TFP410MPAPREPG4 [TI]

增强型产品 Panelbus™ 数字变送器 | PAP | 64 | -55 to 125;
TFP410MPAPREPG4
型号: TFP410MPAPREPG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

增强型产品 Panelbus™ 数字变送器 | PAP | 64 | -55 to 125

驱动 接口集成电路 显示驱动器 驱动程序和接口
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TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
D
Controlled Baseline  
One Assembly  
One Test Site  
D
D
Enhanced PLL Noise Immunity  
On-Chip Regulators and Bypass  
Capacitors for Reducing System Costs  
One Fabrication Site  
Enhanced Jitter Performance  
No HSYNC Jitter Anomaly  
Negligible Data-Dependent Jitter  
D
D
D
D
D
D
Extended Temperature Performance of  
55°C to 125°C  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
2
D
D
Programmable Using I C Serial Interface  
Monitor Detection Through Hot-Plug and  
Receiver Detection  
Enhanced Product-Change Notification  
Qualification Pedigree  
D
Single 3.3-V Supply Operation  
(1)  
Digital Visual Interface (DVI) Compliant  
D
64-Pin Thin Quad Flat Pack (TQFP) Using  
TI’s PowerPADPackage  
TI Advanced 0.18-μm EPIC-5CMOS  
Process Technology  
Supports Pixel Rates Up to 165MHz  
(Including 1080p and WUXGA at 60Hz)  
D
D
D
Universal Graphics Controller Interface  
12-Bit Dual-Edge and 24-Bit Single-Edge  
Input Modes  
Adjustable 1.1-V to 1.8-V and Standard  
3.3-V CMOS Input Signal Levels  
Fully Differential and Single-Ended Input  
Clocking Modes  
Pin Compatible With SiI164 DVI Transmitter  
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life. Such qualification  
testing should not be viewed as justifying use of this component  
beyond specified performance and environmental limits.  
Standard Intelt 12-Bit Digital Video Port  
Compatible as on Intel 81x Chipsets  
description  
The TFP410 is a Texas Instruments PanelBust flat panel display product, part of a comprehensive family of  
end-to-end digital visual interface (DVI) 1.0-compliant solutions, targeted at the PC and consumer electronics  
industry.  
The TFP410 provides a universal interface to allow a glueless connection to most commonly available graphics  
controllers. Some of the advantages of this universal interface include selectable bus widths, adjustable signal  
levels, and differential and single-ended clocking. The adjustable 1.1-V to 1.8-V digital interface provides a  
low-EMI, high-speed bus that connects seamlessly with 12-bit or 24-bit interfaces. The DVI interface supports  
flat panel display resolutions up to UXGA at 165 MHz in 24-bit true color pixel format.  
The TFP410 combines PanelBus circuit innovation with TI advanced 0.18-μm EPIC-5 CMOS process  
technology and ultralow ground inductance PowerPADt package. The result is a compact 64-pin thin quad flat  
pack (TQFP) package providing a reliable, low-current, low-noise, high-speed digital interface solution.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
55°C to 125°C  
PAP TQFP Tape and reel  
TFP410MPAPREP  
TFP410MEP  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design  
guidelines are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
1. The digital visual interface (DVI) specification is an industry standard developed by the digital display working group (DDWG) for high-speed  
digital connection to digital displays and has been adopted by industry-leading PC and consumer electronics manufacturers. The TFP410  
is compliant to the DVI Revision 1.0 specification.  
PanelBus, PowerPAD, and EPIC-5 are trademarks of Texas Instruments.  
VESA is a trademark of Video Electronics Standards Association.  
Intel is a trademark of Intel Corporation.  
Copyright © 2006 2011, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These  
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,  
Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated  
voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device  
should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level,  
preferably either V or ground. Specific guidelines for handling devices of this type are contained in the publication Guidelines for  
CC  
Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.  
pin assignments  
PAP PACKAGE  
(TOP VIEW)  
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33  
49  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
NC  
DATA11  
DATA10  
DATA9  
DATA8  
DATA7  
DATA6  
IDCK  
IDCK+  
TGND  
TX2+  
TX2−  
TVDD  
TX1+  
TX1−  
TGND  
TX0+  
TX0−  
TVDD  
50  
51  
52  
53  
54  
55  
56  
57  
DATA5 58  
DATA4 59  
DATA3 60  
DATA2 61  
22 TXC+  
21 TXC−  
20 TGND  
19 TFADJ  
DATA1  
DATA0  
DGND  
62  
63  
64  
PVDD  
PGND  
18  
17  
1 2  
3
4
5
6 7 8 9 10 11 12 13 14 15 16  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
functional block diagram  
Universal Input  
TMDS Transmitter  
IDCK  
DATA[23:0]  
DE  
12/24 Bit  
I/F  
Data  
Format  
Serializer  
Serializer  
Serializer  
Control  
TX2  
TX1  
VSYNC  
HSYNC  
Encoder  
Encoder  
Encoder  
V
REF  
EDGE/HTPLG  
DKEN  
TX0  
TXC  
MSEN  
PD  
ISEL/RST  
CTL/A/DK[3:1]  
TFADJ  
2
BSEL/SCL  
DSEL/SDA  
I C Slave I/F  
For DDC  
1.8-V Regulators  
With Bypass  
Capacitors  
PLL  
Terminal Functions  
TERMINAL  
NAME  
I/O  
DESCRIPTION  
NO.  
Input  
The operation of these three multifunction inputs depends on the settings of the ISEL (pin 13) and  
DKEN (pin 35) inputs. All three inputs support 3.3-V CMOS signal levels and contain weak pulldown  
resistors so that, if left unconnected, they default to all low.  
2
When the I C bus is disabled (ISEL = low) and the deskew mode is disabled (DKEN = low), pins 7 and 8  
become the control inputs, CTL[2:1], which can be used to send additional information across the DVI  
link during the blanking interval (DE = low). Pin 6 is not used.  
A3/DK3  
CTL2/A2/DK2  
CTL1/A1/DK1  
6
7
8
I
2
When the I C bus is disabled (ISEL = low) and the deskew mode is enabled (DKEN = high), these three  
inputs become the deskew inputs DK[3:1], used to adjust the setup and hold times of the pixel data  
inputs DATA[23:0], relative to the clock input IDCK .  
2
2
When the I C bus is enabled (ISEL = high), these three inputs become the three LSBs of the I C slave  
address, A[3:1].  
Upper 12 bits of the 24-bit pixel bus  
In 24-bit, single-edge input mode (BSEL = high), this bus inputs the top half of the 24-bit pixel bus.  
In 12-bit, dual-edge input mode (BSEL = low), these bits are not used to input pixel data. In this mode,  
2
DATA[23:12]  
DATA[11:0]  
3647  
I
I
the state of DATA[23:16] is input to the I C register CFG. This allows eight bits of user configuration  
2
2
data to be read by the graphics controller through the I C interface (see the I C register descriptions  
section).  
Note: All unused data inputs should be tied to GND or V  
.
DD  
Lower 12 bits of the 24-bit pixel bus/12-bit pixel bus input  
5055,  
5863  
In 24-bit, single-edge input mode (BSEL = high), this bus inputs the bottom half of the 24-bit pixel bus.  
In 12-bit, dual-edge input mode (BSEL = low), this bus inputs one-half a pixel (12 bits) at every latch  
edge (both rising and falling) of the clock.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
Terminal Functions (Continued)  
TERMINAL  
NAME  
I/O  
DESCRIPTION  
NO.  
