TCA9416_V03 [TI]
TCA9416 Ultra-Low-Voltage I2C Translator with Rise Time Accelerators;
| 型号： | TCA9416_V03 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | TCA9416 Ultra-Low-Voltage I2C Translator with Rise Time Accelerators |
| 文件： | 总30页 (文件大小：1876K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TCA9416
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
TCA9416 Ultra-Low-Voltage I2C Translator with Rise Time Accelerators
1 Features
3 Description
•
•
•
•
2-bit bidirectional translator for SDA and SCL lines
in I2C applications
Provides bidirectional voltage translation with no
direction pin
High-impedance output SCL_A, SDA_A, SCL_B,
SDA_B pins when OE = 0 V or VCC = 0 V
Internal 10-kΩ pull-up resistor on all SDA and SCL
pins are enabled based on respective VCC voltage
1.08 V to 3.6 V on both A and B ports
VCC Isolation feature: If either VCC input is at
GND, both ports are in the high-impedance state
(excluding pull-ups)
The TCA9416 is a 2-bit bidirectional I2C and SMBus
voltage-level translator with an output enable (OE)
input and rising and falling edge accelerators. It is
operational from 1.08 V to 3.6 V on both the A-
side and B-side. This allows the device to interface
between lower and higher logic signal levels at any of
the typical 1.2-V, 1.8-V, 2.5-V, and 3.3-V supply rails.
The OE input pin is referenced to VCCA, can be
tied directly to VCCA, but it is also 3.6-V tolerant.
The OE pin can also be controlled and set to a
logic low to place all the SCL and SDA pins in a
high-impedance state, which significantly reduces the
quiescent current consumption.
•
•
•
No power-supply sequencing required: either VCCA
or VCCB can be ramped first
•
•
Low Ioff of 2.5 µA when either VCCA or VCCB = 0 V
OE input can be tied directly to VCCA or controlled
by GPIO
Latch-up performance exceeds 100 mA per JESD
78, class II
ESD Protection exceeds JESD 22
– 2500-V Human-body model (A114-B)
– 1500-V Charged-device model (C101)
Under normal I2C and SMBus configurations, the
TCA9416 is compatible with standard speeds where
the frequency of SCL is 100 kHz (Standard-mode),
400 kHz (Fast-mode), or 1 MHz (Fast-mode Plus).
•
•
The TCA9416 features internal 10-kΩ pull-up resistors
on SCL_A, SDA_A, SCL_B, and SDA_B. Additional
external pull-up resistors can be added to the bus to
reduce the total pull-up resistance and speed up rising
edges.
2 Applications
Device Information
•
•
•
Wearables
Personal electronics
Servers
PART NUMBER
TCA9416
PACKAGE(1)
BODY SIZE (NOM)
1.35 mm × 0.80 mm
2.9 mm × 1.6 mm
X2SON (8)
SOT-23-T (8)
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
spacer
Typical Application Block Diagram for TCA9416
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings ....................................... 4
6.2 ESD Ratings .............................................................. 4
6.3 Recommended Operating Conditions ........................5
6.4 Thermal Information ...................................................5
6.5 Electrical Characteristics ............................................6
6.6 Timing Requirements .................................................7
6.7 Switching Characteristics ...........................................8
6.8 Typical Characteristics................................................9
7 Parameter Measurement Information..........................10
7.1 Voltage Waveforms................................................... 11
8 Detailed Description......................................................12
8.1 Overview...................................................................12
8.2 Functional Block Diagram.........................................12
8.3 Feature Description...................................................12
8.4 Device Functional Modes..........................................14
9 Application and Implementation..................................15
9.1 Application Information............................................. 15
9.2 Typical Application.................................................... 15
10 Power Supply Recommendations..............................17
11 Layout...........................................................................18
11.1 Layout Guidelines................................................... 18
11.2 Layout Example...................................................... 18
12 Device and Documentation Support..........................19
12.1 Receiving Notification of Documentation Updates..19
12.2 Support Resources................................................. 19
12.3 Trademarks.............................................................19
12.4 Electrostatic Discharge Caution..............................19
12.5 Glossary..................................................................19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (February 2021) to Revision A (August 2021)
Page
•
Changed the document status from: Advanced Information to: Production data............................................... 1
Copyright © 2021 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
5 Pin Configuration and Functions
SCL_A
1
7
6
5
SCL_B
SCL_A
OE
1
2
3
4
8
7
6
5
SCL_B
VCCB
GND
8
VCCA
SDA_A
OE
SDA_B
VCCA
2
VCCB
Not to scale
4
Figure 5-2. 8-PIN DDF, (Top View)
GND
SDA_A
3
SDA_B
Not to scale
Figure 5-1. 8-PIN DTM, (Top View)
Table 5-1. Pin Functions
PIN
TYPE
DESCRIPTION
NAME
SCL_A
VCCA
SDA_A
GND
DTM
DDF
1
2
3
4
5
6
7
1
3
4
6
5
7
8
I/O
Power
I/O
Input/output A. Referenced to VCCA
.
