TMP461 [TI]
具有引脚可编程总线地址的高精度远程和本地温度传感器;
| 型号： | TMP461 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有引脚可编程总线地址的高精度远程和本地温度传感器 温度传感 传感器 温度传感器 |
| 文件： | 总38页 (文件大小：1068K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TMP461
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
TMP461 具有引脚可编程的总线地址的高精度远程和本地温度传感器
1 特性
3 说明
1
•
远程二极管温度传感器精度：±0.75°C
本地温度传感器精度：±1°C
TMP461 器件是一款高精度、低功耗远程温度传感器
监控器，内置有一个本地温度传感器。这类远程温度传
感器通常采用低成本分立式 NPN 或 PNP 晶体管，或
者基板热晶体管或二极管，这些器件都是微处理器、微
控制器或现场可编程门阵列 (FPGA) 的组成部件。本地
和远程传感器均用 12 位数字编码表示温度，分辨率为
0.0625°C。此两线制串口接受 SMBus 通信协议，以
及多达 9 个不同的引脚可编程地址。
•
•
•
•
本地和远程通道的分辨率：0.0625°C
电源和逻辑电压范围：1.7V 至 3.6V
35µA 工作电流 (1SPS)，
3µA 关断电流
•
•
•
•
•
串联电阻抵消
η 因子和偏移校正
可编程数字滤波器
二极管故障检测
该 器件 将诸如串联电阻抵消、可编程非理想性因子
（η 因子）、可编程偏移、可编程温度限制和可编程数
字滤波器等高级特性完美结合，提供了一套准确度和抗
扰度更高且稳健耐用的温度监控解决方案。
两线制和 SMBus™串行接口与引脚可编程的地址
兼容
•
10 引脚超薄型四方扁平无引线 (WQFN) 封装
TMP461 非常适合各类通信、计算、仪器仪表和工业
应用中的多位置、高精度 温度测量。该器件的额定电
源电压范围为 1.7V 至 3.6V，额定工作温度范围为 -
40°C 至 125°C。
2 应用
•
•
•
•
•
•
•
•
处理器温度监控
电信设备
服务器和个人计算机
精密仪器
器件信息(1)
器件型号
TMP461
封装
WQFN (10)
封装尺寸（标称值）
测试设备
2.00mm x 2.00mm
智能电池
(1) 如需了解所有可用封装，请见数据表末尾的可订购产品附录。
嵌入式 应用
发光二极管 (LED) 照明温度控制
4 简化框图
1.7 V to 3.6 V
1.7 V to 3.6 V
10
A1
Processor or ASIC
1
9
V+
SCL
SDA
2
8
D+
TMP461
SMBus
Controller
3
7
Built-In Thermal
Transistor, Diode
ALERT/THERM2
GND
D-
4
6
THERM
A0
5
Overtemperature Shutdown
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SBOS722
TMP461
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
www.ti.com.cn
目录
8.4 Device Functional Modes........................................ 13
8.5 Programming........................................................... 14
8.6 Register Map........................................................... 17
Application and Implementation ........................ 23
9.1 Application Information............................................ 23
9.2 Typical Application .................................................. 23
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
简化框图................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Two-Wire Timing Requirements ............................... 6
7.7 Typical Characteristics.............................................. 7
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................. 10
9
10 Power Supply Recommendations ..................... 26
11 Layout................................................................... 27
11.1 Layout Guidelines ................................................. 27
11.2 Layout Example .................................................... 28
12 器件和文档支持 ..................................................... 29
12.1 接收文档更新通知 ................................................. 29
12.2 社区资源................................................................ 29
12.3 商标....................................................................... 29
12.4 静电放电警告......................................................... 29
12.5 Glossary................................................................ 29
13 机械、封装和可订购信息....................................... 29
8
5 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision A (July 2015) to Revision B
Page
•
•
Added formating of limits - moved negative limits from max column to min column for all temperature accuracy limits. ..... 5
Added minimum and maximum over temperature limits for all Remote sensor source current specifications. .................... 5
Changes from Original (June 2015) to Revision A
Page
•
已发布为量产数据................................................................................................................................................................... 1
2
Copyright © 2015–2016, Texas Instruments Incorporated
TMP461
www.ti.com.cn
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
6 Pin Configuration and Functions
RUN Package
10-Pin WQFN
Top View
A1
10
V+
D+
D-
1
2
3
4
9
SCL
8
7
SDA
ALERT/THERM2
GND
6
THERM
5
A0
Pin Functions
PIN
NAME
TYPE
DESCRIPTION
NO.
5
A0
A1
Digital input
Digital input
Address select. Connect to GND, V+, or leave floating.
Address select. Connect to GND, V+, or leave floating.
10
Interrupt or SMBus alert output. Can be configured as a second THERM output.
Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
ALERT/THERM2
7
Digital output
D–
D+
3
2
6
Analog input
Analog input
Ground
Negative connection to remote temperature sensor
Positive connection to remote temperature sensor
Supply ground connection
GND
Serial clock line for SMBus.
Input; requires a pullup resistor to a voltage between 1.7 V and 3.6 V if driven by an open-drain output.
SCL
SDA
9
8
Digital input
Bidirectional digital
input-output
Serial data line for SMBus. Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
Thermal shutdown or fan-control pin.
Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
THERM
V+
4
1
Digital output
Power supply
Positive supply voltage, 1.7 V to 3.6 V
Copyright © 2015–2016, Texas Instruments Incorporated
3
TMP461
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
MAX
UNIT
Power supply
Input voltage
Input current
V+
6
6
V
THERM, ALERT/THERM2, SDA and SCL only
D+, A0, A1
D– only
(V+) + 0.3
0.3
V
10
mA
°C
°C
°C
Operating temperature
–55
–60
150
Junction temperature (TJ max)
Storage temperature, Tstg
150
150
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
7.2 ESD Ratings
VALUE
±2000
±1000
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.7
NOM
MAX
3.6
UNIT
V
V+
TA
Supply voltage
3.3
Operating free-air temperature
–40
125
°C
7.4 Thermal Information
TMP461
THERMAL METRIC(1)
RUN (WQFN)
10 PINS
123.1
UNIT
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
60.1
78.1
Junction-to-top characterization parameter
Junction-to-board characterization parameter
4.6
ψJB
78.1
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
Copyright © 2015–2016, Texas Instruments Incorporated
TMP461
www.ti.com.cn
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
7.5 Electrical Characteristics
At TA = –40°C to 125°C and V+ = 1.7 V to 3.6 V, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE MEASUREMENT
TA = –10°C to 100°C, V+ = 1.7 V to 3.6 V
TA = –40°C to 125°C, V+ = 1.7 V to 3.6 V
-1
±0.125
±0.5
+1
TALOCAL
Local temperature sensor accuracy
°C
-1.25
+1.25
TA = 0°C to 100°C, TD = –55°C to 150°C,
V+ = 1.7 V to 3.6 V
-0.75
-1.5
±0.125
±0.5
+ 0.75
+1.5
TAREMOTE Remote temperature sensor accuracy
°C
TA = –40°C to 125°C, TD = –55°C to 150°C,
V+ = 1.7 V to 3.6 V
Temperature sensor error versus supply
(local or remote)
V+ = 1.7 V to 3.6 V
-0.25
±0.1
+0.25
°C/V
°C
Temperature resolution
(local and remote)
0.0625
ADC conversion time
ADC resolution
High
One-shot mode, per channel (local or remote)
15
12
17
ms
Bits
88
33
120
45
152
57
Remote sensor
Medium
Series resistance 1 kΩ (max)
µA
source current
Low
5.5
7.5
9.5
η
Remote transistor ideality factor
TMP461 optimized ideality factor
1.008
SERIAL INTERFACE
VIH
VIL
High-level input voltage
1.4
V
V
Low-level input voltage
Hysteresis
0.45
200
mV
mA
V
SDA output-low sink current
Low-level output voltage
Serial bus input leakage current
6
VOL
IO = –6 mA
0 V ≤ VIN ≤ 3.6 V
SCL
0.15
0.4
1
–1
μA
pF
pF
MHz
ms
3
6
Serial bus input capacitance
SDA
4.6
9
Serial bus clock frequency
Serial bus timeout
0.001
20
2.17
30
25
DIGITAL INPUTS (A0, A1)
VIH
VIL
High-level input voltage
0.9(V+)
–0.3
–1
(V+) + 0.3
V
V
Low-level input voltage
Input leakage current
Input capacitance
0.1(V+)
0 V ≤ VIN ≤ 3.6 V
1
5
μA
pF
2.5
DIGITAL OUTPUTS (THERM, ALERT/THERM2)
Output-low sink current
6
mA
V
VOL
IOH
Low-level output voltage
IO = –6 mA
VO = V+
0.15
0.4
1
High-level output leakage current
μA
POWER SUPPLY
V+
Specified supply voltage range
1.7
3.6
375
600
35
V
µA
V
Active conversion, local sensor
240
400
15
Active conversion, remote sensor
Standby mode (between conversions)
Shutdown mode, serial bus inactive
Shutdown mode, serial bus active, fS = 400 kHz
Shutdown mode, serial bus active, fS = 2.17 MHz
Rising edge
IQ
Quiescent current
3
8
90
350
1.2
POR
Power-on reset threshold
1.55
Copyright © 2015–2016, Texas Instruments Incorporated
5
TMP461
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
www.ti.com.cn
7.6 Two-Wire Timing Requirements
At –40°C to 125°C and V+ = 1.7 V to 3.6 V, unless otherwise noted.
