SN74ABT573APWE4 [TI]
OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUT; 八路透明D类锁存器具有三态输出
| 型号： | SN74ABT573APWE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUT |
| 文件： | 总24页 (文件大小：1148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢂ ꢇ ꢈ ꢉ ꢀꢁꢇ ꢃ ꢄ ꢅꢆ ꢂꢇ ꢈꢄ
ꢊ ꢋꢆꢄꢌ ꢆ ꢍꢄꢁꢀ ꢎꢄꢍꢏ ꢁꢆ ꢐꢑꢆ ꢒꢎ ꢏ ꢌꢄꢆꢋ ꢓ ꢏꢀ
ꢔ ꢕꢆ ꢓ ꢈ ꢑꢀꢆꢄꢆ ꢏ ꢊ ꢖꢆ ꢎ ꢖꢆꢀ
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
D
Typical V
(Output Ground Bounce)
D
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD 17
OLP
<1 V at V
= 5 V, T = 25°C
CC
A
D
High-Drive Outputs (−32-mA I , 64-mA I
)
D
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
OH
OL
D
I
Supports Partial-Power-Down Mode
off
Operation
SN54ABT573 . . . J OR W PACKAGE
SN74ABT573A . . . DB, DW, N, NS,
OR PW PACKAGE
SN74ABT573A . . . RGY PACKAGE
(TOP VIEW)
SN54ABT573 . . . FK PACKAGE
(TOP VIEW)
(TOP VIEW)
1
20
OE
1D
2D
3D
4D
5D
6D
7D
8D
V
CC
1Q
1
2
3
4
5
6
7
8
9
10
20
19
3
2
1
20 19
18
19
18
17
16
15
14
13
12
2
3
4
5
6
7
8
9
1D
2D
3D
4D
5D
6D
7D
8D
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
2Q
3Q
4Q
5Q
6Q
3D
4D
5D
6D
7D
4
5
6
7
8
18 2Q
17
16
15
14
17
16
15
14
13
12
11
3Q
4Q
5Q
6Q
7Q
8Q
LE
9 10 11 12 13
10
11
GND
description/ordering information
These 8-bit latches feature 3-state outputs designed specifically for driving highly capacitive or relatively
low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube
SN74ABT573AN
SN74ABT573AN
AB573A
QFN − RGY
Tape and reel SN74ABT573ARGYR
Tube SN74ABT573ADW
SOIC − DW
ABT573A
Tape and reel SN74ABT573ADWR
Tape and reel SN74ABT573ANSR
Tape and reel SN74ABT573ADBR
SOP − NS
ABT573A
AB573A
−40°C to 85°C
SSOP − DB
Tube
