SN74HC373PWR [TI]
OCTAL TRANSPARENT D-TYPE LATCHES; 八路透明D类锁存器
| 型号： | SN74HC373PWR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | OCTAL TRANSPARENT D-TYPE LATCHES |
| 文件： | 总19页 (文件大小：724K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀ
ꢁ
ꢏ
ꢂ
ꢁ
ꢄ
ꢃ
ꢊ
ꢄ
ꢐ
ꢆ
ꢅ
ꢑ
ꢆ
ꢊ
ꢊ
ꢇ
ꢒ
ꢋ
ꢆ
ꢎ
ꢊ
ꢈ
ꢀ
ꢏ
ꢏ
ꢁ
ꢌ
ꢉ
ꢇ
ꢋ
ꢕ
ꢃ
ꢊ
ꢊ
ꢄ
ꢅ
ꢎ
ꢅ
ꢄ
ꢕ
ꢆ
ꢏ
ꢊ
ꢇ
ꢆ
ꢀ
ꢀ
ꢉ
ꢅ
ꢊ
ꢋ
ꢌ
ꢊ
ꢍ
ꢋ
ꢁ
ꢀ
ꢎ
ꢋ
ꢍ
ꢓ
ꢔ
ꢊ
ꢑ
ꢀ
SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003
D
D
Wide Operating Voltage Range of 2 V to 6 V
D
6-mA Output Drive at 5 V
High-Current 3-State True Outputs Can
Drive Up To 15 LSTTL Loads
D
D
Low Input Current of 1 µA Max
Eight High-Current Latches in a Single
Package
D
Low Power Consumption, 80-µA Max I
CC
D
Typical t = 13 ns
pd
D
Full Parallel Access for Loading
SN54HC373 . . . J OR W PACKAGE
SN74HC373 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
SN54HC373 . . . FK PACKAGE
(TOP VIEW)
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
CC
8Q
8D
1
2
3
4
5
6
7
8
9
20
19
18
3
2
1
20 19
18
8D
7D
7Q
2D
2Q
3Q
3D
4D
4
5
6
7
8
17
16
17 7D
16 7Q
15 6Q
14 6D
13 5D
12 5Q
11 LE
15 6Q
14
9 10 11 12 13
6D
GND 10
description/ordering information
These 8-bit latches feature 3-state outputs designed specifically for driving highly capacitive or relatively
low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers.
The eight latches of the ’HC373 devices are transparent D-type latches. While the latch-enable (LE) input is
high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels that
were set up at the D inputs.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube of 20
Tube of 25
Reel of 2000
Reel of 2000
Reel of 2000
Tube of 70
Reel of 2000
Reel of 250
Tube of 20
Tube of 85
Tube of 55