FAST MODE
MIN
HIGH-SPEED MODE
MAX
MIN
0.001
160
MAX
UNIT
MHz
ns
f(SCL)
t(BUF)
SCL operating frequency
0.001
0.4
2.17
Bus free time between stop and start condition
1300
Hold time after repeated start condition.
After this period, the first clock is generated.
t(HDSTA)
600
160
ns
t(SUSTA)
t(SUSTO)
t(HDDAT)
t(SUDAT)
t(LOW)
Repeated start condition setup time
Stop condition setup time
Data hold time
600
600
0
160
160
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
900
150
Data setup time
100
1300
600
40
SCL clock low period
SCL clock high period
Data fall time
320
60
t(HIGH)
tF – SDA
tF, tR – SCL
tR
300
300
130
40
Clock fall and rise time
Rise time for SCL ≤ 100 kHz
1000
t(LOW)
tR
tF
t(HDSTA)
SCL
SDA
t(SUSTO)
t(HDSTA)
t(HIGH)
t(SUSTA)
t(SUDAT)
t(HDDAT)
t(BUF)
P
S
S
P
Figure 1. Two-Wire Timing Diagram
6
Copyright © 2015–2016, Texas Instruments Incorporated
TMP461
www.ti.com.cn
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
7.7 Typical Characteristics
At TA = 25°C and V+ = 3.6 V, unless otherwise noted.
1
0.8
0.6
0.4
0.2
0
0.9
Mean - 6s
Mean + 6 s
0.7
0.5
0.3
0.1
-0.1
-0.3
-0.5
-0.7
-0.9
-1.1
-0.2
-0.4
-0.6
-0.8
-1
Mean - 6s
Mean + 6s
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Ambient Temperature (èC)
Ambient Temperature (èC)
Typical behavior of 25 devices over temperature
Typical behavior of 25 devices over temperature
Figure 2. Local Temperature Error vs
Ambient Temperature
Figure 3. Remote Temperature Error vs
Ambient Temperature
20
0
1
0.8
0.6
0.4
0.2
0
D+ to GND
D+ to V+
-20
-40
-60
-0.2
-0.4
-0.6
-0.8
-1
1
2
3
4
5 6 7 8 10
20 30 40 50 70 100
0
500
1000
1500
2000
2500
3000
Leakage Resistance (MW)
Series Resistance (W)
D004
No physical capacitance during measurement
Figure 4. Remote Temperature Error vs
Leakage Resistance
Figure 5. Remote Temperature Error vs
Series Resistance
400
350
300
250
200
150
100
50
0
-5
-10
-15
-20
-25
-30
0
0
5
10
15
20
25
0.01
0.1
1
10
100
Differential Capacitance (nF)
Conversion Rate (Hz)
D005
D007
No physical series resistance on D+, D– pins during measurement
Figure 6. Remote Temperature Error vs
Differential Capacitance
Figure 7. Quiescent Current vs Conversion Rate
Copyright © 2015–2016, Texas Instruments Incorporated
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TMP461
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
www.ti.com.cn
Typical Characteristics (continued)
At TA = 25°C and V+ = 3.6 V, unless otherwise noted.
250
180
175
170
165
160
155
150
200
150
100
50
0
1k
10k
100k
1M
10M
1.5
2
2.5
3
3.5
4
Clock Frequency (Hz)
Supply Voltage (V)
D008
D009
16 samples per second (default mode)
Figure 8. Shutdown Quiescent Current
vs SCL Clock Frequency
Figure 9. Quiescent Current vs Supply Voltage
(At Default Conversion Rate of 16 Conversions per Second)
3
2.5
2
1.5
1
0.5
1.5
2
2.5
3
3.5
4
Supply Voltage (V)
D010
Figure 10. Shutdown Quiescent Current
vs Supply Voltage
8
Copyright © 2015–2016, Texas Instruments Incorporated
TMP461
www.ti.com.cn
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
8 Detailed Description
8.1 Overview
The TMP461 device is a digital temperature sensor that combines a local temperature measurement channel
and a remote-junction temperature measurement channel in a single WQFN-10 package. The device is two-wire-
and SMBus-interface-compatible with nine pin-programmable bus address options, and is specified over a
temperature range of –40°C to 125°C. The TMP461 device also contains multiple registers for programming and
holding configuration settings, temperature limits, and temperature measurement results.
8.2 Functional Block Diagram
V+
TMP461
A0
Register Bank
Oscillator
A1
SCL
SDA
Serial Interface
Control Logic
16 x I 6 x I
I
ALERT/THERM2
D+
D-
ADC
THERM
Internal
BJT
GND
Copyright © 2015–2016, Texas Instruments Incorporated
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www.ti.com.cn
8.3 Feature Description
8.3.1 Temperature Measurement Data
The local and remote temperature sensors have a resolution of 12 bits (0.0625°C). Temperature data that result
from conversions within the default measurement range are represented in binary form, as shown in the
Standard Binary column of Table 1. Any temperatures above 127°C result in a value that rails to 127.9375
(7FFh). The device can be set to measure over an extended temperature range by changing bit 2 (RANGE) of
the configuration register from low to high. The change in measurement range and data format from standard
binary to extended binary occurs at the next temperature conversion. For data captured in the extended
temperature range configuration, an offset of 64 (40h) is added to the standard binary value, as shown in the
Extended Binary column of Table 1. This configuration allows measurement of temperatures as low as –64°C,
and as high as 191°C; however, most temperature-sensing diodes only operate within the range of –55°C to
150°C. Additionally, the TMP461 is specified only for ambient temperatures ranging from –40°C to 125°C;
parameters in the Absolute Maximum Ratings table must be observed.
