SN54HC158WR [TI]
HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16;
| 型号： | SN54HC158WR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16 CD 输出元件 逻辑集成电路 |
| 文件： | 总16页 (文件大小：744K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢂꢇ ꢈ ꢀꢁꢉ ꢃꢄ ꢅꢆ ꢂꢇ
ꢅ
ꢊ
ꢋ
ꢌ
ꢍ
ꢎ
ꢋ
ꢏ
ꢐ
ꢑ
ꢒ
ꢓ
ꢐ
ꢔ
ꢁ
ꢑ
ꢕ
ꢖ
ꢆ
ꢓ
ꢐ
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ꢁ
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ꢍ
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ꢌ
ꢀ
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ꢐ
ꢑ
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ꢀ
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ꢘ
ꢋ
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ꢙ
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ꢎ
ꢀ
SCLS296D − JANUARY 1996 − REVISED OCTOBER 2003
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 15 LSTTL Loads
D
D
D
Typical t = 11 ns
pd
6-mA Output Drive at 5 V
Low Power Consumption, 80-µA Max I
Low Input Current of 1 µA Max
CC
SN54HC158 . . . FK PACKAGE
(TOP VIEW)
SN54HC158 . . . J OR W PACKAGE
SN74HC158 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
A/B
1A
V
CC
G
1
2
3
4
5
6
7
8
16
15
14
13
3
2
1
20 19
18
4A
4B
NC
1B
1Y
NC
2A
2B
4
5
6
7
8
1B
4A
4B
17
16
1Y
2A
12 4Y
15 4Y
14
9 10 11 12 13
11
10
9
2B
3A
3B
3Y
3A
2Y
GND
NC − No internal connection
description/ordering information
These data selectors/multiplexers contain inverters and drivers that supply full data selection to the four output
gates. A separate strobe (G) input is provided. A 4-bit word is selected from one of two sources and is routed
to the four outputs. The ’HC158 devices’ outputs provide inverted data.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube of 25
Tube of 40
Reel of 2500
Reel of 250
Reel of 2000
Tube of 90
Reel of 2000
Reel of 250
Tube of 25
Tube of 150
Tube of 55
SN74HC158N
SN74HC158N
SN74HC158D
SN74HC158DR
SN74HC158DT
SN74HC158NSR
SN74HC158PW
SN74HC158PWR
SN74HC158PWT
SNJ54HC158J
SNJ54HC158W
SNJ54HC158FK
SOIC − D
SOP − NS
HC158
HC158
−40°C to 85°C
TSSOP − PW
HC158
CDIP − J
CFP − W
LCCC − FK
SNJ54HC158J
SNJ54HC158W
SNJ54HC158FK
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
