OPA4336EA/250G4 [TI]
SINGLE-SUPPLY, microPower CMOS OPERATIONAL AMPLIFIERS microAmplifier Series;型号: | OPA4336EA/250G4 |
厂家: | TEXAS INSTRUMENTS |
描述: | SINGLE-SUPPLY, microPower CMOS OPERATIONAL AMPLIFIERS microAmplifier Series 放大器 光电二极管 |
文件: | 总23页 (文件大小:1297K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
O
OPA336
OPA2336
OPA4336
P
A
4
3
3
6
O
P
A
3
3
6
O
P
A
2
3
3
6
SBOS068C – JANUARY 1997 – REVISED JANUARY 2005
SINGLE-SUPPLY, microPower
CMOS OPERATIONAL AMPLIFIERS
™
microAmplifier Series
FEATURES
DESCRIPTION
ꢀ SINGLE-SUPPLY OPERATION
OPA336 series microPower CMOS operational amplifiers
are designed for battery-powered applications. They
operate on a single supply with operation as low as 2.1V.
The output is rail-to-rail and swings to within 3mV of the
supplies with a 100kΩ load. The common-mode range
extends to the negative supply—ideal for single-supply
applications. Single, dual, and quad versions have identical
specifications for maximum design flexibility.
ꢀ RAIL-TO-RAIL OUTPUT (within 3mV)
ꢀ microPOWER: IQ = 20µA/Amplifier
ꢀ microSIZE PACKAGES
ꢀ LOW OFFSET VOLTAGE: 125µV max
ꢀ SPECIFIED FROM VS = 2.3V to 5.5V
ꢀ SINGLE, DUAL, AND QUAD VERSIONS
In addition to small size and low quiescent current
(20µA/amplifier), they feature low offset voltage
(125µV max), low input bias current (1pA), and high open-
loop gain (115dB). Dual and quad designs feature
completely independent circuitry for lowest crosstalk and
freedom from interaction.
APPLICATIONS
ꢀ BATTERY-POWERED INSTRUMENTS
ꢀ PORTABLE DEVICES
ꢀ HIGH-IMPEDANCE APPLICATIONS
ꢀ PHOTODIODE PRE-AMPS
ꢀ PRECISION INTEGRATORS
ꢀ MEDICAL INSTRUMENTS
ꢀ TEST EQUIPMENT
OPA336 packages are the tiny SOT23-5 surface mount
and SO-8 surface-mount. OPA2336 come in the miniature
MSOP-8 surface-mount, SO-8 surface-mount, and DIP-8
packages. The OPA4336 package is the space-saving
SSOP-16 surface-mount. All are specified from
–40°C to +85°C and operate from –55°C to +125°C.
A macromodel is available for download (at www.ti.com)
for design analysis.
OPA336
Out
V–
1
2
3
5
4
V+
OPA4336
Out A
–In A
+In A
V+
1
2
3
4
5
6
7
8
16 Out D
15 –In D
14 +In D
13 V–
+In
–In
A
B
D
C
SOT23-5
OPA2336
OPA336
Out A
1
2
3
4
8
7
6
5
V+
NC
–In
+In
V–
1
2
3
4
8
7
6
5
NC
V+
+In B
–In B
Out B
NC
12 +In C
11 –In C
10 Out C
A
–In A
+In A
V–
Out B
–In B
+In B
B
Output
NC
9
NC
DIP-8, SO-8, MSOP-8
SO-8
SSOP-16
NC = No Connection
NC = No Connection
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 1997-2005, Texas Instruments Incorporated
www.ti.com
PACKAGE/ORDERING INFORMATION(1)
PACKAGE
DRAWING
DESIGNATOR
PACKAGE
MARKING
PRODUCT
PACKAGE-LEAD
Single
OPA336N
OPA336NA
OPA336NJ
OPA336U
OPA336UA
OPA336UJ
SOT23-5
SOT23-5
SOT23-5
DBV
DBV
DBV
D
D
D
A36(2)
A36(2)
J36
OPA336U
OPA336UA
OPA336UJ
SO-8 Surface-Mount
SO-8 Surface-Mount
SO-8 Surface-Mount
Dual
OPA2336E
OPA2336EA
OPA2336P
MSOP-8 Surface-Mount
MSOP-8 Surface-Mount
DIP-8
DGK
DGK
P
B36(2)
B36(2)
OPA2336P
OPA2336PA
DIP-8
P
OPA2336PA
OPA2336U
OPA2336UA
SO-8 Surface-Mount
SO-8 Surface-Mount
D
D
OPA2336U
OPA2336UA
Quad
OPA4336EA
SSOP-16 Surface-Mount
DBQ
OPA4336EA
NOTES: (1) For the most current package and ordering information, see the package option addendum at the end of this data sheet. (2) Grade will be marked on
the Reel.