SN74HC373N
SN74HC373N
SN74HC373DW
SN74HC373DWR
SN74HC373NSR
SN74HC373DBR
SN74HC373PW
SN74HC373PWR
SN74HC373PWT
SNJ54HC373J
SOIC − DW
HC373
SOP − NS
HC373
HC373
−40°C to 85°C
SSOP − DB
TSSOP − PW
HC373
CDIP − J
CFP − W
LCCC − FK
SNJ54HC373J
SNJ54HC373W
SNJ54HC373FK
−55°C to 125°C
SNJ54HC373W
SNJ54HC373FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢎ
ꢎ
ꢍ
ꢉ
ꢥ
ꢐ
ꢠ
ꢜ
ꢕ
ꢅ
ꢞ
ꢊ
ꢟ
ꢩ
ꢔ
ꢙ
ꢉ
ꢗ
ꢚ
ꢁ
ꢘ
ꢐ
ꢋ
ꢊ
ꢋ
ꢖ
ꢗ
ꢡ
ꢠ
ꢘ
ꢙ
ꢟ
ꢟ
ꢚ
ꢛ
ꢜ
ꢜ
ꢗ
ꢝ
ꢝ
ꢖ
ꢖ
ꢢ
ꢙ
ꢙ
ꢚ
ꢗ
ꢗ
ꢙ
ꢖ
ꢞ
ꢞ
ꢢ
ꢞ
ꢟ
ꢠ
ꢚ
ꢚ
ꢡ
ꢡ
ꢗ
ꢝ
ꢜ
ꢛ
ꢞ
ꢞ
ꢞ
ꢗ
ꢙ
ꢘ
ꢢ
ꢠ
ꢣ
ꢞ
ꢞ
ꢤ
ꢖ
ꢟ
ꢜ
ꢞ
ꢝ
ꢖ
ꢝ
ꢪ
ꢙ
ꢚ
ꢗ
ꢠ
ꢥ
ꢜ
ꢗ
ꢥ
ꢝ
ꢝ
ꢡ
ꢞ
ꢡ
ꢦ
Copyright 2003, Texas Instruments Incorporated
ꢉ ꢗ ꢢ ꢚ ꢙꢥ ꢠꢟ ꢝꢞ ꢟꢙ ꢛꢢ ꢤꢖ ꢜꢗ ꢝ ꢝꢙ ꢬꢔ ꢌꢑ ꢎꢍ ꢭ ꢑꢆꢮꢂ ꢆꢂꢈ ꢜꢤꢤ ꢢꢜ ꢚ ꢜ ꢛꢡ ꢝꢡꢚ ꢞ ꢜ ꢚ ꢡ ꢝꢡ ꢞꢝꢡ ꢥ
ꢚ
ꢙ
ꢟ
ꢝ
ꢙ
ꢚ
ꢛ
ꢝ
ꢙ
ꢞ
ꢢ
ꢖ
ꢘ
ꢖ
ꢟ
ꢡ
ꢚ
ꢝ
ꢧ
ꢝ
ꢡ
ꢚ
ꢙ
ꢘ
ꢊ
ꢡ
ꢨ
ꢜ
ꢔ
ꢗ
ꢛ
ꢡ
ꢞ
ꢝ
ꢜ
ꢗ
ꢥ
ꢚ
ꢥ
ꢜ
ꢝ ꢡ ꢞ ꢝꢖ ꢗꢫ ꢙꢘ ꢜ ꢤꢤ ꢢꢜ ꢚ ꢜ ꢛ ꢡ ꢝ ꢡ ꢚ ꢞ ꢦ
ꢚ
ꢜ
ꢗ
ꢝ
ꢪ
ꢦ
ꢎ
ꢚ
ꢙ
ꢥ
ꢝ
ꢖ
ꢙ
ꢟ
ꢡ
ꢞ
ꢖ
ꢗ
ꢫ
ꢥ
ꢙ
ꢡ
ꢙ
ꢝ
ꢗ
ꢡ
ꢟ
ꢡ
ꢞ
ꢜ
ꢚ
ꢖ
ꢤ
ꢖ
ꢗ
ꢟ
ꢤ
ꢠ
ꢠ ꢗꢤ ꢡꢞꢞ ꢙ ꢝꢧꢡ ꢚ ꢩꢖ ꢞꢡ ꢗ ꢙꢝꢡ ꢥꢦ ꢉ ꢗ ꢜꢤ ꢤ ꢙ ꢝꢧꢡ ꢚ ꢢꢚ ꢙ ꢥꢠꢟ ꢝꢞ ꢈ ꢢꢚ ꢙ ꢥꢠꢟ ꢝꢖꢙ ꢗ
ꢝ
ꢢ
ꢚ
ꢙ
ꢟ
ꢡ
ꢞ
ꢞ
ꢖ
ꢗ
ꢫ
ꢥ
ꢙ
ꢡ
ꢞ
ꢗ
ꢙ
ꢝ
ꢗ
ꢡ
ꢟ
ꢡ
ꢞ
ꢞ
ꢜ
ꢚ
ꢖ
ꢤ
ꢪ
ꢖ
ꢗ
ꢟ
ꢤ
ꢠ
ꢥ
ꢡ
ꢝ
ꢡ
ꢞ
ꢖ
ꢗ
ꢫ
ꢙ
ꢘ
ꢜ
ꢤ
ꢤ
ꢢ
ꢜ
ꢚ
ꢜ
ꢛ
ꢡ
ꢝ
ꢡ
ꢚ
ꢞ
ꢦ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢆꢈ ꢀꢁ ꢇ ꢃ ꢄꢅꢆ ꢇ ꢆ
ꢉꢅ ꢊꢋ ꢌ ꢊ ꢍ ꢋꢁ ꢀꢎꢋꢍ ꢏꢁ ꢊ ꢐꢑꢊ ꢒ ꢎꢏ ꢌꢋꢊꢅ ꢄꢏꢀ
ꢓꢔ ꢊ ꢄ ꢆ ꢑꢀꢊꢋꢊ ꢏ ꢉꢕꢊ ꢎ ꢕꢊꢀ
SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003
description/ordering information (continued)
An output-enable (OE) input places the eight outputs in either a normal logic state (high or low logic levels) or
the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines
significantly. The high-impedance state and increased drive provide the capability to drive bus lines without
interface or pullup components.
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are off.