A-port supply voltage. 1.08 V ≤ VCCA ≤ 3.6 V
Input/output A. Referenced to VCCA
Ground
.
GND
I/O
SDA_B
VCCB
SCL_B
Input/output B. Referenced to VCCB
.
Power
I/O
B-port supply voltage. 1.08 V ≤ VCCB ≤ 3.6 V
Input/output B. Referenced to VCCB
Output enable (active High). Pull OE low to place all outputs in 3-state mode.
Referenced to VCCA
.
OE
8
2
Input
.
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
6 Specifications
6.1 Absolute Maximum Ratings
over recommended operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
MAX
UNIT
V
VCCA
VCCB
Supply voltage range
Supply voltage range
4
4
V
A port
B port
A port
B port
A port
B port
VI < 0
VO < 0
4
VI
Input voltage range(1)
V
V
V
4
4
Voltage range applied to any output
VO
VO
in the high-impedance or power-off state(1)
4
4
Voltage range applied to any output in the high or low state(1) (2)
4
IIK
IOK
IO
Input clamp current
–50
–50
±50
±100
150
mA
mA
mA
mA
°C
Output clamp current
Continuous output current
Continuous current through VCCA, VCCB, or GND
Storage temperature
Tstg
–65
(1) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(2) The value of VCCA and VCCB are provided in the recommended operating conditions table.
6.2 ESD Ratings
VALUE
±2500
UNIT
A-Ports, B-Ports
VCCA, VCCB, OE
V
V
V
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
V(ESD)
Electrostatic discharge
±2000
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Copyright © 2021 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
6.3 Recommended Operating Conditions
over recommended operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
MIN
1.08
1.08
MAX
3.6
UNIT
V
VCCA
VCCB
Supply voltage
Supply voltage
3.6
V
A-port I/Os, B-port
I/Os, OE
VI
Input voltage
0 V to 3.6 V
0 V to 3.6 V
0
3.6
3.6
V
V
High-level
input voltage
VIH
OE input
OE input
1.08 V to 3.6 V
1.08 V to 3.6 V
1.08 V to 3.6 V
1.08 V to 3.6 V
VCCA × 0.65
Low-level
input voltage
VIL
TA
0
VCCA × 0.35
125
V
Operating free-air temperature
–40
°C
6.4 Thermal Information
TCA9416
TCA9416
THERMAL METRIC(1)
DDF
8 PINS
177.6
98.7
DTM
8 PINS
212.5
105.3
124.1
4.5
UNIT
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
97.8
Junction-to-top characterization parameter
Junction-to-board characterization parameter
12.2
ψJB
97.2
23.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
VCCA
VCCB
