PCI1512ZVF [TI]
PCI1512 Single Slot PC CardBus Controller;
| 型号： | PCI1512ZVF |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | PCI1512 Single Slot PC CardBus Controller 时钟 PC 外围集成电路 |
| 文件： | 总5页 (文件大小：125K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCI1512
www.ti.com
SLLA231–JUNE 2006
CardBus Controller
FEATURES
•
Serial EEPROM Interface for Loading
Subsystem ID, Subsystem Vendor ID, and
Other Configuration Registers
•
A 216-Terminal MicroStar BGA™ PBGA
(GVF/ZVF) Package
•
Pipelined Architecture for Greater Than
130-Mbps Throughput from CardBus-to-PCI
and from PCI-to-CardBus
•
2.5-V Core Logic and 3.3-V I/O with Universal
PCI Interfaces Compatible with 3.3-V and 5-V
PCI Signaling Environments
•
•
•
Up to Five General-Purpose I/Os
•
Integrated Low-Dropout Voltage Regulator
LDO-VR) Eliminates the Need for an External
2.5-V Power Supply
Programmable Output Select for CLKRUN
Five PCI Memory Windows and Two I/O
Windows Available for the 16-Bit Interface
•
•
•
•
•
Mix-and-Match 5-V/3.3-V 16-Bit PC Cards and
3.3-V CardBus Cards
•
•
Two I/O Windows and Two Memory Windows
Available to the CardBus Socket
A Single PC Card or CardBus Slot with Hot
Insertion and Removal
Exchangeable-Card-Architecture- (ExCA-)
Compatible Registers Are Mapped in Memory
and I/O Space
Parallel Interface to TI TPS2211A Single-Slot
PC Card Power Switch
Burst Transfers to Maximize Data Throughput
with CardBus Cards
•
•
Intel™ 82365SL-DF and 82365SL Register
Compatible
Interrupt Configurations: Parallel PCI,
Serialized PCI, Parallel ISA, and Serialized
ISA
Ring Indicate, SUSPEND, PCI CLKRUN, and
CardBus CCLKRUN
•
•
•
Socket Activity LED Terminal
PCI Bus Lock (LOCK)
Internal Ring Oscillator
DESCRIPTION
The Texas Instruments PCI1512 device, a 216-terminal MicroStar BGA™ single-slot CardBus controller
designed to meet the PCI Bus Power Management Interface Specification for PCI to CardBus Bridges, is an
ultralow-power high-performance PCI-to-CardBus controller that supports a single PC card socket compliant with
the PC Card Standard (Revision 7.2). The controller provides features that make it the best choice for bridging
between PCI and PC Cards in both notebook and desktop computers. The PC Card Standard retains the 16-bit
PC Card specification defined in the PCI Local Bus Specification and defines the 32-bit PC Card, CardBus,
capable of full 32-bit data transfers at 33 MHz. The controller supports both 16-bit and CardBus PC Cards,
powered at 5 V or 3.3 V, as required.
The controller is compliant with the PCI Local Bus Specification, and its PCI interface can act as either a PCI
master device or a PCI slave device. The PCI bus mastering is initiated during CardBus PC Card bridging
transactions. The controller is also compliant with PCI Bus Power Management Interface Specification (Revision
1.1).
All card signals are internally buffered to allow hot insertion and removal without external buffering. The
controller is register-compatible with the Intel 82365SL-DF and 82365SL ExCA controllers. The controller
internal data path logic allows the host to access 8-, 16-, and 32-bit cards using full 32-bit PCI cycles for
maximum performance. Independent buffering and a pipeline architecture provide an unsurpassed performance
level with sustained bursting. The controller can also be programmed to accept fast posted writes to improve
system-bus utilization.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar BGA is a trademark of Texas Instruments.
Intel is a trademark of Intel Corporation.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
PCI1512
www.ti.com
SLLA231–JUNE 2006
Multiple system-interrupt signaling options are provided, including parallel PCI, parallel ISA, serialized ISA, and
serialized PCI. Furthermore, general-purpose inputs and outputs are provided for the board designer to
implement sideband functions. Many other features designed into the PCI1512 controller, such as a socket
activity light-emitting diode (LED) outputs, are discussed in detail throughout this document.
An advanced complementary metal-oxide semiconductor (CMOS) process achieves low system power
consumption while operating at PCI clock rates up to 33 MHz. Several low-power modes enable the host
power-management system to further reduce power consumption.
NOTE:
This product is for high-volume PC applications only. For a complete datasheet or
more information contact support@ti.com.
2
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jun-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
PCI1512ZVF
OBSOLETE NFBGA
ZVF
216
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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