TLC6C5816-Q1 [TI]
具有诊断功能的汽车类电源逻辑 16 位移位寄存器 LED 驱动器;
| 型号： | TLC6C5816-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有诊断功能的汽车类电源逻辑 16 位移位寄存器 LED 驱动器 驱动 驱动器 移位寄存器 |
| 文件： | 总35页 (文件大小：1903K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TLC6C5816-Q1
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
具有诊断功能的 TLC6C5816-Q1 电源逻辑 16 位移位寄存器 LED 驱动器
1 特性
TLC6C5816-Q1 器件是一个 16 位移位寄存器 LED 驱
动器，专门用于支持汽车 LED 应用。内置 LED 开路
和 LED 短路诊断机制提供增强的安全保护。该器件含
有 16 个带电源 DMOS 晶体管输出的通道。其中 8 个
通道配置了相应的寄存器，支持 LED 故障诊断，因此
该器件可以驱动 16 个不具有诊断功能的通道或 8 个具
有诊断功能的通道。诊断通道 DIAGn 必须连接到
DRAINn 才能实现 LED 诊断。命令错误故障表明通道
配置了 LED 诊断功能，但寄存器写入命令同时打开了
该通道。器件提供循环冗余校验，以验证移位寄存器中
的寄存器值。在读回模式中，该器件提供 6 位 CRC 提
醒。MCU 可以读回 CRC 提醒并检查该提醒是否正
确，以确定 MCU 与该器件之间的通信环路是否良好。
1
•
•
符合汽车类应用 要求
具有符合 AEC-Q100 标准的下列特性：
–
器件温度等级 1：环境工作温度范围为 –40°C
至 125°C
–
器件人体放电模型 (HBM) 静电放电 (ESD) 分类
等级 H3A
–
–
器件 CDM ESD 分类等级 C6
提供功能安全
–
可帮助进行功能安全系统设计的文档
•
•
16 个带电源 DMOS 晶体管输出的通道
–
–
–
每通道达 50 mA 的漏极开路输出
最大额定输出电压：45V
压摆率经优化可降低 EMI
器件信息(1)
串行接口和 PWM 输入
器件型号
封装
封装尺寸（标称值）
–
兼容 TPIC6C596、TLC6C598-Q1、
TLC6C5912-Q1 的移位寄存器
TLC6C5816-Q1
HTSSOP (28)
9.70mm × 4.40mm
(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。
–
–
LED 状态读回
用于分组调光的 2 个 PWM 输入
典型应用原理图
•
诊断和保护
Battery 5 V–40 V
–
–
–
–
可配置 LED 开路和短路诊断
过热保护
3 V–5.5 V
串行接口通信误差检测
漏极开路误差反馈
VCC
DRAIN0
EN
RCK
DRAIN1/
DIAG0
2 应用
SER IN
SRCK
•
•
•
•
•
汽车仪表组
汽车 HVAC 控制面板
汽车内部面板
MCU
CLR
SER OUT
ERR
G1
TLC6C5816-Q1
汽车电子旋钮式换挡器指示器
汽车中控台
DRAIN14
DRAIN15/
DIAG14
G2
3 说明
GND
汽车应用中有各种 LED 指示器。某些 应用 （如混合
仪表组和电子旋钮式换挡器）具有安全要求，必须具有
LED 故障诊断功能；其他 应用 （如 HVAC 面板）仅
具有一个 LED 开关控制器，不要求具有 LED 诊断功
能。为了涵盖两种 应用，TLC6C5816-Q1 器件实现了
灵活的 LED 诊断功能。通过写入到寄存器，可以对输
出通道配置 LED 诊断 特性 或不配置 LED 诊断 特性。
Copyright © 2017, Texas Instruments Incorporated
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLASEJ5
TLC6C5816-Q1
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 15
7.5 Register Maps......................................................... 15
7.6 Interface Registers.................................................. 15
Application and Implementation ........................ 20
8.1 Application Information............................................ 20
8.2 Typical Application ................................................. 20
Power Supply Recommendations...................... 23
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements ............................................... 6
6.7 Switching Characteristics.......................................... 6
6.8 Typical Characteristics.............................................. 7
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
8
9
10 Layout................................................................... 24
10.1 Layout Guidelines ................................................. 24
10.2 Layout Example .................................................... 24
11 器件和文档支持 ..................................................... 25
11.1 接收文档更新通知 ................................................. 25
11.2 社区资源................................................................ 25
11.3 商标....................................................................... 25
11.4 静电放电警告......................................................... 25
11.5 Glossary................................................................ 25
12 机械、封装和可订购信息....................................... 26
7
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision A (December 2017) to Revision B
Page
•
向特性 部分添加了功能安全链接 ............................................................................................................................................ 1
Changes from Original (October 2017) to Revision A
Page
•
将数据表从“预告信息”更改为“生产数据” ................................................................................................................................. 1
2
版权 © 2017–2020, Texas Instruments Incorporated
TLC6C5816-Q1
www.ti.com.cn
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
5 Pin Configuration and Functions
PWP PowerPAD™ Package
28-Pin HTSSOP With Exposed Thermal Pad
Top View
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
GND
VCC
G1
2
ERR
G2
3
NC
DRAIN0
4
DRAIN15/DIAG14
DRAIN14
DRAIN13/DIAG12
DRAIN12
DRAIN11/DIAG10
DRAIN10
DRAIN9/DIAG8
DRAIN8
DRAIN1/DIAG0
DRAIN2
5
6
DRAIN3/DIAG2
DRAIN4
7
Thermal
Pad
8
DRAIN5/DIAG4
DRAIN6
9
10
11
12
13
14
DRAIN7/DIAG6
SER_IN
SRCK
CLR
RCK
EN
SER_OUT
Not to scale
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
Shift register clear, active-low. CLR low level clears all the storage registers in the device,
shift registers work normally. CLR high level makes both storage registers and shift registers
work normally.
