TMS370C736A [TI]
8-BIT MICROCONTROLLER; 8位微控制器型号: | TMS370C736A |
厂家: | TEXAS INSTRUMENTS |
描述: | 8-BIT MICROCONTROLLER |
文件: | 总48页 (文件大小:711K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
FZ AND FN PACKAGES
(TOP VIEW)
CMOS/EEPROM/EPROM Technologies on
a Single Device
– Mask-ROM Devices for High-Volume
Production
– One-Time-Programmable (OTP) EPROM
Devices for Low-Volume Production
– Reprogrammable-EPROM Devices for
Prototyping Purposes
Internal System Memory Configurations
– On-Chip Program Memory Versions
– ROM: 16K Bytes
6
5
4
3
2
1 44 43 42 41 40
39
AN3
AN4
A5
7
A4
8
38
37
36
35
34
33
32
31
AN5
A3
9
AN6
A2
10
11
12
13
14
15
16
17
AN7
A1
– EPROM: 16K Bytes
D6/CP6
D7/CP5
D4/CP4
D5/CP1
OP1/CP3
OP2/CP2
A0
– Data EEPROM: 256 Bytes
– Static RAM: 256 Bytes Usable as
Registers
– Standby RAM With Separate Power
Supply Pin: 256 Bytes
MC
RESET
SPICLK
30 SPISOMI
29 SPISIMO
18 19 20 21 22 23 24 25 26 27 28
Flexible Operating Features
– Low-Power Modes: STANDBY and HALT
– Commercial, Industrial, and Automotive
Temperature Ranges
– Clock Options
– Divide-by-1 (2 MHz–5 MHz SYSCLK)
Phase-Locked Loop (PLL)
– Divide-by-4 (0.5 MHz–5 MHz SYSCLK)
Serial Peripheral Interface (SPI)
– Variable-Length High-Speed Shift
Register
– Supply Voltage (V ) 5 V ±10%
CC
– Synchronous Master/Slave Operation
Programmable Acquisition and Control
Timer (PACT) Module
– Input Capture on up to Six Pins, Four of
Which Can Have a Programmable
Prescaler
– One Input Capture Pin Can Drive an 8-Bit
Event Counter
– Up to Eight Timer-Driven Outputs
– Interaction Between Event Counter and
Timer Activity
– 18 Independent Interrupt Vectors
– Watchdog With Selectable Time-Out
Period
– Asynchronous Mini Serial
Communication Interface (Mini SCI)
Flexible Interrupt Handling
– Two Software-Programmable Interrupt
Levels
Eight Channel 8-Bit Analog-to-Digital
Converter 1 (ADC1)
TMS370 Series Compatibility
– Register-to-Register Architecture
– 256 General-Purpose Registers
– 14 Powerful Addressing Modes
– Instructions Upwardly Compatible With
All TMS370 Devices
CMOS/TTL Compatible I/O Pins/Packages
– All Peripheral Function Pins Software
Configurable for Digital I/O
– 16 Bidirectional Pins, Nine Input Pins
– 44-Pin Plastic and Ceramic Leaded Chip
Carrier (LCC) Packages
Workstation/PC-Based Development
System
– C Compiler and C Source Debugger
– Real-Time In-Circuit Emulation
– Multi-Window User Interface
– Microcontroller Programmer
– Global- and Individual-Interrupt Masking
– Programmable Rising- or Falling-Edge
Detect
– Individual-Interrupt Vectors
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
Pin Descriptions
44 PINS
†
DESCRIPTION
I/O
NAME
NO.
A0
A1
A2
A3
A4
A5
A6
A7
34
35
36
37
38
39
40
41
I / O
Port A is a general-purpose bidirectional I/O port.
D3
27
14
15
12
13
Port D is a general-purpose bidirectional port. Also configurable as SYSCLK (see Note 1)
PACT input capture 4 (see Note 2)
PACT input capture 1 (see Note 2)
PACT input capture 6 (see Note 2)
PACT input capture 5 (see Note 2)
D4/CP4
D5/CP1
D6/CP6
D7/CP5
I / O
AN0/E0
AN1/E1
AN2/E2
AN3/E3
AN4/E4
AN5/E5
AN6/E6
AN7/E7
4
5
6
7
8
9
10
11
ADC1 analog input pins (AN0–AN7)/port E digital input pins (E0–E7)
Port E can be programmed individually as a general-purpose digital input pin if it is not used as ADC1 analog
input or positive reference input.
I
I
INT1
28
External interrupt (non-maskable or maskable)/general-purpose input pin
OP1/CP3
OP2/CP2
OP3
OP4
OP5
OP6
OP7
OP8
16
17
21
22
23
24
25
26
PACT PWM output 1/input capture 3 (see Note 3)
PACT output pin 2/input capture 2 (see Note 3)
PACT PWM output 3
PACT PWM output 4
PACT PWM output 5
PACT PWM output 6
PACT PWM output 7
PACT PWM output 8
O
SCIRXD
SCITXD
19
20
I
O
PACT mini SCI data receive input pin
PACT mini SCI data transmit output pin
SPISOMI
SPISIMO
SPICLK
30
29
31
SPI slave output pin, master input pin/general-purpose bidirectional pin
SPI slave input pin, master output pin/general-purpose bidirectional pin
SPI bidirectional serial clock pin/general-purpose bidirectional pin
I / O
System reset bidirectional pin; as input pin, RESET initializes the microcontroller; as open-drain output,
RESET indicates that an internal failure was detected by watchdog or oscillator fault circuit.
RESET
MC
32
33
I / O
I
Mode control input pin; enables EEPROM write protection override (WPO) mode, also EPROM V
PP
XTAL2/CLKIN
XTAL1
43
44
I
O
Internal oscillator crystal input/External clock source input
Internal oscillator output for crystal
V
V
V
V
V
1
18
2
3
42
Positive supply voltage for digital logic and digital I/O pins
Ground reference for digital logic and digital I/O pins
ADC1 positive supply voltage and optional positive reference input
ADC1 ground supply and low reference input pin
CC1
SS1
CC3
SS3
Positive supply voltage pin for standby RAM
CCSTBY
†
I = input, O = output
NOTES: 1. D3 can be configured as SYSCLK by appropriately programming the DPORT1 and DPORT2 registers.
2. These digital I/O buffers are connected internally to some of the PACT module’s input capture pins. This allows the microcontroller
to read the level on the input capture pin, or if the port D pin is configured as an output, to generate a capture. Be careful to leave
the port D pin configured as an input if the corresponding input capture pin is being driven by external circuitry.
3. CP2 and CP3 are connected internally to OP2 and OP1. CP2 and CP3 can be used only to capture OP2 and OP1, respectively and
not as external capture inputs.
2
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
functional block diagram
E0-E7
or
AN0-AN7
XTAL2/
CLKIN
INT1
XTAL1
MC
RESET
Clock Options:
Divide-By-4 or
Divide-By-1 (PLL)
V
V
CC3
System
Control
A-to-D
Converter 1
Interrupts
SS3
Serial
Peripheral
Interface
SPISOMI
SPISIMO
SPICLK
RAM
Register File
256 Bytes
Standby RAM
256 Bytes
CPU
V
CCSTBY
CP1
Program Memory
ROM: 16K Bytes
EPROM: 16K Bytes
.
.
Data EEPROM
256 Bytes
CP6
OP1
PACT
.
.
OP8
128 BYTES
Dual Port
RAM
SCITXD
SCIRXD
Mini SCI
Watchdog
V
CC1
Port A
8
Port D
5
V
SS1
description
The TMS370C036, TMS370C736, and SE370C736 devices are members of the TMS370 family of single-chip
8-bit microcontrollers. Unless otherwise noted, the term TMS370Cx36 refers to these devices. The TMS370
family provides cost-effective real-time system control through advanced peripheral-function modules and
various on-chip memory configurations.
The TMS370Cx36 family of devices uses high-performance silicon-gate CMOS EPROM and EEPROM
technologies. Low operating power, wide operating temperature range, and noise immunity of CMOS
technology coupled with the high performance and extensive on-chip peripheral functions make the
TMS370Cx36 devices attractive for system designs for automotive electronics, industrial motors, computer
peripheral controls, telecommunications, and consumer applications.
All TMS370Cx36 devices contain the following on-chip peripheral modules:
Programmable acquisition and control timer (PACT)
–
–
Asynchronous mini SCI
PACT watchdog timer
Serial peripheral interface (SPI)
Eight channel, 8-bit analog-to-digital converter 1 (ADC1)
3
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
description (continued)
Table 1 provides a memory configuration overview of the TMS370Cx36 devices.
Table 1. Memory Configurations
PROGRAM MEMORY
(BYTES)
DATA MEMORY
(BYTES)
DEVICE
44 PIN PACKAGES
ROM
EPROM
RAM
EEPROM
TMS370C036A
TMS370C736A
16K
—
512
512
512
256
FN – PLCC
FN – PLCC
FZ – CLCC
—
—
16K
16K
256
†
SE370C736A
256
†
System evaluators and development are for use only in prototype environment, and their reliability has not been characterized.
The suffix letter A appended to the device names in Table 1 indicates the configuration of the devices. ROM
or EPROM devices have different configurations as indicated in Table 2. ROM devices with the suffix letter A
are configured through a programmable contact during manufacture.
Table 2. Suffix Letter Configuration
‡
DEVICE
CLOCK
LOW-POWER MODE
Enabled
EPROM A
ROM A
Divide-by-4 (Standard oscillator)
Divide-by-4 or Divide-by-1 (PLL)
Enabled or disabled
‡
Refer to the “device numbering conventions” section for device nomenclature and to the “device part numbers” section for ordering.
The 16K bytes of mask-programmable ROM in the associated TMS370Cx36 devices are replaced in the
TMS370C736 with 16K bytes of EPROM. All other available memory and on-chip peripherals are identical. The
OTP (TMS370C736) and reprogrammable (SE370C736) devices are available.
The TMS370C736 OTP device is available in a plastic package. This microcontroller is effective to use for
immediate production updates for other members of the TMS370Cx36 family or for low-volume production runs
when the mask charge or cycle time for the low-cost mask ROM devices is not practical.
The SE370C736 has a windowed ceramic package to allow reprogramming of the program EPROM memory
during the development/prototyping phase of design. The SE370C736 device allows quick updates to
breadboards and prototype systems while iterating initial designs.
The TMS370Cx36 family provides two low-power modes (STANDBY and HALT) for applications where
low-power consumption is critical. Both modes stop all CPU activity (that is, no instructions are executed). In
the STANDBY mode, the internal oscillator, the PACT counter, and PACT’s first command/definition entry
remain active. This allows the PACT module to bring the device out of STANDBY mode. In the HALT mode, all
device activity is stopped. The device retains all RAM data and peripheral configuration bits throughout both
low-power modes.
The TMS370Cx36 features advanced register-to-register architecture that allows direct arithmetic and logical
operations without requiring an accumulator (for example, ADD R24, R47; add the contents of register 24 to
the contents of register 47 and store the result in register 47). The TMS370Cx36 family is fully
instruction-set-compatible, providing easy transition between members of the family.
The TMS370Cx36 has a PACT module that acts as a timer coprocessor by gathering timing information on input
signals and controlling output signals with little or no intervention by the CPU. The coprocessor nature of this
module allows for levels of flexibility and power not found in traditional microcontroller timers.
4
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
description (continued)
TheTMS370Cx36familyprovidesthesystemdesignerwithaneconomical, efficientsolutiontoreal-timecontrol
applications. The PACT compact development tool (CDT ) meets the challenge of efficiently developing the
software and hardware required to design the TMS370Cx36 into an ever-increasing number of complex
applications. The application source code can be written in assembly and C language, and the output code can
be generated by the linker. Precise real-time in-circuit emulation and extensive symbolic debug and analysis
tools ensure efficient software and hardware implementation as well as a reduced time-to-market cycle.
The TMS370Cx36 family together with the TMS370 PACT CDT370, BP programmer, software tools,
SE370C736reprogrammable devices, comprehensive product documentation, and customer support provides
a complete solution to the needs of the system designer.
central processing unit (CPU)
TheCPUontheTMS370Cx36deviceisthehigh-performance8-bitTMS370CPUmodule. The’x36implements
an efficient register-to-register architecture that eliminates the conventional accumulator bottleneck. The
complete ’x36 instruction map is shown in Table 16.
The ’370Cx36 CPU architecture provides the following components:
CPU registers:
A stack pointer (SP) that points to the last entry in the memory stack
A status register (ST) that monitors the operation of the instructions and contains the global interrupt-enable
bits
A program counter (PC) that points to the memory location of the next instruction to be executed
A memory map that includes:
256-byte general-purpose RAM that can be used for data memory storage, program instructions, general
purpose register, or the stack
256-byte general-purpose standby RAM, which is powered through a separate V
pin to protect the
CCSTBY
memory against power failures on the main V
pins
CC1
128-byte dual-port RAM that contains the capture registers, the circular buffer, and a command/definition
area
A peripheral file that provides access to all internal peripheral modules, system-wide control functions, and
EEPROM/EPROM programming control
256-byte EEPROM module, that provides in-circuit programmability and data retention in power-off
conditions
16K-byte ROM or 16K-byte EPROM
CDT is a trademark of Texas Instruments Incorporated.
