TCAN1046A-Q1 [TI]
具有待机模式的增强型汽车类双路 CAN 收发器;
| 型号： | TCAN1046A-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有待机模式的增强型汽车类双路 CAN 收发器 |
| 文件： | 总22页 (文件大小：1954K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
TCAN1046A-Q1 具有待机模式的汽车类双路CAN FD 收发器
1 特性
3 说明
• AEC-Q100（等级1）：符合汽车应用要求
• 两个具有模式控制功能的独立高速CAN FD 收发器
• 符合ISO 11898-2:2016 物理层标准要求
• 提供功能安全
TCAN1046A-Q1 是一款双路高速控制器局域网 (CAN)
收发器，符合 ISO 11898-2:2016 高速 CAN 规范的物
理层要求。
该器件支持传统 CAN 和CAN FD 网络（数据速率高达
8 兆位/秒 (Mbps)）。此外，该器件具有两个带独立电
源（VCC1 和 VCC2 ）和模式控制引脚（STB1 和
STB2）的 CAN FD 通道，允许每个 CAN 通道真正独
立地运行。在需要冗余或额外 CAN FD 通道作为系统
故障时的备份的应用中，能够独立操作每个通道的能力
非常重要。
– 可帮助进行功能安全系统设计的文档
• 支持传统CAN 和经优化的CAN FD 性能（数据速
率为2、5 和8Mbps）
– 具有较短的对称传播延迟时间，可增加时序裕量
• 支持12V 和24V 电池应用
• 接收器共模输入电压：±12V
• 保护特性：
该器件具有很多保护和诊断功能，包括热关断 (TSD)、
TXD 显性超时 (DTO) 和高达 ±58V 的总线故障保护，
并且定义了电源欠压或引脚悬空情况下的失效防护行
为。
– 总线故障保护：±58V
– 欠压保护
– TXD 显性超时(DTO)
• 数据速率低至9.2kbps
– 热关断保护(TSD)
• 工作模式：
– 正常模式
– 支持远程唤醒请求功能的低功耗待机模式
• 优化了未上电时的性能
器件信息
封装(1)
VSON (DMT) (14)
SOIC (D) (14)
封装尺寸（标称值）
4.50mm x 3.00mm
8.95mm x 3.91mm
器件型号
TCAN1046A-Q1
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
– 总线和逻辑引脚为高阻抗（运行总线或应用上无
负载）
VIN
VIN
VOUT
– 支持热插拔：在总线和RXD 输出上可实现上电
和断电无干扰运行
• 结温范围：–40°C 至150°C
• 采用SOIC (14) 封装和无引线VSON (14) 封装
(4.5mm x 3.0mm)，具有改进的自动光学检查(AOI)
功能
5V Voltage
Regulator
(e.g. TPSxxxx)
4
11
VCC2
CANH1
VDD
VCC1
13
14
GPIO
STB1
4
RXD1
TXD1
CAN FD
Controller
1
12
CANL1
System Controller
Optional:
Terminating
Node
Optional:
Filtering,
TCAN1046A-Q1
Transient and
ESD
Dual CAN FD
Transceiver
2 应用
8
GPIO
STB2
10
CANH2
7
6
CAN FD
Controller
RXD2
TXD2
• 汽车和运输
– 车身控制模块
– 汽车网关
9
CANL2
– 高级驾驶辅助系统(ADAS)
– 信息娱乐系统
Optional:
Terminating
Node
Optional:
Filtering,
Transient and
ESD
简化版原理图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLLSFJ4
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
4 Pin Configuration and Functions
TXD1
GND1
VCC1
RXD1
TXD2
GND2
VCC2
1
2
3
4
5
6
7
14
13
12
11
10
9
STB1
TXD1
GND1
VCC1
RXD1
TXD2
GND2
VCC2
1
2
3
4
5
6
7
14
13
12
11
10
9
STB1
CANH1
CANL1
STB2
CANH1
CANL1
STB2
Thermal
Pad
CANH2
CANL2
RXD2
CANH2
CANL2
RXD2
8
8
Not to scale
Not to scale
图4-1. D Package, 14 Pin SOIC, Top View
图4-2. DMT Package, 14 Pin VSON, Top View
表4-1. Pin Functions
Pins
Type
Description
Name
TXD1
GND1
VCC1
No.