CLR
DRAIN0
13
I
4
O
I/O
O
Channel 0 open drain-output
DRAIN1/DIAG0
DRAIN2
5
Channel 1 open-drain output or diagnostics input 0
Channel 2 open drain output
6
DRAIN3/DIAG2
DRAIN4
7
I/O
O
Channel 3 open-drain output or diagnostics input 2
Channel 4 open drain output
8
DRAIN5/DIAG4
DRAIN6
9
I/O
O
Channel 5 open-drain output or diagnostics input 4
Channel 6 open-drain output
10
11
18
19
20
21
22
23
24
25
DRAIN7/DIAG6
DRAIN8
I/O
O
Channel 7 open-drain output or diagnostics input 6
Channel 8 open-drain output
DRAIN9/DIAG8
DRAIN10
I/O
O
Channel 9 open-drain output or diagnostics input 8
Channel 10 open-drain output
DRAIN11/DIAG10
DRAIN12
I/O
O
Channel 11 open-drain output or diagnostics input 10
Channel 12 open-drain output
DRAIN13/DIAG12
DRAIN14
I/O
O
Channel 13 open-drain output or diagnostics input 12
Channel 14 open-drain output
DRAIN15/DIAG14
I/O
Channel 15 open-drain output or diagnostics input 14
Copyright © 2017–2020, Texas Instruments Incorporated
3
TLC6C5816-Q1
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
Pin Functions (continued)
PIN
I/O
DESCRIPTION
NAME
NO.
Device enable, active-low. EN high level shuts down the device, all the registers reset, and
the device enters standby mode. EN low level enables the device, all functions work
normally.
EN
14
I
ERR
G1
27
2
O
Open-drain error feedback
I
I
Channel enable, controls DRAIN0–DRAIN7 outputs, active-low
Channel enable, controls DRAIN8–DRAIN15 outputs, active-low
No intenal connection
G2
3
NC
26
NC
Serial data latch. The data in each shift register transfers to a storage register at the rising
edge of RCK. Meanwhile, the status bit is loaded to the shift register.
RCK
16
I
SER IN
12
15
I
Serial data input. Data on SER IN loads into the shift register on each rising edge of SRCK.
Serial data output. The purpose of this pin is to cascade several devices on the serial bus.
SER OUT
O
Serial clock input. On each rising SRCK edge, data transfers from SER IN to the internal
serial shift registers.
SRCK
17
1
I
VCC
P
Power supply pin for the device. Add a 0.1-μF ceramic capacitor near the pin.
Power ground, the ground reference pin for the device. This pin must connect to the ground
plane on the PCB.
GND
28
—
G
—
Thermal pad
Connect to polygon pour to optimize thermal performance
6 Specifications
6.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
MAX UNIT
VCC
VI
Supply voltage
6
V
V
Logic input voltage, CLR, EN, G1, G2, RCK, SER IN, SRCK
Logic output voltage, SER OUT
6
VO
VCC + 0.3
V
VDS
VERR
IO
Power DMOS drain-source voltage, DRAIN0–DRAIN15
Error output voltage, ERR
45
6
V
V
Channel output current
50
mA
°C
°C
Operating junction temperature, TJ
Storage temperature, Tstg
–40
–55
150
165
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
±4000
V(ESD) Electrostatic discharge
V
Charged-device model (CDM), per AEC Q100-
011
All pins
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
3
MAX
UNIT
VCC
VIH
VIL
TA
Supply voltage
5.5
V
V
High-level input voltage, CLR, EN, G1, G2, RCK, SER IN, SRCK
Low-level input voltage, CLR, EN, G1, G2, RCK, SER IN, SRCK
Operating ambient temperature
2.4
0.7
V
–40
125
°C
4
Copyright © 2017–2020, Texas Instruments Incorporated
TLC6C5816-Q1
www.ti.com.cn
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
6.4 Thermal Information
TLC6C5816-Q1
THERMAL METRIC(1)
PWP (HTSSOP)
UNIT
28 PINS
44.4
29.9
26.9
2
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
26.7
5.3
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
6.5 Electrical Characteristics
VCC = 5 V, TJ = –40°C to 150°C unless otherwise specified
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Power-on-reset rising
threshold
V(POR-rising)
1.5
2.5
V
Power-on-reset falling
threshold
V(POR-falling)
t(device-ready)
1
V
Device ready time
VCC > 0.5 V, EN = 0
50
60
µs
All outputs off, no clock signal , EN = 0
All outputs on, no clock signal, EN = 0
120
300
ICC
Logic supply current
µA
210
Logic supply current at
frequency
ICC(FRQ)
I(Q)
VOH
fSRCK = 5 MHz, CL = 30 pF, all outputs on
320
600
1
µA
µA
Quiescent current
EN = 1
IOH = –20 μA
IOH = –4 mA
IOH = –20 μA
IOH = –4 mA
VI = 5 V
4.9
4.5
4.99
4.69
0.001
0.25
0.2
High-level output voltage
SER OUT
V
V
0.01
0.4
Low-level output voltage
SER OUT
VOL
IIH
IIL
High-level input current
Low-level input current
µA
µA
VI = 0 V
–0.2
0.01
0.1
VDS = 30 V
VDS = 30 V, TA = 125°C
0.1
0.3
8
ID(SX)
Off-state drain current
µA
VCC = 5 V, ID = 20 mA
TA = 25°C, single channel ON
5
6
9
6.2
Static drain-source on-
state resistance
rDS(on)
TA = 25°C, all channels ON
