TMAG5111C4AQDBVRQ1 [TI]
TMAG511x-Q1 2D, Dual-Channel, High-Sensitivity, Hall-Effect Latch;
| 型号： | TMAG5111C4AQDBVRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | TMAG511x-Q1 2D, Dual-Channel, High-Sensitivity, Hall-Effect Latch |
| 文件： | 总42页 (文件大小：2566K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMAG5110-Q1, TMAG5111-Q1
SLYS029A – JULY 2021 – REVISED SEPTEMBER 2021
TMAG511x-Q1 2D, Dual-Channel, High-Sensitivity, Hall-Effect Latch
1 Features
3 Description
•
AEC-Q100 qualified with the following results:
– Device temperature grade 1: –40 °C to 125 °C
ambient operating temperature range
– Device HBM ESD classification Level H3A
– Device CDM ESD classification Level C6
2D sensing with planar and vertical hall sensors
Inherent quadrature independent of magnet
alignment or magnet pole pitch
The TMAG5110-Q1 and TMAG5111-Q1 are
2-dimensional, dual Hall-effect latches operating from
a 2.5 V to 38 V power supply. Designed for high-
speed and high-temperature motor applications, these
devices are optimized for applications leveraging
rotating magnets. Integrating two sensors and two
separate signal chains the TMAG511x-Q1 offers
two independent digital outputs giving speed and
direction calculation (TMAG5111-Q1) or giving directly
the digital output of each independent latches
(TMAG5110-Q1). This high level of integration allow
the use of a single TMAG511x-Q1 device instead of
two separate latches.
•
•
•
Two functional options available:
– TMAG5110-Q1: independent 2D outputs
– TMAG5111-Q1: speed and direction outputs
Ultra-high magnetic sensitivity:
– TMAG511xx2-Q1: ±1.4 mT (typical)
– TMAG511xx4-Q1: ±3 mT (typical)
Fast 40-kHz sensing bandwidth
2.5-V to 38-V operating VCC range
Open-drain output (10 mA sink)
Wide ambient operating temperature range:
– –40 °C to +125 °C
Protection features
– Reverse supply protection (up to –20 V)
– Device survives up to 40-V
– Output short-circuit protection
•
The device is offered in a standard 3 mT operating
point, as well as a high-sensitivity 1.4 mT operating
point. The higher magnetic sensitivity provides
flexibility in low-cost magnet selection and mechanical
component placement. The TMAG511x-Q1 is also
available in three 2-axis combination options (X-Y,
Z-X, Z-Y) to allow flexible placement of the sensor
relative to the magnet.
•
•
•
•
•
The device performs consistently across a wide
ambient temperature range of –40 °C to +125 °C.
– Output current limitation
Device Information
PART NUMBER
TMAG5110-Q1
TMAG5111-Q1
PACKAGE(1)
BODY SIZE (NOM)
2 Applications
•
•
Incremental rotary encoding
Linear speed and direction control
– Roof and trunk motor control
– Window and door motor control
Angular position detection
– Knob control (radio and climate control)
– Electronic power steering
– Fluid measurement
SOT-23 (5)
2.9 mm × 1.6 mm
(1) For all available packages, see the package option
addendum at the end of the data sheet.