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
Supply Voltage ................................................................................... 7.5V
DISCHARGE SENSITIVITY
Signal Input Terminals, Voltage(2) .....................(V–) –0.3V to (V+) +0.3V
Current(2) .................................................... 10mA
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han-
dling and installation procedures can cause damage.
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature ..................................................–55°C to +125°C
Storage Temperature .....................................................–55°C to +125°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering, 10s)................................................. 300°C
ESD Rating:
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
Charged Device Model, OPA336 NJ and UJ only (CDM)(4) ....... 1000V
Human Body Model (HBM)(4) ......................................................... 500V
Machine Model (MM)(4) .................................................................. 100V
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only. Functional opera-
tion of the device at these conditions, or beyond the specified operating
conditions, is not implied. (2) Input terminals are diode-clamped to the power
supply rails. Input signals that can swing more than 0.3V beyond the supply
rails should be current-limited to 10mA or less. (3) Short-circuit to ground,
one amplifier per package. (4) OPA336 NJ and UJ have been tested to CDM
of 1000V. All other previous package versions have been tested using HBM
and MM. Results are shown.
OPA336, 2336, 4336
2
SBOS068C
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = 2.3V to 5.5V
Boldface limits apply over the specified temperature range, TA = –40°C to +85°C.
At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted.
OPA336NA, UA
OPA336N, U
OPA2336E, P, U
OPA2336EA, PA, UA
OPA4336EA
OPA336NJ, UJ
PARAMETER
CONDITION
MIN
TYP(1) MAX
MIN
TYP MAX MIN TYP MAX UNITS
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
vs Power Supply
Over Temperature
Channel Separation, dc
VOS
dVOS/dT
PSRR
±60
±1.5
25
±125
ꢀ
ꢀ
ꢀ
±500
±500 ±2500
ꢀ
µV
µV/°C
µV/V
µV/V
µV/V
VS = 2.3V to 5.5V
VS = 2.3V to 5.5V
100
130
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
0.1
ꢀ
ꢀ
INPUT BIAS CURRENT
Input Bias Current
Over Temperature
Input Offset Current
IB
±1
±1
±10
±60
±10
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
pA
pA
pA
IOS
NOISE
Input Voltage Noise, f = 0.1 to 10Hz
Input Voltage Noise Density, f = 1kHz en
Current Noise Density, f = 1kHz
3
40
30
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
µVp-p
nV/√Hz
fA/√Hz
in
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio CMRR
Over Temperature
VCM
–0.2
80
76
(V+) –1
ꢀ
76
74
ꢀ
ꢀ
76
74
ꢀ
V
dB
dB
–0.2V < VCM < (V+) –1V
–0.2V < VCM < (V+) –1V
90
86
86
INPUT IMPEDANCE
Differential
Common-Mode
1013 || 2
1013 || 4
ꢀ
ꢀ
ꢀ
ꢀ
Ω || pF
Ω || pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain
Over Temperature
AOL RL = 25kΩ, 100mV < VO < (V+) – 100mV 100
RL = 25kΩ, 100mV < VO < (V+) – 100mV 100
115
106
90
90
ꢀ
ꢀ
ꢀ
ꢀ
90
90
ꢀ
ꢀ
ꢀ
ꢀ
dB
dB
dB
dB
RL = 5kΩ, 500mV < VO < (V+) – 500mV
RL = 5kΩ, 500mV < VO < (V+) – 500mV
90
90
Over Temperature
