LM118_07 概述
FAST GENERAL-PURPOSE OPERATIONAL AMPLIFIERS FAST通用运算放大器
LM118_07 数据手册
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PDF下载ꢀ ꢁꢂꢂ ꢃ ꢄ ꢀ ꢁꢅ ꢂ ꢃꢄ ꢀꢁ ꢆ ꢂꢃ
ꢇꢈꢉꢊ ꢋ ꢌꢍꢌ ꢎꢈꢀ ꢏꢐꢑꢎꢐ ꢒ ꢉꢌ ꢒ ꢐꢌꢎ ꢈꢊ ꢓꢒ ꢍꢈꢀ ꢈꢁ ꢐ ꢀꢓ ꢇꢓ ꢌꢎ ꢉ
The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
LM118 . . . JG PACKAGE
LM218 . . . D OR P PACKAGE
LM318 . . . D, P, OR PS PACKAGE
(TOP VIEW)
D
D
D
D
D
D
D
Small Signal Bandwidth . . . 15 MHz Typ
Slew Rate . . . 50 V/µs Min
Bias Current . . . 250 nA Max (LM118,
LM218)
BAL/COMP1
COMP2
1
2
3
4
8
7
6
5
Supply Voltage Range . . . ±5 V to ±20 V
Internal Frequency Compensation
Input and Output Overload Protection
Same Pin Assignments as
IN–
IN+
V
CC+
OUT
BAL/COMP3
V
CC–
General-Purpose Operational Amplifiers
LM118 . . . FK PACKAGE
(TOP VIEW)
description/ordering information
The LM118, LM218, and LM318 are precision,
fast operational amplifiers designed for
applications requiring wide bandwidth and high
slew rate. They feature a factor-of-ten increase in
speed over general-purpose devices without
sacrificing dc performance.
3
2
1
20 19
18
NC
V
NC
IN–
NC
IN+
NC
4
5
6
7
8
17
16
15
14
CC+
These operational amplifiers have internal
unity-gain frequency compensation. This
considerably simplifies their application because
no external components are necessary for
operation. However, unlike most internally
compensated amplifiers, external frequency
compensation may be added for optimum
NC
OUT
NC
9 10 11 12 13
performance.
For
inverting
applications,
feed-forward compensation boosts the slew rate
to over 150 V/µs and almost double the
bandwidth. Overcompensation can be used with
the amplifier for greater stability when maximum
bandwidth is not needed. Further, a single
capacitor can be added to reduce the settling time
for 0.1% error band to under 1 µs.
NC – No internal connection
The high speed and fast settling time of these operational amplifiers make them useful in A/D converters,
oscillators, active filters, sample-and-hold circuits, and general-purpose amplifiers.
ORDERING INFORMATION
V
max
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
IO
†
T
A
PACKAGE
AT 25°C
PDIP (P)
Tube of 50
Tube of 75
Reel of 2500
Reel of 2000
LM318P
LM318P
LM318D
0°C to 70°C
10 mV
SOIC (D)
SOP (PS)
LM318
LM18
LM318DR
LM318PSR
†
Package drawings, standard packing quantities, thermal data, symboliztion, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2002, Texas Instruments Incorporated
ꢒ ꢗ ꢢ ꢚ ꢙꢥ ꢠꢟ ꢝꢞ ꢟꢙ ꢛꢢ ꢤꢖ ꢜꢗ ꢝ ꢝꢙ ꢁꢓ ꢀꢏ ꢐꢎ ꢇ ꢏꢆꢃꢬ ꢆꢬꢄ ꢜꢤꢤ ꢢꢜ ꢚ ꢜ ꢛꢡ ꢝꢡꢚ ꢞ ꢜ ꢚ ꢡ ꢝꢡ ꢞꢝꢡ ꢥ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢂ ꢃꢄ ꢀ ꢁꢅ ꢂ ꢃ ꢄ ꢀꢁ ꢆ ꢂꢃ
ꢇꢈꢉ ꢊ ꢋꢌꢍ ꢌꢎ ꢈ ꢀ ꢏꢐ ꢑꢎꢐ ꢒꢉ ꢌ ꢒ ꢐꢌ ꢎꢈꢊꢓ ꢒ ꢍꢈꢀ ꢈꢁ ꢐꢀ ꢓꢇ ꢓꢌ ꢎꢉ
The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
symbol
1
8
5
BAL/COMP1
COMP2
BAL/COMP3
3
2
IN+
+
6
OUT
–
IN–
Pin numbers shown are for the D, JG, P, and PS packages.