•
•
Change of
Voltage
Direction
OUT1
Angular speed and direction
TMAG5110
– Electric pumps
– Fans
OUT2
– Wheel and motor speed
Time
Voltage
Change of
Direction
PULSE
DIR
TMAG5111
Time
Device Axis Polarities
Device Outputs
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMAG5110-Q1, TMAG5111-Q1
SLYS029A – JULY 2021 – REVISED SEPTEMBER 2021
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison.........................................................3
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings ....................................... 5
7.2 ESD Ratings .............................................................. 5
7.3 Recommended Operating Conditions ........................5
7.4 Thermal Information ...................................................5
7.5 Electrical Characteristics ............................................6
7.6 Magnetic Characteristics ............................................6
7.7 Typical Characteristics................................................7
8 Detailed Description......................................................21
8.1 Overview...................................................................21
8.2 Functional Block Diagram.........................................21
8.3 Feature Description...................................................21
8.4 Device Functional Modes..........................................30
9 Application and Implementation..................................31
9.1 Application Information............................................. 31
9.2 Typical Applications.................................................. 31
10 Power Supply Recommendations..............................33
11 Layout...........................................................................33
11.1 Layout Guidelines................................................... 33
11.2 Layout Example...................................................... 33
12 Device and Documentation Support..........................34
12.1 Receiving Notification of Documentation Updates..34
12.2 Support Resources................................................. 34
12.3 Trademarks.............................................................34
12.4 Electrostatic Discharge Caution..............................34
12.5 Glossary..................................................................34
13 Mechanical, Packaging, and Orderable
Information.................................................................... 34
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (July 2021) to Revision A (September 2021)
Page
•
•
•
Removed the preview notes from the Device Comparison table........................................................................3
Added operating supply current for the TMAG511xx4-Q1..................................................................................6
Added graphs to the Typical Characteristics section.......................................................................................... 7
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5 Device Comparison
Table 5-1. Device Comparison
SENSITIVITY
(BOP TYP)
AXIS OF
SENSITIVITY
DEVICE
DEVICE OPTION
OUT1
OUT2
A2
A4
B2
B4
C2
C4
A2
A4
B2
B4
C2
C4
1.4 mT
3 mT
XY
ZX
ZY
XY
ZX
ZY
X
Y
1.4 mT
3 mT
TMAG5110-Q1
Z
Z
X
Y
1.4 mT
3 mT
1.4 mT
3 mT
1.4 mT
3 mT
TMAG5111-Q1
Speed
Direction
1.4 mT
3 mT
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6 Pin Configuration and Functions
VCC
GND
NC
1
2
3
5
OUT2
OUT1
4
Not to scale
Figure 6-1. DBV Package 5-Pin SOT-23 Top View
Table 6-1. Pin Functions
PIN
NAME
TYPE
DESCRIPTION
NO.
2.5-V to 38-V power supply. Connect a ceramic capacitor with a value of at least 0.01 µF
between VCC and ground.
1
VCC
Power supply
2
3
GND
NC
Ground
—
Ground reference.
Not internally connected. Connection to the ground pin is recommended.
Open-drain output 1.
For TMAG5110A-Q1: X axis.
For TMAG5110B-Q1: Z axis.
For TMAG5110C-Q1: Z axis.
For TMAG5111-Q1: Speed.
4
5
OUT1
OUT2
Output
Output
Open-drain output 2.
For TMAG5110A-Q1: Y axis.
For TMAG5110B-Q1: X axis.
For TMAG5110C-Q1: Y axis.
For TMAG5111-Q1: Direction.
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC
–20
40
V
Power Supply Voltage
Output Pin Voltage
Voltage ramp rate (VCC < 5V)
Voltage ramp rate (VCC > 5V)
VOUT1, VOUT2
Unlimited
0
V/µs
2
40
GND – 0.5
V
mA
T
Output pin reverse current during reverse supply condition
Magnetic flux density,BMAX
0
100
Unlimited
–40
Junction temperature, TJ
Storage temperature, Tstg
Junction temperature, TJ
150
150
°C
°C
–65
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per AEC Q100-002(1) HBM ESD Classification
Level 2
±2000
V
V(ESD)
Electrostatic discharge
Charged device model (CDM), per AEC Q100-011
CDM ESD Classification Level C4A
± 500
V
(1) AECQ 100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.5
0
MAX
UNIT
V
VCC
VO
Power supply voltage
38
38
Output pin voltage (OUT1, OUT2)
Output pin current sink (OUT1, OUT2)(1)
Ambient temperature
V
ISINK
TA
0
10
mA
°C
–40
125
(1) Power dissipation and thermal limits must be observed
7.4 Thermal Information
TMAG5110
DBV (SOT-23)
5 PINS
166.5
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
RθJC(top)
RθJB
86.0
37.6
°C/W
°C/W
ΨJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
14.1
ΨJB
37.3
RθJC(bot)
—
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