TA = 125°C, all channels ON
7.3
9
Ω
VCC = 3.3 V, ID = 20 mA
11.6
13.5
Thermal shutdown
threshold
T(SHUTDOWN)
T(HYS)
175
15
°C
°C
V
Thermal shutdown
hysteresis
LED-open detection
threshold
V(OC_th)
Vhys(OC)
V(SC_th)
4
1
4.3
60
4.5
1.5
LED-open detection-
threshold hysteresis
mV
V
LED-short detection
threshold
1.22
60
LED-short detection-
threshold hysteresis
Vhys(SC)
mV
ERR pin open-drain
voltage drop
V(ERR_PD)
Ilkg(ERR)
IERR = 4 mA
VERR = 5 V
0.3
1
V
ERR pin leakage current
–1
µA
Copyright © 2017–2020, Texas Instruments Incorporated
5
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6.6 Timing Requirements
Vcc = 5 V, TJ = 25°C, CL = 30 pF, ID = 20 mA unless otherwise specified
MIN
NOM
MAX
UNIT
MHz
ns
fSRCK
tSRCK
tSRCKH
tSRCKL
tsu
Serial clock frequency
10
Serial clock duration
100
30
SRCK pulse duration, high
SRCK pulse duration, low
ns
30
ns
Setup time, SER IN high before SRCK rise
Hold time, SER IN high after SRCK rise
SER IN pulse duration
15
ns
th
15
ns
tSER IN
td
40
ns
Last SRCK rise to RCK rise
200
ns
6.7 Switching Characteristics
Vcc = 5 V, TJ = 25ºC, CL = 30 pF, ID = 20 mA unless otherwise specified
PARAMETER
MIN
TYP
35
MAX
UNIT
µs
tpd(deg_open)
tpd(deg_short)
tpd(GOFF)
LED open to ERR pin pulled down time
LED short to ERR pin pulled down time
35
µs
Propagation delay time, output off (VOUT equals 10% LED supply
voltage) from Gx rising
250
ns
tpd(GON)
tpd(ROFF)
tpd(RON)
Propagation delay time, output on (VOUT equals 90% LED supply
voltage) from Gx falling
250
250
250
ns
ns
ns
Propagation delay time, output off (VOUT equals 10% LED supply
voltage) from RCK rising
Propagation delay time, output on (VOUT equals 90% LED supply
voltage) from RCK rising
tr
Rise time, drain output
100
100
35
ns
ns
ns
ns
ns
tf
Fall time, drain output
tpd(SIO)
tr(o)
tf(o)
Propagation delay time, SRCK falling edge to SEROUT change
SEROUT rise time (10% to 90%)
SEROUT fall time (90% to 10%)
20
20
ttSRCK
t
SRCK
ttsu
t
ttht
ttSRCKH
t
ttSRCKLt
SER IN
ttSER IN
t
ttdt
RCK
Copyright © 2017, Texas Instruments Incorporated
图 1. Timing Diagram of Input Signals
6
版权 © 2017–2020, Texas Instruments Incorporated
TLC6C5816-Q1
www.ti.com.cn
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
Gx
tpd(GOFF)
tpd(GON)
VOUTx
tr
tf
RCK
tpd(ROFF)
tpd(RON)
VOUTx
SRCK
ttpd(SIO)
t
tpd(SIO)
SER OUT
tr(o)
tf(o)
Copyright © 2017, Texas Instruments Incorporated
图 2. Timing Diagram of Output Signals
6.8 Typical Characteristics
350
120
110
100
90
-40°C
25°C
125°C
VCC = 3 V
VCC = 3.3 V
VCC = 5 V
VCC = 5.5 V
340
330
320
310
300
290
280
270
260
250
240
80
70
60
50
40
30
20
0
0.5
1
1.5
2
Frequency (MHz)
2.5
3
3.5
4
4.5
5
-40
-20
0
20
Ambient Temperature (°C)
40
60
80
100 120 140
D001
D002
VCC = 5 V
图 3. Supply Current vs CLK Frequency
图 4. Supply Current vs Ambient Temperature
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Typical Characteristics (接下页)
280
11
10
9
All Channels OFF
All Channels ON
240
-40°C
25°C
125°C
200
160
120
80
8
7
6
40
5
3
3.5
4
4.5
Supply Voltage (V)
5
5.5
6
10
15
20
25
Drain Current (mA)
30
35
40
45
50
D003
D006
VCC = 3.3 V
Single channel ON
图 5. Supply Current vs Supply Voltage
图 6. rDS(on) vs Ambient Temperature
10
9
12
11
10
9
-40°C
25°C
125°C
-40°C
25°C
125°C
8
7
8
6
7
5
6
4
5
10
15
20
25
Drain Current (mA)
30
35
40
45
50
10
15
20
25
Drain Current (mA)
30
35
40
45
50
D007
D009
VCC = 5 V
Single channel ON
VCC = 3.3 V
All channels ON
图 7. rDS(on)vs Ambient Temperature
图 8. rDS(on)vs Drain Current
11
11
10
9
10
9
-40°C
25°C
125°C
-40°C
25°C
125°C
8
8
7
7
6
6
5
5
4
4
10
15
20
25
Drain Current (mA)
30
35
40
45
50
3
3.5
4
4.5
5
5.5
VCC (V)
D010
D008
VCC = 5 V
All channels ON
图 9. rDS(on) vs Drain Current
图 10. rDS(on) vs Supply Voltage
8
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www.ti.com.cn
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
Typical Characteristics (接下页)
6
0.26
0.24
0.22
0.2
VCC = 3 V
VCC = 3.3 V
VCC = 4 V
VCC = 4.5 V
VCC = 5 V
VCC = 5.5 V
VCC = 3 V
VCC = 3.3 V
VCC = 4 V
VCC = 4.5 V
VCC = 5 V
VCC = 5.5 V
5.5
5
4.5
4
3.5
3
0.18
2.5
0.16
-40
-20
0
20
Ambient Temperature (°C)
40
60
80
100 120 140
-40
-20
0
20
Ambient Temperature (°C)
40
60
80
100 120 140
D004
D005
图 11. SER OUT High Voltage vs Temperature (°C)
图 12. SER OUT Low Voltage vs Temperature (°C)
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TLC6C5816-Q1
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
7 Detailed Description
7.1 Overview
The TLC6C5816-Q1 device is a 16-bit shift-register LED driver designed to support automotive LED applications.