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
GBW
SR
VS = 5V, G = 1
VS = 5V, G = 1
VIN • G = VS
100
0.03
100
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
kHz
V/µs
µs
Overload Recovery Time
OUTPUT
Voltage Output Swing from Rail(2)
RL = 100kΩ, AOL ≥ 70dB
RL = 25kΩ, AOL ≥ 90dB
RL = 25kΩ, AOL ≥ 90dB
RL = 5kΩ, AOL ≥ 90dB
RL = 5kΩ, AOL ≥ 90dB
3
20
ꢀ
ꢀ
ꢀ
ꢀ
mV
mV
mV
mV
mV
mA
pF
100
100
500
500
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Over Temperature
70
ꢀ
ꢀ
Over Temperature
Short-Circuit Current
Capacitive Load Drive
ISC
CLOAD
±5
See Text
ꢀ
ꢀ
ꢀ
ꢀ
POWER SUPPLY
Specified Voltage Range
Minimum Operating Voltage
Quiescent Current (per amplifier)
Over Temperature
VS
IQ
2.3
5.5
ꢀ
ꢀ
ꢀ
ꢀ
V
V
µA
µA
2.1
20
ꢀ
ꢀ
ꢀ
23
IO = 0
32
36
ꢀ
ꢀ
38
42
IO = 0
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
–40
–55
–55
+85
+125
+125
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
°C
°C
°C
Thermal Resistance
SOT-23-5 Surface-Mount
MSOP-8 Surface-Mount
SO-8 Surface-Mount
DIP-8
θJA
200
150
150
100
100
80
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
SSOP-16 Surface-Mount
DIP-14
ꢀSpecifications same as OPA2336E, P, U.
NOTES: (1) VS = +5V. (2) Output voltage swings are measured between the output and positive and negative power-supply rails.
OPA336, 2336, 4336
3
SBOS068C
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted.
POWER-SUPPLY and COMMON-MODE
REJECTION RATIO vs FREQUENCY
OPEN-LOOP GAIN/PHASE vs FREQUENCY
100
100
80
60
40
20
0
CMRR
G
80
60
40
20
0
0
–45
–90
–135
–180
PSRR
Φ
–20
1
10
100
1k
10k
100k
1M
1
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
QUIESCENT CURRENT vs SUPPLY VOLTAGE
Per Amplifier
QUIESCENT CURRENT vs TEMPERATURE
Per Amplifier
30
25
20
15
10
30
25
20
15
10
5
VS = +5V
VS = +2.3V
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
–75
–50
–25
0
25
50
75
100
125
Supply Voltage (V)
Temperature (°C)
SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE
SHORT-CIRCUIT CURRENT vs TEMPERATURE
±6
±5
±4
±3
±2
±1
0
8
7
6
5
4
3
2
1
0
VS = +5V
–ISC
+ISC
+ISC
+ISC
VS = +2.3V
–ISC
–ISC
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
–75
–50
–25
0
25
50
75
100
125
Supply Voltage (V)
Temperature (°C)
OPA336, 2336, 4336
4
SBOS068C
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted.
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
CHANNEL SEPARATION vs FREQUENCY
1k
100
10
1k
150
140
130
120
110
Voltage Noise
100
10
Dual and Quad devices, G = 1, all
channels. Quad measured channel A
to D or B to C—other combinations
yield improved rejection.
Current Noise
1
1
10
100
1k
10k
100k
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
AOL, CMRR, PSRR vs TEMPERATURE
AOL
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
VS = +5.5V
120
110
100
90
6
5
4
3
2
1
0
PSRR
VS = +2.3V
CMRR
80
70
–75
–50
–25
0
25
50
75
100
125
100
1k
10k
100k
Temperature (°C)
Frequency (Hz)
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
OFFSET VOLTAGE DRIFT MAGNITUDE
PRODUCTION DISTRIBUTION
25
20
15
10
5
25
20
15
10
5
Typical production
distribution of
packaged units.
Typical production
distribution of
packaged units.
0.3%
0.1%
0.2%
0.1%
0
0
Offset Voltage (µV)
Offset Voltage Drift (µV/°C)
OPA336, 2336, 4336
5
SBOS068C
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted.