FUNCTION TABLE
(each latch)
INPUTS
OUTPUT
Q
OE
L
LE
H
H
L
D
H
L
H
L
L
L
X
X
Q
0
H
X
Z
logic diagram (positive logic)
1
OE
11
LE
C1
1D
2
1Q
3
1D
To Seven Other Channels
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
ꢏ
ꢂ
ꢁ
ꢄ
ꢃ
ꢊ
ꢄ
ꢐ
ꢆ
ꢅ
ꢑ
ꢆ
ꢊ
ꢊ
ꢇ
ꢒ
ꢋ
ꢆ
ꢎ
ꢊ
ꢈ
ꢀ
ꢏ
ꢏ
ꢁ
ꢌ
ꢉ
ꢇ
ꢋ
ꢕ
ꢃ
ꢊ
ꢊ
ꢄ
ꢅ
ꢎ
ꢅ
ꢄ
ꢕ
ꢆ
ꢏ
ꢊ
ꢇ
ꢆ
ꢀ
ꢀ
ꢉ
ꢅ
ꢊꢋ
ꢌ
ꢊ
ꢍ
ꢋ
ꢁ
ꢀ
ꢎ
ꢋ
ꢍ
ꢓ
ꢔ
ꢊ
ꢑ
ꢀ
SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HC373
MIN NOM
SN74HC373
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC373
SN74HC373
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V = V or V
IH
V
OH
OL
I
IL
IL
I
I
= −6 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −7.8 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
0.5
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V
V = V or V
V
I
IH
I
I
= 6 mA
4.5 V
6 V
0.4
0.33
0.33
1000
5
OL
= 7.8 mA
0.4
OL
I
I
I
V = V
I
or 0
6 V
1000
10
nA
µA
µA
pF
I
CC
V
O
= V
or 0
6 V
0.01
OZ
CC
CC
V = V
I
or 0,
I
O
= 0
6 V
160
10
80
CC
C
2 V to 6 V
3
10
10
i
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢆꢈ ꢀꢁ ꢇ ꢃ ꢄꢅꢆ ꢇ ꢆ
ꢉꢅ ꢊꢋ ꢌ ꢊ ꢍ ꢋꢁ ꢀꢎꢋꢍ ꢏꢁ ꢊ ꢐꢑꢊ ꢒ ꢎꢏ ꢌꢋꢊꢅ ꢄꢏꢀ
ꢓꢔ ꢊ ꢄ ꢆ ꢑꢀꢊꢋꢊ ꢏ ꢉꢕꢊ ꢎ ꢕꢊꢀ
SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
T
= 25°C
SN54HC373
SN74HC373
A
V
UNIT
CC
MIN
80
16
14
50
10
9
MAX
MIN
120
24
MAX
MIN
100
20
MAX
2 V
4.5 V
6 V
t
w
t
su
t
h
Pulse duration, LE high
Setup time, data before LE↓
Hold time, data after LE↓
ns
20
17
2 V
75
63
4.5 V
6 V
15
13
ns
ns
13
11
2 V
20
10
10
26
24
4.5 V
6 V
13
12
13
12
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
58
15
13
73
18
15
65
17
14
50
15
13
28
8
SN54HC373
SN74HC373
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
150
30
MIN
MAX
225
45
MIN
MAX
190
38
2 V
4.5 V
6 V
D
Q
26
38
32
t
pd
ns
2 V
175
35
265
53
220
44
4.5 V
6 V
LE
OE
OE
Any Q
Any Q
Any Q
Any Q
30
45
38
2 V
150
30
225
45
190
38
4.5 V
6 V
t
t
t
ns
ns
ns
en
dis
t
26
38
32
2 V
150
30
225
45
190
38
4.5 V
6 V
26
38
32
2 V
60
90
75
4.5 V
6 V
12
18
15
6
10
15
13
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
ꢏ
ꢂ
ꢁ
ꢄ
ꢃ
ꢊ
ꢄ
ꢐ
ꢆ
ꢅ
ꢑ
ꢆ
ꢊ
ꢊ
ꢇ
ꢒ
ꢋ
ꢆ
ꢎ
ꢊ
ꢈ
ꢀ
ꢏ
ꢏ
ꢁ
ꢌ
ꢉ
ꢇ
ꢋ
ꢕ
ꢃ
ꢊ
ꢊ
ꢄ
ꢅ
ꢎ
ꢅ
ꢄ
ꢕ
ꢆ
ꢏ
ꢊ
ꢇ
ꢆ
ꢀ
ꢀ
ꢉ
ꢅ
ꢊꢋ
ꢌ
ꢊ
ꢍ
ꢋ
ꢁ
ꢀ
ꢎ
ꢋ
ꢍ
ꢓ
ꢔ
ꢊ
ꢑ
ꢀ
SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
82
SN54HC373
SN74HC373
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
200
40
MIN
MAX
300
60
MIN
MAX
250
50
2 V
4.5 V
6 V
22
D
Q
19
34
51
43
t
pd
ns
2 V
100
24
225
45
335
67
285
57
4.5 V
6 V
LE
OE
Any Q
Any Q
Any Q
20
38
57
48
2 V
90
200
40
300
60
250
50
4.5 V
6 V
23
t
t
ns
ns
en
19
34
51
43
2 V
45
210
42
315
63
265
53
4.5 V
6 V
17
t
13
36
53
45
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per latch
No load
100
pF
pd
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢆꢈ ꢀꢁ ꢇ ꢃ ꢄꢅꢆ ꢇ ꢆ
ꢉꢅ ꢊꢋ ꢌ ꢊ ꢍ ꢋꢁ ꢀꢎꢋꢍ ꢏꢁ ꢊ ꢐꢑꢊ ꢒ ꢎꢏ ꢌꢋꢊꢅ ꢄꢏꢀ
ꢓꢔ ꢊ ꢄ ꢆ ꢑꢀꢊꢋꢊ ꢏ ꢉꢕꢊ ꢎ ꢕꢊꢀ
SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
L
S1
S2
L
50 pF
or
150 pF
t
Open
Closed
Closed
Open
PZH
S1
S2
Test
Point
t
t
1 kΩ
1 kΩ
en
R
t
t
t
L
PZL
PHZ
PLZ