A built-in LED-open and LED-short diagnostic mechanism provides enhanced safety protection. The device
contains 16 channels with power DMOS transistor outputs, but 8 of the channels can instead be configured by
the corresponding DIAGn bits in the Configuration register to support LED fault diagnostics. The diagnostics
channels DIAGn must connect to DRAINn to realize LED diagnostics. A command error fault implies that a
channel is configured for LED diagnostics, but a register write command has turned on the channel at the same
time. The device provides a cyclic redundancy check to verify register values in the shift registers. In readback
mode, the device provides 6 bits of the CRC remainder. The MCU can read back the CRC remainder and check
if the remainder is correct. This checks whether the communication loop between MCU and device is good.
7.2 Functional Block Diagram
TLC6C5816-Q1
VCC
Power
EN
Driver
DRAIN0
DRAIN1
/DIAG0
G1
G2
Driver
Diagnostics
CLR
RCK
X 8
SER IN
SRCK
Logic Control
DRAIN14
DRAIN15
/DIAG14
SER OUT
Thermal Shutdown
Open Drain Error
Output
ERR
GND
7.3 Feature Description
The features of the TLC6C5816-Q1 device are described in the following sections. 表 1 describes device
behavior under different conditions.
表 1. TLC6C5816-Q1 Behavior Under Different Conditions
CONFIGUR
ATION
REGISTERS
STATUS
REGISTERS
DEVICE
CURRENT
OUTPUTS 0-7
OUTPUTS 8-15
EN = HIGH
CLR = X
Clear
Clear
Clear
Clear
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Low I(Q)
CLR = LOW
Active current
Controlled by
configuration and
G1 level
Controlled by
configuration and
G2 level
EN = LOW
̅
Set by
interface
Set by fault
detection
CLR = HIGH
Operation current
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7.3.1 Device Enable (EN)
The TLC6C5816-Q1 device provides a low I(Q) mode. A high EN level shuts down the device, all the registers
reset, and the device enters standby mode. A low EN level enables the device, and all functions work normally.
7.3.2 Gated Output (Gx)
The device provides two active-low inputs to control gated outputs. G1 turns channels DRAIN0–DRAIN7 on and
off, and G2 turns channels DRAIN8–DRAIN15 on and off.
7.3.3 Register Clear (CLR)
The device provides a convenient function for clearing registers. A low CLR input level clears all internal registers
and all fault states. A high CLR level makes the device work normally.
7.3.4 Open-Drain Outputs and Flexible Diagnostics Channel
The device provides 16 output channels. All 16 channels have integrated low-side switches to drive external
loads such as LEDs independently. Eight channels have integrated voltage comparators dedicated for LED-open
and -short diagnostics as depicted in the following sections.
7.3.4.1 Configurable Outputs
The 16 channels are divided into eight pairs of outputs like DRAIN0, DRAIN1/DIAG0 as shown in 图 13. By
default, both outputs of this pair are open-drain outputs. Each of the pair is independent from the other.
DRAIN1
DRAIN0
/DIAG0
REF
SHORT
OPEN
REF
X 8
TLC6C5816-Q1
X 8
Copyright © 2017, Texas Instruments Incorporated
图 13. Open-Drain Output and Flexible Diagnostics
By setting its bit in the configuration register to HIGH, the DRAIN1/DIAG0 output can be configured as
diagnostics channel DIAG0 for DRAIN0.
By setting the configuration register to LOW, DRAIN1/DIAG0 can be configured as the independent open-drain
output DRAIN1.
If DRAIN1/DIGA0 is configured as a diagnostics channel, when DRAIN0 is on, the DRAIN1/DIAG0 diagnostics
path monitors the voltage. When DRAIN0 is off, DRAIN1/DIAG0 is in the high-impedance state to avoid any
leakage current.
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Vbat
DRAIN1
/DIAG0
DRAIN0
MCU
ERR
REF
SHORT
OPEN
4
REF
SPI
X 8
TLC6C5816-Q1
X 8
Copyright © 2017, Texas Instruments Incorporated
图 14. Diagnostics Configuration of Output Driver Pair
7.3.4.2 LED-Open Diagnostics
As depicted in Configurable Outputs, the DIAG0 channel monitors the anode voltage of the LED load of DRAIN0.
When the DRAIN0 channel turns on, DIAG0 compares the DRAIN0 voltage with internal threshold for LED-open
detection, V(OC_th). When DRAIN0 is on, and V(DIAG0) is continuously higher than V(OC_th) for tpd(deg_open), the device
asserts an LED-open fault, sets the corresponding bit in the fault table, and pulls ERR low.
An LED-open fault does not turn off the channel automatically in the LED-open state. Once the device detects an
open fault, it latches the fault status in the DIAGn_OPEN fault register. The fault register value only recovers to
normal when the LED fault disappears and the fault status is read back. Cycling Gx on and off does not clear the
fault.
7.3.4.3 LED-Short Diagnostics
As depicted in Configurable Outputs, the DIAG0 channel monitors the LED anode voltage of DRAIN0. When the
DRAIN0 channel is turned on, DIAG0 compares the DRAIN0 voltage with the internal threshold for LED short
detection, V(SC_th). When DRAIN0 is on and V(DIAG0) is continuously lower than V(SC_th) for tpd(deg_short), the device
asserts an LED-short fault, sets the corresponding bit in the fault flag table, and pulls ERR low.
The device does not turn off the channel automatically in LED-short state. Once device detects a short fault, it
latches the fault state in the DIAGn_SHORT fault register. The fault register value only recovers to normal when
LED fault disappears and the fault status is read back. Cycling Gx on and off does not clear the fault.
7.3.5 Thermal Shutdown
The TLC6C5816-Q1 device has an internal thermal sensor that monitors device temperature. Once the thermal
sensor detects device overtemperature, it disables all channel outputs and sets the TSD flag in the Fault
Readback register. The fault register value only recovers to normal when the overtemperature fault disappears
and the fault status is read back.