5
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
central processing unit (CPU) (continued)
Figure 1 Illustrates the CPU registers and memory blocks.
Program Counter
15
0
Legend:
Stack Pointer (SP)
7
0
C=Carry
N=Negative
Status Register (ST)
Z=Zero
C
7
N
6
Z
5
V
4
IE2 IE1
V=Overflow
IE2=Level 2 interrupts Enable
IE1=Level 1 interrupts Enable
3
2
1
0
RAM (Includes up to 256-Byte Registers File)
0000h
0000h
R0(A)
R1(B)
256-Byte RAM
00FFh
0100h
†
Reserved
0001h
0002h
0003h
017Fh
0180h
01FFh
0200h
02FFh
0300h
0FFFh
1000h
10BFh
10C0h
128-Byte PACT Dual-Port RAM
256-Byte Standby RAM
R2
R3
†
Reserved
Peripheral File
†
Reserved
1EFFh
1F00h
R127
R255
256-Byte Data EEPROM
007Fh
1FFFh
2000h
†
Reserved
3FFFh
4000h
16K-Byte ROM/EPROM
7F9Bh
7F9Ch
Interrupts and Reset Vectors;
Trap Vectors
7FFFh
8000h
00FFh
†
Reserved
FFFFh
†
Reserved means the address space is reserved for future expansion.
Figure 1. Programmer’s Model
stack pointer (SP)
The SP is an 8-bit CPU register. Stack operates as a last-in, first-out, read/write memory. Typically, the stack
is used to store the return address on subroutine calls as well as the ST contents during interrupt sequences.
The SP points to the last entry or top of the stack. The SP is incremented automatically before data is pushed
onto the stack and decremented after data is popped from the stack. The stack can be placed anywhere in the
on-chip RAM.
status register (ST)
The ST monitors the operation of the instructions and contains the global interrupt-enable bits. The ST includes
four status bits (condition flags) and two interrupt-enable bits.
The four status bits indicate the outcome of the previous instruction; conditional instructions (for example,
the conditional-jump instructions) use the status bits to determine program flow.
The two interrupt-enable bits control the two interrupt levels.
6
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
central processing unit (CPU) (continued)
The ST, status-bit notation, and status-bit definitions are shown in Table 3.
Table 3. Status Registers
7
C
6
N
5
Z
4
V
3
2
1
0
IE2
IE1
Reserved
Reserved
RW-0
RW-0
RW-0
RW-0
RW-0
RW-0
R = read, W = write, 0 = value after reset
program counter (PC)
The contents of the PC point to the memory location of the next instruction to be executed. The PC consists
of two 8-bit registers in the CPU: the program counter high (PCH) and program counter low (PCL). These
registers contain the most significant byte (MSbyte) and least significant byte (LSbyte) of a 16-bit address.
During reset, the contents of the reset vector (7FFEh, 7FFFh) are loaded into the PC. The PCH (MSbyte of the
PC) is loaded with the contents of memory location 7FFEh, and the PCL (LSbyte of the PC) is loaded with the
contents of memory location 7FFFh. Figure 2 shows this operation using an example value of 4000h as the
contents of the reset vector.
Program Counter (PC)
Memory
PCH
40
PCL
00
0000h
40
00
7FFEh
7FFFh
Figure 2. Program Counter After Reset
memory map
The TMS370Cx36 architecture is based on the Von Neuman architecture, where the program memory and data
memory share a common address space. All peripheral input/output is memory mapped in this same common
address space. As shown in Figure 3, the TMS370Cx36 provides memory-mapped RAM, ROM, EPROM, data
EEPROM, I/O pins, peripheral functions, and system-interrupt vectors.
The peripheral file contains all I/O port control, peripheral status and control, EEPROM, EPROM, and
system-wide control functions. The peripheral file is located between 1000h to 107Fh and is divided logically
into eight peripheral file frames of 16 bytes each. The eight PF frames consist of five control frames and three
reserved frames.Each on-chip peripheral is assigned to a separate frame through which peripheral control and
data information are passed.
7
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
central processing unit (CPU) (continued)
Peripheral File Control Registers
†
Reserved
1000h–100Fh
1010h–101Fh
1020h–102Fh
1030h–103Fh
0000h
System Control
256-Byte RAM
Digital Port Control
00FFh
0100h
017Fh
0180h
†
Reserved
SPI Peripheral Control
PACT Peripheral Control
1040h–104Fh
1050h–105Fh
1060h–106Fh
1070h–107Fh
128-Byte PACT Dual-Port RAM
256-Byte PACT Standby RAM
01FFh
0200h
†
Reserved
Reserved
02FFh
0300h
†
†
Reserved
ADC1 Peripheral Control
0FFFh
1000h
Vectors
Peripheral File
10BFh
10C0h
PACT Interrupt 1-18
Trap 15–0
7F9Ch–7FBFh
7FC0h–7FDFh
7FE0h–7FEBh
7FECh–7FEDh
7FEEh–7FF5h
7FF6h–7FF7h
†
Reserved
1EFFh
†
Reserved
1F00h
1FFFh
2000h
256-Byte Data EEPROM
ADC1
†
Reserved
†
Reserved
3FFFh
4000h
7F9Bh
7F9Ch
16K-Byte ROM/EPROM
Serial Peripheral Interface
†
Reserved
Interrupts and Reset Vectors;
Trap and PACT Vectors
7FF8h–7FFBh
7FFFh
8000h
Interrupt 1
Reset
7FFCh–7FFDh
7FFEh–7FFFh
†
Reserved
FFFFh
†
Reserved means that the address space is reserved for future expansion.
Figure 3. TMS370Cx36 Memory Map
RAM/register file (RF)
Locations within the RAM address space can serve as the RF, general-purpose read/write memory, program
memory, or the stack instructions. The TMS370Cx36 devices contain 256 bytes of internal RAM,
memory-mapped beginning at location 0000h (R0) and continuing through location 00FFh (R255) which is
shown in Figure 1.
The first two registers, R0 and R1, are also called register A and B, respectively. Some instructions implicitly
use register A or B; for example, the instruction LDSP (load SP) assumes that the value to be loaded into the
stack pointer is contained in register B. Registers A and B are the only registers cleared on reset.
dual-port RAM
The upper 128 bytes of the register files can be used by the PACT module to contain commands and definitions
as well as timer values. Any RAM not used by PACT can be used as an additional CPU register or as
general-purpose memory.
8
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
standby RAM module
The 256 byte standby RAM is general-purpose and powered through a separate V
pin. The data stored
CCSTBY
in this memory is protected against power failures on the main V
pins.
CC1
The standby RAM data is saved if the power failure on the main V
pins is detected externally and an external
CC1
reset is generated when V
falls below 4.3 V (see Figure 4). The external reset must remain low during the
CC1
entire power failures. The falling edge of the reset signal is internally detected to set the standby RAM in
low-power HALT mode. After the next power up, the RESET pin must be pulled high to get out of the HALT mode
of the standby RAM. In halt mode, the standby RAM consumes only leakage current.
4.3 Volt
V
CC1
RESET
Standby RAM Locked in Halt Mode
Figure 4. Standby RAM Locked in Halt Mode
peripheral file (PF)
The TMS370Cx36 control registers contain all the registers necessary to operate the system and peripheral
modules on the device. The instruction set includes some instructions that access the PF directly. These
instructions designate the register by the number of the PF relative to 1000h, preceded by P0 for a hexadecimal
designator or P for a decimal designator. For example, the system-control register 0 (SCCR0) is located at
address 1010h; its peripheral file hexadecimal designator is P010, and its decimal designator is P16. Table 4
lists the TMS370Cx36 PF address map.
Table 4. TMS370Cx36 Peripheral File Address Map
PERIPHERAL FILE
ADDRESS RANGE
DESCRIPTION
DESIGNATOR
P000–P00F
P010–P01F
P020–P02F
P030–P03F
P040–P04F
P050–P06F
P070–P07F
P080–P0FF
1000h–100Fh
1010h–101Fh
1020h–102Fh
1030h–103Fh
1040h–104Fh
1050h–106Fh
1070h–107Fh
1080h–10FFh
Reserved
System and EPROM/EEPROM control registers
Digital I/O port control registers
SPI registers
PACT registers
Reserved
Analog-to-digital converter 1 registers
Reserved
9
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
data EEPROM
The TMS370Cx36 devices, containing 256 bytes of data EEPROM, have a memory mapped beginning at
location 1F00h and continuing through location 1FFFh. Writing to the data EEPROM module is controlled by
the data EEPROM control register (DEECTL) and the write-protection register (WPR). Programming algorithm
examples are available in the TMS370 Family User’s Guide (literature number SPNU127) or the
TMS370FamilyDataManual(literaturenumberSPNS014B). ThedataEEPROMfeaturesincludethefollowing:
Programming:
–
–
–
Bit-, byte-, and block-write/erase modes.
Internal charge pump circuitry. No external EEPROM programming voltage supply is needed.
Control register: Data EEPROM programming is controlled by the DEECTL located in the PF frame
beginning at location P01A. See Table 5.
–
In-circuit programming capability. There is no need to remove the device to program.
Write protection. Writes to the data EEPROM are disabled during the following conditions.
–
–
–
Reset. All programming of the data EEPROM module is halted.
Write protection active. There is one write-protect bit per 32-byte EEPROM block.
Low-power mode operation
Write protection can be overridden by applying 12 V to MC.
Table 5. Data EEPROM and PROGRAM EPROM Control Registers Memory Map
ADDRESS
P01A
SYMBOL
DEECTL
—
NAME
Data EEPROM Control Register
Reserved
P01B
P01C
EPCTLL
Program EPROM Control Register – Low Array
†
program EPROM
The TMS370C736 device contains 16K bytes of EPROM mapped, beginning at location 4000h and continuing
through location 7FFFh as shown in Figure 3. Reading the program EPROM modules is identical to reading
other internal memory. During programming, the EPROM is controlled by the EPROM control register
(EPCTLL). The program EPROM module features include:
Programming
–
–
In-circuit programming capability if V is applied to MC
PP
Control register: EPROM programming is controlled by the EPROM control register (EPCTLL) located
in the peripheral file (PF) frame at location P01C as shown in Table 5.
Write protection: Writes to the program EPROM are disabled under the following conditions:
–
–
–
Reset: All programming to the EPROM module is halted
Low-power modes
13 V not applied to MC
†
Memory addresses 7FE0h through 7FEBh are reserved for Texas Instruments (TI ), and addresses 7FECh through 7FFFh are reserved
for interrupt and reset vectors. Trap vectors, used with TRAP0 through TRAP15 instructions, are located between addresses 7FC0h and
7FDFh.
TI is a trademark of Texas Instruments Incorporated.
10
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
†
program ROM
The program ROM consists of 16K bytes of mask programmable read-only memory. The program ROM is used
for permanent storage of data or instructions. Programming of the mask ROM is performed at the time of device
fabrication. Refer to Figure 3 for ROM memory map.
system reset
The system-reset operation ensures an orderly start-up sequence for the TMS370Cx36 CPU-based device.
There are up to three different actions that can cause a system reset to the device. Two of these actions are
generated internally, while one (RESET pin) is controlled externally. These actions are as follows:
PACT watchdog (WD) timer. A watchdog-generated reset occurs if an improper value is written to the WD
key register, or if the re-initialization does not occur before the watchdog timer timeout . See the TMS370
User’s Guide (literature number SPNU127) for more information.
Oscillator reset. Reset occurs when the oscillator operates outside of the recommended operating range.
See the TMS370 User’s Guide (literature number SPNU127) for more information.
External RESET pin. A low level signal can trigger an external reset. To ensure a reset, the external signal
should be held low for one SYSCLK cycle. Signals of less than one SYSCLK can generate a reset. See the
TMS370 User’s Guide (literature number SPNU127) for more information.
Once a reset source is activated, the external RESET pin is driven (active) low for a minimum of eight SYSCLK
cycles. This allows the ’x36 device to reset external system components. Additionally, if a cold start (V
is off
CC
for several hundred milliseconds) condition or oscillator failure occurs or the RESET pin is held low, then the
reset logic holds the device in a reset state for as long as these actions are active.
After a reset, the program can check the oscillator-fault flag (OSC FLT FLAG, SCCR0.4) and the cold-start flag
(COLD START, SCCR0.7) to determine the source of the reset. A reset does not clear these flags.Table 6 lists
the reset sources. If none of the sources indicated in Table 6 caused the reset, then the RESET pin was pulled
low by the external hardware or the PACT module’s watchdog.
