OPA2376AIDRG4 [TI]
Low-Noise, Low Quiescent Current, Precision Operational Amplifier e-trim Series; 低噪声，低静态电流，精密运算放大器电子微调系列
| 型号： | OPA2376AIDRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Low-Noise, Low Quiescent Current, Precision Operational Amplifier e-trim Series |
| 文件： | 总30页 (文件大小：1461K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA376
OPA2376
OPA4376
www.ti.com
SBOS406F –JUNE 2007–REVISED MARCH 2013
Low-Noise, Low Quiescent Current,
Precision Operational Amplifier
e-trim™ Series
Check for Samples: OPA376, OPA2376, OPA4376
1
FEATURES
DESCRIPTION
The OPA376 family represent a new generation of
low-noise operational amplifiers with e-trim, offering
outstanding dc precision and ac performance. Rail-to-
rail input and output, low offset (25μV max), low noise
(7.5nV/√Hz), quiescent current of 950μA max, and a
5.5MHz bandwidth make this part very attractive for a
variety of precision and portable applications. In
addition, this device has a reasonably wide supply
range with excellent PSRR, making it attractive for
applications that run directly from batteries without
regulation.
23
•
LOW NOISE: 7.5nV/√Hz at 1kHz
0.1Hz TO 10Hz NOISE: 0.8μVPP
QUIESCENT CURRENT: 760μA (typ)
LOW OFFSET VOLTAGE: 5μV (typ)
GAIN BANDWIDTH PRODUCT: 5.5MHz
RAIL-TO-RAIL INPUT AND OUTPUT
SINGLE-SUPPLY OPERATION
•
•
•
•
•
•
•
•
SUPPLY VOLTAGE: 2.2V to 5.5V
SPACE-SAVING PACKAGES:
The OPA376 (single version) is available in
MicroSIZE SC70-5, SOT23-5, and SO-8 packages.
The OPA2376 (dual) is offered in the WCSP-8,
MSOP-8, and SO-8 packages. The OPA4376 (quad)
is offered in a TSSOP-14 package. All versions are
specified for operation from –40°C to +125°C.
–
SC-70, SOT23, WCSP, MSOP, TSSOP
APPLICATIONS
•
•
•
•
•
•
ADC BUFFER
AUDIO EQUIPMENT
MEDICAL INSTRUMENTATION
HANDHELD TEST EQUIPMENT
ACTIVE FILTERING
SENSOR SIGNAL CONDITIONING
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
INPUT VOLTAGE NOISE SPECTRAL DENSITY
100
10
1
1
10
100
1k
10k
100k
Frequency (Hz)
Offset Voltage (mV)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
e-trim, NanoStar, NanoFree are trademarks of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2013, Texas Instruments Incorporated
OPA376
OPA2376
OPA4376
SBOS406F –JUNE 2007–REVISED MARCH 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATING(1)
over operating free-air temperature range (unless otherwise noted)
OPA376, OPA2376, OPA4376
UNIT
V
Supply Voltage
VS = (V+) – (V–)
+7
(V–) – 0.5 to (V+) + 0.5
±10
Voltage(2)
Current(2)
V
Signal Input Terminals
mA
Output Short-Circuit(3)
Operating Temperature
Storage Temperature
Junction Temperature
Continuous
–40 to +150
–65 to +150
+150
TA
TA
TJ
°C
°C
°C
V
Human Body Model
Charged Device Model
Machine Model
4000
ESD Rating
1000
V
200
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less.
(3) Short-circuit to ground, one amplifier per package.
