TLV61046ADBVR [TI]
具有功率二极管和隔离开关的 28V 输出电压升压转换器 | DBV | 6 | -40 to 125;型号: | TLV61046ADBVR |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有功率二极管和隔离开关的 28V 输出电压升压转换器 | DBV | 6 | -40 to 125 升压转换器 开关 光电二极管 |
文件: | 总27页 (文件大小:2159K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TLV61046A
ZHCSGJ6B –APRIL 2017 –REVISED FEBRUARY 2021
具有功率二极管和隔离开关的TLV61046A 28V 输出电压升压转换器
1 特性
3 说明
• 输入电压范围:1.8V 至5.5V,启动后低至1.6V
• 输出电压高达28V
• 集成式功率二极管和隔离开关
• 开关电流为980mA(典型值)
• 输入电压为3.6V、输出电压为12V 时,效率高达
85%
TLV61046A 是一款高度集成的升压转换器,专为
PMOLED 面板、LCD 偏置电源和传感器模块等应用设
计。TLV61046A 集成了 30V 电源开关、输入至输出的
隔离开关以及整流器二极管。该器件可将来自一节锂离
子电池或两节碱性电池(串联)的输入电压转换成高达
28V 的输出电压。
• ±2.5% 的输出电压精度
• 在轻负载状态下进入节能工作模式
• 内部7ms 软启动时间
• 在关断期间真正断开输入与输出之间的连接
• 输出短路保护
• 输出过压保护
TLV61046A 的工作开关频率为 1.0MHz。该器件支持
使用小型外部组件。通过将 TLV61046A 的 FB 引脚和
VIN 引脚相连,可将其默认内部输出电压设置为12V。
因此,只需要三个外部组件即可获得 12V 输出电压。
TLV61046A 的开关限流典型值为 980mA。它具有
7ms 内置软启动时间,从而能够降低浪涌电流。
TLV61046A 处于关断模式时,隔离开关会将输出与输
入断开以最大限度降低泄漏电流。TLV61046A 还具有
输出短路保护、输出过压保护和热关断功能。
• 热关断保护
• 3mm × 3mm SOT23-6 封装
• 使用TLV61046A 并借助WEBENCH® Power
Designer 创建定制设计方案
TLV61046A 采用6 引脚3mm x 3mm SOT23-6 封装。
2 应用
器件信息(1)
• PMOLED 电源
• LCD 面板
封装尺寸(标称值)
器件型号
封装
TLV61046A
SOT23-6 (6)
2.9mm x 1.6mm
• 可穿戴设备
• 便携式医疗设备
• 传感器电源
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
L1
1.8 V ~ 5.5 V
C1
VIN
SW
4.5 V ~ 28 V
GND
VOUT
C2
ON
R1
OFF
FB
EN
R2
简化版原理图
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLVSD82
TLV61046A
ZHCSGJ6B –APRIL 2017 –REVISED FEBRUARY 2021
www.ti.com.cn
Table of Contents
8 Application and Implementation.................................. 11
8.1 Application Information..............................................11
8.2 Typical Application - 12-V Output Boost Converter...11
8.3 System Examples..................................................... 16
9 Power Supply Recommendations................................17
10 Layout...........................................................................18
10.1 Layout Guidelines................................................... 18
10.2 Layout Example...................................................... 18
11 Device and Documentation Support..........................19
11.1 Device Support........................................................19
11.2 接收文档更新通知................................................... 19
11.3 支持资源..................................................................19
11.4 Trademarks............................................................. 19
11.5 静电放电警告...........................................................19
11.6 术语表..................................................................... 19
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Typical Characteristics................................................6
7 Detailed Description........................................................8
7.1 Overview.....................................................................8
7.2 Functional Block Diagram...........................................8
7.3 Feature Description.....................................................8
7.4 Device Functional Modes............................................9
Information.................................................................... 19
4 Revision History
Changes from Revision A (April 2017) to Revision B (February 2021)
Page
• 更新了整个文档的表、图和交叉参考的编号格式。.............................................................................................1
• 更正了语法和计算格式........................................................................................................................................1
• 添加了WEBENCH 链接..................................................................................................................................... 1
Changes from Revision * (April 2017) to Revision A (April 2017)
Page
• 已更改为“量产数据”........................................................................................................................................1
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5 Pin Configuration and Functions
SW
GND
FB
VIN
VOUT
EN
图5-1. DBV Package 6-Pin SOT23 Top View
表5-1. Pin Functions
PIN
NUMBER
TYPE
DESCRIPTION
NAME
SW
1
2
PWR The switch pin of the converter. It is connected to the drain of the internal power MOSFET.