Table 6. Reset Sources
REGISTER
SCCR0
SCCR0
ADDRESS
1010h
PF
BIT NO.
CONTROL BIT
COLD START
OSC FLT FLAG
SOURCE OF RESET
Cold (power-up)
Oscillator out of range
P010
P010
7
4
1010h
Once a reset is activated, the following sequence of events occurs:
1. The CPU registers are initialized: ST = 00h, SP = 01h (reset state).
2. Registers A and B are initialized to 00h (no other RAM is changed).
3. The contents of the LSbyte of the reset vector (07FFh) are read and stored in the PCL.
4. The contents of the MSbyte of the reset vector (07FEh) are read and stored in the PCH.
5. Program execution begins with an opcode fetch from the address pointed to the PC.
The reset sequence takes 20 SYSCLK cycles from the time the reset pulse is released until the first opcode
fetch. During a reset, RAM contents (except for registers A and B) remain unchanged, and the module control
register bits are initialized to their reset state.
†
Memory addresses 7FE0h through 7FEBh are reserved for Texas Instruments, and addresses 7FECh through 7FFFh are reserved for
interrupt and reset vectors. Trap vectors, used with TRAP0 through TRAP15 instructions, are located between addresses 7FC0h and
7FDFh.
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
interrupts
The TMS370 family software-programmable interrupt structure permits flexible on-chip and external interrupt
configurations to meet real-time interrupt-driven application requirements. The hardware interrupt structure
incorporates two priority levels as shown in Figure 5. Interrupt level 1 has a higher priority than interrupt
level 2. The two priority levels can be masked independently by the global interrupt mask bits (IE1 and IE2) of
the ST.
PACT
GROUP 3
Cmd/Def Entry 7
GROUP 2
GROUP 1
Default Timer
Overflow
CP1 Edge
CP2 Edge
CP3 Edge
CP4 Edge
CP5 Edge
CP6 Edge
Circular Buffer
Cmd/Def Entry 6
Cmd/Def Entry 5
Cmd/Def Entry 4
Cmd/Def Entry 3
Cmd/Def Entry 2
Cmd/Def Entry 1
Cmd/Def Entry 0
SCI TXINT
SCI RXINT
PACT 3 PRI
PACT 2 PRI
PACT 1 PRI
AD INT
ADC1
SPI INT
EXT INT1
CPU
INT1
SPI
NMI
Priority
Logic
INT1 PRI
STATUS REG
AD PRI
SPI PRI
IE1
IE2
Level 1 INT
Level 2 INT
Enable
Figure 5. Interrupt Control
Each system interrupt is configured independently to either the high- or low-priority chain by the application
program during system initialization. Within each interrupt chain, the interrupt priority is fixed by the position of
the system interrupt. However, since each system interrupt is selectively configured on either the high- or
low-priority-interrupt chain, the application program can elevate any system interrupt to the highest priority.
Arbitration between the two priority levels is performed within the CPU. Arbitration within each of the priority
12
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
interrupts (continued)
chains is performed within the peripheral modules to support interrupt expansion for future modules. Pending
interrupts are serviced upon completion of current instruction execution, depending on their interrupt mask and
priority conditions.
The TMS370Cx36 has 21 hardware system interrupts (plus RESET) as shown in Table 7. Each system interrupt
has a dedicated vector located in program memory through which control is passed to the interrupt service
routines. A system interrupt may have multiple interrupt sources. All of the interrupt sources are individually
maskable by local interrupt enable control bits in the associated peripheral file. Each interrupt source FLAG bit
is individually readable for software polling or for determining which interrupt source generated the associated
system interrupt.
Twenty of the system interrupts are generated by on-chip peripheral functions, and one external interrupt is
supported. Software configuration of the external interrupts is performed through the INT1 control register in
peripheral file frame 1. Each external interrupt is individually software configurable for input polarity (rising or
falling edge) for ease of system interface. External interrupt INT1 is software configurable as either a maskable
or non-maskable interrupt. When INT1 is configured as non-maskable, it cannot be masked by the individual-
or global-enable mask bits. The INT1 NMI bit is protected during non-privileged operation and, therefore, should
be configured during the initialization sequence following reset. To maximize pin flexibility, external interrupt
INT1 can be software configured as a general-purpose input pin if the interrupt function is not required.
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POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
interrupts (continued)
Table 7. Hardware System Interrupts
PRIORITY
IN
GROUP
INTERRUPT
SOURCE
INTERRUPT
FLAG
SYSTEM
INTERRUPT
VECTOR
ADDRESS
MODULE
PRIORITY
OSC FLT FLG
†
External RESET
Watchdog Overflow
Oscillator Fault
COLD START
(No Flag)
OSC FLT FLAG
†
RESET
RESET
7FFEh, 7FFFh
1
‡
INT1
SPI
External Interrupt 1
INT1 FLAG
INT1
7FFCh, 7FFDh
7FF6h, 7FF7h
2
3
SPI RX/TX Complete
SPI INT FLAG
SPIINT
Buffer Half/Full
Interrupt Flag
PACT Circular Buffer
BUFINT
7FB0h, 7FB1h
1
PACT CP6 Event
PACT CP5 Event
PACT CP4 Event
PACT CP3 Event
PACT CP2 Event
PACT CP1 Event
CP6 INT FLAG
CP5 INT FLAG
CP4 INT FLAG
CP3 INT FLAG
CP2 INT FLAG
CP1 INT FLAG
CP6INT
CP5INT
CP4INT
CP3INT
CP2INT
CP1INT
7FB2h, 7FB3h
7FB4h, 7FB5h
7FB6h, 7FB7h
7FB8h, 7FB9h
7FBAh, 7FBBh
7FBCh, 7FBDh
2
3
4
5
6
7
PACT (Group 1)
4
5
Default Timer
Overflow
DEFTIM OVRFL INT
FLAG
POVRL
INT
7FBEh, 7FBFh
8
PACT SCI Rx Int
PACT RX RDY
PRXINT
PTXINT
CDINT 0
CDINT 1
CDINT 2
CDINT 3
CDINT 4
CDINT 5
CDINT 6
CDINT 7
ADINT
7F9Eh, 7F9Fh
7F9Ch, 7F9Dh
7FA0h, 7FA1h
7FA2h, 7FA3h
7FA4h, 7FA5h
7FA6h, 7FA7h
7FA8h, 7FA9h
7FAAh, 7FABh
7FACh, 7FADh
7FAEh, 7FAFh
7FECh, 7FEDh
1
2
1
2
3
4
5
6
7
8
PACT (Group 2)
PACT SCI Tx Int
PACT TX RDY
PACT Cmd/Def Entry 0
PACT Cmd/Def Entry 1
PACT Cmd/Def Entry 2
PACT Cmd/Def Entry 3
PACT Cmd/Def Entry 4
PACT Cmd/Def Entry 5
PACT Cmd/Def Entry 6
PACT Cmd/Def Entry 7
ADC1 Conversion Complete
CMD/DEF INT 0 FLAG
CMD/DEF INT 1 FLAG
CMD/DEF INT 2 FLAG
CMD/DEF INT 3 FLAG
CMD/DEF INT 4 FLAG
CMD/DEF INT 5 FLAG
CMD/DEF INT 6 FLAG
CMD/DEF INT 7 FLAG
AD INT FLAG
PACT (Group 3)
6
7
ADC1
†
‡
Relative priority within an interrupt level
Release microcontroller from STANDBY and HALT low-power modes
privileged operation and EEPROM write protection override
The TMS370Cx36 family is designed with significant flexibility to enable the designer to software-configure the
system and peripherals to meet the requirements of a variety of applications. The nonprivileged mode of
operation ensures the integrity of the system configuration, once it is defined for an application. Following a
hardware reset, the TMS370Cx36 operates in the privileged mode, where all peripheral file registers have
unrestricted read/write access, and the application program configures the system during the initialization
sequence following reset. As the last step of system initialization, the PRIVILEGE DISABLE bit (SCCR2.0) is
set to 1 to enter the nonprivileged mode, disabling write operations to specific configuration-control bits within
the PF. Table 8 lists the control bits shown in the table which are write-protected during the nonprivileged mode
and must be configured by software prior to exiting the privileged mode.
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
privileged operation and EEPROM write protection override (continued)
Table 8. Privilege Bits
†
REGISTER
CONTROL BIT
PF AUTO WAIT
NAME
LOCATION
P010.5
P010.6
SCCRO
OSC POWER
P011.2
P011.4
MEMORY DISABLE
AUTOWAIT DISABLE
SCCR1
SCCR2
P012.0
P012.1
P012.3
P012.4
P012.6
P012.7
PRIVILEGE DISABLE
INT1 NMI
CPU STEST
BUS STEST
PWRDWN/IDLE
HALT/STANDBY
P03F.5
P03F.6
P03F.7
SPI ESPEN
SPI PRIORITY
SPI STEST
SPIPRI
P040.0
P040.1
P040.2
P040.3
P040.4
PACT PRESCALE SELECT 0
PACT PRESCALE SELECT 1
PACT PRESCALE SELECT 2
PACT PRESCALE SELECT 3
FAST MODE SELECT
PACTSCR
P04F.0
P04F.1
P04F.2
P04F.3
P04F.4
P04F.5
P04F.7
PACT WD PRESCALE SELECT 0
PACT WD PRESCALE SELECT 1
PACT MODE SELECT
PACT GROUP 3 PRIORITY
PACT GROUP 2 PRIORITY
PACT GROUP 1 PRIORITY
PACT STEST
PACTPRI
ADPRI
P07F.5
P07F.6
P07F.7
AD ESPEN
AD PRIORITY
AD STEST
†
The privilege bits are shown in a bold typeface and shaded areas in the
system configuration registers section of Table 10.
low-power and IDLE modes
The TMS370Cx36 devices have two low-power modes (STANDBY and HALT) and an IDLE mode. For
mask-ROM devices, low-power modes can be disabled permanently through a programmable contact when
the mask is manufactured.
The STANDBY and HALT low-power modes significantly reduce power consumption by reducing or stopping
the activity of the various on-chip peripherals when processing is not required. Each of the low-power modes
is entered by executing the IDLE instruction when the PWRDWN/IDLE bit in SCCR2 has been set to 1. The
HALT/STANDBY bit in SCCR2 controls the low-power mode selection.
In the STANDBY mode (HALT/STANDBY = 0), all CPU activity and most peripheral module activity is stopped;
however, the oscillator, internal clocks, the PACT counter, and the first PACT command entry remain active in
all modules. System processing is suspended until a qualified interrupt (hardware RESET or external interrupt
on INT1) is detected.
In the HALT mode (HALT/STANDBY = 1), the TMS370Cx36 is placed in its lowest power consumption mode.
The oscillator and internal clocks are stopped, causing all internal activity to be halted. System activity is
suspended until a qualified interrupt (hardware RESET or external interrupt on the INT1) is detected. The
power-down mode-selection bits are summarized in Table 9.
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
low-power and IDLE modes (continued)
Table 9. Low-Power/Idle Control Bits
POWER-DOWN CONTROL BITS
MODE SELECTED
PWRDWN/IDLE
(SCCR2.6)
HALT/STANDBY
(SCCR2.7)
1
0
1
STANDBY
HALT
1
0
†
X
IDLE
†
X = Don’t care
When low-power modes are disabled through a programmable contact in the mask-ROM devices, writing to the
SCCR2.6-7 bits is ignored. In addition, if an IDLE instruction is executed when low-power modes are disabled
through a programmable contact, the device always enters the IDLE mode.
To provide a method for always exiting low-power modes for mask-ROM devices, INT1 is enabled automatically
as a nonmaskable interrupt (NMI) during low-power modes when the hard watchdog mode is selected. This
means that the NMI is generated always, regardless of the interrupt enable flags.
The following information is preserved throughout both the STANDBY and HALT modes: RAM (register file),
CPU registers (SP, PC, and ST), I/O pin direction and output data, and status registers of all on-chip peripheral
functions. Since all CPU instruction processing is stopped during the STANDBY and HALT modes, the clocking
of the WD timer is inhibited.
clock modules
The ’x36 family provides two clock options that are referred to as divide-by-1 (phase-locked loop) and
divide-by-4 (standard oscillator). Both the divide-by-1 and divide-by-4 options are configurable during the
manufacturing process of a TMS370 microcontroller. The ’x36 masked-ROM devices offer both options to meet
system engineering requirements. Only one of the two clock options is allowed on each ROM device. The ’736A
EPROM has only the divide-by-4.
The divide-by-1 clock module option provides the capability for reduced electromagnetic interference (EMI) with
no added cost.