MIN
0.65
0.6
TYP
0.9
MAX
UNIT
VUVLO_RIS UVLO Rising
VUVLO for VCCA and
VCCB are independent
0 V to 3.6 V
0 V to 3.6 V
1
V
V
V
V
Threshold
E
VUVLO_FAL UVLO Falling
VUVLO for VCCA and
VCCB are independent
0 V to 3.6 V
0 V to 3.6 V
0.85
0.95
Threshold
L
RTA(2) Activation
Threshold
VCCI
×
VCCI
×
(1)
VRTA
1.08 V to 3.6 V
1.08 V to 3.6 V
1.08 V to 3.6 V
1.08 V to 3.6 V
0.30
0.45
FTA(2) Activation
Threshold
VCCI
×
VCCI
×
(1)
VFTA
0.60
0.70
RPU
VI = 0.15 V
1.08V to 3.6V
1.08 V to 3.6 V
1.08 V to 3.6 V
1.08V to 3.6V
1.08 V to 3.6 V
1.08 V to 3.6 V
7.5
10
±0.1
0
12.5
±1
kΩ
μA
μA
II
OE
VI = VCCA or GND
OE less than VIL
IOZ
A or B port
±2.5
VI = 3.6 V, VO = 0
V (TA ≤ 85 C)
A port
B port
A port
B port
0 V
0 V to 3.6 V
0 V
±0.1
±0.1
±0.1
±0.1
±0.5
±0.5
±2.5
±2.5
VI = 3.6 V, VO = 0
V (TA ≤ 85 C)
0 to 3.6 V
0 V
Ioff
μA
VI = 3.6 V, VO = 0
V (TA ≤ 125 C)
0 V to 3.6 V
0 V
VI = 3.6 V, VO = 0
V (TA ≤ 125 C)
0 to 3.6 V
VI = VO = open,
IO = 0,
OE = 0 V
VCCA
VCCB
4
3
13
13
ICC_OFF
1.08 V to 3.6 V
1.08 V to 3.6 V
μA
μA
VI = VO = open,
IO = 0,
OE = 0 V
1.32 V
1.32 V to 3.6 V
1.32 V to 3.6 V
1.32 V to 3.6 V
1.32 V to 3.6 V
0 V
3
4
6
10
14
1.98 V
VI = VO = open,
IO = 0,
OE = VCCA
ICCA
3.6 V
6
0 V
-0.5
-0.5
0
1.32 V to 3.6 V
1.32 V to 3.6 V
1.32 V to 3.6 V
1.32 V to 3.6 V
1.32 V to 3.6 V
0 V
3
12
6
1.32 V
1.5
2
1.98 V
8
VI = VO = open,
IO = 0,
OE = VCCA
ICCB
3.6 V
5
12
μA
μA
0 V
0
1.32 V to 3.6 V
1.32 V
1
7
12
15
23
50
50
25
55
25
15
4
1.32 V
4
VI = VO = open,
IO = 0,
OE = VCCA
ICCA + ICCB
1.98 V
1.98 V
6
3.6 V
3.6 V
11
28
28
15
30
15
10
2.5
7
VI = 0.2 V, IO = 2 mA
VI = 0.2 V, IO = 2 mA
VI = 0.2 V, IO = 3 mA
VI = 0.2 V, IO = 2 mA
VI = 0.2 V, IO = 3 mA
VI = 0.2 V, IO = 6 mA
1.08 V
1.08 V
1.08 V, 1.8 V
1.65 V
1.8 V, 1.08 V
1.65 V
Ron
Ω
1.08 V, 3.0 V
1.65 V, 3.0 V
3.0 V
3.0 V, 1.08 V
3.0 V, 1.65 V
3.0 V
CI
OE
3.3 V
3.3 V
pF
pF
Cio
A or B port
0 V, 1.08 V, 3.6 V
0 V, 1.08 V, 3.6 V
10
(1) VCCI is the VCC associated with the input port.
(2) RTA is "rise time accelerator" and FTA is "fall time accelerator"
Copyright © 2021 Texas Instruments Incorporated
6
Submit Document Feedback
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
6.6 Timing Requirements
over operating free-air temperature range (unless otherwise noted). Typical specifications are at TA = 25 °C, VCC = 3.3 V,
unless otherwise noted.
