SN74AUC2G240YEPR [TI]
AUC SERIES, 1-BIT DRIVER, INVERTED OUTPUT, PBGA8, DSBGA-8;
| 型号： | SN74AUC2G240YEPR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AUC SERIES, 1-BIT DRIVER, INVERTED OUTPUT, PBGA8, DSBGA-8 驱动 输出元件 |
| 文件： | 总11页 (文件大小：292K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74AUC2G240
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES534B–DECEMBER 2003–REVISED SEPTEMBER 2006
FEATURES
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
•
•
±8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
•
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
•
Ioff Supports Partial-Power-Down Mode
Operation
– 1000-V Charged-Device Model (C101)
•
•
•
Sub-1-V Operable
Max tpd of 1.8 ns at 1.8 V
Low Power Consumption, 10 µA at 1.8 V
DCT PACKAGE
(TOP VIEW)
DCU PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
4 5
GND
2Y
2A
VCC
1
2
3
4
8
7
6
5
1OE
VCC
2OE
1Y
1
2
3
4
8
7
6
5
1OE
1A
3 6
2 7
1 8
1Y
1A
2Y
2OE
1Y
1A
2OE
VCC
1OE
2A
GND
2Y
GND
2A
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The SN74AUC2G240 is designed specifically to improve the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
This device is organized as two 1-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low,
the device passes data from the A input to the Y output. When OE is high, the outputs are in the
high-impedance state.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74AUC2G240
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES534B–DECEMBER 2003–REVISED SEPTEMBER 2006
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Reel of 3000
Reel of 3000
SN74AUC2G240YEPR
_ _ _UK_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74AUC2G240YZPR
–40°C to 85°C
SSOP – DCT
Reel of 3000
Reel of 3000
SN74AUC2G240DCTR
SN74AUC2G240DCUR
U40_ _ _
UK_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of
Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.
FUNCTION TABLE
(EACH BUFFER)
INPUTS
OUTPUT
Y
OE
L
A
H
L
L
H
Z
L
H
X
LOGIC DIAGRAM (POSITIVE LOGIC)
1
1OE
6
3
2
1Y
2Y
1A
7
5
2OE
2A
2
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SN74AUC2G240
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES534B–DECEMBER 2003–REVISED SEPTEMBER 2006
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX
3.6
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
Output voltage range(2)
3.6
V
VO
VO
IIK
3.6
V
–0.5 VCC + 0.5
V
Input clamp current
VI < 0
–50
–50
±20
±100
220
227
102
mA
mA
mA
mA
IOK
IO
Output clamp current
VO < 0
Continuous output current
Continuous current through VCC or GND
DCT package
θJA
Package thermal impedance(3)
DCU package
°C/W
°C
YEP/YZP package
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
MIN
0.8
MAX UNIT
VCC
Supply voltage
2.7
V
VCC = 0.8 V
VCC
VIH
High-level input voltage
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 0.8 V
0.65 × VCC
1.7
V
0
VIL
Low-level input voltage
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
0.35 × VCC
V
0.7
3.6
VCC
3.6
–0.7
–3
–5
–8
–9
0.7
3
VI
Input voltage
0
0
0
V
V
Active state
VO
Output voltage
3-state
VCC = 0.8 V
VCC = 1.1 V
IOH
High-level output current
Low-level output current
VCC = 1.4 V
mA
mA
VCC = 1.65 V
VCC = 2.3 V
VCC = 0.8 V
VCC = 1.1 V
IOL
VCC = 1.4 V
5
VCC = 1.65 V
8
VCC = 2.3 V
9
VCC = 0.8 V to 1.65 V(2)
VCC = 1.65 V to 1.95 V(3)
VCC = 2.3 V to 2.7 V(3)
20
20
20
85
∆t/∆v
Input transition rise or fall rate
Operating free-air temperature
ns/V
°C
TA
–40
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(2) The data was taken at CL = 15 pF, RL = 2 kΩ (see Figure 1).
(3) The data was taken at CL = 30 pF, RL = 500 Ω (see Figure 1).