PWR Ground
GND
Voltage feedback of adjustable output voltage. Connected to the center tap of a resistor divider to
FB
EN
3
4
I
I
program the output voltage. When it is connected to the VIN pin, the output voltage is set to 12 V by an
internal feedback.
Enable logic input. Logic high voltage enables the device. Logic low voltage disables the device and
turns it into shutdown mode.
VOUT
VIN
5
6
PWR Output of the boost converter
IC power supply input
I
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
–0.3
–0.3
–40
–65
MAX
6
UNIT
V
VIN, EN, FB
Voltage range at terminals (2)
SW, VOUT
32
V
Operating junction temperature range, TJ
Storage temperature range, Tstg
150
150
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) All voltage values are with respect to network ground terminal.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(2)
±2000
V
(1)
V(ESD)
Electrostatic discharge
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(3)
±500
V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges
in to the device.
(2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.8
TYP
MAX UNIT
VIN
VOUT
L
Input voltage range
5.5
28
V
V
Output voltage range
3.3
Effective inductance range
Effective input capacitance range
Effective output capacitance range
Operating junction temperature
2.2×0.7
0.22
10 22×1.3
1.0
µH
µF
µF
°C
CIN
COUT
TJ
0.22
1.0
10
125
–40
6.4 Thermal Information
TLV61046A
DBV (SOT23)
6 PINS
177.7
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
RθJC(top)
RθJB
120.6
Junction-to-board thermal resistance
33.2
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
21.5
ψJT
32.6
ψJB
RθJC(bot)
n/a
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
TA = –40°C to 85°C, VIN = 3.6 V and VOUT = 12 V. Typical values are at TA = 25°C, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
VIN
Input voltage range
1.8
5.5
1.8
1.6
V
V
VIN rising
VIN falling
1.75
1.55
200
VIN_UVLO
Under voltage lockout threshold
VIN_HYS
IQ_VIN
VIN UVLO hysteresis
mV
µA
µA
IC enabled, no load, no switching, VIN = 1.8 V to 5.5 V,
VOUT = 12 V
Quiescent current into VIN pin
Shutdown current into VIN pin
110
0.1
200
1.0
ISD
IC disabled, VIN = 1.8 V to 5.5 V, TA = 25°C
OUTPUT
VOUT
Output voltage range
3.3
11.7
28
12.4
V
V
VOUT_12V
12-V output voltage accuracy
FB pin connected to VIN pin, TJ=0°C to 125°C
PWM mode, TA=25°C
12.1
0.795
0.795
0.803
29.2
0.783
0.775
0.807
0.815
V
VREF
Feedback voltage
PWM mode, TJ=-40°C to 125°C
PFM mode, TA=25°C
V
V
VOVP
Output overvoltage protection threshold
28
30.4
V
VOVP_HYS Over voltage protection hysteresis
0.9
V
IFB_LKG
ISW_LKG
Leakage current into FB pin
Leakage current into SW pin
TA = 25°C
200
500
nA
nA
IC disabled, TA = 25°C
POWER SWITCH
Isolation MOSFET on resistance
VOUT = 12 V
850
450
RDS(on)
mΩ
Low-side MOSFET on resistance
Switching frequency
VOUT = 12 V
fSW
VIN = 3.6 V, VOUT = 12 V, PWM mode
850
1050
150
1250
250
kHz
ns
tON_min
Minimal switch on time
VIN = 3.6 V, VOUT = 12 V
680
20
980
1250
mA
mA
mA
ms
ILIM_SW
Peak switch current limit
VIN = 2.4 V, VOUT = 3.3 V
ILIM_CHG
tSTARTUP
Pre-charge current
Startup time
VIN = 3.6 V, VOUT = 0 V
30
5
50
VOUT from VIN to 12 V, COUT_effective = 2.2 µF, IOUT = 0 A
2
LOGIC INTERFACE
VEN_H EN Logic high threshold
VEN_L EN Logic Low threshold
PROTECTION
1.2
V
V
0.4
TSD
Thermal shutdown threshold
Thermal shutdown hysteresis
TJ rising
150
20
°C
°C
TSD_HYS
TJ falling below TSD
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6.6 Typical Characteristics
VIN = 3.6 V, VOUT = 12 V, TA = 25°C, unless otherwise noted.