Operating supply current for
TMAG511xx2-Q1
VCC = 2.5 V to 38 V, TA = –40°C to
125°C
ICC
ICC
6
6
8
mA
mA
Operating supply current for
TMAG511xx4-Q1
VCC = 2.5 V to 38 V, TA = –40°C to
125°C
8.5
IRCC
tON
Reverse-battery current
Power-on-time
VCC = –20 V
–100
0
µA
µs
52.5
OUTPUT
VOL
IOH
Low-level output voltage
Output leakage current
Output short-circuit current
Propagation delay time
Output rise time
IOL= 10mA
VCC= 5V
0.5
1
V
0.1
65
µA
mA
ISC
110
tPD
Change in BOP or BRP to change in output
RL= 1kΩ, CL= 50pF
12.5
0.2
tR
µs
tF
Output fall time
RL= 1kΩ, CL= 50pF
0.2
FREQUENCY RESPONSE
fCHOP
fBW
Chopping frequency
Signal bandwidth
320
40
kHz
kHz
7.6 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
TMAG5110x2-Q1
BOP(1), BOP(2)
BRP(1), BRP(2)
BHYS(1), BHYS(2)
BSYM(1), BSYM(2)
BSYM_OP
Magnetic field operating point
Magnetic field release point
Magnetic hysteresis BOP - BRP
Symmetry
0.2
–2.6
0.9
1.4
–1.4
2.75
2.6
VCC = 2.5 V to 38 V, TA = – 40 °C to
125 °C
-0.2
4.6
2
mT
mT
BOP(1) + BRP(1), BOP(2) + BRP(2)
BOP(1) - BOP(2)
–2
Operating point symmetry
Release point symmetry
–1.5
–1.5
1.5
1.5
BSYM_RP
BRP(1) - BRP(2)
TMAG5110x4-Q1
BOP(1), BOP(2)
BRP(1), BRP(2)
BHYS(1), BHYS(2)
BSYM(1), BSYM(2)
BSYM_OP
Magnetic field operating point
Magnetic field release point
Magnetic hysteresis BOP - BRP
Symmetry
0.8
-5.3
3
3
-3
6
5.3
-0.8
9
VCC = 2.5 V to 38 V, TA = – 40 °C to
125 °C
mT
mT
BOP(1) + BRP(1), BOP(2) + BRP(2)
BOP(1) - BOP(2)
–2
2
Operating point symmetry
Release point symmetry
–1.5
–1.5
1.5
1.5
BSYM_RP
BRP(1) - BRP(2)
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7.7 Typical Characteristics
TMAG511xx2-Q1 versions
3
2
1
0
3
2
1
0
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-1. BOP_Z Threshold vs. VCC
Figure 7-2. BOP_Z Threshold vs. Temperature
1
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
0
-1
-2
0
-1
-2
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-3. BRP_Z Threshold vs. VCC
Figure 7-4. BRP_Z Threshold vs. Temperature
4
3
2
1
4
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
3
2
1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-5. Hysteresis_Z vs. VCC
Figure 7-6. Hysteresis_Z vs. Temperature
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7.7 Typical Characteristics (continued)
3
3
2
1
0
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
2
1
0
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-7. BOP_X Threshold vs. VCC
Figure 7-8. BOP_X Threshold vs. Temperature
0
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
-1
-2
-3
0
-1
-2
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-9. BRP_X Threshold vs. VCC
Figure 7-10. BRP_X Threshold vs. Temperature
4
3
2
1
4
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
3
2
1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-11. Hysteresis_X vs. VCC
Figure 7-12. Hysteresis_X vs. Temperature
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7.7 Typical Characteristics (continued)
3
3
2
1
0
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
2
1
0
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-13. BOP_Y Threshold vs. VCC
Figure 7-14. BOP_Y Threshold vs. Temperature
0
0
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
-1
-2
-3
-1
-2
-3
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-15. BRP_Y Threshold vs. VCC
Figure 7-16. BRP_Y Threshold vs. Temperature
5
4
3
2
5
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
4
3
2
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-17. Hysteresis_Y vs. VCC
Figure 7-18. Hysteresis_Y vs. Temperature
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7.7 Typical Characteristics (continued)
2
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
1
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-19. BSYM(Z) vs. VCC
Figure 7-20. BSYM(Z) vs. Temperature
2
1
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-21. BSYM(X) vs. VCC
Figure 7-22. BSYM(X) vs. Temperature
2
1
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-23. BSYM(Y) vs. VCC
Figure 7-24. BSYM(Y) vs. Temperature
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7.7 Typical Characteristics (continued)
2
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
1
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-25. BSYM_OP(ZX) vs. VCC
Figure 7-26. BSYM_OP(ZX) vs. Temperature
2
1
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-27. BSYM_RP(ZX) vs. VCC
Figure 7-28. BSYM_RP(ZX) vs. Temperature
2
1
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-29. BSYM_OP(ZY) vs. VCC
Figure 7-30. BSYM_OP(ZY) vs. Temperature
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7.7 Typical Characteristics
2
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
1
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-31. BSYM_RP(ZY) vs. VCC
Figure 7-32. BSYM_RP(ZY) vs. Temperature
2
1
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-33. BSYM_OP(XY) vs. VCC
Figure 7-34. BSYM_OP(XY) vs. Temperature
2
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
1
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-35. BSYM_RP(XY) vs. VCC
Figure 7-36. BSYM_RP(XY) vs. Temperature
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7.7 Typical Characteristics (continued)
8
8
7
6
5
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 5V
VCC = 12V
VCC = 24V