7.3.6 Command Error
The diagnostics configuration for DRAINn+1 and DIAGn cannot be set to open-drain output mode and diagnostics
mode at the same time. If the device detects both of the registers have been set high for any channel, the device
sets the CMD_ERR flag HIGH and pulls the open-drain error flag ERR pin low. Furthermore, the device ignores
the DIAGn setting and drives the channel in open-drain output mode. To reset the CMD_ERR flag, correct the
register configuration value and read out the fault register value.
12
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7.3.7 Serial Communication Error
The device provides a cyclic redundancy check to verify register values in the shift registers. In readback mode,
the device provides 6 bits of the CRC remainder. The MCU can read back the CRC remainder and check if the
remainder is correct to determine whether the communication loop between MCU and device is good. Shift-
Register Communication-Fault Detection gives a detailed description of the CRC check.
7.3.8 Error Feedback
If any of the fault flags is high, ERR is pulled down. The MCU can detect the device fault by this pin, read out
fault flags, and take actions accordingly. The first RCK rising edge latches the fault registers into shift registers.
The status information shifts toward SER OUT at the falling edge of SRCK.
7.3.9 Interface
The TLC6C5816-Q1 device contains a 24-bit shift-register serial interface that feeds a 24-bit D-type storage
register. Data transfer through the shift and storage registers is on the rising edge of the shift register clock
(SRCK) and register latch signal (RCK), respectively. The storage register transfers data to the output buffer
when device enable (EN) is low and shift register clear (CLR) is high.
7.3.9.1 Register Write
The TLC6C5816-Q1 device has a 24-bit configuration register. Data transfers through the shift registers on the
rising edge of SRCK and latches into the storage registers on the rising edge of RCK. The first 8 data bits control
the diagnostics channel configuration, and the following 16 data bits control 16 open-drain outputs independently.
RCK
SRCK
19
1
2
3
4
5
20
21
22
23
24
SER IN
SER OUT
OUTPUT
D23
D22
D21
D20
D19
D5
D4
D3
D2
D1
D0
NEW
OUTPUTS
OLD
OUTPUTS
Copyright © 2017, Texas Instruments Incorporated
图 15. Register Write Timing Diagram
The DRAINn+1-DIAGn channel configuration is controlled by the DIAGn registers. These channels can be set to
either open-drain output or diagnostics input mode. The TLC6C5816-Q1 device does not allow the user to set
DRAINn+1 and DIAGn high at the same time, because the divider resistor for LED diagnostics can result in
leakage current on the LED, which lights up the LED. If the DIAGn and DRAINn registers are set to high at the
same time, the channel operates as an open-drain output instead of LED diagnostics, and a command error
latches in the fault registers, which can be read back by the register readback function as explained in Register
Read.
7.3.9.2 Register Read
The fault information loads to shift registers on the rising edge of RCK and can be read out on SER OUT. On the
rising edge of the RCK signal, the MSB data DIAG14_OPEN appears on the SER OUT pin. On each falling edge
of SRCK signal, there is 1 bit of data shifted out on the SER OUT pin. There is a total of 24 bits in the fault
information registers. Register Maps describes the details.
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RCK
SRCK
19
1
2
3
4
5
20
21
22
23
24
SER IN
SER OUT
D19
D23
D22
D21
D20
D5
D4
D3
D2
D1
D0
tFault Readback Timing Diagramt
Copyright © 2017, Texas Instruments Incorporated
图 16. Register Read Timing Diagram
7.3.9.3 Shift-Register Communication-Fault Detection
The TLC6C5816-Q1 device provides a cyclic redundancy check to verify register values in the shift registers. In
readback mode, the TLC6C5816-Q1 device provides 6 bits of the CRC remainder. The MCU can read back the
CRC remainder and check if the remainder is correct. The CRC checksum provides a readback method to verify
shift register values without altering them.
Polynomial: x6 + x +1
(1)
D
D
D
D
D
D
Input
Copyright © 2017, Texas Instruments Incorporated
图 17. CRC Check Block Diagram
The TLC6C5816-Q1 device also checks the configuration register for faulty commands.
The TLC6C5816-Q1 configuration register consists of 24 bits. To generate the CRC checksum, the device first
shifts left 6 bits and appends 0s, then bit-wise exclusive-ORs the 30 data bits with the polynomial to get the
checksum.
For example, if the configuration data is 0xD7i0F68 and the polynomial is 0x43 (7’b100i0011), the CRC
checksum is 0x19 (6’b01i1001).
The MCU can read back the CRC checksum and append it to the LSB of 24 bits, and then the 30 bits of data
becomes 0x35C3 DA19. Performing the bit-wise exclusive-OR operation with the polynomial should lead to a
residual of 0.
CRC reference: CRC Implementation With MSP430
7.3.9.4 Clear Register
A logic low on CLR clears all registers in the device. TI suggests clearing the device registers during power up or
initialization.
7.3.9.5 Register Clock
RCK is the storage-register clock. Data in the storage register appears at the output whenever the output enable
(G1 and G2) input signals are low.
14
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7.4 Device Functional Modes
7.4.1 Normal Operation
To make the device operate normally, usually use a 3.3-V or 5-V power supply to power VCC, connect the LED
supply voltage to a regulated voltage or directly to the car battery, and make sure the channel current does not
exceed 50 mA.
7.4.2 POR Reset
When VCC is lower than V(POR-falling), the device stops working and enters the power-off mode. When VCC is higher
than V(POR-rising), the device starts to work and sets all registers to their default values.
7.4.3 Standby Mode
When VCC is higher than V(POR-rising) and EN is high, the device enters the standby mode and sets all registers to
their default values. The power consumption is very low.