100
90
80
70
60
50
40
100
90
80
70
60
50
40
30
20
10
0
30
VIN = 1.8 V
VIN = 3 V
VIN = 3.6 V
VIN = 4.2 V
20
VOUT = 5 V
VOUT = 12 V
VOUT = 24 V
10
0
0.0001
0.001
0.01
Output Current (A)
0.1
1
0.0001
0.001
0.01
Output Current (A)
0.1
1
D001
D002
VOUT = 12 V
图6-1. Efficiency vs Output Current
VIN = 3.6 V
图6-2. Efficiency vs Output Current
12.2
810
805
800
795
790
785
780
12.15
12.1
12.05
12
11.95
11.9
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
120
Temperature (èC)
Temperature (èC)
D003
D004
VIN = 3.6 V, VOUT = 12 V, FB pin connected to VIN pin, PWM
mode
VIN = 3.6 V, VOUT = 12 V, PWM mode
图6-4. FB Reference Voltage vs Temperature
图6-3. 12-V Fixed Output Voltage vs Temperature
150
140
130
120
110
100
90
150
140
130
120
110
100
90
80
80
70
70
-40
-20
0
20
40
60
80
100
120
1.8
2.4
3
3.6 4.2
Input Voltage (V)
4.8
5.4
6
Temperature (èC)
D005
D001
VIN = 3.6 V, VOUT = 12 V, No switching
VIN = 1.8 V ~ 6 V, VOUT = 12 V, No switching
图6-5. Quiescent Current into VIN vs Temperature
图6-6. Quiescent Current into VIN vs Input Voltage
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6.6 Typical Characteristics (continued)
VIN = 3.6 V, VOUT = 12 V, TA = 25°C, unless otherwise noted.
0.3
1100
1000
900
800
700
600
500
0.25
0.2
0.15
0.1
0.05
0
-40
-20
0
20
40
60
80
Temperature (èC)
D007
-40
-20
0
20
40
60
80
100
120
Temperature (èC)
VIN = 3.6 V
D008
VIN = 3.6 V, VOUT = 12 V
图6-8. Current Limit vs Temperature
图6-7. Shutdown Current vs Temperature
1100
1000
900
800
700
600
500
1.8
2.4
3
3.6 4.2
Input Voltage (V)
4.8
5.4
6
D009
VIN = 1.8 V ~ 6 V, VOUT = 12 V
图6-9. Current Limit vs Input Voltage
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7 Detailed Description
7.1 Overview
The TLV61046A is a highly-integrated boost converter designed for applications requiring high voltage and small
solution size such as PMOLED panel power supply and sensor module. The TLV61046A integrates a 30-V
power switch, an input to output isolation switch, and a rectifier diode. It can output up to 28 V from input of a Li+
battery or two-cell alkaline batteries in series.
One common issue with conventional boost regulators is the conduction path from input to output even when the
power switch is turned off. It creates three problems, which are inrush current during start-up, output leakage
current during shutdown, and excessive over load current. In the TLV61046A, the isolation switch is turned off
under shutdown mode and over load conditions, thereby opening the current path. Thus, the TLV61046A can
truely disconnect the load from the input voltage and minimize the leakage current during shutdown mode.
