TMP451HQDQWTQ1 [TI]
具有 N 因数、滤波功能和串联电阻校正的汽车类 1.7V 远程和本地温度传感器 | DQW | 8 | -40 to 125;
| 型号： | TMP451HQDQWTQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 N 因数、滤波功能和串联电阻校正的汽车类 1.7V 远程和本地温度传感器 | DQW | 8 | -40 to 125 温度传感 传感器 温度传感器 |
| 文件： | 总40页 (文件大小：1749K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMP451-Q1
ZHCSCV4C –OCTOBER 2014 –REVISED APRIL 2021
具有η 因子、失调电压校正、串联电阻抵消和可编程数字滤波器的TMP451-
Q1 ±1°C 远程和本地温度传感器
1 特性
3 说明
• 符合汽车应用要求
• 具有符合AEC-Q100 标准的下列特性：
TMP451-Q1 器件是一款高精度、低功耗远程温度传感
器监视器，内置一个本地温度传感器。这类远程温度传
感器通常采用低成本离散式 NPN 或 PNP 晶体管，或
者基板热晶体管或二极管，这些器件都是微处理器、微
控制器或 FPGA 的组成部件。对于本地和远程传感
器，此温度表示方式为 12 位数字编码，分辨率为
0.0625°C。对于本地和远程温度传感器，在典型运行
范围内，温度精度为 ±1°C（最大值）。此两线制串口
接受SMBus 通信协议。
– 器件温度等级1：-40°C 至125°C 环境工作温度
范围
• 本地和远程二极管传感器精度为±1°C
• 本地和远程通道的分辨率为0.0625°C
• 1.7V 至3.6V 电源和逻辑电压范围
• 27µA 运行电流，3µA 关断电流
• 串联电阻抵消
• η因子和偏移校正
诸如串联电阻抵消、可编程非线性因子（η 因子）、
可编程偏移、可编程温度限制和一个可编程数字滤波器
等的高级特性被组合在一起，实现了一个具有更佳准确
度和抗扰度的稳健耐用热度监控解决方案。
• 可编程数字滤波器
• 二极管故障检测
• 双线和SMBus™ 串行接口
• 8 引脚WSON (WDFN) 封装
TMP451-Q1 器件是在各种汽车子系统中进行多位置高
精度温度测量的理想选择。TMP451-Q1 采用可润湿侧
翼 WSON 封装，可提供针对可焊性的视觉指示器以缩
短自动视觉检测 (AVI) 时间。此器件的额定运行电源电
压范围为 1.7V 至 3.6V，额定工作温度范围为 -40°C
至125°C。
– 具有可润湿侧翼的2.50mm × 2.50mm 封装
(DQW)
– 2.00mm × 2.00mm (DQF)
2 应用
• 汽车信息娱乐系统
• 电子控制单元(ECU) 处理器温度监视
• 电子控制单元(TCM) 处理器温度监视
• 电子控制单元(BCM) 处理器温度监视
• LED 前灯温度控制
器件信息(1)
封装尺寸（标称值）
器件型号
TMP451-Q1
封装
WSON (8)
WSON (8)
2.00mm × 2.00mm
2.50mm × 2.50mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
1.7V to 3.6V
1.7V to 3.6V
1
V+
Processor
or ASIC
2
3
4
5
8
DXP
DXN
SCL
SDA
7
Built-in
Thermal
Transistor/
Diode
SMBus
Controller
TMP451-Q1
THERM
GND
ALERT / THERM2
6
Overtemperature
Shutdown
典型应用
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLOS877
TMP451-Q1
ZHCSCV4C –OCTOBER 2014 –REVISED APRIL 2021
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Table of Contents
7.5 Programming............................................................ 14
7.6 Register Map.............................................................17
8 Application and Implementation..................................23
8.1 Application Information............................................. 23
8.2 Typical Application.................................................... 23
9 Power Supply Recommendations................................26
10 Layout...........................................................................27
10.1 Layout Guidelines................................................... 27
10.2 Layout Example...................................................... 28
11 Device and Documentation Support..........................29
11.1 接收文档更新通知................................................... 29
11.2 支持资源..................................................................29
11.3 Trademarks............................................................. 29
11.4 静电放电警告...........................................................29
11.5 术语表..................................................................... 29
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Timing Characteristics for 图6-1 ................................6
6.7 Typical Characteristics................................................7
7 Detailed Description........................................................9
7.1 Overview.....................................................................9
7.2 Functional Block Diagram...........................................9
7.3 Feature Description.....................................................9
7.4 Device Functional Modes..........................................14
Information.................................................................... 29
4 Revision History
Changes from Revision B (June 2019) to Revision C (April 2021)
Page
• 分离了DQF 和DQW 可润湿侧翼封装................................................................................................................1
• 添加了可润湿侧翼封装的说明.............................................................................................................................1
• Added separate Pinout for DQW wettable flanks package ................................................................................3
Changes from Revision A (January 2019) to Revision B (June 2019)
Page
• 添加了DQW 封装...............................................................................................................................................1
• Added DQW (WSON) package information to the Thermal Information table ...................................................4
Changes from Revision * (October 2014) to Revision A (January 2019)
Page
• 将“预发布DQF 可订购产品”更改为“有效”................................................................................................. 1
• Moved storage temperature to the Absolute Maximum Ratings table................................................................4
• Moved the AEC-Q100 ESD classification levels to the ESD Ratings table........................................................ 4
• Changed TMP451-Q1 SMBus Addresses table .............................................................................................. 16
• Added Receiving Notification of Documentation Updates section....................................................................29
• Added Community Resources section..............................................................................................................29
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5 Pin Configuration and Functions
V+
1
2
3
4
8
7
6
5
SCL
D+
D-
SDA
ALERT/THERM2
GND
THERM
图5-1. DQF Package 8-Pin WSON Top View
1
2
3
4
8
7
V+
D+
SCL
SDA
6 ALERT/THERM
5 GND
D-
THERM
图5-2. DQW with Wettable Flanks Packages 8-Pin WSON Top View
表5-1. Pin Functions
PIN
TYPE
DESCRIPTION
NAME
NO.
Interrupt or SMBus alert output. Can be configured as a second THERM output. Open-drain; requires
pullup resistor to voltage between 1.7 V and 3.6 V.
ALERT/ THERM2
6
Digital output
3
2
5
Analog input
Analog input
Ground
Negative connection to remote temperature sensor.
Positive connection to remote temperature sensor.
Supply ground connection.
D–
D+
GND
Serial clock line for SMBus. Input; requires pullup resistor to voltage between 1.7 V and 3.6 V if driven
by open-drain output.
SCL
SDA
8
7
Digital input
Bidirectional digital
input-output
Serial data line for SMBus. Open-drain; requires pullup resistor to voltage between 1.7 V and 3.6 V.
Thermal shutdown or fan-control pin. Open-drain; requires pullup resistor to voltage between 1.7 V and
3.6 V.
THERM
V+
4
1
Digital output
Power supply
Positive supply voltage, 1.7 V to 3.6 V.