Table 1. Temperature Data Format (Local and Remote Temperature High Bytes)
LOCAL AND REMOTE TEMPERATURE REGISTER HIGH BYTE VALUE
(1°C Resolution)
STANDARD BINARY(1)
EXTENDED BINARY(2)
TEMPERATURE
(°C)
BINARY
HEX
C0
CE
E7
00
BINARY
HEX
00
–64
–50
–25
0
1100 0000
1100 1110
1110 0111
0000 0000
0000 0001
0000 0101
0000 1010
0001 1001
0011 0010
0100 1011
0110 0100
0111 1101
0111 1111
0111 1111
0111 1111
0111 1111
0000 0000
0000 1110
0010 0111
0100 0000
0100 0001
0100 0101
0100 1010
0101 1001
0111 0010
1000 1011
1010 0100
1011 1101
1011 1111
1101 0110
1110 1111
1111 1111
0E
27
40
1
01
41
5
05
45
10
0A
19
4A
59
25
50
32
72
75
4B
64
8B
A4
BD
BF
D6
EF
FF
100
125
127
150
175
191
7D
7F
7F
7F
7F
(1) Resolution is 1°C per count. Negative numbers are represented in twos complement format.
(2) Resolution is 1°C per count. All values are unsigned with a –64°C offset.
10
Copyright © 2015–2016, Texas Instruments Incorporated
TMP461
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ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
Both local and remote temperature data use two bytes for data storage. The high byte stores the temperature
with 1°C resolution. The second or low byte stores the decimal fraction value of the temperature and allows a
higher measurement resolution, as shown in Table 2. The measurement resolution for both the local and the
remote channels is 0.0625°C.
Table 2. Decimal Fraction Temperature Data Format (Local and Remote Temperature Low Bytes)
TEMPERATURE REGISTER LOW BYTE VALUE
(0.0625°C Resolution)(1)
TEMPERATURE
(°C)
STANDARD AND EXTENDED BINARY
0000 0000
HEX
00
10
20
30
40
50
60
70
80
90
A0
B0
C0
D0
E0
F0
0
0.0625
0.1250
0.1875
0.2500
0.3125
0.3750
0.4375
0.5000
0.5625
0.6250
0.6875
0.7500
0.8125
0.8750
0.9375
0001 0000
0010 0000
0011 0000
0100 0000
0101 0000
0110 0000
0111 0000
1000 0000
1001 0000
1010 0000
1011 0000
1100 0000
1101 0000
1110 0000
1111 0000
(1) Resolution is 0.0625°C per count. All possible values are shown.
8.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
High-byte conversion (for example, 0111 0011):
Convert the right-justified binary high byte to hexadecimal.
From hexadecimal, multiply the first number by 160 = 1 and the second number by 161 = 16.
The sum equals the decimal equivalent.
0111 0011b → 73h → (3 × 160) + (7 × 161) = 115.
Low-byte conversion (for example, 0111 0000):
To convert the left-justified binary low-byte to decimal, use bits 7 through 4 and ignore bits 3 through 0
because they do not affect the value of the number.
0111b → (0 × 1 / 2)1 + (1 × 1 / 2)2 + (1 × 1 / 2)3 + (1 × 1 / 2)4 = 0.4375.
8.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
For positive temperatures (for example, 20°C):
(20°C) / (1°C per count) = 20 → 14h → 0001 0100.
Convert the number to binary code with 8-bit, right-justified format, and MSB = 0 to denote a positive sign.
20°C is stored as 0001 0100 → 14h.
For negative temperatures (for example, –20°C):
(|–20|) / (1°C per count) = 20 → 14h → 0001 0100.
Generate the twos complement of a negative number by complementing the absolute value binary number
and adding 1.
–20°C is stored as 1110 1100 → ECh.
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8.3.2 Series Resistance Cancellation
Series resistance cancellation automatically eliminates the temperature error caused by the resistance of the
routing to the remote transistor or by the resistors of the optional external low-pass filter. A total of up to 1 kΩ of
series resistance can be cancelled by the TMP461 device, thus eliminating the need for additional
characterization and temperature offset correction. See Figure 5 (Remote Temperature Error vs Series
Resistance) for details on the effects of series resistance on sensed remote temperature error.
8.3.3 Differential Input Capacitance
The TMP461 device tolerates differential input capacitance of up to 1000 pF with minimal change in temperature
error. The effect of capacitance on the sensed remote temperature error is illustrated in Figure 6 (Remote
Temperature Error vs Differential Capacitance).
8.3.4 Filtering
Remote junction temperature sensors are usually implemented in a noisy environment. Noise is most often
created by fast digital signals that can corrupt measurements. The TMP461 device has a built-in, 65-kHz filter on
the D+ and D– inputs to minimize the effects of noise. However, a bypass capacitor placed differentially across
the inputs of the remote temperature sensor is recommended to make the application more robust against
unwanted coupled signals. For this capacitor, select a value between 100 pF differential and 1 nF. Some
applications attain better overall accuracy with additional series resistance. However, this increased accuracy is
application-specific. When series resistance is added, the total value must not be greater than 1 kΩ. If filtering is
required, suggested component values are 100 pF differential and 50 Ω on each input; exact values are
application-specific.
Additionally, a digital filter is available for the remote temperature measurements to further reduce the effect of
noise. This filter is programmable and has two levels when enabled. Level 1 performs a moving average of four
consecutive samples. Level 1 filtering can be achieved by setting the digital filter control register (read address
24h, write address 24h) to 01h. Level 2 performs a moving average of eight consecutive samples. Level 2
filtering can be achieved by setting the digital filter control register (read address 24h, write address 24h) to 02h.
The value stored in the remote temperature result register is the output of the digital filter, and is the value that
the ALERT and THERM limits are compared to. The digital filter provides additional immunity to noise and spikes
on the ALERT and THERM outputs. The filter responses to impulse and step inputs are shown in Figure 11 and
Figure 12, respectively. The filter can be enabled or disabled by programming the desired levels in the digital
filter register; see Table 4. The digital filter is disabled by default and on POR.
100
90
100
90
80
70
80
70
Disabled
Disabled
60
50
60
50
Level 1
Level 2
40
30
40
30
Level1
Level 2
20
10
20
10
0
0
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
Samples
Samples
Figure 11. Filter Response to Impulse Inputs
Figure 12. Filter Response to Step Inputs
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8.3.5 Sensor Fault
The TMP461 device can sense a fault at the D+ input resulting from an incorrect diode connection. The TMP461
device can also sense an open circuit. Short-circuit conditions return a value of –64°C. The detection circuitry
consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) – 0.3 V (typical). The
comparator output is continuously checked during a conversion. If a fault is detected, then OPEN (bit 2) in the
status register is set to 1.
When not using the remote sensor with the TMP461 device, the D+ and D– inputs must be connected together
to prevent meaningless fault warnings.
8.3.6 ALERT and THERM Functions
Operation of the ALERT (pin 7) and THERM (pin 4) interrupts is shown in Figure 13. Operation of the THERM
(pin 4) and THERM2 (pin 7) interrupts is shown in Figure 14. The ALERT and THERM pin setting is determined
by bit 5 of the configuration register.
The hysteresis value is stored in the THERM hysteresis register and applies to both the THERM and THERM2
interrupts. The value of the CONAL[2:0] bits in the consecutive ALERT register (see Table 4) determines the
number of limit violations before the ALERT pin is tripped. The default value is 000b and corresponds to one
violation, 001b programs two consecutive violations, 011b programs three consecutive violations, and 111b
programs four consecutive violations. The CONAL[2:0] bits provide additional filtering for the ALERT pin state.
