TPD4F202_15 [TI]
Four or Six-Channel EMI Filter;
| 型号： | TPD4F202_15 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Four or Six-Channel EMI Filter |
| 文件： | 总11页 (文件大小：696K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPD4F202, TPD6F202
www.ti.com
SLLS800 –JUNE 2010
FOUR-, SIX-CHANNEL EMI FILTER WITH ESD PROTECTION FOR LCD DISPLAY
Check for Samples: TPD4F202, TPD6F202
1
FEATURES
•
Four-, Six-Channel EMI Filtering and ESD
(R = 100 Ω, CTOTAL = 30 pF)
Protection for Data Lines
•
•
Low 10-nA Leakage Current
•
Excellent filter Performance
Space-Saving WCSP Package and
–
–
–
>40dB Attenuation at 1GHz-3GHz
-3dB Bandwidth at 108MHz
Flow-Through Pin Mapping Provides Optimum
Performance in Portable Applications
70 dB Crosstalk Attenuation at 100 MHz
APPLICATIONS
•
•
Exceeds IEC61000-4-2 (Level 4) ESD
Protection Requirements
•
•
•
•
•
LCD Display Interface
Memory Interface
SVGA Video Connections
Keypad
–
–
–
±25-kV IEC 61000-4-2 Contact Discharge
±25-kV IEC 61000-4-2 Air-Gap Discharge
±15-kV Human-Body Model (HBM)
Data Lines in Portables
Pi-Style C-R-C Filter Configuration Offers
Symmetric Filter Performance
TPD4F202
TPD6F202
YFU PACKAGE
YFU PACKAGE
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TA
PACKAGE(1) (2)
PACKAGE DIMENSION
TOP-SIDE MARKING
YMS5WS
Length = 2.36 mm, Width = 1.053 mm,
Pitch = 0.4 mm, Height = 0.32 mm)
TPD6F202YFUR
TPD4F202YFUR
–40°C to 85°C
WCSP – YFU
Length = 1.56 mm, Width = 1.053 mm,
Pitch = 0.4 mm, Height = 0.32 mm)
YMS57S
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPD4F202, TPD6F202
SLLS800 –JUNE 2010
www.ti.com
DESCRIPTION
The TPDxF202 are four, six-channel EMI filters, designed particularly to suppress EMI noise in the cell phone
and other portable applications. These low-pass filters also protect internal core citcuity against system level
ESD strikes at the external interface pins. The pi-style C-R-C filter provides symmetric filter performance in the
data lines to/ from either side of the filter.
Due to tiny package parasitics of the WCSP package, the TPDxF202 series of filters provide excellent signal
attenuation (-40dB at 1GHz) at the typical cell-phone carrier frequency ranges.
The ultra thin (0.3-mm package height, when mounted on board) space saving YFU package enables the
TPDxF202 devices to mount on the printed circuit boards where the height is a key constraint.
The TPDxF202 devices offer very robust system level ESD protection specifications at both input and output
ports, which eliminates the need for any additional ESD clamp diodes at the external interface pins.
The TPDxF202 devices are specified for –40°C to 85°C operation.
EQUIVALENT SCHEMATIC REPRESENTATION
2
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F202, TPD6F202
TPD4F202, TPD6F202
www.ti.com
SLLS800 –JUNE 2010
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
VIO
IO to GND
6
V
Continuous power dissipation (TA = 70°C)
Storage temperature range
Junction temperature
100 mW
Tstg
TJ
–65
150
150
300
°C
°C
°C
Lead temperature (soldering, 10 s)
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
TA = –40°C to 85°C (Unless otherwise noted)
PARAMETER
DC breakdown voltage
Resistance
TEST CONDITIONS
MIN
6
TYP(1)
MAX UNIT
VBR
R
IIO = 10 mA
V
85
100
15
115
Ω
pF
C
Capacitance (C1 or C2)
Channel leakage current
Cut-off frequency
VIO = 3.3 V
VIO = 3.3 V
IIO
fC
10
nA
ZSOURCE = 50 Ω, ZLOAD = 50 Ω
108
MHz
(1) Typical values are at TA = 25°C.
ESD PROTECTION
PARAMETER
TYP UNIT
HBM
±15
±25
±25
kV
kV
kV
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
Copyright © 2010, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TPD4F202, TPD6F202
TPD4F202, TPD6F202
SLLS800 –JUNE 2010
www.ti.com
APPLICATION INFORMATION
Typically, there are multiple EMI filters being utilized in cell phone applications to suppress the EMI interference.
This means the total board area consumed by EMI filters are relatively large. One example of space saving
innovation is to place the EMI filters right under the connectors so that the main PCB space is not utilized. The
YFU packages of the TPDxF202 series offer ultra low-profile package height which enables such innovative
component placement in portable applications. Package under-fill is recommended while using the YFU
packages in flex boards.
For maximum efficiency of filtering and ESD protection, while doing the board layout, care should be taken to
reduce board parasitic from package GND pins to board GND plane. The TPDxF202 devices should be
connected to a ground plane with a micro via adjacent to the device GND pad. If this is not possible, the
connection to the ground plane should be as direct as possible to minimize the inductance. Due to flow-through
pin mapping, the signal pins routing is easily achieved in a single layer.
Figure 1. Board Layout with TPDxF20
4
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F202, TPD6F202
TPD4F202, TPD6F202
www.ti.com
SLLS800 –JUNE 2010
TYPICAL CHARACTERISTICS
Figure 2. Channel-to-Channel Crosstalk
Figure 3. Frequency Response Data (0 V Bias)
Copyright © 2010, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TPD4F202, TPD6F202
TPD4F202, TPD6F202
SLLS800 –JUNE 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Figure 4. IEC Clamping Waveforms +8 kV Contact
Figure 5. IEC Clamping Waveforms -8 kV Contact
6
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F202, TPD6F202
TPD4F202, TPD6F202
www.ti.com
SLLS800 –JUNE 2010
TYPICAL CHARACTERISTICS (continued)
Figure 6. DC Characteristics (IIN vs. VIN), TA = 25ºC
Figure 7. C1 or C2 Capacitance vs. VBIAS
Copyright © 2010, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): TPD4F202, TPD6F202
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jun-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
Samples Not Available
Samples Not Available
TPD4F202YFUR
TPD6F202YFUR
PREVIEW
PREVIEW
DSBGA
DSBGA
YFU
YFU
10
15
3000
TBD
TBD
Call TI
Call TI
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明