SN74LVC574AQDWRQ1 [TI]
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS; 八路边沿触发D型触发器具有三态输出
| 型号： | SN74LVC574AQDWRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS |
| 文件： | 总11页 (文件大小：219K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74LVC574A-Q1
www.ti.com ............................................................................................................................................... SCAS715B–SEPTEMBER 2003–REVISED APRIL 2008
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
1
FEATURES
DW OR PW PACKAGE
•
Qualified for Automotive Applications
(TOP VIEW)
•
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
OE
1D
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
1Q
2D
3D
4D
5D
18 2Q
17 3Q
•
•
•
•
Operates From 2 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 7 ns at 3.3 V
16
15
14
13
12
11
4Q
5Q
6Q
7Q
8Q
CLK
Typical VOLP (Output Ground Bounce) < 0.8 V
at VCC = 3.3 V, TA = 25°C
6D
7D
8D
GND
•
•
•
Typical VOHV (Output VOH Undershoot) > 2 V at
VCC = 3.3 V, TA = 25°C
Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With 3.3-V VCC
)
Ioff Supports Partial-Power-Down Mode
Operation
DESCRIPTION/ORDERING INFORMATION
The SN74LVC574A octal edge-triggered D-type flip-flop is designed for 2.7-V to 3.6-V VCC operation.
This device features 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance
loads. It is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working
registers.
On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels at the data (D) inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or
low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the
bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines
without interface or pullup components.
OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of thIs device as a translator in
a mixed 3.3-V/5-V system environment.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVC574A-Q1
SCAS715B–SEPTEMBER 2003–REVISED APRIL 2008 ............................................................................................................................................... www.ti.com
ORDERING INFORMATION(1)
TA
PACKAGE(2)
Reel of 2000
Reel of 2000
ORDERABLE PART NUMBER
SN74LVC574AQDWRQ1
TOP-SIDE MARKING
L574AQ1
L574AQ1
SOIC – DW
–40°C to 125°C
TSSOP – PW
SN74LVC574AQPWRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
FUNCTION TABLE
(EACH FLIP-FLOP)
INPUTS
OUTPUT
Q
OE
L
CLK
D
H
L
↑
↑
H
L
L
L
L
X
X
X
Q0
Z
H
LOGIC DIAGRAM (POSITIVE LOGIC)
1
OE
11
CLK
C1
1D
19
1Q
2
1D
To Seven Other Channels
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX
6.5
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
Voltage range applied to any output in the high or low state(2)(3)
6.5
V
VO
VO
IIK
6.5
V
–0.5 VCC + 0.5
V
Input clamp current
VI < 0
–50
–50
±50
±100
58
mA
mA
mA
mA
IOK
IO
Output clamp current
VO < 0
Continuous output current
Continuous current through VCC or GND
DW package
PW package
θJA
Package thermal impedance(4)
Storage temperature range
°C/W
°C
83
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC574A-Q1
SN74LVC574A-Q1
www.ti.com ............................................................................................................................................... SCAS715B–SEPTEMBER 2003–REVISED APRIL 2008
Recommended Operating Conditions(1)
MIN
2
MAX UNIT
Operating
3.6
V
VCC
Supply voltage
Data retention only
VCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
1.5
2
VIH
VIL
VI
High-level input voltage
Low-level input voltage
Input voltage
V
0.8
5.5
VCC
5.5
–12
–24
12
V
V
0
0
0
High or low state
3-state
VO
IOH
IOL
Output voltage
V
VCC = 2.7 V
VCC = 3 V
High-level output current
Low-level output current
mA
mA
VCC = 2.7 V
VCC = 3 V
24
Δt/Δv
Input transition rise or fall rate
Operating free-air temperature
6
ns/V
TA
–40
125
°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
2.7 V to 3.6 V
2.7 V
MIN TYP(1) MAX UNIT
VCC – 0.2
IOH = –100 µA
2.2
2.4
2.2
VOH
IOH = –12 mA
V
3 V
IOH = –24 mA
IOL = 100 µA
3 V
2.7 V to 3.6 V
2.7 V
0.2
0.4
0.55
±5
VOL
IOL = 12 mA
V
IOL = 24 mA
3 V
II
VI = 0 to 5.5 V
VO = 0 to 5.5 V
VI = VCC or GND
3.6 V ≤ VI ≤ 5.5 V(2)
3.6 V
µA
µA
IOZ
3.6 V
±15
10
ICC
IO = 0
3.6 V
µA
10
ΔICC
Ci
One input at VCC – 0.6 V,
VI = VCC or GND
Other inputs at VCC or GND
2.7 V to 3.6 V
3.3 V
500
µA
pF
pF
4
Co
VO = VCC or GND
3.3 V
5.5
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
(2) This applies in the disabled state only.