Temperature Conversion Complete
Temperature Conversion Complete
150
140
150
140
130
120
130
120
THERM Limit
110
100
THERM Limit
110
100
THERM Limit - Hysteresis
THERM Limit - Hysteresis
90
90
THERM2 Limit
High Temperature Limit
80
70
80
70
THERM2 Limit - Hysteresis
Measured
Temperature
Measured
Temperature
60
50
60
50
Time
Time
ALERT output
serviced by master
THERM2
THERM
ALERT
THERM
Figure 14. THERM and THERM2 Interrupt Operation
Figure 13. ALERT and THERM Interrupt Operation
8.4 Device Functional Modes
8.4.1 Shutdown Mode (SD)
The TMP461 shutdown mode enables the user to save maximum power by shutting down all device circuitry
other than the serial interface, and reducing current consumption to typically less than 3 μA; see Figure 10
(Shutdown Quiescent Current vs Supply Voltage). Shutdown mode is enabled when the SD bit (bit 6) of the
configuration register is high; the device shuts down after the current conversion is finished. When the SD bit is
low, the device maintains a continuous-conversion state.
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8.5 Programming
8.5.1 Serial Interface
The TMP461 device operates only as a slave device on either the two-wire bus or the SMBus. Connections to
either bus are made using the open-drain I/O lines, SDA and SCL. The SDA and SCL pins feature integrated
spike suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP461
device supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 2.17 MHz)
modes. All data bytes are transmitted MSB first.
8.5.1.1 Bus Overview
The TMP461 device is SMBus-interface-compatible. In SMBus protocol, the device that initiates the transfer is
called a master, and the devices controlled by the master are slaves. The bus must be controlled by a master
device that generates the serial clock (SCL), controls the bus access, and generates the start and stop
conditions.
To address a specific device, a start condition is initiated. A start condition is indicated by pulling the data line
(SDA) from a high-to-low logic level when SCL is high. All slaves on the bus shift in the slave address byte, with
the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the slave being
addressed responds to the master by generating an acknowledge bit and pulling SDA low.
Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit. During data
transfer, SDA must remain stable when SCL is high. A change in SDA when SCL is high is interpreted as a
control signal.
After all data are transferred, the master generates a stop condition. A stop condition is indicated by pulling SDA
from low to high when SCL is high.
8.5.1.2 Bus Definitions
The TMP461 device is two-wire- and SMBus-compatible. Figure 15 and Figure 16 illustrate the timing for various
operations on the TMP461 device. The bus definitions are as follows:
Bus Idle:
Both SDA and SCL lines remain high.
Start Data Transfer: A change in the state of the SDA line (from high to low) when the SCL line is high defines
a start condition. Each data transfer initiates with a start condition.
Stop Data Transfer: A change in the state of the SDA line (from low to high) when the SCL line is high defines
a stop condition. Each data transfer terminates with a repeated start or stop condition.
Data Transfer: The number of data bytes transferred between a start and stop condition is not limited and is
determined by the master device. The receiver acknowledges the data transfer.
Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge bit. A device
that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of the acknowledge clock pulse. Take setup
and hold times into account. On a master receive, data transfer termination can be signaled by the
master generating a not-acknowledge on the last byte that is transmitted by the slave.
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Programming (continued)
1
9
1
9
SCL
¼
SDA
1
0
0
1
1
0
0(1) R/W
P7 P6 P5 P4 P3
P2 P1
P0
¼
Start By
Master
ACK By
ACK By
Device
Device
Frame 2 Pointer Register Byte
Frame 1 Two-Wire Slave Address Byte
1
9
SCL
(Continued)
SDA
D7 D6 D5 D4 D3 D2 D1 D0
(Continued)
ACK By
Device
Stop By
Master
Frame 3 Data Byte 1
(1) Slave address 1001100 is shown.
Figure 15. Two-Wire Timing Diagram for Write Word Format
1
9
1
9
¼
SCL
SDA
1
0
0
1
1
0
0(1)
R/W
P7
P6
P5
P4
P3
P2
P1
P0
¼
Start By
Master
ACK By
ACK By
Device
Device
Frame 1 Two-Wire Slave Address Byte
Frame 2 Pointer Register Byte
1
9
1
9
SCL
¼
(Continued)
SDA
0(1)
¼
1
0
1
0
0
1
R/W
D7
D6
D5
D4 D3
D2
D1
D0
(Continued)
Start By
Master
ACK By
From
Device
NACK By
Master(2)
Device
Frame 3 Two-Wire Slave Address Byte
Frame 4 Data Byte 1 Read Register
(1) Slave address 1001100 is shown.
(2) The master must leave SDA high to terminate a single-byte read operation.
Figure 16. Two-Wire Timing Diagram for Single-Byte Read Format
8.5.1.3 Serial Bus Address
To communicate with the TMP461 device, the master must first address slave devices using a slave address
byte. The slave address byte consists of seven address bits and a direction bit indicating the intent of executing a
read or write operation. The TMP461 allows up to nine devices to be connected to the SMBus, depending on the
A0, A1 pin connections as described in Table 3. The A0 and A1 address pins must be isolated from noisy or
high-frequency signals traces in order to avoid false address settings when these pins are set to a float state.
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Programming (continued)
Table 3. TMP461 Slave Address Options
SLAVE ADDRESS
A1 CONNECTION
A0 CONNECTION
BINARY
1001 000
1001 001
1001 010
1001 011
1001 100
1001 101
1001 110
1001 111
1010 000
HEX
48
GND
GND
GND
Float
Float
Float
V+
GND
Float
V+
49
4A
4B
4C
4D
4E
4F
50
GND
Float
V+
GND
Float
V+
V+
V+
8.5.1.4 Read and Write Operations
Accessing a particular register on the TMP461 device is accomplished by writing the appropriate value to the
pointer register. The value for the pointer register is the first byte transferred after the slave address byte with the
R/W bit low. Every write operation to the TMP461 device requires a value for the pointer register (see Figure 15).
When reading from the TMP461 device, the last value stored in the pointer register by a write operation is used
to determine which register is read by a read operation. To change which register is read for a read operation, a
new value must be written to the pointer register. This transaction is accomplished by issuing a slave address
byte with the R/W bit low, followed by the pointer register byte; no additional data are required. The master can
then generate a start condition and send the slave address byte with the R/W bit high to initiate the read
command; see Figure 16 for details of this sequence.
If repeated reads from the same register are desired, continually sending the pointer register bytes is not
necessary because the TMP461 retains the pointer register value until it is changed by the next write operation.
The register bytes are sent MSB first, followed by the LSB.
Terminate read operations by issuing a not-acknowledge command at the end of the last byte to be read. For a
single-byte operation, the master must leave the SDA line high during the acknowledge time of the first byte that
is read from the slave.
8.5.1.5 Timeout Function
The TMP461 device resets the serial interface if either SCL or SDA are held low for 25 ms (typical) between a
start and stop condition. If the TMP461 device is holding the bus low, the device releases the bus and waits for a
start condition. To avoid activating the timeout function, maintaining a communication speed of at least 1 kHz for
the SCL operating frequency is necessary.
8.5.1.6 High-Speed Mode
For the two-wire bus to operate at frequencies above 1 MHz, the master device must issue a high-speed mode
(HS-mode) master code (0000 1xxx) as the first byte after a start condition to switch the bus to high-speed
operation. The TMP461 device does not acknowledge this byte, but switches the input filters on SDA and SCL
and the output filter on SDA to operate in HS-mode, thus allowing transfers at up to 2.17 MHz. After the HS-
mode master code is issued, the master transmits a two-wire slave address to initiate a data transfer operation.
