型号: | INA159-EP_16 |
厂家: | TEXAS INSTRUMENTS |
描述: | PRECISION, GAIN OF 0.2 LEVEL TRANSLATION DIFFERENCE AMPLIFIER 放大器 |
文件: | 总18页 (文件大小:529K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INA159-EP
www.ti.com .......................................................................................................................................................................................... SBOS443–NOVEMBER 2008
PRECISION, GAIN OF 0.2 LEVEL
TRANSLATION DIFFERENCE AMPLIFIER
1
FEATURES
DESCRIPTION
2
•
Gain of 0.2 to Interface ±10-V Signals to
Single-Supply ADCs
The INA159 is a high slew rate, G = 1/5 difference
amplifier consisting of a precision op amp with a
precision resistor network. The gain of 1/5 makes the
INA159 useful to couple ±10-V signals to
single-supply analog-to-digital converters (ADCs),
particularly those operating on a single +5-V supply.
The on-chip resistors are laser-trimmed for accurate
gain and high common-mode rejection. Excellent
temperature coefficient of resistance (TCR) tracking
of the resistors maintains gain accuracy and
common-mode rejection over temperature. The input
common-mode voltage range extends beyond the
positive and negative supply rails. It operates on a
total of 1.8-V to 5.5-V single or split supplies. The
INA159 reference input uses two resistors for easy
mid-supply or reference biasing.
•
•
•
•
•
•
Gain Accuracy: ±0.024% (max)
Wide Bandwidth: 1.5 MHz
High Slew Rate: 15 V/µs
Low Offset Voltage: ±100 µV
Low Offset Drift: ±1.5 µV/°C
Single-Supply Operation Down to 1.8 V
APPLICATIONS
•
•
•
•
Industrial Process Controls
Instrumentation
Differential to Single-Ended Conversion
Audio Line Receivers
The difference amplifier is the foundation of many
commonly-used circuits. The INA159 provides this
circuit function without using an expensive external
precision resistor network. The INA159 is available in
an MSOP-8 surface-mount package and is specified
for operation over the extended industrial temperature
range, –55°C to 125°C.
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
•
•
•
•
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Military (–55°C/125°C)
Temperature Range(1)
•
•
•
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
(1) Additional temperature ranges are available - contact factory
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
INA159-EP
SBOS443–NOVEMBER 2008 .......................................................................................................................................................................................... www.ti.com
VREF
5V
V+
Ω
Ω
20k
100k
−
SENSE
IN
REF V+
R1
DOUT
Ω
100
+IN
ADS8325
ADC
DCLOCK
CS
C1
1000pF
−
IN
Ω
Ω
Ω
100k
40k
+IN
REF 2
REF 1
GND
VIN
40k
INA159
Figure 1. Typical Application
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
ORDERABLE PART
NUMBER(2)
PACKAGE
DESIGNATOR
TEMPERATURE
PACKAGE LEAD
TOP-SIDE MARKING
-55°C to 125°C
INA159AMDGKTEP
MSOP-8 Tape and reel
DGK
OAA
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
TOP VIEW
MSOP
INA159
1
2
3
4
REF 2
V+
REF 1
8
7
6
5
−
IN
OUT
+IN
SENSE
−
V
2
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ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
+5.5
UNIT
V
Supply voltage
Signal input terminals (−IN and +IN), voltage
Reference (REF 1 and REF2) and sense pins
±30
V
Current
Voltage
±10
mA
V
(V–) – 0.5
(V+) + 0.5
Continuous
+125
Output short circuit
Operating temperature
Storage temperature
Junction temperature
ESD rating
–55
–65
°C
°C
°C
V
+150
+150
Human-Body Model
4000
Charged-Device Model
1000
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
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ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = –55°C to +125°C.
At TA = +25°C, RL = 10 kΩ connected to VS/2, REF pin 1 connected to ground, and REF pin 2 connected to VREF = 5 V,
unless otherwise noted.
