TPD4E1U06_14 [TI]
Quad Channel High Speed ESD Protection Device;
| 型号： | TPD4E1U06_14 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Quad Channel High Speed ESD Protection Device |
| 文件： | 总14页 (文件大小：950K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPD4E1U06
www.ti.com
SLVSBQ9B –DECEMBER 2012–REVISED FEBRUARY 2013
Quad Channel High Speed ESD Protection Device
Check for Samples: TPD4E1U06
1
FEATURES
APPLICATIONS
•
Provides System Level ESD Protection for
Low-Voltage IO Interface
•
USB2.0
Ethernet
•
•
IEC 61000-4-2 Level 4
•
•
•
•
HDMI Control Lines
MIPI Bus
–
–
±15kV (Contact discharge)
±15kV (Air-gap discharge)
LVDS
•
•
•
•
•
•
IO Capacitance 0.8pF (Typ)
SATA
DC Breakdown Voltage 6.5V (Min)
Ultra low Leakage Current 10nA (Max)
Low ESD Clamping Voltage
D1-
NC
D2-
6
5
4
1
2
D1+
GND
D2+
6
5
4
D1-
NC
D1+
1
2
Industrial Temperature Range: –40°C to 125°C
GND
D2+
Small, Easy-to-Route DCK, DBV, and DGS
Package
3
3
D2-
DCK
2 mm x 2.1 mm x 0.95 mm
(0.65-mm pitch)
DBV
2.9 mm x 2.8 x 1.45 mm
(0.95-mm pitch)
1
2
3
4
5
10
9
8
7
6
DGS
3 mm x 4.9 mm x 1.1mm
(0.5-mm pitch)
DESCRIPTION
The TPD4E1U06 is a quad channel ultra low cap ESD protection device. It offers ±15KV IEC air-gap and ±15KV
contact ESD protection. Its 0.8pF line capacitance makes it suitable for a wide range of applications. Typical
application areas are HDMI, USB2.0, MHL, and DisplayPort.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
3000
3000
3000
Tape and reel
TPD4E1U06DCKR
BPI
NG4I
TBD
Tape and reel
Tape and reel
TPD4E1U06DBVR
TPD4E1U06DGSR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPD4E1U06
SLVSBQ9B –DECEMBER 2012–REVISED FEBRUARY 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTIONAL BLOCK DIAGRAM
D1-
D2+
D1+
D2-
GND
Figure 1. Circuit Schematic Diagram
TERMINAL FUNCTIONS DCK/DBV
PIN
DESCRIPTION
TYPE
USAGE
NAME
D1+
DBV/DCK
DGS
1
6
4
3
1
9
4
6
I/O
D1–
I/O
Connect to data line as close to the
connector as possible
ESD protected channel
I/O
D2–
D2+
I/O
Can be left floating, grounded, or connected
to VCC
NC
5
2
2, 5, 7, 10
3, 8
I/O
No connect
Ground
GND
GND
Connect to ground
2
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Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: TPD4E1U06
TPD4E1U06
www.ti.com
SLVSBQ9B –DECEMBER 2012–REVISED FEBRUARY 2013
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
MIN
–40
–65
MAX
125
155
±15
±15
3
UNIT
°C
°C
kV
kV
A
Operating temperature range
Storage temperature
IEC 61000-4-2 contact ESD
IEC 61000-4-2 air-gap ESD
IPP, peak pulse current (tp = 8/20 μs)
PPP, peak pulse power (tp = 8/20 μs)
45
W
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
TYP
MAX UNIT
VRWM
Reverse stand-off voltage
IIO = 10 µA
5.5
V
V
V
IPP = 1 A, tp = 8/20 μSec, from I/O to GND(1)
IPP = 3A, tp = 8/20 μSec, from I/O to GND(1)
Pin x to GND Pin(2)
11
15
Clamp voltage with ESD
strike
VCLAMP
1.0
RDYN
CL
Dynamic resistance
Line capacitance
Ω
GND to Pin x
0.6
f = 1 MHz, VBIAS = 2.5 V, 25 °C
0.8
1
0.015
0.025
pF
pF
DCK package
DBV package
0.006
0.01
Channel to channel input
capacitance
Pin 2 = 0 V, f = 1 MHz, VBIAS = 2.5 V, between
channel pins
CCROSS
Variation of channel input
capacitance
Pin 2 = 0V , f = 1 MHz, VBIAS = 2.5 V, channel_x pin to gnd – channel_y pin to
gnd
∆CIO-TO-GND
0.025
0.07
pF
Break-down voltage, IO to
GND
VBR
IIO = 1 mA