The bus continues to operate in HS-mode until a stop condition occurs on the bus. Upon receiving the stop
condition, the TMP461 device switches the input and output filters back to fast mode operation.
8.5.2 General-Call Reset
The TMP461 device supports reset using the two-wire general-call address 00h (0000 0000b). The TMP461
device acknowledges the general-call address and responds to the second byte. If the second byte is 06h (0000
0110b), the TMP461 device executes a software reset. This software reset restores the power-on reset state to
all TMP461 registers and aborts any conversion in progress. The TMP461 device takes no action in response to
other values in the second byte.
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8.6 Register Map
Table 4. Register Map
BIT DESCRIPTION
POINTER READ POINTER WRITE
(HEX)
00
01
02
03
04
05
06
07
08
N/A
10
11
12
13
14
15
16
19
20
21
22
23
24
FE
(HEX)
N/A
N/A
N/A
09
POR (HEX)
00
7
LT11
RT11
BUSY
MASK1
0
6
LT10
RT10
LHIGH
SD
5
LT9
4
LT8
3
LT7
RT7
RLOW
0
2
LT6
1
LT5
0
LT4
RT4
LTHRM
0
REGISTER DESCRIPTION
Local Temperature Register (high byte)
Remote Temperature Register (high byte)
Status Register
00
RT9
RT8
RHIGH
0
RT6
OPEN
RANGE
CR2
LTHL6
LTLL6
RTHL6
RTLL6
X
RT5
RTHRM
0
N/A
00
LLOW
ALERT/THERM2
0
Configuration Register
0A
0B
0C
0D
0E
0F
08
0
0
CR3
LTHL7
LTLL7
RTHL7
RTLL7
X
CR1
LTHL5
LTLL5
RTHL5
RTLL5
X
CR0
LTHL4
LTLL4
RTHL4
RTLL4
X
Conversion Rate Register
7F
LTHL11
LTLL11
RTHL11
RTLL11
X
LTHL10
LTLL10
RTHL10
RTLL10
X
LTHL9
LTLL9
RTHL9
RTLL9
X
LTHL8
LTLL8
RTHL8
RTLL8
X
Local Temperature High Limit Register
Local Temperature Low Limit Register
Remote Temperature High Limit Register (high byte)
Remote Temperature Low Limit Register (high byte)
One-Shot Start Register(1)
80
7F
80
N/A
00
N/A
11
RT3
RT2
RT1
RT0
RTOS8
RTOS0
RTHL0
RTLL0
LT0
0
0
0
0
Remote Temperature Register (low byte)
Remote Temperature Offset Register (high byte)
Remote Temperature Offset Register (low byte)
Remote Temperature High Limit Register (low byte)
Remote Temperature Low Limit Register (low byte)
Local Temperature Register (low byte)
Channel Enable Register
00
RTOS11
RTOS3
RTHL3
RTLL3
LT3
RTOS10
RTOS2
RTHL2
RTLL2
LT2
RTOS9
RTOS1
RTHL1
RTLL1
LT1
RTOS7
0
RTOS6
0
RTOS5
0
RTOS4
0
12
00
13
F0
0
0
0
0
14
00
0
0
0
0
N/A
16
00
0
0
0
0
03
0
0
0
0
0
0
REN
RTH5
LTH5
HYS5
CONAL0
NC1
DF1
0
LEN
RTH4
LTH4
HYS4
1
19
7F
RTH11
LTH11
HYS11
0
RTH10
LTH10
HYS10
0
RTH9
LTH9
HYS9
0
RTH8
LTH8
HYS8
0
RTH7
LTH7
HYS7
CONAL2
NC3
0
RTH6
LTH6
HYS6
CONAL1
NC2
0
Remote Temperature THERM Limit Register
Local Temperature THERM Limit Register
THERM Hysteresis Register
20
7F
21
0A
01
22
Consecutive ALERT Register
23
00
NC7
NC6
NC5
NC4
0
NC0
DF0
1
η-Factor Correction Register
24
00
0
0
0
Digital Filter Control Register
N/A
55
0
1
0
1
0
1
Manufacturer Identification Register
(1) X = undefined. Writing any value to this register initiates a one-shot start; see the One-Shot Conversion section.
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8.6.1 Register Information
The TMP461 device contains multiple registers for holding configuration information, temperature measurement
results, and status information. These registers are described in Figure 17 and Table 4.
8.6.1.1 Pointer Register
Figure 17 shows the internal register structure of the TMP461 device. The 8-bit pointer register is used to
address a given data register. The pointer register identifies which of the data registers must respond to a read
or write command on the two-wire bus. This register is set with every write command. A write command must be
issued to set the proper value in the pointer register before executing a read command. Table 4 describes the
pointer register and the internal structure of the TMP461 registers. The power-on reset (POR) value of the
pointer register is 00h (0000 0000b).
Pointer Register
Local and Remote Temperature Registers
Status Register
Configuration Register
Conversion Rate Register
SDA
Local and Remote Temperature Limit Registers
One-Shot Start Register
I/O
Remote Temperature Offset Registers
Local and Remote THERM Limit Registers
THERM Hysteresis Register
Control
Interface
Consecutive ALERT Register
N-factor Correction Register
SCL
Digital Filter Register
Manufacturer ID Register
Figure 17. Internal Register Structure
8.6.1.2 Local and Remote Temperature Registers
The TMP461 device has multiple 8-bit registers that hold temperature measurement results. The eight most
significant bits (MSBs) of the local temperature sensor result are stored in register 00h, and the four least
significant bits (LSBs) are stored in register 15h (the four MSBs of register 15h). The eight MSBs of the remote
temperature sensor result are stored in register 01h, and the four LSBs are stored in register 10h (the four MSBs
of register 10h). The four LSBs of both the local and remote sensor indicate the temperature value after the
decimal point (for example, if the temperature result is 10.0625°C, then the high byte is 0000 1010 and the low
byte is 0001 0000). These registers are read-only and are updated by the ADC each time a temperature
measurement is completed.
When the full temperature value is needed, reading the MSB value first causes the LSB value to be locked (the
ADC does not write to it) until the LSB value is read. The same thing happens upon reading the LSB value first
(the MSB value is locked until it is read). This mechanism assures that both bytes of the read operation are from
the same ADC conversion. This assurance remains valid only until another register is read. For proper operation,
read the high byte of the temperature result first. Read the low byte register in the next read command; if the
LSBs are not needed, the register can be left unread. The power-on reset value of all temperature registers is
00h.
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8.6.1.3 Status Register
The status register reports the state of the temperature ADC, the temperature limit comparators, and the
connection to the remote sensor. Table 5 lists the status register bits. The status register is read-only and is read
by accessing pointer address 02h.
Table 5. Status Register Format
STATUS REGISTER (Read = 02h, Write = N/A)
BIT NUMBER
BIT NAME
FUNCTION
7
6
5
4
3
2
1
0
BUSY
= 1 when the ADC is converting
LHIGH(1)
LLOW(1)
RHIGH(1)
RLOW(1)
OPEN(1)
RTHRM
LTHRM
= 1 when the local high temperature limit is tripped
= 1 when the local low temperature limit is tripped
= 1 when the remote high temperature limit is tripped
= 1 when the remote low temperature limit is tripped
= 1 when the remote sensor is an open circuit
= 1 when the remote THERM limit is tripped
= 1 when the local THERM limit is tripped
(1) These flags stay high until the status register is read or are reset by a POR when pin 7 is configured as ALERT. Only bit 2 (OPEN) stays
high until the status register is read or is reset by a POR when pin 7 is configured as THERM2.