SN74ABT573APW
TSSOP − PW
AB573A
AB573A
Tape and reel SN74ABT573APWR
SN74ABT573AGQNR
VFBGA − GQN
VFBGA − ZQN (Pb-free)
CDIP − J
Tape and reel
SN74ABT573AZQNR
Tube
Tube
Tube
SNJ54ABT573J
SNJ54ABT573W
SNJ54ABT573FK
SNJ54ABT573J
SNJ54ABT573W
SNJ54ABT573FK
CFP − W
−55°C to 125°C
LCCC − FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢎ
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ꢞ
ꢗ
ꢚ
ꢘ
ꢗ
ꢟ
ꢠ
ꢡ
ꢛ
ꢛ
ꢢ
ꢘ
ꢞ
ꢝ
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Copyright 2003, Texas Instruments Incorporated
ꢊ ꢘ ꢣ ꢛ ꢚꢦ ꢡꢠ ꢞꢟ ꢠꢚ ꢜꢣ ꢥꢗ ꢝꢘ ꢞ ꢞꢚ ꢭꢕ ꢌꢑ ꢎꢍ ꢮ ꢑꢈꢯꢂ ꢈꢂꢉ ꢝꢥꢥ ꢣꢝ ꢛ ꢝ ꢜꢢ ꢞꢢꢛ ꢟ ꢝ ꢛ ꢢ ꢞꢢ ꢟꢞꢢ ꢦ
ꢡ ꢘꢥ ꢢꢟꢟ ꢚ ꢞꢨꢢ ꢛ ꢪꢗ ꢟꢢ ꢘ ꢚꢞꢢ ꢦꢧ ꢊ ꢘ ꢝꢥ ꢥ ꢚ ꢞꢨꢢ ꢛ ꢣꢛ ꢚ ꢦꢡꢠ ꢞꢟ ꢉ ꢣꢛ ꢚ ꢦꢡꢠ ꢞꢗꢚ ꢘ
ꢣ ꢛ ꢚꢠꢢ ꢟꢟꢗ ꢘꢬ ꢦ ꢚꢢꢟ ꢘ ꢚꢞ ꢘ ꢢꢠꢢꢟ ꢟꢝꢛ ꢗ ꢥꢫ ꢗ ꢘꢠꢥ ꢡ ꢦꢢ ꢞꢢꢟ ꢞꢗꢘ ꢬ ꢚꢙ ꢝ ꢥꢥ ꢣꢝ ꢛ ꢝ ꢜꢢ ꢞꢢꢛ ꢟ ꢧ
ꢎꢛ ꢚ ꢦꢡꢠ ꢞ ꢟ ꢠ ꢚꢘ ꢙꢚ ꢛ ꢜ ꢞ ꢚ ꢟ ꢣꢢ ꢠ ꢗꢙ ꢗꢠꢝ ꢞꢗ ꢚꢘꢟ ꢣꢢ ꢛ ꢞꢨ ꢢ ꢞꢢ ꢛ ꢜꢟ ꢚꢙ ꢆꢢꢩ ꢝꢟ ꢕꢘꢟ ꢞꢛ ꢡꢜ ꢢꢘꢞ ꢟ
ꢟ ꢞ ꢝ ꢘꢦ ꢝ ꢛꢦ ꢪ ꢝ ꢛꢛ ꢝ ꢘ ꢞꢫꢧ ꢎꢛ ꢚ ꢦꢡꢠ ꢞꢗꢚꢘ ꢣꢛ ꢚꢠ ꢢꢟ ꢟꢗ ꢘꢬ ꢦꢚꢢ ꢟ ꢘꢚꢞ ꢘꢢ ꢠꢢ ꢟꢟ ꢝꢛ ꢗꢥ ꢫ ꢗꢘꢠ ꢥꢡꢦ ꢢ
ꢞ ꢢ ꢟ ꢞꢗ ꢘꢬ ꢚꢙ ꢝ ꢥꢥ ꢣꢝ ꢛ ꢝ ꢜ ꢢ ꢞ ꢢ ꢛ ꢟ ꢧ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢂꢇ ꢈꢉ ꢀꢁꢇ ꢃ ꢄꢅ ꢆꢂ ꢇ ꢈ ꢄ
ꢊꢋ ꢆꢄ ꢌ ꢆ ꢍ ꢄꢁ ꢀꢎꢄꢍ ꢏꢁ ꢆ ꢐꢑꢆ ꢒꢎ ꢏ ꢌꢄꢆꢋ ꢓ ꢏꢀ
ꢔꢕ ꢆ ꢓ ꢈ ꢑꢀꢆꢄꢆ ꢏ ꢊꢖꢆ ꢎꢖ ꢆꢀ
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
description/ordering information (continued)
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus
lines without need for interface or pullup components.
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to V
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
through a pullup
CC
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,
off
off
preventing damaging current backflow through the device when it is powered down.