7
6
5
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-37. Supply Current vs. VCC
Figure 7-38. Supply Current vs. Temperature
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7.7 Typical Characteristics
TMAG511xx4-Q1 versions
5
4
3
2
5
4
3
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
2
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-39. BOP_Z Threshold vs. VCC
Figure 7-40. BOP_Z Threshold vs. Temperature
-1
-1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
-2
-3
-4
-2
-3
-4
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-41. BRP_Z Threshold vs. VCC
Figure 7-42. BRP_Z Threshold vs. Temperature
8
7
6
5
7
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
6
5
4
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-43. Hysteresis_Z vs. VCC
Figure 7-44. Hysteresis_Z vs. Temperature
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7.7 Typical Characteristics (continued)
5
5
4
3
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
4
3
2
2
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-45. BOP_X Threshold vs. VCC
Figure 7-46. BOP_X Threshold vs. Temperature
-2
-3
-4
-5
-1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
-2
-3
-4
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-47. BRP_X Threshold vs. VCC
Figure 7-48. BRP_X Threshold vs. Temperature
8
7
6
5
8
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
7
6
5
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-49. Hysteresis_X vs. VCC
Figure 7-50. Hysteresis_X vs. Temperature
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7.7 Typical Characteristics (continued)
5
5
4
3
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
4
3
2
2
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-51. BOP_Y Threshold vs. VCC
Figure 7-52. BOP_Y Threshold vs. Temperature
-1
-2
-3
-4
-5
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
-4
-3
-2
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-53. BRP_Y Threshold vs. VCC
Figure 7-54. BRP_Y Threshold vs. Temperature
7
6
5
4
8
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
7
6
5
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-55. Hysteresis_Y vs. VCC
Figure 7-56. Hysteresis_Y vs. Temperature
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7.7 Typical Characteristics (continued)
2
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
1
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-57. BSYM(Z) vs. VCC
Figure 7-58. BSYM(Z) vs. Temperature
2
1
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-59. BSYM(X) vs. VCC
Figure 7-60. BSYM(X) vs. Temperature
2
1
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-61. BSYM(Y) vs. VCC
Figure 7-62. BSYM(Y) vs. Temperature
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7.7 Typical Characteristics (continued)
2
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
1
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-63. BSYM_OP(ZX) vs. VCC
Figure 7-64. BSYM_OP(ZX) vs. Temperature
2
1
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-65. BSYM_RP(ZX) vs. VCC
Figure 7-66. BSYM_RP(ZX) vs. Temperature
2
1
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-67. BSYM_OP(ZY) vs. VCC
Figure 7-68. BSYM_OP(ZY) vs. Temperature
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7.7 Typical Characteristics
2
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
1
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-69. BSYM_RP(ZY) vs. VCC
Figure 7-70. BSYM_RP(ZY) vs. Temperature
2
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
1
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-71. BSYM_OP(XY) vs. VCC
Figure 7-72. BSYM_OP(XY) vs. Temperature
2
1
2
1
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
0
0
-1
-1
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-73. BSYM_RP(XY) vs. VCC
Figure 7-74. BSYM_RP(XY) vs. Temperature
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7.7 Typical Characteristics (continued)
8
8
7
6
5
TA = -40°C
TA = 30°C
TA = 125°C
VCC = 2.5V
VCC = 12V
VCC = 24V
7
6
5
2.5
7.5
12.5
Supply Voltage (V)
17.5
22.5
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
Figure 7-75. Supply Current vs. VCC
Figure 7-76. Supply Current vs. Temperature
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8 Detailed Description
8.1 Overview
The TMAG5110-Q1 and TMAG5111-Q1 are dual chopper-stabilized Hall effect sensors with two digital latched
outputs for rotational magnetic sensing applications. The TMAG511x-Q1 device can be powered with a supply
voltage between 2.5 V and 38 V, and survives continuous –20 V reverse-battery conditions. The TMAG511x-Q1
device only operates when a voltage of 2.5 V to 38 V applied to the VCC pin (with respect to the GND pin). In
addition, the device can withstand voltages up to 40 V for transient durations.
Alternating north and south magnetic poles are required to toggle the outputs of each Hall-effect latch.
The device is offered in a standard 3 mT typical operating point, as well as a high-sensitivity 1.4 mT typical
operating point. The higher magnetic sensitivity provides flexibility in low-cost magnet selection and mechanical
component placement. The TMAG511x-Q1 is also available in three 2-axis combination options (X-Y, Z-X, Z-Y)
to support flexible multiple installation orientations relative to the magnet.