The BUSY bit = 1 if the ADC is making a conversion. This bit is set to 0 if the ADC is not converting.
The LHIGH and LLOW bits indicate a local sensor overtemperature or undertemperature event, respectively. The
RHIGH and RLOW bits indicate a remote sensor overtemperature or undertemperature event, respectively. The
HIGH bit is set when the temperature exceeds the high limit in alert mode and therm mode and the low bit is set
when the temperature goes below the low limit in alert mode. The OPEN bit indicates an open-circuit condition
on the remote sensor. When pin 7 is configured as the ALERT output, the five flags are NORed together. If any
of the five flags are high, the ALERT interrupt latch is set and the ALERT output goes low. Reading the status
register clears the five flags, provided that the condition that caused the setting of the flags is not present
anymore (that is, the value of the corresponding result register is within the limits, or the remote sensor is
connected properly and functional). The ALERT interrupt latch (and the ALERT pin correspondingly) is not reset
by reading the status register. The reset is done by the master reading the temperature sensor device address to
service the interrupt, and only if the flags are reset and the condition that caused them to be set is no longer
present.
The RTHRM and LTHRM flags are set when the corresponding temperature exceeds the programmed THERM
limit. These flags are reset automatically when the temperature returns to within the limits. The THERM output
goes low in the case of overtemperature on either the local or remote channel, and goes high as soon as the
measurements are within the limits again. The THERM hysteresis register (21h) allows hysteresis to be added so
that the flag resets and the output goes high when the temperature returns to or goes below the limit value minus
the hysteresis value.
When pin 7 is configured as THERM2, only the high limits matter. The LHIGH and RHIGH flags are set if the
respective temperatures exceed the limit values, and the pin goes low to indicate the event. The LLOW and
RLOW flags have no effect on THERM2 and the output behaves the same way when configured as THERM.
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8.6.1.4 Configuration Register
The configuration register sets the temperature range, the ALERT/THERM modes, and controls the shutdown
mode. The configuration register is set by writing to pointer address 09h, and is read by reading from pointer
address 03h. Table 6 summarizes the bits of the configuration register.
Table 6. Configuration Register Bit Descriptions
CONFIGURATION REGISTER (Read = 03h, Write = 09h, POR = 00h)
BIT NUMBER
NAME
FUNCTION
POWER-ON RESET VALUE
0 = ALERT enabled
1 = ALERT masked
7
MASK1
0
0 = Run
1 = Shut down
6
SD
0
0 = ALERT
1 = THERM2
5
ALERT/THERM2
Reserved
0
0
0
0
4:3
2
—
0 = –40°C to +127°C
1 = –64°C to +191°C
RANGE
1:0
Reserved
—
MASK1 (bit 7) of the configuration register masks the ALERT output. If MASK1 is 0 (default), the ALERT output
is enabled. If MASK1 is set to 1, the ALERT output is disabled. This configuration applies only if the value of
ALERT/THERM2 (bit 5) is 0 (that is, pin 7 is configured as the ALERT output). If pin 7 is configured as the
THERM2 output, the value of the MASK1 bit has no effect.
The shutdown bit (SD, bit 6) enables or disables the temperature-measurement circuitry. If SD = 0 (default), the
TMP461 device converts continuously at the rate set in the conversion rate register. When SD is set to 1, the
TMP461 device stops converting when the current conversion sequence is complete and enters a shutdown
mode. When SD is set to 0 again, the TMP461 resumes continuous conversions. When SD = 1, a single
conversion can be started by writing to the one-shot start register; see the One-Shot Start Register section for
more information.
ALERT/THERM2 (bit 5) sets the configuration of pin 7. If the ALERT/THERM2 bit is 0 (default), then pin 7 is
configured as the ALERT output; if this bit is set to 1, then pin 7 is configured as the THERM2 output.
The temperature range is set by configuring RANGE (bit 2) of the configuration register. Setting this bit low
(default) configures the TMP461 device for the standard measurement range (–40°C to +127°C); temperature
conversions are stored in the standard binary format. Setting bit 2 high configures the TMP461 device for the
extended measurement range (–64°C to +191°C); temperature conversions are stored in the extended binary
format (see Table 1).
The remaining bits of the configuration register are reserved and must always be set to 0. The power-on reset
value for this register is 00h.
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8.6.1.5 Conversion Rate Register
The conversion rate register (read address 04h, write address 0Ah) controls the rate at which temperature
conversions are performed. This register adjusts the idle time between conversions but not the conversion time
itself, thereby allowing the TMP461 power dissipation to be balanced with the temperature register update rate.
Table 7 lists the conversion rate options and corresponding time between conversions. The default value of the
register is 08h, which gives a default rate of 16 conversions per second.
Table 7. Conversion Rate
VALUE
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
CONVERSIONS PER SECOND
TIME (Seconds)
0.0625
16
0.125
8
0.25
4
0.5
2
1
1
0.5
2
4
0.25
8
16 (default)
32
0.125
0.0625 (default)
0.03125
8.6.1.6 One-Shot Start Register
When the TMP461 device is in shutdown mode (SD = 1 in the configuration register), a single conversion is
started by writing any value to the one-shot start register, pointer address 0Fh. This write operation starts one
conversion and comparison cycle on either both the local and remote sensors or on only one or the other sensor,
depending on the LEN and REN values configured in the channel enable register (read address 16h, write
address 16h). The TMP461 device returns to shutdown mode when the cycle completes. The value of the data
sent in the write command is irrelevant and is not stored by the TMP461 device.
8.6.1.7 Channel Enable Register
The channel enable register (read address 16h, write address 16h) enables or disables the temperature
conversion of remote and local temperature sensors. LEN (bit 0) of the channel enable register enables/disables
the conversion of local temperature. REN (bit 1) of the channel enable register enables/disables the conversion
of remote temperature. Both LEN and REN are set to 1 (default), this enables the ADC to convert both local and
remote temperatures. If LEN is set to 0, the local temperature conversion is disabled and similarly if REN is set
to 0, the remote temperature conversion is disabled.
Both local and remote temperatures are converted by the internal ADC as a default mode. Channel Enable
register can be configured to achieve power savings by reducing the total ADC conversion time to half for
applications that do not require both remote and local temperature information.
8.6.1.8 Consecutive ALERT Register
The Consecutive ALERT register (read address 22h, write address 22h) controls the number of out-of-limit
temperature measurements required for ALERT to be asserted. Table 8 summarizes the values of the
consecutive ALERT register. The number programmed in the consecutive ALERT applies to both the remote and
local temperature results. When the number of times that the temperature result consecutively exceeds the high
limit register value is equal to the value programmed in the consecutive ALERT register, ALERT is asserted.
Similarly, the consecutive ALERT register setting is also applicable to the low-limit register.
Table 8. Consecutive ALERT
REGISTER VALUE
NUMBER OF OUT-OF-LIMIT MEASUREMENTS REQUIRED TO ASSERT ALERT
01h
03h
07h
0Fh
1 (default)
2
3
4
Copyright © 2015–2016, Texas Instruments Incorporated
21
TMP461
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
www.ti.com.cn
8.6.1.9 η-Factor Correction Register
The TMP461 device allows for a different η-factor value to be used for converting remote channel measurements
to temperature. The remote channel uses sequential current excitation to extract a differential VBE voltage
measurement to determine the temperature of the remote transistor. Equation 1 shows this voltage and
temperature.
hkT
I2
I1
VBE2 - VBE1
=
ln
q
(1)
The value η in Equation 1 is a characteristic of the particular transistor used for the remote channel. The power-
on reset value for the TMP461 device is η = 1.008. The value in the η-factor correction register can be used to
adjust the effective η-factor according to Equation 2 and Equation 3.