2
Data enable. As defined in DVI 1.0 specification, the DE signal allows the transmitter to encode pixel  
data or control data on any given input clock cycle. During active video (DE = high), the transmitter  
encodes pixel data, DATA[23:0]. During the blanking interval (DE = low), the transmitter encodes  
HSYNC, VSYNC, and CTL[3:1].  
DE  
I
I
HSYNC  
4
Horizontal sync input  
Differential clock input. The TFP410 supports both single-ended and fully differential clock input  
modes. In the single-ended clock input mode, the IDCK+ input (pin 57) should be connected to the  
single-ended clock source and the IDCKinput (pin 56) should be tied to GND. In the differential clock  
input mode, the TFP410 uses the crossover point between the IDCK+ and IDCKsignals as the timing  
reference for latching incoming data DATA[23:0], DE, HSYNC, and VSYNC. The differential clock input  
mode is only available in the low signal swing mode.  
IDCK−  
IDCK+  
56  
57  
I
I
VSYNC  
5
Vertical sync input  
Configuration/Programming  
2
2
Input bus select/I C clock input. The operation of this pin depends on whether the I C interface is  
enabled or disabled. This pin is only 3.3-V tolerant.  
2
When I C is disabled (ISEL = low), a high level selects 24-bit input, single-edge input mode. A low level  
selects 12-bit input, dual-edge input mode.  
BSEL/SCL  
15  
35  
14  
9
I
2
2
2
When I C is enabled (ISEL = high), this pin functions as the I C clock input (see the I C register  
descriptions section). In this configuration, this pin has an open-drain output that requires an external  
5-kΩ pullup resistor connected to V  
.
DD  
2
2
Data deskew enable. The deskew function can be enabled either through I C or by this pin when I C is  
disabled. When deskew is enabled, the input clock to data setup/hold time can be adjusted in discrete  
trim increments. The amount of trim per increment is defined by t  
.
(STEP)  
2
When I C is disabled (ISEL = low), a high level enables deskew with the trim increment determined by  
pins DK[3:1] (see the data deskew section). A low level disables deskew and the default trim setting is  
used.  
DKEN  
I
I/O  
I
2
2
When I C is enabled (ISEL = high), the value of DKEN and the trim increment are selected through I C.  
In this configuration, the DKEN pin should be tied to either GND or V to avoid a floating input.  
DD  
2
2
DSEL/I C data. The operation of this pin depends on whether the I C interface is enabled or disabled.  
This pin is only 3.3-V tolerant.  
2
When I C is disabled (ISEL = low), this pin is used with BSEL and V  
to select the single-ended or  
REF  
differential input clock mode (see the universal graphics controller interface modes section).  
DSEL/SDA  
2
2
When I C is enabled (ISEL = high), this pin functions as the I C bidirectional data line. In this  
configuration, this pin has an open-drain output that requires an external 5-kΩ pullup resistor  
connected to V  
.
DD  
2
Edge select/hot plug input. The operation of this pin depends on whether the I C interface is enabled or  
disabled. This input is 3.3-V tolerant only.  
2
When I C is disabled (ISEL = low), a high level selects the primary latch to occur on the rising edge of  
the input clock IDCK+. A low level selects the primary latch to occur on the falling edge of the input clock  
IDCK+. This is the case for both single-ended and differential input clock modes.  
EDGE/HTPLG  
2
When I C is enabled (ISEL = high), this pin is used to monitor the hot plug detect signal (see the DVI or  
VESAP&D and DFP standards). When used for hot-plug detection, this pin requires a series 1-KΩ  
resistor.  
2
2
I C interface select/I C reset (active low, asynchronous)  
2
2
2
If ISEL is high, the I C interface is active. Default values for the I C registers can be found in the I C  
register descriptions section.  
2
ISEL/RST  
13  
I
If ISEL is low, I C is disabled and the chip configuration is specified by the configuration pins (BSEL,  
DSEL, EDGE, V ) and state pins (PD, DKEN).  
REF  
2
If ISEL is brought low and then back high, the I C state machine is reset. The register values are  
changed to their default values and are not preserved from before the reset.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
Terminal Functions (Continued)  
TERMINAL  
NAME  
I/O  
DESCRIPTION  
NO.  
2
Monitor sense/programmable output 1. The operation of this pin depends on whether the I C interface  
is enabled or disabled. This pin has an open-drain output and is only 3.3-V tolerant. An external 5-kΩ  
pullup resistor connected to V is required on this pin.  
DD  
2
When I C is disabled (ISEL = low), a high level indicates a powered-on receiver is detected at the  
MSEN/PO1  
11  
O
differential outputs. A low level indicates a powered-on receiver is not detected. This function is valid  
only in dc-coupled systems.  
2
2
2
When I C is enabled (ISEL = high), this output is programmable through the I C interface (see the I C  
register descriptions section).  
2
Power down (active low). In the power-down state, only the digital I/O buffers and I C interface remain  
active.  
2
When I C is disabled (ISEL = low), a high level selects the normal operating mode. A low level selects  
the power-down mode.  
PD  
10  
I
2
2
When I C is enabled (ISEL = high), the power-down state is selected through I C. In this configuration,  
PD should be tied to GND.  
2
Note: The default register value for PD is low, so the device is in power-down mode when I C is first  
2
enabled or after an I C reset.  
Input reference voltage. Selects the swing range of the digital data inputs (DATA[23:0], DE, HSYNC,  
VSYNC, and IDCK ).  
For high-swing 3.3-V input signal levels, V  
should be tied to V  
.
REF  
DD  
V
REF  
3
I
For low-swing input signal levels, V  
should be set to half of the maximum input voltage level. See  
REF  
the recommended operating conditions section for the allowable range for V  
.
REF  
The desired V  
voltage level is typically derived using a simple voltage-divider circuit.  
REF  
Reserved  
RESERVED  
34  
In  
This pin is reserved and must be tied to GND for normal operation.  
DVI Differential Signal Output  
Full-scale adjust. This pin controls the amplitude of the DVI output voltage swing, determined by the  
value of the pullup resistor R connected to TV  
TFADJ  
19  
I
.
DD  
TFADJ  
TX0+  
TX0−  
25  
24  
Channel 0 DVI differential output pair. TX0 transmits the 8-bit blue pixel data during active video and  
HSYNC and VSYNC during the blanking interval.  
O
O
O
O
TX1+  
TX1−  
28  
27  
Channel 1 DVI differential output pair. TX1 transmits the 8-bit green pixel data during active video and  
CTL[1] during the blanking interval.  
TX2+  
TX2−  
31  
30  
Channel 2 DVI differential output pair. TX2 transmits the 8-bit red pixel data during active video and  
CTL[3:2] during the blanking interval.  
TXC+  
TXC−  
22  
21  
DVI differential output clock  
Power and Ground  
DGND  
16, 48, 64 Ground Digital ground  
DV  
NC  
1, 12, 33  
Power Digital power supply. Must be set to 3.3-V nominal.  
NC No connection required. If connected, tie high.  
DD  
49  
17  
18  
PGND  
PV  
Ground PLL ground  
Power PLL power supply. Must be set to 3.3-V nominal.  
DD  
TGND  
TV  
20, 26, 32 Ground Transmitter differential output driver ground  
23, 29  
Power Transmitter differential output driver power supply. Must be set to 3.3-V nominal.  