ꢋ
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ꢍ
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ꢜ
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ꢞ
ꢟ
ꢠ
ꢡ
ꢢ
ꢣ
ꢤ
ꢥ
ꢛ
ꢡ
ꢠ
ꢥ
ꢛ
ꢦ
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ꢥ
ꢞ
ꢏ
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ꢍ
ꢋ
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ꢁ
ꢍ ꢌꢕꢌ ꢝꢥ ꢧ ꢠꢨ ꢣ ꢦ ꢛꢝ ꢠꢥ ꢡ ꢢꢨ ꢨ ꢤ ꢥꢛ ꢦꢞ ꢠꢧ ꢩꢢꢪ ꢫꢝꢡ ꢦꢛ ꢝꢠꢥ ꢟꢦ ꢛꢤ ꢬ ꢏꢨ ꢠꢟꢢ ꢡꢛ ꢞ ꢡꢠ ꢥꢧꢠꢨ ꢣ ꢛꢠ
ꢞ ꢩꢤ ꢡ ꢝ ꢧꢝ ꢡ ꢦ ꢛ ꢝꢠ ꢥꢞ ꢩꢤ ꢨ ꢛ ꢜꢤ ꢛ ꢤ ꢨꢣ ꢞ ꢠꢧ ꢕꢤꢭ ꢦꢞ ꢔꢥꢞ ꢛꢨ ꢢꢣ ꢤꢥꢛ ꢞ ꢞꢛ ꢦꢥ ꢟꢦꢨ ꢟ ꢮ ꢦꢨ ꢨ ꢦ ꢥꢛꢯꢬ
ꢏꢨ ꢠ ꢟꢢꢡ ꢛ ꢝ ꢠꢥ ꢩꢨ ꢠ ꢡ ꢤ ꢞ ꢞ ꢝꢥ ꢰ ꢟ ꢠꢤꢞ ꢥꢠꢛ ꢥꢤ ꢡꢤ ꢞꢞ ꢦꢨ ꢝꢫ ꢯ ꢝꢥꢡ ꢫꢢꢟ ꢤ ꢛꢤ ꢞꢛ ꢝꢥꢰ ꢠꢧ ꢦꢫ ꢫ
ꢩꢦ ꢨ ꢦ ꢣ ꢤ ꢛ ꢤ ꢨ ꢞ ꢬ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢂ ꢇꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢂ ꢇ
ꢊꢋ ꢌ ꢍꢎ ꢋ ꢏꢐ ꢑ ꢒ ꢓꢐꢔ ꢁ ꢑ ꢕ ꢖ ꢆ ꢓꢐꢔ ꢁ ꢑ ꢍꢌꢕꢌ ꢀꢑ ꢐꢑ ꢅꢕꢖ ꢎꢀꢗ ꢘꢋ ꢐꢕ ꢔꢏ ꢐꢑ ꢙꢑꢎꢀ
SCLS296D − JANUARY 1996 − REVISED OCTOBER 2003
FUNCTION TABLE
INPUTS
OUTPUT
Y
DATA
SELECT
A/B
G
A
X
L
B
X
X
X
L
H
L
L
L
L
X
L
H
H
L
L
H
X
X
H
H
H
L
H
logic diagram (positive logic)
2
1A
4
1Y
3
1B
5
2A
7
9
2Y
3Y
6
2B
11
3A
10
3B
14
4A
12
4Y
13
4B
15
G
1
A/B
Pin numbers shown are for the D, J, N, NS, PW, and W packages.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢂꢇ ꢈ ꢀꢁꢉ ꢃꢄ ꢅꢆ ꢂꢇ
ꢊ ꢋꢌꢍ ꢎꢋꢏ ꢐ ꢑ ꢒ ꢓꢐ ꢔꢁꢑ ꢕ ꢖ ꢆ ꢓꢐ ꢔꢁꢑ ꢍꢌꢕꢌ ꢀꢑ ꢐꢑ ꢅꢕꢖ ꢎꢀꢗ ꢘꢋ ꢐꢕ ꢔ ꢏꢐ ꢑꢙ ꢑ ꢎꢀ
SCLS296D − JANUARY 1996 − REVISED OCTOBER 2003
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC158
MIN NOM
SN74HC158
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
ꢏꢎ ꢖ ꢍꢋ ꢅ ꢕ ꢏꢎ ꢑꢱ ꢔꢑꢚ ꢝꢥ ꢧ ꢠꢨ ꢣ ꢦꢛ ꢝꢠꢥ ꢡꢠ ꢥꢡꢤ ꢨ ꢥꢞ ꢩꢨ ꢠꢟ ꢢꢡꢛ ꢞ ꢝꢥ ꢛꢜ ꢤ ꢧꢠ ꢨꢣ ꢦꢛ ꢝꢲ ꢤ ꢠꢨ
ꢟꢤ ꢞ ꢝ ꢰꢥ ꢩꢜ ꢦ ꢞ ꢤ ꢠꢧ ꢟꢤ ꢲ ꢤ ꢫꢠ ꢩꢣꢤ ꢥꢛꢬ ꢅ ꢜꢦ ꢨꢦ ꢡꢛ ꢤꢨ ꢝꢞ ꢛꢝ ꢡ ꢟꢦ ꢛꢦ ꢦꢥ ꢟ ꢠꢛ ꢜꢤꢨ
ꢞ ꢩꢤ ꢡ ꢝ ꢧꢝ ꢡ ꢦ ꢛ ꢝꢠ ꢥꢞ ꢦ ꢨ ꢤ ꢟꢤ ꢞ ꢝ ꢰꢥ ꢰꢠꢦ ꢫꢞ ꢬ ꢕꢤꢭ ꢦꢞ ꢔꢥꢞ ꢛꢨ ꢢꢣ ꢤꢥꢛ ꢞ ꢨ ꢤꢞ ꢤꢨ ꢲ ꢤꢞ ꢛꢜ ꢤ ꢨ ꢝꢰꢜ ꢛ ꢛꢠ
ꢡ ꢜꢦ ꢥ ꢰꢤ ꢠꢨ ꢟꢝ ꢞ ꢡ ꢠꢥ ꢛꢝ ꢥꢢꢤ ꢛ ꢜꢤ ꢞ ꢤ ꢩꢨ ꢠꢟ ꢢꢡꢛ ꢞ ꢮ ꢝꢛꢜ ꢠꢢꢛ ꢥꢠꢛ ꢝꢡꢤ ꢬ
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢂ ꢇꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢂ ꢇ
ꢊꢋ ꢌ ꢍꢎ ꢋ ꢏꢐ ꢑ ꢒ ꢓꢐꢔ ꢁ ꢑ ꢕ ꢖ ꢆ ꢓꢐꢔ ꢁ ꢑ ꢍꢌꢕꢌ ꢀꢑ ꢐꢑ ꢅꢕꢖ ꢎꢀꢗ ꢘꢋ ꢐꢕ ꢔꢏ ꢐꢑ ꢙꢑꢎꢀ
SCLS296D − JANUARY 1996 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC158
SN74HC158
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V