SN74ABT573A . . . GQN OR ZQN PACKAGE
(TOP VIEW)
terminal assignments
1
2
3
4
1
1D
2
3
4
A
B
C
D
E
A
B
C
D
E
OE
3Q
4D
7Q
8D
V
1Q
2Q
4Q
6Q
8Q
CC
3D
2D
5Q
6D
LE
5D
7D
GND
FUNCTION TABLE
(each latch)
INPUTS
OUTPUT
Q
OE
L
LE
H
H
L
D
H
L
H
L
L
L
X
X
Q
0
H
X
Z
logic diagram (positive logic)
1
OE
11
LE
C1
1D
19
1Q
2
1D
To Seven Other Channels
Pin numbers shown are for the DB, DW, FK, J, N, NS, PW, RGY, and W packages.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢂ ꢇ ꢈ ꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆꢂ ꢇꢈ ꢄ
ꢊ ꢋꢆꢄꢌ ꢆ ꢍꢄꢁꢀ ꢎꢄꢍꢏ ꢁꢆ ꢐꢑꢆ ꢒꢎ ꢏ ꢌꢄꢆꢋ ꢓ ꢏꢀ
ꢔ ꢕꢆ ꢓ ꢈ ꢑꢀꢆꢄꢆ ꢏ ꢊ ꢖꢆ ꢎꢖ ꢆꢀ
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I
Voltage range applied to any output in the high or power-off state, V
. . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
O
Current into any output in the low state, I : SN54ABT573 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
O
SN74ABT573A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA
IK
OK
I
Output clamp current, I
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
O
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
JA
(see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 2): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
(see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
SN54ABT573 SN74ABT573A
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
V
V
V
V
Supply voltage
5.5
5.5
V
V
CC
High-level input voltage
Low-level input voltage
Input voltage
IH
0.8
0.8
V
IL
0
V
0
V
CC
V
I
CC
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
−24
48
−32
64
5
mA
mA
ns/V
°C
OH
OL
∆t/∆v
Outputs enabled
5
T
−55
125
−40
85
A
NOTE 4: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢂꢇ ꢈꢉ ꢀꢁꢇ ꢃ ꢄꢅ ꢆꢂ ꢇ ꢈ ꢄ
ꢊꢋ ꢆꢄ ꢌ ꢆ ꢍ ꢄꢁ ꢀꢎꢄꢍ ꢏꢁ ꢆ ꢐꢑꢆ ꢒꢎ ꢏ ꢌꢄꢆꢋ ꢓ ꢏꢀ
ꢔꢕ ꢆ ꢓ ꢈ ꢑꢀꢆꢄꢆ ꢏ ꢊꢖꢆ ꢎꢖ ꢆꢀ
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54ABT573 SN74ABT573A
A
PARAMETER
TEST CONDITIONS
I = −18 mA
UNIT
†
MIN TYP
MAX
MIN
MAX
MIN
MAX
V
IK
V
V
V
= 4.5 V,
= 4.5 V,
= 5 V,
−1.2
−1.2
−1.2
V
CC
CC
CC
I
I
I
I
I
I
I
= −3 mA
= −3 mA
= −24 mA
= −32 mA
= 48 mA
= 64 mA
2.5
3
2.5
3
2.5
3
OH
OH
OH
OH
OL
OL
V
OH
V
2
2
V
= 4.5 V
= 4.5 V
CC
CC
2*
2
0.55
0.55
1
V
V
V
V
OL
0.55*
0.55
1
100
mV
µA
µA
µA
µA
µA
mA
µA
mA
µA
hys
I
I
I
I
I
I
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 0,
V = V
I CC
or GND
1
I
‡
10
‡
10
‡
10
V
O
V
O
= 2.7 V
= 0.5 V
OZH
OZL
off
‡
−10
‡
−10
‡
−10
V or V ≤ 4.5 V
100
50
100
50
I
O
= 5.5 V,
= 5.5 V,
V
= 5.5 V
Outputs high
50
CEX
O
O
§
V
= 2.5 V
−50 −100 −180
−50 −180
−50
−180
250
30
O
Outputs high
Outputs low
1
24
250
30
250
30
V
= 5.5 V, I = 0,
O
CC
I
CC
V = V
I
or GND
CC
Outputs disabled
0.5
250
250
250
V
= 5.5 V, One input at 3.4 V,
CC
Other inputs at V
¶
1.5
1.5
1.5
mA
∆I
CC
or GND
CC
V = 2.5 V or 0.5 V
C
C
3.5
6.5
pF
pF
i
I
V
O
= 2.5 V or 0.5 V
o
* On products compliant to MIL-PRF-38535, this parameter does not apply.
†
‡
§
¶
All typical values are at V
= 5 V.
CC
This data sheet limit may vary among suppliers.