INPUT BIAS CURRENT
INPUT BIAS CURRENT vs TEMPERATURE
1k
vs INPUT COMMON-MODE VOLTAGE
4
3
2
1
0
100
10
1
VS = +5V
0.1
–75
–50
–25
0
25
50
75
100
125
0
1
2
3
4
5
Temperature (°C)
Common-Mode Voltage (V)
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
VS = +5V
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
5
–2.5
–2.0
–1.5
–1.0
–0.5
0
VS = ±2.5V
4
3
2
1
0
–55°C
Sourcing
Current
Sinking
Current
+125°C
+25°C
VS = +2.3V
+125°C
+125°C
–55°C
+25°C
–55°C
+25°C
0
1
2
3
4
5
6
7
8
–0
–1
–2
–3
–4
–5
–6
–7
–8
Output Current (mA)
Output Current (mA)
LARGE-SIGNAL STEP RESPONSE
G = 1, CL = 620pF, VS = +5V
SMALL-SIGNAL STEP RESPONSE
G = 1, CL = 200pF, VS = +5V
200µs/div
50µs/div
OPA336, 2336, 4336
6
SBOS068C
www.ti.com
Normally, input bias current is approximately 1pA. How-
ever, input voltages exceeding the power supplies can
cause excessive current to flow in or out of the input pins.
Momentary voltages greater than the power supply can be
tolerated as long as the current on the input pins is limited
to 10mA. This is easily accomplished with an input resis-
tor, as shown in Figure 2.
APPLICATIONS INFORMATION
OPA336 series op amps are fabricated on a state-of-the-art
0.6 micron CMOS process. They are unity-gain stable and
suitable for a wide range of general-purpose applications.
Power-supply pins should be bypassed with 0.01µF ceramic
capacitors. OPA336 series op amps are protected against
reverse battery voltages.
OPERATING VOLTAGE
+5V
OPA336 series op amps can operate from a +2.1V to +5.5V
single supply with excellent performance. Most behavior
remains unchanged throughout the full operating voltage
range. Parameters which vary significantly with operating
voltage are shown in the typical characteristics. OPA336
series op amps are fully specified for operation from +2.3V
to +5.5V; a single limit applies over the supply range. In
addition, many parameters are ensured over the specified
temperature range, –40°C to +85°C.
IOVERLOAD
10mA max
VOUT
OPAx336
VIN
5kΩ
FIGURE 2. Input Current Protection for Voltages Exceeding
the Supply Voltage.
CAPACITIVE LOAD AND STABILITY
OPA336 series op amps can drive a wide range of capaci-
tive loads. However, all op amps under certain conditions
may become unstable. Op-amp configuration, gain, and
load value are just a few of the factors to consider when
determining stability.
INPUT VOLTAGE
The input common-mode range of OPA336 series op amps
extends from (V–) – 0.2V to (V+) – 1V. For normal
operation, inputs should be limited to this range. The
absolute maximum input voltage is 300mV beyond the
supplies. Thus, inputs greater than the input
common-mode range but less than maximum input volt-
age, while not valid, will not cause any damage to the op
amp. Furthermore, the inputs may go beyond the power
supplies without phase inversion, as shown in Figure 1,
unlike some other op amps.
When properly configured, OPA336 series op amps can
drive approximately 10,000pF. An op amp in unity-gain
configuration is the most vulnerable to capacitive load. The
capacitive load reacts with the op amp’s output resistance,
along with any additional load resistance, to create a pole in
the response which degrades the phase margin. In unity gain,
OPA336 series op amps perform well with a pure capacitive
load up to about 300pF. Increasing gain enhances the
amplifier’s ability to drive loads beyond this level.
One method of improving capacitive load drive in the
unity-gain configuration is to insert a 50Ω to 100Ω resistor
inside the feedback loop, as shown in Figure 3. This reduces
ringing with large capacitive loads while maintaining DC
6V
VOUT
RS
100Ω
OPAx336
VOUT
0V
VIN
CL
RL
FIGURE 1. No Phase Inversion with Inputs Greater than the
Power-Supply Voltage.
FIGURE 3. Series Resistor in Unity-Gain Configuration
Improves Capacitive Load Drive.
