TMAG5131-Q1 [TI]
汽车级低功耗（10Hz，1.3µA）低电压（最高 5.5V）霍尔效应开关;
| 型号： | TMAG5131-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 汽车级低功耗（10Hz，1.3µA）低电压（最高 5.5V）霍尔效应开关 开关 |
| 文件： | 总32页 (文件大小：1770K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMAG5131-Q1
ZHCSQO5 –APRIL 2023
TMAG5131-Q1 汽车类、低功耗、高精度、霍尔效应开关
1 特性
3 说明
• 业内超低功耗：
TMAG5131-Q1 是一款超低功耗、低电压、高精度霍
尔效应传感器，专为紧凑型和电池关键型汽车应用而设
计。该器件提供多种磁性阈值、采样率和输出类型，适
用于各种应用。
– 20Hz 版本：2µA（3V 时）
• 工作VCC 范围：1.65V 至5.5V
• 高精度磁性阈值选项（典型BOP）：
– 3mT（1.5mT 磁滞）
• 全极磁响应
• 推挽或开漏输出选项
• 业界通用SOT-23 (DBZ) 封装
• 工作温度范围：–40°C 至+125°C
当施加的磁通量密度超过工作点 (BOP) 阈值时，器件会
输出低电压。输出会保持低电平，直到磁通密度降至低
于释放点 (BRP)，随后器件输出高电压。全极磁响应可
以使输出对南北磁场都很敏感。
TMAG5131-Q1 在内部进行下电上电，从而以超低的
电流消耗运行。20Hz 版本在 3V 时的电流消耗为
2μA。
2 应用
• 车门把手和电子门锁
• 换挡杆
TMAG5131-Q1 采用业界通用的封装和引脚排列
SOT-23。
• 遮阳板、化妆镜或手套箱
• LCD 屏幕、盖板或后备箱的开合传感器
• 雨刮器初始位置或结束位置传感器
• 制动踏板或后灯执行器
• 天窗或尾门
该器件可在 1.65V 至5.5V 的VCC 范围以及 –40°C 至
125°C 的更大工作温度范围内运行。
封装信息(1)(2)
• 翘板开关
• 电池关键型位置感应
封装尺寸（标称值）
器件型号
封装
TMAG5131-Q1
DBZ（SOT-23，3） 2.92mm × 1.30mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
(2) 请参阅器件比较表。
VCC
R1
VCC
Low-Power
Oscillator
Low-Power
Oscillator
LDO
VCC
LDO
VCC
OUT
OUT
Output
control
Output
control
X
X
Amp
Amp
Chopper
stabilizaꢀon
Chopper
stabilizaꢀon
GND
GND
Block Diagram (Push-pull)
Block Diagram (Open-drain)
方框图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLYS050
TMAG5131-Q1
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Table of Contents
8.4 Device Functional Modes..........................................11
9 Application and Implementation..................................12
9.1 Application Information............................................. 12
9.2 Typical Applications.................................................. 14
10 Power Supply Recommendations..............................20
11 Layout...........................................................................20
11.1 Layout Guidelines................................................... 20
11.2 Layout Example...................................................... 20
12 Device and Documentation Support..........................21
12.1 接收文档更新通知................................................... 21
12.2 支持资源..................................................................21
12.3 Trademarks.............................................................21
12.4 静电放电警告.......................................................... 21
12.5 术语表..................................................................... 21
13 Mechanical and Packaging Information....................21
13.1 Tape and Reel Information......................................22
13.2 Mechanical Data..................................................... 24
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device Comparison.........................................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 ESD Ratings............................................................... 4
7.3 Recommended Operating Conditions.........................4
7.4 Thermal Information....................................................4
7.5 Electrical Characteristics.............................................5
7.6 Magnetic Characteristics.............................................5
7.7 Typical Characteristics................................................6
8 Detailed Description........................................................7
8.1 Overview.....................................................................7
8.2 Functional Block Diagram...........................................7
8.3 Feature Description.....................................................7
4 Revision History
DATE
REVISION
NOTES
April 2023
*
Initial Release
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5 Device Comparison
表5-1. Device Comparison
TYPICAL
VERSION
TYPICAL
MAGNETIC
OUTPUT
TYPE
SENSOR
ORIENTATION
SAMPLING
PACKAGES
AVAILABLE
THRESHOLD HYSTERESIS RESPONSE
RATE
Omnipolar
Active Low
TMAG5131C1D
TMAG5131C7D
3 mT
3 mT
1.5 mT
1.5 mT
Push-pull
Z
Z
20 Hz
SOT-23
SOT-23
Omnipolar
Active Low
Open-drain
20 Hz
6 Pin Configuration and Functions
VCC
1
3
GND
OUT
2
图6-1. DBZ Package, 3-Pin SOT-23 (Top View)
表6-1. Pin Functions
PIN
TYPE(1)
DESCRIPTION
NAME
GND
OUT
VCC
NO.