≈
∆
«
’
÷
◊
1.008 ì 2088
2088 + NADJUST
ꢀeff
=
(2)
≈
∆
«
’
÷
◊
1.008 ì 2088
NADJUST
=
- 2088
ꢀeff
(3)
The η-factor correction value must be stored in twos complement format, yielding an effective data range from
–128 to 127. The η-factor correction value is written to and read from pointer address 23h. The register power-on
reset value is 00h, thus having no effect unless a different value is written to it. The resolution of the η-factor
register is 0.000483.
Table 9. η-Factor Range
NADJUST
BINARY
HEX
7F
0A
08
DECIMAL
η
0111 1111
0000 1010
0000 1000
0000 0110
0000 0100
0000 0010
0000 0001
0000 0000
1111 1111
1111 1110
1111 1100
1111 1010
1111 1000
1111 0110
1000 0000
127
10
8
0.950205
1.003195
1.004153
1.005112
1.006073
1.007035
1.007517
1.008
06
6
04
4
02
2
01
1
00
0
FF
FE
FC
FA
F8
F6
80
–1
–2
–4
–6
–8
–10
–128
1.008483
1.008966
1.009935
1.010905
1.011877
1.012851
1.073829
8.6.1.10 Remote Temperature Offset Register
The offset register allows the TMP461 device to store any system offset compensation value that may result from
precision calibration. The value in the register is stored in the same format as the temperature result, and is
added to the remote temperature result upon every conversion. Combined with the η-factor correction, this
function allows for very accurate system calibration over the entire temperature range.
8.6.1.11 Manufacturer Identification Register
The TMP461 device allows for the two-wire bus controller to query the device for manufacturer and device IDs to
enable software identification of the device at the particular two-wire bus address. The manufacturer ID is
obtained by reading from pointer address FEh. The TMP461 device reads 55h for the manufacturer code.
22
Copyright © 2015–2016, Texas Instruments Incorporated
TMP461
www.ti.com.cn
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TMP461 device requires only a transistor connected between the D+ and D– pins for remote temperature
measurement. Tie the D+ pin to GND if the remote channel is not used and only the local temperature is
measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output) require pullup
resistors as part of the communication bus. A 0.1-µF power-supply decoupling capacitor is recommended for
local bypassing. Figure 18 and Figure 19 illustrate the typical configurations for the TMP461 device.
9.2 Typical Application
1.7V to 3.6V
(2)
RS
10kꢀ
(typ)
10kꢀ
(typ)
10kꢀ
(typ)
10kꢀ
(typ)
0.1µF
(3)
CDIFF
(2)
RS
10
A1
Diode-connected configuration(1)
1
2
3
4
9
8
7
6
V+
SCL
SDA
Series Resistance
(2)
RS
D+
D-
SMBus
Controller
(3)
CDIFF
TMP461
(2)
RS
ALERT /
THERM2
GND
THERM
Transistor-connected configuration(1)
A0
5
Over-Temperature Shutdown
(1) The diode-connected configuration provides better settling time. The transistor-connected configuration provides
better series resistance cancellation.
(2) RS (optional) is < 1 kΩ in most applications. RS is the combined series resistance connected externally to the D+, D-
pins. RS selection depends on the application; see the Filtering section.
(3) CDIFF (optional) is < 1000 pF in most applications. CDIFF selection depends on the application; see the Filtering
section and Figure 6 (Remote Temperature Error vs Differential Capacitance).
Figure 18. TMP461 Basic Connections Using a Discrete Remote Transistor
Copyright © 2015–2016, Texas Instruments Incorporated
23
TMP461
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
www.ti.com.cn
Typical Application (continued)
1.7 V to 3.6 V
1.7 V to 3.6 V
10
A1
Processor or ASIC
1
2
3
4
9
8
7
6
V+
D+
D-
SCL
SDA
TMP461
SMBus
Controller
Built-In Thermal
Transistor, Diode
ALERT/THERM2
GND
THERM
A0
5
Overtemperature Shutdown
Figure 19. TMP461 Basic Connections Using a Processor Built-In Remote Transistor
9.2.1 Design Requirements
The TMP461 device is designed to be used with either discrete transistors or substrate transistors built into
processor chips and application-specific integrated circuits (ASICs). Either NPN or PNP transistors can be used,
as long as the base-emitter junction is used as the remote temperature sense. NPN transistors must be diode-
connected. PNP transistors can either be transistor- or diode-connected (see Figure 18).
Errors in remote temperature sensor readings are typically the consequence of the ideality factor and current
excitation used by the TMP461 device versus the manufacturer-specified operating current for a given transistor.
Some manufacturers specify a high-level and low-level current for the temperature-sensing substrate transistors.
The TMP461 device uses 7.5 μA for ILOW and 120 μA for IHIGH
.
The ideality factor (η) is a measured characteristic of a remote temperature sensor diode as compared to an
ideal diode. The TMP461 allows for different η-factor values; see the η-Factor Correction Register section.
The ideality factor for the TMP461 device is trimmed to be 1.008. For transistors that have an ideality factor that
does not match the TMP461, Equation 4 can be used to calculate the temperature error.
NOTE
For Equation 4 to be used correctly, the actual temperature (°C) must be converted to
Kelvin (K).
h - 1.008
TERR
=
´ (273.15 + T(°C))
1.008
where
•
•
•
TERR = error in the TMP461 device because η ≠ 1.008,
η = ideality factor of the remote temperature sensor,
T(°C) = actual temperature, and
(4)
In Equation 4, the degree of delta is the same for °C and K.
24
Copyright © 2015–2016, Texas Instruments Incorporated
TMP461
www.ti.com.cn
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
Typical Application (continued)
For η = 1.004 and T(°C) = 100°C:
1.004 - 1.008
1.008
≈
’
TERR
=
ì 273.15 + 100èC
(
)
∆
÷
◊
«
TERR = -1.48èC
(5)
If a discrete transistor is used as the remote temperature sensor with the TMP461, the best accuracy can be
achieved by selecting the transistor according to the following criteria:
1. Base-emitter voltage is > 0.25 V at 7.5 μA, at the highest-sensed temperature.
2. Base-emitter voltage is < 0.95 V at 120 μA, at the lowest-sensed temperature.
3. Base resistance is < 100 Ω.
4. Tight control of VBE characteristics indicated by small variations in hFE (that is, 50 to 150).
Based on this criteria, two recommended small-signal transistors are the 2N3904 (NPN) or 2N3906 (PNP).
9.2.2 Detailed Design Procedure
The local temperature sensor inside the TMP461 device monitors the ambient air around the device. The thermal
time constant for the TMP461 device is approximately two seconds. This constant implies that if the ambient air
changes quickly by 100°C, then the TMP461 device takes approximately 10 seconds (that is, five thermal time
constants) to settle to within 1°C of the final value. In most applications, the TMP461 package is in electrical, and
therefore thermal, contact with the printed circuit board (PCB), as well as subjected to forced airflow. The
accuracy of the measured temperature directly depends on how accurately the PCB and forced airflow
temperatures represent the temperature that the TMP461 is measuring. Additionally, the internal power
dissipation of the TMP461 can cause the temperature to rise above the ambient or PCB temperature. The
internal power dissipated as a result of exciting the remote temperature sensor is negligible because of the small
currents used. Equation 6 can be used to calculate the average conversion current for power dissipation and
self-heating based on the number of conversions per second and temperature sensor channel enabled.