The divide-by-1 provides a one-to-one match of the external resonator frequency (CLKIN) to the internal system
clock (SYSCLK) frequency, whereas the divide-by-4 produces a SYSCLK which is one-fourth the frequency of
the external resonator. Inside of the divide-by-1 module, the frequency of the external resonator is multiplied
by four, and the clock module then divides the resulting signal by four to provide the four-phased internal system
clock signals. The resulting SYSCLK is equal to the resonator frequency. These are formulated as follows:
external resonator frequency
4
CLKIN
4
Divide-by-4 option : SYSCLK
Divide-by-1 option : SYSCLK
external resonator frequency
4
4
CLKIN
The main advantage of choosing a divide-by-1 oscillator is the reduced EMI. The harmonics of low-speed
resonators extend through fewer of the emissions spectrum than the harmonics of faster resonators. The
divide-by-1 provides the capability of reducing the resonator speed by four times, and this results in a steeper
decay of emissions produced by the oscillator.
16
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
system configuration registers
Table 10 contains system-configuration and control functions and registers for controlling EEPROM
programming. The privileged bits are shown in a bold typeface and shaded areas.
Table 10. Peripheral File Frame 1: System-Configuration Registers
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
COLD
START
OSC
POWER
PF AUTO
WAIT
OSC FLT
FLAG
MC PIN
WPO
MC PIN
DATA
µP/µC
MODE
P010
—
SCCR0
AUTO
WAIT
DISABLE
MEMORY
DISABLE
P011
—
—
—
—
—
—
—
SCCR1
SCCR2
HALT/
STANDBY
PWRDWN/
IDLE
BUS
STEST
CPU
STEST
INT1
NMI
PRIVILEGE
DISABLE
P012
—
P013
to
Reserved
P016
INT1
FLAG
INT1
PIN DATA
INT1
POLARITY
INT1
PRIORITY
INT1
ENABLE
P017
—
—
—
INT1
P018
P019
P01A
P01B
P01C
Reserved
Reserved
BUSY
BUSY
—
—
—
—
—
—
—
AP
—
W1W0
W0
EXE
EXE
DEECTL
EPCTLL
Reserved
VPPS
P01D
P01E
P01F
Reserved
17
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
digital port control registers
Peripheral file frame 2 contains the digital I/O pin configuration and control registers. Table 11showsthespecific
addresses, registers, and control bits within this peripheral file frame. Table 12 shows the port configuration
register setup.
Table 11. Peripheral File Frame 2: Digital Port-Control Registers
PF
P020
P021
P022
P023
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
Reserved
BIT 2
BIT 1
BIT 0
APORT1
APORT2
ADATA
ADIR
Port A Control Register 2 (must be 0)
Port A Data
Port A Direction
P024
to
Reserved
P02B
P02C
P02D
P02E
P02F
Port D Control Register 1 (must be 0)
—
—
—
—
—
—
—
—
—
—
—
—
DPORT1
DPORT2
DDATA
DDIR
†
Port D Control Register 2 (must be 0)
Port D Data
Port D Direction
†
To configure pin D3 as SYSCLK, set port D control register 2 = 08h.
Table 12. Port Configuration Register Setup
abcd
00q1
abcd
00y0
PORT
PIN
A
D
0 – 7
3 – 7
Data out q
Data out q
Data In y
Data In y
a = Port x Control Register 1
b = Port x Control Register 2
c = Data
d = Direction
serial peripheral interface
The SPI is a high-speed synchronous serial I/O port that allows a serial bit stream of programmed length (one
to eight bits) to be shifted into and out of the device at a programmable bit transfer rate. The SPI normally is
used for communications between the microcontroller and external peripherals or another microcontroller.
Typical applications include external I/O or peripheral expansion by way of devices such as shift registers,
display drivers, and A/D converters. Multi-device communications are supported by the master/slave operation
of the SPI. The SPI module features include the following:
Three external pins
–
–
–
SPISOMI: SPI slave output/master input pin or general-purpose bidirectional I/O pin
SPISIMO: SPI slave input/master output pin or general-purpose bidirectional I/O pin
SPICLK: SPI serial clock pin or general-purpose bidirectional I/O pin
Two operational modes: Master and slave
18
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
serial peripheral interface (continued)
Baud rate: Eight different programmable rates
–
Maximum baud rate in master mode: 2.5M bps at 5-MHz SYSCLK
SYSCLK
2
SPI BAUD RATE
2b
where b=bit rate in SPICCR.5-3 (range 0–7)
–
Maximum baud rate in slave mode: 625K bps at 5-MHz SYSCLK
for maximum slave SPI BAUD RATE < SYSCLK/8
Data word format: one to eight data bits
Simultaneous receiver and transmitter operations (transmit function can be disabled in software)
Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms.
Seven SPI module control registers located in control register frame beginning at address P030h
The SPI module-control registers are listed in Table 13.
Table 13. SPI Module-Control Register Memory Map
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
SPI SW
RESET
CLOCK
POLARITY
SPI BIT
RATE2
SPI BIT
RATE1
SPI BIT
RATE0
SPI
CHAR2
SPI
CHAR1
SPI
CHAR0
P030
SPICCR
RECEIVER
OVERRUN
SPI INT
FLAG
MASTER/
SLAVE
SPI INT
ENA
P031
—
—
—
TALK
SPICTL
P032
to
Reserved
P036
P037
P038
P039
RCVD7
SDAT7
RCVD6
SDAT6
RCVD5
SDAT5
RCVD4
SDAT4
RCVD3
RCVD2
SDAT2
RCVD1
SDAT1
RCVD0
SDAT0
SPIBUF
SPIDAT
RESERVED
SDAT3
P03A
to
Reserved
P03C
SPICLK
DATA IN
SPICLK
DATA OUT
SPICLK
FUNCTION
SPICLK
DATA DIR
P03D
P03E
P03F
—
—
—
—
SPIPC1
SPIPC2
SPIPRI
SPISIMO
DATA IN
SPISIMO
DATA OUT
SPISIMO
FUNCTION
SPISIMO
DATA DIR
SPISOMI
DATA IN
SPISOMI
DATA OUT
SPISOMI
FUNCTION
SPISOMI
DATA DIR
SPI
STEST
SPI
PRIORITY
SPI
ESPEN
—
—
—
—
—
19
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
serial peripheral interface (continued)
The SPI block diagram is illustrated in Figure 6.
RECEIVER
SPIBUF.7-0
OVER RUN
SPIBUF Buffer
SPICTL.7
Register
SPIPRI.6
8
0
1
Level 1 INT
Level 2 INT
SPICTL.0
SPI INT FLAG
SPICTL.6
SPIINT ENA
SPIPC2.7-4
SPIDAT
Data Register
SPISIMO
SPICTL.1
TALK
SPIDAT.7-0
SPIPC2.3-0
SPISOMI
State Control
SPICCR.2-0
†
MASTER/SLAVE
SPI CHAR
SPICTL.2
2
1
0
SPIPC1.3-0
SPICLK
System
Clock
SPICCR.6
CLOCK POLARITY
SPICCR.5-3
5
4
3
SPI BIT RATE
The block diagram is shown in slave mode.
†
Figure 6. SPI Block Diagram
programmable acquisition and control timer (PACT) module
Traditionally, timers in microcontrollers provide limited capture and compare functions consuming significant
CPU processing power and leading to inaccurate timings due to interrupt latencies. The programmable
acquisition and control timer (PACT) acts as a coprocessor combining configurable capture and compare
features, within a flexible dual-port RAM, able to run real-time tasks with little or no CPU intervention. The PACT
structure allows concatenation of tasks, thus enabling the CPU to perform data manipulation while the PACT
module both captures and outputs real-time-related information. Since all the PACT control information is held
within the dual-port Ram, the CPU can access these parameters quickly.
To use the PACT, the user must set up three distinct areas of memory. The first is the dual-port RAM, which
contains the capture area, the commands, and the timer definitions. The second is the peripheral frame. The
third is an area near the end of the program memory which holds the interrupt vectors of PACT.
20
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
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programmable acquisition and control timer (PACT) module (continued)
The PACT module features include the following:
Input-capture functions on up to six input pins (CP1 to CP6), depending on the mode selected:
–
–
Mode A: CP1–2 are dedicated capture, CP3–6 are circular buffer capture, and CP6 is also an event pin.
Mode B: CP1–4 are dedicated capture, CP5–6 are circular buffer capture, and CP6 is also an event pin.
Multiple timer-driven outputs on eight pins (OP1 to OP8)
–
Standard compare command: set or clear an output pin whenever the timer/counter is equal to a certain
value
–
–
Virtual timers: enable variations of the PWM’s period and provides periodic interrupts to the processor.
Double event-compare command: comparisons of the 8-bit event counter with two event-compare
values and the actions that can be performed are based on each value:
–
Event-compare 1 matching the event counter: sets or resets the selected output pin (OP1–OP8),
generates interrupt, and generates a 32-bit capture into the circular buffer.
–
Event-compare 2 matching the event counter: sets or resets the selected output pin (OP1–OP8),
generates interrupt, generates a 32-bit capture into the circular buffer, and resets the 20-bit default
timer.
–
Offset timer definition-time from last event:
–
–
–
Generates an interrupt when the maximum event count is reached
Stores the 16-bit virtual timer in the circular buffer on each event
Stores the 20-bit default timer and 8-bit event counter in the circular buffer when the maximum
event count is reached
–
Resets the 20-bit hardware default timer when the maximum event count is reached.
–
–
Conditional-compare command has a timer-compare value and an event-compare value.
–
Generates an interrupt when the event-compare value equals the event counter and the
timer-compare value equals the last defined timer
–
Sets or clears one of the seven output pins (OP1–OP7) when the event compare value equals the
event counter and the timer-compare value equals the last defined timer
Baud rate timer definition: runs the mini-serial communications port built into the PACT module.
Configurable timer overflow rates
One 8-bit event counter driven by CP6
Up to 20-bit timer capability
Interaction between event counter and timer activity
Register-based organization allowing direct access to timer parameters by the CPU
18 independent interrupt vectors with two priority levels
Integrated, configurable watchdog with selectable time-out period
21
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
programmable acquisition and control timer (PACT) module (continued)
Mini-serial communications interface works as a simplified full duplex universal asychronous
receiver/transmitter (UART) with independent setup of baud rate for receive and transmit lines.
–
Asynchronous communications mode
Asynchronous Baud
1
–2
(Max Virtual Timer Value) (4) (PACT Resolution)
where PACT Resolution = SYSCLK × Prescale Value
PACT block diagram
The PACT module block diagram is illustrated in Figure 7.
PACT PRESCALED CLOCK
20-Bit Timer/Counter
Prescale
8-Bit Event Counter
Watchdog Timer
CP1
CP2
Dedicated Capture Register 1
Dedicated Capture Register 2
Dedicated Capture Register 3
Dedicated Capture Register 4
Reset
CP3
CP4
CP5
CP6
3-Bit Prescaler
MODE
Circular Buffer
(32–Bit Captures)
OPT1
OPT2
OPT3
OPT4
OPT5
OPT6
OPT7
OPT8
Outputs
EVENT ONLY
Command/Definition Area
Command Analyzer
and
Output Controller
Int Level 1
Int Level 2
SCITXD
Mini SCI
SCIRXD
Figure 7. PACT Block diagram
22
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
PACT control registers
The PACT module is controlled and accessed through registers in peripheral frame 4. These registers are listed
in Table 14. The bits in shaded boxes are privileged mode bits; that is, they can be written to only in theprivileged
mode.
