SN74CBTD3305CDRG4 [TI]
CBT/FST/QS/5C/B SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, GREEN, PLASTIC, MS-0012AA, SOIC-8;型号: | SN74CBTD3305CDRG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | CBT/FST/QS/5C/B SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, GREEN, PLASTIC, MS-0012AA, SOIC-8 驱动 光电二极管 输出元件 逻辑集成电路 |
文件: | 总16页 (文件大小:804K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74CBTD3305C
DUAL FET BUS SWITCH WITH LEVEL SHIFTING
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
SCDS126A − SEPTEMBER 2003 − REVISED OCTOBER 2003
D
D
D
D
D
Undershoot Protection for Off-Isolation on
A and B Ports Up To −2 V
D
D
D
D
D
Data I/Os Support 0 to 5-V Signaling Levels
(0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
Integrated Diode to V Provides 5-V Input
Control Inputs Can be Driven by TTL or
5-V/3.3-V CMOS Outputs
CC
Down To 3.3-V Output Level Shift
Bidirectional Data Flow, With Near-Zero
Propagation Delay
I
off
Supports Partial-Power-Down Mode
Operation
Low ON-State Resistance (r
)
on
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Characteristics (r = 3 Ω Typical)
on
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
(C
= 5 pF Typical)
io(OFF)
− 1000-V Charged-Device Model (C101)
D
D
Data and Control Inputs Provide
Undershoot Clamp Diodes
D
Supports Both Digital and Analog
Applications: USB Interface, Memory
Interleaving, Bus Isolation, Low-Distortion
Signal Gating
V
CC
Operating Range From 4.5 V to 5.5 V
D OR PW PACKAGE
(TOP VIEW)
1
2
3
4
1OE
1A
1B
8
7
6
5
VCC
2OE
2B
GND
2A
description/ordering information
The SN74CBTD3305C is a high-speed TTL-compatible FET bus switch with low ON-state resistance (r ),
on
allowing for minimal propagation delay. This device features an integrated diode in series with V to provide
CC
level shifting for 5-V input down to 3.3-V output levels. Active Undershoot-Protection Circuitry on the A and B
ports of the SN74CBTD3305C provides protection for undershoot up to −2 V by sensing an undershoot event
and ensuring that the switch remains in the proper OFF state.
The SN74CBTD3305C is organized as two 1-bit bus switches with separate output-enable (1OE, 2OE) inputs.
It can be used as two 1-bit bus switches or as one 2-bit bus switch. When OE is high, the associated 1-bit bus
switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When
OE is low, the associated 1-bit bus switch is OFF, and a high-impedance state exists between the A and B ports.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
Tube
SN74CBTD3305CD
SOIC − D
CC305C
Tape and reel SN74CBTD3305CDR
Tube SN74CBTD3305CPW
Tape and reel SN74CBTD3305CPWR
−40°C to 85°C
TSSOP − PW
CC305C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBTD3305C
DUAL FET BUS SWITCH WITH LEVEL SHIFTING
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
SCDS126A − SEPTEMBER 2003 − REVISED OCTOBER 2003
description/ordering information (continued)
This device is fully specified for partial-power-down applications using I . The I feature ensures that
off
off
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the
driver.
FUNCTION TABLE
(each bus switch)
INPUT INPUT/OUTPUT
FUNCTION
OE
H
A
B
Z
A port = B port
Disconnect
L
logic diagram (positive logic)
2
1
3
1A
1B
SW
SW
1OE
5
7
6
2A
2B
2OE
simplified schematic, each FET switch (SW)
A
B
Undershoot
Protection Circuit
†
EN
†
EN is the internal enable signal applied to the switch.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBTD3305C
DUAL FET BUS SWITCH WITH LEVEL SHIFTING
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
SCDS126A − SEPTEMBER 2003 − REVISED OCTOBER 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Control input voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
IN
Switch I/O voltage range, V (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I/O
Control input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
IK
IN
I/O port clamp current, I
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
I/O
I/OK
ON-state switch current, I (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
I/O
Continuous current through V or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
CC
Package thermal impedance, θ (see Note 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
JA
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Storage temperature range, T
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. V and V are used to denote specific conditions for V .