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6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range, unless otherwise noted.(1)
MIN
MAX
3.6
UNIT
V
Power supply
Input voltage
V+
–0.3
–0.3
–0.3
–0.3
THERM, ALERT/ THERM2, SDA and SCL only
3.6
V
D+ only
(V+) + 0.3
0.3
V
V
D–only
Input current
10
mA
°C
°C
°C
Operating temperature
127
–55
–60
Junction temperature (TJmax)
Storage temperature, Tstg
150
150
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level 2
±2000
V(ESD)
Electrostatic discharge
Corner pins (1, 4, 5,
and 8)
V
±750
±500
Charged device model (CDM), per AEC Q100-011
CDM ESD Classification Level C4B
Other pins
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.7
NOM
MAX
3.6
UNIT
Supply voltage
3.3
V
TA
Operating free-air temperature
125
°C
–40
6.4 Thermal Information
TMP451-Q1
DQW
THERMAL METRIC(1)
DQF (WSON)
UNIT
(WSON)
8 PINS
128.5
67.9
8 PINS
171.3
81.4
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
137.9
3.9
56.9
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
4.4
ψJT
140
56.5
ψJB
RθJC(bot)
—
—
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
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6.5 Electrical Characteristics
At TA = –40°C to 125°C and V+ = 3.3 V, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE ERROR
TA = 0°C to 70°C
±0.25
±1
±1
±2
±1
±2
±4
°C
°C
°C
°C
°C
TELOCAL
Local temperature sensor
TA = –40°C to 125°C
±0.25
±1
TA = 0°C to 70°C, TD = –55°C to 150°C
TA = –40°C to 100°C, TD = –55°C to 150°C
TA = –40°C to 125°C, TD = –55°C to 150°C
TEREMOTE Remote temperature sensor(1)
±2
Remote temperature sensor versus supply
V+ = 1.7 V to 3.6 V
±0.1
±0.25
°C/V
(local or remote)
TEMPERATURE MEASUREMENT
Conversion time
One-Shot mode, local and remote total
31
12
34
ms
Bits
Bits
μA
μA
μA
Local temperature sensor resolution
Remote temperature sensor resolution
Remote sensor source current, high
Remote sensor source current, medium
Remote sensor source current, low
Remote transistor ideality factor
12
120
45
Series resistance 1 kΩ max
7.5
TMP451-Q1 optimized ideality factor
1.008
η
SMBus INTERFACE
VIH
VIL
High-level input voltage
1.4
V
V
Low-level input voltage
Hysteresis
0.45
200
0.15
3
mV
mA
V
SMBus output low sink current
Low-level output voltage
Logic input current
6
VOL
IO = 6 mA
0.4
1
0 V ≤VI ≤3.6 V
–1
μA
pF
SMBus input capacitance
SMBus clock frequency
SMBus timeout
0.01
20
2.5
30
1
MHz
ms
μs
25
SCL falling edge to SDA valid time
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At TA = –40°C to 125°C and V+ = 3.3 V, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL OUTPUTS (THERM, ALERT/ THERM2)
VOL
IOH
Low-level output voltage
IO = 6 mA
VO = V+
0.15
0.4
1
V
High-level output leakage current
μA
POWER SUPPLY
V(V+) Specified voltage range
1.7
3.6
40
V
0.0625 conversions per second
27
165
300
3
μA
μA
μA
μA
μA
μA
V
16 conversions per second
250
450
8
32 conversions per second
IQ
Quiescent current
Serial bus inactive, shutdown mode
Serial bus active, ƒS = 400 kHz, shutdown mode
Serial bus active, ƒS = 2.5 MHz, shutdown mode
90
350
1.2
POR
Power-on reset threshold
1.55
(1) Tested with less than 5-Ω effective series resistance and 100-pF differential input capacitance.
6.6 Timing Characteristics for 图6-1
FAST MODE
HIGH-SPEED MODE
PARAMETER
SCL operating frequency
MIN
0.001
1300
MAX
MIN
0.001
260
MAX
UNIT
MHz
ns
0.4
2.5
ƒ(SCL)
t(BUF)
Bus free time between STOP and START Condition
Hold time after repeated START condition. After this period, the first clock
is generated.
t(HDSTA)
600
160
ns
t(SUSTA)
t(SUSTO)
t(HDDAT)
t(SUDAT)
t(LOW)
Repeated START condition setup time
STOP condition setup time
Data hold time
600
600
0
160
160
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
900
150
Data setup time
100
1300
600
30
SCL clock LOW period
SCL clock HIGH period
Data fall and rise time
Clock fall and rise time
260
60
t(HIGH)
300
300
80
40
tF, tR –SDA
tF, tR –SCL
tR
1000
Rise time for SCL ≤100 kHz
t(LOW)
tR
tF
t(HDSTA)
SCL
SDA
t(SUSTO)
t(HDSTA)
t(HIGH)
t(SUSTA)
t(SUDAT)
t(HDDAT)
t(BUF)
P
S
S
P
图6-1. Two-Wire Timing Diagram
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6.7 Typical Characteristics
At TA = 25°C and V+ = 3.3 V, unless otherwise noted.
2
2
1.5
1
Mean
Mean
Mean - 4σ
Mean + 4σ
1.5
1
Mean - 4σ
Mean + 4σ
0.5
0
0.5
0
-0.5
-1
-0.5
-1
-1.5
-2
-1.5
-2
-50
0
50
100
150
-50
0
50
100
150
C001
C002
Ambient Temperature (°C)
Ambient Temperature (°C)
图6-2. Local Temperature Error vs. Temperature
图6-3. Remote Temperature Error vs. Temperature
20
10
2
1.5
1
0
-10
-20
-30
-40
0.5
0
-0.5
-1
D+ to GND
D+ to V+
-50
-60
-1.5
-2
1
10
100
0
500
1000
1500
2000
2500
3000
C003
C004
Leakage Resistance (Mꢀ)
Series Resistance (ꢀ)
图6-4. Remote Temperature Error vs. Leakage Resistance
图6-5. Remote Temperature Error vs. Series Resistance
90
0
20 mV p-p
80
50 mV p-p
-5
-10
-15
-20
-25
70
60
50
40
30
20
10
0
100 mV p-p
-10
0
5
10
15
20
0
200
400
600
800
1000
C005
Differential Capacitance (nF)
C006
Noise Frequency (MHz)
图6-6. Remote Temperature Error vs. Differential Capacitance
图6-7. Remote Temperature Error vs. Remote Channel Noise
Frequency
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6.7 Typical Characteristics (continued)
At TA = 25°C and V+ = 3.3 V, unless otherwise noted.
350
300
250
200
150
100
50
180
160
140
120
100
80
60
40
20
0
0
1
10
100
1000
10000
0.01
0.1
1
10
100
C008
C007
Clock Frequency (kHz)
Conversion Rate (Hz)
图6-9. Shutdown Quiescent Current vs. SCL Clock Frequency
图6-8. Quiescent Current vs. Conversion Rate
170
3
2.5
2
165
160
155
150
145
1.5
1
0.5
0
1.5
2
2.5
3
3.5
4
1.5
2
2.5
3
3.5
4
C009
C010
Supply Voltage (V)
Supply Voltage (V)
图6-10. Quiescent Current vs. Supply Voltage (At Default
图6-11. Shutdown Quiescent Current vs. Supply Voltage
Conversion Rate of 16 Conversions per Second)
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7 Detailed Description
7.1 Overview
The TMP451-Q1 device is a digital temperature sensor that combines a local temperature measurement channel
and a remote-junction temperature measurement channel in a single DFN-8 package. The device is two-wire-
and SMBus-interface compatible, and is specified over a temperature range of –40°C to 125°C. The TMP451-
Q1 device also contains multiple registers for programming and holding configuration settings, temperature
limits, and temperature measurement results.