7.5 Register Maps
表 2. Register Map
CONFIGURATION REGISTER
Bit
23
22
21
20
19
18
17
16
Field name
DIAG14
DIAG12
DIAG10
DIAG8
DIAG6
DIAG4
DIAG2
DIAG0
Default
value
0h
0h
0h
0h
0h
0h
0h
0h
Bit
15
14
13
12
11
10
9
8
Field name
DRAIN15
DRAIN14
DRAIN13
DRAIN12
DRAIN11
DRAIN10
DRAIN9
DRAIN8
Default
value
0h
0h
0h
0h
0h
0h
0h
0h
Bit
7
6
5
4
3
2
1
0
Field name
DRAIN7
DRAIN6
DRAIN5
DRAIN4
DRAIN3
DRAIN2
DRAIN1
DRAIN0
Default
value
0h
0h
0h
0h
0h
0h
0h
0h
FAULT_READBACK REGISTER
Bit
23
22
21
20
19
18
17
16
DIAG14_
OPEN
DIAG14_
SHORT
DIAG12_
OPEN
DIAG12_
SHORT
DIAG10_
OPEN
DIAG10_
SHORT
DIAG8_
SHORT
Field name
DIAG8_OPEN
Default
value
0h
15
0h
0h
0h
0h
0h
0h
0h
Bit
14
13
12
11
10
9
8
DIAG6_
SHORT
DIAG4_
SHORT
DIAG2_
SHORT
DIAG0_
SHORT
Field name DIAG6_OPEN
DIAG4_OPEN
DIAG2_OPEN
DIAG0_OPEN
Default
0h
0h
0h
5
0h
4
0h
3
0h
2
0h
1
0h
0
value
Bit
7
6
Field name
TSD
CMD_ERR
CRC
0h
Default
value
0h
0h
7.6 Interface Registers
Table 3 lists the memory-mapped registers for the interface.
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Table 3. Interface Registers
OFFSET
0h
ACRONYM
REGISTER NAME
SECTION
Go
Config
Fault_Readback
Configuration Register
1h
Fault Readback Register
Go
Complex bit access types are encoded to fit into small table cells. Table 4 shows the codes that are used for
access types in this section.
Table 4. Interface Access Type Codes
CODE
DESCRIPTION
Read type
Read to clear
Write type
R
Read-only
RC
W
Read to clear the fault
Write-only
Reset or Default -n
Value
Value after reset or the default
value
7.6.1 Configuration Register (Offset = 0h) [reset = 0h]
Config is shown in Figure 18 and described in Table 5.
Return to Summary Table.
Figure 18. Configuration Register
23
22
21
20
DIAG8
19
DIAG6
18
17
16
DIAG14
W-0h
DIAG12
W-0h
DIAG10
W-0h
DIAG4
W-0h
DIAG2
W-0h
DIAG0
W-0h
W-0h
W-0h
15
14
13
12
11
10
9
8
DRAIN15
W-0h
DRAIN14
W-0h
DRAIN13
W-0h
DRAIN12
W-0h
DRAIN11
W-0h
DRAIN10
W-0h
DRAIN9
W-0h
DRAIN8
W-0h
7
6
5
4
3
2
1
0
DRAIN7
W-0h
DRAIN6
W-0h
DRAIN5
W-0h
DRAIN4
W-0h
DRAIN3
W-0h
DRAIN2
W-0h
DRAIN1
W-0h
DRAIN0
W-0h
Table 5. Configuration Register Field Descriptions
Bit
Field
Type
Reset
Description
23
DIAG14
W
W
W
W
W
W
0h
0h
0h
0h
0h
0h
Diagnostics configuration bit for DRAIN15 and DIAG14
HIGH = Diagnostics enabled as DIAG14
LOW = Diagnostics disabled as DRAIN15
22
21
20
19
18
DIAG12
DIAG10
DIAG8
DIAG6
DIAG4
Diagnostics configuration bit for DRAIN13 and DIAG12
HIGH = Diagnostics enabled as DIAG12
LOW = Diagnostics disabled as DRAIN13
Diagnostics configuration bit for DRAIN11 and DIAG10
HIGH = Diagnostics enabled as DIAG10
LOW = Diagnostics disabled as DRAIN11
Diagnostics configuration bit for DRAIN9 and DIAG8
HIGH = Diagnostics enabled as DIAG8
LOW = Diagnostics disabled as DRAIN9
Diagnostics configuration bit for DRAIN7 and DIAG6
HIGH = Diagnostics enabled as DIAG16
LOW = Diagnostics disabled as DRAIN7
Diagnostics configuration bit for DRAIN5 and DIAG4
HIGH = Diagnostics enabled as DIAG4
LOW = Diagnostics disabled as DRAIN5
16
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Table 5. Configuration Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
17
DIAG2
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
Diagnostics configuration bit for DRAIN3 and DIAG2
HIGH = Diagnostics enabled as DIAG2
LOW = Diagnostics disabled as DRAIN3
16
15
14
13
12
11
10
9
DIAG0
Diagnostics configuration bit for DRAIN1 and DIAG0
HIGH = Diagnostics enabled as DIAG0
LOW = Diagnostics disabled as DRAIN1
DRAIN15
DRAIN14
DRAIN13
DRAIN12
DRAIN11
DRAIN10
DRAIN9
DRAIN8
DRAIN7
DRAIN6
DRAIN5
DRAIN4
DRAIN3
DRAIN2
DRAIN1
DRAIN0
Open-drain output control bit for DRAIN15 and DIAG14
HIGH = Output power switch enabled
LOW = Output power switch disabled
Open-drain output control bit for DRAIN14
HIGH = Output power switch enabled
LOW = Output power switch disabled
Open-drain output control bit for DRAIN13 and DIAG12
HIGH = Output power switch enabled
LOW = Output power switch disabled
Open-drain output control bit for DRAIN12
HIGH = Output power switch enabled
LOW = Output power switch disabled
Open-drain output control bit for DRAIN11 and DIAG10
HIGH = Output power switch enabled
LOW = Output power switch disabled
Open-drain output control bit for DRAIN10
HIGH = Output power switch enabled
LOW = Output power switch disabled
Open-drain output control bit for DRAIN9 and DIAG8
HIGH = Output power switch enabled
LOW = Output power switch disabled
8
Open-drain output control bit for DRAIN8
HIGH = Output power switch enabled
LOW = Output power switch disabled
7
Open-drain output control bit for DRAIN7 and DIAG6
HIGH = Output power switch enabled
LOW = Output power switch disabled
6
Open-drain output control bit for DRAIN6
HIGH = Output power switch enabled
LOW = Output power switch disabled
5
Open-drain output control bit for DRAIN5 and DIAG4
HIGH = Output power switch enabled
LOW = Output power switch disabled
4
Open-drain output control bit for DRAIN4
HIGH = Output power switch enabled
LOW = Output power switch disabled
3
Open-drain output control bit for DRAIN3 DIAG2
HIGH = Output power switch enabled
LOW = Output power switch disabled
2
Open-drain output control bit for DRAIN2
HIGH = Output power switch enabled
LOW = Output power switch disabled
1
Open-drain output control bit for DRAIN1 DIAG0
HIGH = Output power switch enabled
LOW = Output power switch disabled
0
Open-drain output control bit for DRAIN0
HIGH = Output power switch enabled
LOW = Output power switch disabled
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7.6.2 Fault Readback Register (Offset = 1h) [reset = 0h]
Fault_readback is shown in Figure 19 and described in Table 6.