3
Ground reference
Omnipolar/Unipolar output that responds to north and/or south magnetic poles
—
2
O
1
1.65 V to 5.5 V power supply. TI recommends connecting this pin to a ceramic capacitor to
ground with a value of at least 0.1 µF.
—
(1) O = output
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
MAX
5.5
UNIT
Power Supply Voltage
Output Pin Voltage
VCC
V
OUT
OUT
VCC + 0.3
5
GND –0.3
–5
Output Pin current
mA
T
Magnetic Flux Density, BMAX
Junction temperature, TJ
Storage temperature, Tstg
Unlimited
Junction temperature, TJ
150
150
°C
°C
–65
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum
Ratings do not imply functional operation of the device at these or any other conditions beyond those listed
under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within
the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability,
functionality, performance, and shorten the device lifetime.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, all pins((1))
±5500
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per ANSI/ESDA/
JEDEC JS-002, all pins((2))
± 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V
VCC
Vo
Io
Power supply voltage
Output voltage
1.65
0
5.5
5.5
5
V
Output current
mA
°C
–5
–40
TA
Ambient temperature
125
7.4 Thermal Information
TMAG5131-Q1
SOT-23 (DBZ)
3 PINS
227.4
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
RθJC(top)
RθJB
122.7
61.2
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
21.3
ΨJT
60.8
ΨJB
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OPEN-DRAIN OUTPUT
High impedance output leakage
current
IOZ
VCC = 5.5 V, OUT = 5.5 V
IOUT = 1mA
5
100
0.3
nA
V
VOL
Low-level output voltage
0.1
PUSH-PULL OUTPUT DRIVER
VOH
VOL
High-level output voltage
Low-level output voltage
IOUT = -0.5 mA
IOUT = 0.5 mA
Vcc-0.35 Vcc-0.1
0.1
V
V
0.3
TMAG5131xxD
fs
ts
Frequency of magnetic sampling
Period of magnetic sampling
13
35
20
50
2
29
77
3
Hz
ms
µA
ICC(AVG) Average current consumption
Vcc = 3 V over temperature
ALL VERSIONS
ICC(PK)
ICC(SLP)
tON
Peak current consumption
Sleep current consumption
Power-on time
0.8
1.25
0.8
140
60
2
1.4
425
75
mA
µA
65
45
µs
tACTIVE
Active time period
7.6 Magnetic Characteristics
for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TMAG5131Cxx
BOP
BRP
Magnetic threshold operate point
Magnetic release operate point
Magnetic hysteresis
±2
±0.5
±1
±3
±1.5
±1.5
±4
±2.5
±2
mT
mT
mT
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
BHYS
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7.7 Typical Characteristics
5
5
4
BOPS
BOPN
BRPS
BRPN
BOPS
BOPN
BRPS
BRPN
3
1
3
2
1
0
-1
-2
-3
-4
-5
-1
-3
-5
1.65
2.65
3.65
4.65
5.5
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
Supply Voltage (V)
TA = 25°C
VCC = 3 V
图7-2. 3.0 mT Threshold vs. Supply Voltage
图7-1. 3.0 mT Threshold vs. Temperature
4
4
VCC = 1.65 V
VCC = 3 V
VCC = 5.5 V
VCC = 1.65 V
VCC = 3 V
VCC = 5.5 V
3
2
1
0
3
2
1
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
Temperature (C)
Magnetic Threshold = 1.8 mT
Sampling Rate = 10 Hz
Magnetic Threshold = 3.0 mT
Sampling Rate = 20 Hz
图7-3. ICC vs. Temperature
图7-4. ICC vs. Temperature
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8 Detailed Description
8.1 Overview
The TMAG5131-Q1 device is a magnetic sensor with a digital output that indicates when the magnetic flux
density threshold has been crossed. The output consists of a push-pull turning low when a field is present or
turning high when no field is present. As an omnipolar switch the output is sensitive to both the South and the
North Pole. The device integrates a Hall Effect element, analog signal conditioning, and a low-frequency
oscillator that enables ultra-low average power consumption. To achieve low-power consumption the device
periodically measures magnetic flux density, updates the output, and enters into a low-power sleep state. With a
supply range of 1.65 V to 5.5 V, this device is designed for battery-operated low power automotive applications.
