SN65ELT20DGKR [TI]
5-V TTL-to-Differential PECL Translator; 5 V TTL至差分PECL转换器
| 型号： | SN65ELT20DGKR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5-V TTL-to-Differential PECL Translator |
| 文件： | 总11页 (文件大小：418K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN65ELT20
www.ti.com ............................................................................................................................................................................................ SLLS922–DECEMBER 2008
5-V TTL-to-Differential PECL Translator
1
FEATURES
PINOUT ASSIGNMENT
•
1.25-ns Maximum Propagation Delay
•
Operating Range: VCC = 4.2 V to 5.7 V With
GND = 0 V
D-8, DGK-8 Package
(Top View)
•
•
•
Flow-Through Pinout Enables Easy Layout
Built-In Temperature Compensation
VCC
NC
Q
1
2
8
7
Drop-In Compatible With MC10ELT20,
MC100ELT20
TTL
D
APPLICATIONS
•
Data and Clock Transmission Over Backplane
PECL
•
Signaling Level Conversion for Clock or Data
3
4
6
5
NC
Q
DESCRIPTION
The SN65ELT20 is
a
TTL-to-differential PECL
translator. It operates on a 5-V supply and ground
only. The output is undetermined when the inputs are
left floating. The low output skew makes the device
an ideal solution for clock or data signal translation.
NC
GND
P0065-04
The SN65ELT20 is housed in an industry-standard
SOIC-8 package and is also available in a TSSOP-8
package.
Table 1. Pin Description
PIN
FUNCTION
TTL input
D
Q,Q
VCC
PECL outputs
Positive supply
Ground
GND
ORDERING INFORMATION(1)
PART NUMBER
SN65ELT206D
SN65ELT20DGK
PART MARKING
PACKAGE
LEAD FINISH
NiPdAu
SN65ELT20
SN65ELT20
SOIC
SOIC-TSSOP
NiPdAu
(1) Leaded device options not initially available; contact a sales representative for further details.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN65ELT20
SLLS922–DECEMBER 2008............................................................................................................................................................................................ www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)
PARAMETER
Absolute PECL-mode supply voltage
VIN input voltage
CONDITIONS
VCC (GND = 0 V)
VALUE
UNIT
V
6
6
GND = 0 V; VI ≤ VCC
Continuous
V
50
mA
mA
°C
Output current
Surge
100
Operating temperature range
Storage temperature range
–40 to 85
–65 to 150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
POWER DISSIPATION RATINGS
POWER RATING THERMAL RESISTANCE,
DERATING FACTOR
TA > 25°C
POWER RATING
TA = 85°C
(mW)
CIRCUIT-BOARD
MODEL
JUNCTION-TO-AMBIENT,
PACKAGE
TA < 25°C
(mW)
NO AIRFLOW
(mW/°C)
Low-K
High-K
Low-K
High-K
719
840
469
527
139
119
213
189
7
8
5
5
288
336
188
211
SOIC
SOIC-TSSOP
THERMAL CHARACTERISTICS
PARAMETER
PACKAGE
SOIC
VALUE
UNIT
79
120
98
θJB
Junction-to-board thermal resistance
°C/W
SOIC-TSSOP
SOIC
θJC
Junction-to-case thermal resistance
°C/W
SOIC-TSSOP
74
KEY ATTRIBUTES
CHARACTERISTIC
VALUE
SO-8: Level 1
TSSOP-8: Level 3
UL 94 V-0 at 0.125 in
>4 kV
Moisture sensitivity level
Flammability rating (oxygen index: 28 to 34)
ESD—human body model
ESD—machine model
200 V
ESD—charged-device model
2 kV
Meets or exceeds JEDEC Spec EIA/JESD78 latchup test
2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN65ELT20
SN65ELT20
www.ti.com ............................................................................................................................................................................................ SLLS922–DECEMBER 2008
PECL DC CHARACTERISTICS(1) (VCC = 5 V; GND = 0 V)(2)
–40°C
MIN TYP MAX MIN TYP MAX MIN TYP MAX
9.6 16 10.1 16 10.7 16
25°C
85°C
PARAMETER
UNIT
ICC
Power-supply current
Output HIGH voltage(3)
mA
mV
mV
VOH
VOL
3915 3958 4120 3915 3963 4120 3915 3967 4120
3170 3247 3380 3170 3244 3380 3170 3244 3380
(3)
Output LOW voltage
(1) The device meets these specifications after thermal equilibrium has been established when mounted in a test socket or printed-circuit
board with maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and are not valid simultaneously.