OPA336, 2336, 4336
7
SBOS068C
www.ti.com
accuracy. For example, with RL = 25kΩ, OPA336 series op
amps perform well with capacitive loads in excess of 1000pF,
as shown in Figure 4. Without RS, capacitive load drive is
typically 350pF for these conditions, as shown in Figure 5.
Direct Current (DC) error at the output; however, this error
may be insignificant. For instance, with RL = 100kΩ and
RS = 100Ω, there is only about a 0.1% error at the output.
Figure 5 shows the recommended operating regions for the
OPA336. Decreasing the load resistance generally improves
capacitive load drive. Figure 5 also illustrates how stability
differs depending on where the resistive load is connected.
With G = +1 and RL = 10kΩ connected to VS/2, the OPA336
can typically drive 500pF. Connecting the same load to
ground improves capacitive load drive to 1000pF.
RS = 100Ω, Load = 2kΩ || 1000pF, VS = +5V
10k
Operation Above Selected Gain
Curve Not Recommended
G = +2
G = +1
RL to Ground
RL to Ground
1k
50µs/div
FIGURE 4. Small-Signal Step Response Using Series Re-
sistor to Improve Capacitive Load Drive.
G = +1
L to VS/2
R
VS = +5V, VO = VS/2
Alternatively, the resistor may be connected in series with
the output outside of the feedback loop. However, if there is
a resistive load parallel to the capacitive load, it and the
series resistor create a voltage divider. This introduces a
100
5
10
100
Resistive Load (kΩ)
FIGURE 5. Stability—Capacitive Load vs Resistive Load.
OPA336, 2336, 4336
8
SBOS068C
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
OPA2336E/250
OPA2336E/250G4
OPA2336E/2K5
OPA2336E/2K5G4
OPA2336EA/250
OPA2336EA/250G4
OPA2336EA/2K5
OPA2336EA/2K5G4
OPA2336P
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
PDIP
DGK
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
B36
B36
B36
B36
B36
B36
B36
B36
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DGK
DGK
DGK
DGK
DGK
DGK
DGK
P
250
2500
2500
250
250
2500
2500
50
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
OPA2336P
OPA2336PA
PDIP
P
50
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
OPA2336P
A
OPA2336PAG4
OPA2336PG4
PDIP
P
50
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
OPA2336P
A
PDIP
P
50
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
OPA2336P
OPA2336U
SOIC
D
75
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
OPA
2336U
OPA2336U/2K5
OPA2336U/2K5G4
OPA2336UA
SOIC
D
2500
2500
75
Green (RoHS
& no Sb/Br)
OPA
2336U
SOIC
D
Green (RoHS
& no Sb/Br)
OPA
2336U
SOIC
D
Green (RoHS
& no Sb/Br)
OPA
2336U
A
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
OPA2336UA/2K5
OPA2336UA/2K5G4
OPA2336UAG4
ACTIVE
SOIC
SOIC
SOIC
D
8
8
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 85
OPA
2336U
A
ACTIVE
ACTIVE
D
D
2500
75
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
OPA
2336U
A
Green (RoHS
& no Sb/Br)
OPA
2336U
A
OPA2336UG4
OPA336N/250
OPA336N/250G4
OPA336N/3K
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
SOIC
D
8
5
5
5
5
5
5
5
5
5
5
5
5
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
OPA
2336U
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
PDIP
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
P
250
Green (RoHS
& no Sb/Br)
A36
A36
A36
A36
A36
A36
A36
A36
J36
J36
J36
J36
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
OPA336N/3KG4
OPA336NA/250
OPA336NA/250G4
OPA336NA/3K
OPA336NA/3KG4
OPA336NJ/250
OPA336NJ/250G4
OPA336NJ/3K
OPA336NJ/3KG4
OPA336P