Finally, its wide temperature range of -40°C to 125°C makes this device suited for wide range of applications.
8.2 Functional Block Diagram
VCC
R1
VCC
Low-Power
Oscillator
Low-Power
Oscillator
LDO
LDO
VCC
VCC
OUT
OUT
Output
control
Output
control
X
X
Amp
Amp
Chopper
stabilizaꢀon
Chopper
stabilizaꢀon
GND
GND
Block Diagram (Push-pull)
Block Diagram (Open-drain)
8.3 Feature Description
8.3.1 Magnetic Flux Direction
图8-1 shows that the TMAG5131-Q1 device is sensitive to the magnetic field component that is perpendicular to
the top of the package.
B
SOT-23
PCB
图8-1. Direction of Sensitivity
Magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet. This
condition exists when a south magnetic pole is near the top of the package. Magnetic flux that travels from the
top to the bottom of the package results in negative millitesla values.
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positive B
negative B
N
S
S
N
PCB
PCB
图8-2. Flux Direction Polarity
8.3.2 Magnetic Response
The TMAG5131-Q1 is an omnipolar switch. 图8-3 shows the output responds to both north and south poles.
OUT
BHYS
BHYS
VCC
0V
0 mT
B
BOP BRP
BRP BOP
north
south
图8-3. Omnipolar Functionality
8.3.3 Output Type
The TMAG5131-Q1 has a push-pull CMOS output and the C7D variant has an open-drain output that can drive
the output voltage near VCC or ground level. The C5D, G1D, H1D, and C1D device versions have push-pull
CMOS outputs that can drive a VCC or ground level. The C7D device variant has open-drain outputs that can
become high impedance or drive ground. For this version, an external pullup resistor must be used.
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VCC
Output
Output
Control
图8-4. Push-Pull Output (Simplified)
VCC
Output
Control
Output
图8-5. Open-Drain Output (Simplified)
8.3.4 Sampling Rate
When the TMAG5131-Q1 powers up, the device measures the first magnetic sample and sets the output within
the tON time. The output is latched, and the device enters an ultra low power sleep state. After each tS time has
passed, the device measures a new sample and updates the output if necessary. If the magnetic field does not
change between periods, the output also does not change.
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VCC
1.65 V
tON
time
tACTIVE
tS
tS
ICC
ICC(PK)
time
Output
VCC
2nd sample
3rd sample
Invalid
1st sample
GND
time
图8-6. Timing Diagram
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8.3.5 Hall Element Location
The sensing element inside the device is in the center of both packages when viewed from the top. 图8-7 shows
the tolerances and side-view dimensions.
SOT-23
Top View
SOT-23
Side View
centered
650 µm
70 µm
80 µm
图8-7. Hall Element Location
8.4 Device Functional Modes
The TMAG5131-Q1 device has one mode of operation that applies when the Recommended Operating
Conditions are met.
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9 Application and Implementation
备注
以下应用部分中的信息不属于 TI 元件规格，TI 不担保其准确性和完整性。TI 的客户负责确定元件是否
适合其用途，以及验证和测试其设计实现以确认系统功能。
9.1 Application Information
The TMAG5131-Q1 device is typically used to detect the proximity of a magnet. The magnet is often attached to
a movable component in the system.