PARAMETER
TEST CONDITIONS
SDA,SCL = Hi-Z
MIN
TYP
MAX
UNIT
tRTA
Time from VRTA to RTA disabling
80
210
ns
EN = VCC
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
7
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
6.7 Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
TEST CONDITIONS
VCCA = 1.08 V
MIN
TYP
MAX
UNIT
17
10
7
30
20
25
23
25
20
20
20
30
20
25
23
25
20
20
20
8
VCCA = 1.8 V
VCCA = 2.5 V
VCCA = 3.6 V
VCCA = 1.08 V
VCCA = 1.8 V
VCCA = 2.5 V
VCCA = 3.6 V
VCCB = 1.08 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.6 V
VCCB = 1.08 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.6 V
tPHL
tPLH
tPHL
tPLH
A
A
B
B
B
B
A
A
ns
6
9
5
ns
ns
ns
4
2
17
10
7
6
9
5
4
2
tSK(O)-RISE
tSK(O)-FALL
ten
Rising Channel-to-channel skew (Propagation)
Falling Channel-to-channel skew (Propagation)
ns
ns
ns
ns
8
OE
OE
A or B
A or B
70
60
18
12
11
10
18
12
11
10
13
12
12
11
13
12
12
11
350
160
35
30
25
25
35
30
25
25
30
30
35
40
30
30
35
40
tdis
VCCA = 1.08 V
VCCA = 1.8 V
VCCA = 2.5 V
VCCA = 3.6 V
VCCB = 1.08 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.6 V
VCCA = 1.08 V
VCCA = 1.8 V
VCCA = 2.5 V
VCCA = 3.6 V
VCCB = 1.08 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.6 V
trA
trB
tfA
tfB
B-port
A-port
B-port
A-port
A-port
B-port
A-port
B-port
ns
ns
ns
ns
Copyright © 2021 Texas Instruments Incorporated
8
Submit Document Feedback
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
6.8 Typical Characteristics
35
9
8
7
6
5
4
3
2
-40 C
25 C
125 C
-40 C
25 C
125 C
30
25
20
15
10
5
1
1.2 1.4 1.6 1.8
2
2.2 2.4 2.6 2.8
3
1
1.5
2
2.5
3
3.5
4
Min(VCCA, VCCB) (V)
VCCA (V)
The Min(VCCA, VCCB) signifies that the lower voltage of VCCA or
VCCB is used. As an example, if VCCA = 1.8 V and VCCB = 3.3 V,
then the Min(VCCA, VCCB) is 1.8 V.
Figure 6-2. ICCA (μA) vs VCCA (V)
Figure 6-1. RON (Ω) vs Min(VCCA, VCCB) (V)
7
-40 C
25 C
125 C
6
5
4
3
2
1
1
1.5
2
2.5
3
3.5
4
VCCB (V)
Figure 6-3. ICCB (μA) vs VCCB (V)
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
9
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
7 Parameter Measurement Information
VCC
VCC
RL
(see Note A)
VIN
VOUT
S1
PULSE
DUT
GND
GENERATOR
R
T
C = 57 pF
L
(see Note B)
(see Note C)
TEST
tPLZ/tPZL
S1
VCC
TEST CIRCUIT FOR OPEN-DRAIN OUTPUT
Copyright © 2017, Texas Instruments Incorporated
Figure 7-1. Load Circuit for Pulse Duration, Propagation Delay, Output Rise-Time and Fall-Time
Measurement
1. RL = 1.35 kΩ
2. RT termination resistance should be equal to ZOUT of pulse generators.
3. CL includes probe and jig capacitance. CL = 50 pF when on the B-side.
4. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω,
slew rate ≥ 1 V/ns.
5. tPLZ and tPHZ are the same as tdis.
6. tPZL and tPZH are the same as ten.