DD  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†  
Supply voltage range, DV , PV , TV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4 V  
DD  
DD  
DD  
Input voltage, logic/analog signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4 V  
External DVI single-ended termination resistance, R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 Ω to open circuit  
T
External TFADJ resistance, R  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 Ω to open circuit  
TFADJ  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
stg  
Case temperature for 10 s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
Lead temperature 1,6 mm (1/16 in) from case for 10 s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
ESD protection: DVI pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 kV, Human-Body Model  
All other pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV, Human-Body Model  
JEDEC latch up (EIA/JESD78) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall  
device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.  
dissipation ratings  
AIR FLOW  
(cfm)  
T
3 255C  
DERATING FACTOR  
T
= 705C  
T
= 855C  
T
A
= 1255C  
A
A
A
PACKAGE  
POWER RATING  
ABOVE T = 255C  
POWER RATING POWER RATING POWER RATING  
A
PAP  
0
2.962 W  
23.7 mW/°C  
1.895 W  
1.54 W  
592 mW  
NOTE: See Table 2 for the thermal properties of the 64-pin TQFP PowerPAD package.  
recommended operating conditions  
MIN  
NOM  
MAX  
UNIT  
Supply voltage, V (DV , PV , TV )  
DD  
3
3.3  
3.6  
0.9  
V
DD  
DD  
DD  
§
Low-swing mode  
High-swing mode  
DVI receiver  
0.55  
V
/2  
DDQ  
Input reference voltage, V  
V
REF  
DV  
DD  
DVI termination supply voltage, AV (see Note 1)  
3.14  
45  
3.3  
50  
3.46  
V
Ω
DD  
DVI Single-ended termination resistance, R (see Note 2)  
DVI receiver  
55  
515  
125  
T
TFADJ resistor for DVI-compliant V  
, R  
400 mV = V = 600 mV  
(SWING)  
505  
55  
510  
25  
Ω
(SWING)  
(TFADJ)  
Operating free-air temperature, T  
°C  
A
§
V
DDQ  
defines the maximum low-level input voltage, it is not an actual input voltage.  
NOTES: 1. AV is the termination supply voltage of the DVI link.  
DD  
2. R is the single-ended termination resistance at the receiver end of the DVI link.  
T
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
 
TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
dc specifications  
PARAMETERS  
Data, DE, VSYNC,  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V
= DV  
0.7 V  
DD  
REF  
DD  
HSYNC, and IDCK+/−  
0.5 V V  
0.95 V  
0.95 V  
V
+ 0.2  
V
High-level input voltage  
V
REF  
REF  
IH  
IL  
Other inputs  
0.7 V  
DD  
V
REF  
= DV  
0.3 V  
DD  
DD  
Data, DE, VSYNC,  
HSYNC, and IDCK+/−  
Low-level input voltage  
(CMOS input)  
0.5 V V  
V
0.2  
V
V
REF  
REF  
Other inputs  
0.3V  
DD  
V
V
High-level digital output voltage (open-drain output)  
Low-level digital output voltage (open-drain output)  
High-level input current  
V
V
= 3 V, I = 20 μA  
2.4  
V
V
OH  
DD  
OH  
= 3.6 V, I = 4 mA  
0.4  
50  
50  
OL  
DD  
OL  
I
IH  
I
IL  
V = 3.6 V  
I
μA  
μA  
Low-level input current  
V = 0  
I
AV = 3.3 V 5%,  
DD  
V
V
DVI single-ended high-level output voltage  
DVI single-ended low-level output voltage  
DVI single-ended output swing voltage  
DVI single-ended standby/off output voltage  
R
R
= 50 Ω 10%,  
AV 0.01  
AV + 0.01  
V
V
H
T
DD  
DD  
= 510 Ω 1%  
TFADJ  
AV = 3.3 V 5%,  
DD  
R
R
= 50 Ω 10%,  
AV 0.6  
AV 0.4  
DD  
L
T
DD  
= 510 Ω 1%  
TFADJ  
AV = 3.3 V 5%,  
DD  
VSWING  
R
R
= 50 Ω 10%,  
400  
600 mV  
P-P  
T
= 510 Ω 1%  
TFADJ  
AV = 3.3 V 5%,  
DD  
V
OFF  
R
R
= 50 Ω 10%,  
AV 0.01  
AV + 0.01  
V
T
DD  
DD  
= 510 Ω 1%  
TFADJ  
I
I
Power-down current (see Note 1)  
Normal power-supply current  
200  
200  
500  
250  
μA  
PD  
Worst-case pattern  
mA  
IDD  
R is the single-ended termination resistance at the receiver end of the DVI link.  
Black and white checkerboard pattern, each checker is one pixel wide.  
T
NOTE 1: Assumes all inputs to the transmitter are not toggling.  
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electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (continued)  
ac specifications  
PARAMETER  
IDCK frequency  
TEST CONDITIONS  
MIN  
25  
TYP  
MAX  
165  
40  
UNIT  
MHz  
ns  
f
t
t
t
(IDCK)  
(pixel)  
(IDCK)  
(ijit)  
Pixel time period (see Note 1)  
IDCK duty cycle  
6.06  
30%  
70%  
IDCK clock jitter tolerance  
2
ns  
ps  
0°C to 70°C  
75  
45  
75  
45  
240  
320  
240  
320  
t
r
DVI output rise time (20-80%) (see Note 2)  
DVI output fall time (20-80%) (see Note 2)  
f
= 165 MHz  
(IDCK)  
55°C to 125°C  
0°C to 70°C  
t
t
t
f
f
f
= 165 MHz  
= 165 MHz  
= 165 MHz  
ps  
ps  
ns  
f
(IDCK)  
(IDCK)  
(IDCK)  
55°C to 125°C  
DVI output intra-pair + to differential skew  
(see Note 3)  
50  
sk(D)  
sk(CC)  
DVI output inter-pair or channel-to-channel  
skew (see Note 3)  
1.2  
0°C to 70°C  
150  
190  
t
DVI output clock jitter, max. (see Note 4)  
f
= 165 MHz  
ps  
ns  
ojit  
(IDCK)  
55°C to 125°C  
Single edge  
(BSE = 1, DSEL = 0,  
DKEN = 0, EDGE = 0)  
Data, DE, VSYNC, HSYNC setup time to  
IDCK+ falling edge  
t
IDCK = 165 MHz  
IDCK = 165 MHz  
IDCK = 165 MHz  
IDCK = 165 MHz  
IDCK = 165 MHz  
1.5  
1.5  
1.5  
1.5  
su(IDF)  
Single edge  
(BSE = 1, DSEL = 0,  
DKEN = 0, EDGE = 0)  
Data, DE, VSYNC, HSYNC hold time to  
IDCK+ falling edge  
t
t
t
t
ns  
ns  
ns  
ns  
h(IDF)  
su(IDR)  
h(IDR)  
su(ID)  
Single edge  
(BSEL = 1, DSEL = 0,  
DKEN = 0, EDGE = 1)  
Data, DE, VSYNC, HSYNC setup time to  
IDCK+ rising edge  
Single edge  
(BSEL = 1, DSEL = 0,  
DKEN = 0, EDGE = 1)  
Data, DE, VSYNC, HSYNC hold time to  
IDCK+ rising edge  
Dual edge  
(BSEL = 0, DSEL = 1,  
DKEN = 0)  
Data, DE, VSYNC, HSYNC setup time to  
IDCK+ falling/rising edge  
0.9  
1
Data, DE, VSYNC, HSYNC hold time to  
IDCK+ falling/rising edge  
Dual edge (BSEL = 0,  
DSEL = 1, DKEN = 0)  
t
t
IDCK = 165 MHz  
IDCK = 165 MHz  
ns  
ps  
h(ID)  
De-skew trim increment  
DKEN = 1  
350  
(STEP)  
NOTES: 1. t  
is the pixel time defined as the period of the TXC output clock. The period of IDCK is equal to t  
.