8.2 Functional Block Diagram
Threshold
selection
Chopper
stabilization
LDO
OUT 1
OUT 2
VCC
Z
Amp
Amp
∫
∫
GND
Output
control
X
Mux
Y
8.3 Feature Description
8.3.1 2D Description
8.3.1.1 2D General Description and Advantages
The best way to understand the advantage of a 2D dual latch hall sensor is to compare its behavior with
others solutions used in the market. The two most common methods are: dual planar hall latch sensors or
two single hall latch sensors. Those methods are used in applications such as rotary encoding or speed and
direction sensing. The principle is to set two sensors apart at a certain angle such that they will sense the same
magnetic field but with a fixed phase difference. The frequency of the signal will give the speed or incremental
information while the phase will give the direction of rotation. For an easy read, the signals should be as close to
a quadrature signal as possible, meaning there is a 90° phase shift between the two signals. To create those two
signals in quadrature, the two latches must be placed at a distance of ½ pole + n pole from one another.
The TMAG511x-Q1 can be used instead of a dual planar hall latch or two single hall latch sensors. The
TMAG511x-Q1 has two integrated hall latch sensors spaced at a 90° angle from each other, which allows
each sensor to detect a quadrature component of the same magnetic field. For A, B, and C device variants,
the magnetic direction detected will be XY, ZX, and ZY, respectively. Each of those components are placed at
90° from each other by design, therefore the output signals will also be separated with the same angle value.
Wherever the sensor is placed to catch the right two components of the field, the output will be in quadrature
from one another. Figure 8-1 shows the result of two different type of sensors when the devices are placed close
to a ring magnet.
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Figure 8-1. Dual Planar Latch vs. 2D Dual Latch
8.3.1.2 2D Magnetic Sensor Response
The TMAG5110-Q1 has two integrated latches that update their results to the OUT1 and OUT2 pins. Each one
of these outputs will then have a latch functionality. Figure 8-2 shows the response to different magnetic poles
for each output.
The TMAG5111-Q1 outputs are not directly connected to the two integrated latches. Additional processing is
available to generate the speed and direction outputs.
Vout
Vout (H)
BHYS
Vout (L)
B
North
BRP
BOP
South
0 mT
Figure 8-2. Latch Functionality
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Figure 8-3 shows the magnetic response of both the TMAG5110-Q1 and TMAG5111-Q1 to a sinusoidal field.
The sinusoidal curves represents the evaluation of the magnetic seen by both integrated hall sensors.
The TMAG5110-Q1 response shows both outputs reacting to this signal by going low once the field is higher
than BOP and going high when the field is lower than BRP
.
The TMAG5111-Q1 response shows how those two signals are processed to create a speed output and a
direction output.
Figure 8-3. TMAG511x-Q1 Output Behavior
8.3.1.3 Axis Polarities
The Figure 8-4 shows the directions from where each axes are sensitive to a south pole. This also shows that
the opposite directions are sensitive to the north pole.
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Figure 8-4. Axis Polarities
8.3.2 Axis Options
8.3.2.1 Device Placed In-Plane to Magnet
The outer edge of the magnet is the area where the magnetic field is the strongest. Placing the sensor on
the outer edge of the magnet enables the sensor to get the best flexibility in terms of distance and sensitivity
selection. The different figures below show how to use the different versions of the TMAG511x-Q1 in regards to
the magnet and sensor placement.
The options shown in Figure 8-5 and Figure
8-6 composed of the X and Y axises enable
the sensor to be placed in the same plane as
the ring magnet. The sensor can be placed
facing the magnet or on the side of the
magnet. The part can also be turned at 180
degrees along the Z axis.
Figure 8-5. XY Outer Edge 1
Figure 8-6. XY Outer Edge 2
The options shown in Figure 8-7 and Figure
8-8 composed of Z and X axises enable the
sensor to be placed below the magnet, or
facing the magnet with the front side of the
device. The part can also be turned at 180
degrees along the Z axis.
Figure 8-7. ZX Outer Edge 1
Figure 8-8. ZX Outer Edge 2
The options shown in Figure 8-9 and Figure
8-10 composed of Z and Y axises also
enable the sensor to be placed below the
magnet in a different position, as well as
facing the ring magnet with the side of the
device. The part can also be turned at 180
degrees along the Z axis.