Equation 7 shows an example with local and remote sensor channels enabled and 16 conversions per second;
see the Electrical Characteristics table for typical values required for these calculations. For a 3.3-V supply and a
conversion rate of 16 conversions per second, the TMP461 device dissipates 0.531 mW (PDIQ = 3.3 V × 161 μA)
when both the remote and local channels are enabled.
Average Conversion Current = Local ADC Conversion Time ∂ Conversions per Second ∂ Local Active I
(
)
(
)
(
)
Q
+ Remote ADC Conversion Time ∂ Conversions per Second ∂ Remote Active I
(
)
(
)
(
)
Q
»
ÿ
+ Standby Mode I ∂ 1- Local ADC Conversion Time + Remote ADC Conversion Time ∂ Conversions per Second
(
)
(
)
Q
⁄
(6)
16
s
≈
’
Average Conversion Current = 15 ms
∂ 240 ꢀA
(
(
)
)
∆
«
÷
◊
16
s
≈
’
+ 15 ms ∂
∂ 400 ꢀA
(
(
)
)
∆
÷
«
◊
»
ÿ
16
s
≈
’
+ 15 ꢀA ∂ 1- 15 ms + 15 ms ∂
(
)
(
)
…
Ÿ
⁄
∆
«
÷
◊
= 161 ꢀA
(7)
The temperature measurement accuracy of the TMP461 device depends on the remote and local temperature
sensor being at the same temperature as the system point being monitored. If the temperature sensor is not in
good thermal contact with the part of the system being monitored, then there is a delay between the sensor
response and the system changing temperature. This delay is usually not a concern for remote temperature-
sensing applications that use a substrate transistor (or a small, SOT23 transistor) placed close to the device
being monitored.
Copyright © 2015–2016, Texas Instruments Incorporated
25
TMP461
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
www.ti.com.cn
Typical Application (continued)
9.2.3 Application Curve
Figure 20 shows the typical step response to submerging a sensor in an oil bath with a temperature of 100°C.
100
85
70
55
40
25
-1
1
3
5
7
9
11
13
15
17
19
Time (s)
Figure 20. Temperature Step Response
10 Power Supply Recommendations
The TMP461 device operates with a power-supply range of 1.7 V to 3.6 V. The device is optimized for operation
at a 3.3-V supply but can measure temperature accurately in the full supply range.
A power-supply bypass capacitor is recommended. Place this capacitor as close as possible to the supply and
ground pins of the device. A typical value for this supply bypass capacitor is 0.1 μF. Applications with noisy or
high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise.
26
Copyright © 2015–2016, Texas Instruments Incorporated
TMP461
www.ti.com.cn
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
11 Layout
11.1 Layout Guidelines
Remote temperature sensing on the TMP461 device measures very small voltages using very low currents;
therefore, noise at the device inputs must be minimized. Most applications using the TMP461 have high digital
content, with several clocks and logic-level transitions that create a noisy environment. Layout must adhere to
the following guidelines:
1. Place the TMP461 device as close to the remote junction sensor as possible.
2. Route the D+ and D– traces next to each other and shield them from adjacent signals through the use of
ground guard traces, as shown in Figure 21. If a multilayer PCB is used, bury these traces between the
ground or V+ planes to shield them from extrinsic noise sources. 5-mil (0.127 mm) PCB traces are
recommended.
3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are
used, make the same number and approximate locations of copper-to-solder connections in both the D+ and
D– connections to cancel any thermocouple effects.
4. Use a 0.1-μF local bypass capacitor directly between the V+ and GND of the TMP461 device. For optimum
measurement performance, minimize filter capacitance between D+ and D– to 1000 pF or less. This
capacitance includes any cable capacitance between the remote temperature sensor and the TMP461
device.
5. If the connection between the remote temperature sensor and the TMP461 device is less than 8-in
(20.32 cm) long, use a twisted-wire pair connection. For lengths greater than 8 in, use a twisted, shielded
pair with the shield grounded as close to the TMP461 device as possible. Leave the remote sensor
connection end of the shield wire open to avoid ground loops and 60-Hz pickup.
6. Thoroughly clean and remove all flux residue in and around the pins of the TMP461 device to avoid
temperature offset readings as a result of leakage paths between D+ and GND, or between D+ and V+.
V+
D+
Ground or V+ layer
on bottom and top,
if possible.
D-
GND
NOTE: Use a minimum of 5-mil (0.127 mm) traces with 5-mil spacing.
Figure 21. Suggested PCB Layer Cross-Section
Copyright © 2015–2016, Texas Instruments Incorporated
27
TMP461
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
www.ti.com.cn
11.2 Layout Example
VIA to Power or Ground Plane
VIA to Internal Layer
Ground Plane
Pullup Resistors
Supply Voltage
Supply Bypass
Capacitor
10
A1
1
2
3
4
9
8
7
6
V+
D+
SCL
SDA
RS
CDIFF
ALERT /
THERM2
RS
D-
Thermal
Shutdown
A0
5
GND
THERM
Serial Bus Traces
Figure 22. TMP461 Layout Example
28
版权 © 2015–2016, Texas Instruments Incorporated
TMP461
www.ti.com.cn
ZHCSDW3B –JUNE 2015–REVISED AUGUST 2016
12 器件和文档支持
12.1 接收文档更新通知
如需接收文档更新通知，请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册
后，即可每周定期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。
12.2 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 商标
E2E is a trademark of Texas Instruments.
SMBus is a trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
12.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏
版权 © 2015–2016, Texas Instruments Incorporated
29
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMP461AIRUNR-S
TMP461AIRUNT-S
ACTIVE
ACTIVE
QFN
QFN
RUN
RUN
10
10
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
ZDW1
ZDW1
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP461AIRUNR-S
TMP461AIRUNT-S
QFN
QFN
RUN
RUN
10
10
3000
250
178.0
178.0
8.4
8.4
2.25
2.25
2.25
2.25
1.0
1.0
4.0
4.0
8.0
8.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP461AIRUNR-S
TMP461AIRUNT-S
QFN
QFN
RUN
RUN
10
10
3000
250
205.0
205.0
200.0
200.0
33.0
33.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RUN 10
2 X 2, 0.5 mm pitch
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4228249/A
www.ti.com
PACKAGE OUTLINE
RUN0010A
WQFN - 0.8 mm max height
S
C
A
L
E
5
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
2.1
1.9
B
A
PIN 1 INDEX AREA
2.1
1.9
0.8
0.7
C
SEATING PLANE
0.08 C
0.05
0.00
SYMM
5
(0.2) TYP
4
6
SYMM
2X 1.5
6X 0.5
9
1
0.3
0.2
10X
10
PIN 1 ID
0.1
C A B
0.6
10X
0.05
0.4
4220470/A 05/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
RUN0010A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
10
SEE SOLDER MASK
DETAIL
10X (0.7)
1
10X (0.25)
9
SYMM
(1.7)
6X (0.5)
(R0.05) TYP
6
4
5
(1.7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4220470/A 05/2020
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RUN0010A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
10X (0.7)
10
1
10X (0.25)
9
SYMM
(1.7)
6X (0.5)
(R0.05) TYP
6
4
5
SYMM
(1.7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 20X
4220470/A 05/2020
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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