(pixel)  
(pixel)  
2. Rise and fall times are measured as the time between 20% and 80% of signal amplitude.  
3. Measured differentially at the 50% crossing point using the IDCK+ input clock as a trigger  
4. Relative to input clock (IDCK)  
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timing diagrams  
t
t
f
r
DVI  
Outputs  
80% V  
20% V  
OD  
OD  
Figure 1. Rise and Fall Time for DVI Outputs  
t
h(IDF)  
IDCK  
IDCK+  
t
t
h(IDR)  
su(IDF)  
t
su(IDR)  
V
V
DATA[23:0], DE,  
HSYNC, VSYNC  
IH  
IL  
Figure 2. Control and Single-Edge-Data Setup/Hold Time to IDCK  
IDCK+  
t
t
t
h(ID)  
su(ID)  
h(ID)  
t
su(ID)  
DATA[23:0], DE,  
HSYNC, VSYNC  
V
IH  
V
IL  
Figure 3. Dual-Edge Data Setup/Hold Times to IDCK+  
t
sk(D)  
TX+  
50%  
TX−  
Figure 4. Analog Output Intra-Pair Differential Skew  
TXN  
50%  
t
sk(CC)  
50%  
TXM  
Figure 5. Analog Output Channel-to-Channel Skew  
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functional description  
The TFP410 is a DVI-compliant digital transmitter that is used in digital host monitor systems to transition  
minimized differential signaling (TMDS) encode and serialize RGB pixel data streams. The TFP410 supports  
resolutions from VGA to WUXGA (and 1080p) and can be controlled in two ways: 1) configuration and state pins  
2
or 2) the programmable I C serial interface (see the terminal functions section).  
The host in a digital display system, usually a PC or consumer electronics device, contains a DVI-compatible  
transmitter, such as the TFP410, that receives 24-bit pixel data along with appropriate control signals. The  
TFP410 encodes the signals into a high-speed, low-voltage, differential serial bit stream optimized for  
transmission over a twisted-pair cable to a display device. The display device, usually a flat-panel monitor,  
requires a DVI-compatible receiver like the TFP401 to decode the serial bit stream back to the same 24-bit pixel  
data and control signals that originated at the host. This decoded data can then be applied directly to the  
flat-panel drive circuitry to produce an image on the display. Since the host and display can be separated by  
distances up to 5 meters or more, serial transmission of the pixel data is preferred (see the TMDS pixel data  
and control signal encoding, pixel data and control signal encoding, universal graphics contoller interface  
voltage signal levels, and universal graphics controller interface clock inputs sections).  
The TFP410 integrates a high-speed digital interface, a TMDS encoder, and three differential TMDS drivers.  
Data is driven to the TFP410 encoder across 12 or 24 data lines, along with differential clock pair and sync  
signals. The flexibility of the TFP410 allows for multiple clock and data formats that enhance system  
performance.  
The TFP410 also has enhanced PLL noise immunity, an enhancement accomplished with on-chip regulators  
and bypass capacitors.  
2
The TFP410 is versatile and highly programmable to provide maximum flexibility for the user. An I C host  
interface is provided to allow enhanced configurations in addition to power on default settings programmed by  
pin-strapping resistors.  
2
The TFP410 offers monitor detection through receiver detection, or hot-plug detection when I C is enabled. The  
monitor detection feature allows the user enhanced flexibility when attaching to digital displays or receivers (see  
terminal functions, hot plug/unplug, and register descriptions sections).  
The TFP410 has a data deskew feature allowing the users to deskew the input data with respect to the IDCK  
(see the data deskew feature section).  
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transition minimized differential signaling (TMDS) pixel data and control signal encoding  
For TMDS, only one of two possible TMDS characters for a given pixel is transmitted at a given time. The  
transmitter keeps a running count of the number of ones and zeros previously sent and transmits the character  
that minimizes the number of transitions and approximates a dc balance of the transmission line. Three TMDS  
channels are used to transmit RGB pixel data during the active video interval (DE = High). These same three  
channels are also used to transmit HSYNC, VSYNC, and the control signals, CTL[2:1], during the inactive  
display or blanking interval (DE = Low). The following table maps the transmitted output data to the appropriate  
TMDS output channel in a DVI-compliant system.  
INPUT PINS  
(VALID FOR DE = High)  
TRANSMITTED PIXEL DATA  
ACTIVE DISPLAY (DE = High)  
TMDS OUTPUT CHANNEL  
DATA[23:16]  
Channel 2 (TX2  
Channel 1 (TX1  
Channel 0 (TX0  
)
)
)
Red[7:0]  
Green[7:0]  
Blue[7:0]  
DATA[15:8]  
DATA[7:0]  
INPUT PINS  
(VALID FOR DE = Low)  
TRANSMITTED CONTROL DATA  
BLANKING INTERVAL (DE = Low)  
TMDS OUTPUT CHANNEL  
CTL3, CTL2 (see Note 1)  
Channel 2 (TX2  
Channel 1 (TX1  
Channel 0 (TX0  
)
)
)
CTL[3:2]  
CTL[1]  
CTL1 (See Note 1)  
HSYNC, VSYNC  
HSYNC, VSYNC  
NOTE 1: The TFP410 encodes and transfers the CTL[3:1] inputs during the vertical blanking interval. CTL3 is reserved for HDCP and is  
always encoded as 0. The CTL[2:1] inputs are reserved for future use. When DE = high, CTL and SYNC pins must be held  
constant.  
universal graphics controller interface voltage signal levels  
The universal graphics controller interface can operate in the following two distinct voltage modes:  
D
High-swing mode where standard 3.3-V CMOS signaling levels are used  
Low-swing mode where adjustable 1.1-V to 1.8-V signaling levels are used  
D
To select the high-swing mode, the VREF input pin must be tied to the 3.3-V power supply.  
To select the low-swing mode, the V  
must be 0.55 to 0.95 V.  
REF  
In the low-swing mode, V  
is used to set the midpoint of the adjustable signaling levels. The allowable range  
REF  
of values for V  
is from 0.55 V to 0.9 V. The typical approach is to provide this from off chip by using a simple  
REF  
voltage-divider circuit. The minimum allowable input signal swing in the low-swing mode is VREF 0.2 V. In  
low-swing mode, the V input is common to all differential input receivers.  
REF  
universal graphics controller interface clock inputs  
The universal graphics controller interface of the TFP410 supports both fully differential and single-ended clock  
input modes. In the differential clock input mode, the universal graphics controller interface uses the crossover  
point between the IDCK+ and IDCKsignals as the timing reference for latching incoming data (DATA[23:0],  
DE, HSYNC, and VSYNC). Differential clock inputs provide greater common-mode noise rejection. The  
differential clock input mode is only available in the low-swing mode. In the single-ended clock input mode, the  
IDCK+ input (pin 57) should be connected to the single-ended clock source and the IDCKinput (pin 56) should  
be tied to GND.  
The universal graphics controller interface of the TFP410 provides selectable 12-bit dual-edge and 24-bit  
single-edge input clocking modes. In the 12-bit dual-edge mode, the 12-bit data is latched on each edge of the  
input clock. In the 24-bit single-edge mode, the 24-bit data is latched on the rising edge of the input clock when  
EDGE = 1 and the falling edge of the input clock when EDGE = 0.  
DKEN and DK[3:1] allow the user to compensate the skew between IDCK and the pixel data and control  
signals. See the description of the CTL_3_MODE register for details.  