(2) Output parameters vary 1:1 with Vcc.
(3) Outputs are terminated through a 50-Ω resistor to VCC – 2 V.
TTL INPUT DC CHARACTERISTICS(1) (VCC = 4.2 V to 5.7 V; TA = –40°C to 85°C)
PARAMETER
TEST CONDITIONS
VIN = 2.7 V
MIN
TYP
MAX UNIT
IIH
20
µA
20
Input HIGH current
IIH
VIN = VCC
IIL
Input LOW current
VIN = 0.5 V
IIN = –18 mA
–0.6
–1.2
mA
V
VIK
VIH
VIL
Input clamp diode voltage
Input HIGH voltage
Input LOW voltage
2
V
0.8
V
(1) The device meets these specifications after thermal equilibrium has been established when mounted in a test socket or printed-circuit
board with maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and are not valid simultaneously.
AC CHARACTERISTICS(1) (VCC = 4.2 V to 5.7 V; GND = 0 V)
–40°C
25°C
85°C
PARAMETER
UNIT
MIN TYP MAX MIN
TYP MAX MIN TYP
MAX
fMAX
Maximum switching frequency(2) (See
Figure 4.)
400
430
0.5
430
MHz
tPLH
Propagation delay, 1.5 V to 50% (see Figure 2)
Propagation delay, 1.5 V to 50% (see Figure 2)
Random clock jitter (RMS)
0.9
0.7
1.25
1.2
0.9
0.7
1.25
1.2
0.9
0.7
1.25
1.2
ns
ns
ps
tPHL
tJITTER
0.5
0.5
Q-output rise/fall times (20%–80%) (see
Figure 3)
1.5
1
1.5
1
tr/tf
1
1.5
ns
(1) The device meets these specifications after thermal equilibrium has been established when mounted in a test socket or printed-circuit
board with maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and are not valid simultaneously.
(2) Maximum switching frequency is measured at an output amplitude of 300 mVPP
.
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): SN65ELT20
SN65ELT20
SLLS922–DECEMBER 2008............................................................................................................................................................................................ www.ti.com
Typical Termination for Output Driver
ZO = 50 W
P
N
P
N
Driver
ZO = 50 W
Receiver
50 W
50 W
VTT
VTT = VCC – 2 V
S0078-02
Figure 1. Typical Termination for Output Driver
1.5 V
1.5 V
IN
OUT
OUT
tPLH
tPHL
T0405-01
Figure 2. Output Propagation Delay
80%
20%
tr
tf
T0402-01
Figure 3. Output Rise and Fall Times
4
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN65ELT20
SN65ELT20
www.ti.com ............................................................................................................................................................................................ SLLS922–DECEMBER 2008
OUTPUT AMPLITUDE
vs
FREQUENCY
1000
900
800
700
T = 25°C
A
600
500
400
300
200
100
0
T = 85°C
A
T = −40°C
A
V
= 4.2 V
CC
GND = 0 V
V
swing
= 0.8 V−2 V
0
100
200
300
400
500
f − Frequency − MHz
G001
Figure 4.
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): SN65ELT20
PACKAGE OPTION ADDENDUM
www.ti.com
2-Jan-2009
PACKAGING INFORMATION
Orderable Device
SN65ELT20D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65ELT20DGK
SN65ELT20DGKR
SN65ELT20DR
MSOP
MSOP
SOIC
DGK
DGK
D
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN65ELT20DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 29.0
SN65ELT20DR
D
8
2500
Pack Materials-Page 2
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