LM747 [TI]
双路、44V、1.5MHz 运算放大器;
| 型号： | LM747 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 双路、44V、1.5MHz 运算放大器 放大器 运算放大器 |
| 文件： | 总10页 (文件大小：200K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM747
LM747 Dual Operational Amplifier
Literature Number: SNOS661
November 1994
LM747
Dual Operational Amplifier
General Description
Features
Y
No frequency compensation required
The LM747 is a general purpose dual operational amplifier.
The two amplifiers share a common bias network and power
supply leads. Otherwise, their operation is completely inde-
pendent.
Y
Short-circuit protection
Y
Wide common-mode and differential voltage ranges
Low power consumption
Y
Y
Y
Additional features of the LM747 are: no latch-up when in-
put common mode range is exceeded, freedom from oscilla-
tions, and package flexibility.
No latch-up
Balanced offset null
The LM747C/LM747E is identical to the LM747/LM747A
except that the LM747C/LM747E has its specifications
a
guaranteed over the temperature range from 0 C to 70 C
§
§
b
a
instead of 55 C to 125 C.
§
§
Connection Diagrams
Metal Can Package
Dual-In-Line Package
TL/H/11479–5
TL/H/11479–4
Order Number LM747CN or LM747EN
See NS Package Number N14A
Order Number LM747H
See NS Package Number H10C
*VaA and VaB are internally connected.
C
1995 National Semiconductor Corporation
TL/H/11479
RRD-B30M115/Printed in U. S. A.
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
g
Input Voltage (Note 2)
15V
Output Short-Circuit Duration
Indefinite
Operating Temperature Range
LM747/LM747A
LM747C/LM747E
Supply Voltage
LM747/LM747A
LM747C/LM747E
b
b
a
55 C to 125 C
§
§
0 C to 70 C
g
g
22V
18V
a
§
65 C to 150 C
§
§
§
a
Storage Temperature Range
§
Power Dissipation (Note 1)
Differential Input Voltage
800 mW
Lead Temperature (Soldering, 10 sec.)
300 C
g
30V
Electrical Characteristics (Note 3)
LM747A/LM747E
LM747
LM747C
Typ Max
Parameter
Conditions
Units
Min
Typ
Max
Min
Typ Max Min
e
s
s
Input Offset Voltage
T
25 C
§
A
R
R
10 kX
1.0
5.0
6.0
2.0
6.0
7.5
S
S
mV
mV
50X
0.8
3.0
4.0
s
s
R
R
50X
S
10 kX
S
Average Input Offset
Voltage Drift
15
mV/ C
§
e
e
e
g
Input Offset Voltage
Adjustment Range
T
25 C, V
§
20V
A
S
g
g
g
15
10
15
mV
nA
Input Offset Current
T
A
25 C
§
3.0
30
70
20
85
200
500
20
200
300
Average Input Offset
Current Drift
0.5
nA/ C
§
e
Input Bias Current
T
T
25 C
§
30
80
80
500
1.5
80
500
0.8
nA
A
s
s
T
T
0.210
mA
AMIN
A
AMAX
e
e
g
Input Resistance
T
25 C, V
§
20V
1.0
0.5
6.0
0.3
2.0
0.3
2.0
A
S
MX
e
g
V
T
20V
S
e
g
g
13
Input Voltage Range
25 C
§
12
A
V
g
g
g
g
13
12
13
12
t
e
e
Large Signal
Voltage Gain
T
25 C, R
§
20V, V
2 kX
A
L
e
g
g
V
15V
50
V/mV
V/mV
S
S
O
e
t
e
g
g
V
15V, V
10V
50
200
20
15
200
O
R
2 kX
L
S
S
S
S
e
e
e
e
e
g
g
g
g
g
g
V
V
V
V
20V, V
15V
10V
32
10
V/mV
V/mV
V/mV
O
O
15V, V
25
e
g
5V, V
20V
2V
O
e
t
t
Output Voltage Swing
g
R
R
10 kX
2 kX
16
15
L
V
g
L
e
t
t
g
V
15V
S
g
g
g
g
g
g
R
R
10 kX
2 kX
12
10
14
13
12
10
14
13
L
L
V
g
g
e
Output Short
T
25 C
§
10
25
35
40
25
25
A
mA
dB
Circuit Current
10
s
s
e
e
g
g
Common-Mode
Rejection Ratio
R
10 kX, V
50 kX, V
12V
12V
70
90
70
90
S
CM
R
80
95
2
S
CM