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universal graphics controller interface modes  
Table 1 is a tabular representation of the different modes for the universal graphics controller interface. The  
12-bit mode is selected when BSEL = 0 and the 24-bit mode when BSEL = 1. The 12-bit mode uses dual-edge  
clocking and the 24-bit mode uses single-edge clocking. The EDGE input is used to control the latching edge  
in 24-bit mode, or the primary latching edge in 12-bit mode. When EDGE = 1, the data input is latched on the  
rising edge of the input clock and when EDGE = 0, the data input is latched on the falling edge of the input clock.  
A fully differential input clock is available only in the low-swing mode. Single-ended clocking is not  
recommended in the low-swing mode as this decreases common-mode noise rejection.  
2
Note that BSEL, DSEL, and EDGE are determined by register CTL_1_MODE when I C is enabled (ISEL = 1)  
2
and by input pins when I C is disabled (ISEL = 0).  
Table 1. Universal Graphics Controller Interface Options (Tabular Representation)  
V
BSEL  
EDGE  
DSEL  
BUS WIDTH  
12 bit  
LATCH MODE CLOCK EDGE  
CLOCK MODE  
Differential (see Note 1 and Note 2)  
Single ended  
REF  
0.55 V to 0.9 V  
0.55 V to 0.9 V  
0.55 V to 0.9 V  
0.55 V to 0.9 V  
0.55 V to 0.9 V  
0.55 V to 0.9 V  
0.55 V to 0.9 V  
0.55 V to 0.9 V  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
X
X
X
X
Dual edge  
Dual edge  
Dual edge  
Dual edge  
Single edge  
Single edge  
Single edge  
Single edge  
Dual edge  
Dual edge  
Single edge  
Single edge  
Falling  
Falling  
Rising  
Rising  
Falling  
Falling  
Rising  
Rising  
Falling  
Rising  
Falling  
Rising  
12 bit  
12 bit  
Differential (see Note 1 and Note 2)  
Single ended  
12 bit  
24 bit  
Single ended  
24 bit  
Differential (see Note 1 and Note 3)  
Single ended  
24 bit  
24 bit  
Differential (see Note 1 and Note 3)  
Single ended (see Note 4)  
Single ended (see Note 4)  
Single ended (see Note 4)  
Single ended (see Note 4)  
DV  
DV  
DV  
DV  
12 bit  
DD  
DD  
DD  
DD  
12 bit  
24 bit  
24 bit  
NOTES: 1. The differential clock input mode is only available in the low signal swing mode (i.e., V  
2. The TFP410 does not support a 12-bit dual-clock, single-edge input clocking mode.  
3. The TFP410 does not support a 24-bit single-clock, dual-edge input clocking mode.  
0.9 V).  
REF  
4. In the high-swing mode (V  
= DV ), DSEL is a don’t care; therefore, the device is always in the single-ended latch mode.  
REF  
DD  
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12-Bit, Dual-Edge Input Mode (BSEL = 0)  
DE  
L = Low Half Pixel  
H = High Half Pixel  
P
L
N+1  
P L  
0
P H  
0
P L  
1
P H  
1
P
H
P
L
N1  
D[11:0]  
P L  
N
N
DSEL=1  
EDGE=0  
IDCK+  
IDCK+  
Single-Ended  
Clock Input  
Mode  
DSEL=1  
EDGE=1  
DSEL=0  
EDGE=0  
Differential  
Clock Input  
Mode (Low  
Swing Only)  
{(IDCK+) (IDCK)}  
{(IDCK+) (IDCK)}  
DSEL=0  
EDGE=1  
First Latch Edge  
Figure 6. Universal Graphics Controller Interface Options for 12-Bit Mode (Graphical Representation)  
24-Bit, Single-Edge Input Mode (BSEL = 1)  
DE  
P
0
P
1
P
N-1  
P
N
D[23:0]  
DSEL=0  
EDGE=0  
IDCK+  
Single-Ended  
Clock Input  
Mode  
DSEL=0  
EDGE=1  
IDCK+  
DSEL=1  
EDGE=0  
Differential  
Clock Input  
Mode (Low  
Swing Only)  
{(IDCK+) (IDCK)}  
{(IDCK+) (IDCK)}  
DSEL=1  
EDGE=1  
First Latch Edge  
Figure 7. Universal Graphics Controller Interface Options for 24-Bit Mode (Graphical Representation)  
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12-bit mode data mapping  
P0  
P1  
P2  
PIN  
NAME  
P0L  
LOW  
G0[3]  
G0[2]  
G0[1]  
G0[0]  
B0[7]  
B0[6]  
B0[5]  
B0[4]  
B0[3]  
B0[2]  
B0[1]  
B0[0]  
P0H  
P1L  
LOW  
G1[3]  
G1[2]  
G1[1]  
G1[0]  
B1[7]  
B1[6]  
B1[5]  
B1[4]  
B1[3]  
B1[2]  
B1[1]  
B1[0]  
P1H  
HIGH  
R1[7]  
R1[6]  
R1[5]  
R1[4]  
R1[3]  
R1[2]  
R1[1]  
R1[0]  
G1[7]  
G1[6]  
G1[5]  
G1[4]  
P2L  
LOW  
G2[3]  
G2[2]  
G2[1]  
G2[0]  
B2[7]  
B2[6]  
B2[5]  
B2[4]  
B2[3]  
B2[2]  
B2[1]  
B2[0]  
P2H  
HIGH  
R2[7]  
R2[6]  
R2[5]  
R2[4]  
R2[3]  
R2[2]  
R2[1]  
R2[0]  
G2[7]  
G2[6]  
G2[5]  
G2[4]  
HIGH  
R0[7]  
R0[6]  
R0[5]  
R0[4]  
R0[3]  
R0[2]  
R0[1]  
R0[0]  
G0[7]  
G0[6]  
G0[5]  
G0[4]  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
24-bit mode data mapping  
PIN NAME  
D23  
P0  
P1  
P2  
PIN NAME  
D11  
D10  
D9  
P0  
P1  
P2  
R0[7]  
R0[6]  
R0[5]  
R0[4]  
R0[3]  
R0[2]  
R0[1]  
R0[0]  
G0[7]  
G0[6]  
G0[5]  
G0[4]  
R1[7]  
R1[6]  
R1[5]  
R1[4]  
R1[3]  
R1[2]  
R1[1]  
R1[0]  
G1[7]  
G1[6]  
G1[5]  
G1[4]  
R2[7]  
R2[6]  
R2[5]  
R2[4]  
R2[3]  
R2[2]  
R2[1]  
R2[0]  
G2[7]  
G2[6]  
G2[5]  
G2[4]  
G0[3]  
G0[2]  
G0[1]  
G0[0]  
B0[7]  
B0[6]  
B0[5]  
B0[4]  
B0[3]  
B0[2]  
B0[1]  
B0[0]  
G1[3]  
G1[2]  
G1[1]  
G1[0]  
B1[7]  
B1[6]  
B1[5]  
B1[4]  
B1[3]  
B1[2]  
B1[1]  
B1[0]  
G2[3]  
G2[2]  
G2[1]  
G2[0]  
B2[7]  
B2[6]  
B2[5]  
B2[4]  
B2[3]  
B2[2]  
B2[1]  
B2[0]  
D22  
D21  
D20  
D8  
D19  
D7  
D18  
D6  
D17  
D5  
D16  
D4  
D15  
D3  
D14  
D2  
D13  
D1  
D12  
D0  
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data deskew feature  
The deskew feature allows adjustment of the input setup/hold time. Specifically, the input data DATA[23:0] can  
be latched slightly before or after the latching edge of the clock IDCK depending on the amount of deskew  
desired. When deskew enable (DKEN) is enabled, the amount of deskew is programmable by setting the three  
bits DK[3:1]. When disabled, a default deskew setting is used. To allow maximum flexibility and ease of use,  
2
DKEN and DK[3:1] are accessed directly through configuration pins when I C is disabled, or through registers  
2
2
of the same name when I C is enabled. When using I C mode, DKEN should be tied to ground to avoid a floating  
input.  