PACKAGE INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
BUR
SC70-5
DCK
DBV
D
OPA376
SOT23-5
BUQ
SO-8
OPA376
SO-8
D
OPA2376
OBBI
OPA2376
MSOP-8
DGK
YZD
PW
OPA2376
OPA4376
Lead- (Pb-) Free WCSP-8
TSSOP-14
OPA2376
OPA4376
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
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SBOS406F –JUNE 2007–REVISED MARCH 2013
ELECTRICAL CHARACTERISTICS: VS = +2.2V to +5.5V
Boldface limits apply over the specified temperature range: TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
OPA376, OPA2376, OPA4376
PARAMETERS
OFFSET VOLTAGE
CONDITIONS
MIN TYP MAX
UNIT
Input Offset Voltage
vs Temperature
VOS
5
0.26
0.32
5
25
1
μV
dVOS/dT
–40°C to +85°C
μV/°C
μV/°C
μV/V
μV/V
mV/V
–40°C to +125°C
2
vs Power Supply
PSRR
VS = +2.2V to +5.5V, VCM < (V+) – 1.3V
VS = +2.2V to +5.5V, VCM < (V+) – 1.3V
20
Over Temperature
5
Channel Separation, dc (dual, quad)
INPUT BIAS CURRENT
Input Bias Current
0.5
IB
0.2
10
10
pA
pA
pA
Over Temperature
See Typical Characteristics
Input Offset Current
IOS
0.2
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 1kHz
Input Current Noise, f = 1kHz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
INPUT CAPACITANCE
Differential
0.8
7.5
2
μVPP
nV/√Hz
fA/√Hz
en
in
VCM
(V–) – 0.1
76
(V+) + 0.1
V
CMRR
(V–) < VCM < (V+) – 1.3 V
90
dB
6.5
13
pF
pF
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
AOL
50mV < VO < (V+) – 50mV, RL = 10kΩ
100mV < VO < (V+) – 100mV, RL = 2kΩ
CL = 100pF, VS = 5.5V
120
120
134
126
dB
dB
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
GBW
SR
tS
5.5
2
MHz
V/μs
μs
G = +1
Settling Time 0.1%
Settling Time 0.01%
Overload Recovery Time
THD + Noise
2V Step , G = +1
2V Step , G = +1
VIN × Gain > VS
1.6
tS
2
μs
0.33
0.00027
μs
THD+N VO = 1VRMS, G = +1, f = 1kHz, RL = 10kΩ
%
OUTPUT
Voltage Output Swing from Rail
RL = 10kΩ(1)
RL = 10kΩ(2)
10
20
20
30
40
50
60
80
mV
mV
mV
mV
mV
mV
mA
Over Temperature
RL = 10kΩ
RL = 2kΩ(1)
RL = 2kΩ(2)
Voltage Output Swing from Rail
40
50
Over Temperature
Short-Circuit Current
RL = 2kΩ
ISC
CLOAD
RO
+30/–50
Capacitive Load Drive
Open-Loop Output Impedance
See Typical Characteristics
150
Ω
(1) SC70-5, SOT23-5, SO-8, MSOP-8, and TSSOP-14 packages only.
(2) Wafer chip-scale package only.
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OPA2376
OPA4376
SBOS406F –JUNE 2007–REVISED MARCH 2013
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = +2.2V to +5.5V (continued)
Boldface limits apply over the specified temperature range: TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
OPA376, OPA2376, OPA4376
PARAMETERS
POWER SUPPLY
CONDITIONS
MIN
TYP
MAX
UNIT
Specified Voltage Range
Operating Voltage Range
Quiescent Current per amplifier
Over Temperature
TEMPERATURE RANGE
Specified Range
VS
IQ
2.2
5.5
V
V
2 to 5.5
760
IO = 0, VS = +5.5V, VCM < (V+) – 1.3V
950
μA
mA
1
–40
–40
+125
+150
°C
Operating Range
°C
Thermal Resistance
SC70
θJA
°C/W
°C/W
°C/W
°C/W
°C/W
250
200
150
250
SOT23
SO-8, TSSOP-14, MSOP-8
WCSP-8
4
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OPA2376
OPA4376
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SBOS406F –JUNE 2007–REVISED MARCH 2013
PIN CONFIGURATIONS
OPA376
SOT23-5
(TOP VIEW)
OPA2376
SO-8, MSOP-8
(TOP VIEW)
OUT
V-
1
2
3
5
4
V+
OUT A
-IN A
+IN A
V-
1
2
3
4
8
7
6
5
V+
OUT B
-IN B
+IN B
+IN
-IN
OPA376
SC70-5
(TOP VIEW)
OPA2376
WCSP-8
(TOP VIEW)
+IN
V-
1
5
V+
2
3
D2
D1 V-
+IN B
-IN
4
OUT
C2
B2
A2
C1 +IN A
-IN B
2,188 mm
2,038 mm
-IN A
B1
OUT B
V+
A1 OUT A
OPA376
SO-8
(TOP VIEW)
1,15 mm
1,00 mm
NC(1)
1
2
3
4
8
7
6
5
NC(1)
(Bump Side Down)
-
-IN
+IN
V-
V+
+
OUT
NC(1)
OPA4376
TSSOP-14
(TOP VIEW)
OUT A
1
2
3
4
5
6
7
14 OUT D
-IN A
+IN A
V+
13 -IN D
12 +IN D
11 V-
+IN B
-IN B
OUT B
10 +IN C
9
8
-IN C
OUT C
NOTE: (1) NC denotes no internal connection.