7. VCCI is the VCC associated with the input port.
8. VCCO is the VCC associated with the output port.
Copyright © 2021 Texas Instruments Incorporated
10
Submit Document Feedback
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
7.1 Voltage Waveforms
VCCI
Input
VCCI / 2
VCCI / 2
0 V
tPLH
tPHL
VOH
0.9 × VCCO
0.1 × VCCO
VCCO / 2
tr
Output
VCCO / 2
VOL
tf
Figure 7-2. Propagation Delay Times
spacer
VCCA
VCCA / 2
VCCA / 2
OE input
0 V
tPLZ
tPZL
VOH
Output
Waveform 1
S1 at 2 × VCCO
VCCO / 2
VCCO× 0.1
VOL
(see Note 2)
tPHZ
tPZH
VOH
0 V
Output
Waveform 2
S1 at GND
VCCO× 0.9
VCCO / 2
(see Note 2)
1. CL includes probe and jig capacitance.
2. Waveform 1 in Figure 7-3 is for an output with internal such that the output is high, except when OE is high (see Figure 7-1).
Waveform 2 in Figure 7-3 is for an output with conditions such that the output is low, except when OE is high.
3. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
4. The outputs are measured one at a time, with one transition per measurement.
5. tPLZ and tPHZ are the same as tdis
.
6. tPZL and tPZH are the same as ten
.
7. tPLH and tPHL are the same as tpd
.
8. VCCI is the VCC associated with the input port.
9. VCCO is the VCC associated with the output port.
Figure 7-3. Enable and Disable Times
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
11
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
8 Detailed Description
8.1 Overview
The TCA9416 device is a directionless voltage-level translator specifically designed for translating logic voltage
levels. The A and B ports are able to accept I/O voltages ranging from 1.08 V to 3.6 V. The device is a pass-gate
architecture with edge-rate accelerators (one-shots) to improve the overall data rate. 10-kΩ pull up resistors,
commonly used in open-drain applications, have been conveniently integrated so that an external resistor is not
needed. When TCA9416 is disabled the one shots are also disabled, but the internal pull ups are still enabled.
Pull up resistors are gated on the supply voltage. When supply is above UVLO, the pull up resistor for that
specific side (A vs B) is enabled.
8.2 Functional Block Diagram
VCCA
VCCB
Gate Bias
Generator
OE
Rise/Fall
Rise/Fall
Accelerator
Accelerator
10 k
10 k
SCL_A
SCL_B
Rise/Fall
Rise/Fall
Accelerator
Accelerator
10 k
10 k
SDA_A
SDA_B
8.3 Feature Description
8.3.1 Architecture
The TCA9416 architecture (see Figure 8-1) is an auto-direction-sensing based translator that does not require a
direction-control signal to control the direction of data flow from A to B or from B to A.
Copyright © 2021 Texas Instruments Incorporated
12
Submit Document Feedback
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
VCCA
VCCB
Gate Bias
Generator
Rise Time
Logic
Rise Time
10 k
10 k
Logic
A
B
Fall Time
Logic
Fall Time
Logic
VCCA
VCCB
Figure 8-1. Architecture of a TCA9416 Cell
These two bidirectional channels support both directions of data flow without a direction-control signal. By
properly biasing the gate of the pass-FET, the FET can turn on (low RDSON), when either side input voltage drops
to ~ 1 voltage threshold below the lowest of the two supplies.
The TCA9416 is part of the TI "Switch" type voltage translator family and employs key circuits to enable this
voltage translation:
1. An N-channel pass-gate transistor topology that ties the A-port to the B-port.
2. Output rise time accelerator circuitry to detect and accelerate rising edges on the A or B ports
3. Output fall time accelerator circuitry to detect and accelerate falling edges on the A or B ports
For bidirectional voltage translation, pull up resistors are included on the device for dc current sourcing
capability. The VGATE gate bias of the N-channel pass transistor is set to the lower supply voltage and can
be represented with MIN(VCCA, VCCB).