7.2 Functional Block Diagram
V+
TMP451-Q1
Voltage Regulator
Register Bank
Oscillator
SCL
SDA
Serial Interface
Control Logic
16 x I
6 x I
I
ALERT/THERM2
D+
D-
ADC
THERM
Internal
BJT
GND
7.3 Feature Description
7.3.1 Temperature Measurement Data
The local and remote temperature sensors have a resolution of 12 bits (0.0625°C). Temperature data that result
from conversions within the default measurement range are represented in binary form, as shown in the
Standard Binary column of 表 7-1. Any temperature below 0°C results in a data value of 0 (00h). Likewise,
temperatures above 127°C result in a value of 127 (7Fh). The device can be set to measure over an extended
temperature range by changing bit 2 (RANGE) of configuration register from low to high. The change in
measurement range and data format from standard binary to extended binary occurs at the next temperature
conversion. For data captured in the extended temperature range configuration, an offset of 64 (40h) is added to
the standard binary value, as shown in the EXTENDED BINARY column of 表 7-1. This configuration allows
measurement of temperatures as low as –64°C, and as high as 191°C; however, most temperature-sensing
diodes only measure with the range of –55°C to 150°C. Additionally, the TMP451-Q1 is specified only for
ambient temperatures ranging from –40°C to 125°C; parameters in the Absolute Maximum Ratings table must
be observed.
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表7-1. Temperature Data Format (Local and Remote Temperature High Bytes)
LOCAL AND REMOTE TEMPERATURE REGISTER
HIGH BYTE VALUE (1°C RESOLUTION)
TEMPERATURE
(°C)
STANDARD BINARY(1)
BINARY
EXTENDED BINARY(2)
BINARY
HEX
00
00
00
00
01
05
0A
19
32
4B
64
7D
7F
7F
7F
7F
HEX
00
0000 0000
0000 0000
0000 0000
0000 0000
0000 0001
0000 0101
0000 1010
0001 1001
0011 0010
0100 1011
0110 0100
0111 1101
0111 1111
0111 1111
0111 1111
0111 1111
0000 0000
0000 1110
0010 0111
0100 0000
0100 0001
0100 0101
0100 1010
0101 1001
0111 0010
1000 1011
1010 0100
1011 1101
1011 1111
1101 0110
1110 1111
1111 1111
–64
–50
–25
0
0E
27
40
1
41
5
45
10
4A
59
25
50
72
75
8B
A4
BD
BF
D6
EF
FF
100
125
127
150
175
191
(1) Resolution is 1°C/count. Negative values produce a read of 0°C.
(2) Resolution is 1°C/count. All values are unsigned with a –64°C offset.
Both local and remote temperature data use two bytes for data storage. The high byte stores the temperature
with 1°C resolution. The second or low byte stores the decimal fraction value of the temperature and allows a
higher measurement resolution, as shown in 表 7-2. The measurement resolution for both the local and the
remote channels is 0.0625°C.
表7-2. Decimal Fraction Temperature Data Format (Local and Remote Temperature Low Bytes)
TEMPERATURE REGISTER LOW BYTE VALUE
(0.0625°C RESOLUTION)(1)
TEMP
(°C)
STANDARD AND EXTENDED BINARY
HEX
00
10
20
30
40
50
60
70
80
90
A0
B0
C0
D0
E0
F0
0
0000 0000
0001 0000
0010 0000
0011 0000
0100 0000
0101 0000
0110 0000
0111 0000
1000 0000
1001 0000
1010 0000
1011 0000
1100 0000
1101 0000
1110 0000
1111 0000
0.0625
0.1250
0.1875
0.2500
0.3125
0.3750
0.4375
0.5000
0.5625
0.6250
0.6875
0.7500
0.8125
0.8750
0.9385
(1) Resolution is 0.0625°C/count. All possible values are shown.
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7.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
High-byte conversion (for example, 0111 0011):
Convert the right-justified binary high byte to hexadecimal.
From hexadecimal, multiply the first number by 160 = 1 and the second number by 161 = 16.
The sum equals the decimal equivalent.
0111 0011b →73h →(3 × 160) + (7 × 161) = 115
Low-byte conversion (for example, 0111 0000):
To convert the left-justified binary low-byte to decimal, use bits 7 through 4 and ignore bits 3 through 0 because
they do not affect the value of the number.
0111b →(0 × 1/2)1 + (1 × 1/2)2 + (1 × 1/2)3 + (1 × 1/2)4 = 0.4375
7.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
For positive temperatures (for example, 20°C):
(20°C) / (1°C/count) = 20 →14h →0001 0100
Convert the number to binary code with 8-bit, right-justified format, and MSB = 0 to denote a positive sign.
20°C is stored as 0001 0100 →14h.
For negative temperatures (for example, –20°C):
(|–20|) / (1°C/count) = 20 →14h →0001 0100
Generate the two's complement of a negative number by complementing the absolute value binary number and
adding 1.
–20°C is stored as 1110 1100 →ECh.
7.3.2 Series Resistance Cancellation
Series resistance cancellation automatically eliminates the temperature error caused by the resistance of the
routing to the remote transistor or by the resistors of the optional external low-pass filter. A total of up to 1 kΩ of
series resistance can be cancelled by the TMP451-Q1 device, eliminating the need for additional
characterization and temperature offset correction. See 图 6-5, Remote Temperature Error vs. Series
Resistance, for details on the effects of series resistance on sensed remote temperature error.
7.3.3 Differential Input Capacitance
The TMP451-Q1 device tolerates differential input capacitance of up to 1000 pF with minimal change in
temperature error. The effect of capacitance on sensed remote temperature error is shown in 图 6-6, Remote
Temperature Error vs. Differential Capacitance.
7.3.4 Filtering
Remote junction temperature sensors are usually implemented in a noisy environment. Noise is most often
created by fast digital signals, and it can corrupt measurements. The TMP451-Q1 device has a built-in, 65-kHz
filter on the inputs of D+ and D– to minimize the effects of noise. However, a bypass capacitor placed
differentially across the inputs of the remote temperature sensor is recommended to make the application more
robust against unwanted coupled signals. For this capacitor, select a value of between 100 pF and 1 nF. Some
applications attain better overall accuracy with additional series resistance; however, this increased accuracy is
application-specific. When series resistance is added, the total value should not be greater than 1 kΩ. If filtering
is required, suggested component values are 100 pF and 50 Ω on each input; exact values are application-
specific.
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Additionally, a digital filter is available for the remote temperature measurements to further reduce the effect of
noise. This filter is programmable and has two levels when enabled. Level 1 performs a moving average of four
consecutive samples. Level 2 performs a moving average of eight consecutive samples. The value stored in the
remote temperature result register is the output of the digital filter, and the ALERT and THERM limits are
compared to it. This provides additional immunity to noise and spikes on the ALERT and THERM outputs. The
filter responses are shown in 图 7-1. The filter can be enabled or disabled by programming the desired levels in
the digital filter register. The digital filter is disabled by default and on POR.
Impulse Response
Step response
100
90
100
90
80
70
80
70
Disabled
Disabled
60
50
60
50
Level1
Level2
40
30
40
30
Level1
Level2
20
10
20
10
0
0
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
Samples
Samples
图7-1. Filter Response to Impulse and Step Inputs
7.3.5 Sensor Fault
The TMP451-Q1 device can sense a fault at the D+ input resulting from incorrect diode connection. The
TMP451-Q1 device can also sense an open circuit. Short-circuit conditions return a value of –64°C. The
detection circuitry consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) – 0.3 V
(typical). The comparator output is continuously checked during a conversion. If a fault is detected, then OPEN
(bit 2) in the status register is set to 1.
When not using the remote sensor with the TMP451-Q1 device, the D+ and D– inputs must be connected
together to prevent meaningless fault warnings.
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7.3.6 ALERT and THERM Functions
The operation of the ALERT (pin 6) and THERM (pin 4) interrupts is shown in 图 7-2. The operation of the
THERM (pin 4) and THERM2 (pin 6) interrupts is shown in 图7-3.