Return to Summary Table.
Figure 19. Fault_Readback Register
23
22
21
20
19
18
17
16
DIAG14_OPEN DIAG14_SHOR DIAG12_OPEN DIAG12_SHOR DIAG10_OPEN DIAG10_SHOR DIAG8_OPEN DIAG8_SHORT
T
T
T
RC-0h
15
RC-0h
RC-0h
13
RC-0h
RC-0h
11
RC-0h
RC-0h
9
RC-0h
8
14
12
10
DIAG6_OPEN DIAG6_SHORT DIAG4_OPEN DIAG4_SHORT DIAG2_OPEN DIAG2_SHORT DIAG0_OPEN DIAG0_SHORT
RC-0h
RC-0h
RC-0h
5
RC-0h
4
RC-0h
3
RC-0h
2
RC-0h
1
RC-0h
0
7
6
TSD
CMD_ERR
RC-0h
CRC
R-0h
RC-0h
Table 6. Fault Readback Register Field Descriptions
Bit
Field
Type
Reset
Description
23
DIAG14_OPEN
RC
RC
RC
RC
RC
RC
RC
RC
RC
RC
RC
RC
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
LED-Open fault flag for DRAIN15 and DIAG14, read to clear the fault
HIGH = LED-open fault detected
LOW = LED-open fault not detected
22
21
20
19
18
17
16
15
14
13
12
DIAG14_SHORT
DIAG12_OPEN
DIAG12_SHORT
DIAG10_OPEN
DIAG10_SHORT
DIAG8_OPEN
DIAG8_SHORT
DIAG6_OPEN
DIAG6_SHORT
DIAG4_OPEN
DIAG4_SHORT
LED-short fault flag for DIAG15 and DIAG14, read to clear the fault
HIGH = LED-short fault detected
LOW = LED-short fault not detected
LED-open fault flag for DRAIN13 and DIAG12, read to clear the fault
HIGH = LED open fault detected
LOW = LED-open fault not detected
LED-short fault flag for DIAG13 and DIAG12, read to clear the fault
HIGH = LED-short fault detected
LOW = LED-short fault not detected
LED-open fault flag for DRAIN11 and DIAG10, read to clear the fault
HIGH = LED-open fault detected
LOW = LED-open fault not detected
LED-short fault flag for DIAG11 and DIAG10, read to clear the fault
HIGH = LED-short fault detected
LOW = LED-short fault not detected
LED-open fault flag for DRAIN9 and DIAG8, read to clear the fault
HIGH = LED-open fault detected
LOW = LED-open fault not detected
LED-short fault flag for DIAG9 and DIAG8, read to clear the fault
HIGH = LED-short fault detected
LOW = LED-short fault not detected
LED-open fault flag for DRAIN7 and DIAG6, read to clear the fault
HIGH = LED-open fault detected
LOW = LED-open fault not detected
LED-short fault flag for DIAG7 and DIAG6, read to clear the fault
HIGH = LED-short fault detected
LOW = LED-short fault not detected
LED-open fault flag for DRAIN5 and DIAG4, read to clear the fault
HIGH = LED open fault detected
LOW = LED-open fault not detected
LED-short fault flag for DIAG5 and DIAG4, read to clear the fault
HIGH = LED-short fault detected
LOW = LED-short fault not detected
18
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Table 6. Fault Readback Register Field Descriptions (continued)
Bit
Field
DIAG2_OPEN
Type
Reset
Description
11
RC
RC
RC
RC
RC
RC
0h
0h
0h
0h
0h
0h
LED-open fault flag for DRAIN3 and DIAG2, read to clear the fault
HIGH = LED-open fault detected
LOW = LED-open fault not detected
10
9
DIAG2_SHORT
DIAG0_OPEN
DIAG0_SHORT
TSD
LED-short fault flag for DIAG3 and DIAG2, read to clear the fault
HIGH = LED-short fault detected
LOW = LED-short fault not detected
LED-open fault flag for DRAIN1 and DIAG0, read to clear the fault
HIGH = LED-open fault detected
LOW = LED-open fault not detected
8
LED-short fault flag for DIAG1 and DIAG0, read to clear the fault
HIGH = LED-short fault detected
LOW = LED-short fault not detected
7
Thermal-shutdown detection flag, read to clear the fault
HIGH = Thermal shutdown detected
LOW = Thermal shutdown not detected
6
CMD_ERR
Serial-interface command error, read to clear the fault
HIGH = Command error detected in last serial-interface
communication
LOW = No command error detected in last serial-interface
communication
5–0
CRC
R
0h
CRC checksum of configuration registers
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TLC6C5816-Q1 device usually is used to drive LED indicators in automotive cluster applications to convey
different kinds of information, such as airbag alert, engine fault, and so forth. Typically there are two types LED
indicators, general-purpose indicators and safety-related indicators. General indicators only require a simple
turnon and turnoff function. Safety-related indicators require not only LED on-off control, but also LED-open and -
short diagnostics. The TLC6C5816-Q1 device is very flexible, as it has 8 configurable LED diagnostics pins,
which can be configured as open-drain outputs or LED open- and short-diagnostics pins. By configuring
corresponding channels for the LED diagnostics function, the TLC6C5816-Q1 device can provide LED open and
short diagnostics to improve the system safety level. The following section describes a typical cluster application.