VIO = 2.5 V
6.5
8.5
10
V
ILEAK
Leakage current
1
nA
(1) Non-repetitive current pulse 8/20 us exponentially decaying waveform according to IEC61000-4-5
(2) Extraction of RDYN using least squares fit of TLP characteristics between I=10A and I=20A
Copyright © 2012–2013, Texas Instruments Incorporated
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3
Product Folder Links: TPD4E1U06
TPD4E1U06
SLVSBQ9B –DECEMBER 2012–REVISED FEBRUARY 2013
www.ti.com
TYPICAL CHARACTERISTICS
30
27
24
21
18
15
12
9
30
27
24
21
18
15
12
9
6
6
3
3
0
0
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
C001
C002
Voltage (V)
Voltage (V)
Figure 2. TLP, Data to GND
Figure 3. TLP, GND to Data
180
150
120
90
60
30
0
œ30
œ60
œ90
œ120
œ150
œ180
60
30
0
œ30
œ60
œ20
0
20 40 60 80 100 120 140 160 180 200 220
œ20
0
20 40 60 80 100 120 140 160 180 200 220
C003
C004
Time (ns)
Time (ns)
Figure 4. IEC 61000-4-2 Clamping Voltage, +8kV Contact
Figure 5. IEC 61000-4-2 Clamping Voltage, –8kV Contact
1.0
500
TA = 25°C
VIN = 2.5 V
0.8
450
0.6
0.4
400
350
300
250
200
150
100
50
0.2
0.0
œ0.2
œ0.4
œ0.6
œ0.8
œ1.0
0
œ2 œ1
0
1
2
3
4
5
6
7
8
9
10
œ55 œ35 œ15
5
25
45
65
85
105 125
C005
C006
Voltage (V)
Temperature (°C)
Figure 6. Diode Curve, TA = 25°C
Figure 7. ILEAK vs. Temperature, VIN = 2.5 V
4
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Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: TPD4E1U06
TPD4E1U06
www.ti.com
SLVSBQ9B –DECEMBER 2012–REVISED FEBRUARY 2013
TYPICAL CHARACTERISTICS (continued)
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
50
45
40
35
30
25
20
15
10
5
Current
Power
f = 1 MHz
0
œ5
0
5
10 15 20 25 30 35 40 45 50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
C008
Time (ꢀs)
C007
VBIAS (V)
Figure 8. Capacitance Across VBIAS, f = 1 MHz
Figure 9. Surge Curve (tp = 8/20 μs), Pin IO to GND
Figure 10. PCB Layout Recommendation
Copyright © 2012–2013, Texas Instruments Incorporated
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5
Product Folder Links: TPD4E1U06
TPD4E1U06
SLVSBQ9B –DECEMBER 2012–REVISED FEBRUARY 2013
www.ti.com
REVISION HISTORY
Changes from Revision A (December 2012) to Revision B
Page
•
Added CCROSS data for DBV package ................................................................................................................................... 3
6
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Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: TPD4E1U06
PACKAGE OPTION ADDENDUM
www.ti.com
21-Feb-2013
PACKAGING INFORMATION
Orderable Device
TPD4E1U06DBVR
TPD4E1U06DCKR
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
PREVIEW
SOT-23
SC70
DBV
6
6
3000
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
DCK
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 125 BPI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPD4E1U06DBVR
TPD4E1U06DCKR
TPD4E1U06DCKR
SOT-23
SC70
DBV
DCK
DCK
6
6
6
3000
3000
3000
178.0
180.0
178.0
9.0
8.4
9.0
3.23
2.25
2.4
3.17
2.4
1.37
1.22
1.2
4.0
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q3
SC70
2.5
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPD4E1U06DBVR
TPD4E1U06DCKR
TPD4E1U06DCKR
SOT-23
SC70
DBV
DCK
DCK
6
6
6
3000
3000
3000
180.0
202.0
180.0
180.0
201.0
180.0
18.0
28.0
18.0
SC70
Pack Materials-Page 2
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