INA159
PARAMETER
OFFSET VOLTAGE(1)
Initial(1)
CONDITIONS
UNIT
MIN
TYP
±100
±20
MAX
RTO
VS = ±2.5 V, Reference and Input
Pins Grounded
VOS
±500
µV
Over Temperature
±1450
±100
µV
µV/V
µV/V
%
vs Power Supply
PSRR VS = ±0.9 V to ±2.75 V
Over Temperature
Reference Divider Accuracy(2)
PSRR VS = ±0.9 V to ±2.75 V
±200
±0.002
±0.024
±0.050
over Temperature
±0.002
%
(3)
INPUT IMPEDANCE
Differential
240
60
kΩ
kΩ
Common-Mode
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Positive
RTI
VCM
17.5
–12.5
96
V
V
Negative
Common-Mode Rejection Ratio
over Temperature
CMRR VCM = –10 V to +10 V, RS = 0 Ω
80
dB
dB
74
94
(4)
OUTPUT VOLTAGE NOISE
RTO
f = 0.1 Hz to 10 Hz
f = 10 kHz
10
30
µVPP
nV/√Hz
VREF2 = 4.096 V,
RL Connected to GND,
(VIN+) – (VIN–) = –10 V to +10 V,
VCM = 0 V
GAIN
Initial
G
0.2
V/V
%
Error
±0.005
±0.024
vs Temperature
Nonlinearity
OUTPUT
±0.035
%
±0.0002
% of FS
VREF2 = 4.096 V,
RL Connected to GND
(V+) –
0.02
Voltage, Positive
over Temperature
Voltage, Negative
(V+) – 0.1
(V+) – 0.2
V
V
V
VREF2 = 4.096 V,
RL Connected to GND
(V–) +
0.01
(V–) + 0.048
(V–) + 0.070
over Temperature
Current Limit, Continuous to Common
Capacitive Load
V
mA
pF
Ω
±60
See Typical Characteristic
110
Open-Loop Output Impedance
FREQUENCY RESPONSE
Small-Signal Bandwidth
Slew Rate
RO f = 1 MHz, IO = 0
–3 dB
1.5
15
1
MHz
V/µs
µs
SR
Settling Time, 0.01%
tS 4 V Output Step, CL = 100 pF
(1) Includes effects of amplifier input bias and offset currents.
(2) Reference divider accuracy specifies the match between the reference divider resistors using the configuration in Figure 2.
(3) Internal resistors are ratio matched but have 20% absolute value.
(4) Includes effects of amplifier input current noise and thermal noise contribution of resistor network.
4
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INA159-EP
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ELECTRICAL CHARACTERISTICS (continued)
Boldface limits apply over the specified temperature range, TA = –55°C to +125°C.
At TA = +25°C, RL = 10 kΩ connected to VS/2, REF pin 1 connected to ground, and REF pin 2 connected to VREF = 5 V,
unless otherwise noted.
INA159
PARAMETER
Overload Recovery Time
CONDITIONS
50% Overdrive
UNIT
MIN
TYP
MAX
250
ns
POWER SUPPLY
Specified Voltage Range
Operating Voltage Range
VS
+5
V
V
+1.8
+5.5
IO = 0 mA, VS = ±2.5 V, Reference
and Input Pins Grounded
Quiescent Current
IQ
1.1
1.5
mA
over Temperature
TEMPERATURE RANGE
Specified Range
2.0
mA
–55
–55
–65
+125
+125
+150
°C
°C
°C
Operating Range
Storage Range
Thermal Resistance
MSOP-8
θJA
Surface Mount
150
°C/W
+5V
V+
7
Ω
Ω
100k
100k
20k
2
3
5
6
The test is performed by
measuring the output
with the reference
applied to alternate
OUT
reference resistors, and
calculating a result such
that the amplifier offset is
cancelled in the final
measurement.
Ω
Ω
Ω
40k
40k
1
8
INA159
4
−
V
Figure 2. Test Circuit for Reference Divider Accuracy
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TYPICAL CHARACTERISTICS
At TA = +25°C, RL = 10 kΩ connected to VS/2, REF pin 1 connected to ground, and REF pin 2 connected to VREF = 5 V,
unless otherwise noted.
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
µ
_
Offset Voltage Drift ( V/ C)
µ
Offset Voltage ( V)
GAIN vs FREQUENCY
POWER−SUPPLY REJECTION RATIO vs FREQUENCY
0
10
20
30
40
50
130
120
110
100
90
80
70
60
50
40
30
20
10
−
−
−
−
−
0
−
10
10
10
100
1k
10k
100k
1M
10M
100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
COMMON−MODE REJECTION RATIO vs FREQUENCY
QUIESCENT CURRENT vs TEMPERATURE
VS = 5.5V
120
110
100
90
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
VS = 5V
80
70
60
VS = 1.8V
50
40
30
20
10
100
1k
10k
100k
1M
10M
−
50
−
25
0
25
50
75
100
125
Frequency (Hz)
_
Temperature ( C)
6
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10 kΩ connected to VS/2, REF pin 1 connected to ground, and REF pin 2 connected to VREF = 5 V,
unless otherwise noted.