9.1.1 Defining the Design Implementation
The first step of the design is identifying the general design implementation. Define whether the magnet that
needs to be detected is sliding past the sensor, or moving head-on toward the sensor, or swinging toward the
sensor on a hinge. 图9-1 shows examples for each of the aforementioned design implementations.
图9-1. Design Implementations
With each implementation, the objective is to design the system such that the spatial coordinates of the transition
region fall within the spatial coordinates associated with the BOP maximum and BRP minimum specifications. 图
9-2 shows a head-on example that shows how the location corresponding to the device BOPMAX and BRPMIN fall
within the desired transition region. To facilitate rapid design iteration, TI’s Magnetic Sensing Proximity Tool is
leveraged in the following design examples.
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图9-2. Head-On Example
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9.2 Typical Applications
9.2.1 Hinge
XZ-Plane Displacement Dimensions
*Dimensions not to scale
XY-Plane Displacement Dimensions
*Dimensions not to scale
*Magnet offsets when magnet oriented at 0°
图9-3. Typical Application Diagram
9.2.1.1 Design Requirements
表9-1 lists the design parameters for this example.
表9-1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
3.3 V
VCC
Switch Region
5° to 15°
Max Magnet
6.35 mm (¼ inch)
25.4 mm (1 inches)
304.8 mm (12 inches)
228.6 mm (9 inches)
6 mm (0.23622 inch)
Max Magnet Width or Length
Fixture Width
Fixture Length
Sensor Distance From Hing Origin
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表9-1. Design Parameters (continued)
DESIGN PARAMETER
EXAMPLE VALUE
Center Of Magnet Offset From Hinge Origin
≥(6 mm –Magnet Height/2)
9.2.1.2 Detailed Design Procedure
Due to the complex non-linear behavior magnets and the number of variables that can influence it, some
experimentation is required to solve for a design that will work. This application uses a simple axial, dipole, block
magnet. Other shapes might be considered for different field strengths or prices. A neodymium type of magnet
(N52) is used. At the time of this writing, N52 can be commonly found with heights of 1/16", 1/8", 3/16", and 1/4".
As price often increases with size, the first design attempt will be with a 1/16" thick magnet, which has a width
and length equal to 0.25". Based on the sensor distance from hinge origin and fixture dimension constraints,
there is a lot of flexibility on where the sensor can be placed. Due to other hardware within the fixture, the
TMAG5131C1DQDBZ sensor is placed 203.2 mm (8") from the origin. From there, the user can assess a design
with the following displacement dimensions.
图 9-4 shows that the b-field magnitude for the TMAG5131C1DQDBZ is not adequate for the spatial constraints
of 5° and 15°, as the Bz magnitude only surpasses the BRP minimum. There are a few options on how to
proceed. As the BOP(Max) does not fall within our range, the user must increase field strength. This can be
accomplished with a thicker magnet or by adjusting sensor and magnet z-offsets. The magnet cannot get any
closer due to enclosure constraints, therefore the only option allowed is to increase the magnet thickness. After a
few more iterations with the tool, a 0.25" × 0.25" × 0.25" magnet can work (see 图9-5 and 图9-6).
9.2.1.3 Application Curves
图9-4. B-Field Hypothesis One
图9-5. B-Field Hypothesis Two
图9-6. Thresholds
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9.2.2 Head-On
XZ-Plane Displacement Dimensions
*Dimensions not to scale
XY-Plane Displacement Dimensions
*Dimensions not to scale
图9-7. Typical Application Diagram
9.2.2.1 Design Requirements
表9-1 lists the design parameters for this example.
表9-2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
VCC
3.3 V
Between 10 mm and 30 mm from
sensor fixture surface
Switch Region
Sensor Distance From Equipment Outer Surface
2 mm (0.0787 inch)
25.4 mm (<1 inch)
25.4 mm (<1 inch)
6.35 mm (<1/4 inch)
N42
Magnet Length
Magnet Width
Magnet Height
Magnet Type
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9.2.2.2 Detailed Design Procedure
In this particular case, there are several N42 magnets available from other prior projects. As the desired
transition region is where the magnet surface is at least 12 mm (10 mm + 2 mm) away from the sensor, we try an
initial design with one of our larger magnets (3/8" × 3/16" × 3/16"). 图 9-8 shows the respective curve for this
magnet along the movement along with the magnetic thresholds of the TMAG5131C1DQDBZ.