The rise and fall time accelerator (RTA and FTA, respectively) circuitry speeds up the output slew rate by
monitoring the input edge for transitions, helping maintain the data rate through the device. During a low-to-high
signal rising edge, the rise time accelerator (RTA) circuit turns on to increase the current drive capability of
the driver. This edge-rate acceleration provides high ac drive by bypassing the internal 10-kΩ pull up resistors
during the low-to-high transition to speed up the signal. The output resistance of the driver is decreased to
approximately 150 Ω during this acceleration phase. During a high-to-low signal falling edge, the fall time
accelerator (FTA) turns on to increase the current drive capability of the driver, similar to the rise time
accelerator. This helps reduce the fall time for large capacitive loads. For light capacitive loads, the fall time
accelerator will not enable.
Both the rise and fall time accelerators have logic to control the rate at which they turn on and off, in order to
reduce ringing and over/undershoots.
8.3.2 Enable and Disable
The TCA9416 has an OE input that is used to disable the device by setting OE low, which prevents any signals
from propagating across the device. This pin is referenced to the VCCA supply. The rise and fall time accelerators
are also disabled. Note that the internal pull up resistors will still be enabled if the supply is above VUVLO. The
disable time (tdis) indicates the delay between the time when OE goes low and when the outputs are disabled
(Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to
become operational after OE is taken high.
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
13
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
8.3.3 Pull up resistors on I/O Lines
Each A-port I/O has an internal 10-kΩ pull up resistor to VCCA, and each B-port I/O has an internal 10-kΩ pull
up resistor to VCCB. If a smaller value of pull up resistor is required, an external resistor must be added from
the I/O to VCCA or VCCB (in parallel with the internal 10-kΩ resistors). However, adding lower value pull up
resistors effects VOL levels. It is recommended not to go below 1.5-kΩ. The internal pull ups of the TCA9416
are controlled by their respective supplies. The resistors have back-biasing protection, so that if a supply is off,
the current cannot flow through the resistors back into the supply. If a supply is above VUVLO_RISE, the pull up
resistor for its side is enabled.
8.4 Device Functional Modes
The TCA9416 device has two functional modes, enabled and disabled. To disable the device set the OE input
low, which disables the rise time and fall time accelerators, and prevents signals from propagating across the
channels. The internal pull up resistors are not affected by the OE input. Setting the OE input high enables the
device.
Copyright © 2021 Texas Instruments Incorporated
14
Submit Document Feedback
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The TCA9416 can be used to bridge the digital-switching compatibility gap between two voltage nodes to
successfully interface logic threshold levels found in electronic systems. It should be used in a point-to-point
topology for interfacing devices or systems operating at different interface voltages with one another. The
primary target application use is for interfacing with open-drain drivers on the data I/Os such as I2C or SMBus,
where the data is bidirectional and no control signal is available.
9.2 Typical Application
Optional Resistors
1.8 V
3.3 V
0.1 ꢀF
VCCA
V
CCB
SDA_A
SCL_A
SDA_B
SCL_B
Controller
I2C
Bus
Devices
I2C
Bus
OE
OE is referenced to VCCA
Figure 9-1. Typical Application Circuit
9.2.1 Design Requirements
For this design example, use the parameters listed in Table 9-1.
Table 9-1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage range
1.08 to 3.6 V
Output voltage range
1.08 to 3.6 V
9.2.2 Detailed Design Procedure
To begin the design process, determine the following:
•
Input voltage range
– Use the supply voltage of the device that is driving the TCA9416 device to determine the input voltage
range. For a valid logic high, the value must exceed the VIH of the input port. For a valid logic low, the
value must be less than the VIL of the input port.
•
Output voltage range
– Use the supply voltage of the device that the TCA9416 device is driving to determine the output voltage
range
– The TCA9416 device has 10-kΩ internal pull up resistors. External pull up resistors can be added to
reduce the total RC of a signal trace if necessary.
