SN74LS375NE4 [TI]
4-BIT BISTABLE LATCHES; 4位双稳态锁存器![SN74LS375NE4](http://pdffile.icpdf.com/pdf1/p00160/img/icpdf/SN74L_891348_icpdf.jpg)
型号: | SN74LS375NE4 |
厂家: | ![]() |
描述: | 4-BIT BISTABLE LATCHES |
文件: | 总20页 (文件大小:963K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
SOIC
Drawing
SN54LS375J
SN74LS375D
ACTIVE
ACTIVE
J
16
16
1
TBD
A42 SNPB
N / A for Pkg Type
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375D
SN74LS375DE4
SN74LS375DE4
SN74LS375DG4
SN74LS375DG4
SN74LS375DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
D
D
D
D
D
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375DR
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375DRE4
SN74LS375DRE4
SN74LS375DRG4
SN74LS375DRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375J
SN74LS375J
SN74LS375N
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
J
J
16
16
16
TBD
TBD
Call TI
Call TI
Call TI
Call TI
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS375N
ACTIVE
PDIP
N
16
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS375N3
SN74LS375N3
SN74LS375NE4
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
N
N
N
16
16
16
TBD
TBD
Call TI
Call TI
Call TI
Call TI
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS375NE4
SN74LS375NSR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
SO
SO
SO
SO
SO
N
16
16
16
16
16
16
16
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
NS
NS
NS
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375NSR
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375NSRE4
SN74LS375NSRE4
SN74LS375NSRG4
SN74LS375NSRG4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
LCCC
CDIP
CDIP
Drawing
SNJ54LS375FK
SNJ54LS375FK
SNJ54LS375J
SNJ54LS375J
SNJ54LS375W
SNJ54LS375W
OBSOLETE
OBSOLETE
ACTIVE
FK
FK
J
20
20
16
16
16
16
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
1
1
A42 SNPB
A42 SNPB
Call TI
N / A for Pkg Type
N / A for Pkg Type
Call TI
ACTIVE
J
OBSOLETE
OBSOLETE
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jun-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jun-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
(mm)
16
SN74LS375DR
SN74LS375NSR
D
16
16
FMX
MLA
6.5
8.2
10.3
10.5
2.1
2.5
8
16
16
Q1
Q1
NS
330
16
12
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74LS375DR
SN74LS375NSR
D
16
16
FMX
MLA
342.9
342.9
336.6
336.6
28.58
28.58
NS
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
SOIC
Drawing
SN54LS375J
SN74LS375D
ACTIVE
ACTIVE
J
16
16
1
TBD
A42 SNPB
N / A for Pkg Type
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375D
SN74LS375DE4
SN74LS375DE4
SN74LS375DG4
SN74LS375DG4
SN74LS375DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
D
D
D
D
D
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375DR
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375DRE4
SN74LS375DRE4
SN74LS375DRG4
SN74LS375DRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375J
SN74LS375J
SN74LS375N
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
J
J
16
16
16
TBD
TBD
Call TI
Call TI
Call TI
Call TI
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS375N
ACTIVE
PDIP
N
16
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS375N3
SN74LS375N3
SN74LS375NE4
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
N
N
N
16
16
16
TBD
TBD
Call TI
Call TI
Call TI
Call TI
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS375NE4
SN74LS375NSR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
SO
SO
SO
SO
SO
N
16
16
16
16
16
16
16
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
NS
NS
NS
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375NSR
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS375NSRE4
SN74LS375NSRE4
SN74LS375NSRG4
SN74LS375NSRG4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
LCCC
CDIP
CDIP
Drawing
SNJ54LS375FK
SNJ54LS375FK
SNJ54LS375J
SNJ54LS375J
SNJ54LS375W
SNJ54LS375W
OBSOLETE
OBSOLETE
ACTIVE
FK
FK
J
20
20
16
16
16
16
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
1
1
A42 SNPB
A42 SNPB
Call TI
N / A for Pkg Type
N / A for Pkg Type
Call TI
ACTIVE
J
OBSOLETE
OBSOLETE
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74LS375DR
SN74LS375NSR
SOIC
SO
D
16
16
2500
2000
330.0
330.0
16.4
16.4
6.5
8.2
10.3
10.5
2.1
2.5
8.0
16.0
16.0
Q1
Q1
NS
12.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LS375DR
SN74LS375NSR
SOIC
SO
D
16
16
2500
2000
333.2
346.0
345.9
346.0
28.6
33.0
NS
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
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www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
相关型号:
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![](http://pdffile.icpdf.com/pdf2/p00308/img/page/SN74LS375NS_1858047_files/SN74LS375NS_1858047_2.jpg)
SN74LS375NS
D Latch, LS Series, 2-Func, High Level Triggered, 2-Bit, Complementary Output, TTL, PDIP16, PLASTIC, DIP-16
MOTOROLA
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SN74LS377D
OCTAL D FLIP-FLOP WITH ENABLE; HEX D FLIP-FLOP WITH ENABLE; 4-BIT D FLIP-FLOP WITH ENABLE
MOTOROLA
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![](http://pdffile.icpdf.com/pdf1/p00089/img/page/SN74LS377D_468865_files/SN74LS377D_468865_2.jpg)
SN74LS377DW
OCTAL D FLIP-FLOP WITH ENABLE; HEX D FLIP-FLOP WITH ENABLE; 4-BIT D FLIP-FLOP WITH ENABLE
MOTOROLA
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