While the Bz magnitude adequately exceeds the BOPMAX, it does not quite reach the BRPMIN. Therefore, the user
must make some adjustments so that Bz falls below BRPMIN within the desired operating range. To reduce Bz,
there are a few options. The user can offset the magnet or choose a smaller magnet. After iterating through
increasing x-offsets and y-offsets as well as decreasing magnet thicknesses, the user can eventually find a
solution that works. In this case, a 3/8" × 3/16" × 1/16" N42 magnet with no x or y offset from the sensor center is
used. 图9-9 and 图9-10 shows the curves corresponding to the final magnet parameters.
9.2.2.3 Application Curve
图9-8. B-Field Hypothesis One
图9-9. B-Field Hypothesis Two
图9-10. Thresholds
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9.2.3 Slide-By
XZ-Plane Displacement Dimensions
*Dimensions not to scale
XY-Plane Displacement Dimensions
*Dimensions not to scale
*Y-offset when magnet x displacement = 0
图9-11. Typical Application Diagram
9.2.3.1 Design Requirements
表9-1 lists the design parameters for this example.
表9-3. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
3.3 V
VCC
Magnet Range Of Motion
Sensor Distance From Equipment Outer Surface
Magnet Length
11 mm (<0.433 inch)
6 mm (>0.236 inch)
12.7 mm (<1/2 inch)
12.7 mm (<1/2 inch)
3.175 mm (<1/8 inch)
N42
Magnet Width
Magnet Height
Magnet Type
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9.2.3.2 Detailed Design Procedure
For this particular case involving the TMAG5131C1DQDBZ, the user can arbitrarily start with a 1/8" × 1/8" ×
1/16" magnet, a z-offset of 7 mm (>6 mm), and an initial displacement of one half of the magnet length (1/8"/2 =
1/16") and serendipitously get something that works (see 图 9-12 and 图 9-13). Had the B-field not exceeded
BOPMAX, the user could try moving the magnet closer on the z-axis, made the magnet larger, or changed the
magnet to one with higher permeability. Alternatively, if the b-field was too large, the magnet can be moved
further away in each axis or a smaller magnet can be used.
9.2.3.3 Application Curve
图9-13. Thresholds
图9-12. B-Field Hypothesis
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10 Power Supply Recommendations
The TMAG5131-Q1 device is powered from 1.65-V to 5.5-V DC power supplies. A decoupling capacitor close to
the device must be used to provide local energy with minimal inductance. TI recommends using a ceramic
capacitor with a value of at least 0.1 µF.
11 Layout
11.1 Layout Guidelines
Magnetic fields pass through most non-ferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed circuit boards (PCBs), which makes the placement of the
magnet on the opposite side possible.
11.2 Layout Example
VCC
GND
OUT
图11-1. SOT-23 Layout Example
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12 Device and Documentation Support
12.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
12.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
12.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
12.4 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
12.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
13 Mechanical and Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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13.1 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
TMAG5131QC1DBZR
TMAG5131QC7DBZR
SOT-23
SOT-23
DBZ
DBZ
3
3
3000
3000
180.0
180.0
8.4
8.4
3.15
3.15
2.77
2.77
1.22
1.22
4.0
4.0
8.0
8.0
Q3
Q3
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
SPQ
3000
3000
Length (mm) Width (mm)
Height (mm)
18.0
TMAG5131QC1DBZR
TMAG5131QC7DBZR
SOT-23
SOT-23
DBZ
DBZ
3
3
180.0
183.0
180.0
183.0
20.0
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13.2 Mechanical Data
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
3.04
2.80
1.9
3
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
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EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
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EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PMAG5131C1DQDBZRQ1
PMAG5131C7DQDBZRQ1
ACTIVE
ACTIVE
SOT-23
SOT-23
DBZ
DBZ
3
3
3000
3000
TBD
TBD
Call TI
Call TI
Call TI
-40 to 125
-40 to 125
Samples
Samples
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2023
Addendum-Page 2
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
(0.125)
3.04
2.80
1.9
3
(0.15)
NOTE 4
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/D 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/D 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/D 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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