Figure 8-9. ZY Outer Edge 1
Figure 8-10. ZY Outer Edge 1
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8.3.2.2 Device Placed on the Side Edge of the Magnet
The side edge of the magnet still provides a magnetic field, but the field is much weaker than the field on the
outer edge. Placing the sensor on the side edge minimizes the flexibility as of how far the device can be placed
from the ring magnet. The 2 mT version enables high sensitivity, allowing the application to work as well as when
the device is placed on the outer edge. Nevertheless this option can be helpful in application where the sensor
has to fit within the magnet diameter.
The options shown in Figure 8-11 and Figure
8-12 composed of X and Y axises enable
the sensor to be placed facing the side edge
of the magnet. The side of the sensor can
also be placed next to the side edge of the
magnet. The part can also be turned at 180
degrees along the Z axis.
Figure 8-11. XY Side Edge 1
Figure 8-13. ZX Side Edge 1
Figure 8-15. ZY Side Edge 1
Figure 8-12. XY Side Edge 2
Figure 8-14. ZX Side Edge 2
Figure 8-16. ZY Side Edge 1
The options shown in Figure 8-13 and Figure
8-14 composed of Z and X axis enable
another way to place the sensor facing the
side edge of the magnet. The top of the
sensor can also be placed facing the side
edge of the magnet. The part can also be
turned at 180 degrees along the Z axis.
The options shown in Figure 8-15 and Figure
8-16 composed of Z and Y axises enable the
placement of the sensor on the side edge of
a magnet with the pins facing the magnet, or
with top of the sensor facing the side edge of
the magnet. The part can also be turned at
180 degrees along the Z axis.
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8.3.3 Power-On Time
Figure 8-17 shows the behavior of the device after the VCC voltage is applied and when the field is below the
BOP threshold. Once the minimum value for VCC is reached, the TMAG5110-Q1 will take time tON to power up
and then time tPD to update the output to a level High.
Figure 8-18 shows the behavior of the device after the VCC voltage is applied and when the field is above the
BOP threshold. Once the minimum value for VCC is reached, the TMAG5110-Q1 will take time tON to power up
and then time tPD to update the output to a level High.
For the TMAG5111-Q1 the power-on behavior is similar but OUT1 will be updated to Low during the tPD time.
OUT2 will be updated to High during the tPD time. The output value following the power-on sequence will then
depend on the magnet placement, the sense of rotation and the device variant.
Supply (V)
Supply (V)
VCC
VCC
2.5V
0V
2.5V
0V
t (s)
t (s)
t (s)
t (s)
t (s)
t (s)
B (mT)
B (mT)
BOP
BRP
BOP
BRP
Output (V)
Output (V)
VCC
VCC
0V
0V
tON
tPD
tON
tPD
Figure 8-17. Power-On Time When B<BOP
Supply (V)
VCC
2.5V
0V
t (s)
B (mT)
BOP
BRP
t (s)
Output (V)
VCC
0V
t (s)
tON
tPD
Figure 8-18. Power-On Time When B>BOP
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8.3.4 Propagation Delay
The TMAG511x-Q1 samples the Hall element at a nominal sampling interval of tPD to detect the presence of a
magnetic south pole. Between each sampling interval, the device calculates the average magnetic field applied
to the device. As defined in Figure 8-20, if this average value crosses the BOP or BRP threshold, the device
changes the corresponding level. Because the system, Hall sensor + magnet is by nature asynchronous, the
propagation delay td will vary depending on when the magnetic field goes above the BOP value. As shown in
Figure 8-19 the output delay will then depend on when the magnetic field will get higher than the BOP value. The
first graph shows the typical case.
The magnetic field goes above the BOP value at the moment where the output is updated. The part will then only
need one cycle of tPD to update the output. The second graph shows a magnetic field going above the BOP value
just right before half of the sampling period. This is the best case possible where the output will be updated in
just half of the sampling period. Finally, the third graph shows the worst possible case where the magnetic field
goes above the BOP value just after half of the sampling period. At the next output update, the value will still see
a value under the threshold and will need a whole new period to update the output
Magnetic Field
B7
Magnetic Field
B7
Magnetic Field
B7
B6
B6
B6
B5
B5
B5
BOP
B4
BOP
B4
BOP
B4
B3
B2
B1
B3
B2
B1
B3
B2
B1
t1
t2
t3
t4
t5
t6
t7
t8
t1
t2
t3
t4
t5
t6
t7
t8
t1
t2
t3
t4
t5
t6
t7
t8
Time
Time
Time
Output
Output
Output
VCC
VCC
VCC
tPDMin
tPDTyp
tPDMax
0V
0V
0V
Time
Time
Time
Figure 8-19. Field Sampling Timing
Figure 8-20 shows TMAG511x-Q1 propagation delay analysis when a magnetic south pole is applied. The Hall
element of the TMAG511x-Q1 experiences an increasing magnetic field as a magnetic south pole approaches
near the device as well as a decreasing magnetic field as a magnetic south pole leaves away. At time t1 the
magnetic field goes above the BOP threshold. The output will then start to move after the time tPD. As shown in
Figure 8-20, this time will vary depending on when the sampling period is. At t2 the output start pulling to the low
voltage value. At t3 the output is completely pulled down to the lower voltage value. The same process happen
on the other way when the magnetic value is going under the BOP threshold.