8.2 Typical Application
Following is a typical automotive cluster application which contains 24 LEDs. Two TLC6C5816-Q1 devices
connected in series drive the total of 24 LEDs. The first device drives 8 safety-critical LEDs which require LED
diagnostics, and the second device drives 16 general-purpose LEDs which only require simple on-and-off control.
An MCU, which controls the two devices through a serial interface and GPIOs, controls channel on-off, PWM
dimming, and LED diagnostics functions.
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Typical Application (接下页)
VCC
BATTERY
4.7 …F
0.1 …F
10 …F
GND
GND
GND
GND
GND
VCC
EN
DRAIN0
DIAG0
G1
DRAIN2
DIAG2
G2
CLR
DRAIN4
DIAG4
ERR
SER IN
SRCK
RCK
DRAIN6
DIAG6
MCU
TLC6C5816-Q1
DRAIN8
DIAG8
SER OUT
GND
DRAIN10
DIAG10
DRAIN12
DIAG12
DRAIN14
GND
DIAG14
VCC
0.1 …F
4.7 …F
GND
GND
VCC
EN
DRAIN0
DRAIN1
G1
DRAIN2
DRAIN3
DRAIN4
DRAIN5
DRAIN6
DRAIN7
DRAIN8
DRAIN9
DRAIN10
DRAIN11
DRAIN12
DRAIN13
DRAIN14
DRAIN15
G2
CLR
ERR
SER IN
SRCK
RCK
TLC6C5816-Q1
SER OUT
GND
GND
Copyright
© 2017, Texas Instruments Incorporated
图 20. Typical Application Circuit
8.2.1 Design Requirements
Here are the design requirements for the system. The device is powered by 3.3-V voltage. The LED supply is an
automotive battery, 12 V typical. Target LED current is 10 mA typical.
表 7. Design Requirements
Parameter
VCC
Value
3.3 V
VBATTERY
ILED
12 V typical
10 mA typical
8.2.2 Detailed Design Procedure
Based on the LED supply voltage, LED forward voltage, and LED output current, calculate the value for the
current-setting resistor.
Assume the LED forward voltage is 2 volts, current-setting resistor R = (VBATTERY – VLED) / ILED = 1 kΩ.
8.2.3 Application Curves
This section shows the device normal control waveform and error-state waveform.
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21
TLC6C5816-Q1
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
图 21. Waveform for Turning On Cascading Device
图 22. First Device Drain0 Open Waveform
DRAIN15
22
版权 © 2017–2020, Texas Instruments Incorporated
TLC6C5816-Q1
www.ti.com.cn
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
9 Power Supply Recommendations
The supply voltage range is from 3 V to 5.5 V for the TLC6C5816-Q1 device, which typically uses the same
supply voltage as the microcontroller, 3.3 V or 5 V. The LED supply voltage can be up to 40 V, so the LED
supply can use a car battery directly. Ensure the LED current is no greater than 50 mA during load dump
conditions. As the car battery varies a lot, to achieve stable LED brightness, a regulated voltage, for example
5 V, is preferred for the LED supply.
版权 © 2017–2020, Texas Instruments Incorporated
23
TLC6C5816-Q1
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
10 Layout
10.1 Layout Guidelines
To enhance the thermal performance, the TLC6C5816-Q1 device is designed with a thermal pad. TI
recommends to reserve enough copper area for a heat sink. To minimize the noise interference, it is
recommended to put the filter capacitor near the VCC pin. For a detailed layout example, see the following
example.
10.2 Layout Example
VLED up to 40V
VCC = 3 to 5.5V
to µC
1
2
3
4
5
6
7
8
9
VCC
G1
GND
ERR
28
27
26
25
to µC
to µC
G2
NC
DRAIN15
DIAG14
DRAIN0
DRAIN1
DIAG0
DRAIN14 24
DRAIN13
23
DRAIN2
DIAG12
DRAIN3
DIAG2
DRAIN12 22
DRAIN11
21
DRAIN4
DIAG10
DRAIN5
DIAG4
DRAIN10 20
DRAIN9
19
10 DRAIN6
DIAG8
DRAIN7
11
DRAIN8 18
DIAG6
to µC
to µC
to µC
12 SER IN
SRCK
RCK
17
16
to µC
to µC
to µC
13
14
CLR
EN
SER OUT 15
图 23. Layout Example
24
版权 © 2017–2020, Texas Instruments Incorporated
TLC6C5816-Q1
www.ti.com.cn
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
11 器件和文档支持
11.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 社区资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.3 商标
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
版权 © 2017–2020, Texas Instruments Incorporated
25
TLC6C5816-Q1
ZHCSH63B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是适用于指定器件的最新数据。数据如有变更，恕不另行通知，
且不会对此文档进行修订。如需获取此数据表的浏览器版本，请查看左侧的导航面板。
26
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重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、
验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2020 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TLC6C5816QPWPRQ1
ACTIVE
HTSSOP
PWP
28
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TLC6C5816
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Jun-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLC6C5816QPWPRQ1 HTSSOP PWP
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Jun-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTSSOP PWP 28
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
TLC6C5816QPWPRQ1
2000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PWP 28
4.4 x 9.7, 0.65 mm pitch
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224765/B
www.ti.com
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、
验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2020 德州仪器半导体技术（上海）有限公司
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