TLV1018-15YDCR [TI]
AMPLIFIER FOR THREE-WIRE ANALOG ELECTRET MICROPHONES; 放大器，用于三线模拟驻极体麦克风
| 型号： | TLV1018-15YDCR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AMPLIFIER FOR THREE-WIRE ANALOG ELECTRET MICROPHONES |
| 文件： | 总12页 (文件大小：619K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLV1018
www.ti.com .......................................................................................................................................... SLVS664A–OCTOBER 2008–REVISED NOVEMBER 2008
AMPLIFIER FOR THREE-WIRE ANALOG ELECTRET MICROPHONES
1
FEATURES
APPLICATIONS
•
•
•
•
•
Mobile Communications, Bluetooth
Automotive Accessories
Cellular Phones
2
•
Output Voltage Noise (A Weighted):
–89 dBV (Typ)
•
•
•
•
•
•
•
•
Low Supply Current: 70 µA (Typ)
Wide Supply Voltage Range: 1.7 V to 5 V
PSRR: 70 dB (Typ)
PDAs
Accessory Microphone Products
Signal-to-Noise Ratio: 61 dB (Typ)
Input Capacitance: 2 pF (Typ)
Input Impedance: >100 MΩ (Typ)
Output Impedance: <100 Ω (Typ)
Maximum Input Signal: 170 mVPP (Typ)
YDC PACKAGE
(TOP VIEW)
A2 B2
OUTPUT
GND
VCC
A1 B1
INPUT
DESCRIPTION/ORDERING INFORMATION
The TLV1018 is an audio amplifier for small-form-factor electret microphones and is designed to replace the
currently implemented JFET preamplifiers. The TLV1018 is ideal for extended battery-life applications, such as a
Bluetooth™ communication link. The addition of a third pin to an electret microphone that incorporates a
TLV1018 allows for a dramatic reduction in supply current compared to a JFET-equipped electret microphone.
Microphone supply current is reduced to 70 µA, assuring longer battery life.
The TLV1018 is specified for supply voltages from 1.7 V to 5 V and has fixed voltage gains of 15 dB and 25 dB.
It offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability
over temperature.
The TLV1018 is offered in a space-saving four-terminal ultra-thin lead-free package (YDC) and is ideally suited
for the form factor of miniature electret microphone packages. The TLV1018 is characterized for operation over a
free-air temperature range of –40°C to 85°C.
ORDERING INFORMATION(1)
TA
AV
PACKAGE(2)
ORDERABLE PART NUMBER
TLV1018-15YDCR
TOP-SIDE MARKING
15 dB
25 dB
Y28
NanoStar™ WCSP
–40°C to 85°C
Reel of 3000
(DSBGA) – YDC
TLV1018-25YDCR
YW8
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
Bluetooth is a trademark of Bluetooth SIG.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TLV1018
SLVS664A–OCTOBER 2008–REVISED NOVEMBER 2008 .......................................................................................................................................... www.ti.com
FUNCTIONAL BLOCK DIAGRAM
VCC
INPUT
OUTPUT
1×
Gain
VDC
GND
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VCC
VIN
θJA
TA
Supply voltage
–0.3 V to 5.5 V
–0.3 V to 0.3 V
230.47°C/W
Input voltage
Thermal impedance, junction to free air(2)
Operating free-air temperature range
Storage temperature range
–40°C to 85°C
–65°C to 150°C
Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Package thermal impedance is calculated according to JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
MIN
1.7
MAX UNIT
VCC
TA
Supply voltage
5
V
Operating free-air temperature
–40
85
°C
2
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TLV1018
TLV1018
www.ti.com .......................................................................................................................................... SLVS664A–OCTOBER 2008–REVISED NOVEMBER 2008
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TJ
25°C
MIN
TYP
MAX UNIT
70
90
µA
ICC
Supply current
VIN = GND
Full range
25°C
100
VCC = 1.7 V,
VIN = 18 mVPP
f = 1 kHz
TLV1018-15
TLV1018-25
TLV1018-15
TLV1018-25
61
61
61
62
70
,
,
25°C
25°C
25°C
SNR
Signal-to-noise ratio
dB
dB
VCC = 5 V,
VIN = 18 mVPP
f = 1 kHz
25°C
Full range
25°C
55
50
55
50
TLV1018-15
TLV1018-25
PSRR
Power-supply rejection ratio
VCC = 1.7 V to 5 V
65
Full range
25°C
TLV1018-15
TLV1018-25
170
60
f = 1 kHz,
THD+N < 1%
VIN
Input voltage
mVPP
Hz
25°C
fLOW
fHIGH
Lower –3-dB roll-off frequency
Upper –3-dB roll-off frequency
RSOURCE = 50 Ω, VIN = 18 mVPP
25°C
70
TLV1018-15
25°C
75
RSOURCE = 50 Ω,
kHz
VIN = 18 mVPP
TLV1018-25
TLV1018-15
TLV1018-25
25°C
75
25°C
–89
–80
500
en
Output noise
A-weighted
dBV
25°C
25°C
TLV1018-15