The TLV61046A operates with a switching frequency at 1.0 MHz. This allows the use of small external
components. The TLV61046A has an internal default 12-V output voltage setting by connecting the FB pin to the
VIN pin. Thus, it only needs three external components to get 12-V output voltage. The TLV61046A has typical
980-mA switch current limit. It has 7-ms built-in soft start time to minimize the inrush current. The TLV61046A
also implements output short circuit protection, output overvoltage protection, and thermal shutdown.
7.2 Functional Block Diagram
VIN
SW
1
6
VIN
VOUT
UVLO
5
VOUT
Thermal
shutdown
Gate driver
Gate driver
Pre-charge &
short circuit
EN
4
Logic
EN
protection & on/off
control
PWM / PFM control
œ
1.2 V
FB
+
œ
+
œ
Soft start &
current limit control
3
FB
EA
GND
2
OVP REF
VOUT
+
REF
7.3 Feature Description
7.3.1 Undervoltage Lockout
An undervoltage lockout (UVLO) circuit stops the operation of the converter when the input voltage drops below
the typical UVLO threshold of 1.55 V. A hysteresis of 200 mV is added so that the device cannot be enabled
again until the input voltage goes up to 1.75 V. This function is implemented in order to prevent malfunctioning of
the device when the input voltage is between 1.55 V and 1.75 V.
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7.3.2 Enable and Disable
When the input voltage is above the maximal UVLO rising threshold of 1.8 V and the EN pin is pulled high, the
TLV61046A is enabled. When the EN pin is pulled low, the TLV61046A goes into shutdown mode. The device
stops switching and the isolation switch is turned off, providing the isolation between input and output. In
shutdown mode, less than 1-µA input current is consumed.
7.3.3 Soft Start
The TLV61046A begins soft start when the EN pin is pulled high. At the beginning of the soft start period, the
isolation FET is turned on slowly to charge the output capacitor with 30-mA current for about 2 ms. This is called
the pre-charge phase. After the pre-charge phase, the TLV61046A starts switching. This is called switching soft-
start phase. An internal soft start circuit limits the peak inductor current according to the output voltage. When
the output voltage is below 3 V, the peak inductor current is limited to 140 mA. Along with the output voltage
going up from 3 V to 5 V, the peak current limit is gradually increased to the normal value of 980 mA. The
switching soft start phase is about 5 ms typically. The soft start funciton reduces the inrush current during start-
up.
7.3.4 Overvoltage Protection
The TLV61046A has internal output overvoltage protection (OVP) function. When the output voltage exceeds the
OVP threshold of 29.2 V, the device stops switching. Once the output voltage falls 0.9 V below the OVP
threshold, the device resumes operation again.
7.3.5 Output Short Circuit Protection
The TLV61046A starts to limit the output current whenever the output voltage drops below 4 V. The lower output
voltage, the smaller output current limit. When the VOUT pin is shorted to ground, the output current is limited to
less than 200 mA. This function protects the device from being damaged when the output is shorted to ground.
7.3.6 Thermal Shutdown
The TLV61046A goes into thermal shutdown once the junction temperature exceeds the thermal shutdown
termperature threshold of 150°C typically. When the junction temperature drops below 130°C typically, the
device starts operating again.
7.4 Device Functional Modes
The TLV61046A has two operation modes, PWM mode and power save mode.
7.4.1 PWM Mode
The TLV61046A uses a quasi-constant 1.0-MHz frequency pulse width modulation (PWM) at moderate to heavy
load current. Based on the input voltage-to-output votlage ratio, a circuit predicts the required off-time. At the
beginning of the switching cycle, the NMOS switching FET, shown in the functional block diagram, is turned on.
The input voltage is applied across the inductor and the inductor current ramps up. In this phase, the output
capacitor is discharged by the load current. When the inductor current hits the current threshold that is set by the
output of the error amplifier, the PWM switch is turned off, and the power diode is forward-biased. The inductor
transfers its stored energy to replenish the output capacitor and supply the load. When the off-time is expired,
the next switching cycle starts again. The error amplifier compares the FB pin voltage with an internal reference
votlage, and its output determines the inductor peak current.