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OPA4376
SBOS406F –JUNE 2007–REVISED MARCH 2013
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
POWER-SUPPLY AND COMMON-MODE
OPEN-LOOP GAIN/PHASE vs FREQUENCY
REJECTION RATIO vs FREQUENCY
120
100
80
60
40
20
0
160
140
120
100
80
0
V(+) Power-Supply Rejection Ratio
-20
-40
Gain
-60
Phase
Common-Mode
Rejection Ratio
-80
60
-100
-120
-140
-160
-180
40
V(-) Power-Supply Rejection Ratio
20
0
-20
10
100
1k
10k
100k
1M
10M
0.1
1
10
100
1k
10k
100k 1M
10M
Frequency (Hz)
Figure 2.
Frequency (Hz)
Figure 1.
OPEN-LOOP GAIN AND POWER-SUPPLY
REJECTION RATIO vs TEMPERATURE
0.1Hz to 10Hz
INPUT VOLTAGE NOISE
160
140
120
100
80
Open-Loop Gain (RL = 2kW)
Power-Supply Rejection Ratio
(VS = 2.1V to 5.5V)
1s/div
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Figure 3.
Figure 4.
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
INPUT VOLTAGE NOISE SPECTRAL DENSITY
100
10
1
1
VS = 5V, VCM = 2V, VOUT = 1VRMS
0.1
0.01
Gain = 10V/V
Gain = 1V/V
0.001
0.0001
1
10
100
1k
10k
100k
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
Figure 5.
Figure 6.
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OPA376
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OPA4376
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SBOS406F –JUNE 2007–REVISED MARCH 2013
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
COMMON-MODE REJECTION RATIO
QUIESCENT CURRENT
vs TEMPERATURE
vs TEMPERATURE
110
100
90
1000
900
800
700
600
500
80
70
60
50
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Temperature (°C)
Figure 7.
Figure 8.
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs SUPPLY VOLTAGE
SHORT-CIRCUIT CURRENT
vs TEMPERATURE
75
50
1000
900
800
700
600
500
50
40
30
20
10
0
VS = ±2.75V
ISC+
ISC+
25
0
IQ
-25
-50
-75
-100
ISC-
-50
-25
0
25
50
75
100
125
150
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Temperature (°C)
Supply Voltage (V)
Figure 9.
Figure 10.
INPUT BIAS CURRENT vs TEMPERATURE
OUTPUT VOLTAGE vs OUTPUT CURRENT
3
2
1000
900
800
700
600
500
400
300
200
100
0
VS = ±2.75
1
+150°C
+125°C
+25°C
-40°C
0
-1
-2
-3
0
10
20
30
40
50
60
70
80
-50
-25
0
25
50
75
100
125
150
Output Current (mA)
Temperature (°C)
Figure 11.
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
(–40°C to +125°C)
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
½Offset Voltage Drift½ (mV/°C)
Offset Voltage (mV)
Figure 13.
Figure 14.
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE
6
5
4
3
2
1
0
50
VS = 5.5V
VS = 5V
G = +1V/V
40
30
20
10
0
VS = 2.5V
1k
10k
100k
1M
10M
10
100
1k
Frequency (Hz)
Load Capacitance (pF)
Figure 15.
Figure 16.
SMALL-SIGNAL PULSE RESPONSE
LARGE-SIGNAL PULSE RESPONSE
G = +1
RL = 10kW
G = +1
RL = 2kW
CL = 50pF
CL = 50pF
Time (400ns/div)
Time (2ms/div)
Figure 17.
Figure 18.
8
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SBOS406F –JUNE 2007–REVISED MARCH 2013
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
SETTLING TIME vs CLOSED-LOOP GAIN
CHANNEL SEPARATION vs FREQUENCY
140
120
100
80
100
10
1
0.01%
60
40
0.1%
20
0
0.1
10
100
1k
10k
100k
1M
10M
100M
1
10
100
Frequency (Hz)
Closed-Loop Gain (V/V)
Figure 19.