TLV1018-25
Full range
25°C
250
400
750
mV
VOUT
Output voltage
VIN = GND
f = 1 kHz
600
Full range
25°C
800
ZOUT
Output impedance
<100
2.3
Ω
25°C
0.9
0.5
0.3
0.2
0.9
0.5
0.4
0.1
VCC = 1.7 V, VOUT = 1.7 V, Sinking
VCC = 1.7 V, VOUT = 0 V, Sourcing
VCC = 5 V, VOUT = 1.7 V, Sinking
VCC = 5 V, VOUT = 0 V, Sourcing
Full range
25°C
1.5
2.9
2.6
Full range
25°C
IOUT
Output current
mA
Full range
25°C
Full range
25°C
TLV1018-15
TLV1018-25
0.13
0.2
f = 1 kHz,
VIN = 18 mVPP
THD
Total harmonic distortion
%
25°C
CIN
ZIN
Input capacitance
Input impedance
2
pF
MΩ
>100
15.4
25°C
Full range
25°C
14.8
14
16
TLV1018-15
TLV1018-25
17
dB
f = 1 kHz,
VIN = 18 mVPP
AV
Gain
24.8
24
25.5
26.2
Full range
27
Copyright © 2008, Texas Instruments Incorporated
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3
Product Folder Link(s): TLV1018
TLV1018
SLVS664A–OCTOBER 2008–REVISED NOVEMBER 2008 .......................................................................................................................................... www.ti.com
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
CLOSED LOOP GAIN AND PHASE
vs
FREQUENCY
30
25
20
15
10
5
180
135
90
85
80
75
70
65
60
Gain
TA = 25°C
45
TA = 125°C
0
0
TA = -40°C
Phase
-5
-45
-90
-135
-180
-10
-15
-20
-25
-30
10
100
1k
10k
100k
1M
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Frequency (Hz)
VCC – V
POWER SUPPLY REJECTION RATIO
TOTAL HARMONIC DISTORTION + NOISE
vs
vs
FREQUENCY
FREQUENCY
120
100
80
60
40
20
0
0.6
0.5
0.4
0.3
0.2
0.1
0
VS = 1.7 V
VIN = 18 mVpp
10
100
1k
10k
100k
0
10
100
1,000
10,000
100,000
Frequency – Hz
Frequency – Hz
4
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TLV1018
TLV1018
www.ti.com .......................................................................................................................................... SLVS664A–OCTOBER 2008–REVISED NOVEMBER 2008
TYPICAL CHARACTERISTICS (continued)
TOTAL HARMONIC DISTORTION
OUTPUT NOISE VOLTAGE
vs
vs
INPUT VOLTAGE
FREQUENCY
1.6
1.4
1.2
1
-80
-90
-100
-110
-120
-130
-140
-150
0.8
0.6
0.4
0.2
0
10
100
1k
10k
100k
0
10
20
30
40
50
60
70
80
Frequency – Hz
Input Amplitude – mVpp
Copyright © 2008, Texas Instruments Incorporated
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Product Folder Link(s): TLV1018
TLV1018
SLVS664A–OCTOBER 2008–REVISED NOVEMBER 2008 .......................................................................................................................................... www.ti.com
APPLICATION INFORMATION
Low Current
The TLV1018 has a low supply current, which allows for a longer battery life. The low supply current of 70 µA
makes this amplifier optimal for microphone applications that need to be always on.
Built-In Gain
The TLV1018 is offered in the space-saving YDC package, which fits perfectly into the metal can of a
microphone. This allows the TLV1018 to be placed on the PCB inside the microphone.
The bottom side of the PCB has pins that connect the supply voltage to the amplifier and make the output
available. The input of the amplifier is connected to the microphone via the PCB.
Diaphragm
Airgap
Electret
Backplate
Connector
VCC
OUTPUT
GND
Figure 1. Built-In Gain
A-Weighted Filter
The human ear has a frequency range from 20 Hz to about 20 kHz. Within this range the sensitivity of the human
ear is not equal for each frequency. To approach the hearing response, weighting filters are introduced. One of
those filters is the A-weighted filter.
The A-weighted filter is usually used in signal-to-noise ratio measurements, where sound is compared to device
noise. It improves the correlation of the measured data to the signal-to-noise ratio perceived by the human ear.
10
0
-10
-20
-30
-40
-50
-60
-70
10
100
1000
10000
100000
Frequency – Hz
Figure 2. A-Weighted Filter
6
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Product Folder Link(s): TLV1018
TLV1018
www.ti.com .......................................................................................................................................... SLVS664A–OCTOBER 2008–REVISED NOVEMBER 2008
Measuring Noise and SNR
The overall noise of the TLV1018 is measured within the frequency band from 10 Hz to 22 kHz using an
A-weighted filter. The input of the TLV1018 is connected to ground with a 5-pF capacitor.