Table 14. PACT Control Registers
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
PACT
BIT 1
PACT
BIT 0
PACT
REG
DEFTIM
OVRFL
INT ENA
DEFTIM
OVRFL
INT FLAG
FAST
MODE
SELECT
PACT
PRESCALE
SELECT3
CMD/DEF
AREA ENA
P040
PRESCALE PRESCALE
SELECT2
PRESCALE PACTSCR
SELECT0
SELECT1
CMD/DEF
AREA
INT ENA
CMD/DEF
AREA
CMD/DEF
AREA
CMD/DEF
AREA
CMD/DEF
AREA
P041
P042
P043
—
—
—
—
—
CDSTART
CDEND
START BIT 5 START BIT 4 START BIT 3 START BIT 2
CMD/DEF
AREA
END BIT 6
CMD/DEF
AREA
END BIT 5
CMD/DEF
AREA
END BIT 4
CMD/DEF
AREA
END BIT 3
CMD/DEF
AREA END
BIT 2
—
1
—
BUFFER
POINTER
BIT 5
BUFFER
POINTER
BIT 4
BUFFER
POINTER
BIT 3
BUFFER
POINTER
BIT 2
BUFFER
POINTER
BIT 1
1
BUFPTR
P044
P045
Reserved
PACT
RXRDY
PACT
TXRDY
PACT
PARITY
PACT SCI
RX INT ENA TX INT ENA
PACT SCI
PACT SCI
SW RESET
PACT FE
—
SCICTLP
RXBUFP
TXBUFP
PSTATE
PACT
RXDT7
PACT
RXDT6
PACT
RXDT5
PACT
PACT
PACT
RXDT2
PACT
RXDT1
PACT
RXDT0
P046
P047
P048
P049
RXDT4
RXDT3
PACT
TXDT7
PACT
TXDT6
PACT
TXDT5
PACT
PACT
PACT
TXDT2
PACT
TXDT1
PACT
TXDT0
TXDT4
TXDT3
PACT OP8
STATE
PACT OP7
STATE
PACT OP6
STATE
PACT OP5
STATE
PACT OP4
STATE
PACT OP3
STATE
PACT OP2
STATE
PACT OP1
STATE
CMD/DEF
INT 7 FLAG INT 6 FLAG
CMD/DEF
CMD/DEF
INT 5 FLAG
CMD/DEF
CMD/DEF
CMD/DEF
INT 2 FLAG
CMD/DEF
INT 1 FLAG
CMD/DEF
INT 0 FLAG
CDFLAGS
INT 4 FLAG
INT 3 FLAG
CP2 CAPT
RISING
EDGE
CP2 CAPT
FALLING
EDGE
CP1 CAPT
RISING
EDGE
CP1 CAPT
FALLING
EDGE
CP2 INT
ENA
CP2 INT
FLAG
CP1 INT
ENA
CP1 INT
FLAG
P04A
P04B
P04C
CPCTL1
CPCTL2
CPCTL3
CP4 CAPT
RISING
EDGE
CP4 CAPT
FALLING
EDGE
CP3 CAPT
RISING
EDGE
CP3 CAPT
FALLING
EDGE
CP4 INT
ENA
CP4 INT
FLAG
CP3 INT
ENA
CP3 INT
FLAG
CP6 CAPT
RISING
EDGE
CP6 CAPT
FALLING
EDGE
CP5 CAPT
RISING
EDGE
CP5 CAPT
FALLING
EDGE
CP6 INT
ENA
CP6 INT
FLAG
CP5 INT
ENA
CP5 INT
FLAG
INPUT
CAPT
PRESCALE
SELECT 3
INPUT
CAPT
PRESCALE
SELECT 2
INPUT
CAPT
PRESCALE
SELECT 1
BUFFER
P04D HALF/FULL
INT ENA
BUFFER
HALF/FULL
INT FLAG
EVENT
COUNTER
SW RESET
CP6 EVENT
ONLY
OP/ SET/CLR
SELECT
CPPRE
WDRST
P04E
WATCHDOG REST KEY
PACT
GROUP 1
PRIORITY
PACT
GROUP 2
PRIORITY
PACT
GROUP 3
PRIORITY
PACT
MODE
SELECT
PACT WD
PRESCALE
SELECT 1
PACT WD
PRESCALE PACTPRI
SELECT 0
PACT
P04F
PACT
SUSPEND
STEST
23
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
analog-to-digital converter 1 module
The analog-to-digital converter 1 (ADC1) module is an 8-bit, successive approximation converter with internal
sample-and-hold circuitry. The module has four multiplexed analog input channels that allow the processor to
convert the voltage levels from up to eight different sources. The ADC1 module features include the following:
Minimum conversion time: 32.8 µs at 5-MHz SYSCLK
Ten external pins:
–
Eight analog-input channels (AN0–AN7), any of which can be software-configured as digital inputs
(E0–E7) when not needed as analog channels
–
–
–
AN1–AN7 also can be configured as positive-input voltage reference.
V
V
: ADC1 module high-voltage reference input
CC3
: ADC1 module low-voltage reference input
SS3
The ADDATA register, which contains the digital result of the last ADC1 conversion.
ADC1 operations can be accomplished through either interrupt-driven or polled algorithms.
Six ADC1 module control registers located in the control-register frame beginning at address 1070h
The ADC1 module control registers are listed in Table 15.
Table 15. ADC1 Module Control Register Memory Map
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
CONVERT
START
SAMPLE
START
REF VOLT
SELECT2
REF VOLT
SELECT1
REF VOLT
SELECT0
AD INPUT
SELECT2
AD INPUT
SELECT1
AD INPUT
SELECT0
P070
ADCTL
AD INT
FLAG
AD INT
ENA
P071
P072
—
—
—
—
—
AD READY
ADSTAT
ADDATA
A/D Conversion Data Register
RESERVED
P073
to
P07C
P07D
P07E
Port E Data Input Register
Port E Input Enable Register
ADIN
ADENA
AD
PRIORITY
P07F AD STEST
AD ESPEN
—
—
—
—
—
ADPRI
24
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
analog-to-digital converter 1 module (continued)
The ADC1 module block diagram is illustrated in Figure 8.
Port E Input
Port E Data
ENA 0
AN 0
ADENA.0
SAMPLE
START
CONVERT
START
ADIN.0
2
1
0
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
ADCTL.2–0
ADCTL.6
ADCTL.7
Port E Input
ENA 1
Port E Data
AN 1
AD INPUT SELECT
ADENA.1
ADIN.1
Port E Input
ENA 2
Port E Data
AN 2
ADENA.2
ADIN.2
Port E Input
ENA 3
Port E Data
AN 3
ADENA.3
ADIN.3
ADDATA.7–0
A/D
Port E Input
ENA 4
Port E Data
AN 4
A-to-D
Conversion
Data Register
ADENA.4
ADIN.4
Port E Input
ENA 5
AD READY
ADSTAT.2
Port E Data
AN 5
ADENA.5
ADIN.5
AD PRIORITY
0
Level 1 INT
ADPRI.6
Port E Input
ENA 6
Port E Data
AN 6
1
Level 2 INT
ADENA.6
ADIN.6
5
4
3
ADCTL.5–3
Port E Input
ENA 7
AD INT FLAG
ADSTAT.1
Port E Data
AN 7
REF VOLTS SELECT
ADENA.7
ADIN.7
ADSTAT.0
AD INT ENA
V
CC3
V
SS3
Figure 8. ADC1 Block Diagram
25
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
instruction set overview
Table 16 provides an opcode to instruction cross reference of all 73 instructions and 274 opcodes of the
‘370Cx36 instruction set. The numbers at the top of this table represent the most significant nibble (MSN) of
the opcode while the numbers at the left side of the table represent the least significant nibble (LSN). The
instruction of these two opcode nibbles contains the mnemonic, operands, and byte/cycle particular to that
opcode.
For example, the opcode B5h points to the CLR A instruction. This instruction contains one byte and executes
in eight SYSCLK cycles.
26
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
†
Table 16. TMS370 Family Opcode/Instruction Map
MSN
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
JMP
#ra
2/7
INCW
#ra,Rd
3/11
MOV
Ps,A
2/8
CLRC /
TST A
1/9
MOV
A,B
1/9
MOV
A,Rd
2/7
TRAP
15
1/14
LDST
n
2/6
0
1
2
3
4
5
JN
ra
2/5
MOV
A,Pd
2/8
MOV
B,Pd
2/8
MOV
Rs,Pd
3/10
MOV
Ps,B
2/7
MOV
B,Rd
2/7
TRAP
14
1/14
MOV
#ra[SP],A
2/7
JZ
ra
2/5
MOV
Rs,A
2/7
MOV
#n,A
2/6
MOV
Rs,B
2/7
MOV
Rs,Rd
3/9
MOV
#n,B
2/6
MOV
B,A
1/8
MOV
#n,Rd
3/8
MOV
Ps,Rd
3/10
DEC
A
1/8
DEC
B
1/8
DEC
Rd
2/6
TRAP
13
1/14
MOV
A,*ra[SP]
2/7
JC
ra
2/5
AND
Rs,A
2/7
AND
#n,A
2/6
AND
Rs,B
2/7
AND
Rs,Rd
3/9
AND
#n,B
2/6
AND
B,A
1/8
AND
#n,Rd
3/8
AND
A,Pd
2/9
AND
B,Pd
2/9
AND
#n,Pd
3/10
INC
A
1/8
INC
B
1/8
INC
Rd
2/6
TRAP
12
1/14
CMP
*n[SP],A
2/8
JP
ra
2/5
OR
Rs,A
2/7
OR
#n,A
2/6
OR
Rs,B
2/7
OR
Rs,Rd
3/9
OR
#n,B
2/6
OR
B,A
1/8
OR
#n,Rd
3/8
OR
A,Pd
2/9
OR
B,Pd
2/9
OR
#n,Pd
3/10
INV
A
1/8
INV
B
1/8
INV
Rd
2/6
TRAP
11
1/14
extend
inst,2
opcodes
JPZ
ra
2/5
XOR
Rs,A
2/7
XOR
#n,A
2/6
XOR
Rs,B
2/7
XOR
Rs,Rd
3/9
XOR
#n,B
2/6
XOR
B,A
1/8
XOR
#n,Rd
3/8
XOR
A,Pd
2/9
XOR
B,Pd
2/9
XOR
#n,Pd
3/10
CLR
A
1/8
CLR
B
1/8
CLR
Rn
2/6
TRAP
10
1/14
L
S
N
JNZ
ra
2/5
BTJO
Rs,A,ra
3/9
BTJO
#n,A,ra
3/8
BTJO
Rs,B,ra
3/9
BTJO
Rs,Rd,ra
4/11
BTJO
#n,B,ra
3/8
BTJO
B,A,ra
2/10
BTJO
#n,Rd,ra
4/10
BTJO
A,Pd,ra
3/11
BTJO
B,Pd,ra
3/10
BTJO
#n,Pd,ra
4/11
XCHB
A
1/10
XCHB A /
TST B
1/10
XCHB
Rn
2/8
TRAP
9
1/14
IDLE
1/6
6
JNC
ra
2/5
BTJZ
Rs.,A,ra
3/9
BTJZ
#n,A,ra
3/8
BTJZ
Rs,B,ra
3/9
BTJZ
Rs,Rd,ra
4/11
BTJZ
#n,B,ra
3/8
BTJZ
B,A,ra
2/10
BTJZ
#n,Rd,ra
4/10
BTJZ
A,Pd,ra
3/10
BTJZ
B,Pd,ra
3/10
BTJZ
#n,Pd,ra
4/11
SWAP
A
1/11
SWAP
B
1/11
SWAP
Rn
2/9
TRAP
8
1/14
MOV
#n,Pd
3/10
7
8
JV
ra
2/5
ADD
Rs,A
2/7
ADD
#n,A
2/6
ADD
Rs,B
2/7
ADD
Rs,Rd
3/9
ADD
#n,B
2/6
ADD
B,A
1/8
ADD
#n,Rd
3/8
MOVW
#16,Rd
4/13
MOVW
Rs,Rd
3/12
MOVW
#16[B],Rpd
4/15
PUSH
A
1/9
PUSH
B
1/9
PUSH
Rd
2/7
TRAP
7
1/14
SETC
1/7
JL
ra
2/5
ADC
Rs,A
2/7
ADC
#n,A
2/6
ADC
Rs,B
2/7
ADC
Rs,Rd
3/9
ADC
#n,B
2/6
ADC
B,A
1/8
ADC
#n,Rd
3/8
JMPL
lab
3/9
JMPL
*Rp
2/8
JMPL
*lab[B]
3/11
POP
A
1/9
POP
B
1/9
POP
Rd
2/7
TRAP
6
1/14
RTS
9
A
B
1/9
JLE
ra
2/5
SUB
Rs,A
2/7
SUB
#n,A
2/6
SUB
Rs,B
2/7
SUB
Rs,Rd
3/9
SUB
#n,B
2/6
SUB
B,A
1/8
SUB
#n,Rd
3/8
MOV
& lab,A
3/10
MOV
*Rp,A
2/9
MOV
*lab[B],A
3/12
DJNZ
A,#ra
2/10
DJNZ
B,#ra
2/10
DJNZ
Rd,#ra
3/8
TRAP
5
1/14
RTI
1/12
JHS
ra
2/5
SBB
Rs,A
2/7
SBB
#n,A
2/6
SBB
Rs,B
2/7
SBB
Rs,Rd
3/9
SBB
#n,B
2/6
SBB
B,A
1/8
SBB
#n,Rd
3/8
MOV
A, & lab
3/10
MOV
A, *Rp
2/9
MOV
A,*lab[B]
3/12
COMPL
A
1/8
COMPL
B
1/8
COMPL
Rd
2/6
TRAP
4
1/14
PUSH
ST
1/8
†
All conditional jumps (opcodes 01-0F), BTJO, BTJZ, and DJNZ instructions use two additional cycles if the branch is taken. The BTJO, BTJZ, and DJNZ
instructions have a relative address as the last operand.