I
O
I/O
4. I and I are used to denote specific conditions for I .
I
O
I/O
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Notes 6 and 7)
MIN
4.5
2
MAX
5.5
5.5
0.8
5.5
85
UNIT
V
V
V
V
V
T
Supply voltage
CC
High-level control input voltage
Low-level control input voltage
Data input/output voltage
Operating free-air temperature
V
IH
0
V
IL
0
V
I/O
−40
°C
A
NOTES: 6. All unused control inputs of the device must be held at V or GND to ensure proper device operation. Refer to the TI application
CC
report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
7. In applications with fast edge rates, multiple outputs switching, and operating at high frequencies, the output may have little or no
level-shifting effect.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBTD3305C
DUAL FET BUS SWITCH WITH LEVEL SHIFTING
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
SCDS126A − SEPTEMBER 2003 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
PARAMETER
Control inputs
TEST CONDITIONS
MIN TYP
MAX
UNIT
V
V
V
V
= 4.5 V,
= 5 V,
I = −18 mA
IN
−1.8
V
IK
CC
0 mA > I ≥ −50 mA,
I
Data inputs
Switch OFF
−2
V
IKU
OH
CC
V
IN
= V or GND,
CC
V
I
See Figures 4 and 5
Control inputs
V
V
V
V
= 5.5 V,
= 5.5 V,
= 0,
V
V
= V or GND
1
10
μA
μA
μA
mA
IN
CC
CC
CC
CC
CC
IN
CC
= 0 to 5.5 V,
Switch OFF,
O
‡
I
OZ
V = 0,
I
V = V or GND
IN CC
I
I
V
O
= 0 to 5.5 V,
V = 0
I
10
off
CC
I
I/O
= 0,
= 5.5 V,
Switch ON or OFF
1.5
2.5
V
IN
= V or GND,
CC
§
ΔI
CC
Control inputs
Control inputs
V
V
V
V
= 5.5 V,
One input at 3.4 V,
Other inputs at V or GND
mA
pF
pF
pF
CC
C
C
C
= 3 V or 0
= 3 V or 0,
= 3 V or 0,
3.5
in
IN
Switch OFF,
Switch ON,
V
V
= V or GND
5
io(OFF)
io(ON)
I/O
IN
CC
= V or GND
12.5
I/O
IN
CC
I
O
I
O
I
O
= 64 mA
= 30 mA
= −15 mA
3
3
8
6
6
V = 0
I
¶
V
CC
= 4.5 V
Ω
r
on
V = 2.4 V,
I
20
V
and I refer to control inputs. V , V , I , and I refer to data pins.
IN I O I O
IN
†
All typical values are at V = 5 V (unless otherwise noted), T = 25°C.
CC
A
‡
§
¶
For I/O ports, the parameter I includes the input leakage current.
OZ
This is the increase in supply current for each input that is at the specified voltage level, rather than V or GND.
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
CC
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 3)
V
= 5 V
0.5 V
CC
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
#
t
t
t
A or B
OE
B or A
A or B
A or B
0.15
4.7
ns
ns
ns
pd
en
dis
1.5
1.5
5.3
OE
#
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance,
when driven by an ideal voltage source (zero output impedance).
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBTD3305C
DUAL FET BUS SWITCH WITH LEVEL SHIFTING
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
SCDS126A − SEPTEMBER 2003 − REVISED OCTOBER 2003
undershoot characteristics (see Figures 1 and 2)
†
PARAMETER
TEST CONDITIONS
Switch OFF,
MIN
TYP
−0.3
MAX
UNIT
V
OUTU
V
CC
= 5.5 V,
V
IN
= V or GND
2
V
V
CC
OH
†
All typical values are at V = 5 V (unless otherwise noted), T = 25°C.