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Magnetic Field
BOP
BRP
Time
Output
VCC
0V
t1
t2 t3
t4
t5 t6
Time
tPD
tPD
tF
tR
Figure 8-20. Propagation Delay
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8.3.5 Hall Element Location
The sensing element inside the device is in the center when viewed from the top. Figure 8-21 shows the exact
position of the sensors in regard of the package.
62µm
62µm
142 µm
45µm
44µm
50µm
Z axis
Y axis
X axis
Die
0.509mm
Figure 8-21. Hall Element Location
8.3.6 Power Derating
The device is specified from –40 °C to 125 °C for a voltage rating of 2.5 V to 38 V. Because the part is
draining at its maximum a current of 17 mA the maximum voltage that can be applied will depend on what is
the maximum ambient temperature acceptable for the application. The curve in Figure 8-22 shows the maximum
acceptable power supply voltage versus the maximum acceptable ambient temperature.
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The Figure 8-22 can also be calculated using the following formulas:
TJ = TA + DT
(1)
where
•
•
•
TJ is the junction temperature
TA is the ambient temperature
ΔT is the difference between the junction temperature and the ambient temperature
DT = PD ìRqJA
(2)
(3)
where
•
•
PD is the power dissipated by the part
RθJA is the junction to ambient thermal resistance
PD = VCCìICC
where
•
•
VCC is the voltage supply of the device
ICC is the current consumption of the device
Combining the three equations above gives Equation 4 below:
TJ max - TA
ICC max ìRqJA
VCC max
=
(4)
This equation gives the maximum voltage the part can handle in regards of the ambient temperature.
For example, with an the application required to work within a ambient temperature of maximum 85 °C, and
TJmax, RθJA and ICCmax are defined in the data sheet, the maximum voltage allowed for this application is
determined in Equation 5:
170èC -140èC
6.5 mA ì166.5èC / W
VCC max
=
= 27.72 V
40
35
30
25
20
15
10
5
VCC Max
40
0
20
60
80
100
120
140
Ambient Temperature (èC)
D002
Figure 8-22. Power Derating Curve
8.4 Device Functional Modes
The TMAG511x-Q1 device has one mode of operation that applies when the Recommended Operating
Conditions are met.
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The TMAG511x-Q1 is designed for rotary applications for DC motor sensors or incremental rotary encoding.
For reliable functionality, the magnet must apply a flux density at the sensor greater than the corresponding
maximum BOP or BRP numbers specified in the Magnetic Characteristics table. Add additional margin to account
for mechanical tolerance, temperature effects, and magnet variation. Magnets generally produce weaker fields
as temperature increases.
9.2 Typical Applications
9.2.1 Incremental Rotary Encoding Application
VCC
TMAG
511x
GPIOs
Microcontroller
Motor
Driver
GPIOs
Motor
GND
Figure 9-1. Incremental Encoding
9.2.1.1 Design Requirements
Table 9-1 lists the use the parameters for this design.
Table 9-1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Motor speed
22.5 kRPM
8
Number of magnet poles
9.7 mm diameter × 2 mm
thick
Dimensions
Magnetic material
Ceramic 8D
2.5 mm
Air gap above the Hall sensors
Radial magnetic flux density peak
Tangential magnetic flux density peak
±12.5 mT
±9.5 mT
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9.2.1.2 Detailed Design Procedure
Incremental encoders are used on knobs, wheels, motors, and flow meters to measure relative rotary movement.
By attaching a ring magnet to the rotating component and placing the TMAG511x-Q1 nearby, the sensor will
generate voltage pulses as the magnet turns. The TMAG511x-Q1 integrates two sensors and two signal chains.
This means each channel can go up to the maximum speed independently from each other.
When the magnet rotates, the TMAG5110-Q1 will generate alternate pulses on each output. One input will be
the result of what is sensed from one specific axis, while the other output will sense from another specific axis.
In Table 9-1, this is also referred as Radial and Tangential magnetic flux. Those two signals are the result of two
different components of the same magnetic field resulting in the two signals being 90° from one another. Also
called quadrature output, this type of signal is ideal to measure a rotational count as well as a change in direction
of the ring magnet.