The input setup/hold time can be varied with respect to the input clock by an amount t  
given by the formula:  
(CD)  
t
= (DK[3:1] – 4) × t  
(STEP)  
(CD)  
Where:  
t
= Adjustment increment amount  
(STEP)  
DK[3:1] = Number from 0 to 7 represented as a 3-bit binary number  
= Cumulative deskew amount  
t
(CD)  
(DK[3:1] – 4) is simply a multiplier in the range {–4, –3, –2, –1, 0, 1, 2, 3} for t  
. Therefore, data can be  
(STEP)  
latched in increments from four times the value of t  
before the latching edge of the clock to three times  
(STEP)  
the value of t  
after the latching edge. Note that the input clock is not changed, only the time when data  
(STEP)  
is latched with respect to the clock.  
DATA[23:0]  
IDCK  
t  
(CD)  
t
t  
(CD)  
t
(CD)  
(CD)  
DK[3:1]  
000  
4 × t  
100  
0
111  
3 × t  
000  
4 × t  
100  
0
111  
3 × t  
(STEP)  
t
(CD)  
(STEP)  
(STEP)  
(STEP)  
Default Falling  
Default Rising  
Figure 8. A Graphical Representation of the De-Skew Function  
hot plug/unplug (auto connect/disconnect detection)  
The TFP410 supports hot plug/unplug (auto connect/disconnect detection) for the DVI link. The receiver sense  
(RSEN) input bit indicates if a DVI receiver is connected to TXC+ and TXC–. The HTPLG bit reflects the current  
2
state of the HTPLG pin connected to the monitor via the DVI connector. When I C is disabled (ISEL = 0), the  
2
RSEN value is available on the MSEN pin. When I C is enabled, the connection status of the DVI link and  
HTPLG sense pins are provided by the CTL_2_MODE register. The MSEL bits of the CTL_2_MODE register  
can be used to program the MSEN to output the HTPLG value, the RSEN value, an interrupt, or be disabled.  
The source of the interrupt event is selected by TSEL in the CTL_2_MODE register. An interrupt is generated  
by a change in status of the selected signal. The interrupt status is indicated in the MDI bit of CTL_2_MODE  
and can be output via the MSEN pin. The interrupt continues to be asserted until a 1 is written to the MDI bit,  
resetting the bit back to 0. Writing 0 to the MDI bit has no effect.  
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device configuration and I2C reset description  
The TFP410 device configuration can be programmed by several different methods to allow maximum flexibility  
for the user’s application. Device configuration is controlled depending on the state of the ISEL/RST pin,  
2
2
configuration pins (BSEL, DSEL, EDGE, V  
), and state pins (PD, DKEN). I C bus select and I C reset (active  
REF  
low) are shared functions on the ISEL/RST pin, which operates asynchronously.  
Holding ISEL/RST low causes the device configuration to be set by the configuration pins (BSEL, DSEL, EDGE,  
2
and V  
) and state pins (PD, DKEN). The I C bus is disabled.  
REF  
Holding ISEL/RST high causes the chip configuration to be set based on the configuration bits (BSEL, DSEL,  
2
2
EDGE) and state bits (PD, DKEN) in the I C registers. The I C bus is enabled.  
Momentarily bringing ISEL/RST low and then back high while the device is operating in normal or power-down  
2
mode resets the I C registers to their default values. The device configuration is changed to the default  
2
power-up state with I C enabled. After power up, the device must be reset. It is suggested that this pin be tied  
to the system reset signal, which is low during power up and is then asserted high after all the power supplies  
are fully functional.  
DE generator  
The TFP410 contains a DE generator that can be used to generate an internal DE signal when the original data  
2
source does not provide one. There are several I C programmable values that control the DE generator (see  
Figure 9). DE_GEN in the DE_CTL register enables this function. When enabled, the DE pin is ignored.  
DE_TOP and DE_LIN are line counts used to control the number of lines after VSYNC goes active that DE is  
enabled and the total number of lines that DE remains active, respectively. The polarity of VSYNC must be set  
by VS_POL in the DE_CTL register.  
DE_DLY and DE_CNT are pixel counts used to control the number of pixels after HSYNC goes active that DE  
is enabled and the total number of pixels that DE remains active, respectively. The polarity of HSYNC must be  
set by HS_POL in the DE_CTL register.  
The TFP410 also counts the total number of HSYNC pulses between VSYNC pulses and the total number of  
pixels between HSYNC pulses. These values, the total vertical and horizontal resolutions, are available in  
V_RES and H_RES, respectively. These values are available at all times, whether or not the DE generator is  
enabled.  
16  
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PanelBusDIGITAL TRANSMITTER  
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Full Vertical Frame  
DE_TOP  
DE_DLY  
DE_CNT  
V_RES  
DE_LIN  
Actual Display Area  
H_RES  
Figure 9. DE Generator Register Functions  
register map  
2
2
The TFP410 is a standard I C slave device. All the registers can be written and read through the I C interface  
(unless otherwise specified). The TFP410 slave machine supports only byte read and write cycles. Page mode  
2
is not supported. The 8-bit binary address of the I C machine is 0111 A A A X, where A[3:1] are pin  
3
2 1  
2
programmable or set to 000 by default. The I C base address of the TFP410 is dependent on A[3:1] (pins 6,  
7, and 8 respectively) as shown:  
WRITE ADDRESS  
(Hex)  
READ ADDRESS  
(Hex)  
A[3:1]  
000  
001  
010  
011  
100  
101  
110  
111  
70  
72  
74  
76  
78  
7A  
7C  
7E  
71  
73  
75  
77  
79  
7B  
7D  
7F  
17  
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TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
register map (continued)  
SUB-  
ADDRESS  
REGISTER  
VEN_ID  
RW  
BIT7  
BIT6  
BIT5  
BIT4  
BIT3  
BIT2  
BIT1  
BIT0  
R
R
00  
VEN_ID[7:0]  
01  
VEN_ID[15:8]  
DEV_ID[7:0]  
DEV_ID[15:8]  
REV_ID[7:0]  
Reserved  
R
02  
DEV_ID  
R
03  
REV_ID  
R
04  
RESERVED  
CTL_1_MODE  
CTL_2_MODE  
CTL_3_MODE  
CFG  
R
05-07  
08  
RW  
RW  
RW  
R
RSVD  
VLOW  
TDIS  
DK  
VEN  
HEN  
DSEL  
TSEL  
BSEL  
RSEN  
CTL  
EDGE  
PD  
MDI  
09  
MSEL  
HTPLG  
0A  
DKEN  
RSVD  
0B  
CFG  
RESERVED  
DE_DLY  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
R
0C-31  
32  
Reserved  
DE_DLY[7:0]  
DE_CTL  
33  
RSVD  
RSVD  
DE_GEN  
VS_POL  
HS_POL  
RSVD  
DE_DLY[8]  
DE_TOP  
34  
DE_DLY[6:0]  
RESERVED  
35  
Reserved  
36  
DE_CNT[7:0]  
DE_CNT  
DE_LIN  
H_RES  
37  
Reserved  
Reserved  
Reserved  
Reserved  
DE_CNT[10:8]  
DE_LIN[10:8]  
H_RES[10:8]  
V_RES[10:8]  
38  
DE_LIN[7:0]  
H_RES[7:0]  
V_RES[7:0]  
39  
3A  
R
3B  
R
3C  
V_RES  
R
3D  
RESERVED  
R
3EFF  
register descriptions  
VEN_ID  
Sub-Address = 0100  
Read Only  
Default = 0x014C  
7
6
5
4
3
2
1
0
VEN_ID[7:0]  
VEN_ID[15:8]  
These read-only registers contain the 16-bit TI vendor ID. VEN_ID is hardwired to 0x014C.  