1
Digital Input CAN transmit data input 1, integrated pull-up
2
GND1
Ground connection, transceiver 1
5-V supply voltage, transceiver 1
3
Supply
RXD1
TXD2
GND2
VCC2
4
Digital Output CAN receive data output 1, tri-state when VCC < UVVCC
Digital Input CAN transmit data input 2, integrated pull-up
5
6
GND2
Ground connection, transceiver 2
5-V supply voltage, transceiver 2
7
Supply
RXD2
CANL2
CANH2
STB2
8
Digital Output CAN receive data output 2, tri-state when VCC < UVVCC
9
Bus IO
Bus IO
Low-level CAN bus 2 input/output line
High-level CAN bus 2 input/output line
10
11
12
13
14
Digital Input Standby input 2 for mode control, integrated pull-up
CANL1
CANH1
STB1
Bus IO
Bus IO
Low-level CAN bus 1 input/output line
High-level CAN bus 1 input/output line
Digital Input Standby input 1 for mode control, integrated pull-up
Electrically connected to GND, connect the thermal pad to the printed circuit board (PCB)
ground plane for thermal relief
Thermal Pad (VSON only)
—
Copyright © 2022 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: TCAN1046A-Q1
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
5 Device and Documentation Support
5.1 Device Support
This device conforms to the following CAN standards. The core of what is needed is covered within this system
specification; however, reference should be made to these standards and any discrepancies pointed out and
discussed. This document should provide all the basics of what is needed. However, for a full understanding of
CAN including the protocol these additional sources are helpful as the scope of CAN protocol in detail is outside
the scope of this physical layer (transceiver) specification.
5.1.1 Device Nomenclature
CAN Transceiver Physical Layer Standards:
• ISO 11898-2:2016 High speed medium access unit (original High Speed CAN transceiver standard)
• ISO 11898-5 High speed medium access unit with low power mode (super sets -2 standard electrically in
several specs and adds the original wake up capability via the bus in low power mode).
• ISO 11898-6 High speed medium access unit with selective wake.
• ISO 8802-3: CSMA/CD –referenced for collision detection from ISO11898-2
• CAN FD 1.0 Spec and Papers
• Bosch “Configuration of CAN Bit Timing”, Paper from 6th International CAN Conference (ICC), 1999. This
is repeated a lot in the DCAN IP CAN Controller spec copied into this system spec.
• GMW3122: GM requirements for HS CAN
• SAE J2284-2: High Speed CAN (HSC) for Vehicle Applications at 250 kbps
• SAE J2284-3: High Speed CAN (HSC) for Vehicle Applications at 500 kbps
EMC requirements:
• HW Requirements for CAN, LIN, FR V1.3: German OEM requirements for HS CAN
Conformance Test requirements:
• HS_TRX_Test_Spec_V_1_0: GIFT / ICT CAN test requirements for High Speed Physical Layer
5.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TCAN1046A-Q1
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
5.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: TCAN1046A-Q1
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
6.1 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
TCAN1046ADMTRQ1
TCAN1046ADRQ1
VSON
SOIC
DMT
D
14
14
3000
2500
330.0
330.0
12.4
16.4
3.2
6.5
4.7
9.0
1.15
2.1
8.0
8.0
12.0
16.0
Q1
Q1
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: TCAN1046A-Q1
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
SPQ
3000
2500
Length (mm) Width (mm)
Height (mm)
55.0
TCAN1046ADMTRQ1
TCAN1046ADRQ1
VSON
SOIC
DMT
D
14
14
370.0
853.0
355.0
449.0
35.0
Copyright © 2022 Texas Instruments Incorporated
6
Submit Document Feedback
Product Folder Links: TCAN1046A-Q1
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
PACKAGE OUTLINE
D0014A
SOIC - 1.75 mm max height
S
C
A
L
E
1
.
8
0
0
SMALL OUTLINE INTEGRATED CIRCUIT
C
6.2
5.8
TYP
SEATING PLANE
0.1 C
PIN 1 ID
AREA
A
12X 1.27
14
1
2X
8.75
8.55
NOTE 3
7.62
7
8
0.51
0.31
14X
4.0
3.8
B
1.75 MAX
0.25
C A B
NOTE 4
0.25
0.13
TYP
SEE DETAIL A
0.25
GAGE PLANE
0.25
1.27
0.10
0.40
0 - 8
DETAIL A
TYPICAL
4220718/A 09/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.
5. Reference JEDEC registration MS-012, variation AB.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
7
Product Folder Links: TCAN1046A-Q1
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
EXAMPLE BOARD LAYOUT
D0014A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
14X (1.55)
SYMM
1
14
14X (0.6)
12X (1.27)
SYMM
8
7
(R0.05)
TYP
(5.4)
LAND PATTERN EXAMPLE
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220718/A 09/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
8
Submit Document Feedback
Product Folder Links: TCAN1046A-Q1
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
EXAMPLE STENCIL DESIGN
D0014A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
14X (1.55)
SYMM
1
14
14X (0.6)
12X (1.27)
SYMM
7
8
(5.4)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:8X
4220718/A 09/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
9
Product Folder Links: TCAN1046A-Q1
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
PACKAGE OUTLINE
DMT0014B
VSON - 1 mm max height
SCALE 3.200
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
A
B
PIN 1 INDEX AREA
4.6
4.4
0.1 MIN
(0.13)
1.0
0.8
S
C
A
L
E
3
0
.