3
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SN74AUC2G240
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES534B–DECEMBER 2003–REVISED SEPTEMBER 2006
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
0.8 V to 2.7 V
0.8 V
MIN
TYP(1) MAX UNIT
IOH = –100 µA
IOH = –0.7 mA
IOH = –3 mA
IOH = –5 mA
IOH = –8 mA
IOH = –9 mA
IOL = 100 µA
IOL = 0.7 mA
IOL = 3 mA
VCC – 0.1
0.55
1.1 V
0.8
1
VOH
V
1.4 V
1.65 V
2.3 V
1.2
1.8
0.8 V to 2.7 V
0.8 V
0.2
0.25
1.1 V
0.3
V
VOL
IOL = 5 mA
1.4 V
0.4
IOL = 8 mA
1.65 V
2.3 V
0.45
0.6
IOL = 9 mA
II
A or OE inputs
VI = VCC or GND
VI or VO = 2.7 V
VO = VCC or GND
VI = VCC or GND,
VI = VCC or GND
VO = VCC or GND
0 to 2.7 V
0
±5
±10
±10
10
µA
µA
µA
µA
pF
pF
Ioff
IOZ
ICC
Ci
2.7 V
IO = 0
0.8 V to 2.7 V
2.5 V
2.5
5.5
Co
2.5 V
(1) All typical values are at TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
VCC = 1.2 V VCC = 1.5 V
± 0.1 V ± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 0.8 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
TYP
4.5
5.6
5.8
MIN MAX MIN MAX MIN TYP MAX MIN MAX
tpd
ten
tdis
A
Y
Y
Y
0.9
0.9
1.9
3.3
4.1
4.8
0.7
0.7
1.5
2.2
2.5
3.8
0.5
0.6
1.8
1.2
1.4
2.8
1.8
2.1
4
0.5
0.6
1.4
1.3
1.5
2.9
ns
ns
ns
OE
OE
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
TYP
1.5
1.7
1.8
MAX
2.5
MIN
0.6
0.8
0.8
MAX
1.7
tpd
ten
tdis
A
Y
Y
Y
0.7
0.9
1.5
ns
ns
ns
OE
OE
3.1
2.1
3.7
1.9
Operating Characteristics
TA = 25°C
VCC = 0.8 V
TYP
VCC = 1.2 V VCC = 1.5 V VCC = 1.8 V
VCC = 2.5 V
TYP
TEST
CONDITIONS
PARAMETER
UNIT
TYP
TYP
TYP
Power dissipation
capacitance
Cpd
f = 10 MHz
15
15
15
15
17
pF
4
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SN74AUC2G240
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES534B–DECEMBER 2003–REVISED SEPTEMBER 2006
PARAMETER MEASUREMENT INFORMATION
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
2 × VCC
Open
GND
S1
RL
From Output
Under Test
CL
V
RL
VCC
CL
(see Note A)
D
RL
0.8 V
2 kW
2 kW
2 kW
2 kW
2 kW
1 kW
500 W
0.1 V
0.1 V
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
0.1 V
LOAD CIRCUIT
0.15 V
0.15 V
0.15 V
0.15 V
VCC
Timing Input
VCC/2
0 V
tW
tsu
th
VCC
VCC
0 V
Input
VCC/2
VCC/2
Data Input
VCC/2
VCC/2
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
0 V
VCC
0 V
Output
Control
VCC/2
VCC/2
Input
VCC/2
VCC/2
tPZL
tPLZ
tPLH
tPHL
VCC/2
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
VOH
VOL
VCC
VOL
VCC/2
VCC/2
Output
Output
VOL + V
D
tPHL
tPLH
tPZH
tPHZ
VOH
VOL
Output
Waveform 2
S1 at GND
VOH
VOH – V
D
VCC/2
VCC/2
VCC/2
»0 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W,
slew rate ³ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
5
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
74AUC2G240DCTRE4
74AUC2G240DCURE4
SN74AUC2G240DCTR
SN74AUC2G240DCUR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SM8
DCT
8
8
8
8
3000
Pb-Free
(RoHS)
CU NIPDAU Level-1-260C-UNLIM
US8
SM8
US8
DCU
DCT
DCU
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000
Pb-Free
(RoHS)
CU NIPDAU Level-1-260C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AUC2G240YEPR
SN74AUC2G240YZPR
NRND
WCSP
WCSP
YEP
YZP
8
8
3000
TBD
SNPB
Level-1-260C-UNLIM
Level-1-260C-UNLIM
ACTIVE
3000 Green (RoHS &
no Sb/Br)
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
M
0,13
0,65
8
5
0,15 NOM
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
0,25
1
4
0° – 8°
0,60
0,20
3,15
2,75
1,30 MAX
Seating Plane
0,10
0,10
0,00
4188781/C 09/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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