From Output
Under Test
Open
Closed
Open
50 pF
C
dis
L
Closed
(see Note A)
50 pF
or
150 pF
t
or t
−−
Open
Open
pd
t
LOAD CIRCUIT
V
CC
Reference
Input
50%
V
CC
0 V
High-Level
Pulse
50%
50%
t
t
h
su
0 V
V
CC
t
Data
Input
w
90%
90%
50%
10%
50%
10%
V
CC
Low-Level
Pulse
0 V
50%
50%
t
t
f
r
0 V
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PULSE DURATIONS
Output
V
CC
V
CC
Control
(Low-Level
Enabling)
Input
50%
50%
50%
50%
0 V
V
0 V
t
t
PLH
PHL
90%
t
t
PLZ
PZL
OH
≈V
CC
50%
≈V
CC
Output
Waveform 1
(See Note B)
In-Phase
Output
90%
t
50%
10%
50%
10%
10%
t
V
OL
V
OL
t
r
f
f
t
t
t
PZH
PHZ
PHL
90%
PLH
V
V
OH
V
Output
Waveform 2
(See Note B)
OH
90%
t
90%
Out-of-
Phase
Output
50%
10%
50%
10%
50%
≈0 V
OL
t
r
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CFP
Drawing
5962-8407201VRA
5962-8407201VSA
84072012A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
J
W
FK
J
20
20
20
20
20
20
20
20
20
20
1
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
LCCC
CDIP
CFP
POST-PLATE N / A for Pkg Type
8407201RA
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
8407201SA
W
FK
J
JM38510/65403B2A
JM38510/65403BRA
SN54HC373J
LCCC
CDIP
CDIP
SSOP
SSOP
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
Call TI
N / A for Pkg Type
N / A for Pkg Type
Call TI
J
SN74HC373DBLE
SN74HC373DBR
DB
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC373DBRE4
SN74HC373DBRG4
SN74HC373DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
DB
DB
DW
DW
DW
DW
DW
DW
N
20
20
20
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC373DWE4
SN74HC373DWG4
SN74HC373DWR
SN74HC373DWRE4
SN74HC373DWRG4
SN74HC373N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC373N3
SN74HC373NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
20
20
TBD
Call TI
Call TI
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC373NSR
SN74HC373NSRE4
SN74HC373NSRG4
SN74HC373PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
NS
PW
PW
PW
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC373PWE4
SN74HC373PWG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC373PWLE
SN74HC373PWR
OBSOLETE TSSOP
ACTIVE TSSOP
PW
PW
20
20
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
SN74HC373PWRE4
SN74HC373PWRG4
SN74HC373PWT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC373PWTE4
SN74HC373PWTG4
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54HC373FK
SNJ54HC373J
SNJ54HC373W
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
20
20
1
1
1
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74HC373DBR
SN74HC373DWR
SN74HC373PWR
SSOP
SOIC
DB
DW
PW
20
20
20
2000
2000
2000
330.0
330.0
330.0
16.4
24.4
16.4
8.2
7.5
13.0
7.1
2.5
2.7
1.6
12.0
12.0
8.0
16.0
24.0
16.0
Q1
Q1
Q1
10.8
6.95
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC373DBR
SN74HC373DWR
SN74HC373PWR
SSOP
SOIC
DB
DW
PW
20
20
20
2000
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
33.0
41.0
33.0
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明