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V or GND.
CC
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
SN54ABT573
V
T
= 5 V,
= 25°C
CC
A
UNIT
MIN
MAX
MIN
3.3
1.9
1.5
MAX
t
w
t
su
t
h
Pulse duration, LE high
Setup time, data before LE↓
Hold time, data after LE↓
3.3
2.5
2.5
2.5
ns
ns
ns
High
Low
1
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢂ ꢇ ꢈ ꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆꢂ ꢇꢈ ꢄ
ꢊ ꢋꢆꢄꢌ ꢆ ꢍꢄꢁꢀ ꢎꢄꢍꢏ ꢁꢆ ꢐꢑꢆ ꢒꢎ ꢏ ꢌꢄꢆꢋ ꢓ ꢏꢀ
ꢔ ꢕꢆ ꢓ ꢈ ꢑꢀꢆꢄꢆ ꢏ ꢊ ꢖꢆ ꢎꢖ ꢆꢀ
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
SN74ABT573A
V
T
= 5 V,
= 25°C
CC
A
UNIT
MIN
MAX
MIN
3.3
1.9
1.5
MAX
t
Pulse duration, LE high
3.3
1.9
1.5
ns
w
High
Low
Setup time, data before LE↓
Hold time, data after LE↓
t
ns
ns
su
h
†
1.8
†
1.8
t
†
This data-sheet limit may vary among suppliers.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C = 50 pF (unless otherwise noted) (see Figure 1)
L
SN54ABT573
V
T
= 5 V,
FROM
(INPUT)
TO
(OUTPUT)
CC
A
PARAMETER
UNIT
= 25°C
TYP
3.2
MIN
MAX
MIN
1.9
2.2
2.2
3.2
1.2
2.7
2.5
2
MAX
5.4
5.7
6.1
6.7
4.7
6.2
6.4
6
t
t
t
t
t
t
t
t
1.4
1.6
2
6.4
6.7
7.1
7.5
6.2
7.2
7.7
7
PLH
PHL
PLH
PHL
PZH
PZL
PHZ
PLZ
D
Q
Q
Q
Q
ns
ns
ns
ns
4.2
4
LE
OE
OE
5.2
2.8
0.8
2
3.2
4.7
4.9
2.2
1.4
4.2
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C = 50 pF (unless otherwise noted) (see Figure 1)
L
SN74ABT573A
= 5 V,
V
T
FROM
(INPUT)
TO
(OUTPUT)
CC
A
PARAMETER
UNIT
= 25°C
TYP
3.2
MIN
MAX
MIN
MAX
5.4
5.7
6.1
6.7
4.7
6.2
6.4
6
t
t
t
t
t
t
t
t
1.9
2.2
2.2
3.2
1.2
1.9
2.2
2.2
3.2
1.2
5.9
6.2
6.6
7.2
5.2
6.7
PLH
PHL
PLH
PHL
PZH
PZL
PHZ
PLZ
D
Q
Q
Q
Q
ns
ns
ns
ns
4.2
4
LE
OE
OE
5.2
3.2
†
†
2.5
2.5
4.7
†
2.5
2
4.9
2.5
2
7.1
6.5
4.2
†
This data-sheet limit may vary among suppliers.