Electrical Characteristics (Note 3) (Continued)
LM747A/LM747E
LM747
Typ
LM747C
Typ
Parameter
Conditions
Units
Min
Typ
Max
Min
Max
Min
Max
e
s
s
e
g
g
Supply Voltage
V
20V to V
5V
S
S
Rejection Ratio
R
R
50X
10 kX
86
96
S
S
dB
77
96
77
96
e
Transient Response
Rise Time
T
A
25 C, Unity Gain
§
0.25
6.0
0.8
20
0.3
5
0.3
5
ms
Overshoot
%
e
e
e
Bandwidth (Note 4)
Slew Rate
T
T
T
T
25 C
§
0.437
0.3
1.5
0.7
MHz
V/ms
mA
A
A
A
A
25 C, Unity Gain
§
0.5
1.7
0.5
1.7
Supply Current/Amp
Power Consumption/Amp
25 C
§
2.5
2.8
85
2.8
85
e
e
e
25 C
§
g
g
V
V
20V
15V
80
150
S
mW
50
50
S
e
e
e
g
LM747A
LM747E
LM747
V
20V
S
A
A
T
T
T
T
165
135
AMIN
mW
mW
AMAX
e
e
e
g
V
20V
150
150
150
S
A
A
T
T
T
T
AMIN
AMAX
e
e
e
g
V
15V
S
A
A
T
T
T
T
60
45
100
75
AMIN
mW
AMAX
Note 1: The maximum junction temperature of the LM747C/LM747E is 100 C. For operating at elevated temperatures, devies in the TO-5 package must be
§
derated based on a thermal resistance of 150 C/W, junction to ambient, or 45 C/W, junction to case. The thermal resistance of the dual-in-line package is 100 C/
§
§
§
W, junction to ambient.
g
Note 2: For supply voltages less than 15V, the absolute maximum input voltage is equal to the supply voltage.
s
s
s
b
s
s
s
s
T
A
b
g
Note 3: These specifications apply for 5V
specified. The LM747 and LM747C are specified for V
g
20V and 55 C
V
T
125 C for the LM747A and 0 C
§
A
70 C for the LM747E unless otherwise
§
§
15V and 55 C
§
S
A
s
s
s
e
g
T
125 C and 0 C
§
T
A
70 C, respectively, unless otherwise specified.
§
§
§
S
Note 4: Calculated value from: 0.35/Rise Time (ms).
Schematic Diagram (Each Amplifier)
TL/H/11479–1
Note: Numbers in parentheses are pin numbers for amplifier B. DIP only.
3
Typical Performance Characteristics
Input Bias and Offset
Currents vs Ambient
Temperature
DC Parameters
vs Supply Voltage
Common Mode Rejection
Ratio vs Frequency
TL/H/11479–2
4
Typical Performance Characteristics (Continued)
Input Resistance and
Input Capacitance
vs Frequency
Broadband Noise for
Various Bandwidths
TL/H/11479–3
5
6
Physical Dimensions inches (millimeters)
Metal Can Package (H)
Order Number LM747H
NS Package Number H10C
7
Physical Dimensions inches (millimeters) (Continued)
Dual-In-Line Package (N)
Order Number LM747CN or LM747EN
NS Package Number N14A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Corporation
National Semiconductor
Europe
National Semiconductor
Hong Kong Ltd.
National Semiconductor
Japan Ltd.
a
1111 West Bardin Road
Arlington, TX 76017
Tel: 1(800) 272-9959
Fax: 1(800) 737-7018
Fax:
(
49) 0-180-530 85 86
@
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
Hong Kong
Tel: (852) 2737-1600
Fax: (852) 2736-9960
Tel: 81-043-299-2309
Fax: 81-043-299-2408
Email: cnjwge tevm2.nsc.com
a
a
a
a
Deutsch Tel:
English Tel:
Fran3ais Tel:
Italiano Tel:
(
(
(
(
49) 0-180-530 85 85
49) 0-180-532 78 32
49) 0-180-532 93 58
49) 0-180-534 16 80
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Medical
Security
Logic
Space, Avionics and Defense www.ti.com/space-avionics-defense
Transportation and Automotive www.ti.com/automotive
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明