The TLV61046A has a built-in compensation circuit that can accommodate a wide range of input voltage, output
voltage, inductor value, and output capacitor value for stable operation.
7.4.2 Power Save Mode
The TLV61046A implements a power save mode with pulse frequency modulation (PFM) to improve efficiency at
light load. When the load current decreases, the inductor peak current set by the output of the error amplifier
declines to regulate the output voltage. When the inductor peak current hits the low limit of 200 mA, the output
voltage will exceed the setting voltage as the load current decreases further. When the FB voltage hits the PFM
reference voltage, the TLV61046A goes into power save mode. In power save mode, when the FB voltage rises
and hits the PFM reference voltage, the device continues switching for several cycles because of the delay time
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of the internal comparator, then it stops switching. The load is supplied by the output capacitor and the output
voltage declines. When the FB voltage falls below the PFM reference voltage, after the delay time of the
comparator, the device starts switching again to ramp up the output voltage.
Output
Voltage
PFM mode at light load
1.01 x VOUT_NOM
VOUT_NOM
PWM mode at heavy load
图7-1. Output Voltage in PWM Mode and PFM Mode
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
The TLV61046A is a boost DC-DC converter integrating a power switch, an input to output isolation switch, and
a rectifier diode. The device supports up to 28-V output with the input voltage ranging from 1.8 V to 5.5 V. The
TLV61046A adopts the current-mode control with adaptive constant off-time. The switching frequency is quasi-
constant at 1.0 MHz. The isolation switch disconnects the output from the input during shutdown to minimize
leakage current.
The following design procedure can be used to select component values for the TLV61046A.
8.2 Typical Application - 12-V Output Boost Converter
spacing
L1
2.7 V ~ 4.2 V
10 µH
C1
1.0 µF
VIN
SW
VOUT
FB
12 V
GND
C2
TLV61046A
ON
4.7 µF
R1
OFF
1.0 Mꢀ
EN
R2
71.5 kꢀ
图8-1. 12-V Boost Converter
表8-1. Design Requirements
8.2.1 Design Requirements
PARAMETERS
VALUES
Input Voltage
Output Voltage
2.7 V ~ 4.2 V
12 V
Output Current
50 mA
Output Voltage Ripple
±50 mV
8.2.2 Detailed Design Procedure
8.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TLV61046A device with the WEBENCH® Power Designer.
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1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
8.2.2.2 Programming the Output Voltage
There are two ways to set the output voltage of the TLV61046A. When the FB pin is connected to the input
voltage, the output voltage is fixed to 12 V. This function makes the TLV61046A only need three external
components to minimize the solution size. The second way is to use an external resistor divider to set the
desired output voltage.
By selecting the external resistor divider R1 and R2, as shown in 方程式 1, the output voltage is programmed to
the desired value. When the output voltage is regulated, the typical voltage at the FB pin is VREF of 795 mV.
≈
∆
«
’
VOUT
VREF
R1=
-1 ìR2
÷
◊
(1)
where
• VOUT is the desired output voltage
• VREF is the internal reference voltage at the FB pin
For best accuracy, R2 should be kept smaller than 80 kΩ to ensure the current flowing through R2 is at least
100 times larger than the FB pin leakage current. Changing R2 towards a lower value increases the immunity
against noise injection. Changing the R2 towards a higher value reduces the quiescent current for achieving
higher efficiency at low load currents.
8.2.2.3 Inductor Selection
Because the selection of the inductor affects steady state operation, transient behavior, and loop stability, the
inductor is the most important component in power regulator design. There are three important inductor
specifications, inductor value, saturation current, and dc resistance (DCR).
The TLV61046A is designed to work with inductor values between 2.2 µH and 22 µH. Follow 方程式 2 to 方程式
4 to calculate the peak current of the inductor for the application. To calculate the peak current in the worst case,
use the minimum input voltage, maximum output voltage, and maximum load current of the application. To have
enough design margin, choose the inductor value with -30% tolerance, and a low power-conversion efficiency for
the calculation.
In a boost regulator, the inductor dc current can be calculated with 方程式2.