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
250
Green (RoHS
& no Sb/Br)
3000
3000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
OPA336PA
OPA336U
OBSOLETE
ACTIVE
PDIP
SOIC
P
D
8
8
TBD
Call TI
Call TI
75
2500
2500
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
336U
OPA336U/2K5
OPA336U/2K5G4
OPA336UA
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
D
D
D
8
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
OPA
336U
Green (RoHS
& no Sb/Br)
OPA
336U
Green (RoHS
& no Sb/Br)
OPA
336U
A
OPA336UA/2K5
OPA336UA/2K5G4
OPA336UAG4
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
D
D
D
8
8
8
2500
2500
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
OPA
336U
A
Green (RoHS
& no Sb/Br)
OPA
336U
A
Green (RoHS
& no Sb/Br)
OPA
336U
A
OPA336UG4
OPA4336EA/250
OPA4336EA/250G4
OPA4336EA/2K5
OPA4336EA/2K5G4
OPA4336PA
ACTIVE
ACTIVE
SOIC
SSOP
SSOP
SSOP
SSOP
PDIP
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Call TI
OPA
336U
DBQ
DBQ
DBQ
DBQ
N
16
16
16
16
14
250
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
OPA
4336EA
ACTIVE
250
Green (RoHS
& no Sb/Br)
OPA
4336EA
ACTIVE
2500
2500
Green (RoHS
& no Sb/Br)
OPA
4336EA
ACTIVE
Green (RoHS
& no Sb/Br)
OPA
4336EA
OBSOLETE
TBD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA336 :
Enhanced Product: OPA336-EP
•
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPA2336E/250
OPA2336E/2K5
OPA2336EA/250
OPA2336U/2K5
OPA336N/250
OPA336N/3K
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
D
8
8
250
2500
250
180.0
330.0
180.0
330.0
178.0
179.0
178.0
178.0
178.0
179.0
178.0
178.0
179.0
330.0
330.0
180.0
330.0
12.4
12.4
12.4
12.4
9.0
5.3
5.3
3.4
3.4
1.4
1.4
8.0
8.0
8.0
8.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
8.0
Q1
Q1
Q1
Q1
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q1
Q1
Q1
Q1
8
5.3
3.4
1.4
8
2500
250
6.4
5.2
2.1
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
D
5
3.23
3.2
3.17
3.2
1.37
1.4
5
3000
3000
250
8.4
8.0
OPA336N/3K
5
9.0
3.23
3.23
3.23
3.2
3.17
3.17
3.17
3.2
1.37
1.37
1.37
1.4
8.0
OPA336NA/250
OPA336NA/3K
OPA336NA/3K
OPA336NJ/250
OPA336NJ/3K
OPA336NJ/3K
OPA336U/2K5
OPA336UA/2K5
OPA4336EA/250
OPA4336EA/2K5
5
9.0
8.0
5
3000
3000
250
9.0
8.0
5
8.4
8.0
5
9.0
3.23
3.23
3.2
3.17
3.17
3.2
1.37
1.37
1.4
8.0
5
3000
3000
2500
2500
250
9.0
8.0
5
8.4
8.0
8
12.4
12.4
12.4
12.4
6.4
5.2
2.1
12.0
12.0
12.0
12.0
SOIC
D
8
6.4
5.2
2.1
SSOP
DBQ
DBQ
16
16
6.4
5.2
2.1
SSOP
2500
6.4
5.2
2.1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPA2336E/250
OPA2336E/2K5
OPA2336EA/250
OPA2336U/2K5
OPA336N/250
OPA336N/3K
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
D
8
8
250
2500
250
210.0
367.0
210.0
367.0
180.0
203.0
180.0
180.0
180.0
203.0
180.0
180.0
203.0
367.0
367.0
210.0
367.0
185.0
367.0
185.0
367.0
180.0
203.0
180.0
180.0
180.0
203.0
180.0
180.0
203.0
367.0
367.0
185.0
367.0
35.0
35.0
35.0
35.0
18.0
35.0
18.0
18.0
18.0
35.0
18.0
18.0
35.0
35.0
35.0
35.0
35.0
8
8
2500
250
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
D
5
5
3000
3000
250
OPA336N/3K
5
OPA336NA/250
OPA336NA/3K
OPA336NA/3K
OPA336NJ/250
OPA336NJ/3K
OPA336NJ/3K
OPA336U/2K5
OPA336UA/2K5
OPA4336EA/250
OPA4336EA/2K5
5
5
3000
3000
250
5
5
5
3000
3000
2500
2500
250
5
8
SOIC
D
8
SSOP
DBQ
DBQ
16
16
SSOP
2500
Pack Materials-Page 2
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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相关型号:
OPA4336EA/2K5G4
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