V = V or V
IH
V
OH
OL
I
IL
I
I
= −6 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −7.8 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V = V or V
V
I
IH
IL
I
I
= 6 mA
4.5 V
6 V
0.4
0.33
0.33
1000
80
OL
= 7.8 mA
0.4
OL
I
I
V = V
I
or 0
6 V
1000
160
10
nA
µA
pF
I
CC
V = V
I
or 0,
I
O
= 0
6 V
CC
CC
C
2 V to 6 V
3
10
10
i
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
63
SN54HC158
SN74HC158
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
125
25
MIN
MAX
190
38
MIN
MAX
160
32
2 V
4.5 V
6 V
13
A or B
A/B
G
Y
Y
Y
Y
11
21
32
27
2 V
67
125
25
190
38
160
31
4.5 V
6 V
18
t
pd
ns
14
21
32
27
2 V
59
115
23
170
34
145
29
4.5 V
6 V
16
13
20
29
25
2 V
28
60
90
75
t
t
4.5 V
6 V
8
12
18
15
ns
6
10
15
13
ꢏ ꢎꢖꢍ ꢋꢅ ꢕ ꢏꢎ ꢑꢱꢔ ꢑꢚ ꢝꢥ ꢧ ꢠꢨ ꢣ ꢦ ꢛꢝ ꢠꢥ ꢡ ꢠ ꢥꢡꢤ ꢨ ꢥꢞ ꢩꢨ ꢠꢟ ꢢꢡꢛ ꢞ ꢝꢥ ꢛꢜ ꢤ ꢧꢠ ꢨꢣ ꢦꢛ ꢝꢲꢤ ꢠꢨ
ꢟ ꢤ ꢞ ꢝ ꢰ ꢥ ꢩꢜ ꢦ ꢞ ꢤ ꢠꢧ ꢟꢤ ꢲ ꢤ ꢫ ꢠꢩ ꢣꢤ ꢥ ꢛꢬ ꢅ ꢜꢦ ꢨꢦ ꢡꢛ ꢤꢨ ꢝꢞ ꢛꢝ ꢡ ꢟꢦ ꢛꢦ ꢦꢥ ꢟ ꢠꢛ ꢜꢤꢨ
ꢞ ꢩ ꢤ ꢡ ꢝ ꢧꢝ ꢡ ꢦ ꢛ ꢝꢠ ꢥꢞ ꢦ ꢨ ꢤ ꢟꢤ ꢞ ꢝ ꢰꢥ ꢰꢠ ꢦ ꢫꢞ ꢬ ꢕꢤ ꢭꢦ ꢞ ꢔꢥꢞ ꢛꢨ ꢢꢣ ꢤꢥꢛ ꢞ ꢨ ꢤꢞ ꢤꢨ ꢲ ꢤꢞ ꢛꢜ ꢤ ꢨ ꢝꢰꢜ ꢛ ꢛꢠ
ꢡ ꢜ ꢦ ꢥ ꢰꢤ ꢠꢨ ꢟꢝ ꢞ ꢡ ꢠꢥ ꢛꢝ ꢥꢢ ꢤ ꢛ ꢜꢤ ꢞ ꢤ ꢩꢨ ꢠ ꢟꢢꢡ ꢛꢞ ꢮ ꢝꢛꢜ ꢠꢢꢛ ꢥꢠꢛ ꢝꢡꢤ ꢬ
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢂꢇ ꢈ ꢀꢁꢉ ꢃꢄ ꢅꢆ ꢂꢇ
ꢊ ꢋꢌꢍ ꢎꢋꢏ ꢐ ꢑ ꢒ ꢓꢐ ꢔꢁꢑ ꢕ ꢖ ꢆ ꢓꢐ ꢔꢁꢑ ꢍꢌꢕꢌ ꢀꢑ ꢐꢑ ꢅꢕꢖ ꢎꢀꢗ ꢘꢋ ꢐꢕ ꢔ ꢏꢐ ꢑꢙ ꢑ ꢎꢀ
SCLS296D − JANUARY 1996 − REVISED OCTOBER 2003
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
81
SN54HC158
SN74HC158
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
190
38
MIN
MAX
290
58
MIN
MAX
235
47
2 V
4.5 V
6 V
23
A or B
A/B
G
Y
Y
Y
Y
18
33
49
41
2 V
81
210
42
320
64
260
52
4.5 V
6 V
23
t
pd
ns
18
36
54
45
2 V
91
190
38
290
58
235
47
4.5 V
6 V
24
18
33
49
41
2 V
45
210
42
315
63
265
53
t
t
4.5 V
6 V
17
ns
13
36
53
45
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance
No load
40
pF
pd
PARAMETER MEASUREMENT INFORMATION
V
CC
From Output
Under Test
Test
Point
Input
50%
50%
0 V
C
L
t
t
PLH
PHL
90%
(see Note A)
V
V
OH
In-Phase
Output
90%
t
50%
10%
50%
10%
LOAD CIRCUIT
OL
t
r
f
f
t
t
PLH
PHL
90%
V
CC
V
V
90%
t
90%
OH
Input
50%
10%
50%
10%
90%
t
Out-of-Phase
Output
50%
10%
50%
10%
0 V
OL
t
r
f
t
r
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
C includes probe and test-fixture capacitance.