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
15
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
9.2.2.1 Startup Considerations with Large Capacitive Load Mismatches
Due to the FET based architecture of this translator, there are some considerations a system designer must
be aware of during powering up with large differences in capacitance between the sides. If one supply with
smaller capacitance is already powered up, and the other is ramping (with OE pin high), the side with the heavier
load can ramp slower than the power supply ramp, due to only having an internal 10kΩ pull up resistor. In this
situation, once the rising POR threshold is met, the device enables all circuitry. If the heavy capacitance side
has not yet risen above about 70% of supply, the device determines this as low, and briefly turns on the fall time
accelerators to propagate a low. Once the fall time accelerator has timed out, the signals rise and sit idle high.
This phenomenon can be eliminated by holding the OE pin low (disabled) until all supplies and busses have
ramped up, since this explicitly disables the bus acceleration circuitry until the bus has completed power up.
Slower supply ramps also help reduce this since the bus voltage follows the supply closer if the ramp is slow.
9.2.3 Application Curve
Figure 9-2. Level-Translation of a 1-MHz Signal
Copyright © 2021 Texas Instruments Incorporated
16
Submit Document Feedback
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
10 Power Supply Recommendations
The TCA9416 has no supply restrictions outside of the 1.08 V to 3.6 V range. VCCA can be higher than or lower
than VCCB. The internal circuitry will select the appropriate supply automatically to correctly support translation.
VCCA can also be the same as VCCB, and the device can be used as a buffer.
The sequencing of each power supply does not damage the device during the power up operation, so either
power supply can be ramped up first. The output-enable (OE) input circuit is designed so that when the (OE)
input is low, the outputs are disabled. No signals may propagate, and the rise time and fall time accelerators are
disabled, but the internal pull up resistors will remain unaffected. To make sure the signals do not pass through
during power up or power down, the OE input pin must be tied to GND through a pull down resistor and should
not be enabled until VCCA and VCCB are fully ramped and stable. If OE is tied to VCCA, this is OK, but might result
in a glitch on the bus during power up depending on the capacitive load and ramp rates. The minimum value of
the pull down resistor to ground is determined by the current-sourcing capability of the driver.
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
17
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
11 Layout
11.1 Layout Guidelines
For reliability of the device, the following common printed-circuit board layout guidelines are recommended:
1. Bypass capacitors should be used on power supplies and should be placed as close as possible to the
VCCA, VCCB pin, and GND pin.
2. Short trace lengths should be used to avoid excessive loading.
3. Keep SCL and SDA lengths close to prevent skewing the signals.
4. PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than
the one-shot duration, approximately 30 ns. Making sure that any reflection encounters low impedance at the
source driver.
11.2 Layout Example
SCL_A
OE
SCL_B
VCCB
GND
To MCU
GND
VCCB
GND
CAP
TCA9416
CAP
VCCA
SDA_A
VCCA
SDA_B
Figure 11-1. TCA9416 Layout Example (DDF)
Copyright © 2021 Texas Instruments Incorporated
18
Submit Document Feedback
Product Folder Links: TCA9416
TCA9416
www.ti.com
SCPS238A – FEBRUARY 2021 – REVISED AUGUST 2021
12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
19
Product Folder Links: TCA9416
PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TCA9416DDFR
TCA9416DTMR
ACTIVE SOT-23-THIN
DDF
DTM
8
8
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
-40 to 125
2JGF
LC
ACTIVE
X2SON
5000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2021
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Dec-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TCA9416DDFR
SOT-
DDF
8
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
23-THIN
TCA9416DTMR
TCA9416DTMR
X2SON
X2SON
DTM
DTM
8
8
5000
5000
180.0
178.0
9.5
8.4
0.93
0.93
1.49
1.49
0.43
0.43
2.0
2.0
8.0
8.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Dec-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TCA9416DDFR
TCA9416DTMR
TCA9416DTMR
SOT-23-THIN
X2SON
DDF
DTM
DTM
8
8
8
3000
5000
5000
210.0
189.0
205.0
185.0
185.0
200.0
35.0
36.0
33.0
X2SON
Pack Materials-Page 2
PACKAGE OUTLINE
DDF0008A
SOT-23 - 1.1 mm max height
S
C
A
L
E
4
.