Temperature Conversion Complete
150
140
130
120
THERM Limit
110
100
THERM Limit - Hysteresis
90
High Temperature Limit
80
70
Measured
Temperature
60
50
Time
ALERT output
serviced by master
ALERT
THERM
图7-2. ALERT and THERM Interrupt Operation
Temperature Conversion Complete
150
140
130
120
THERM Limit
110
100
THERM Limit - Hysteresis
90
THERM2 Limit
80
70
THERM2 Limit - Hysteresis
Measured
Temperature
60
50
Time
THERM2
THERM
图7-3. THERM and THERM2 Interrupt Operation
The hysteresis value is stored in the THERM hysteresis register. The value of the CONAL[2:0] bits in the
consecutive ALERT register determines the number of limit violations before the ALERT pin is tripped. The
default value is 000b and corresponds to one violation, 001b programs two consecutive violations, 011b
programs three consecutive violations, and 111b programs four consecutive violations. This provides additional
filtering for the ALERT pin state.
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7.4 Device Functional Modes
7.4.1 Shutdown Mode (SD)
The TMP451-Q1 shutdown mode enables the user to save maximum power by shutting down all device circuitry
other than the serial interface, reducing current consumption to typically less than 3 μA; see 图 6-11, Shutdown
Quiescent Current vs. Supply Voltage. Shutdown mode is enabled when the SD bit (bit 6) of the configuration
register is high; the device shuts down after the current conversion is finished. When the SD bit is low, the device
maintains a continuous-conversion state.
7.5 Programming
7.5.1 Serial Interface
The TMP451-Q1 device operates only as a slave device on either the two-wire bus or the SMBus. Connections
to either bus are made using the open-drain I/O lines, SDA and SCL. The SDA and SCL pins feature integrated
spike suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The
TMP451-Q1 device supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 2.5
MHz) modes. All data bytes are transmitted MSB first.
7.5.1.1 Bus Overview
The TMP451-Q1 device is SMBus interface compatible. In SMBus protocol, the device that initiates the transfer
is called a master, and the devices controlled by the master are slaves. The bus must be controlled by a master
device that generates the serial clock (SCL), controls the bus access, and generates the start and stop
conditions.
To address a specific device, a start condition is initiated. A start condition is indicated by pulling the data line
(SDA) from a high-to-low logic level while SCL is high. All slaves on the bus shift in the slave address byte, with
the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the slave being
addressed responds to the master by generating an acknowledge bit and pulling SDA low.
Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit. During data
transfer SDA must remain stable while SCL is high, because any change in SDA while SCL is high is interpreted
as a control signal.
After all data have been transferred, the master generates a stop condition. A stop condition is indicated by
pulling SDA from low to high, while SCL is high.
7.5.1.2 Bus Definitions
The TMP451-Q1 device is two-wire and SMBus-compatible. 图 7-4 and 图 7-5 show the timing for various
operations on the TMP451-Q1 device. The bus definitions are as follows:
Bus Idle:
Both SDA and SCL lines remain high.
Start Data
Transfer:
A change in the state of the SDA line, from high to low, while the SCL line is high, defines
a start condition. Each data transfer initiates with a start condition.
Stop Data
Transfer:
A change in the state of the SDA line from low to high while the SCL line is high defines a
stop condition. Each data transfer terminates with a repeated start or stop condition.
Data Transfer:
The number of data bytes transferred between a start and a stop condition is not limited
and is determined by the master device. The receiver acknowledges data transfer.
Acknowledge:
Each receiving device, when addressed, is obliged to generate an acknowledge bit. A
device that acknowledges must pull down the SDA line during the acknowledge clock
pulse in such a way that the SDA line is stable low during the high period of the
acknowledge clock pulse. Take setup and hold times into account. On a master receive,
data transfer termination can be signaled by the master generating a not-acknowledge on
the last byte that has been transmitted by the slave.
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1
9
1
9
SCL
SDA
¼
1
0
0
1
1
0
0(1) R/W
P7 P6 P5 P4 P3
P2 P1
P0
¼
Start By
Master
ACK By
ACK By
Device
Device
Frame 2 Pointer Register Byte
Frame 1 Two-Wire Slave Address Byte
1
9
SCL
(Continued)
SDA
D7 D6 D5 D4 D3 D2 D1 D0
(Continued)
ACK By
Device
Stop By
Master
Frame 3 Data Byte 1
A. Slave address 1001100 shown.
图7-4. Two-Wire Timing Diagram for Write Word Format
1
9
1
9
¼
SCL
SDA
1
0
0
1
1
0
0(1)
R/W
P7
P6
P5
P4
P3
P2
P1
P0
¼
Start By
Master
ACK By
ACK By
Device
Device
Frame 1 Two-Wire Slave Address Byte
Frame 2 Pointer Register Byte
1
9
1
9
SCL
¼
(Continued)
SDA
0(1)
¼
1
0
1
0
0
1
R/W
D7
D6
D5
D4 D3
D2
D1
D0
(Continued)
Start By
Master
ACK By
From
Device
NACK By
Master(2)
Device
Frame 3 Two-Wire Slave Address Byte
Frame 4 Data Byte 1 Read Register
A. Slave address 1001100 shown.
B. Master should leave SDA high to terminate a single-byte read operation.
图7-5. Two-Wire Timing Diagram for Single-Byte Read Format
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7.5.1.3 Serial Bus Address
To communicate with the TMP451-Q1 device, the master must first address slave devices using a slave address
byte. The slave address byte consists of seven address bits, and a direction bit indicating the intent of executing
a read or write operation. The TMP451-Q1 SMBus addresses are shown in 表 7-3. Additional factory-
programmed device addresses are available upon request.
表7-3. TMP451-Q1 SMBus Addresses
Orderable Part Number (DQF Package)
SMBus Address (7-bit)
TMP451HQDQFRQ1
49
4C
4E
TMP451AQDQFRQ1
TMP451JQDQFRQ1
7.5.1.4 Read and Write Operations
Accessing a particular register on the TMP451-Q1 device is accomplished by writing the appropriate value to the
pointer register. The value for the pointer register is the first byte transferred after the slave address byte with the
R/ W bit low. Every write operation to the TMP451-Q1 device requires a value for the pointer register (see 图
7-4).
When reading from the TMP451-Q1 device the last value stored in the pointer register by a write operation is
used to determine which register is read by a read operation. To change which register is read for a read
operation, a new value must be written to the pointer register. This transaction is accomplished by issuing a
slave address byte with the R/ W bit low, followed by the pointer register byte; no additional data are required.
The master can then generate a start condition and send the slave address byte with the R/ W bit high to initiate
the read command; see 图7-5 for details of this sequence.
If repeated reads from the same register are desired, it is not necessary to continually send the pointer register
bytes, because the TMP451-Q1 retains the pointer register value until it is changed by the next write operation.
The register bytes are sent MSB first, followed by the LSB.
Read operations should be terminated by issuing a not-acknowledge command at the end of the last byte to be
read. For single-byte operation, the master must leave the SDA line high during the acknowledge time of the first
byte that is read from the slave.
7.5.1.5 Timeout Function
If the SMBus timeout function is enabled, the TMP451-Q1 device resets the serial interface if either SCL or SDA
are held low for 25 ms (typical) between a start and stop condition. If the TMP451-Q1 device is holding the bus
low, the device releases the bus and waits for a start condition. To avoid activating the timeout function,
maintaining a communication speed of at least 1 kHz for the SCL operating frequency is necessary. The SMBTO
bit (bit 7) of the consecutive ALERT register controls the timeout enable. Setting the SMBTO bit to a value of 0
(default) disables the timeout. Setting the SMBTO bit to a value of 1 enables the function.