Figure 20.
OPEN-LOOP OUTPUT RESISTANCE vs FREQUENCY
1k
100
10
1
400mA Load
2mA Load
0.1
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Figure 21.
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OPA4376
SBOS406F –JUNE 2007–REVISED MARCH 2013
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APPLICATION INFORMATION
The OPA376 family of operational amplifiers is built
using e-trim, a proprietary technique in which offset
voltage is adjusted during the final steps of
manufacturing. This technique compensates for
performance shifts that can occur during the molding
process. Through e-trim, the OPA376 family delivers
excellent offset voltage (5μV, typ). Additionally, the
amplifier boasts a fast slew rate, low drift, low noise,
and excellent PSRR and AOL. These 5.5MHz CMOS
op amps operate on 760μA (typ) quiescent current.
R2
10kW
+5V
C1
100nF
R1
1kW
VOUT
OPA376
OPERATING CHARACTERISTICS
VIN
The OPA376 family of amplifiers has parameters that
are fully specified from 2.2V to 5.5V (±1.1V to
±2.75V). Many of the specifications apply from –40°C
to +125°C. Parameters that can exhibit significant
variance with regard to operating voltage or
temperature are presented in the Typical
Characteristics.
VCM = 2.5V
GENERAL LAYOUT GUIDELINES
Figure 22. Basic Single-Supply Connection
COMMON-MODE VOLTAGE RANGE
For best operational performance of the device, good
printed circuit board (PCB) layout practices are
required. Low-loss, 0.1μF bypass capacitors must be
connected between each supply pin and ground,
placed as close to the device as possible. A single
bypass capacitor from V+ to ground is applicable to
single-supply applications.
The input common-mode voltage range of the
OPA376 series extends 100mV beyond the supply
rails. The offset voltage of the amplifier is very low,
from approximately (V–) to (V+) – 1V, as shown in
Figure 23. The offset voltage increases as common-
mode voltage exceeds (V+) –1V. Common-mode
rejection is specified from (V–) to (V+) – 1.3V.
BASIC AMPLIFIER CONFIGURATIONS
The OPA376 family is unity-gain stable. It does not
exhibit output phase inversion when the input is
overdriven. A typical single-supply connection is
shown in Figure 22. The OPA376 is configured as a
basic inverting amplifier with a gain of –10V/V. This
single-supply connection has an output centered on
the common-mode voltage, VCM. For the circuit
shown, this voltage is 2.5V, but may be any value
within the common-mode input voltage range.
3
2
1
0
-1
-2
-V
+V
-3
-0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input Common-Mode Voltage (V)
Figure 23. Offset and Common-Mode Voltage
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SBOS406F –JUNE 2007–REVISED MARCH 2013
INPUT AND ESD PROTECTION
load, a voltage divider is created, introducing a gain
error at the output and slightly reducing the output
swing. The error introduced is proportional to the ratio
RS/RL, and is generally negligible at low output
current levels.
The OPA376 family incorporates internal electrostatic
discharge (ESD) protection circuits on all pins. In the
case of input and output pins, this protection primarily
consists of current steering diodes connected
between the input and power-supply pins. These ESD
protection diodes also provide in-circuit, input
overdrive protection, as long as the current is limited
to 10mA as stated in the Absolute Maximum Ratings.
Figure 24 shows how a series input resistor may be
added to the driven input to limit the input current.
The added resistor contributes thermal noise at the
amplifier input and its value should be kept to a
minimum in noise-sensitive applications.
V+
RS
VOUT
OPA376
10W to
20W
VIN
CL
RL
Figure 25. Improving Capacitive Load Drive
ACTIVE FILTERING
V+
IOVERLOAD
10mA max
VOUT
OPA376
The OPA376 series is well-suited for filter
applications requiring a wide bandwidth, fast slew
rate, low-noise, single-supply operational amplifier.
Figure 26 shows a 50kHz, 2nd-order, low-pass filter.
The components have been selected to provide a
maximally-flat Butterworth response. Beyond the
cutoff frequency, roll-off is –40dB/dec. The
Butterworth response is ideal for applications
requiring predictable gain characteristics such as the
anti-aliasing filter used ahead of an analog-to-digital
converter (ADC).
