MSP430F417TDE1 [TI]
具有 32KB 闪存、1KB RAM、比较器和 96 段 LCD 的 DIE 16 位超低功耗微控制器 | TD | 0;
| 型号： | MSP430F417TDE1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 32KB 闪存、1KB RAM、比较器和 96 段 LCD 的 DIE 16 位超低功耗微控制器 | TD | 0 控制器 CD 微控制器 微控制器和处理器 外围集成电路 比较器 闪存 |
| 文件： | 总6页 (文件大小：194K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MSP430F417-DIE
www.ti.com
SLAS891 –JULY 2012
MIXED SIGNAL MICROCONTROLLER
1
FEATURES
•
•
•
•
•
•
•
Low Supply-Voltage Range, 1.8 V to 3.6 V
•
•
•
•
Integrated LCD Driver for 96 Segments
Ultralow Power Consumption
Five Power-Saving Modes
Wake-Up From Standby Mode
Frequency-Locked Loop (FLL+)
16-Bit RISC Architecture
On-Chip Comparator
Brownout Detector
Supply Voltage Supervisor/Monitor −
Programmable Level Detection
•
•
Serial Onboard Programming, No External
Programming Voltage Needed, Programmable
Code Protection by Security Fuse
16-Bit Timer_A With Three or Five
Capture/Compare Registers
Bootstrap Loader in Flash Devices
DESCRIPTION
The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low power
modes, is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 6 μs.
The MSP430F417 is a microcontroller configuration with one or two built-in 16-bit timers, a comparator, 96 LCD
segment drive capability, and 48 I/O pins.
Typical applications include sensor systems that capture analog signals, convert them to digital values, and
process the data and transmit them to a host system. The comparator and timer make the configurations ideal
for industrial meters, counter applications and handheld meters.
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
MSP430F417TDE1
MSP430F417TDE2
100
10
MSP430F417
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MSP430F417-DIE
SLAS891 –JULY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
11 mils.
Silicon with backgrind
Floating
AlCu/TiN
800 nm
2
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
MSP430F417-DIE
www.ti.com
SLAS891 –JULY 2012
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
91.95
Y MIN
2586.7
2470.75
2356.7
2241.7
2126.7
2011.7
1896.7
1483.4
1251.25
1129.05
1008.45
896.5
X MAX
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
339.05
451.5
Y MAX
2661.7
2545.75
2431.7
2316.7
2201.7
2086.7
1971.7
1558.4
1326.25
1204.05
1083.45
971.5
DVCC
1
P6.3
2
91.95
P6.4
3
91.95
P6.5
4
91.95
P6.6
5
91.95
P6.7
6
91.95
N/C
7
91.95
XIN
8
91.95
XOUT
9
91.95
AVSS2
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
91.95
N/C
91.95
P5.1/S0
91.95
P5.0/S1
91.95
787.45
674.2
862.45
749.2
P4.7/S2
91.95
P4.6/S3
91.95
559.6
634.6
P4.5/S4
91.95
440.95
91.95
515.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
166.95
338.5
P4.4/S5
264.05
376.5
P4.3/S6
91.95
P4.2/S7
905.5
91.95
980.5
P4.1/S8
1007.6
1109.7
1211.8
1313.9
1416
91.95
1082.6
1184.7
1286.8
1388.9
1491
P4.0/S9
91.95
P3.7/S10
P3.6/S11
P3.5/S12
P3.4/S13
P3.3/S14
P3.2/S15
P3.1/S16
P3.0/S17
P2.7/S18
P2.6/CAOUT/S19
P2.5/TA1CLK/S20
P2.4/TA1.4/S21
P2.3/TA1.3/S22
P2.2/TA1.2/S23
COM0
91.95
91.95
91.95
1518.1
1620.2
1722.3
1824.4
1926.5
2290.1
2392.3
2494.4
2681.55
2681.55
2681.55
2681.55
2681.55
2681.55
2681.55
2681.55
2681.55
2681.55
2681.55
2681.55
2681.55
2681.55
2681.55
91.95
1593.1
1695.2
1797.3
1899.4
2001.5
2365.1
2467.3
2569.4
2756.55
2756.55
2756.55
2756.55
2756.55
2756.55
2756.55
2756.55
2756.55
2756.55
2756.55
2756.55
2756.55
2756.55
2756.55
91.95
91.95
91.95
91.95
91.95
91.95
91.95
263.5
737.3
812.3
839.4
914.4
941.5
1016.5
1119.05
1221.15
1323.25
1425.35
1527.45
1629.55
1731.65
1833.75
1935.85
2303.25
2416.95
P5.2/COM1
P5.3/COM2
P5.4/COM3
R03
1044.05
1146.15
1248.25
1350.35
1452.45
1554.55
1656.65
1758.75
1860.85
2228.25
2341.95
P5.5/R13
P5.6/R23
P5.7/R33
P2.1/TA1.1
P2.0/TA0.2
P1.7/CA1
P1.6/CA0
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
MSP430F417-DIE
SLAS891 –JULY 2012
www.ti.com
Table 1. Bond Pad Coordinates in Microns (continued)
DESCRIPTION
P1.5/TA0CLK/ACLK
P1.4/TA1.0
P1.3/TA1.0/SVSOUT
P1.2/TA0.1
P1.1/TA0.0/MCLK
P1.0/TA0.0
TDO/TDI
PAD NUMBER
X MIN
2681.55
2456.25
2350
Y MIN
2464.1
X MAX
2756.55
2531.25
2425
Y MAX
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
2539.1
2856.15
2856.15
2856.15
2856.15
2856.15
2856.15
2841.8
2781.15
2781.15
2781.15
2781.15
2781.15
2781.15
2766.8
2245.35
2092
2320.35
2167
1991
2066
1803.2
1401.45
1209.6
1105.85
1003.75
842.45
721.45
600.45
475.95
373.75
260.9
1878.2
1476.45
1284.6
1180.85
1078.75
917.45
796.45
675.45
550.95
448.75
335.9
TDI/TCLK
TMS
2781.15
2781.15
2781.15
2781.15
2781.15
2781.15
2781.15
2781.15
2781.15
2856.15
2856.15
2856.15
2856.15
2856.15
2856.15
2856.15
2856.15
2856.15
TCK
RST/NMI
P6.0
P6.1
P6.2
AVSS1
DVSS
AVCC
4
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Copyright © 2012, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
21-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
MSP430F417TDE1
MSP430F417TDE2
ACTIVE
ACTIVE
0
0
100
10
TBD
TBD
Call TI
Call TI
N / A for Pkg Type
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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