7.5.1.6 High-Speed Mode
For the two-wire bus to operate at frequencies above 1 MHz, the master device must issue a high-speed mode
(Hs-mode) master code (0000 1xxx) as the first byte after a start condition to switch the bus to high-speed
operation. The TMP451-Q1 device does not acknowledge this byte, but switches the input filters on SDA and
SCL and the output filter on SDA to operate in Hs-mode, allowing transfers at up to 2.5 MHz. After the Hs-mode
master code has been issued, the master transmits a two-wire slave address to initiate a data transfer operation.
The bus continues to operate in Hs-mode until a stop condition occurs on the bus. Upon receiving the stop
condition, the TMP451-Q1 device switches the input and output filters back to fast mode operation.
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7.6 Register Map
表7-4. Register Map
BIT DESCRIPTION
POINTER READ POINTER WRITE
(HEX)
(HEX)
POR (HEX)
7
6
5
4
3
2
1
0
REGISTER DESCRIPTION
Local temperature (high byte)
Remote temperature (high byte)
Status register
00
N/A
00
00
LT11
RT11
BUSY
LT10
RT10
LHIGH
LT9
LT8
LT7
LT6
LT5
LT4
01
N/A
RT9
LLOW
RT8
RT7
RT6
OPEN
RT5
RT4
02
N/A
N/A
RHIGH
RLOW
RTHRM
LTHRM
ALERT/
THERM2
03
09
00
MASK1
SD
0
0
RANGE
0
0
Configuration register
04
05
06
07
08
N/A
10
11
0A
0B
0C
0D
0E
0F
N/A
11
08
55
00
55
00
N/A
00
00
00
00
00
00
6E
6E
0A
01
00
00
55
0
0
0
0
CR3
LTHL7
LTLL7
RTHL7
RTLL7
X
CR2
LTHL6
LTLL6
RTHL6
RTLL6
X
CR1
LTHL5
LTLL5
RTHL5
RTLL5
X
CR0
LTHL4
LTLL4
RTHL4
RTLL4
X
Conversion rate register
LTHL11
LTLL11
RTHL11
RTLL11
X
LTHL10
LTLL10
RTHL10
RTLL10
X
LTHL9
LTLL9
RTHL9
RTLL9
X
LTHL8
LTLL8
RTHL8
RTLL8
X
Local temperature high limit
Local temperature low limit
Remote temperature high limit (high byte)
Remote temperature low limit (high byte)
One-shot start(1)
RT3
RT2
RT1
RT0
0
0
0
0
Remote temperature (low byte)
Remote temperature offset (high byte)
Remote temperature offset (low byte)
Remote temperature high limit (low byte)
Remote temperature low limit (low byte)
Local temperature (low byte)
Remote temperature THERM limit
Local temperature THERM limit
THERM hysteresis
RTOS11
RTOS3
RTHL3
RTLL3
LT3
RTOS10
RTOS2
RTHL2
RTLL2
LT2
RTOS9
RTOS1
RTHL1
RTLL1
LT1
RTOS8
RTOS0
RTHL0
RTLL0
LT0
RTOS7
0
RTOS6
0
RTOS5
0
RTOS4
0
12
13
14
15
19
20
21
22
23
24
FE
12
13
0
0
0
0
14
0
0
0
0
N/A
19
0
0
0
0
RTH11
LTH11
HYS11
SMBTO
NC7
RTH10
LTH10
HYS10
0
RTH9
LTH9
HYS9
0
RTH8
LTH8
HYS8
0
RTH7
LTH7
HYS7
CONAL2
NC3
0
RTH6
LTH6
HYS6
CONAL1
NC2
0
RTH5
LTH5
HYS5
CONAL0
NC1
DF1
0
RTH4
LTH4
HYS4
1
20
21
22
Consecutive ALERT
23
NC6
NC5
NC4
NC0
DF0
1
η-factor correction
24
0
0
0
0
Digital filter control
N/A
0
1
0
1
0
1
Manufacturer ID
(1) X = undefined. Writing any value to this register initiates a one-shot start; see the One-Shot Conversion section.
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7.6.1 Register Information
The TMP451-Q1 device contains multiple registers for holding configuration information, temperature
measurement results, and status information. These registers are described in 图7-6 and 表7-4.
7.6.1.1 Pointer Register
图 7-6 shows the internal register structure of the TMP451-Q1 device. The 8-bit pointer register is used to
address a given data register. The pointer register identifies which of the data registers should respond to a read
or write command on the two-wire bus. This register is set with every write command. A write command must be
issued to set the proper value in the pointer register before executing a read command. 表 7-4 describes the
pointer register and the internal structure of the TMP451-Q1 registers. The power-on reset (POR) value of the
pointer register is 00h (0000 0000b).
Pointer Register
Local and Remote Temperature Registers
Status Register
Configuration Register
Conversion Rate Register
SDA
Local and Remote Temperature Limit Registers
One-Shot Start Register
I/O
Control
Interface
Remote Temperature Offset Registers
Local and Remote THERM Limit Registers
THERM Hysteresis Register
Consecutive ALERT Register
N-factor Correction Register
SCL
Digital Filter Register
Manufacturer ID Register
图7-6. Internal Register Structure
7.6.1.2 Temperature Registers
The TMP451-Q1 device has multiple 8-bit registers that hold temperature measurement results. The eight most
significant bits (MSBs) of the local temperature sensor result are stored in register 00h, while the four least
significant bits (LSBs) are stored in register 15h (the four MSBs of register 15h). The eight MSBs of the remote
temperature sensor result are stored in register 01h, and the four LSBs are stored in register 10h (the four MSBs
of register 10h). The four LSBs of both the local sensor and the remote sensor indicate the temperature value
after the decimal point (for example, if the temperature result is 10.0625°C, the high byte is 0000 1010 and the
low byte is 0001 0000). These registers are read-only and are updated by the ADC each time a temperature
measurement is completed.
When the full temperature value is needed, reading the MSB value first causes the LSB value to be locked (the
ADC does not write to it) until it is read. The same thing happens upon reading the LSB value first (the MSB
value is locked until it is read). This mechanism assures that both bytes of the read operation are from the same
ADC conversion. This assurance remains valid only until another register is read. For proper operation, read the
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high byte of the temperature result first. Read the low byte register in the next read command; if the LSBs are
not needed, the register may be left unread. The power-on reset value of all temperature registers is 00h.
7.6.1.3 Status Register
The status register reports the state of the temperature ADC, the temperature limit comparators, and the
connection to the remote sensor. 表 7-5 lists the status register bits. The status register is read-only, and is read
by accessing pointer address 02h.
表7-5. Status Register Format
STATUS REGISTER (READ = 02h, WRITE = N/A)
BIT NUMBER
BIT NAME
BUSY
FUNCTION
7
6
5
4
3
2
1
0
= 1 when the ADC is converting
LHIGH(1)
LLOW(1)
RHIGH(1)
RLOW(1)
OPEN(1)
RTHRM
LTHRM
= 1 when the local high temperature limit is tripped
= 1 when the local low temperature limit is tripped
= 1 when the remote high temperature limit is tripped
= 1 when the remote low temperature limit is tripped
= 1 when the remote sensor is an open circuit
= 1 when the remote THERM limit is tripped
= 1 when the local THERM limit is tripped
(1) These flags stay high until the status register is read or they are reset by a POR when pin 6 is
configured as ALERT. Only bit 2 (OPEN) stays high until the status register is read or it is reset by a
POR when pin 6 is configured as THERM2.
The BUSY bit = 1 if the ADC is making a conversion. This bit is set to 0 if the ADC is not converting.