VOUT ìIOUT
IL(DC)
=
V ì h
IN
(2)
where
• VOUT is output voltage
• IOUT is output current
• VIN is input voltage
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• ηis power conversion efficiency, use 80% for most applications
The inductor ripple current is calculated with 方程式 3 for an asynchronous boost converter in continuous
conduction mode (CCM).
V
ì V
+ 0.8V - V
(
)
IN
OUT IN
DIL(P-P)
=
L ì fSW ì V
+ 0.8V
OUT
(3)
where
• ΔIL(P-P) is inductor ripple current
• L is inductor value
• f SW is switching frequency
• VOUT is output voltage
• VIN is input voltage
Therefore, the inductor peak current is calculated with 方程式4.
DIL P-P
(
)
IL P = IL DC
+
(
)
(
)
2
(4)
Normally, it is advisable to work with an inductor peak-to-peak current of less than 40% of the average inductor
current for maximum output current. A smaller ripple from a larger valued inductor reduces the magnetic
hysteresis losses in the inductor and EMI. But in the same way, load transient response time is increased.
Because the TLV61046A is for relatively small output current application, the inductor peak-to-peak current can
be as high as 200% of the average current with a small inductor value, which means the TLV61046A always
works in DCM mode. 表8-2 lists the recommended inductors for the TLV61046A.
表8-2. Recommended Inductors for the TLV61046A
PART NUMBER
FDSD0420-H-100M
CDRH3D23/HP
74438336100
L(µH)
10
SATURATION CURRENT (A)
SIZE (LxWxH)
4.2x4.2x2.0
4.0x4.0x2.5
3.2x3.2x2.0
4.0x4.0x1.2
VENDOR(1)
Toko
DCR MAX (mΩ)
200
198
322
132
2.5
1.02
2.35
1.1
10
Sumida
Wurth
10
VLS4012-4R7M
4.7
TDK
(1) See Third-party Products Disclaimer
8.2.2.4 Input and Output Capacitor Selection
The output capacitor is mainly selected to meet the requirements for output ripple and loop stability. This ripple
voltage is related to the capacitance of the capacitor and its equivalent series resistance (ESR). Assuming a
ceramic capacitor with zero ESR, the minimum capacitance needed for a given ripple can be calculated by:
IOUT ìDMAX
fSW ì VRIPPLE
COUT
=
(5)
where
• DMAX is maximum switching duty cycle
• VRIPPLE is peak to peak output voltage ripple
The ESR impact on the output ripple must be considered if tantalum or aluminum electrolytic capacitors are
used.
Care must be taken when evaluating a ceramic capacitor’s derating under dc bias, aging, and ac signal. For
example, the dc bias can significantly reduce capacitance. A ceramic capacitor can lose more than 50% of its
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capacitance at its rated voltage. Therefore, always leave margin on the voltage rating to ensure adequate
capacitance at the required output voltage.
It is recommended to use the output capacitor with effective capacitance in the range of 0.47 μF to 10 μF. The
output capacitor affects loop stability of the boost regulator. If the output capacitor is below the range, the boost
regulator can potentially become unstable. Increasing the output capacitor makes the output voltage ripple
smaller in PWM mode.
For input capacitor, a ceramic capacitor with more than 1.0 µF is enough for most applications.