0
0
0
SECTION A-A
TYPICAL
C
SEATING PLANE
0.08 C
0.05
0.00
1.6 0.1
SYMM
EXPOSED
THERMAL PAD
(0.2) TYP
7
8
(0.19) TYP
A
A
2X
15
SYMM
3.9
4.2 0.1
14
1
12X 0.65
0.35
0.25
14X
0.45
0.35
PIN 1 ID
(OPTIONAL)
14X
0.1
C A B
0.05
C
4225087/B 01/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
10
Submit Document Feedback
Product Folder Links: TCAN1046A-Q1
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
EXAMPLE BOARD LAYOUT
DMT0014B
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.6)
14X (0.6)
14X (0.3)
SYMM
1
14
2X
(1.85)
12X (0.65)
SYMM
15
(4.2)
(0.69)
TYP
(
0.2) VIA
TYP
8
7
(R0.05) TYP
(0.55) TYP
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4225087/B 01/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
11
Product Folder Links: TCAN1046A-Q1
TCAN1046A-Q1
ZHCSLK9 –JULY 2021
www.ti.com.cn
EXAMPLE STENCIL DESIGN
DMT0014B
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.47)
15
14X (0.6)
1
14
14X (0.3)
(1.18)
12X (0.65)
SYMM
(1.38)
(R0.05) TYP
METAL
TYP
8
7
SYMM
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 15
77.4% PRINTED SOLDER COVERAGE BY AREA
SCALE:20X
4225087/B 01/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
12
Submit Document Feedback
Product Folder Links: TCAN1046A-Q1
重要声明和免责声明
TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没
有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。
TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI
提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021，德州仪器(TI) 公司
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jun-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TCAN1046ADMTRQ1
TCAN1046ADRQ1
ACTIVE
ACTIVE
VSON
SOIC
DMT
D
14
14
3000 RoHS & Green
2500 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
-40 to 150
-40 to 150
1046A
1046A
Samples
Samples
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jun-2022
Addendum-Page 2
GENERIC PACKAGE VIEW
DMT 14
3 x 4.5, 0.65 mm pitch
VSON - 0.9 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225088/A
www.ti.com
PACKAGE OUTLINE
DMT0014B
VSON - 1 mm max height
SCALE 3.200
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
A
B
PIN 1 INDEX AREA
4.6
4.4
0.1 MIN
(0.13)
1.0
0.8
SECTION A-A
SCALE 30.000
SECTION A-A
TYPICAL
C
SEATING PLANE
0.08 C
0.05
0.00
1.6 0.1
SYMM
EXPOSED
THERMAL PAD
(0.2) TYP
7
8
(0.19) TYP
A
A
2X
3.9
15
SYMM
4.2 0.1
14
1
12X 0.65
0.35
0.25
14X
0.45
0.35
PIN 1 ID
14X
0.1
C A B
(OPTIONAL)
0.05
C
4225087/B 01/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DMT0014B
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.6)
14X (0.6)
14X (0.3)
SYMM
1
14
2X
(1.85)
12X (0.65)
SYMM
15
(4.2)
(0.69)
TYP
(
0.2) VIA
TYP
8
7
(R0.05) TYP
(0.55) TYP
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4225087/B 01/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DMT0014B
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.47)
15
14X (0.6)
1
14
14X (0.3)
(1.18)
12X (0.65)
SYMM
(1.38)
(R0.05) TYP
METAL
TYP
8
7
SYMM
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 15
77.4% PRINTED SOLDER COVERAGE BY AREA
SCALE:20X
4225087/B 01/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022，德州仪器 (TI) 公司
相关型号：
TCAN1046ADMTRQ1
具有待机模式的增强型汽车类双路 CAN 收发器 | DMT | 14 | -40 to 150Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1046ADRQ1
具有待机模式的增强型汽车类双路 CAN 收发器 | D | 14 | -40 to 150Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1046AV-Q1
TCAN104xAV-Q1 Automotive Dual CAN FD Transceiver with 1.8-V I/O Support and Standby ModeWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1046AV-Q1_V01
TCAN104xAV-Q1 Automotive Dual CAN FD Transceiver with 1.8-V I/O Support and Standby ModeWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1046AVDMTRQ1
具有待机模式和 1.8V I/O 支持的增强型汽车双路 CAN 收发器 | DMT | 14 | -40 to 150Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1046AVDRQ1
具有待机模式和 1.8V I/O 支持的增强型汽车双路 CAN 收发器 | D | 14 | -40 to 150Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1046AVDYYRQ1
具有待机模式和 1.8V I/O 支持的增强型汽车双路 CAN 收发器 | DYY | 14 | -40 to 150Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1046DMTRQ1
汽车类高速双路 CAN 收发器 | DMT | 14 | -40 to 125Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1046V-Q1
具有待机和 1.8V IO 支持的汽车类高速双 CAN 收发器Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1046VDMTRQ1
具有待机和 1.8V IO 支持的汽车类高速双 CAN 收发器 | DMT | 14 | -40 to 125Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1048AV-Q1
TCAN104xAV-Q1 Automotive Dual CAN FD Transceiver with 1.8-V I/O Support and Standby ModeWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TCAN1048AVDMTRQ1
具有低功耗待机模式和 1.8V I/O 支持的增强型汽车类双路 CAN 收发器 | DMT | 14 | -40 to 150Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
©2020 ICPDF网 联系我们和版权申明