SHORT−CIRCUIT CURRENT vs TEMPERATURE
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
120
100
80
60
40
20
0
3.0
2.5
2.0
1.5
1.0
0.5
0
±
= 2.75V
VS
−
_
C
±
= 2.5V
TA
=
40
VS
_
TA = +25
C
−
_
40 C
TA
=
TA
=
+125_C
_
TA = +125
C
±
= 0.9V
VS
−
−
−
−
−
−
0.5
1.0
1.5
2.0
2.5
3.0
−
−
−
−
20
40
60
80
±
= 2.5V
VS
±
VS
VS
=
0.9V
2.5V
±
=
±
VS
25
=
2.75V
−
100
−
50
−
0
25
0
50
75
100
125
10
20
30
40
50
60
70
80
90
_
Temperature ( C)
Output Current (mA)
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
OUTPUT VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
1000
100
10
0.01
0.25VPP
Ω
Ω
2k
4VPP
600
0.001
10
1
100
1k
10k
100k
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
0.1Hz TO 10Hz NOISE
SMALL−SIGNAL OVERSHOOT vs LOAD CAPACITANCE
60
50
40
30
20
10
0
VS = 5V
100
Time (1s/div)
1000
Load Capacitance (pF)
3000
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10 kΩ connected to VS/2, REF pin 1 connected to ground, and REF pin 2 connected to VREF = 5 V,
unless otherwise noted.
SMALL−SIGNAL STEP RESPONSE
LARGE−SIGNAL STEP RESPONSE
Time (500ns/div)
Time (500ns/div)
SETTLING TIME
VOUT = 4V Step
CL = 100pF
Time (250ns/div)
8
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INA159-EP
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APPLICATION INFORMATION
(
)
[(
)
(
)]
VCM) + V) ) 5 V) * 0.5VREF
(3)
(4)
The internal op amp of the INA159 has a rail-to-rail
common-mode voltage capability at its inputs. A
rail-to-rail op amp allows the use of ±10-V inputs into
a circuit biased to 1/2 of a 5-V reference (2.5-V
quiescent output). The inputs to the op amp will swing
from approximately 400 mV to 3.75 V in this
application.
(
)
[(
)
(
)]
VCM* + V* * 5 0.5VREF * V*
Some typical values are shown in Table 1.
Table 1. Common-Mode Range For Various
Supply and Reference Voltages
REF 1 and REF 2 Connected Together
The unique input topology of the INA159 eliminates
the input offset transition region typical of most
V+
5
V−
0
VREF
3
VCM+
15
VCM−
–15
rail-to-rail
complementary
stage
operational
amplifiers. This allows the INA159 to provide superior
glitch- and transition-free performance over the entire
common-mode range.
5
0
2.5
1.25
17.5
23.75
–12.5
–6.25
5
0
1/2 Reference Connection
Good layout practice includes the use of a 0.1-µF
bypass capacitor placed closely across the supply
pins.