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8.2.3 Application Performance Curves
SW
10 V / div
SW
10 V / div
VOUT (AC)
10 mV / div
VOUT (AC)
30 mV / div
Inductor
Current
100 mA / div
Inductor
Current
100 mA / div
VIN = 3.6 V, VOUT = 12 V, IOUT = 18 mA
VIN = 3.6 V, VOUT = 12 V, IOUT = 50 mA
图8-3. Switching Waveforms in PWM DCM Mode
图8-2. Switching Waveforms in PWM CCM Mode
SW
10 V / div
EN
1 V / div
VOUT (AC)
50 mV / div
Inductor
Current
100 mA / div
VOUT
3 V / div
Inductor
Current
100 mA / div
VIN = 3.6 V, VOUT = 12 V, IOUT = 3 mA
VIN = 3.6 V, VOUT = 12 V, IOUT = 50 mA
图8-4. Switching Waveforms in Power Save Mode
图8-5. Soft Start-up Waveforms
EN
1 V / div
VOUT (AC)
200 mV / div
VOUT (AC)
3 V / div
Inductor
Current
100 mA / div
Output Current
50 mA / div
VIN = 3.6 V, VOUT = 12 V
VIN = 3.6 V, VOUT = 12 V, IOUT = 50 mA
图8-7. 30-mA to 70-mA Load Transient Response
图8-6. Shutdown Waveforms
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VOUT (AC)
200 mV / div
VIN (3.3 V offset)
500 mV / div
VOUT = 12 V, IOUT = 50 mA
图8-8. Input Voltage from 3.3-V to 4.2-V Line Transient Response
8.3 System Examples
8.3.1 Fixed 12-V Output Voltage with Three External Components
The TLV61046A can output fixed 12-V voltage by connecting the FB pin to the VIN pin to save the external
resistor divider. The 图8-9 shows the application circuit.
L1
1.8 V ~ 5.5 V
10 µH
C1
2.2mF
VIN
FB
SW
VOUT
GND
12 V
C2
ON
10 µF
OFF
EN
图8-9. Fixed 12-V Output Voltage by Connecting the FB Pin to VIN Pin
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9 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 1.8 V to 5.5 V. This input supply
must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk
capacitance can be required in addition to the ceramic bypass capacitors. A typical choice is an electrolytic or
tantalum capacitor with a value of 47 µF. The output current of the input power supply needs to be rated
according to the supply voltage, output voltage, and output current of the TLV61046A.
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10 Layout
10.1 Layout Guidelines
As for all switching power supplies, especially those running at high switching frequency and high currents,
layout is an important design step. If the layout is not carefully done, the regulator could suffer from instability
and noise problems. To maximize efficiency, switch rise and fall time are very fast. To prevent radiation of high
frequency noise (for example, EMI), proper layout of the high-frequency switching path is essential. Minimize the
length and area of all traces connected to the SW pin, and always use a ground plane under the switching
regulator to minimize interplane coupling. The input capacitor needs not only to be close to the VIN pin, but also
to the GND pin in order to reduce input supply ripple.
The most critical current path for all boost converters is from the switching FET, through the rectifier diode, then
the output capacitors, and back to ground of the switching FET. This high current path contains nanosecond rise
and fall time and should be kept as short as possible. Therefore, the output capacitors need not only to be close
to the VOUT pin, but also to the GND pin to reduce the overshoot at the SW pin and VOUT pin.
10.2 Layout Example
A large ground plane on the bottom layer connects the ground pins of the components on the top layer through
vias.
GND
VIN
VOUT
VIN
VOUT
EN
GND
SW
GND
FB
图10-1. PCB Layout Example
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11 Device and Documentation Support
11.1 Device Support
11.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
11.1.2 Development Support
11.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TLV61046A device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
11.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
11.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
WEBENCH® are registered trademarks of Texas Instruments.
所有商标均为其各自所有者的财产。
11.5 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
11.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TLV61046ADBVR
TLV61046ADBVT
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
6
6
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
1C4F
1C4F
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Jan-2021
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Feb-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV61046ADBVR
TLV61046ADBVT
SOT-23
SOT-23
DBV
DBV
6
6
3000
250
180.0
180.0
8.4
8.4
3.2
3.2
3.2
3.2
1.4
1.4
4.0
4.0
8.0
8.0
Q3
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Feb-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLV61046ADBVR
TLV61046ADBVT
SOT-23
SOT-23
DBV
DBV
6
6
3000
250
210.0
210.0
185.0
185.0
35.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
B
1.45 MAX
A
PIN 1
INDEX AREA
1
2
6
5
2X 0.95
1.9
3.05
2.75
4
3
0.50
6X
0.25
C A B
0.15
0.00
0.2
(1.1)
TYP
0.25
GAGE PLANE
0.22
0.08
TYP
8
TYP
0
0.6
0.3
TYP
SEATING PLANE
4214840/C 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
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EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
5
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214840/C 06/2021
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
5
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/C 06/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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