†
Table 16. TMS370 Family Opcode/Instruction Map (Continued)
MSN
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
JNV
ra
2/5
MPY
Rs,A
2/46
MPY
#n,A
2/45
MPY
Rs,B
2/46
MPY
Rs,Rd
3/48
MPY
#n,B
2/45
MPY
B,A
1/47
MPY
#n,Rs
3/47
BR
lab
3/9
BR
*Rp
2/8
BR
*lab[B]
3/11
RR
A
1/8
RR
B
1/8
RR
Rd
2/6
TRAP
3
1/14
POP
ST
1/8
C
D
E
F
JGE
ra
2/5
CMP
Rs,A
2/7
CMP
#n,A
2/6
CMP
Rs,B
2/7
CMP
Rs,Rd
3/9
CMP
#n,B
2/6
CMP
B,A
1/8
CMP
#n,Rd
3/8
CMP
& lab,A
3/11
CMP
*Rp,A
2/10
CMP
*lab[B],A
3/13
RRC
A
1/8
RRC
B
1/8
RRC
Rd
2/6
TRAP
2
1/14
LDSP
L
S
N
1/7
JG
ra
2/5
DAC
Rs,A
2/9
DAC
#n,A
2/8
DAC
Rs,B
2/9
DAC
Rs,Rd
3/11
DAC
#n,B
2/8
DAC
B,A
1/10
DAC
#n,Rd
3/10
CALL
lab
3/13
CALL
*Rp
2/12
CALL
*lab[B]
3/15
RL
A
1/8
RL
B
1/8
RL
Rd
2/6
TRAP
1
1/14
STSP
1/8
JLO
ra
2/5
DSB
Rs,A
2/9
DSB
#n,A
2/8
DSB
Rs,B
2/9
DSB
Rs,Rd
3/11
DSB
#n,B
2/8
DSB
B,A
1/10
DSB
#n,Rd
3/10
CALLR
lab
3/15
CALLR
*Rp
2/14
CALLR
*lab[B]
3/17
RLC
A
1/8
RLC
B
1/8
RLC
Rd
2/6
TRAP
0
1/14
NOP
1/7
MOVW
*n[Rn]
4/15
DIV
Rn.A
3/14-63
Second byte of two-byte instructions (F4xx):
F4
F4
F4
F4
F4
F4
F4
F4
8
9
JMPL
*n[Rn]
4/16
Legend:
MOV
*n[Rn],A
4/17
A
B
C
D
E
F
*
&
#
=
=
=
Indirect addressing operand prefix
Direct addressing operand prefix
immediate operand
MOV
A,*n[Rn]
4/16
#16 = immediate 16-bit number
lab
n
Pd
Pn
Ps
ra
Rd
Rn
Rp
=
=
=
=
=
=
=
=
=
16-label
immediate 8-bit number
Peripheral register containing destination type
Peripheral register
Peripheral register containing source byte
Relative address
Register containing destination type
Register file
Register pair
BR
*n[Rn]
4/16
CMP
*n[Rn],A
4/18
CALL
*n[Rn]
4/20
Rpd= Destination register pair
Rps = Source Register pair
Rs
= Register containing source byte
CALLR
*n[Rn]
4/22
†
All conditional jumps (opcodes 01-0F), BTJO, BTJZ, and DJNZ instructions use two additional cycles if the branch is taken. The BTJO, BTJZ, and DJNZ instructions
have a relative address as the last operand.
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
development system support
The TMS370 family development support tools include an assembler, a C-compiler, a linker, CDT and an
EEPROM/UVEPROM programmer.
Assembler/linker (Part No. TMDS3740850–02 for PC)
–
–
–
Includes extensive macro capability
Provides high-speed operation
Includes format conversion utilities for popular formats
ANSI C Compiler (Part No. TMDS3740855–02 for PC, Part No. TMDS3740555–09 for HP700 , Sun-3
or Sun-4 )
–
–
–
–
–
–
Generate assembly code for the TMS370 that can be inspected easily
Improves code execution speed and reduces code size with optional optimizer pass
Enables direct reference the TMS370’s port registers by using a naming convention
Provides flexibility in specifying the storage for data objects
Interfaces C functions and assembly functions easily
Includes assembler and linker
CDT370 (Compact Development Tool) PACT real-time in-circuit emulation
–
Base (Part Number EDSCDT37P – for PC, requires cable)
Cable for 44-pin PLCC (Part No. EDSTRG44PLCC36)
–
–
–
–
–
–
–
–
EEPROM and EPROM programming support
Allows inspection and modification of memory locations
Includes compatibility to upload/download program and data memory
Execute programs and software routines
Includes 1024-sample trace buffer
Includes single-step executable instructions
Uses software breakpoints to halt program execution at selected address
Microcontroller programmer
–
–
Base (Part No. TMDS3760500A – for PC, requires programmer head)
Single unit head for 44-pin PLCC (Part No. TMDS3780512A)
PC-based, window/function-key-orienteduserinterfaceforeaseofuseandrapidlearningenvironment
–
HP700 is a trademark of Hewlett Packard, Incorporated.
Sun-3 and Sun-4 are trademarks of Sun Microsystems, Incorporated.
29
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
device numbering conventions
Figure 9 illustrates the numbering and symbol nomenclature for the TMS370Cx36 family.
TMS 370 C 7 36
A FN T
Prefix: TMS = Standard prefix for fully qualified devices
SE = System evaluator (window EPROM) that is used for
prototyping purpose.
Family: 370 = TMS370 8-Bit Microcontroller Family
Technology:
C = CMOS
Program Memory Types:
0 = Mask ROM
7 = EPROM
Device Type:
36 = x36 device containing the following modules:
– Analog-to-Digital Converter 1
– Serial Peripheral Interface
– Programmable Acquisition and
Control Timer (PACT)
Memory Size:
6 = 16K bytes
Temperature Ranges:
A = –40°C to 85°C
L =
0°C to 70°C
T = –40°C to 105°C
Packages:
FN = Plastic Leaded Chip Carrier
FZ = Ceramic Leaded Chip Carrier
ROM and EPROM Option:
A = For ROM device, the watchdog timer can be configured
as one of the three different mask options:
– A standard watchdog or
– A hard watchdog or
– A simple watchdog
The clock can be either:
– Divide-by-4 clock or
– Divide-by-1 (PLL) clock
The low-power modes can be either:
– Enabled or
– Disabled
A = For EPROM device, a standard watchdog, a divide-by-
4 clock, and low-power modes are enabled
Figure 9. TMS370Cx36 Family Nomenclature
30
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
device part numbers
Table 17 provides a listing of all the ’x36 devices available. The device part number nomenclature is designed
to assist ordering. Upon ordering, the customer must specify not only the device part number, but also the clock
and watchdog timer options desired. Each device can have only one of the three possible watchdog timer
options and one of the two clock options. The options to be specified pertain solely to orders involving ROM
devices.
Table 17. Device Part Numbers
DEVICE PART NUMBERS
FOR 44 PINS (LCC)
TMS370C036AFNA
TMS370C036AFNL
TMS370C036AFNT
TMS370C736AFNT
†
SE370C736AFZT
†
System evaluators are for use in prototype environment, and their
reliability has not been characterized.
31
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
new code release form
Figure 10 shows a sample of the new code release form.
NEW CODE RELEASE FORM
TEXAS INSTRUMENTS
DATE:
TMS370 MICROCONTROLLER PRODUCTS
To release a new customer algorithm to TI incorporated into a TMS370 family microcontroller, complete this form and submit with the following information:
1. A ROM description in object form on Floppy Disk, Modem XFR, or EPROM (Verification file will be returned via same media)
2. An attached specification if not using TI standard specification as incorporated in TI’s applicable device data book.
Company Name:
Street Address:
Street Address:
City:
Contact Mr./Ms.:
Phone: (
)
Ext.:
State
Zip
Customer Purchase Order Number:
Customer Print Number *Yes:
No:
*If Yes: Customermust provide ”print” to TI w/NCRF for approvalbefore ROM
code processing starts.
#
Customer Part Number:
Customer Application:
(Std. spec to be followed)
TMS370 Device:
TI Customer ROM Number:
(provided by Texas Instruments)
CONTACT OPTIONS FOR THE ’A’ VERSION TMS370 MICROCONTROLLERS
OSCILLATOR FREQUENCY
Low Power Modes
[] Enabled
[] Disabled
Watchdog counter
[] Standard
[] Hard Enabled
[] Simple Counter
Clock Type
[] Standard (/4)
[] PLL (/1)
MIN
TYP
MAX
[] External Drive (CLKIN)
[] Crystal
[] Ceramic Resonator
NOTE:
Non ’A’ version ROM devices of the TMS370 microcontrollers will have the
“Low-powermodesEnabled”, “Divide-by-4”Clock, and“Standard”Watchdog
options. See the TMS370 Family User’s Guide (literature number SPNU127)
or the TMS370 Family Data Manual (literature number SPNS014B).
[] Supply Voltage MIN:
(std range: 4.5V to 5.5V)
MAX:
TEMPERATURE RANGE
PACKAGE TYPE
[] ’L’:
[] ’A’:
[] ’T’:
0° to 70°C (standard)
–40° to 85°C
–40° to 105°C
[] ’N’ 28-pin PDIP
[] “FN” 28-pin PLCC
[] “N” 40-pin PDIP
[] “FN” 44-pin PLCC
[] “FN” 68-pin PLCC
[] “NM” 64-pin PSDIP
[] “NJ” 40-pin PSDIP (formerly known as N2)
SYMBOLIZATION
BUS EXPANSION
[] TI standard symbolization
[] YES
[] NO
[] TI standard w/customer part number
[] Customer symbolization
(per attached spec, subject to approval)
NON-STANDARD SPECIFICATIONS:
ALL NON-STANDARDS SPECIFICATIONS MUST BE APPROVED BY THE TI ENGINEERING STAFF: If the customer requires expedited production material
(i.e., product which must be started in process prior to prototype approval and full production release) and non-standard spec issues are not resolved to the
satisfaction of both the customer and TI in time for a scheduled shipment, the specification parameters in question will be processed/tested to the standard
TI spec. Any such devices which are shipped without conformance to a mutually approved spec, will be identified by a ’P’ in the symbolization preceding the
TI part number.
RELEASE AUTHORIZATION:
This document, including any referenced attachments, is and will be the controlling document for all orders placed for this TI custom device. Any changes must
be in writing and mutually agreed to by both the customer and TI. The prototype cycletime commences when this document is signed off and the verification
code is approved by the customer.
1. Customer:
Date:
2. TI: Field Sales:
Marketing:
Prod. Eng.:
Proto. Release:
Figure 10. Sample New Code Release Form
32
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
Table 18. Peripheral File Frame Compilation
Table 18 is a collection of all the peripheral file frames used in the ’Cx36 (provided for a quick reference).
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
System Configuration Registers
COLD
START
OSC
POWER
PF AUTO
WAIT
OSC FLT
FLAG
MC PIN
WPO
MC PIN
DATA
µP/µC
MODE
P010
P011
P012
—
—
SCCR0
SCCR1
SCCR2
AUTO
WAIT
DISABLE
MEMORY
DISABLE
—
—
—
—
—
—
HALT/
STANDBY
PWRDWN/
IDLE
BUS
STEST
CPU
STEST
INT1
NMI
PRIVILEGE
DISABLE
—
P013
to
Reserved
P016
INT1
FLAG
INT1
PIN DATA
INT1
POLARITY
INT1
PRIORITY
INT1
ENABLE
P017
—
—
—
INT1
P018
P019
P01A
P01B
P01C
Reserved
BUSY
BUSY
—
—
—
—
—
—
—
AP
—
W1W0
W0
EXE
EXE
DEECTL
EPCTLL
Reserved
Reserved
VPPS
P01D
P01E
P01F
Digital Port Control Registers
P020
P021
P022
P023
Reserved
APORT1
APORT2
ADATA
ADIR
Port A Control Register 2 (must be 0)
Port A Data
Port A Direction
P024
to
Reserved
P02B
P02C
P02D
P02E
P02F
Port D Control Register 1 (must be 0)
—
—
—
—
—
—
—
—
—
—
—
—
DPORT1
DPORT2
DDATA
DDIR
†
Port D Control Register 2 (must be 0)
Port D Data
Port D Direction
SPI Module Control Register Memory Map
SPI SW
RESET
CLOCK
POLARITY
SPI BIT
RATE2
SPI BIT
RATE1
SPI BIT
RATE0
SPI
CHAR2
SPI
CHAR1
SPI
CHAR0
P030
P031
SPICCR
SPICTL
RECEIVER
OVERRUN
SPI INT
FLAG
MASTER/
SLAVE
SPI INT
ENA
—
—
—
TALK
P032
to
Reserved
P036
P037
P038
P039
RCVD7
SDAT7
RCVD6
SDAT6
RCVD5
SDAT5
RCVD4
SDAT4
RCVD3
Reserved
SDAT3
RCVD2
SDAT2
RCVD1
SDAT1
RCVD0
SDAT0
SPIBUF
SPIDAT
†
To configure D3 as SYSCLK, set port D register 2 = 08h.