The TMAG5111-Q1 directly generates the speed and direction outputs. This eliminates the need for external
processing.
The maximum rotational speed that can be measured is limited by the sensor bandwidth and the magnetic
strength of the magnet.
Generally, the bandwidth must be faster than two times the number of poles per second. In this design example,
the maximum speed is 22500 RPM, which involves a rotation of 3000 poles per second when using an 8-pole
magnet. The TMAG511x-Q1 sensing bandwidth is typically 40 kHz, which is more than thirteen times the pole
frequency.
The strength of the magnet also has an impact on how fast the magnet can turn. A weaker magnet with a
maximum strength very close to the threshold value will limit the maximum speed by limiting the amount of time
where this field will be higher than the BOP. The time spent above the BOP value will be longer for a magnet with
stronger field.
When the magnet strength is significantly higher than BOP, Equation 5 can be used to calculate the allowed
speed.
Bandwidth (Hz)ì 60
Speed (RPM) Ç
Number of poles
(5)
9.2.1.3 Application Curve
Change of
Voltage
Direction
OUT1
TMAG5110
OUT2
Time
Figure 9-2. TMAG5110-Q1 Output Response
Voltage
Change of
Direction
PULSE
DIR
TMAG5111
Time
Figure 9-3. TMAG5111-Q1 Output Response
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10 Power Supply Recommendations
The TMAG511x-Q1 is powered by 2.5-V to 38-V DC power supplies. A decoupling capacitor placed close to the
device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor
with a value of at least 0.01 µF.
11 Layout
11.1 Layout Guidelines
Magnetic fields pass through most non-ferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed-circuit boards (PCBs), which makes placing the magnet on
the opposite side of the PCB possible.
11.2 Layout Example
VCC
VCC OUT1
GND
GND
GND
NC
OUT2
Figure 11-1. Layout Example
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Nov-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMAG5110A2AQDBVRQ1
TMAG5110A4AQDBVRQ1
TMAG5110B2AQDBVRQ1
TMAG5110B4AQDBVRQ1
TMAG5110C2AQDBVRQ1
TMAG5110C4AQDBVRQ1
TMAG5111A2AQDBVRQ1
TMAG5111A4AQDBVRQ1
TMAG5111B2AQDBVRQ1
TMAG5111B4AQDBVRQ1
TMAG5111C2AQDBVRQ1
TMAG5111C4AQDBVRQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
SN
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Nov-2021
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMAG5110-Q1, TMAG5111-Q1 :
Catalog : TMAG5110, TMAG5111
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Nov-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMAG5110A2AQDBVRQ1 SOT-23
TMAG5110A4AQDBVRQ1 SOT-23
TMAG5110B2AQDBVRQ1 SOT-23
TMAG5110B4AQDBVRQ1 SOT-23
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
3000
3000
3000
3000
3000
178.0
178.0
178.0
178.0
178.0
9.0
9.0
9.0
9.0
9.0
3.3
3.3
3.3
3.3
3.3
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
TMAG5110C2AQDBVRQ SOT-23
1
TMAG5110C4AQDBVRQ SOT-23
1
DBV
5
3000
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
TMAG5111A2AQDBVRQ1 SOT-23
TMAG5111A4AQDBVRQ1 SOT-23
TMAG5111B2AQDBVRQ1 SOT-23
TMAG5111B4AQDBVRQ1 SOT-23
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
3000
3000
3000
3000
3000
178.0
178.0
178.0
178.0
178.0
9.0
9.0
9.0
9.0
9.0
3.3
3.3
3.3
3.3
3.3
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
TMAG5111C2AQDBVRQ SOT-23
1
TMAG5111C4AQDBVRQ SOT-23
1
DBV
5
3000
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Nov-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMAG5110A2AQDBVRQ1
TMAG5110A4AQDBVRQ1
TMAG5110B2AQDBVRQ1
TMAG5110B4AQDBVRQ1
TMAG5110C2AQDBVRQ1
TMAG5110C4AQDBVRQ1
TMAG5111A2AQDBVRQ1
TMAG5111A4AQDBVRQ1
TMAG5111B2AQDBVRQ1
TMAG5111B4AQDBVRQ1
TMAG5111C2AQDBVRQ1
TMAG5111C4AQDBVRQ1
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
190.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
2X 0.95
1.9
3.05
2.75
1.9
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/F 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/F 06/2021
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/F 06/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated
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TMAG5123B1CQDBZT
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