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
UNIT
MIN
MAX
MIN
MAX
150
fclock
tw
Clock frequency
150
MHz
ns
Pulse duration, CLK high or low
Setup time, data before CLK↑
Hold time, data after CLK↑
3.3
2
3.3
2
tsu
th
ns
2
2
ns
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): SN74LVC574A-Q1
SN74LVC574A-Q1
SCAS715B–SEPTEMBER 2003–REVISED APRIL 2008 ............................................................................................................................................... www.ti.com
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
MIN
MAX
fmax
tpd
150
150
1
MHz
ns
CLK
OE
Q
Q
Q
8
9
7
7
7.5
6.4
ten
1
ns
tdis
OE
0.5
ns
Operating Characteristics
TA = 25°C
VCC = 2.5 V
VCC = 3.3 V
TEST
CONDITIONS
PARAMETER
UNIT
TYP
60
9
TYP
43
Outputs enabled
Outputs disabled
Cpd
Power dissipation capacitance per flip-flop
f = 10 MHz
pF
15
4
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC574A-Q1
SN74LVC574A-Q1
www.ti.com ............................................................................................................................................... SCAS715B–SEPTEMBER 2003–REVISED APRIL 2008
PARAMETER MEASUREMENT INFORMATION
V
LOAD
S1
Open
R
L
From Output
Under Test
TEST
/t
S1
GND
t
t
Open
PLH PHL
C
L
t
/t
V
LOAD
GND
R
L
PLZ PZL
(see Note A)
/t
PHZ PZH
LOAD CIRCUIT
INPUTS
V
CC
V
M
V
LOAD
C
L
R
L
V
∆
V
I
t /t
r f
2.7 V
2.7 V
2.7 V
≤2.5 ns
≤2.5 ns
1.5 V
1.5 V
6 V
6 V
50 pF
50 pF
500 Ω
500 Ω
0.3 V
0.3 V
3.3 V ± 0.3 V
V
I
Timing Input
Data Input
V
M
0 V
t
w
t
t
h
su
V
I
V
I
Input
V
M
V
M
V
M
V
M
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
I
V
I
Output
Control
V
M
V
M
Input
V
M
V
M
0 V
0 V
t
t
t
t
t
PHL
PZL
PLZ
PLH
Output
Waveform 1
V
V
OH
V
V
/2
LOAD
V
V
V
M
M
Output
V
V
M
S1 at V
LOAD
V
+ V
∆
OL
OL
(see Note B)
OL
t
PHL
PLH
t
t
PHZ
PZH
Output
Waveform 2
S1 at GND
V
V
OH
V
OH
V
- V
∆
V
M
OH
M
Output
M
≈0 V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
PHL pd
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): SN74LVC574A-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CLVC574AQDWRG4Q1
CLVC574AQPWRG4Q1
SN74LVC574AQDWRQ1
SN74LVC574AQPWRQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
TSSOP
SOIC
DW
PW
DW
PW
20
20
20
20
2000
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
TSSOP
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC574A-Q1 :
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
Catalog: SN74LVC574A
•
Enhanced Product: SN74LVC574A-EP
•
Military: SN54LVC574A
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
SN74LVC574PW
8-BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
TI
©2020 ICPDF网 联系我们和版权申明