VIN
5kW
Figure 24. Input Current Protection
CAPACITIVE LOAD AND STABILITY
The OPA376 series of amplifiers may be used in
applications where driving
a capacitive load is
required. As with all op amps, there may be specific
instances where the OPAx376 can become unstable,
leading to oscillation. The particular op amp circuit
configuration, layout, gain, and output loading are
some of the factors to consider when establishing
whether an amplifier will be stable in operation. An op
amp in the unity-gain (+1V/V) buffer configuration and
driving a capacitive load exhibits a greater tendency
to be unstable than an amplifier operated at a higher
noise gain. The capacitive load, in conjunction with
the op amp output resistance, creates a pole within
the feedback loop that degrades the phase margin.
The degradation of the phase margin increases as
the capacitive loading increases.
R3
5.49kW
C2
150pF
V+
R1
R2
5.49kW
12.4kW
OPA376
VOUT
C1
1nF
VIN
The OPAx376 in a unity-gain configuration can
directly drive up to 250pF pure capacitive load.
Increasing the gain enhances the ability of the
amplifier to drive greater capacitive loads; see the
typical characteristic plot, Small-Signal Overshoot vs
Capacitive Load. In unity-gain configurations,
capacitive load drive can be improved by inserting a
small (10Ω to 20Ω) resistor, RS, in series with the
output, as shown in Figure 25. This resistor
significantly reduces ringing while maintaining dc
performance for purely capacitive loads. However, if
there is a resistive load in parallel with the capacitive
(V+)/2
Figure 26. Second-Order Butterworth 50kHz Low-
Pass Filter
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OPA2376 WCSP PACKAGE
should be expected. Fluorescent lighting may
introduce noise or hum because of the time-varying
light output. Best layout practices include end-product
packaging that provides shielding from possible light
sources during operation.
The OPA2376YZD is a lead- (PB-) free, die-level,
wafer chip-scale package (WCSP). Unlike devices
that are in plastic packages, these devices have no
molding compound, lead frame, wire bonds, or leads.
Using standard surface-mount assembly procedures,
the WCSP can be mounted to a PCB without
additional underfill. Figure 27 and Figure 28 detail the
pinout and package marking. See the NanoStar™
and NanoFree™ 300μm Solder Bump WCSP
Application Note (SBVA017) for more detailed
information on package characteristics and PCB
design.
DRIVING AN ANALOG-TO-DIGITAL
CONVERTER
The low noise and wide gain bandwidth of the
OPA376 family make it an ideal driver for ADCs.
Figure 29 illustrates the OPA376 driving an
ADS8327, 16-bit, 250kSPS converter. The amplifier is
connected as a unity-gain, noninverting buffer.
OPA2376YZD
Top View
+5V
(bump side down)
Not to Scale
C1
0.1mF
+5V
(1)
R1
D2
C2
B2
A2
D1 V-
+IN B
-IN B
OUT B
V+
100W
+IN
ADS8327
Low Power
16-Bit
OPA376
C1 +IN A
(1)
C3
-IN A
B1
-IN
1.2nF
500kSPS
VIN
A1 OUT A
REF IN
+5V
WCSP-8
REF5040
4.096V
Figure 27. Pin Description
C4
100nF
OPA2376YZD
WCSP-8 Enlarged Image
Top View
NOTE: (1) Suggested value; may require adjustment based on
specific application.
(bump side down)
Figure 29. Driving an ADS8327
Actual Size:
Package Marking Code:
YMD = year/month/day
PHANTOM-POWERED MICROPHONE
Exact Size:
CGL = indicates OPA2376YZD
S = for engineering purposes only
1.150mm x 2.188mm
The circuit shown in Figure 30 depicts how a remote
microphone amplifier can be powered by a phantom
source on the output side of the signal cable. The
cable serves double duty, carrying both the
differential output signal from and dc power to the
microphone amplifier stage.
Figure 28. Top View Package Marking
An OPA2376 serves as a single-ended input to a
differential output amplifier with a 6dB gain. Common-
mode bias for the two op amps is provided by the dc
voltage developed across the electret microphone
element. A 48V phantom supply is reduced to 5.1V
by the series 6.8kΩ resistors on the output side of the
cable, and the 4.7kΩ and zener diode on the input
side of the cable. AC coupling blocks the different dc
voltage levels from each other on each end of the
cable.