33
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
Table 18. Peripheral File Frame Compilation (Continued)
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
SPI Module Control Register Memory Map (Continued)
P03A
to
Reserved
P03C
SPICLK
DATA IN
SPICLK
DATA OUT
SPICLK
FUNCTION
SPICLK
DATA DIR
P03D
P03E
P03F
—
—
—
—
SPIPC1
SPIPC2
SPIPRI
SPISIMO
DATA IN
SPISIMO
DATA OUT
SPISIMO
FUNCTION
SPISIMO
DATA DIR
SPISOMI
DATA IN
SPISOMI
DATA OUT
SPISOMI
FUNCTION
SPISOMI
DATA DIR
SPI
STEST
SPI
PRIORITY
SPI
ESPEN
—
—
—
—
—
PACT Module Register Memory Map
DEFTIM
OVRFL
INT ENA
DEFTIM
OVRFL
INT FLAG
FAST
MODE
SELECT
PACT
PACT
PACT
PACT
PRESCALE
SELECT0
CMD/DEF
AREA ENA
P040
P041
PRESCALE PRESCALE PRESCALE
SELECT3
PACTSCR
CDSTART
SELECT2
SELECT1
CMD/DEF
AREA
START
BIT 5
CMD/DEF
AREA
START
BIT 4
CMD/DEF
AREA
START
BIT 3
CMD/DEF
AREA
START
BIT 2
CMD/DEF
AREA
INT ENA
—
—
—
CMD/DEF
AREA
END BIT 6
CMD/DEF
AREA
END BIT 5
CMD/DEF
AREA
END BIT 4
CMD/DEF
AREA
END BIT 3
CMD/DEF
AREA END
BIT 2
P042
P043
—
1
—
—
—
CDEND
BUFFER
POINTER
BIT 5
BUFFER
POINTER
BIT 4
BUFFER
POINTER
BIT 3
BUFFER
POINTER
BIT 2
BUFFER
POINTER
BIT 1
1
BUFPTR
P044
P045
Reserved
PACT SCI
PACT
RXRDY
PACT
TXRDY
PACT
PARITY
PACT SCI
PACT SCI SW
RESET
PACT FE
—
SCICTLP
RX INT ENA TX INT ENA
PACT
RXDT7
PACT
RXDT6
PACT
RXDT5
PACT
RXDT4
PACT
RXDT3
PACT
RXDT2
PACT
RXDT1
P046
P047
P048
P049
PACT RXDT0 RXBUFP
PACT TXDT0 TXBUFP
PACT
TXDT7
PACT
TXDT6
PACT
TXDT5
PACT
TXDT4
PACT
TXDT3
PACT
TXDT2
PACT
TXDT1
PACT OP8
STATE
PACT OP7
STATE
PACT OP6
STATE
PACT OP5
STATE
PACT OP4
STATE
PACT OP3
STATE
PACT OP2
STATE
PACT OP1
PSTATE
STATE
CMD/DEF
INT 7 FLAG
CMD/DEF
INT 6 FLAG
CMD/DEF
INT 5 FLAG
CMD/DEF
INT 4 FLAG
CMD/DEF
INT 3 FLAG
CMD/DEF
INT 2 FLAG
CMD/DEF
INT 1 FLAG
CMD/DEF
CDFLAGS
INT 0 FLAG
CP2 CAPT
RISING
EDGE
CP2 CAPT
FALLING
EDGE
CP1 CAPT
RISING
EDGE
CP1 CAPT
FALLING
EDGE
CP2 INT
ENA
CP2 INT
FLAG
CP1 INT
ENA
CP1 INT
FLAG
P04A
P04B
P04C
CPCTL1
CPCTL2
CPCTL3
CP4 CAPT
RISING
EDGE
CP4 CAPT
FALLING
EDGE
CP3 CAPT
RISING
EDGE
CP3 CAPT
FALLING
EDGE
CP4 INT
ENA
CP4 INT
FLAG
CP3 INT
ENA
CP3 INT
FLAG
CP6 CAPT
RISING
EDGE
CP6 CAPT
FALLING
EDGE
CP5 CAPT
RISING
EDGE
CP5 CAPT
FALLING
EDGE
CP6 INT
ENA
CP6 INT
FLAG
CP5 INT
ENA
CP5 INT
FLAG
INPUT
CAPT
PRESCALE
SELECT 3
INPUT
CAPT
PRESCALE
SELECT 2
INPUT
CAPT
PRESCALE
SELECT 1
BUFFER
P04D HALF/FULL
INT ENA
BUFFER
HALF/FULL
INT FLAG
EVENT
COUNTER
SW RESET
CP6 EVENT
ONLY
OP/ SET/CLR
SELECT
CPPRE
34
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
Table 18. Peripheral File Frame Compilation (Continued)
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
PACT Module Register Memory Map (Continued)
P04E
P04F
WATCHDOG RESET KEY
WDRST
PACT
GROUP 1
PRIORITY
PACT
PACT
PACT
MODE
SELECT
PACT WD
PRESCALE
SELECT 1
PACT WD
PRESCALE
SELECT 0
PACT
STEST
PACT
SUSPEND
GROUP 2
PRIORITY
GROUP 3
PRIORITY
PACTPRI
ADC1 Module Control Register Memory Map
CONVERT
START
SAMPLE
START
REF VOLT
SELECT2
REF VOLT
SELECT1
REF VOLT
SELECT0
AD INPUT
SELECT2
AD INPUT
SELECT1
AD INPUT
SELECT0
P070
ADCTL
AD INT
FLAG
P071
P072
—
—
—
—
—
AD READY
AD INT ENA
ADSTAT
ADDATA
ADC1 Conversion Data Register
RESERVED
P073
to
P07C
P07D
P07E
Port E Data Input Register
Port E Input Enable Register
ADIN
ADENA
AD
PRIORITY
P07F AD STEST
AD ESPEN
—
—
—
—
—
ADPRI
35
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range,V
(see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.6 V to 7 V
CC1
Input voltage range, All pins except MC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.6 V to7 V
MC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.6 V to 14 V
Input clamp current, I (V < 0 or V > V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
I
CC)
Output clamp current, I
OK
O
O
CC
Continuous output current per buffer, I (V = 0 to V ) (see Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA
O
O
CC)
Maximum I
current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 mA
CC
Maximum I current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 170 mA
SS
Continuous power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W
Operating free-air temperature, T : L version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
A
A version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C
T version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 105°C
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 4. Unless otherwise noted, all voltage values are with respect to V
.
SS1
5. Electrical characteristics are specified with all output buffers loaded with specified I current. Exceeding the specified I current in
O
O
any buffer can affect the levels on other buffers.
recommended operating conditions
MIN
4.5
3
NOM
MAX
UNIT
V
Supply voltage (see Note 4)
5
5.5
5.5
5.5
5.5
5.5
0.3
0.8
0.3
V
V
CC1
RAM data-retention supply voltage (see Note 6)
Standby RAM supply voltage
V
4.5
3
5
V
CCSTBY
Standby RAM data retention supply voltage (see Note 6)
Analog supply voltage (see Note 4)
Analog supply ground
V
V
4.5
– 0.3
5
0
V
V
V
V
CC3
SS3
All pins except MC
Low-level input voltage
V
SS1
V
IL
MC, normal operation
V
SS1
All pins except MC, XTAL2/CLKIN, and
RESET
2
V
CC1
V
IH
High-level input voltage
V
XTAL2/CLKIN
0.8 V
0.7 V
V
V
CC1
CC1
CC1
RESET
CC1
13
EEPROM write protect override (WPO)
11.7
12
V
MC
MC (mode control) voltage
EPROM programming voltage (V
Microcomputer
L version
)
13
13.2
13.5
0.3
70
V
PP
V
SS1
0
T
A
Operating free-air temperature
A version
– 40
– 40
85
°C
T version
105
NOTES: 4. Unless otherwise noted, all voltage values are with respect to V
.
SS1
6. RESET must be externally activated when V
CC1
or SYSCLK is not within the recommended operating range.
36
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
Low-level output voltage
All outputs
I
I
= 1.4 mA
0.4
V
OL
OL
All outputs
except PACT
outputs
= –50 µA
0.9 V
OH
CC1
CC1
V
OH
High-level output voltage
V
PACT outputs
All outputs
I
I
= –50 µA
0.7 V
OH
= –2 mA
2.4
OH
0 V ≤ V ≤ 0.3 V
10
50
µA
µA
µA
µA
µA
mA
µA
mA
I
0.3 V < V < V
– 0.3 V
I
CC1
MC
I
I
Input current
V
V
–0.3 < V < V
+0.3 V
CC1
10
CC1
I
+0.3 V < V < 13 V
650
± 10
CC1
I
I/O pins
0 V <V < V
I
CC1
= 0.4 V
I
I
Low-level output current
High-level output current
All outputs
V
OL
V
OH
V
OH
1.4
– 50
– 2
OL
= 0.9 V
= 2.4 V
CC1
All outputs
OH
Supply current (operating mode)
OSC POWER bit = 0
See Notes 7 and 8
SYSCLK = 5 MHz
36
7
45
12
mA
mA
µA
Supply current (STANDBY mode)
OSC POWER bit = 0
See Notes 7 and 8
SYSCLK = 5 MHz
I
I
CC1
See Notes 7 and 8
XTAL2/CLKIN < 0.2 V
Supply current (HALT mode)
5
30
Standby RAM supply current (operating mode OSC SYSCLK = 5 MHz
POWER bit = 0) = 4.5 V
1
1.5
mA
CCSTBY
V
CCSTBY
NOTES: 7. Single chip mode, ports configured as inputs or outputs with no load. All inputs ≤ 0.2 V or ≥ V
– 0.2V.
CC1
8. XTAL2/CLKIN is driven with an external square wave signal with 50% duty cycle and rise and fall times less than 10 ns. Current
can be higher with a crystal oscillator. At 5-MHz SYSCLK, this extra current = 0.01 mA x (total load capacitance + crystal capacitance
in pF).
37
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
XTAL2/CLKIN
XTAL1
XTAL2/CLKIN
XTAL1
C3
(see Note A)
C1
(see Note A)
C2
Crystal/Ceramic
Resonator
(see Note B)
External
Clock Signal
(see Note A)
NOTES: A. The values of C1 and C2 are typically 15 pF and C3 value is typically 50 pF. See the manufacturer’s recommendations for ceramic
resonators.
B. The crystal/ceramic resonator frequency is four times the reciprocal of the system clock period.
Figure 11. Recommended Crystal/Clock Connections
Load Voltage
1.2 kΩ
V
O
20 pF
Case 1: V = V
= 2.4 V; Load Voltage = 0 V
= 0.4 V; Load Voltage = 2.1 V
O
OH
OL
Case 2: V = V
O
NOTE A: All measurements are made with the pin loading as shown unless otherwise noted. All measurements are made with XTAL2/CLKIN
driven by an external square wave signal with a 50% duty cycle and rise and fall times less than 10 ns unless otherwise stated.
Figure 12. Typical Output Load Circuit (See Note A)
V
CC
V
CC
Pin Data
300 Ω
30 Ω
6 kΩ
Output
Enable
I/O
INT1
20 Ω
20 Ω
GND
GND
Figure 13. Typical Buffer Circuitry
38
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
PARAMETER MEASUREMENT INFORMATION
timing parameter symbology
Timing parameter symbols have been created in accordance with JEDEC Standard 100. In order to shorten the
symbols, some of the pin names and other related terminology have been abbreviated as follows:
AR
B
CI
M
S
Array
Byte
XTAL2/CLKIN
Master mode
Slave mode
SC
SYSCLK
SPISIMO
SPISOMI
SPICLK
SIMO
SOMI
SPC
Lowercase subscripts and their meanings are:
c
d
f
cycle time (period)
delay time
fall time
su
v
w
setup time
valid time
pulse duration (width)
r
rise time
The following additional letters are used with these meanings:
H
L
V
High
Low
Valid
All timings are measured between high and low measurement points as indicated in Figure 14 and Figure 15.
0.8 V
V (High)
2 V (High)
CC
0.8 V (Low)
0.8 V (Low)
Figure 14. XTAL2/CLKIN Measurement Points
Figure 15. General Measurement Points
39
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
external clocking requirements for clock divided by 4 (see Note 9 and Figure 16)
NO.
1
PARAMETER
Pulse duration, XTAL2/CLKIN (see Note 10)
Rise time, XTAL2/CLKIN
MIN
MAX
UNIT
ns
t
t
t
t
20
w(Cl)
2
30
30
100
20
5
ns
r(Cl)
3
Fall time, XTAL2/CLKIN
ns
f(CI)
4
Delay time, XTAL2/CLKIN rise to SYSCLK fall
Crystal operating frequency
ns
d(CIH-SCL)
CLKIN
2
MHz
MHz
†
SYSCLK
Internal system clock operating frequency
0.5
†
SYSCLK = CLKIN/4
NOTES: 9. For V and V , refer to recommended operating conditions.