The LHIGH and LLOW bits indicate a local sensor overtemperature or undertemperature event, respectively.
The RHIGH and RLOW bits indicate a remote sensor overtemperature or undertemperature event, respectively.
The OPEN bit indicates an open circuit condition on the remote sensor. When pin 6 is configured as the ALERT
output, the five flags are NORed together. If any of the five flags are high, the ALERT interrupt latch is set and
the ALERT output goes low. Reading the status register clears the five flags, provided that the condition that
caused the setting of the flags is not present anymore (that is, the value of the corresponding result register is
within the limits, or the remote sensor is connected properly and functional). The ALERT interrupt latch (and the
ALERT pin correspondingly) is not reset by reading the status register. The reset is done by the master reading
the temperature sensor device address to service the interrupt, and only if the flags have been reset and the
condition that caused them to be set is not present.
The RTHRM and LTHRM flags are set when the corresponding temperature exceeds the programmed THERM
limit. They are reset automatically when the temperature returns to within the limits. The THERM output goes low
in the case of overtemperature on either the local or the remote channel, and goes high as soon as the
measurements are within the limits again. The THERM hysteresis register (21h) allows hysteresis to be added
so that the flag resets and the output goes high when the temperature returns to or goes below the limit value
minus the hysteresis value.
When pin 6 is configured as THERM2, only the high limits matter. The LHIGH and RHIGH flags are set if the
respective temperatures exceed the limit values, and the pin goes low to indicate the event. The LLOW and
RLOW flags have no effect on THERM2, and the output behaves the same way when configured as THERM.
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7.6.1.4 Configuration Register
The configuration register sets the temperature range, the ALERT/ THERM modes, and controls the shutdown
mode. The configuration register is set by writing to pointer address 09h, and read by reading from pointer
address 03h. 表7-6 summarizes the bits of configuration register.
表7-6. Configuration Register Bit Descriptions
CONFIGURATION REGISTER (READ = 03h, WRITE = 09h, POR = 00h)
BIT NUMBER
NAME
FUNCTION
POWER-ON RESET VALUE
0 = ALERT Enabled
1 = ALERT Masked
7
MASK1
0
0 = Run
1 = Shut down
6
SD
0
0 = ALERT
1 = THERM2
5
ALERT/ THERM2
Reserved
0
0
0
0
4:3
2
—
0 = 0°C to +127°C
1 = –64°C to +191°C
RANGE
1:0
Reserved
—
MASK1 (bit 7) of the configuration register masks the ALERT output. If MASK1 is 0 (default), the ALERT output
is enabled. If MASK1 is set to 1, the ALERT output is disabled. This configuration applies only if the value of
ALERT/ THERM2 (bit 5) is 0 (that is, pin 6 is configured as the ALERT output). If pin 6 is configured as the
THERM2 output, the value of the MASK1 bit has no effect.
The shutdown bit (SD, bit 6) enables or disables the temperature-measurement circuitry. If SD = 0 (default), the
TMP451-Q1 device converts continuously at the rate set in the conversion rate register. When SD is set to 1, the
TMP451-Q1 device stops converting when the current conversion sequence is complete and enters a shutdown
mode. When SD is set to 0 again, the TMP451-Q1 resumes continuous conversions. When SD = 1, a single
conversion can be started by writing to the one-shot start register. See the One-Shot Start Register section for
more information.
ALERT/ THERM2 (bit 5) sets the configuration of pin 6. If the ALERT/ THERM2 bit is 0 (default), then pin 6 is
configured as the ALERT output; if it is set to 1, then pin 6 is configured as the THERM2 output.
The temperature range is set by configuring RANGE (bit 2) of the configuration register. Setting this bit low
(default) configures the TMP451-Q1 device for the standard measurement range (0°C to 127°C); temperature
conversions are stored in the standard binary format. Setting bit 2 high configures the TMP451-Q1 device for the
extended measurement range (–64°C to 191°C); temperature conversions are stored in the extended binary
format (see 表7-1).
The remaining bits of the configuration register are reserved and must always be set to 0. The power-on reset
value for this register is 00h.
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7.6.1.5 Conversion Rate Register
The conversion rate register (read address 04h, write address 0Ah) controls the rate at which temperature
conversions are performed. This register adjusts the idle time between conversions but not the conversion time
itself, thereby allowing the TMP451-Q1 power dissipation to be balanced with the temperature register update
rate. 表 7-7 lists the conversion rate options and corresponding time between conversions. The default value of
the register is 08h, which gives a default rate of 16 conversions per second.
表7-7. Conversion Rate
VALUE
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
CONVERSIONS PER SECOND
TIME (SECONDS)
0.0625
16
0.125
8
0.25
4
0.5
2
1
1
0.5
2
4
0.25
8
16 (default)
32
0.125
0.0625 (default)
0.03125
7.6.1.6 One-Shot Start Register
When the TMP451-Q1 device is in shutdown mode (SD = 1 in the configuration register), a single conversion is
started by writing any value to the one-shot start register, pointer address 0Fh. This write operation starts one
conversion and comparison cycle on both the local and the remote sensors. The TMP451-Q1 device returns to
shutdown mode when the cycle completes. The value of the data sent in the write command is irrelevant and is
not stored by the TMP451-Q1 device.
7.6.1.7 η-Factor Correction Register
The TMP451-Q1 device allows for a different η-factor value to be used for converting remote channel
measurements to temperature. The remote channel uses sequential current excitation to extract a differential
VBE voltage measurement to determine the temperature of the remote transistor. 方程式 1 shows this voltage
and temperature.
hkT
I2
I1
VBE2 - VBE1
=
ln
q
(1)
The value ηin 方程式1 is a characteristic of the particular transistor used for the remote channel. The power-on
reset value for the TMP451-Q1 device is η = 1.008. The value in the η-factor correction register may be used
to adjust the effective η-factor according to 方程式2 and 方程式3.
≈
∆
«
’
÷
◊
1.008 ì 2088
2088 + NADJUST
ꢀeff
=
(2)
≈
∆
«
’
÷
◊
1.008 ì 2088
NADJUST
=
- 2088
ꢀeff
(3)
The η-factor correction value must be stored in twos complement format, yielding an effective data range from
–128 to 127. The η-factor correction value is written to and read from pointer address 23h. The register power-
on reset value is 00h, thus having no effect unless a different value is written to it.
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表7-8. η-Factor Range
NADJUST
BINARY
0111 1111
0000 1010
0000 1000
0000 0110
0000 0100
0000 0010
0000 0001
0000 0000
1111 1111
1111 1110
1111 1100
1111 1010
1111 1000
1111 0110
1000 0000
HEX
7F
0A
08
DECIMAL
η
127
10
0.950198
1.003195
1.004152
1.005111
1.006072
1.007035
1.007517
1.008
8
06
6
04
4
02
2
01
1
00
0
FF
FE
FC
FA
F8
F6
80
1.008483
1.008967
1.009935
1.010905
1.011877
1.012851
1.073837
–1
–2
–4
–6
–8
–10
–128
7.6.1.8 Offset Register
The offset register allows the TMP451-Q1 device to store any system offset compensation value that might be
observed from precision calibration. The value in the register is stored in the same format as the temperature
result, and is added to the remote temperature result upon every conversion. Combined with the η-factor
correction, this function allows for very accurate system calibration over the entire temperature range.
7.6.1.9 General Call Reset
The TMP451-Q1 device supports reset using the two-wire general call address 00h (0000 0000b). The TMP451-
Q1 device acknowledges the general call address and responds to the second byte. If the second byte is 06h
(0000 0110b), the TMP451-Q1 device executes a software reset. This software reset restores the power-on
reset state to all TMP451-Q1 registers, and it aborts any conversion in progress. The TMP451-Q1 device takes
no action in response to other values in the second byte.