CC
A
V
CC
11 V
100 kΩ
5.5 V
Input
(Open
Socket)
Input
Generator
90 %
90 %
10 %
50 Ω
2 ns 2 ns
20 ns
DUT
Ax
Bx
10 %
−2 V
100 kΩ
10 pF
V
S
Output
V
OH
V
OH
(V
OUTU
)
− 0.3
Figure 1. Device Test Setup
Figure 2. Transient Input Voltage (V ) and Output
I
Voltage (V
) Waveforms
OUTU
(Switch OFF)
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBTD3305C
DUAL FET BUS SWITCH WITH LEVEL SHIFTING
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
SCDS126A − SEPTEMBER 2003 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
FOR LEVEL SHIFTER
V
CC
Input Generator
V
IN
50 Ω
50 Ω
V
G1
TEST CIRCUIT
DUT
7 V
Open
GND
Input Generator
50 Ω
S1
R
V
V
O
L
I
50 Ω
V
G2
C
R
L
L
(see Note A)
S1
V
I
V
Δ
C
R
V
CC
TEST
L
L
t
pd(s)
5 V 0.5 V
5 V 0.5 V
5 V 0.5 V
Open
7 V
500 Ω
500 Ω
500 Ω
V
CC
or GND
50 pF
50 pF
50 pF
t
/t
PLZ PZL
GND
0.3 V
0.3 V
t
/t
PHZ PZH
Open
V
CC
Output
Control
(V
3 V
0 V
1.5 V
1.5 V
)
IN
t
t
t
PLZ
PZL
PZH
Output
Waveform 1
S1 at 7 V
3.5 V
Output
Control
3 V
0 V
1.5 V
1.5 V
V
V
+ V
Δ
1.5 V
1.5 V
OL
(V
IN
)
V
OL
(see Note B)
t
PHZ
t
t
PLH
PHL
Output
Waveform 2
S1 at Open
(see Note B)
V
OH
V
V
OH
− V
Δ
OH
Output
1.5 V
1.5 V
0 V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (t
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
)
pd(s)
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
are the same as t
are the same as t
.
.
PLZ
PZL
PLH
PHZ
dis
PZH
en
. The tpd propagation delay is the calculated RC time constant of the typical ON-state
PHL
pd(s)
resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Test Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBTD3305C
DUAL FET BUS SWITCH WITH LEVEL SHIFTING
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
SCDS126A − SEPTEMBER 2003 − REVISED OCTOBER 2003
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE HIGH
OUTPUT VOLTAGE HIGH
vs
vs
SUPPLY VOLTAGE
SUPPLY VOLTAGE
4
3.75
3.5
4
3.75
3.5
T
= 85°C
T = 25°C
A
V = V
I CC
A
V = V
I
CC
100 μA
100 μA
6 mA
12 mA
6 mA
12 mA
3.25
3.25
24 mA
24 mA
3
3
2.75
2.75
2.5
2.25
2
2.5
2.25
2
1.75
1.5
1.75
1.5
4.5
4.75
5
5.25
5.5
5.75
4.5
4.75
5
5.25
5.5
5.75
V
CC
− Supply Voltage − V
V
CC
− Supply Voltage − V
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
4
3.75
3.5
T
= 0°C
A
V = V
I
CC
100 μA
3.25
6 mA
12 mA
3
24 mA
2.75
2.5
2.25
2
1.75
1.5
4.5
4.75
5
5.25
5.5
5.75
V
CC
− Supply Voltage − V
Figure 4. V Values
OH
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBTD3305C
DUAL FET BUS SWITCH WITH LEVEL SHIFTING
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
SCDS126A − SEPTEMBER 2003 − REVISED OCTOBER 2003
TYPICAL CHARACTERISTICS (continued)
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
3.5
V
T
= 5 V
= 25°C