0
0
0
PLASTIC SMALL OUTLINE
C
2.95
2.65
SEATING PLANE
TYP
PIN 1 ID
AREA
0.1 C
A
6X 0.65
8
1
2.95
2.85
NOTE 3
2X
1.95
4
5
0.4
0.2
8X
0.1
C A
B
1.65
1.55
B
1.1 MAX
0.20
0.08
TYP
SEE DETAIL A
0.25
GAGE PLANE
0.1
0.0
0 - 8
0.6
0.3
DETAIL A
TYPICAL
4222047/B 11/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DDF0008A
SOT-23 - 1.1 mm max height
PLASTIC SMALL OUTLINE
8X (1.05)
SYMM
1
8
8X (0.45)
SYMM
6X (0.65)
5
4
(R0.05)
TYP
(2.6)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222047/B 11/2015
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DDF0008A
SOT-23 - 1.1 mm max height
PLASTIC SMALL OUTLINE
8X (1.05)
SYMM
(R0.05) TYP
8
1
8X (0.45)
SYMM
6X (0.65)
5
4
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4222047/B 11/2015
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DTM0008A
X2SON - 0.4 mm max height
S
C
A
L
E
1
2
.
0
0
0
PLASTIC SMALL OUTLINE - NO LEAD
0.85
0.75
A
B
PIN 1 INDEX AREA
1.4
1.3
C
0.4 MAX
SEATING PLANE
0.05 C
0.04
0.00
SYMM
(0.102) TYP
5
3
0.27
0.17
2X
4
2X
1
SYMM
0.54
2
1
6
7
4X
8
0.5
0.25
0.15
6X
PIN 1 ID
0.27
0.17
6X
0.1
C B A
C
0.05
4224755/A 01/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad(s) must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DTM0008A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.42)
6X (0.2)
(
0.22)
1
7
8
(0.27)
SYMM
(45 X 0.75)
(0.5)
4
5
3
(45 X 0.1)
(R0.05) TYP
SYMM
(0.78)
SEE SOLDER MASK
DETAILS
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:40X
0.0325 MIN
ALL AROUND
0.0325 MAX
ALL AROUND
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL EDGE
SOLDER MASK
DEFINED
(PREFERRED)
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4224755/A 01/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
DTM0008A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0.2) TYP
4X (0.42)
(
0.22)
7
6X (0.2)
(0.411)
1
8
(0.27)
SYMM
(0.5)
4
5
3
EXPOSED
METAL
SYMM
(R0.05) TYP
(0.78)
PINS: 1,3,5,7
SOLDER PASTE EXAMPLE
BASED ON 0.075 mm THICK STENCIL
SCALE: 40X
4224755/A 01/2019
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated
相关型号：
TCA9509
LEVEL-TRANSLATING I2C/SMBUS BUS REPEATERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9509DGKR
LEVEL-TRANSLATING I2C/SMBUS BUS REPEATERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9509MRVHR
具有内部 1mA 拉电流的 2 位电平转换 400kHz I2C/SMBus 缓冲器/中继器 | RVH | 8 | -40 to 85Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9509RVHR
LEVEL-TRANSLATING I2C/SMBUS BUS REPEATERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9509_13
LEVEL-TRANSLATING I2C/SMBUS BUS REPEATERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9511A
2 位双向 2.3V 至 5.5V 热插拔 400kHz I2C/SMBus 缓冲器Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9511ADGKR
2 位双向 2.3V 至 5.5V 热插拔 400kHz I2C/SMBus 缓冲器 | DGK | 8 | -40 to 125Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9517
LEVEL-TRANSLATING I2C BUS REPEATERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9517-Q1
具有断电高阻抗的汽车类 2 位电平转换 400kHz I2C/SMBus 缓冲器/中继器Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9517A
LEVEL-TRANSLATING I2C BUS REPEATERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9517ADGKR
LEVEL-TRANSLATING I2C BUS REPEATERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCA9517DGKR
LEVEL-TRANSLATING I2C BUS REPEATERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
©2020 ICPDF网 联系我们和版权申明