A-Weighted Filter
5 pF
Figure 3. Noise Measurement
The signal-to-noise ratio (SNR) is measured with a 1-kHz input signal of 18 mVPP using an A-weighted filter. This
represents a sound pressure level (SPL) of 94 dBSPL. No input capacitor is connected.
Sound Pressure Level
The volume of sound applied to a microphone is usually stated as the pressure level with respect to the threshold
of hearing of the human ear. The sound pressure level (SPL) in decibels is defined by:
Sound pressure level (dB) = 20 log Pm/PO
Where Pm is the measured sound pressure, and PO is the threshold of hearing (20 µPa)
To calculate the resulting output voltage of the microphone for a given SPL, the sound pressure in dBSPL needs
to be converted to the absolute sound pressure in dBPa. This is the sound pressure level in decibels, which is
referred to as 1 Pascal (Pa).
The conversion is given by:
dBPa = dBSPL + 20 log 20 µPa
dBPa = dBSPL – 94 dB
Translation from absolute sound pressure level to a voltage is specified by the sensitivity of the microphone. A
conventional microphone has a sensitivity of –44 dBV/Pa.
Absolute
Sound
Pressure
(dB Pa)
Sensitivity
(dBV/Pa)
–94 dB
Sound
Voltage
Pressure
(dBV)
(dB SPL)
Figure 4. dBSPL to dBV Conversion
Example: Busy traffic is 70 dBSPL
VOUT = 70 – 94 – 44 = –68 dBV
This is equivalent to 1.13 mVPP
.
Copyright © 2008, Texas Instruments Incorporated
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Product Folder Link(s): TLV1018
TLV1018
SLVS664A–OCTOBER 2008–REVISED NOVEMBER 2008 .......................................................................................................................................... www.ti.com
Because the TLV1018-15 has a gain of 5.6 (15 dB) over the JFET, the output voltage of the microphone is
6.35 mVPP. By replacing the JFET with the TLV1018-15, the sensitivity of the microphone is –29 dBV/Pa
(–44 + 15).
Low-Frequency Cut-Off Filter
To reduce noise on the output of the microphone, a low-cut filter is implemented in the TLV1018. This filter
reduces the effect of wind and handling noise.
It is also helpful to reduce the proximity effect in directional microphones. This effect occurs when the sound
source is very close to the microphone. The lower frequencies are amplified, which gives a bass sound. This
amplification can cause an overload, which results in a distortion of the signal.
30
25
20
15
10
5
180
135
90
Gain
45
0
0
Phase
-5
-45
-90
-135
-180
-10
-15
-20
-25
-30
10
100
1k
10k
100k
1M
Frequency (Hz)
Figure 5. Gain vs. Frequency
The TLV1018 is optimized to be used in audio-band applications. The TLV1018 provides a flat gain response
within the audio band and offers linearity and excellent temperature stability.
Advantage of Three Pins
The TLV1018 ECM solution has three pins, instead of the two pins provided in the case of a JFET solution. The
third pin provides the advantage of a low supply current, high PSRR, and eliminates the need for additional
components.
Noise pick-up by a microphone in a cell phone is a well known problem. A conventional JFET circuit is sensitive
for noise pick-up because of its high output impedance. The output impedance is usually around 2.2 kΩ. By
providing separate output and supply pins a much lower output impedance is achieved and therefore is less
sensitive to noise pick-up.
RF noise is one of the noises caused by non-linear behavior. The non-linear behavior of the amplifier at high
frequencies, well above the usable bandwidth of the device, causes AM demodulation of high-frequency signals.
The AM modulation contained in such signals folds back into the audio band, thereby disturbing the intended
microphone signal. The GSM signal of a cell phone is such an AM-modulated signal. The modulation frequency
of 216 Hz and its harmonics can be observed in the audio band. This type of noise is called bumblebee noise.
8
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Product Folder Link(s): TLV1018
TLV1018
www.ti.com .......................................................................................................................................... SLVS664A–OCTOBER 2008–REVISED NOVEMBER 2008
External Pre-Amplifier Application
The TLV1018 can also be used outside of an ECM as a space saving external preamplifier. In this application,
the TLV1018 follows a phantom biased JFET microphone in the circuit. This is shown in Figure 6. The input of
the TLV1018 is connected to the microphone via the 2.2-µF capacitor. The advantage of this circuit over one with
only a JFET microphone are the additional gain and the high-pass filter supplied by the TLV1018. The high-pass
filter makes the output signal more robust and less sensitive to low frequency disturbances. In this configuration,
the TLV1018 should be placed as close as possible to the microphone.
VCC
2.2 kW
VCC
VOUT
INPUT OUTPUT
GND
2.2 µF
JFET
Microphone
GND
Figure 6. External Preamplifier
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Product Folder Link(s): TLV1018
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2008
PACKAGING INFORMATION
Orderable Device
TLV1018-15YDCR
TLV1018-25YDCR
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
DSBGA
YDC
4
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
DSBGA
YDC
4
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
D: Max = 1142 µm, Min = 1082 µm
E: Max = 1142 µm, Min = 1082 µm
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