DEV_ID  
7
Sub-Address = 0302  
Read Only  
Default = 0x0410  
6
5
4
3
2
1
0
DEV_ID[7:0]  
DEV_ID[15:8]  
These read-only registers contain the 16-bit device ID for the TFP410. DEV_ID is hardwired to 0x0410.  
REV_ID  
7
Sub-Address = 04  
5
Read Only  
Default = 0x00  
6
4
3
2
1
0
REV_ID[7:0]  
This read-only register contains the revision ID.  
18  
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TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
register descriptions (continued)  
RESERVED  
7
Sub-Address = 0705  
Read Only  
Default = 0x641400  
6
5
4
3
2
1
0
RESERVED[7:0]  
RESERVED[7:0]  
RESERVED[15:8]  
CTL_1_MODE  
Sub-Address = 08  
Read/Write  
Default = 0xBE  
7
6
5
4
3
2
BSEL  
1
0
RSVD  
TDIS  
VEN  
HEN  
DSEL  
EDGE  
PD  
PD: This read/write register contains the power-down mode.  
0: Power down (default after RESET)  
1: Normal operation  
EDGE: This read/write register contains the edge select mode.  
0: Input data latches to the falling edge of IDCK+  
1: Input data latches to the rising edge of IDCK+  
BSEL: This read/write register contains the input bus select mode.  
0: 12-bit operation with dual-edge clock  
1: 24-bit operation with single-edge clock  
DSEL:This read/write register is used in combination with BSEL and V  
to select the single-ended or differential  
REF  
input clock mode. In the high-swing mode, DSEL is a don’t care since IDCK is always single-ended.  
HEN: This read/write register contains the horizontal sync enable mode.  
0: HSYNC input is transmitted as a fixed low.  
1: HSYNC input is transmitted in its original state.  
VEN: This read/write register contains the vertical sync enable mode.  
0: VSYNC input is transmitted as a fixed low.  
1: VSYNC input is transmitted in its original state.  
TDIS: This read/write register contains the TMDS disable mode.  
0: TMDS circuitry enable state is determined by PD.  
1: TMDS circuitry is disabled.  
CTL_2_MODE  
Sub-Address = 09  
Read/Write  
Default = 0x00  
7
6
5
4
3
2
1
0
VLOW  
MSEL[3:1]  
TSEL  
RSEN  
HTPLG  
MDI  
MDI: This read/write register contains the monitor detect interrupt mode.  
0: Detected logic level change in detection signal (to clear, write one to this bit)  
1: Logic level remains the same.  
19  
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PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
register descriptions (continued)  
HTPLG: This read only register contains the hot-plug detection input logic state.  
0: Logic level detected on EDGE/HTPLG (pin 9)  
1: High level detected on EDGE/HTPLG (pin 9)  
RSEN: This read-only register contains the receiver sense input logic state, which is valid only for dc-coupled  
systems.  
0: A powered-on receiver is not detected.  
1: A powered-on receiver is detected (i.e., connected to the DVI transmitter outputs).  
TSEL: This read/write register contains the interrupt generation source select.  
0: Interrupt bit (MDI) is generated by monitoring RSEN.  
1: Interrupt bit (MDI) is generated by monitoring HTPLG.  
MSEL: This read/write register contains the source select of the monitor sense output pin.  
000: Disabled. MSEN output high.  
001: Outputs the MDI bit (interrupt)  
010: Outputs the RSEN bit (receiver detect)  
011: Outputs the HTPLG bit (hot-plug detect)  
VLOW: This read-only register indicates the V  
input level.  
REF  
0: This bit is a logic level 0 if the V  
1: This bit is a logic level 1 if the V  
analog input selects high-swing inputs.  
analog input selects low-swing inputs.  
REF  
REF  
CTL_3_MODE  
7
Sub-Address = 0A  
5
Read/Write  
Default = 0x80  
6
4
3
2
1
0
DK[3:1]  
DKEN  
RSVD  
CTL[2:1]  
RSVD  
CTL[2:1]:This read/write register contains the values of the two CTL[2:1] bits that are output on the DVI port during  
the blanking interval.  
DKEN: This read/write register controls the data deskew enable.  
0: Data deskew is disabled, the values in DK[3:1] are not used.  
1: Data deskew is enabled, the deskew setting is controlled through DK[3:1].  
DK[3:1]: This read/write register contains the deskew setting, each increment adjusts the skew by t  
(STEP).  
000: Step 1 (minimum setup/maximum hold)  
001: Step 2  
010: Step 3  
011: Step 4  
100: Step 5 (default)  
101: Step 6  
110: Step 7  
111: Step 8 (maximum setup/minimum hold)  
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TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
register descriptions (continued)  
CFG  
Sub-Address = 0B  
Read Only  
7
6
5
4
3
2
1
0
CFG[7:0] (D[23:16])  
This read-only register contains the state of the inputs D[23:16]. These pins can be used to provide the user with  
2
selectable configuration data through the I C bus.  
RESERVED  
7
Sub-Address = 0E0C  
Read/Write  
Default = 0x97D0A9  
1 0  
6
5
4
3
2
RESERVED  
RESERVED  
RESERVED  
These read/write registers have no effect on TFP410 operation.  
DE_DLY  
7
Sub-Address = 32  
5
Read/Write  
Default = 0x00  
1 0  
6
4
3
2
DE_DLY[7:0]  
This read/write register defines the number of pixels after HSYNC goes active when the DE is generated and when  
the DE generator is enabled. The value must be less than or equal to (2047 DE_CNT).  
DE_CTL  
7
Sub-Address = 33  
Read/Write  
Default = 0x00  
6
5
4
3
2
1
0
Reserved  
DE_GEN  
VS_POL  
HS_POL  
Reserved  
DE_DLY[8]  
DE_DLY[8]: This read/write register contains the top bit of DE_DLY.  
HS_POL: This read/write register sets the HSYNC polarity.  
0: HSYNC is considered active low.  
1: HSYNC is considered active high.  
Pixel counts are reset on the HSYNC active edge.  
VS_POL: This read/write register sets the VSYNC polarity.  
0: VSYNC is considered active low.  
1: VSYNC is considered active high.  
Line counts are reset on the VSYNC active edge.  
DE_GEN: This read/write register enables the internal DE generator.  
0: DE generator is disabled. Signal required on DE pin.  
1: DE generator is enabled. DE pin is ignored.  
DE_TOP  
7
Sub-Address = 34  
5
Read/Write  
Default = 0x00  
6
4
3
2
1
0
DE_TOP[7:0]  
This read/write register defines the number of pixels after VSYNC goes active when the DE is generated and when  
the DE generator is enabled.  