7.6.1.10 Identification Register
The TMP451-Q1 device allows for the two-wire bus controller to query the device for manufacturer and device
IDs to enable software identification of the device at the particular two-wire bus address. The manufacturer ID is
obtained by reading from pointer address FEh. The TMP451-Q1 device reads 55h for the manufacturer code.
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8 Application and Implementation
备注
以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。
8.1 Application Information
The TMP451-Q1 device requires only a transistor connected between the D+ and D– pins for remote
temperature measurement. Tie the D+ pin to GND if the remote channel is not used and only the local
temperature is measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output)
require pullup resistors as part of the communication bus. A 0.1-µF power-supply decoupling capacitor is
recommended for local bypassing. 图8-1 shows the typical configuration for the TMP451-Q1 device.
8.2 Typical Application
(2)
RS
1.7V to 3.6V
0.1µF
1.7V to 3.6V
(3)
CDIFF
(2)
RS
10kꢀ
(typ)
10kꢀ
(typ)
10kꢀ
(typ)
10kꢀ
(typ)
Diode-connected configuration(1)
Series Resistance
(2)
1
V+
RS
2
3
4
5
8
7
DXP
DXN
SCL
SDA
(3)
CDIFF
(2)
RS
SMBus
Controller
TMP451-Q1
THERM
GND
Transistor-connected configuration(1)
ALERT / THERM2
6
Overtemperature Shutdown
A. Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance
cancellation.
B. RS (optional) should be < 1 kΩ in most applications. Selection of RS depends on application; see the Filtering section.
C. CDIFF (optional) should be < 1000 pF in most applications. Selection of CDIFF depends on application; see the Filtering section and 图
6-6, Remote Temperature Error vs. Differential Capacitance.
图8-1. TMP451-Q1 Basic Connections Using a Discrete Remote Transistor
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1.7V to 3.6V
1.7V to 3.6V
1
V+
Processor
2
3
4
5
8
7
or ASIC
DXP
DXN
SCL
SDA
Built-in
Thermal
Transistor/
Diode
SMBus
Controller
TMP451-Q1
THERM
GND
ALERT / THERM2
6
Overtemperature
Shutdown
图8-2. TMP451-Q1 Basic Connections Using a Processor Built-In Remote Transistor
8.2.1 Design Requirements
The TMP451-Q1 device is designed to be used with either discrete transistors or substrate transistors built into
processor chips and ASICs. Either NPN or PNP transistors can be used, as long as the base-emitter junction is
used as the remote temperature sense. NPN transistors must be diode-connected. PNP transistors can either be
transistor- or diode-connected (see 图8-1).
Errors in remote temperature sensor readings are typically the consequence of the ideality factor and current
excitation used by the TMP451-Q1 device versus the manufacturer-specified operating current for a given
transistor. Some manufacturers specify a high-level and low-level current for the temperature-sensing substrate
transistors. The TMP451-Q1 device uses 7.5 μA for ILOW and 120 μA for IHIGH
.
The ideality factor (η) is a measured characteristic of a remote temperature sensor diode as compared to an
ideal diode. The TMP451-Q1 allows for different η-factor values; see the η-Factor Correction Register section.
The ideality factor for the TMP451-Q1 device is trimmed to be 1.008. For transistors that have an ideality factor
that does not match the TMP451-Q1, 方程式4 can be used to calculate the temperature error.
备注
For the equation to be used correctly, actual temperature (°C) must be converted to Kelvin (K).
h - 1.008
TERR
=
´ (273.15 + T(°C))
1.008
(4)
where
• TERR = error in the TMP451-Q1 device because η≠1.008
• η= ideality factor of remote temperature sensor
• T(°C) = actual temperature
• Degree delta is the same for °C and K.
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For η= 1.004 and T(°C) = 100°C:
1.004 -1.008
æ
ö
TERR
=
´ 273.15 +100°C
ç
÷
1.008
è
ø
TERR = 1.48°C
(5)
If a discrete transistor is used as the remote temperature sensor with the TMP451-Q1, the best accuracy can be
achieved by selecting the transistor according to the following criteria:
1. Base-emitter voltage > 0.25 V at 7.5 μA, at the highest sensed temperature.
2. Base-emitter voltage < 0.95 V at 120 μA, at the lowest sensed temperature.
3. Base resistance < 100 Ω.
4. Tight control of VBE characteristics indicated by small variations in hFE (that is, 50 to 150).
Based on this criteria, two recommended small-signal transistors are the 2N3904 (NPN) or 2N3906 (PNP).
8.2.2 Detailed Design Procedure
The local temperature sensor inside the TMP451-Q1 device monitors the ambient air around the device. The
thermal time constant for the TMP451-Q1 device is approximately two seconds. This constant implies that if the
ambient air changes quickly by 100°C, it would take the TMP451-Q1 device about 10 seconds (that is, five
thermal time constants) to settle to within 1°C of the final value. In most applications, the TMP451-Q1 package is
in electrical, and therefore thermal, contact with the printed circuit board (PCB), as well as subjected to forced
airflow. The accuracy of the measured temperature directly depends on how accurately the PCB and forced
airflow temperatures represent the temperature that the TMP451-Q1 is measuring. Additionally, the internal
power dissipation of the TMP451-Q1 can cause the temperature to rise above the ambient or PCB temperature.
The internal power dissipated as a result of exciting the remote temperature sensor is negligible because of the
small currents used. For a 3.3-V supply and maximum conversion rate of 16 conversions per second, the
TMP451-Q1 device dissipates 0.54 mW (PDIQ = 3.3 V × 165 μA). A θJA of 171.3°C/W causes the junction
temperature to rise approximately 0.09°C above the ambient.
The temperature measurement accuracy of the TMP451-Q1 device depends on the remote and/or local
temperature sensor being at the same temperature as the system point being monitored. Clearly, if the
temperature sensor is not in good thermal contact with the part of the system being monitored, then there will be
a delay in the response of the sensor to a temperature change in the system. For remote temperature-sensing
applications using a substrate transistor (or a small, SOT23 transistor) placed close to the device being
monitored, this delay is usually not a concern.
8.2.3 Application Curves
The following curves show the performance capabilities of the TMP451-Q1 device. 图 8-3 shows the accuracy
performance in an oil-bath temperature drift of a population of 16 standard 2N3906 transistors measured in a
diode-connected configuration. 图8-4 shows the typical step response to a submerging of a sensor in an oil bath
with temperature of 100°C.
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2
1.5
1
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
Mean
Mean - 6S
Mean + 6S
0.5
0
-0.5
-1
-1.5
-2
œ1 0
1
2
3
4
5
6
7
8
9 1011121314151617181920
-40 -25 -10
5
20 35 50 65 80 95 110 125
Time (s)
C007
Remote Diode Temperature (èC)
D001
图8-4. Temperature Step Response
图8-3. TMP451-Q1 Remote Diode Temperature
Drift (Diode-Connected 2N3906)
9 Power Supply Recommendations
The TMP451-Q1 device operates with a power supply range of 1.7 V to 3.6 V. The device is optimized for
operation at 3.3-V supply but can measure temperature accurately in the full supply range.
A power-supply bypass capacitor is recommended. Place this capacitor as close as possible to the supply and
ground pins of the device. A typical value for this supply bypass capacitor is 0.1 μF. Applications with noisy or
high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise.