schematic
BAL/COMP3
COMP2
BAL/COMP1
V
CC+
2 kΩ
150 kΩ
2 kΩ
5 kΩ
5 kΩ
100 pF
20 kΩ
20 kΩ
13 Ω
25 Ω
OUT
33 Ω
3.5 kΩ
6 pF
IN–
1 kΩ
1 kΩ
28 pF
5 kΩ
50 Ω
1.7 kΩ
4 kΩ
IN+
30 Ω
500 Ω
1.2 kΩ
1.2 kΩ
30 Ω
5.6 kΩ
20 kΩ
110 Ω
V
CC–
Component values shown are nominal.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢂ ꢃ ꢄ ꢀ ꢁꢅ ꢂ ꢃꢄ ꢀꢁ ꢆ ꢂꢃ
ꢇꢈꢉꢊ ꢋ ꢌꢍꢌ ꢎꢈꢀ ꢏꢐꢑꢎꢐ ꢒ ꢉꢌ ꢒ ꢐꢌꢎ ꢈꢊ ꢓꢒ ꢍꢈꢀ ꢈꢁ ꢐ ꢀꢓ ꢇꢓ ꢌꢎ ꢉ
The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage: V
V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 V
CC+
CC–
Input voltage, V (either input, see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V
I
Differential input current, V (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 V
ID
Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Package thermal impedance, θ (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
JA
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
Package thermal impedance, θ (see Notes 7 and 8):FK package . . . . . . . . . . . . . . . . . . . . . . . . . 5.61°C/W
JC
JG package . . . . . . . . . . . . . . . . . . . . . . . . . 14.5°C/W
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: JG package . . . . . . . . . . . . . . . . . . . . 300°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, P, PS, or PW package . . . . . . . . 260°C
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between V
and V .
CC+
CC–
2. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
3. The inputs are shunted with two opposite-facing base-emitter diodes for overvoltage protection. Therefore, excessive current flows
if a different input voltage in excess of approximately 1 V is applied between the inputs unless some limiting resistance is used.
4. The output can be shorted to ground or either power supply. For the LM118 and LM218 only, the unlimited duration of the short circuit
applies at (or below) 85°C case temperature or 75°C free-air temperature.
5. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperautre is P = (T (max) – T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JC
C
ambient temperautre is P = (T (max) – T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
C
JC
J
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢂ ꢃꢄ ꢀ ꢁꢅ ꢂ ꢃ ꢄ ꢀꢁ ꢆ ꢂꢃ
ꢇꢈꢉ ꢊ ꢋꢌꢍ ꢌꢎ ꢈ ꢀ ꢏꢐ ꢑꢎꢐ ꢒꢉ ꢌ ꢒ ꢐꢌ ꢎꢈꢊꢓ ꢒ ꢍꢈꢀ ꢈꢁ ꢐꢀ ꢓꢇ ꢓꢌ ꢎꢉ
The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
electrical characteristics at specified free-air temperature (see Note 5)
LM118, LM218
TEST
LM318
TYP
4
‡
PARAMETER
Input offset voltage
Input offset current
T
A
UNIT
mV
†
CONDITIONS
MIN
TYP
MAX
MIN
MAX
10
25°C
Full range
25°C
2
4
V
IO
V
V
V
= 0
= 0
= 0
O
O
O
6
15
6
50
30
200
300
500
750
I
IO
nA
Full range
25°C
100
250
500
120
150
I
IB
Input bias current
nA
V
Full range
V
Common-mode input voltage range
V
V
= ±15 V
= ±15 V,
Full range ±11.5
±11.5
±12
ICR
OM
CC±
Maximum peak output voltage
swing
CC±
V
Full range
±12
±13
±13
V
R
= 2 kΩ
L
V
= ±15 V,
25°C
50
25
200
25
20
200
CC±
= ±10 V,
Large-signal differential
voltage amplification
V
O
A
VD
V/mV
Full range
R
≥ 2 kΩ
L
B
Unity-gain bandwidth
Input resistance
V
= ±15 V
25°C
25°C
15
3
15
3
MHz
MΩ
dB
1
CC±
r
1*
0.5
70
i
CMRR Common-mode rejection ratio
V
IC
= V
ICR
min
Full range
80
100
100
Supply-voltage rejection ratio
k
Full range
70
80
5
65
80
5
dB
SVR
(∆V /∆V
CC IO
)
I
Supply current
V
O
= 0, No load
25°C
8
10
mA
CC
* On products compliant to MIL-STD-883, Class B, this parameter is not production tested.
†
‡
All characteristics are measured under open-loop conditions with common-mode input voltage, unless otherwise specified.
Full range for LM118 is –55°C to 125°C, full range for LM218 is –25°C to 85°C, and full range for LM318 is 0°C to 70°C.
NOTE 9: Unless otherwise noted, V
= ±5 V to ±20 V. All typical values are at V = ±15 V and T = 25°C.
CC± A
CC
operating characteristics, V
= ±15 V, T = 25°C
A
CC±
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SR
Slew rate at unity gain
∆V = 10 V,
C
= 100 pF,
See Figure 1
50*
70
V/µs
I
L
* On products compliant to MIL-STD-883, Class B, this parameter is not production tested.
PARAMETER MEASUREMENT INFORMATION
10 V
2 kΩ
Input
0 V
2 kΩ
1 kΩ
Input
–
Output
+
10 V
0 V
90%
10%
Output
∆V
100 pF
O
DV
t
t
O
SR +
t
t
TEST CIRCUIT
VOLTAGE WAVEFORMS
Figure 1. Slew Rate
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
9-Feb-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
LCCC
CDIP
CDIP
SOIC
Drawing
JM38510/10107BPA
LM118FKB
LM118JG
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
JG
8
20
8
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
FK
JG
LM118JGB
LM318D
JG
8
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LM318DE4
LM318DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
PDIP
PDIP
SO
D
D
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LM318DRE4
LM318P
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
LM318PE4
LM318PSR
LM318PSRE4
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
PS
PS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.430 (10,92)
MAX
0.010 (0,25)
M
0.015 (0,38)
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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