CC
100 μA
6 mA
12 mA
A
3
24 mA
2.5
2
1.5
1
5
0
0
1
2
3
4
5
V − Input Voltage − V
I
Figure 5. Data Output Voltage vs Data Input Voltage
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
SN74CBTD3305CD
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
CC305C
SN74CBTD3305CDE4
SN74CBTD3305CDG4
SN74CBTD3305CDR
SN74CBTD3305CDRE4
SN74CBTD3305CDRG4
SN74CBTD3305CPW
SN74CBTD3305CPWE4
SN74CBTD3305CPWG4
SN74CBTD3305CPWR
SN74CBTD3305CPWRE4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
75
Green (RoHS
& no Sb/Br)
CC305C
CC305C
CC305C
CC305C
CC305C
CC305C
CC305C
CC305C
CC305C
SOIC
75
Green (RoHS
& no Sb/Br)
SOIC
D
2500
2500
2500
150
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
Green (RoHS
& no Sb/Br)
150
Green (RoHS
& no Sb/Br)
150
Green (RoHS
& no Sb/Br)
2000
Green (RoHS
& no Sb/Br)
TBD
SN74CBTD3305CPWRG3
SN74CBTD3305CPWRG4
PREVIEW
TSSOP
TSSOP
PW
PW
8
8
2000
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 85
-40 to 85
OBSOLETE
CC305C
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74CBTD3305CDR
SOIC
D
8
8
8
2500
2000
2000
330.0
330.0
330.0
12.4
12.4
12.4
6.4
7.0
7.0
5.2
3.6
3.6
2.1
1.6
1.6
8.0
8.0
8.0
12.0
12.0
12.0
Q1
Q1
Q1
SN74CBTD3305CPWR TSSOP
SN74CBTD3305CPWR TSSOP
PW
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74CBTD3305CDR
SN74CBTD3305CPWR
SN74CBTD3305CPWR
SOIC
D
8
8
8
2500
2000
2000
340.5
367.0
364.0
338.1
367.0
364.0
20.6
35.0
27.0
TSSOP
TSSOP
PW
PW
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号:
SN74CBTD3305CPW
DUAL FET BUS SWITCH WITH LEVEL SHIFTING 5-V BUS SWITCH WITH - 2-V UNDERSHOOT PROTECTION
TI
SN74CBTD3305CPWG4
CBT/FST/QS/5C/B SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, GREEN, PLASTIC, TSSOP-8
TI
SN74CBTD3305CPWR
DUAL FET BUS SWITCH WITH LEVEL SHIFTING 5-V BUS SWITCH WITH - 2-V UNDERSHOOT PROTECTION
TI
SN74CBTD3305CPWRE4
Dual FET Bus Switch with -2 V Undershoot-Protection and Level Shifting 8-TSSOP -40 to 85
TI
SN74CBTD3306C
DUAL FET BUS SWITCH WITH LEVEL SHIFTING 5-V BUS SWITCH WITH-2-V UNDERSHOOT PROTECTION
TI
SN74CBTD3306CD
DUAL FET BUS SWITCH WITH LEVEL SHIFTING 5-V BUS SWITCH WITH-2-V UNDERSHOOT PROTECTION
TI
SN74CBTD3306CDG4
CBT/FST/QS/5C/B SERIES, 2-BIT DRIVER, TRUE OUTPUT, PDSO8, GREEN, PLASTIC, SOIC-8
TI
SN74CBTD3306CDR
DUAL FET BUS SWITCH WITH LEVEL SHIFTING 5-V BUS SWITCH WITH-2-V UNDERSHOOT PROTECTION
TI
SN74CBTD3306CDRG4
CBT/FST/QS/5C/B SERIES, 2-BIT DRIVER, TRUE OUTPUT, PDSO8, GREEN, PLASTIC, SOIC-8
TI
SN74CBTD3306CPW
DUAL FET BUS SWITCH WITH LEVEL SHIFTING 5-V BUS SWITCH WITH-2-V UNDERSHOOT PROTECTION
TI
SN74CBTD3306CPWE4
CBT/FST/QS/5C/B SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, GREEN, PLASTIC, TSSOP-8
TI
©2020 ICPDF网 联系我们和版权申明