L
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
D. and t are the same as t
t
.
PLH
PHL pd
Figure 1. Load Circuit and Voltage Waveforms
ꢏꢎ ꢖ ꢍꢋ ꢅ ꢕ ꢏꢎ ꢑꢱ ꢔꢑꢚ ꢝꢥ ꢧ ꢠꢨ ꢣ ꢦꢛ ꢝꢠꢥ ꢡꢠ ꢥꢡꢤ ꢨ ꢥꢞ ꢩꢨ ꢠꢟ ꢢꢡꢛ ꢞ ꢝꢥ ꢛꢜ ꢤ ꢧꢠ ꢨꢣ ꢦꢛ ꢝꢲ ꢤ ꢠꢨ
ꢟꢤ ꢞ ꢝ ꢰꢥ ꢩꢜ ꢦ ꢞ ꢤ ꢠꢧ ꢟꢤ ꢲ ꢤ ꢫꢠ ꢩꢣꢤ ꢥꢛꢬ ꢅ ꢜꢦ ꢨꢦ ꢡꢛ ꢤꢨ ꢝꢞ ꢛꢝ ꢡ ꢟꢦ ꢛꢦ ꢦꢥ ꢟ ꢠꢛ ꢜꢤꢨ
ꢞ ꢩꢤ ꢡ ꢝ ꢧꢝ ꢡ ꢦ ꢛ ꢝꢠ ꢥꢞ ꢦ ꢨ ꢤ ꢟꢤ ꢞ ꢝ ꢰꢥ ꢰꢠꢦ ꢫꢞ ꢬ ꢕꢤꢭ ꢦꢞ ꢔꢥꢞ ꢛꢨ ꢢꢣ ꢤꢥꢛ ꢞ ꢨ ꢤꢞ ꢤꢨ ꢲ ꢤꢞ ꢛꢜ ꢤ ꢨ ꢝꢰꢜ ꢛ ꢛꢠ
ꢡ ꢜꢦ ꢥ ꢰꢤ ꢠꢨ ꢟꢝ ꢞ ꢡ ꢠꢥ ꢛꢝ ꢥꢢꢤ ꢛ ꢜꢤ ꢞ ꢤ ꢩꢨ ꢠꢟ ꢢꢡꢛ ꢞ ꢮ ꢝꢛꢜ ꢠꢢꢛ ꢥꢠꢛ ꢝꢡꢤ ꢬ
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
SN74HC158D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC158DE4
SN74HC158DG4
SN74HC158DR
SOIC
SOIC
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC158DRE4
SN74HC158DRG4
SN74HC158DT
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC158DTE4
SN74HC158DTG4
SN74HC158N
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC158NE4
SN74HC158NSR
SN74HC158NSRE4
SN74HC158NSRG4
SN74HC158PW
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SO
NS
NS
NS
PW
PW
PW
PW
PW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC158PWE4
SN74HC158PWG4
SN74HC158PWR
SN74HC158PWRE4
SN74HC158PWRG4
SN74HC158PWT
SN74HC158PWTE4
SN74HC158PWTG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC158DR
SN74HC158NSR
SN74HC158PWR
SN74HC158PWT
SOIC
SO
D
16
16
16
16
2500
2000
2000
250
330.0
330.0
330.0
330.0
16.4
16.4
12.4
12.4
6.5
8.2
6.9
6.9
10.3
10.5
5.6
2.1
2.5
1.6
1.6
8.0
12.0
8.0
16.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
NS
PW
PW
TSSOP
TSSOP
5.6
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC158DR
SN74HC158NSR
SN74HC158PWR
SN74HC158PWT
SOIC
SO
D
16
16
16
16
2500
2000
2000
250
333.2
367.0
367.0
367.0
345.9
367.0
367.0
367.0
28.6
38.0
35.0
35.0
NS
PW
PW
TSSOP
TSSOP
Pack Materials-Page 2
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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