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10 Layout
10.1 Layout Guidelines
Remote temperature sensing on the TMP451-Q1 device measures very small voltages using very low currents;
therefore, noise at the device inputs must be minimized. Most applications using the TMP451-Q1 have high
digital content, with several clocks and logic level transitions creating a noisy environment. Layout should adhere
to the following guidelines:
1. Place the TMP451-Q1 device as close to the remote junction sensor as possible.
2. Route the D+ and D–traces next to each other and shield them from adjacent signals through the use of
ground guard traces; see 图10-1. If a multilayer PCB is used, bury these traces between ground or V+
planes to shield them from extrinsic noise sources. 5 mil (0.127 mm) PCB traces are recommended.
3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are
used, make the same number and approximate locations of copper-to-solder connections in both the D+ and
D–connections to cancel any thermocouple effects.
4. Use a 0.1μF local bypass capacitor directly between the V+ and GND of the TMP451-Q1 device. For
optimum measurement performance, minimize filter capacitance between D+ and D–to 1000 pF or less .
This capacitance includes any cable capacitance between the remote temperature sensor and the TMP451-
Q1 device.
5. If the connection between the remote temperature sensor and the TMP451-Q1 device is less than 8-in
(20,32 cm) long, use a twisted-wire pair connection. For lengths greater than 8 in, use a twisted, shielded
pair with the shield grounded as close to the TMP451-Q1 device as possible. Leave the remote sensor
connection end of the shield wire open to avoid ground loops and 60-Hz pickup.
6. Thoroughly clean and remove all flux residue in and around the pins of the TMP451-Q1 device to avoid
temperature offset readings as a result of leakage paths between D+ and GND, or between D+ and V+.
V+
D+
Ground or V+ layer
on bottom and/or
top, if possible.
D-
GND
Use minimum 5-mil (0.127 mm) traces with 5-mil spacing.
图10-1. Suggested PCB Layer Cross-Section
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10.2 Layout Example
VIA to Power or Ground Plane
VIA to Internal Layer
Ground Plane
Pull-Up Resistors
Supply Voltage
Supply Bypass
Capacitor
1
2
3
4
8
7
6
5
V+
D+
SCL
SDA
RS
RS
CDIFF
ALERT /
THERM2
D-
Thermal
Shutdown
GND
THERM
Serial Bus Traces
图10-2. TMP451-Q1 Layout Example
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11 Device and Documentation Support
11.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
11.3 Trademarks
SMBus™ is a trademark of Intel Corporation.
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
11.4 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
11.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMP451AQDQFRQ1
TMP451AQDQFTQ1
TMP451AQDQWRQ1
TMP451AQDQWTQ1
TMP451HQDQFRQ1
TMP451HQDQFTQ1
TMP451HQDQWRQ1
TMP451HQDQWTQ1
TMP451JQDQFRQ1
TMP451JQDQFTQ1
TMP451JQDQWRQ1
TMP451JQDQWTQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
DQF
DQF
DQW
DQW
DQF
DQF
DQW
DQW
DQF
DQF
DQW
DQW
8
8
8
8
8
8
8
8
8
8
8
8
3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
3000 RoHS & Green
250 RoHS & Green
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
DAIQ
DAIQ
1A
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
1A
3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
3000 RoHS & Green
250 RoHS & Green
1RUG
1RUG
1H
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
1H
3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
3000 RoHS & Green
250 RoHS & Green
1RVG
1RVG
1J
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
1J
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2021
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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17-Apr-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP451AQDQFRQ1
TMP451AQDQFRQ1
TMP451AQDQFTQ1
TMP451AQDQFTQ1
TMP451HQDQFRQ1
TMP451HQDQFRQ1
TMP451HQDQFTQ1
TMP451HQDQFTQ1
TMP451JQDQFRQ1
TMP451JQDQFRQ1
TMP451JQDQFTQ1
TMP451JQDQFTQ1
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
DQF
DQF
DQF
DQF
DQF
DQF
DQF
DQF
DQF
DQF
DQF
DQF
8
8
8
8
8
8
8
8
8
8
8
8
3000
3000
250
179.0
178.0
178.0
180.0
178.0
180.0
178.0
180.0
178.0
180.0
180.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
2.2
2.3
2.3
2.2
2.3
2.2
2.3
2.2
2.3
2.2
2.2
2.3
2.2
2.3
2.3
2.2
2.3
2.2
2.3
2.2
2.3
2.2
2.2
2.3
1.2
1.15
1.15
1.2
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
250
3000
3000
250
1.15
1.2
1.15
1.2
250
3000
3000
250
1.15
1.2
1.2
250
1.15
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP451AQDQFRQ1
TMP451AQDQFRQ1
TMP451AQDQFTQ1
TMP451AQDQFTQ1
TMP451HQDQFRQ1
TMP451HQDQFRQ1
TMP451HQDQFTQ1
TMP451HQDQFTQ1
TMP451JQDQFRQ1
TMP451JQDQFRQ1
TMP451JQDQFTQ1
TMP451JQDQFTQ1
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
DQF
DQF
DQF
DQF
DQF
DQF
DQF
DQF
DQF
DQF
DQF
DQF
8
8
8
8
8
8
8
8
8
8
8
8
3000
3000
250
200.0
205.0
205.0
200.0
205.0
200.0
205.0
200.0
205.0
200.0
200.0
205.0
183.0
200.0
200.0
183.0
200.0
183.0
200.0
183.0
200.0
183.0
183.0
200.0
25.0
33.0
33.0
25.0
33.0
25.0
33.0
25.0
33.0
25.0
25.0
33.0
250
3000
3000
250
250
3000
3000
250
250
Pack Materials-Page 2
PACKAGE OUTLINE
DQF0008A
WSON - 0.8 mm max height
S
C
A
L
E
6
.
0
0
0
PLASTIC SMALL OUTLINE - NO LEAD
2.1
1.9
A
B
PIN 1 INDEX AREA
2.1
1.9
0.8
0.7
C
SEATING PLANE
0.05 C
0.05
0.00
SYMM
(0.2) TYP
4
5
SYMM
2X 1.5
6X 0.5
8
1
0.3
8X
0.2
0.1
0.05
0.7
0.5
C A B
PIN 1 ID
0.6
0.4
7X
4220563/A 03/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
DQF0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SEE SOLDER MASK
DETAIL
SYMM
(0.8)
8
8X (0.25)
1
SYMM
6X (0.5)
(R0.05) TYP
4
5
7X (0.7)
(1.7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4220563/A 03/2021
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
DQF0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0.8)
8X (0.25)
1
8
SYMM
6X (0.5)
(R0.05) TYP
5
4
SYMM
(1.7)
7X (0.7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 30X
4220563/A 03/2021
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
DQW0008A
WSON - 0.8 mm max height
SCALE 6.000
PLASTIC SMALL OUTLINE - NO LEAD
2.6
2.4
B
A
PIN 1 INDEX AREA
2.1
1.9
0.1 MIN
(0.05)
SECTION A-A
TYPICAL
0.8
0.7
C
SEATING PLANE
0.08 C
(0.2) TYP
0.05
SYMM
0.00
4
5
2X
SYMM
1.5
A
A
6X
0.5
1
8
0.3
0.2
0.1
0.05
8X
0.85
0.65
PIN 1 ID
8X
C A B
C
4224433/A 07/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
DQW0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
8X (0.95)
8X (0.25)
1
8
SYMM
6X (0.5)
4
5
SYMM
(1.95)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
EXPOSED
METAL
EXPOSED METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4224433/A 07/2018
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
DQW0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
8X (0.95)
8X (0.25)
1
8
SYMM
6X (0.5)
5
4
SYMM
(1.95)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
4224433/A 07/2018
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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