5
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ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢂꢇ ꢈꢉ ꢀꢁꢇ ꢃ ꢄꢅ ꢆꢂ ꢇ ꢈ ꢄ
ꢊꢋ ꢆꢄ ꢌ ꢆ ꢍ ꢄꢁ ꢀꢎꢄꢍ ꢏꢁ ꢆ ꢐꢑꢆ ꢒꢎ ꢏ ꢌꢄꢆꢋ ꢓ ꢏꢀ
ꢔꢕ ꢆ ꢓ ꢈ ꢑꢀꢆꢄꢆ ꢏ ꢊꢖꢆ ꢎꢖ ꢆꢀ
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
7 V
TEST
S1
Open
S1
500 Ω
From Output
Under Test
t
/t
PLH PHL
Open
7 V
GND
t
/t
PLZ PZL
C
= 50 pF
t
/t
Open
L
PHZ PZH
500 Ω
(see Note A)
3 V
0 V
LOAD CIRCUIT
Timing Input
Data Input
1.5 V
t
w
t
t
h
su
3 V
0 V
3 V
0 V
Input
1.5 V
1.5 V
1.5 V
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3 V
0 V
3 V
0 V
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
Input
t
t
t
t
t
PZL
PLZ
PLH
PHL
PHL
Output
Waveform 1
S1 at 7 V
3.5 V
V
V
OH
1.5 V
1.5 V
1.5 V
1.5 V
t
Output
V
V
+ 0.3 V
OL
V
OL
OL
(see Note B)
t
t
PZH
PHZ
− 0.3 V
PLH
Output
Waveform 2
S1 at Open
(see Note B)
V
OH
V
V
OH
OH
1.5 V
1.5 V
Output
≈0 V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CFP
Drawing
5962-9321901Q2A
5962-9321901QRA
5962-9321901QSA
SN74ABT573ADBLE
SN74ABT573ADBR
ACTIVE
ACTIVE
FK
J
20
20
20
20
20
1
1
1
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
Call TI
N / A for Pkg Type
N / A for Pkg Type
Call TI
ACTIVE
W
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ABT573ADBRE4
SN74ABT573ADBRG4
SN74ABT573ADW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
DB
DB
20
20
20
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DW
DW
GQN
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ABT573ADWE4
SN74ABT573ADWG4
SN74ABT573ADWR
SN74ABT573ADWRE4
SN74ABT573ADWRG4
SN74ABT573AGQNR
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74ABT573AN
SN74ABT573ANE4
SN74ABT573ANSR
SN74ABT573ANSRE4
SN74ABT573ANSRG4
SN74ABT573APW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
PDIP
SO
N
20
20
20
20
20
20
20
20
20
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
N
Pb-Free
(RoHS)
NS
NS
NS
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ABT573APWE4
SN74ABT573APWG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ABT573APWLE
SN74ABT573APWR
OBSOLETE TSSOP
PW
PW
20
20
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ABT573APWRE4
SN74ABT573APWRG4
PW
PW
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2008
Orderable Device
SN74ABT573ARGYR
SN74ABT573ARGYRG4
SN74ABT573AZQNR
Status (1)
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
QFN
RGY
20
20
20
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
QFN
RGY
ZQN
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SNJ54ABT573FK
SNJ54ABT573J
SNJ54ABT573W
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
20
20
1
1
1
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
Call TI
N / A for Pkg Type
N / A for Pkg Type
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74ABT573ADBR
SN74ABT573ADWR
SN74ABT573AGQNR
SSOP
SOIC
DB
DW
20
20
20
2000
2000
1000
330.0
330.0
330.0
16.4
24.4
12.4
8.2
10.8
3.3
7.5
13.0
4.3
2.5
2.7
1.5
12.0
12.0
8.0
16.0
24.0
12.0
Q1
Q1
Q1
BGA MI
CROSTA
R JUNI
OR
GQN
SN74ABT573APWR
SN74ABT573ARGYR
SN74ABT573AZQNR
TSSOP
QFN
PW
RGY
ZQN
20
20
20
2000
1000
1000
330.0
180.0
330.0
16.4
12.4
12.4
6.95
3.8
7.1
4.8
4.3
1.6
1.6
1.5
8.0
8.0
8.0
16.0
12.0
12.0
Q1
Q1
Q1
BGA MI
CROSTA
R JUNI
OR
3.3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74ABT573ADBR
SN74ABT573ADWR
SN74ABT573AGQNR
SSOP
SOIC
DB
DW
20
20
20
2000
2000
1000
346.0
346.0
346.0
346.0
346.0
346.0
33.0
41.0
29.0
BGA MICROSTAR
JUNIOR
GQN
SN74ABT573APWR
SN74ABT573ARGYR
SN74ABT573AZQNR
TSSOP
QFN
PW
RGY
ZQN
20
20
20
2000
1000
1000
346.0
190.5
346.0
346.0
212.7
346.0
33.0
31.8
29.0
BGA MICROSTAR
JUNIOR
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
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Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
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