PHOTOSENSITIVITY
Although the OPA2376YZD package has a protective
backside coating that reduces the amount of light
exposure on the die, unless fully shielded, ambient
light can reach the active region of the device. Input
bias current for the package is specified in the
absence of light. Depending on the amount of light
exposure in a given application, an increase in bias
current, and possible increases in offset voltage
12
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: OPA376 OPA2376 OPA4376
OPA376
OPA2376
OPA4376
www.ti.com
SBOS406F –JUNE 2007–REVISED MARCH 2013
An INA163 instrumentation amplifier provides
differential inputs and receives the balanced audio
signals from the cable.
The INA163 gain may be set from 0dB to 80dB by
selecting the RG value. The INA163 circuit is typical
of the input circuitry used in mixing consoles.
Phantom Power
(Provides power source for microphone)
48V
Microphone
100W
1mF
+
33mF
D1
5.1V
R1
2.7kW
R8
R9
C2
R6
4.7kW
4.7kW
R10
R11
33mF
+
100W
+15V
1/2
6.8kW
6.8kW
OPA2376
10mF
2
3
2
3
1kW
1kW
RG
INA163
10mF
Panasonic
WM-034CY
1
1
C3
R7
3.3kW
3.3kW
10kW
10mF
33mF
+
100W
1/2
Low-level differential audio signal
is transmitted differentially on the
same cable as power to the microphone.
OPA2376
-15V
+
Typical microphone input circuit used in mixing consoles.
Figure 30. Phantom-Powered Electret Microphone
V+ = +2.7V to 5V
Passband 300Hz to 3kHz
R9
510kW
R1
R4
R2
1.5kW
20kW
1MW
C3
C1
33pF
1000pF
R7
R8
V+
8
1
VREF
51kW
150kW
1/2
7
6
DCLOCK
DOUT
OPA2376
+IN
2
1/2
R3
ADS7822
Electret
Microphone(1)
Serial
OPA2376
1MW
R6
12-Bit A/D
Interface
1000pF
C2
5
CS/SHDN
-IN
100kW
3
4
G = 100
R5
20kW
GND
NOTE: (1) Electret microphone powered by R1.
Figure 31. OPA2376 as a Speech Bandpass Filtered Data Acquisition System
Copyright © 2007–2013, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: OPA376 OPA2376 OPA4376
OPA376
OPA2376
OPA4376
SBOS406F –JUNE 2007–REVISED MARCH 2013
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (January 2013) to Revision F
Page
•
•
Changed unit (typo) for Quiescent Current feature bullet ..................................................................................................... 1
Changed TSSOP-14 pinout for OPA4376 ............................................................................................................................ 5
Changes from Revision D (August 2010) to Revision E
Page
•
•
Changed rail-to-rail feature bullet to show input and output ................................................................................................. 1
Changed description text to show rail-to-rail input and output ............................................................................................. 1
Changes from Revision C (October 2008) to Revision D
Page
•
•
Updated format of Electrical Characteristics table ................................................................................................................ 3
Updated Figure 11 ................................................................................................................................................................ 7
14
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Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: OPA376 OPA2376 OPA4376
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
OPA2376AID
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
5
5
5
5
5
5
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
SNAGCU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
OPA
2376
OPA2376AIDG4
OPA2376AIDGKR
OPA2376AIDGKRG4
OPA2376AIDGKT
OPA2376AIDGKTG4
