TAS6422E-Q1 [TI]
汽车类 75W、2MHz、2 通道、4.5V 至 26.4V 数字输入 D 类音频放大器;
| 型号： | TAS6422E-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 汽车类 75W、2MHz、2 通道、4.5V 至 26.4V 数字输入 D 类音频放大器 放大器 音频放大器 |
| 文件： | 总9页 (文件大小：1450K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TAS6422E-Q1
ZHCSM93 –OCTOBER 2020
TAS6422E-Q1 具有负载突降保护和I2C 诊断功能的45W、2MHz 数字输入2 通道
汽车用D 类音频放大器
1 特性
2 应用
• 符合面向汽车应用的AEC-Q100 标准
• 汽车音响主机
• 汽车外部放大器
– 温度等级1：–40°C 至+125°C TA
• 高级负载诊断
3 说明
– 直流诊断功能，无需输入时钟即可执行
– 交流诊断功能，可通过阻抗和相位响应实现高频
扬声器检测
TAS6422E-Q1 器件是一款采用 2.1MHz PWM 开关频
率的双通道数字输入 D 类音频放大器，以非常小的
PCB 尺寸实现成本优化的解决方案，可针对启停事件
在低至4.5V 的电压下全面运行，并可在高达40kHz 的
音频带宽下提供出色的音质。
• 可轻松满足CISPR25-L5 EMC 规范
• 音频输入
– 输入采样率：44.1kHz、48kHz、96kHz
– 输入格式：16 位至32 位I2S 和TDM
• 音频输出
器件增加了 EMI 管理特性（包括展频）以帮助应对系
统级EMI 挑战。
– 最高可达2.1MHz 的输出开关频率
• 在4Ω 负载、14.4V BTL 条件下的音频性能
输出开关频率既可以设置为高于调幅 (AM) 频带，以消
除 AM 频带干扰并降低输出滤波需求及成本；也可以
设置为低于AM 频带，以优化器件效率。
– 输出功率为1W 时，THD+N < 0.02%
– 42µVRMS 输出噪声
– –90dB 串扰
该器件内置负载诊断功能，用于检测和诊断误接的输
出，以及检测交流耦合型高频扬声器，从而帮助缩短制
造过程中的测试时间。
• 负载诊断功能
– 开路和短路输出负载
– 输出至电池短路或接地短路
– 线路输出检测能力高达6kΩ
– 独立于主机运行
器件信息
封装(1)
封装尺寸（标称值）
器件型号
TAS6422E-Q1
HSSOP (56)
18.41mm × 7.49mm
• 保护
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
– 输出电流限制和短路保护
– 40V 负载突降
– 可承受接地开路和电源开路
– 直流失调电压
– 温度过高
– 欠压和过压
• 常规运行
– 4.5V 至26.4V 电源电压
– I2C 控制，具有4 个地址选项
– 锁存或非锁存削波检测
PCB 区域
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLOSE81
TAS6422E-Q1
ZHCSM93 –OCTOBER 2020
www.ti.com.cn
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
DATE
REVISION
NOTES
October 2020
*
Initial release.
spacer
Copyright © 2022 Texas Instruments Incorporated
2
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TAS6422E-Q1
ZHCSM93 –OCTOBER 2020
www.ti.com.cn
5 Device and Documentation Support
5.1 Documentation Support
5.2 Related Documentation
For related documentation see the following:
• PurePath™ Console 3 Graphical Development Suite
• TAS6422E-Q1 EVM User's Guide (SLOU541)
5.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.4 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.5 Trademarks
PurePath™ is a trademark of Texas Instruments.
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.6 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
5.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: TAS6422E-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TAS6422EQDKQRQ1
ACTIVE
HSSOP
DKQ
56
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TAS
6422E
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
DKQ0056C
PowerPADTM HSSOP - 2.475 mm max height
S
C
A
L
E
1
.
0
0
0
PLASTIC SMALL OUTLINE
C
10.67
10.03
TYP
SEATING PLANE
A
PIN 1 ID AREA
0.1 C
54X 0.635
56
1
EXPOSED
THERMAL PAD
18.54
18.29
NOTE 3
6.5
5.2
2X
17.15
5.5
4.2
28
29
0.37
56X
0.17
0.13
(2.29)
7.59
7.39
B
C A B
NOTE 4
0.25
0.13
2.29 0.05
TYP
2.475
2.240
NOTE 6
0.25
GAGE PLANE
SEE DETAIL A
0.08
0.00
1.02
0.51
0 - 8
DETAIL A
TYPICAL
4225963/A 06/2020
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. The exposed thermal pad is designed to be attached to an external heatsink.
6. For clamped heatsink design, refer to overall package height above the seating plane as 2.325 +/- 0.075 and molded body
thickness dimension.
www.ti.com
EXAMPLE BOARD LAYOUT
DKQ0056C
PowerPADTM HSSOP - 2.475 mm max height
PLASTIC SMALL OUTLINE
56X (1.9)
SEE DETAILS
SYMM
1
56
56X (0.4)
54X (0.635)
SYMM
28
29
(R0.05) TYP
(9.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
METAL UNDER
SOLDER MASK
SOLDER MASK
METAL
SOLDER MASK
OPENING
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MIN
AROUND
0.05 MAX
AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4225963/A 06/2020
NOTES: (continued)
7. Publication IPC-7351 may have alternate designs.
8. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
9. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
DKQ0056C
PowerPADTM HSSOP - 2.475 mm max height
PLASTIC SMALL OUTLINE
56X (1.9)
SYMM
1
56
56X (0.4)
54X (0.635)
SYMM
28
29
(R0.05) TYP
(9.5)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE:6X
4225963/A 06/2020
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
www.ti.com
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