IL IH
10. This pulse may be either a high pulse, as illustrated below, which extends from the earliest valid high to the final valid high in an
XTAL2/CLKIN cycle or a low pulse, which extends from the earliest valid low to the final valid low in an XTAL2/CLKIN cycle.
1
XTAL2/CLKIN
2
3
4
SYSCLK
Figure 16. External Clock Timing for Divide-by-4
external clocking requirements for clock divided by 1 (PLL) (see Note 9 and Figure 17)
NO.
1
PARAMETER
Pulse duration, XTAL2/CLKIN (see Note 10)
Rise time, XTAL2/CLKIN
MIN
MAX
UNIT
ns
t
t
t
t
20
w(Cl)
2
30
30
100
5
ns
r(Cl)
3
Fall time, XTAL2/CLKIN
ns
f(CI)
4
Delay time, XTAL2/CLKIN rise to SYSCLK rise
Crystal operating frequency
ns
d(CIH-SCH)
CLKIN
2
2
MHz
MHz
‡
SYSCLK
Internal system clock operating frequency
5
‡
SYSCLK = CLKIN/1
NOTES: 9. For V and V , refer to recommended operating conditions.
IL IH
10. This pulse can be either a high pulse, as illustrated below, which extends from the earliest valid high to the final valid high in an
XTAL2/CLKIN cycle or a low pulse, which extends from the earliest valid low to the final valid low in an XTAL2/CLKIN cycle.
1
XTAL2/CLKIN
4
2
3
SYSCLK
Figure 17. External Clock Timing for Divide-by-1
40
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
switching characteristics and timing requirements (see Note 11 and Figure 18)
NO.
PARAMETER
MIN
200
200
MAX
2000
500
UNIT
Divide by 4
Divide by 1
5
t
c
Cycle time, SYSCLK (system clock)
ns
6
7
t
t
Pulse duration, SYSCLK low
Pulse duration, SYSCLK high
0.5 t –20
0.5 t
c
ns
ns
w(SCL)
c
0.5 t
0.5 t + 20
c
w(SCH)
c
NOTE 11: t = system clock cycle time = 1/SYSCLK
c
5
7
6
SYSCLK
Figure 18. SYSCLK Timing
general purpose output signal switching time requirements (see Figure 19)
MIN
TYP
30
MAX
UNIT
t
t
Rise time
Fall time
ns
ns
r
30
f
t
r
t
f
Figure 19. Signal Switching Timing
recommended EEPROM timing requirements for programming
MIN
MAX
UNIT
ms
t
t
Pulse duration, programming signal to ensure valid data is stored (byte mode)
Pulse duration, programming signal to ensure valid data is stored (array mode)
10
20
w(PGM)B
ms
w(PGM)AR
recommended EPROM operating conditions for programming
MIN
TYP
5.5
MAX
6
UNIT
V
V
V
Supply voltage
4.75
13
CC
Supply voltage at MC pin
13.2
30
13.5
50
5
V
PP
I
Supply current at MC pin during programming (V
= 13 V)
mA
PP
PP
Divide by 4
Divide by 1
0.5
2
SYSCLK
System clock
MHz
5
recommended EPROM timing requirements for programming
MIN
TYP
MAX
UNIT
t
Pulse duration, programming signal (see Note 12)
0.40
0.50
3
ms
w(EPGM)
NOTE 12: Programming pulse is active when both EXE (EPCTL.0) and V
(EPCTL.6) are set.
PPS
41
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
SPI master mode external timing characteristics and requirements (see Note 11 and Figure 20)
NO.
38
39
40
41
42
43
MIN
2t
MAX
256t
UNIT
ns
t
t
t
t
t
t
Cycle time, SPICLK
c(SPC)M
c
c
Pulse duration, SPICLK low
t
– 45
– 55
0.5t
0.5t
+45
+45
ns
w(SPCL)M
c
c
c(SPC)
Pulse duration, SPICLK high
t
ns
w(SPCH)M
c(SPC)
50
Delay time, SPISIMO valid after SPICLK low (polarity = 1)
Valid time, SPISIMO data valid after SPICLK high (polarity =1)
Setup time, SPISOMI to SPICLK high (polarity = 1)
– 65
ns
d(SPCL-SIMOV)M
v(SPCH-SIMO)M
su(SOMI-SPCH)M
t
– 50
ns
w(SPCH)
0.25 t + 150
c
ns
Valid time, SPISOMI data valid after SPICLK high
(polarity = 1)
44
t
0
ns
v(SPCH-SOMI)M
NOTE 11: t = system clock cycle time = 1/SYSCLK
c
38
40
39
SPICLK
41
42
Data Valid
SPISIMO
43
44
Data Valid
SPISOMI
†
The diagram is for polarity = 1. SPICLK is inverted when polarity = 0.
†
Figure 20. SPI Master External Timing
42
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
SPI slave mode external timing characteristics and requirements (see Note 11 and Figure 21)
NO.
45
46
47
48
49
50
51
MIN
8t
MAX
UNIT
ns
t
t
t
t
t
t
t
Cycle time, SPICLK
c(SPC)S
c
Pulse duration, SPICLK low
4t – 45 0.5t
c
+45
+45
ns
w(SPCL)S
c(SPC)S
Pulse duration, SPICLK high
4t – 45 0.5t
c
ns
w(SPCH)S
c(SPC)S
+ 130
Delay time, SPISOMI valid after SPICLK low (polarity = 1)
Valid time, SPISOMI data valid after SPICLK high (polarity =1)
Setup time, SPISIMO to SPICLK high (polarity = 1)
Valid time, SPISIMO data after SPICLK high (polarity = 1)
3.25t
ns
d(SPCL-SOMIV)S
v(SPCH-SOMI)S
su(SIMO-SPCH)S
v(SPCH-SIMO)S
c
t
ns
w(SPCH)S
0
ns
3t + 100
C
ns
NOTE 11: t = system clock cycle time = 1/SYSCLK
c
45
47
46
SPICLK
48
49
Data Valid
SPISIMO
50
51
Data Valid
SPISOMI
†
The diagram is for polarity = 1. SPICLK is inverted when polarity = 0.
†
Figure 21. SPI Slave External Timing
43
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
ADC1 converter
The ADC1 converter has a separate power bus for its analog circuitry. These pins are referred to as V
and
CC3
V
. The purpose is to enhance ADC1 performance by preventing digital switching noise of the logic circuitry
SS3
that can be present on V
given with respect to V
and V
from coupling into the ADC1 analog stage. All ADC1 specifications are
SS1
CC1
unless otherwise noted.
SS3
Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-bits (256 values)
Monotonic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Yes
Output conversion mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 00h to FFh (00 for V ≤ V
Conversion time (excluding sample time) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 t
≤; FF for V ≤ V
)
I
SS3
I
ref
c
recommended operating conditions
MIN
NOM
MAX
UNIT
4.5
5
5.5
V
V
Analog supply voltage
Analog ground
V
CC3
V
–0.3
CC1
V
+0.3
CC1
V
–0.3
SS1
V
+0.3
SS1
V
V
V
SS3
†
V
ref
Non-V
CC3
reference
2.5
V
V
+ 0.1
CC3
CC3
Analog input for conversion
V
V
ref
SS3
†
V
ref
must be stable, within ± 1/2 LSB of the required resolution, during the entire conversion time.
operating characteristics over recommended ranges operating conditions
PARAMETER
MIN
MAX
±1.5
±0.9
2
UNIT
LSB
LSB
mA
µA
‡
Absolute accuracy
V
V
= 5.5 V
= 5.5 V
V
= 5.1 V
= 5.1 V
CC3
ref
‡§
Differential/integral linearity error
V
ref
CC3
Converting
I
Analog supply current
CC3
Nonconverting
5
I
I
Input current, AN0–AN7
Input charge current
0 V ≤ V ≤ 5.5 V
2
µA
I
I
1
mA
kΩ
ref
SYSCLK ≤ 3 MHz
24
10
Z
Source impedance of V
ref
ref
3 MHz < SYSCLK ≤ 5 MHz
kΩ
‡
§
Absolute resolution = 20 mV. At V = 5 V, this is one LSB. As V decreases, LSB size decreases; therefore, the absolute accuracy and
differential/integral linearity errors in terms of LSBs increase.
Excluding quantization error of 1/2 LSB
ref
ref
44
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
ADC1 converter (continued)
The ADC1 module allows complete freedom in design of the sources for the analog inputs. The period of the
sample time is user-defined so that the high-impedance can be accommodated without penalty to the
low-impedance sources. The sample period begins when the SAMPLE START bit of the ADC1 control register
(ADCTL.6) is set to 1. The end of the signal sample period occurs when the conversion bit (CONVERT START,
ADCTL.7) is set to 1. After a hold time, the converter will reset the SAMPLE START and CONVERT START bits,
signaling that a conversion has started and that the analog signal can be removed.
analog timing requirements (see Figure 22)
MIN
MAX
UNIT
ns
t
t
t
Setup time, analog to sample command
0
su(S)
h(AN)
w(S)
Hold time, analog input from start of conversion
Pulse duration, sample time per kilo-Ω of source impedance
18t
ns
c
†
1
µs/kΩ
†
The value given is valid for a signal with a source impedance > 1 kΩ. If the source impedance is < 1 kΩ, use a minimum sampling time of 1µs.
Analog Stable
Analog In
t
su(S)
Sample Start
Convert Start
t
h(AN)
t
w(S)
Figure 22. Analog Timing
Table 19 is designed to aid the user in referencing a device part number to a mechanical drawing. The table
shows a cross-reference of the device part number to the TMS370 generic package name and the associated
mechanical drawing by drawing number and name.
Table 19. TMS370Cx36 Family Package Type and Mechanical Cross-Reference
PKG TYPE
(mil pin spacing)
PKG TYPE NO. AND
MECHANICAL NAME
TMS370 GENERIC NAME
DEVICE PART NUMBERS
TMS370C036AFNA
TMS370C036AFNL
TMS370C036AFNT
TMS370C736AFNT
FN – 44 pin
(50-mil pin spacing)
PLASTIC LEADED CHIP CARRIER
(PLCC)
FN(S-PQCC-J**) PLASTIC J-LEADED
CHIP CARRIER
FZ – 44 pin
(50-mil pin spacing)
CERAMIC LEADED CHIP CARRIER
(CLCC)
FZ(S-CQCC-J**) J-LEADED CERAMIC
CHIP CARRIER
†
SE370C736AFZT
45
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
MECHANICAL DATA
FN (S-PQCC-J**)
PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
D
0.090 (2,29)
D1
0.020 (0,51) MIN
3
1
19
0.032 (0,81)
0.026 (0,66)
4
18
D2/E2
D2/E2
E
E1
8
14
0.021 (0,53)
0.013 (0,33)
0.050 (1,27)
9
13
0.007 (0,18)
M
0.008 (0,20) NOM
D/E
D1/E1
D2/E2
NO. OF
PINS
**
MIN
0.385 (9,78)
MAX
MIN
MAX
MIN
MAX
0.395 (10,03)
0.350 (8,89)
0.356 (9,04)
0.141 (3,58)
0.191 (4,85)
0.291 (7,39)
0.341 (8,66)
0.169 (4,29)
0.219 (5,56)
0.319 (8,10)
0.369 (9,37)
20
28
44
52
68
84
0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58)
0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66)
0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20)
0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91)
1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45)
4040005/B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
46
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
J-LEADED CERAMIC CHIP CARRIER
Seating Plane
MECHANICAL DATA
FZ (S-CQCC-J**)
28 LEAD SHOWN
0.040 (1,02)
45°
0.180 (4,57)
0.155 (3,94)
0.140 (3,55)
A
B
1
0.120 (3,05)
26
4
25
5
0.050 (1,27)
C
(at Seating
Plane)
A
B
0.032 (0,81)
0.026 (0,66)
0.020 (0,51)
0.014 (0,36)
19
11
18
12
0.025 (0,64) R TYP
0.040 (1,02) MIN
0.120 (3,05)
0.090 (2,29)
A
B
C
JEDEC
NO. OF
PINS**
OUTLINE
MIN
MAX
MIN
MAX
MIN
MAX
0.485
0.495
0.430
0.455
0.410
0.430
MO-087AA
MO-087AB
MO-087AC
MO-087AD
28
44
52
68
(12,32)
(12,57)
(10,92)
(11,56)
(10,41)
(10,92)
0.685
0.695
0.630
0.655
0.610
0.630
(17,40)
(17,65)
(16,00)
(16,64)
(15,49)
(16,00)
0.785
0.795
0.730
0.765
0.680
0.740
(19,94)
(20,19)
(18,54)
(19,43)
(17,28)
(18,79)
0.985
0.995
0.930
0.955
0.910
0.930
(25,02)
(25,27)
(23,62)
(24,26)
(23,11)
(23,62)
4040219/B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
47
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
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