V+
5
V−
0
VREF
5
VCM+
17.5
VCM−
–12.5
–10.24
–6.25
–8.25
–6.25
–3.125
5
0
4.096
2.5
19.76
23.75
11.55
13.55
16.675
5
0
COMMON-MODE RANGE
3.3
3.3
3.3
0
3.3
The common-mode range of the INA159 is a function
of supply voltage and reference. Where both pins,
REF1 and REF2, are connected together:
0
2.5
0
1.25
(
)
[( ]
)
VCM) + V) ) 5 V) * VREF
(1)
(2)
(
)
[
(
)]
VCM* + V* * 5 VREF * V*
Where one REF pin is connected to the reference,
and the other pin grounded (1/2 reference
connection):
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Input and Output Relationships for Various Reference and Connection Combinations
VREF
(V)
VOUT for VIN = 0
(V)
LINEAR VIN RANGE
(V)
USEFUL VOUT SWING
(V)
REF CONNECTION
5V
V+
+10
0
–10
4.5
(±2V swing)
0.5
5
2.5
2.048
1.65
1.25
100kΩ
20kΩ
SENSE
−IN
10
0
–10
4.048
(±2V swing)
0.048
4.096
3.3
+10
0
–7.885
3.65
(–1.577V, +2V swing)
0.048
OUT
VREF
+10 (also +5)
0
–6 (also –5)
3.25
(–1.2V, +2V swing)
0.048
100kΩ
40kΩ
40kΩ
+IN
REF 2
REF 1
VIN
2.5
+10
0
–4.26
2.9
(–0.852V, +2V swing)
0.048
INA159
1.8
0.9
5V
V+
+10
0
–10
4.5
(=2V swing)
0.5
2.5
1.8
2.5
1.8
Ω
Ω
100k
20k
−
SENSE
IN
+10
0
–8.76
3.8
(–1.752V, +2V swing)
0.048
OUT
VREF
Ω
Ω
Ω
100k
40k
40k
+10
0
–5.76
3.2
(–1.15V, +2V swing)
0.048
+IN
REF 2
REF 1
VIN
1.2
1.2
INA159
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VREF
5V
V+
Ω
100k
Ω
20k
−
SENSE
IN
REF V+
R1
DOUT
Ω
100
+IN
ADS8325
ADC
DCLOCK
CS
C1
1000pF
−
IN
Ω
100k
Ω
Ω
40k
40k
+IN
REF 2
REF 1
GND
VIN
INA159
Figure 3. Typical Application Circuit Interfacing to Medium-Speed, Single-Supply ADCs
VREF
5V
V+
Ω
100k
Ω
20k
−
SENSE
IN
REF V+
R1
DOUT
Ω
100
ADS8361 or
ADS7861
ADC
+IN
DCLOCK
CS
C1
1000pF
−
IN
Ω
100k
Ω
Ω
40k
40k
+IN
REF 2
REF 1
GND
VIN
INA159
Figure 4. Typical Application Circuit Interfacing to Medium-Speed, Single-Supply ADCs with
Pseudo-Differential Inputs (such as the ADS7861 and ADS8361)
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VREF
5V
V+
Ω
Ω
Ω
100k
100k
20k
−
IN
SENSE
REF V+
ADC
R1
Ω
100
+IN
−
IN
C1
1000pF
Ω
Ω
40k
40k
+IN
REF 2
REF 1
VIN
GND
INA159
a) Unipolar, Noninverting, G = 0.2
VREF
5V
V+
Ω
Ω
Ω
100k
20k
−
IN
SENSE
REF V+
ADC
R1
Ω
100
+IN
−
IN
C1
1000pF
Ω
Ω
100k
40k
40k
+IN
REF 2
REF 1
VIN
GND
INA159
b) Bipolar, Noninverting, G = 0.2
VREF
5V
V+
Ω
Ω
Ω
100k
20k
−
SENSE
IN
REF V+
ADC
R1
Ω
100
+IN
−
IN
C1
1000pF
Ω
Ω
100k
40k
40k
+IN
REF 2
REF 1
GND
INA159
VIN
c) Unipolar, Unity Gain
Figure 5. Basic INA159 Configurations
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5V
V+
Ω
Ω
100k
20k
−
SENSE A
OUT A
IN A
VIN−
Ω
100
1000pF
Ω
Ω
Ω
100k
40k
40k
+IN A
REF 2A
REF 1A
VIN+
INA159
VREF
V+
Ω
Ω
100k
20k
REF V+
−
IN B
SENSE B
OUT B
+IN
5V
ADC
Ω
100
−
IN
1000pF
GND
Ω
Ω
Ω
100k
40k
40k
+IN B
REF 2B
REF 1B
INA159
Figure 6. Differential ADC Drive
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2008
PACKAGING INFORMATION
Orderable Device
INA159AMDGKTEP
V62/09613-01XE
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
MSOP
DGK
8
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MSOP
DGK
8
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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OTHER QUALIFIED VERSIONS OF INA159-EP :
Catalog: INA159
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Dec-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
INA159AMDGKTEP
MSOP
DGK
8
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Dec-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
MSOP DGK
SPQ
Length (mm) Width (mm) Height (mm)
190.5 212.7 31.8
INA159AMDGKTEP
8
250
Pack Materials-Page 2
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