OPA2376AIDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
75
Green (RoHS
& no Sb/Br)
OPA
2376
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
DGK
D
2500
2500
250
Green (RoHS
& no Sb/Br)
OBBI
OBBI
OBBI
OBBI
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
2500
2500
3000
250
Green (RoHS
& no Sb/Br)
OPA
2376
OPA2376AIDRG4
OPA2376AIYZDR
OPA2376AIYZDT
OPA376AID
SOIC
D
Green (RoHS
& no Sb/Br)
OPA
2376
DSBGA
DSBGA
SOIC
YZD
YZD
D
Green (RoHS
& no Sb/Br)
OPA2376
Green (RoHS
& no Sb/Br)
SNAGCU
OPA2376
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
OPA
376
OPA376AIDBVR
OPA376AIDBVRG4
OPA376AIDBVT
OPA376AIDBVTG4
OPA376AIDCKR
OPA376AIDCKRG4
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
3000
3000
250
Green (RoHS
& no Sb/Br)
BUQ
BUQ
BUQ
BUQ
BUR
BUR
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
Green (RoHS
& no Sb/Br)
SC70
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
OPA376AIDCKT
OPA376AIDCKTG4
OPA376AIDG4
ACTIVE
SC70
SC70
DCK
5
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
BUR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DCK
D
250
75
Green (RoHS
& no Sb/Br)
BUR
SOIC
8
Green (RoHS
& no Sb/Br)
OPA
376
OPA376AIDR
SOIC
D
8
2500
2500
90
Green (RoHS
& no Sb/Br)
OPA
376
OPA376AIDRG4
OPA4376AIPW
SOIC
D
8
Green (RoHS
& no Sb/Br)
OPA
376
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
14
14
14
14
Green (RoHS
& no Sb/Br)
OPA4376
OPA4376
OPA4376
OPA4376
OPA4376AIPWG4
OPA4376AIPWR
OPA4376AIPWRG4
90
Green (RoHS
& no Sb/Br)
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA376 :
Automotive: OPA376-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPA2376AIDR
OPA2376AIYZDR
OPA2376AIYZDR
OPA2376AIYZDT
OPA2376AIYZDT
OPA376AIDBVR
OPA376AIDBVR
OPA376AIDBVT
OPA376AIDBVT
OPA376AIDCKR
OPA376AIDCKR
OPA376AIDCKT
OPA376AIDCKT
OPA376AIDR
SOIC
DSBGA
DSBGA
DSBGA
DSBGA
SOT-23
SOT-23
SOT-23
SOT-23
SC70
D
8
8
8
8
8
5
5
5
5
5
5
5
5
8
14
2500
3000
3000
250
330.0
180.0
180.0
180.0
180.0
180.0
179.0
179.0
180.0
179.0
178.0
178.0
179.0
330.0
330.0
12.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
9.0
9.0
8.4
12.4
12.4
6.4
1.24
1.24
1.24
1.24
3.23
3.2
5.2
2.29
2.29
2.29
2.29
3.17
3.2
2.1
0.81
0.81
0.81
0.81
1.37
1.4
8.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
12.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q1
Q1
YZD
YZD
YZD
YZD
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
D
250
3000
3000
250
3.2
3.2
1.4
250
3.23
2.2
3.17
2.5
1.37
1.2
3000
3000
250
SC70
2.4
2.5
1.2
SC70
2.4
2.5
1.2
SC70
250
2.2
2.5
1.2
SOIC
2500
2000
6.4
5.2
2.1
OPA4376AIPWR
TSSOP
PW
6.9
5.6
1.6
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPA2376AIDR
OPA2376AIYZDR
OPA2376AIYZDR
OPA2376AIYZDT
OPA2376AIYZDT
OPA376AIDBVR
OPA376AIDBVR
OPA376AIDBVT
OPA376AIDBVT
OPA376AIDCKR
OPA376AIDCKR
OPA376AIDCKT
OPA376AIDCKT
OPA376AIDR
SOIC
DSBGA
DSBGA
DSBGA
DSBGA
SOT-23
SOT-23
SOT-23
SOT-23
SC70
D
8
8
8
8
8
5
5
5
5
5
5
5
5
8
14
2500
3000
3000
250
367.0
182.0
220.0
220.0
182.0
202.0
195.0
195.0
202.0
195.0
180.0
180.0
195.0
367.0
367.0
367.0
182.0
220.0
220.0
182.0
201.0
200.0
200.0
201.0
200.0
180.0
180.0
200.0
367.0
367.0
35.0
17.0
34.0
34.0
17.0
28.0
45.0
45.0
28.0
45.0
18.0
18.0
45.0
35.0
35.0
YZD
YZD
YZD
YZD
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
D
250
3000
3000
250
250
3000
3000
250
SC70
SC70
SC70
250
SOIC
2500
2000
OPA4376AIPWR
TSSOP
PW
Pack Materials-Page 2
D: Max = 2.178 mm, Min =2.118 mm
E: Max = 1.14 mm, Min = 1.08 mm
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相关型号：
OPA2377AIDRGT
IC DUAL OP-AMP, 1000 uV OFFSET-MAX, 5.5 MHz BAND WIDTH, PDSO8, PLASTIC, MO-229, SON-8, Operational Amplifier
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