21  
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TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
register descriptions (continued)  
DE_CNT  
7
Sub-Address = 3736  
Read/Write  
Default = 0x0000  
1 0  
6
5
4
3
2
DE_CNT[7:0]  
Reserved  
DE_CNT[10:8]  
These read/write registers define the width of the active display, in pixels, when the DE generator is enabled. The  
value must be less than or equal to (2047 DE_DLY).  
DE_LIN  
Sub-Address = 3938  
Read/Write  
Default = 0x0000  
1 0  
7
6
5
4
3
2
DE_LIN[7:0]  
Reserved  
DE_LIN[10:8]  
These read/write registers define the height of the active display, in lines, when the DE generator is enabled.  
H_RES  
Sub-Address = 3B3A  
Read Only  
7
6
5
4
3
2
1
0
H_RES[7:0]  
Reserved  
H_RES[10:8]  
These read-only registers return the number of pixels between consecutive HSYNC pulses.  
V_RES  
Sub-Address = 3D3C  
Read Only  
7
6
5
4
3
2
1
0
V_RES[7:0]  
Reserved  
V_RES[10:8]  
These read-only registers return the number of lines between consecutive VSYNC pulses.  
I2C interface  
2
The I C interface is used to access the internal TFP410 registers. This 2-pin interface consists of the SCL clock  
2
line and the SDA serial data line. The basic I C access cycles are shown in Figure 10 and Figure 11.  
SDA  
SCL  
Start Condition (S)  
Stop Condition (P)  
2
Figure 10. I C Start and Stop Conditions  
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TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
I2C interface (continued)  
The basic access write cycle consists of:  
D
D
D
D
D
Start condition  
Slave address cycle  
Sub-address cycle  
Any number of data cycles  
Stop condition  
The basic access read cycle consists of:  
D
D
D
D
D
D
D
Start condition  
Slave write address cycle  
Sub-address cycle  
Restart condition  
Slave read address cycle  
Any number of data cycles  
Stop condition  
The start and stop conditions are shown in Figure 10. The high-to-low transition of SDA while SCL is high defines  
the start condition. The low-to-high transition of SDA while SCL is high defines the stop condition. Each cycle,  
data or address, consists of eight bits of serial data followed by one acknowledge bit generated by the receiving  
device. Thus, each data/address cycle contains nine bits (see Figure 11).  
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL  
SDA  
Slave Address  
Sub-Address  
2
Data  
Stop  
Figure 11. I C Access Cycles  
2
Following a start condition, each I C device decodes the slave address. The TFP410 responds with an  
acknowledge by pulling the SDA line low during the ninth clock cycle if it decodes the address as its address.  
During subsequent sub-address and data cycles, the TFP410 responds with acknowledge (see Figure 12). The  
sub-address is auto-incremented after each data cycle.  
The transmitting device must not drive the SDA signal during the acknowledge cycle so that the receiving device  
may drive the SDA signal low. The master indicates a not acknowledge condition (/A) by keeping the SDA signal  
high just before it asserts the stop condition (P). This sequence terminates a read cycle (see Figure 13).  
The slave address consists of seven bits of address along with one bit of read/write information (read = 1,  
write = 0) (see Figure 11 and Figure 12). For the TFP410, the selectable slave addresses (including the R/W  
bit) using A[3:1] are 0x70, 0x72, 0x74, 0x76, 0x78, 0x7A, 0x7C, and 0x7E for write cycles, and 0x71, 0x73, 0x75,  
0x77, 0x79, 0x7B, 0x7D, and 0x7F for read cycles.  
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TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
S
Slave Address  
W
A
Sub-Address  
A
Data  
A
Data  
A
P
Where:  
From Master  
From Slave  
A
S
Acknowledge  
Start condition  
P
Stop Condition  
2
Figure 12. I C Write Cycle  
S
Slave Address  
W
A
Sub-Address  
A
Sr  
Slave Address  
R
A
Data  
A
Data  
/A  
P
Where:  
From Master  
From Slave  
A
S
Acknowledge  
Start condition  
/A Not acknowledge (SDA high)  
P
Stop Condition  
R
Read Condition = 1  
Write Condition = 0  
Sr Restart Condition  
W
2
Figure 13. I C Read Cycle  
PowerPADt 64-pin TQFP package  
The TFP410 is available in TI’s thermally-enhanced 64-pin TQFP PowerPAD package. The PowerPAD package  
is a 10-mm × 10-mm × 1-mm TQFP outline with 0,5-mm lead pitch. The PowerPAD package has a specially  
designed die-mount pad that offers improved thermal capability over typical TQFP packages of the same  
outline. The PowerPAD package also offers a backside solder plane that connects directly to the die-mount pad  
for enhanced thermal conduction. For thermal considerations, soldering the back side of the TFP410 to the  
application board is not required, as the device power dissipation is well within the package capability when not  
soldered. If traces or vias are located under the back-side pad, they should be protected by suitable solder mask  
or other assembly technique to prevent inadvertent shorting to the exposed back-side pad.  
Soldering the back side of the device to a thermal land connected to the PCB ground plane is recommended  
for electrical and EMI considerations. The thermal land may be soldered to the exposed PowerPAD package  
using standard reflow soldering techniques.  
The recommended pad size for the grounded thermal land is 5,9 mm minimum, centered in the device land  
pattern. When vias are required to ground the land, multiple vias are recommended for a low-impedance  
connection to the ground plane. Vias in the exposed pad should be small enough or filled to prevent wicking  
the solder away from the interface between the package body and the thermal land on the surface of the board  
during solder reflow.  
24  
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TFP410-EP  
PanelBusDIGITAL TRANSMITTER  
SGLS344A JULY 2006 REVISED MAY 2011  
PowerPADt 64-pin TQFP package (continued)  
Thermal vias or other  
connection-to-ground vias  
5.9 mm  
minimum  
Figure 14. Recommended Pad Size  
More information on this package and other requirements for using thermal lands and thermal vias are detailed  
in the TI application report PowerPADt Thermally-Enhanced Package, TI literature number SLMA002,  
available at www.ti.com.  
Table 2 shows the thermal properties of the 64-pin TQFP PowerPAD package. The 64-pin TQFP  
non-PowerPAD package is included only for reference.  
Table 2. 64-Pin TQFP (10 mm × 10 mm × 1 mm)/0,5-mm Lead Pitch  
PowerPAD  
PowerPAD  
NOT CONNECTED TO  
PCB THERMAL PLANE  
WITHOUT  
PowerPAD  
CONNECTED TO PCB  
THERMAL PLANE  
(see Note 1)  
PARAMETER  
Thermal resistance, junction to ambient  
(see Note 1 and Note 2)  
R
R
75.83°C/W  
7.8°/W  
42.2°C/W  
0.38°C/W  
1.66 W  
21.47°C/W  
0.38°C/W  
3.26 W  
θ
θ
JA  
JC  
Thermal resistance, junction to case  
(see Note 1 and Note 2)  
Power-handling capabilities of package  
(see Note 1, Note 2, and Note 3)  
P
D
0.92 W  
NOTES: 1. Specified with the PowerPAD bond pad on the back side of the package soldered to a 2-oz Cu plate PCB thermal plane  
2. Airflow is at 0 LFM (no airflow).  
3. Specified at 150°C junction temperature and 80°C ambient temperature  
25  
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PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TFP410MPAPREP  
HTQFP  
PAP  
64  
1000  
330.0  
24.4  
13.0  
13.0  
1.5  
16.0  
24.0  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
HTQFP PAP 64  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 45.0  
TFP410MPAPREP  
1000  
Pack Materials-Page 2  
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